JP4093376B2 - Suction integrated SMIF system - Google Patents

Description

Background of the Invention
1.TECHNICAL FIELD OF THE INVENTION
The present invention relates to a standard machine boundary system that reduces contaminant particles, and more particularly, to an apparatus that uses a sealed container suitable for use in a semiconductor processing apparatus that is to be prevented from being contaminated by the contaminant particles. In addition, the present invention efficiently transports semiconductor wafers between a mobile container or carrier and a load lock chamber that has a controllable environment and waits for the container or carrier to be transported to a processing station. It relates to a system that can With the apparatus as described above, the production throughput can be significantly increased.
Throughout this disclosure, the term “wafer” will be used consistently to refer to a flat substrate, such as a silicon wafer or flat glass panel, but it will be understood that it can be extended to any substrate. A typical substrate is a disk type having a diameter of 200 mm and a thickness of about 0.760 mm. However, recently, a substrate having the same thickness and a diameter of 300 mm is sometimes selected.
2.Description of prior art
Control of contaminating particles is indispensable for cost reduction, high yield and high profitability of VLSI circuits. As design principles, thinner electrical wires and tighter spacing are increasingly required, and there is a need to better control the number of particles and to remove smaller diameter particles.
Certain types of contaminating particles cause incomplete etching in the space between electrical lines and cause undesirable electrical shorts. Further, in addition to such physical defects, other types of contaminant particles can cause ionization and trapping nuclei in the gate insulator and junctions and cause electrical failure.
The main sources of contaminating particles are the human body, devices and chemicals. Particles emitted from the human body spread to the surrounding environment and reach the wafer by physical contact or movement. For example, the human body that emits skin exfoliation is a highly influential particle source that easily ionizes and causes defects.
Modern processing equipment must involve particles in the size range from 0.01 micrometers below and 200 micrometers above. These sized particles cause significant damage to semiconductor processing. Today's typical semiconductor processing employs a size of 1 micrometer or less. Undesirable contaminant particles having a size of 0.1 micrometer or more will interfere with a semiconductor device employing a size of 1 micrometer. Naturally, the size employed in semiconductor processing tends to become smaller.
More recently, attempts have been made to remove particles having dimensions greater than 0.03 micrometers by filters and other techniques, and a “clean room” has become established. However, there is a need to improve the processing environment. The conventional “clean room” cannot maintain the desired particle-free state. It is virtually impossible to keep a conventional clean room free of particles of size less than 0.01 micrometers. Clean room garments reduce the release of particles, but cannot adequately suppress the release. As many as 6000 particles per minute are released into a 28316 cubic centimeter (1 cubic foot) space adjacent to a fully skilled operator.
In order to control contaminating particles, factories tend to build more elaborate (and expensive) clean rooms with recirculation air systems using HEPA and ULPA filters. A 99.999% efficient filter and as much as 10 complete air exchanges per minute are required to obtain acceptable cleanliness.
Particles inside equipment or chemicals are called “process defects”. In order to minimize process defects, processing equipment manufacturers must ensure that particles generated from the machine do not spread to the wafer, and those who supply chemicals in the gaseous or liquid state deliver a more purified product. I have to do it. Most importantly, the system must be designed to be completely isolated from the particles as the wafer is moved to storage, transport and processing equipment. Standard automated environment (SMIF) systems have been devised and used to reduce contaminating particles by significantly reducing the flow of particles onto the wafer. The purpose is to mechanically ensure that the gaseous medium around the wafer, such as air or nitrogen, does not fluctuate with respect to the wafer during storage, transfer and processing of the wafer, and outside the wafer. This is accomplished by ensuring that particles do not enter the vicinity of the interior of the wafer environment from around.
The SMIF concept is based on the recognition that a stationary small volume, which is air without particle sources inside and without particles, can most clean the wafer environment.
A typical SMIF system engages (1) a minimum volume, i.e. a dustproof box or carrier for storage or transport, (2) an open shelf for a wafer cassette, and (3) a boundary entrance door of the processing equipment. It is used for boxes and carrier doors that are designed in the same way, and for two doors that, when the two doors are opened at the same time, particles on the outer door surface are sandwiched between the two doors. The
In a typical SMIF system, a box and a carrier are installed at the boundary entrance, and a latch as a latching means opens the box door and the port door at the same time. A mechanical elevator for loading cassettes opens two doors. The operator takes out the cassette and installs the cassette in the cassette port or cassette elevator of the apparatus. After the process, the reverse operation is performed.
SMIF system must be effectiveButProofIsThis fact was demonstrated by experiments using SMIF devices inside and outside the clean room. The configuration of the SMIF system has improved by a factor of 10 over the conventional apparatus for transporting open cassettes inside a clean room.
By using the SMIF system, it has been conventional to transport a large number of wafers inside a box or carrier by supporting wafers at regular intervals using a cassette. By using this technique, the cassette is loaded with the wafers supplied, transported to a box or carrier, and then one wafer at a time in the carrier to be placed in a receiving chamber at the next processing position. Is taken out of.
A typical system known is the prior art described below, all of which disclose devices that utilize transportable sealed containers such as SMIF pods, including boxes, box doors and preferred sealing devices.
US Registration No. 4,995,430, registered on February 26, 1991 Bonora and others
PCT Application No. US90 / 01995 filed on April 13, 1990
PCT Application No.US85 / 01446 filed July 29, 1985
In each example, the box is used to transport a plurality of wafers in an ultra-clean environment from a remote location to an enclosed canopy that includes the environment adjacent to the wafer processing station. Generally, the enclosed canopy is incorporated into a suitable sealing, latching and transport mechanism to move the wafer between the SMIF pod and the canopy.
In EPO Patent No. 340,345 B1, issued January 27, 1993 by Michael Waide et al., Provision is made for the flow of clean air through an enclosed canopy.
A paper entitled “Restrictions on Wafers for Controlling Contamination in Microelectronics” was published on pages S1 to S5 of Solid Technology (SOLID STATE TECHNOLOGY) published in August 1990, and surrounded and closed around the wafer. The relevance of doing so is stated, and three known ways of achieving the desired objective are shown.
In view of the above-described prior art situation, the present invention has been devised and summarized at the present time. In particular, the present invention reduces the volume of clean environment required and temporarily stops when a cassette is unloaded from a SMIF box or carrier as the wafer is transferred from processing station to processing station. This is the result of attempts to provide a protected small environment to keep the clean room clean for a large number of wafers carried at one time.
Summary of the Invention
In accordance with the present invention, the system uses a mobile carrier that carries multiple semiconductor wafers in a particle-free environment. Cassettes that support wafers stacked at regular intervals and that are smoothly received within the carrier are delivered to a load lock in a clean environment. The small environment defines an interior region adjacent to the load lock that engages and houses the carrier and seals the load lock chamber and the interior of the carrier in a sealed manner from the surrounding atmosphere. The transport mechanism serves to collect the cassette from the carrier and move the carrier to the load lock chamber while maintaining the absence of particles. The first transport mechanism in the small environment collects the cassette from the carrier and moves it to the internal region, and the second transport mechanism in the load lock collects the cassette from the internal region in the small environment and loads it. Move to chamber. To assist in moving the cassette into the interior region, the small environment hood is movable between a lowered and raised position while maintaining a capillary seal with upstanding walls. The sensor informs whether the cassette is in the SMIF box, whether the wafer is correctly positioned in the cassette, and whether the cassette has been gripped so that it can be moved into the interior area. Laminar air is continuously directed through the interior area of the small environment and filtered to remove foreign material from the wafers supported in the cassette.
The present invention results in an efficient and fast operation and integrated and simplified design, which reduces wafer throughput while protecting the wafer from the external environment throughout the processing steps. It is guaranteed to maximize. The present invention uses a load arm that is already available with a load lock instead of an independent arm in the SMIF unloader or inside a small environment, while maintaining a clean environment for the SMIF box and a suction lock.OfMove the cassette containing multiple wafers inside(While exhausting). In addition, the system of the present invention allows a progressive cross air stream to flow when the SMIF box is opened, and a cassette containing a plurality of wafers.TheSend to small environmentMuIt is.
Still other features, advantages and benefits of the present invention will become apparent from the following description taken in conjunction with the drawings described below. It will be understood that the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention. The accompanying drawings, which are incorporated in and constitute a part of the present invention, illustrate embodiments of the invention and, together with the detailed description, explain the principles of the invention in general terms. Like reference numerals refer to like parts throughout the disclosure.
[Brief description of the drawings]
1 implements the present inventionIs a schematic front view of the wafer processing systemWhen the cover is removed from the load lockthingIt is.
FIG. 2 shows in more detail the components shown in FIG.ShowingFIG. 2 is a schematic cross-sectional view taken along a line 2-2 in FIG.
FIG. 2A is a detailed cross-sectional view of the member shown in FIG. 1, depicting another relative position.
FIG. 3 is a detailed schematic front view in cross section of one component of the present invention, showing the carrier containing the cassette at the top of the small environment, another component of the system of the present invention.
FIG. 4 is a schematic perspective view of a wafer transfer cassette of the type used in the system of the present invention.
FIG. 5 is a cross-sectional view taken along line 5-5 shown in FIG.
FIG. 6 is a cross-sectional view taken along line 6-6 shown in FIG.
6A-6D are schematic views showing the sequential positions of the components shown during operation of the system of the present invention and are similar to FIG.
6E is a detailed front view of some of the components shown in FIGS. 6 and 6A-6D.
FIG. 7 is a detailed cross-sectional view of the components shown in FIG.
FIG. 8 is a further detailed cross-sectional view similar to FIG. 7 but showing another operating position.
FIG. 9 is a schematic side view of a transport device positioned within the small environment of the system of the present invention.
10A to 10H are substantially the same as a part of FIG. 6 and are schematic side views showing continuous relative positions of components.
FIG. 11 is a detailed side view showing the cassette gripping mechanism used by the system of the present invention.
12 is a detailed plan view showing the cassette gripping mechanism of FIG. 11 and other components of the present invention in an enlarged cross section.
13 and 14 are detailed side views of the members of the cassette gripping mechanism in the disengaged position and the engaged position, respectively.
Detailed Description of the Preferred Embodiment
Reference is made to FIGS. 1 and 2 showing a processing system 20 for processing silicon flat substrates such as wafers and flat panels. As described above, the term “wafer” is used for the purpose of indicating a substrate throughout the present disclosure, which will be described later, and is intended to be used in a broad sense to correspond to any substrate. Will be understood. In particular, the present invention is advantageous for the operation of substrates of new dimensions.
The processing system 20 includes a load lock 22 that initially receives the wafer to be processed and a plurality of single wafer processing stations 24 that process the wafer surface, such as imaging or plasma etching. A typical processing station 24 transports the processed wafers one by one and then processes the load lock 22 and processing station 24 for processing between the load lock and at least one or more processing stations 24. And the transfer chambers 28 arranged concentrically inside each other and are arranged at close positions. A plurality of insulating valves 30 are provided one by one between the boundaries between several processing stations 24 and the transfer chamber 28 and between the load lock 22 and the transfer chamber 28.
As noted above, it is known to use a transportable SMIF box or container, such as that shown as carrier 32 (see in particular FIG. 3), to keep articles such as semiconductor wafer 36 (FIG. 1) clean. It has been. This is accomplished by maintaining the interior of each carrier in a particle-free state while the wafer is loaded into or unloaded from the processing system 20. It is customary to transport multiple wafers within a carrier by supporting the wafers at regular intervals using a cassette 34 (FIG. 4). By using this technology, the cassette placed in the carrierpowered byThe wafers are then unloaded one by one from the cassette to be placed in the load lock 22 within the carrier, or the cassette is a clean microenvironment with the carrier, SMIF box, etc. and the wafer. It is carried along with the wafer inside the processing apparatus.
Still referring to FIG. 3, a mobile carrier 32 for transporting wafers in a particle-free environment includes an interior 42 andaccessAnd a cover 38 having a carrier port 40 for engaging, and a carrier door 44 movable between a closed position for engaging and sealing the carrier port and an open position spaced a predetermined distance from the closed position. The complete tightness of the carrier 32 is ensured by an optimal seal 45 when the carrier door 44 is in place. The cassette 34 is smoothly accommodated inside the carrier and plays a role of supporting a plurality of wafers 36 stacked at regular intervals.
As described above, the load lock 22 is located within at least one or more processing stations 24.Each of the wafersPositionedAs much as possibleCassette 34SelectedSelective exportIsA particle-free environmental chamber 46 is defined. The load lock 22 has a load lock port 48 for opening the load lock chamber, a closed position overlapping the load lock port for sealing the load lock chamber from the surrounding atmosphere, and an open position spaced from the closed position. And a load lock door 50 movable between the two. An optimal door opening mechanism 51 (FIG. 2) for moving the load lock door 50 between the closed position and the open position.ButShown in the figureHas been.
As shown in FIGS., BThe lock 22 is a small environment 52 that defines an internal region for engaging and receiving the carrier 32.Adjacent to. The small environment seals and insulates the load lock chamber 46 and the carrier interior 42 from the ambient atmosphere. The carrier 32 is transported from a remote location in a predetermined manner and positioned on a port plate 56 that is part of the small environment 52. The port plate 56 communicates between the inner region 54 and the surrounding atmosphere.ThroughIt has a port opening 58 that enables The port door 60 is movable between a closed position in which the port door 60 is sealingly engaged with the port opening 58 and an open position in which the port door 60 is disengaged away from the port opening.Ru. An optimal seal 62 is used to ensure complete tightness of the small environment 52.
In order for the carrier door to be coextensive at the position closest to the port door, the port plate 56 and the carrier 32 are, KiPosition the carrierMutual engagementIncludes a positioning device. More specifically, the upper surface of the port plate 56InHas a plurality of recesses 64 provided at predetermined intervals so as to accommodate protrusions 66 protruding from the bottom of the carrier.ButIs formed. When the protrusion 66 is completely engaged with the recess 64, the carrier door 44 is located in the vicinity of the port 60 and has the same spread as the port 60.
System 20 removes cassette 34 from carrier 32 and loads it into load lock chamber 46 while maintaining a particle-free environment.As much as possibleUse a transport device. To accomplish this objective, the transport apparatus includes a first transport mechanism 68 (FIG. 9) for removing the cassette from the carrier and loading it into the interior region 54 of the small environment 52. The second transport mechanism 70 (FIGS. 1 and 2) plays a role of unloading the cassette from the internal region 54 and loading it into the load lock chamber 46.
Referring again to FIGS. 5 and 6, the small environment 52 is, InsideWith an uppermost edge 76 defining an opening to the body regionAn upright wall 75 and a base 74 surrounding the interior region 54A main housing 72 adjacent to the load lock 22 is included. The hood 78 overlaps the edges and upstanding walls 75 and includes a horizontal port plate 56 and an integrated hood wall 80 subordinate to the port plate. The hood wall is parallel to the upright wall 75, and the upright wall and the capillarystickerIs positioned on a plane located in the vicinity of the upright wall. The hood 78 is a capillary between the hood wall and the upright wall.stickerIt is possible to move between the lowered position and the raised position while maintaining the above.
As described above, the port plate 56 communicates with the internal region 54 and the surrounding atmosphere.ThroughA port opening 58 (FIG. 3) is provided to allow for this. Further, as described above, the port door 60 is movable between a closed position where the port door 60 is engaged in a sealed state on the same plane as the port opening and an open position where the port door 60 is disengaged away from the port opening. is there.
Referring to FIG. 7, carrier door 44InIs,No. 45 sealedBecomeTo the latching positionAlways energize to engage carrier door with carrier cover 38A latching mechanism 82 is provided. As shown in FIG. 8, the latching mechanism 82 selectively releases the carrier door from the carrier cover.As much as possibleMove to the unlatched positionMovementProductButIs possible.
State more clearlyForWith continued reference to FIG. 7, the carrier door 44 is formed with a central hole 86 having an appropriate size and shape to accommodate an eccentric disk 88 that can be smoothly rotated on the shaft 90. sameMrLatch assembly 92ButTo the heart disk 88Face to faceAxis mounted,on the other handAssemblyExplanation aboutIs two assembliesAboutTo do.Furthermore,A predetermined intervalSeparatedposition,Two or more latching mechanisms 82May be provided on the carrier door 44.. Each latching assembly is within a perforation 96 that extends between an end surface 98 of the carrier door 44 and a void 86.ofA longitudinally slidable latch rod 94 is included. The integral biasing plate 100 is positioned in the side hole 102, and the compression spring 103 surrounds the latch rod 94 and in the base of the cover 38.ofEngage with alignment hole 106DoA bias plate for biasing the tip 104 of the latch rodThePress. The connecting link 108 is pivotally attached to the end opposite to the tip 104 of the latch rod 94 and the eccentric disk 88., AntiDisk rotates clockwiseThenOf spring 103ForcePull out the tip 104 from the hole 106 against(See Figure 8).
The port door 60 is continuous by pressing the spring 103.ForceAnd an activation force mechanism 110 for selectively operating the carrier door latching mechanism 82 to move the latching mechanism toward the non-latching position in the manner described above. The moving operation described above is a port door.IsCarrier 44adjacentdidOccurs when moved to a position. The port 60 also has a central hole 111 that houses the activation force mechanism 110. The starting force mechanism 110 is connected to the inside of the port door 60 via an actuator rod 114 that is pinned to one arm portion of the bell crank 116.ofIt includes an actuator 112 that drives a drive pin 118 guided by the opening 120. As shown in FIGS. 7 and 8, the drive pin moves up and down with respect to a plane separating the carrier door from the port door. The free end of the drive pin 118 engages a fulcrum surface 122 on the eccentric disk 88 that is shaped and sized to receive and hold the free end of the drive pin during an engaging operation. That is, when the carrier door overlaps with the port door as shown in FIGS. 3 and 7, the actuator causes the drive pin 118 to engage the fulcrum surface 122 to advance to rotate the eccentric disk 88 as shown in FIG. In operation and as a result within the base of the cover 38ofHole 106And clerkTogetherdidThe tip 104 of the latch rod 94 is pulled out from the state. Conversely, when the actuator 112 moves backward and the drive pin 118 is retracted, the tip 104 is aligned with the engagement hole 106.HaveAs long as the tip of the spring 103ForceAs a result, the engagement hole is reengaged.
Numerous other designs of the latching mechanism 82 and the joint activation force mechanism 110 can also selectively release the carrier door 44 from the companion cover 38 and achieve a similar result of attaching the carrier door to the cover.
As described above, the system 20 includes a first transport mechanism 68 that removes the cassette from the carrier and moves it to the interior region 54 of the small environment 52. This mechanism is shown in more detail in particular in FIG. The transport mechanism described above isProvided on the base 74Drive the first actuator rod 126First1 actuator 124 and a second actuator 128 that drives the second actuator rod 130. The second actuator 128 is fixed to the first actuator rod 126 so as to be separated from the first actuator 124, and gravity between the port door 60 and the carrier 44 having the cassette 34 (see FIG. 3) to be supported is reduced. The shelf plate 132 to be weighted is fixed to the second actuator rod 130 so as to be separated from the second actuator 128.
Both the first actuator 124 and the second actuator 128 are separated from the port door 60.Carrying outThe operation of moving the shelf 132 from the position to the forward position near the port door is possible. This advanced position is shown in FIG. 10A. In the order of operation of the system 20, the carrier 32 is placed on the port plate 56 and positioned accurately. That is, the protrusion 66 at the bottom of the carrier cover 38 is fully engaged with the recess 64 in the port plate 56, so that the carrier door 44, which is coextensive with the entrance door 60, is located near the port door 60. To do.
Further, the starting force mechanism 110 is provided with a non-holding mechanism.LatchThe second actuator 128 operates to move to the state,Carrying outThe shelf plate 132 is moved together with the port door, the carrier door and the cassette to an intermediate position between the position and the advanced position. This intermediate position is shown in FIG. 10B. In a typical configuration, but not a limitation of the present invention, the elevation of the port plate 56 from the floor 134 or other operational surface is 900 mm and the shelf 132 reaches the position shown in FIG. 10B. As much as 19 mm can be lowered.
As shown in FIG. 6, the elevating mechanism 136 moves the hood 78 between the lowered position and the raised position. The lifting mechanism, BeIncluding a cylinder pair 138 supported on a cylinder 74.And the corresponding linear rail 140 provided on the hood wall 80 is operated.. As the lifting mechanism 136 operates, the operation of the system 20 of the present invention operates continuously and the hood 78 is raised by 266 mm before being positioned in the manner shown in FIG. 10C. As a result of this movement, the cassette 34 for transferring a plurality of wafers to the internal region 54 of the small space 52 is lowered.
As shown in FIG. 4, the cassette 34 includes integral flanges 142 that face each other. As shown in FIGS. 11 and 12, the gripping mechanism 144 is movable between a position that does not engage with the cassette and an engagement position that holds the cassette suspended in the internal region 54. The gripping mechanism 144 can move to the engagement position when the shelf board 132 moves to an intermediate position between FIGS. 10B and 10C. It should be noted that the height of the shelf 132 does not change between FIGS. 10B and 10C, and only the hood 78 moves relative to the shelf. The gripping mechanism 144 is suspended from the inner surface of the port plate 56, and cantilevered and faces the parallel support rod pair 148 facing each other.KickOr away from each otherTheAn actuating device 146 that is driven to The support bar 148 extends to the free end where the opposing gripping finger members 150 are positioned, and each of the gripping finger members is spaced apart to releasably engage the opposing flange 142. Ends with one and second opposing fingers 154 and 156.
When the hood 78 is moved to the position shown in FIG. 10C, the gripping finger member 150, particularly the receiving notch 158 between the fingers 154 and 156 of each gripping finger member, engages the flange. In order to accommodate each other, the cassette flanges 142 are aligned in a straight line as viewed from the front.
As shown in FIG. 10D,CassetteSuspended by gripping mechanism 144In stateThe first and second actuators 124 and 128 can both move the shelf 132 along with the port door, carrier door and cassette to the withdrawal position shown in FIG. 10E, which is located 132 mm above the floor 132. .
As described above, the system 20 includes a second transport mechanism 70 that houses the cassette 34 from the interior region 54 of the small environment 52 and moves it to the load lock chamber 46. This mechanism is described in more detail in particular in FIGS. A more complete description of the second transport mechanism 70 is disclosed in US application Ser. No. 08 / 498,834 filed Jul. 6, 1995. The complete description of the above application is incorporated herein by reference. The second transport mechanism 70 includes a platform 160 that selectively accommodates cassettes within the interior region. The drive arm mechanism 162 on the load lock 22 is,smallWithin the internal area of the environmentAnd aligned with the port opening 58 of the port plate 56 (see FIGS. 10F, 10G and 10H).Operatable to move the platform 160 between an extended position and a retracted position within the load lock chamber.
The base member 164 (FIGS. 2 and 2A) is provided inside the load lock chamber 46. The drive arm mechanism 162 is located between the extended position and the retracted position as described above.NisesuA base member 164 for pivoting the platform 160 on a plane is provided pivotally. The drive arm shaft 166 is rotatably provided on the base member 164, and the drive arm mechanism 162 is fixed to the drive arm shaft that moves the platform 160 between the extended position and the retracted position.
The lift drive mechanism 168 is operable to selectively move the base member 164 between the raised position and the lowered position. In order to achieve this object, the lift drive mechanism 168 includes a drive motor 170 and a screw 172 provided on the base member. When platform 160 is aligned with port opening 58 in port plate 56 within internal region 54 (see FIG. 10F), lift drive mechanism 168 engages and supports the cassette.DoWorks to move the platform vertically. TheRat foamButWhen engaged with the cassetteThe gripping mechanism 144 isMove to disengaged position (Fig. 10H)(FIG. 10G).
Further, the second transport mechanism 70 includes a drive shaft 172 and a motor 174 that rotates the drive shaft. The connection mechanism 176 drives the drive arm shaft 166 to be connected to the drive shaft 172 when the base member 164 is in the lowered position.
The system 20 is provided with a number of sensors that detect operating conditions and continuously provide appropriate information to the operator.
In one example as shown in FIG. 14, the gripping mechanism includes a sensor that detects whether the flange 142 of the cassette 34 is properly engaged with the receiving notch 158 between the opposing fingers 154 and 156. Including. In this example, the transmitter 178 on the first finger 154 is operable to issue an instruction signal to the second finger 156. Second finger 156 has a receiver 180 that is positioned on second finger 156 to receive a signal from the transmitter of the first finger. With the configuration as described above, the presence of a signal at the receiver 180 indicates that there is no cassette positioned between the fingers, and the absence of a signal at the receiver indicates that the cassette flange 142 is between the fingers. Indicates that exists.
In other examples, it may be desirable to know whether a cassette is actually present on the carrier 32. As shown in FIG. 10A, in order to achieve this purpose, a cassette presence transmitter 182 is provided on one of the hood walls 80, and the hood is positioned between the lowered position (FIG. 10B) and the raised position (FIG. 10C). The cassette presence transmitter 182TheWalloppositeOneWall ofIn the cassette presence receiver 184 provided inAcross the cassette passageSignalTo sendThe In this device, the presence of a signal at the receiver 184 indicates that no cassette is present within the interior region 54, and the absence of a signal at the receiver indicates that a cassette is present within the interior region. .
As yet another example, it is desirable to know whether or not this operation is undesirable, whether or not the wafer has been partially removed from or loaded into the cassette. To achieve this goal, as shown in FIG. 10A, a wafer carry-out transmitter 186 is provided on one of the hood walls 80, and the hood is in a lowered position (FIG. 10B) and a raised position (FIG. 10C). When moving again betweenWafer carry-out receiver 188 provided on one opposing wall of the hood wallCassette passageIt is sent across. In an apparatus such as that described above, the presence of a signal at the receiver 188 indicates that the wafer is properly positioned within the cassette, and the absence of a signal at the receiver indicates that the wafer is outside the cassette. Indicates improper protrusion.
As shown in FIGS. 5 and 6, as another feature of the present invention, the system 20 is designed to remove foreign objects from the interior region, particularly to remove foreign objects from the wafer 36 supported in the cassette 34. Direct laminar flow through the inner region 54 of theAir flow generationSubsystem 190IncludingMu Subsystem 190 moves verticallyRuA fan 192 provided on the hood 78 is included. The fan plays a role in creating a positive pressure in the small environment to prevent the entry of pollutants from the surrounding atmosphere. Further, the fan operates to generate a circulating air flow as indicated by an arrow 193 in the small environment. The positive pressure in the small environment isCauses excess air and about 10% to 15% airCapillaries between upright wall 75 and hood wall 80stickerDischarged throughButTherefore, it is necessary to replenish with “compensation” air from the surrounding atmosphere. For this purpose, the adjustable air damper 200 draws in a sufficient amount of “compensation” air and the capillary between the hood and the main housing.stickerDirects air to the fan to compensate for the amount of air leaking from the small environment throughFor, The ambient atmosphere and fan 192TheCommunicatingThroughYouAs much as possibleFood 78InIs provided.
Another important component of the subsystem 190 is a filter 194, preferably an ULPA (Ultra Low Penetration Air) filter, which filters air particles generally in the size range of 0.1 to 0.2 microns. From the stream with an efficiency of about 99.999%. Filter 194 is intended to remove particulate matter from the air stream indicated by arrow 193.On hood 78Under the fan 192In the flowIs provided. Duct 196 is in small environment 52EstablishmentFiltered from the fanToMaintain and direct airflowAs much as possibleIt is provided on the hood 78.
Like the fan 192 and duct 196, the filter 194 is provided on the hood to move with the hood, and as shown in FIGS. 5 and 6, the flow of air passing through the filter is when the cassette is completely in a small environment. All is pulled into the cassette 34 and ejected to pass.Will beIt has an exhaust surface 202. In this example, the fully protruding area on the discharge surface 202 of the filter 194 is equal to the fully protruding area of the cassette.
In the configuration as described above, the exhaust surface 202 positioned above the surface of the carrier door 44 as the hood 78 moves between the lowered position shown in FIG. 6A and the raised position shown in FIGS. 5, 6 and 6D. The amount by which the protruding area (as shown continuously in FIGS. 6B and 6C) increases is equal to the amount by which the protruding area of the cassette located below the surface of the carrier port 40 increases.
Downstream of the cassette, preferably formed to maintain and direct the air flow back from the cassette to the fanHigh pressure condition maintaining member204 is provided.High pressure condition maintaining memberDistribution plate 206 (FIGS. 6, 6A-6E) which is part of the wall ofInOver the entire surface that is closest and coextensive with the cassette when the cassette occupies the position shown in FIG. 6D.,Multiple perforations evenly spaced208Is provided. The purpose of this distribution plate 206 is to prevent the concentration of flux lines and to ensure the uniformity of the air flow in the small environment 52, particularly when returning to the fan.
Other controls for air flowmeansIsHigh pressure condition maintaining memberAn adjustable flow damper 210 located at the boundary between 204 and the fan 192. The damper 210 operates primarily to ensure that turbulence is always prevented.
The main purpose of the airflow generation subsystem is to ensure that cassettes removed from the clean environment of the mobile carrier 32 are transported through the same level of clean environment within the small environment 52. All the abovemeansWorks to prevent turbulent and rotating flows that bring harmful particulate matter onto cassettes and semiconductor wafersYouIs. In this regard, there are two goals that must be achieved in the present invention, the first is not to stir the airflow more than necessary in a small environment, otherwise on adjacent surfaces. Particles will be transmitted in the airTheThe second point is to keep the number of particles already present in the moving air stream until blocked and removed by the filter 194.
While preferred embodiments of the invention have been disclosed in detail, it should be understood that various modifications can be made to the embodiments described above without departing from the scope of the invention as set forth in the specification and defined in the appended claims. Those skilled in the art should understand.

Claims (64)

A movable carrier for transporting a wafer in a particle-free environment, a cover having a carrier port enabling access to the inside of the carrier, a closed position for sealingly engaging with the carrier port, and a predetermined position from the closed position said carrier door and movable carrier door, before Symbol urged to and the carrier cover always the carrier door to the locking position mounted in a sealed state to the carrier cover between an open position at a location spaced intervals and a non-latching movable locking means to a position for releasing and a mobile carrier comprising,
A cassette that supports a plurality of wafers smoothly stored in the carrier and stacked at a predetermined interval, the cassette being releasably supported on the carrier door;
A load lock defining a particle-free chamber in which each of the wafers is unloaded to be selectively positioned at at least one processing station, having a load lock port opening to the load lock chamber and surrounding A load lock that includes a load lock door that is movable between a closed position that seals the load lock chamber from the atmosphere and overlaps the load lock port and an open position that is spaced a predetermined distance from the closed position;
A mini-environment defining an interior region adjacent to said load lock for accommodating a pre-Symbol carrier engaged with the carrier, the small environment seals the interior of the carrier and the load lock chamber from the surrounding atmosphere and insulated, the small environment includes a main housing adjacent to the load lock, the main housing has upstanding walls and the base having a top edge defining an opening surrounding said interior region and into the interior region And an upright wall including a planar port plate and an integral hood wall subordinate to the port plate, and a hood overlapping the edge, the hood wall being located in a plane parallel to the upright wall and a capillary tube Close to the upright wall forming a seal, the hood is movable between a lowered position and a raised position while maintaining a capillary seal between the hood wall and the upright wall The port plate has a port opening that allows communication between the internal region and the surrounding atmosphere; the port plate and the carrier, wherein the carrier door is proximate to the port door and the port door; A small environment including interengagement positioning means for positioning the carrier to be coextensive;
And unloading the cassette from the carrier, and a conveying means for moving the carrier to the load lock chamber to maintain the particle free environment, it consists,
Before SL conveying means, the cassette was carried out from the carrier said moved in the interior region of the mini-environment, and away from the port opening and a closed position that engages sealingly on the port opening flush A first conveying means including a port door movable between an open position and a non-engaged state , wherein the port door opposes a biasing force that moves the latching means in a non-engagement position direction; and including first transport means moving means for selectively causing actuate the locking means of the carrier,
A shelf board on which the gravity of the port door supporting the cassette is weighted;
After raised the port door to the closest position, driving means operated to lower the shelf board, the port door and the cassette into the interior region,
Semiconductor wafer bulk conveying system which comprises a second conveying means for moving the cassette is unloaded from the interior region of the small environment, and the load lock chamber. 2. The semiconductor wafer batch transfer system according to claim 1, further comprising a load lock door drive mechanism that moves the load lock door between the closed position and the open position. A first actuator provided on the pedestal for driving a first actuator rod;
A second actuator for driving the second actuator rod,
The second actuator is fixed to the first actuator rod at a position spaced from the first actuator;
The shelf plate is fixed to the second actuator rod at a position spaced from the second actuator;
2. The first aspect according to claim 1, wherein both the first actuator and the second actuator are capable of moving the shelf board from an unloading position spaced apart from the port door to an advanced position closest to the port door. Semiconductor wafer batch transfer system. Moving said port door, when the front Symbol shelves is positioned at the forward position closest said port door, said locking means engageable with the Do Ri, and the locking means to the non-locking position It includes release means which can be Ru allowed,
The second actuator is configured such that the shelf plate having the port door and the cassette is located between the carry-out position and the advance position in a state where the shelf board is located at the advance position closest to the port door. Can be selectively moved to a position,
The hood has an elevating means for moving the hood between the lowered position and the raised position;
Gripping means that is movable between a position that is disengaged from the cassette and an engagement position that holds the cassette supported in the inner region , wherein the shelf plate has moved to the intermediate position Gripping means sometimes movable to the engagement position,
Said first and second actuators are both in a state where the cassette is lifting by Ri支 the gripping means, it is possible for moving the shelves to the unloading position with the port door,
Said second conveying means includes a platform for selectively accommodating the cassette in the interior region,
Provided on said load lock, allowed to move the platform between a retracted position of the small the interior the load lock chamber and an extended position that is aligned with the port opening of the port plate in the region of the environment Drive arm means;
Elevating drive means for vertically moving the platform engaged with the cassette to receive the cassette;
It said gripping means, said cassette scope third term semiconductor wafer bulk conveying system according to claim, characterized in that the movement to the disengaged position upon engagement with the platform. The second conveying means is a pedestal member provided in the load lock chamber , and a pedestal member that can be selectively moved between an ascending position and a descending position by the elevating drive means ;
A drive arm shaft rotatably provided on the base member ;
And drive the dynamic shaft,
Motor means for rotating the drive shaft;
Coupling means for coupling and driving the drive arm shaft to the drive shaft when the base member is in the lowered position;
Said drive arm means, before Symbol pivotally mounted on said base member to allowed to move the platform on a plane formed between the extended position and the retracted position,
Said drive arm means, before Symbol extended position and the retracted position that is fixed to said drive arm shaft to allowed to move the semiconductor wafer bulk transport according ranging fourth preceding claims, wherein the platform between the system. 5. The semiconductor wafer batch transfer system according to claim 4 , wherein the gripping means is provided on the port plate in the internal region. The cassette includes opposing integral flanges;
The gripping means includes a gripping finger releasably engaged with the integral flange;
5. The semiconductor wafer batch transfer system according to claim 4 , further comprising: gripping drive means for moving the gripping finger between the engagement position and the non-engagement position. The gripping fingers are first and second finger members facing each other ;
A transmitter provided on the first finger member for transmitting a signal to the second finger member having a receiver that is provided to receive a signal from a transmitter positioned on said first finger member,
The presence of a signal at the receiver indicates that there is no properly positioned cassette between the finger members ;
8. The semiconductor wafer batch transfer system according to claim 7 , wherein the absence of a signal in the receiver indicates that a cassette flange exists between the finger members . 5. The semiconductor wafer batch transfer system according to claim 4 , wherein the gripping means includes sensor means for detecting whether or not the cassette is properly engaged. The second transport means includes a platform for selectively accommodating the cassette in the internal region;
Provided in the load lock, allowed to move the platform between a retracted position of the small environment the inside of the load lock chamber and aligned with Ru Shin length located at the port opening of the port plate in the region of 2. The semiconductor wafer batch transfer system according to claim 1, further comprising drive arm means. 2. The semiconductor wafer batch transfer system according to claim 1, wherein the carrier door includes elastic means for urging the latching means toward the latching position. The second conveying means includes a platform for selectively accommodating the cassette;
2. A drive arm means provided on the load lock for moving the platform between an extended position in the small environment and a retracted position in the load lock chamber. The semiconductor wafer batch transfer system described. A pedestal member provided inside the load lock chamber;
13. The semiconductor wafer batch transfer according to claim 12 , wherein the drive arm means is provided on the pedestal member that moves the platform on a plane between the extended position and the contracted position. system. It said drive arm means comprises a drive arm movable between pivotally mounted on said base member, and said extended position and said retracted position,
A drive arm shaft provided rotatably on the pedestal member ,
The driving arm, said extended position and said retracted position and an semiconductor wafer batch transfer system 13 Claims claims, characterized in that it is secured to the drive arm shaft for moving said platform between the. Elevating drive means capable of selectively moving the pedestal member between a raised position and a lowered position;
A drive shaft;
Motor means for rotating the drive shaft;
When the base member is in said lowered position, a semiconductor wafer bulk conveying system in the range 14 claim of claim, which comprises a, a connecting means for connecting driving the drive arm shaft to said drive shaft. The second conveying means includes a platform for selectively accommodating the cassette;
Wherein provided on the load lock, moving the platform between a retracted position of the mini-environment within the said port and opening into aligned Ru extension length position the load lock chamber of the port plate in the interior region of the The semiconductor wafer batch transfer system according to claim 1, further comprising: driving arm means for squeezing. The small environment wherein directing a laminar air flow through the interior region of, and the range 16 of claims, characterized in that it comprises an air flow generating unit for removing foreign matter from the wafer being supported within said cassette The semiconductor wafer batch transfer system described. It said air flow generating means includes a fan for generating a positive give rise to pressure, and the small environment inside the circulating air flow,
A downstream filter of the fan to remove particulate matter from the air stream ;
Duct means for containing and directing the air flow from the fan to the filter;
18. The semiconductor wafer collective transfer system according to claim 17 , further comprising high pressure state maintaining means for receiving and directing an air flow returning from the cassette to the fan. It said air flow generating means includes a fan for generating a positive give rise to pressure, and the small environment inside the circulating air flow,
The fan is provided in the hood and is in fluid communication with the fan to compensate for the amount of air leaking from the small environment via a thin tube seal between the hood and the main housing, thereby allowing the fan to move from the ambient atmosphere to the small atmosphere. An air amount adjusting means for sucking air into the environment;
A downstream filter for the fan to remove particulate matter from the air;
Duct means for containing and directing the air flow from the fan to the filter;
18. The semiconductor wafer collective transfer system according to claim 17, further comprising high pressure state maintaining means for receiving and directing an air flow returning from the cassette to the fan. Interposed between said fan and said high pressure maintaining means, the scope of the claims, characterized in that it comprises an adjustable flow regulating means for maintaining a laminar flow in the air flow generated by the small environment 19 The semiconductor wafer batch transfer system described in the item. The filter is provided on the hood to move with the hood, and has an exhaust surface that draws all of the airflow that passes through the filter into the cassette and exhausts it to pass through, the exhaust of the filter The total protruding area of the surface is equal to the total protruding area of the cassette;
With the movement of the hood between the said raised position and said lowered position, the amount of projected area of the exhaust surface is positioned above the plane of the carrier door is increased, it is positioned below the plane of said carrier port 20. The semiconductor wafer batch transfer system according to claim 19, wherein the amount of increase in the protruding area of the cassette is equal to each other. The high-pressure state maintaining means includes, as a part of a wall, a distribution plate that is coextensive in the vicinity of the cassette when the hood is in the raised position, and the distribution plate is uniformly spaced over the entire surface. The system of claim 21, comprising a plurality of perforations arranged in 20. The system according to claim 19, further comprising a flow rate control means for controlling an air flow between the high pressure state maintaining means and the fan. Provided one wall of the front SL hood wall, the hood when the moves between the raised position and the lowered position, the cassette receiver provided on one wall facing the hood wall the transmitters Ru directed signals across the passage seen including a including a cassette presence sensor means,
The presence of a signal in the receiver indicates that no cassette is present in the inner area, and the absence of a signal in the receiver indicates that a cassette is present in the inner area. The semiconductor wafer collective transfer system according to claim 1. A path of the cassette is provided on one wall of the hood wall , and when the hood moves between the lowered position and the raised position, the receiver is provided on the opposite wall of the hood wall. across it includes wafer delivery sensor means including a transmitter which Ru directed signal,
The presence of a signal at the receiver indicates that the wafer is properly positioned in the cassette, and the absence of a signal at the receiver improperly protrudes outside the cassette to position the wafer. 2. The semiconductor wafer batch transfer system according to claim 1, wherein the semiconductor wafer batch transfer system is indicated. A system for simultaneously transporting a semiconductor wafer which is supported stacked at predetermined intervals inside the cassette which is accommodated in a circular smooth inside a mobile carrier in particle-free environment,
A load lock defining a particle-free chamber in which each of the wafers is unloaded to be selectively positioned at at least one processing station, having a load lock port opening to the load lock chamber and surrounding A load lock that includes a load lock door that is movable between a closed position that seals the load lock chamber from the atmosphere and overlaps the load lock port and an open position that is spaced a predetermined distance from the closed position;
A load lock door drive mechanism for moving the load lock door between the closed position and the open position;
The defining an interior region adjacent to the load lock and includes a port plate having ports for communication between the inner region and the outer environment, and open spaced and a closed position overlapping sealingly with said port from said port A small environment including a port door movable between positions , wherein the port plate is configured to engage and receive the carrier, and the load lock chamber and the interior of the carrier are surrounded by an ambient atmosphere. A small environment that seals and insulates ,
And unloading the cassette from the carrier, and a conveying means for moving the carrier to the load lock chamber to maintain the particle free environment, it consists,
Before SL conveying means includes first conveyor means for moving the cassette in the interior region of the unloading and and the small environment from the carrier,
And unloading the cassette from the interior region of the small environment, and wherein the second conveying means for moving said load lock chamber,
The second conveying means includes a platform for selectively accommodating the cassette;
Provided on said load lock, allowed to move the platform between a retracted position of the small the interior the load lock chamber and an extended position that is aligned with the port opening of the port plate in the region of the environment And a drive arm means. Wherein directing a laminar flow air passing through the interior region of the mini-environment, and it claims paragraph 26, wherein including the air flow generating means for removing foreign matter from the wafer being supported within said cassette System. A carrier for transporting the cassette and the wafer supported in the cassette in a particle-free environment between a position separated from the small environment, and having a carrier port enabling access to the inside of the carrier mobile carrier comprising a cover, and a movable carrier door between the engaging and the closed position overlapping with the carrier carrier and an open position in a position spaced a predetermined distance in a sealed state with said carrier port When,
Coupling means for selectively coupling the carrier door to the port door;
The carrier, the carrier port as much as possible and coextensive at a position against the small environment ports and recently been selectively received in said port plate, said carrier door characterized Rukoto that Sessu next and said port door 27. The system of claim 26 . The cassette is releasably supported on the carrier door;
The carrier includes a latching means moveable to urge the carrier door always to latching position for mounting in a sealed state to the carrier cover and from the carrier cover to the non-latching position to release the carrier door,
The small environment is a main housing adjacent to the load lock, the main housing including an upright wall and a pedestal that surrounds an interior region and defines an opening to the interior region and has an uppermost edge;
A hood overlapping said upstanding wall and the rim includes integral hood wall subordinate planar port plate on the port plate, the hood wall is located in a plane parallel to the upstanding wall and forms the capillary seal said upstanding wall in contact to recently, the hood being movable between a raised position and a lowered position while maintaining a capillary seal between the hood wall and the upstanding wall, said port plate and the interior region A hood having a port opening that allows communication with the surrounding atmosphere,
And said port plate and said carrier, said carrier door is the port door and the closest to possible with co-extensive with the port door includes interengaging positioning means for positioning the pre-Symbol carrier,
The first transport means is a port door that is movable between a closed position that engages in a sealed state on the same plane as the port opening and an open position that is disengaged away from the port opening , First conveying means including a port door including a moving means for selectively operating the hooking means of the carrier against a biasing force that moves the hooking means in a non-locking position direction;
A shelf board on which the gravity of the port door supporting the cassette is weighted;
29. The system according to claim 28 , further comprising driving means for lowering the shelf door, the port door, and the cassette to an internal area after raising the port door to the closest position. A first actuator provided on the pedestal for driving a first actuator rod;
A second actuator for driving the second actuator rod,
The second actuator is fixed to the first actuator rod at a position spaced from the first actuator;
The shelf plate is fixed to the second actuator rod at a position spaced from the second actuator;
30. The range according to claim 29 , wherein both the first actuator and the second actuator are capable of moving the shelf board from an unloading position spaced apart from the port door to an advanced position closest to the port door. System. Said port door, when the front Symbol shelves is positioned at the forward position nearest the said port door and allowed moves in front KiKaketome means engageable with Do Ri said hooking means to the non-locking position Including release means,
The second actuator is configured such that the shelf plate having the port door and the cassette is located between the carry-out position and the advance position in a state where the shelf board is located at the advance position closest to the port door. Can be selectively moved to a position,
The hood has an elevating means for moving the hood between the lowered position and the raised position;
Gripping means that is movable between a position that is disengaged from the cassette and an engagement position that holds the cassette supported in the inner region, wherein the shelf plate has moved to the intermediate position Gripping means sometimes movable to the engagement position,
Said first and second actuators are both in a state where the cassette is lifting by Ri支 the gripping means, it is possible for moving the shelves to the unloading position with the port door,
The second transport means includes elevating drive means for vertically moving the platform engaged with the cassette to accommodate the cassette,
It said gripping means, system range 30th claim of claim, wherein said cassette is moved to the disengaged position upon engagement with the platform. The second conveying means is a pedestal member provided in the load lock chamber , and a pedestal member that can be selectively moved between an elevated position and a lowered position by an elevating drive means ;
A drive Amushafu bets disposed rotatably in the base member,
A drive shaft;
Motor means for rotating the drive shaft;
Coupling means for coupling and driving the drive arm shaft to the drive shaft when the base member is in the lowered position;
The drive arm means is pivotally provided on the pedestal member to move the platform on a plane formed between the extended position and the retracted position;
32. The system of claim 31 , wherein the drive arm means is secured to the drive arm shaft for moving the platform between the extended position and the retracted position . 32. The system according to claim 31 , wherein the gripping means is provided on the port plate in the inner region. The cassette includes opposing integral flanges;
The gripping means includes a gripping finger releasably engaged with the integral flange;
32. The system according to claim 31 , further comprising gripping drive means for moving said gripping finger between said engaged position and said non-engaged position. The gripping fingers are first and second finger members facing each other;
A transmitter provided on the first finger member for transmitting a signal to the second finger member having a receiver that is provided to receive a signal from a transmitter positioned on said first finger member,
The presence of a signal at the receiver indicates that there is no properly positioned cassette between the finger members ;
35. The system of claim 34 , wherein no signal at the receiver indicates that a cassette flange is present between the finger members . 32. The system of claim 31 , wherein the gripping means includes sensor means for detecting whether the cassette is properly engaged. 30. The system of claim 29 , wherein the carrier door includes resilient means for biasing the latching means toward the latching position. A pedestal member provided inside the load lock chamber;
30. The system of claim 29 , wherein the drive arm means is provided on the pedestal member for moving the platform on a plane between the extended position and the retracted position. It said drive arm means comprises a drive arm movable between pivotally mounted on said base member, and said extended position and said retracted position,
A drive arm shaft provided rotatably on the pedestal member ,
The driving arm, the extended position and the retracted position with the system in the range 38 claim of claim, characterized in that it is secured to the drive arm shaft for moving said platform between the. Elevating drive means capable of selectively moving the pedestal member between a raised position and a lowered position;
A drive shaft;
Motor means for rotating the drive shaft;
Wherein when the base member is in the lowered position, the system in the range 39 claim of claim, which comprises a, a connecting means for connecting driving the drive arm shaft to said drive shaft. A path of the cassette is provided on one wall of the hood wall, and when the hood moves between the lowered position and the raised position, the receiver is provided on the opposite wall of the hood wall. Including cassette presence sensor means including a transmitter for directing the signal across
The presence of a signal in the receiver indicates that no cassette is present in the inner area, and the absence of a signal in the receiver indicates that a cassette is present in the inner area. 30. The system of claim 29. A path of the cassette is provided on one wall of the hood wall, and when the hood moves between the lowered position and the raised position, the receiver is provided on the opposite wall of the hood wall. Including wafer delivery sensor means including a transmitter for directing signals across
The presence of a signal at the receiver indicates that the wafer is properly positioned in the cassette, and the absence of a signal at the receiver improperly protrudes outside the cassette to position the wafer. 30. The system of claim 29, wherein the system indicates that The small environment wherein directing a laminar air flow through the interior region of, and the range 28 of claims, characterized in that it comprises an air flow generating unit for removing foreign matter from the wafer being supported within said cassette The system described. It said air flow generating means includes a fan for generating a positive give rise to pressure, and the small environment inside the circulating air flow,
A downstream filter of the fan to remove particulate matter from the air stream ;
Duct means for containing and directing the air flow from the fan to the filter;
44. The system of claim 43 , further comprising high pressure state maintaining means for containing and directing an air flow returning from the cassette to the fan. Wherein interposed between the high pressure maintaining means and said fan, said range 44th claims, characterized in that it comprises an adjustable flow regulating means for maintaining a laminar flow in the air flow generated in a small environment System described in the section. The filter is provided on the hood to move with the hood, and has an exhaust surface that draws all of the airflow that passes through the filter into the cassette and exhausts it to pass through, the exhaust of the filter The total protruding area of the surface is equal to the total protruding area of the cassette;
Along with the movement of the hood between the lowered position and the raised position, an amount by which the protruding area of the exhaust surface positioned above the carrier door surface increases, and the cassette positioned below the carrier port surface. 46. The system of claim 45 , wherein the amount by which the protruding area increases is equal to each other. The high pressure maintaining means, when said hood is in the raised position, comprises a distributor plate with a coextensive with the cassette and the near-contact as part of the wall, the distributor plate is evenly spaced over the entire surface 47. The system of claim 46, comprising a plurality of perforations arranged in 45. The system according to claim 44 , further comprising flow control means for controlling an air flow between said high pressure state maintaining means and said fan. Wherein interposed between the high pressure maintaining means and said fan, said claims, characterized in that it comprises an adjustable flow regulating means for maintaining a laminar flow in the small air flow which is generated in the environment 28 System described in the section. A step of transferring the wafer (a) from our Keru away 隔位 location within mobile carrier having a particle free environment to a mini-environment that defines an interior region of the particle-free environment,
Comprising the steps of supporting a plurality of wafers stacked at predetermined intervals inside the (b) cassette is smoothly accommodated in said carrier,
(C) a port plate having a port opening that allows communication between the internal region and the surrounding atmosphere; a closed position that engages in a sealed state on the same plane as the port opening; and the port opening. Providing a port door movable between the open position and the disengaged position in the small environment;
And (d) a step of providing a main housing to the small environment, each of the wafer is close to the load lock defining a chamber having a particulate-free environment is unloaded at least one treatment is to selectively position the station The load lock has a load lock port opening to the load lock chamber, and seals the load lock chamber from the surrounding atmosphere to provide a predetermined position from the closed position and the closed position overlapping the load lock port. A load lock door movable between an open position at a position, wherein the main housing includes an upright wall and a pedestal having a top edge surrounding the interior region and defining an opening to the interior region; and a planar port plate; A hood that includes an integral hood wall subordinate to the port plate and overlaps the upright wall and the edge; A step allowed to close to the upstanding wall forming the tubular seal positioned the hood walls in a plane parallel to the upstanding wall,
(E) a cover having a carrier port enabling access to the inside of the carrier, a closed position engaged with the carrier port in a sealed state, and an open position at a predetermined distance from the closed position; comprising the steps of: providing a movable carrier door, the prior SL carrier between the,
(F) placing the carrier in the small environment such that the carrier port is coextensive with the port opening of the small environment;
(G) providing interengagement positioning means on the port plate and the carrier to position the carrier on the port plate so that the carrier door is close to and coextensive with the port door ;
(H) simultaneously releasing the latch between the carrier and the carrier door and the latch between the hood and the port door;
While maintaining a capillary seal between (i) the hood wall and said upstanding wall, and allowed Oite moved between the raised and lowered positions and the said carrier cover on the port plate hood, the Carrying the cassette into the internal region of a small environment;
A step (j) said to unloading the cassette from the interior region of the mini-environment, and allowed to move into the load lock chamber,
(K) the steps of: unloading the wafer from the carrier, and allowed to move into the interior region of the small environment,
(L) the unloads the wafers from the interior region of the mini-environment, and a step for moving to the load lock chamber, the semiconductor wafer bulk conveying method characterized in that it consists. 51. The semiconductor wafer collective transfer method according to claim 50 , wherein when the processing of each wafer is completed in said processing station, steps (l), (k), and (a) are executed in this order. The step (k)
(M) moving the carrier door and the port door from the closed position to the open position;
The step (l)
51. The semiconductor wafer batch transfer method according to claim 50 , further comprising the step of (n) moving the load lock door to the open position. The step (i)
(M) the semiconductor wafer bulk transfer method of paragraph 50, wherein claims for small environment the interior region to Oite the cassette is characterized in that it comprises a step of detecting that exists properly positioned. The step (k)
51. The semiconductor wafer batch transfer method according to claim 50 , further comprising: (m) detecting that the cassette is present in the carrier. The step (i)
51. The semiconductor wafer batch transfer method according to claim 50 , further comprising: (m) detecting that all wafers are properly positioned in the cassette. (M) directing a laminar air flow through the internal region of the small environment;
51. The semiconductor wafer batch transfer method according to claim 50 , further comprising: (n) removing foreign matter from the wafer supported in the cassette. The step (m)
(O) comprises the fit Shi rise to positive pressure in the small environment and the step of Ru provided a fan for generating a circulating air flow,
The step (n)
57. The semiconductor wafer batch transfer method according to claim 56 , further comprising: (p) removing particulate matter from the air by a downstream filter of the fan having an exhaust surface having a protruding region. (Q) directed to all the air flow passing through the filter to discharge to pull and allowed to pass into the interior of the cassette, to equalize the total projected area of the exhaust surface of the filter to the entire projected area of the cassette 58. The semiconductor wafer batch transfer method according to claim 57 , further comprising a step. (M) directing a laminar air flow through the internal region of the small environment;
(N) removing foreign matter from the wafer supported in the cassette;
(O) introducing air from the ambient atmosphere into the small environment to compensate for the amount of air leaking from the small environment via a narrow tube seal between the hood and the main housing. 51. The semiconductor wafer batch transfer method according to claim 50 . (M) the amount of projected area of said exhaust surface positioned above the surface of the carrier door is increased, the amount of projected area of the cassette to be positioned below the plane of said carrier port is increased, but made respectively equal as described above, the semiconductor wafer bulk transfer method of paragraph 50, wherein claims that you have been characterized in that it comprises a step for moving said hood between said raised position and said lowered position. A movable carrier for transporting a wafer in a particle-free environment, a cover having a carrier port enabling access to the inside of the carrier, a closed position for sealingly engaging with the carrier port, and a predetermined position from the closed position a moving type carrier comprising a movable carrier door and between an open position at a location spaced intervals,
A cassette for supporting a plurality of wafers smoothly stored in the carrier and stacked at a predetermined interval;
A load lock defining a particle-free chamber in which each of the wafers is unloaded to be selectively positioned at at least one processing station, having a load lock port opening to the load lock chamber and surrounding A load lock that includes a load lock door that is movable between a closed position that seals the load lock chamber from the atmosphere and overlaps the load lock port and an open position that is spaced a predetermined distance from the closed position;
A mini-environment defining an interior region adjacent to said load lock for accommodating a pre-Symbol carrier engaged with the carrier, to insulate and seal the interior of the carrier and the load lock chamber from the surrounding atmosphere With a small environment,
And unloading the cassette from the carrier, and a conveying means for moving the carrier to the load lock chamber to maintain the particle free environment, it consists,
It said conveying means includes a first conveying means for moving the cassette is unloaded from the carrier, and in the interior region of the small environment,
And unloading the cassette from the interior region of the small environment, and wherein the second conveying means for moving said load lock chamber,
Said second conveying means includes a platform for selectively accommodating a pre Symbol cassette,
Provided on said load lock, wherein the drive for moving the platform between the aligned Ru Shin length located port opening of the port plate in the interior region of the small environment retracted position of the load lock chamber And a semiconductor wafer batch transfer system, comprising: arm means; 62. An airflow generating means for directing a laminar airflow passing through an interior region of the small environment and for removing foreign matter from a wafer supported in the cassette. Semiconductor wafer batch transfer system. The air flow generating means generates a positive air pressure and generates a circulating air flow inside the small environment;
A downstream filter of the fan to remove particulate matter from the air stream;
Duct means for containing and directing the air flow from the fan to the filter;
63. The system of claim 62, comprising high pressure state maintaining means for containing and directing an air flow returning from the cassette to the fan. 63. An adjustable flow adjusting means for maintaining a laminar flow in an air flow generated in the small environment, interposed between the high pressure state maintaining means and the fan. The semiconductor wafer batch transfer system according to the item.

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