JP4091014B2 - 半導体装置の洗浄方法ならびに半導体装置製造用機器の洗浄方法および洗浄装置 - Google Patents

半導体装置の洗浄方法ならびに半導体装置製造用機器の洗浄方法および洗浄装置 Download PDF

Info

Publication number
JP4091014B2
JP4091014B2 JP2004092281A JP2004092281A JP4091014B2 JP 4091014 B2 JP4091014 B2 JP 4091014B2 JP 2004092281 A JP2004092281 A JP 2004092281A JP 2004092281 A JP2004092281 A JP 2004092281A JP 4091014 B2 JP4091014 B2 JP 4091014B2
Authority
JP
Japan
Prior art keywords
semiconductor device
cleaning
cyanide
solution
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004092281A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005039198A (ja
JP2005039198A5 (enExample
Inventor
光 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Science and Technology Agency
National Institute of Japan Science and Technology Agency
Original Assignee
Japan Science and Technology Agency
National Institute of Japan Science and Technology Agency
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Science and Technology Agency, National Institute of Japan Science and Technology Agency filed Critical Japan Science and Technology Agency
Priority to JP2004092281A priority Critical patent/JP4091014B2/ja
Publication of JP2005039198A publication Critical patent/JP2005039198A/ja
Publication of JP2005039198A5 publication Critical patent/JP2005039198A5/ja
Application granted granted Critical
Publication of JP4091014B2 publication Critical patent/JP4091014B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2004092281A 2003-06-24 2004-03-26 半導体装置の洗浄方法ならびに半導体装置製造用機器の洗浄方法および洗浄装置 Expired - Fee Related JP4091014B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004092281A JP4091014B2 (ja) 2003-06-24 2004-03-26 半導体装置の洗浄方法ならびに半導体装置製造用機器の洗浄方法および洗浄装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003178855 2003-06-24
JP2004092281A JP4091014B2 (ja) 2003-06-24 2004-03-26 半導体装置の洗浄方法ならびに半導体装置製造用機器の洗浄方法および洗浄装置

Publications (3)

Publication Number Publication Date
JP2005039198A JP2005039198A (ja) 2005-02-10
JP2005039198A5 JP2005039198A5 (enExample) 2005-09-15
JP4091014B2 true JP4091014B2 (ja) 2008-05-28

Family

ID=34220165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004092281A Expired - Fee Related JP4091014B2 (ja) 2003-06-24 2004-03-26 半導体装置の洗浄方法ならびに半導体装置製造用機器の洗浄方法および洗浄装置

Country Status (1)

Country Link
JP (1) JP4091014B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4947454B2 (ja) * 2005-04-13 2012-06-06 国立大学法人大阪大学 半導体処理液の製造方法及びその製造装置
JP2008066349A (ja) * 2006-09-04 2008-03-21 Osaka Univ 光半導体デバイスおよびその製造方法並びにその製造装置
JP5633838B2 (ja) * 2009-03-27 2014-12-03 小林 光 半導体基板の処理方法および半導体装置の製造方法。
WO2012011188A1 (ja) * 2010-07-23 2012-01-26 株式会社Kit 太陽電池およびその製造方法、並びに太陽電池の製造装置
WO2012025984A1 (ja) * 2010-08-24 2012-03-01 株式会社Kit 半導体装置の製造装置及び半導体装置の製造方法
CN102142369A (zh) * 2011-01-05 2011-08-03 复旦大学 一种改善SiC器件性能的方法
CN117324291B (zh) * 2023-09-11 2024-10-15 江苏凯威特斯半导体科技有限公司 一种关于CVD Shower Head部件的清洗方法

Also Published As

Publication number Publication date
JP2005039198A (ja) 2005-02-10

Similar Documents

Publication Publication Date Title
EP1550517B1 (fr) Procede de nettoyage par voie humide d'une surface notamment en un materiau de type Silicium Germanium
US5679171A (en) Method of cleaning substrate
JP2581268B2 (ja) 半導体基板の処理方法
JP5276281B2 (ja) GaAs半導体基板およびその製造方法
WO2011158557A1 (ja) 炭化珪素半導体の洗浄方法および炭化珪素半導体の洗浄装置
CN114364780A (zh) 处理液、试剂盒、处理液的制造方法、基板的清洗方法、基板的处理方法
KR20090036715A (ko) 실리콘 웨이퍼 세정 방법
JP7090625B2 (ja) 処理液、キット、基板の洗浄方法
CN113690128A (zh) 一种磷化铟晶片的清洗方法
JP4091014B2 (ja) 半導体装置の洗浄方法ならびに半導体装置製造用機器の洗浄方法および洗浄装置
JP4579619B2 (ja) シリコンウエハの再生方法
JP3957268B2 (ja) 半導体基板の洗浄方法
JPH08264498A (ja) シリコンウエーハの清浄化方法
JP5152851B2 (ja) 半導体装置の製造方法
WO2011158558A1 (ja) 炭化珪素半導体の洗浄方法および炭化珪素半導体の洗浄装置
JP3076202B2 (ja) Eg用ポリシリコン膜の被着方法
CN111379027B (zh) 一种砷化镓晶片及其制备方法
JPH08264399A (ja) 半導体基板の保管方法および半導体装置の製造方法
JP4094323B2 (ja) 基板洗浄方法および半導体装置の製造方法
JP2007150196A (ja) 半導体ウエーハの洗浄方法および製造方法
US9028620B2 (en) Substrate clean solution for copper contamination removal
JP2001326209A (ja) シリコン基板の表面処理方法
JP2005033038A (ja) 半導体装置及びその製造方法、並びに処理装置
KR20080075508A (ko) 반도체 웨이퍼의 평면연삭방법 및 제조방법
JP4355785B2 (ja) 半導体装置製造用基板の製造方法および半導体装置の製造方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050606

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050606

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070906

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070918

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071105

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20071204

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071227

A911 Transfer of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20080201

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080226

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080227

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110307

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130307

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140307

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees