JP4084785B2 - Manufacturing method of electronic parts - Google Patents

Description

  The present invention relates to a method for manufacturing electronic components such as capacitors, inductors, filters, circuit boards, and the like that are configured by combining a dielectric layer and a conductor layer having a predetermined pattern.

  Conventionally, dielectric materials have been used to form electronic components such as capacitors, inductors, filters, and circuit boards.

  As such a conventional electronic component, for example, a plurality of ceramic layers having a predetermined dielectric constant are laminated with a first internal electrode and a second internal electrode interposed therebetween, and A multilayer ceramic capacitor or the like is well known in which a pair of external electrodes electrically connected to the first and second internal electrodes are provided on the side surface and the main surface of the multilayer body, respectively. A predetermined voltage is applied between the first internal electrode and the second internal electrode via the pair of external electrodes, and a predetermined voltage is applied to the ceramic layer disposed between the first internal electrode and the second internal electrode. It functions as a capacitor by forming a capacitance of.

  The above-mentioned multilayer ceramic capacitor is manufactured through the following steps (for example, see Patent Document 1).

  First, an organic binder and an organic solvent are added to and mixed with a predetermined ceramic material powder to prepare a slurry-like inorganic composition, which is formed into a sheet with a predetermined thickness by a conventionally known doctor blade method, etc. Form a sheet.

  Next, a conductor paste mainly composed of a metal such as nickel is printed and applied in a predetermined pattern on the main surface of the obtained ceramic green sheet by screen printing or the like known in the art to form a conductor pattern. Then, a laminated body of ceramic green sheets is formed by stacking.

Subsequently, the laminate is fired at a high temperature to form a conductor paste as an internal electrode and a ceramic green sheet as a ceramic layer. Finally, the conductor paste is applied to the end face of the laminate by a conventionally known dipping method or the like. A multilayer ceramic capacitor is manufactured by coating and baking to form external electrodes.
JP 2000-243650 A

  By the way, in recent years, with the miniaturization of electronic devices, there has been a demand for miniaturization of electronic components. In the case of the multilayer ceramic capacitor described above, individual ceramic layers and internal electrodes are formed thinly, and further, the number of layers is increased. Various studies have been made to increase the capacity.

  For example, in the above-described conventional multilayer ceramic capacitor, in order to reduce the thickness of the internal electrode, the average particle size of the metal powder contained in the conductor paste used for forming the internal electrode is, for example, about 0.3 μm It is important to make it extremely small.

  However, the particle size of the metal powder contained in the conductor paste is made extremely small to form a thin internal electrode, and even when a plurality of ceramic layers having this internal electrode are laminated, A thickness difference occurs between a certain region and a non-region. This difference in thickness increases as the number of layers increases, which may cause electrical failure such as delamination or bending of the electrode to cause a short circuit.

  The present invention has been devised in view of the above-mentioned drawbacks, and its purpose is to relatively easily eliminate the difference in thickness between a region with a conductor layer and a region without a conductor layer, and to produce a highly laminated electronic component. An object of the present invention is to provide an electronic component manufacturing method capable of effectively preventing defects such as deformation and cracks in a conductor layer and a dielectric layer.

  The method of manufacturing an electronic component according to the present invention includes a step A in which a conductor pattern is attached to the one main surface of the support film having an adhesive on one main surface, and one main surface of the support film, the conductor The conductor pattern of one main surface of the support film is pressed and peeled against both the part where the pattern exists and the part where the adhesive is exposed without the conductor pattern. A layered product by laminating a plurality of layers composed of a step B for selectively attaching a corresponding portion of the dielectric sheet to a portion where the dielectric sheet does not exist, and a portion where the conductor pattern and the dielectric sheet are attached The process C which forms is included.

  The method for manufacturing an electronic component preferably further includes a step D of firing the laminate.

In the method for manufacturing an electronic component, it is preferable that the step A is to press and transfer the conductor pattern existing on the support to one main surface of the support film.
In the method for manufacturing an electronic component, in the step B, the dielectric sheet is preferably pressed against the support film by a pressure roll. In particular, it is preferable that the surface portion of the pressure roll is formed using a urethane rubber coat, a neoprene rubber coat, or a natural rubber coat.
In the method for manufacturing an electronic component, the step B preferably presses the dielectric sheet formed on the surface of the resin film against the support film. In particular, the dielectric sheet is preferably formed on the resin film via a silicone resin or a fluororesin.
In the method for manufacturing an electronic component, in the step D, the pressure-sensitive adhesive is preferably thermally decomposed by the firing. In particular, the pressure-sensitive adhesive is preferably made of an acrylic, acrylic emulsion or butyral material.
In the method of manufacturing an electronic component, the step C includes a step of forming a layer-forming green sheet on a layer constituted by the conductor pattern and a portion where the dielectric sheet is attached, and the conductor pattern and the dielectric. It is preferable to include a step of laminating a plurality of layers formed by forming the layer-forming green sheet on a layer composed of the adhered portion of the body sheet.
In the method for manufacturing an electronic component, it is preferable that the conductor pattern is formed of a metal plating film. In particular, the metal plating film is preferably made of copper, nickel, chrome, or an alloy thereof. Moreover, it is preferable that the baking temperature of the said process D is lower than melting | fusing point of the metal which forms the metal plating film, and is higher than the recrystallization temperature of the said metal.
In the electronic component manufacturing method, the dielectric sheet is preferably a ceramic green sheet or made of an organic material. In the electronic component manufacturing method, the support film is made of polyethylene terephthalate, polyethylene naphthalate, or polypropylene. It is preferable to use.

  The method of manufacturing an electronic component according to the present invention includes a step A in which a conductor pattern is attached to the one main surface of the support film having an adhesive on one main surface, and one main surface of the support film, the conductor The conductor pattern of one main surface of the support film is pressed and peeled against both the part where the pattern exists and the part where the adhesive is exposed without the conductor pattern. A layered product by laminating a plurality of layers composed of a step B for selectively attaching a corresponding portion of the dielectric sheet to a portion where the dielectric sheet does not exist, and a portion where the conductive pattern and the attached portion of the dielectric sheet are attached Therefore, the conductor pattern and the dielectric sheet can be adhered and formed on the support film in a substantially flush manner without forming a large gap therebetween. Thus, even if a laminate is formed by laminating a plurality of such conductor patterns and dielectric sheets, and firing the laminate, it is possible to effectively prevent electrical failure due to delamination or electrode bending. Thus, it is possible to obtain an electronic component excellent in reliability and productivity.

  Further, according to the present invention, a relatively thin conductor pattern can be produced by forming the conductor pattern with a metal plating film. In this case, since the thickness of the dielectric sheet attached to the support film is also reduced in the same manner as the conductor pattern, when the dielectric sheet is selectively attached and transferred onto the support film, the dielectric material is pressed by pressing both of them. The sheet can be broken relatively easily along the contour of the conductor pattern. Therefore, the dielectric sheet can be accurately cut out and attached to the pattern corresponding to the portion where the conductor pattern does not exist, and defects such as deformation and cracks occur in the conductor layer and the dielectric layer obtained by firing them. It can be effectively prevented.

  Furthermore, according to the present invention, the firing temperature of the laminate in step D is lower than the melting point of the metal forming the metal plating film and higher than the recrystallization temperature, so that the metal is heated by the heat during firing. A conductor layer having excellent continuity can be formed without causing the inconvenience of melting the plating film and dividing the metal plating film. Here, the metal plating film becomes a conductor layer with excellent continuity, because the metal forming the metal plating film is recrystallized at the time of firing the dielectric sheet, so that the metal is moderately softened. This is because the (ceramic) particles in the dielectric sheet enter the surface of the metal plating film, thereby improving the adhesion between the metal plating film and the dielectric sheet, and obtaining an electronic component with few structural defects. It becomes.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a cross-sectional view showing a multilayer ceramic capacitor as an electronic component manufactured by a manufacturing method according to an embodiment of the present invention. The multilayer ceramic capacitor 1 shown in FIG. An internal electrode 3 as a layer, a dielectric layer 4, and an external electrode 5 are configured.

  The multilayer ceramic capacitor 1 is formed by alternately laminating internal electrodes 3 and dielectric layers 4 having a predetermined dielectric constant to form a rectangular parallelepiped-shaped multilayer body, and dielectric layers 4 on both upper and lower surfaces of the multilayer body. An insulating layer 2 made of the same material is formed, and an external electrode 5 electrically connected to the internal electrode 3 is attached and formed at both ends of the laminate.

  The dielectric layer 4 is formed of a ceramic material or an organic material. When made of a ceramic material, it is formed of, for example, barium titanate, calcium titanate, strontium titanate or the like. In the case of an organic material, it is made of, for example, PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PP (polypropylene), PPS (polyphenylene sulfide) or the like. The thickness of the dielectric layer 4 is set to, for example, 1.0 μm to 4.0 μm per layer, and the number of stacked layers is set to, for example, 30 to 600 layers. As the material of the insulating layer 2, a ceramic material or an organic material similar to that of the dielectric layer 4 is used.

  The outer shape of the multilayer ceramic capacitor 1 is, for example, formed with dimensions of 1.2 mm in width, 2 mm in length, and 1.2 mm in height, and the number of stacked dielectric layers 4 and internal electrodes 3 is 30 to 600 layers. Set to

  The thickness of the internal electrode 3 is set to about 0.5 μm to 2.0 μm, and the thickness of the dielectric layer 4 is set to about 1.0 μm to 4.0 μm.

  The material and thickness of the dielectric layer 4, the number of stacked layers, the facing area of the internal electrode 3, and the like are appropriately determined depending on the desired capacitance.

The multilayer ceramic capacitor 1 applies a predetermined voltage to the adjacent internal electrodes 3-3 through the external electrodes 5, and applies a predetermined capacitance to the dielectric layer 4 disposed between the internal electrodes 3-3. Next, a method for manufacturing the above-described multilayer ceramic capacitor will be described with reference to FIGS. 2 is a cross-sectional view for explaining step 1 in the production method of the present invention, FIG. 3 is a cross-sectional view for explaining steps 2 to 3 in the production method of the present invention, and FIG. 4 is a production of the present invention. It is sectional drawing for demonstrating the process 5 in a method. Steps 1 to 7 described below do not correspond to steps A to D in each claim on a one-to-one basis.

<Step 1>
First, the conductor pattern 9 made of a nickel plating film is attached to one main surface of the support film 6 to which the adhesive 7 is applied.

  As the support film 6, for example, a hard resin material such as a polyethylene terephthalate film (PET film), a polyethylene naphthalate (PEN film), or a polypropylene film (PP film) having a thickness of 10 μm to 100 μm can be used.

  The pressure-sensitive adhesive 7 is applied to the main surface of the support film 6 by a conventionally known curtain coating method or die coating method and dried to form a thickness of 0.05 μm to 10 μm. The pressure-sensitive adhesive 7 is formed of a material that is reliably pyrolyzed at a relatively low temperature, and is thermally decomposed upon firing even when attached to the conductor pattern 9 and the ceramic green sheet 11. For example, an acrylic (solvent type) ), Acrylic emulsion-based (water-based), butyral-based pressure-sensitive adhesive 7 (solvent-based) is preferably used, and among these, acrylic-based pressure-sensitive adhesive 7 having good peelability is particularly preferable.

  Further, the adhesive strength after drying of the pressure-sensitive adhesive 7 is, for example, 0.005 N / cm to 1.0 N / cm, and from the viewpoint of transferability, it is preferable to use a pressure-sensitive adhesive having a pressure-sensitive adhesive strength of 0.01 N / cm to 1.0 N / cm. From the viewpoint of releasability, it is preferable to use one having a thickness of 0.01 N / cm to 0.2 N / cm.

  Moreover, the conductor pattern 9 can use what formed by performing the etching process to the predetermined conductor pattern 9 on the main surface of the support body 8, for example by depositing the metal plating film deposited by electrolytic plating and electroless plating. . Alternatively, the conductor pattern 9 may be produced by electrolytic plating while masking areas other than the formation area of the conductor pattern 9 so that the predetermined conductor pattern 9 is obtained on the main surface of the support 8. Alternatively, the metal plating film may be produced by a thin film forming method such as ion plating, sputtering, chemical vapor deposition, etc., and the forming method is not particularly limited.

  As a material of the conductor pattern 9, for example, a metal such as copper, nickel, chrome, or an alloy containing these metals is used.

  The conductor pattern 9 is adhered to the support film 6 by pressing and transferring the conductor pattern 9 thus obtained to the surface of the support film 6 to which the adhesive 7 is applied. Thereafter, the conductor pattern 9 is peeled off from the support 8.

  The conductor pattern 9 described above is obtained by printing and applying a conductor paste mainly composed of a metal such as nickel in a predetermined pattern on the surface of the support film 6 on which the adhesive 7 is applied by screen printing or the like. It may be formed.

<Process 2>
Next, a support film 6 to which the conductor pattern 9 is attached and a ceramic green sheet 11 having a thickness substantially equal to that of the conductor pattern 9 are prepared. A portion of the support film 6 where the conductor pattern 9 exists and the conductor pattern 9 are prepared. The ceramic green sheet 11 is pressed against both parts of the part where no water is present.

  The ceramic green sheet 11 is made of a ceramic slurry that is made into a mud by adding and mixing a suitable organic solvent, organic binder, etc. to a dielectric material powder mainly composed of barium titanate, calcium titanate, strontium titanate, etc. It is applied to the main surface of the film 10 by a conventionally known die coating method or the like so as to have a thickness substantially equal to that of the conductor pattern 9 and is heated at a temperature of 70 ° C. to 85 ° C. for about 30 seconds to 60 seconds to be present in the ceramic slurry. It is obtained by drying many of the organic solvents that evaporate.

  As the resin film 10, for example, a hard resin material such as a polyethylene terephthalate film (PET film), a polyethylene naphthalate (PEN film), or a polypropylene film (PP film) having a thickness of 10 μm to 100 μm can be used. Further, a silicone resin, a fluororesin, or the like is applied to the main surface of the resin film 10 by a conventionally known die coating method or the like so that the ceramic green sheet 11 can be easily peeled off from the resin film 10. It is preferable.

  As the pressing means, for example, a pressure roll 13 or the like is used. The pressure roll 13 has a urethane rubber coat, neoprene on the surface portion so that both the portion where the conductor pattern 9 exists and the portion where the conductor pattern 9 does not exist can be uniformly pressed against the ceramic green sheet 11. What was formed with elastic materials, such as a rubber coat and a natural rubber coat, is used suitably.

  When the conductor pattern 9 is made of metal plating or the like, the conductor pattern 9 obtained by the above-described step 1 has a relatively thin thickness. Therefore, when the conductor pattern 9 is pressed, the portion where the conductor pattern 9 exists is pressed and the adhesive film 6 and the pressure-sensitive adhesive. 7 is compressed and deformed and pushed into the support film 6 and the adhesive 7. At the same time, since the ceramic green sheet 11 is pressed, the ceramic green sheet 11 comes into close contact with the adhesive 7 exposed at a portion where the conductor pattern 9 does not exist.

  At this time, since the ceramic green sheet 11 is strongly pressed against the upper corner of the conductor pattern 9, the surface of the ceramic green sheet 11 follows the contour of the conductor pattern 9 due to the cutting force of the edge of the conductor pattern 9. Cracks are likely to occur, and the ceramic green sheet 11 is accurately separated into a pattern corresponding to a portion where the conductor pattern 9 does not exist.

<Step 3>
Next, the resin film 10 is peeled from the ceramic green sheet 11 adhered on the support film 6.

  The ceramic green sheet 11 at the portion where the conductor pattern 9 exists is set such that the adhesion force between the conductor pattern 9 and the ceramic green sheet 11 is set smaller than the adhesion force between the resin film 10 and the ceramic green sheet 11. When peeling the film, it is peeled off at the same time. On the other hand, the ceramic green sheet 11 in the portion where the conductor pattern 9 does not exist is relatively firmly adhered to the support film 6 by the adhesive 7 and is larger than the adhesion force between the resin film 10 and the ceramic green sheet 11. When the resin film 10 is peeled off, the adhesive 7 remains on the support film 5 side and is not peeled off together with the resin film 10.

  Furthermore, since the ceramic green sheet 11 is as thin as the conductor pattern 9 and has cracks along the contour of the conductor pattern 9 in the above-described step 2, when the resin film 10 is peeled off. Then, the fracture occurs at the boundary between the portion where the conductor pattern 9 does not exist and the portion where the conductor pattern 9 exists, and remains at the portion where the conductor pattern 9 does not exist on the support film 6. On such a support film 6, the conductor pattern 9 and the ceramic green sheet 11 'are arranged substantially flush with each other without forming a large gap therebetween. Even when laminated, there is no great difference in thickness between the portion where the conductor pattern 9 is present and the portion where the conductor pattern 9 is not present. When an electronic component is manufactured by firing such a laminate, the deformation of the internal electrode is suppressed. Thus, it is possible to effectively prevent the occurrence of electrical failure and delamination.

<Step 4>
Next, after applying a ceramic slurry to the ceramic green sheet 11 ′ and the conductor pattern 9 obtained in the above step 3, the ceramic green sheet is dried over the ceramic green sheet 11 ′ and the conductor pattern 9 by drying the ceramic slurry. The layer-forming green sheets 12 are stacked.

  Such a ceramic slurry is obtained by adding and mixing an appropriate organic solvent, organic binder or the like to a dielectric material powder mainly composed of barium titanate, calcium titanate, strontium titanate or the like. The ceramic slurry thus obtained is applied by a conventionally known die coating method or the like so as to cover the conductor pattern 9 and the ceramic green sheet 11 ′ and dried.

  Further, in place of the above-described step 4, a ceramic pattern is applied to the main surface of the sheet-forming resin film by a conventionally known die coating method or the like, and dried to form the layer-formed green sheet 12 obtained in the step 3. The sheet-forming resin film may be peeled off by thermocompression bonding to the ceramic green sheet 11 ′.

<Step 5>
Next, a plurality of layer-formed green sheets 12 formed so as to cover the conductor pattern 9 and the ceramic green sheet 11 ′ obtained in step 4 are prepared, and these are pressure-bonded and laminated to each other, and the insulating layer 2 is further formed. A laminate 15 is formed by laminating the ineffective layer 14.

  Such a laminate is, for example, temporarily pressure-bonded at a pressure of 0.9 MPa while being heated at a temperature of 60 ° C., and then, at a temperature of 70 ° C. and a pressure of 50 MPa by a conventionally known hydrostatic pressure press or the like. The layer-formed green sheet 12 formed so as to cover the conductor pattern 9 and the ceramic green sheet 11 ′ constituting the structure is bonded to each other.

<Step 6>
And the laminated body obtained at the process 5 is cut | disconnected to a predetermined shape, and these are baked at high temperature.

  What is important here is that the laminate is fired at a temperature lower than the melting point of the metal forming the conductor pattern 9 and higher than the recrystallization temperature of the metal. The green sheet 12 becomes the dielectric layer 4 of the multilayer ceramic capacitor, and the conductor pattern 9 becomes the internal electrode 3.

  For example, when the conductor pattern 9 is made of nickel, the recrystallization temperature of nickel is 500 to 550 ° C., and the melting point of nickel is 1450 ° C. Therefore, the laminate is fired at a temperature of 1300 ° C., for example.

  By firing at a temperature lower than the melting point of the metal forming the conductor pattern 9 in this way, the inconvenience that the conductor pattern 9 is melted and the conductor pattern 9 is divided at the time of firing is surely prevented, and the continuity is excellent. The electrode 3 can be formed.

  In this case, since the firing temperature of the laminate is set higher than the recrystallization temperature of the metal forming the conductor pattern 9, the recrystallization of the metal forming the conductor pattern 9 proceeds during firing. Thus, the metal is moderately softened, and the ceramic particles in the layer-formed ceramic green sheet 12 enter the surface of the conductor pattern 9, thereby improving the adhesion between the conductor pattern 9 and the layer-formed ceramic green sheet 12, A multilayer ceramic capacitor with few structural defects can be obtained.

<Step 7>
Finally, a conductive paste for external electrodes is applied to both ends of the multilayer body, fired, and further subjected to plating to form external electrodes 5, thereby completing a multilayer ceramic capacitor 1 as a product.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

  Further, in the above-described embodiment, the case where the multilayer ceramic capacitor is manufactured has been described as an example. However, even in the case where other electronic components other than the multilayer ceramic capacitor, for example, other electronic components such as an inductor, a filter, and a circuit board are manufactured. Needless to say, the present invention is applicable.

It is sectional drawing which shows the multilayer ceramic capacitor as an electronic component manufactured with the manufacturing method which concerns on one Embodiment of this invention. It is sectional drawing which shows typically the process 1 in the manufacturing method of this invention. It is sectional drawing which shows the process 2-3 in the manufacturing method of this invention typically. It is sectional drawing which shows typically the process 5 in the manufacturing method of this invention.

Explanation of symbols

1 .... Multilayer ceramic capacitors (electronic parts)
2 .... Insulating layer 3 .... Internal electrode (conductor layer)
4. Ceramic layer (dielectric layer)
5 ... External electrode 6 ... Support film 7 ... Adhesive 8 ... Support 9 ... Conductor pattern 10 ... Resin film 11 ... Ceramic green sheet (dielectric) Body sheet)
11 '・ ・ Ceramic green sheet (dielectric sheet)
12 ... Green sheet for layer formation 13 ... Pressure roll 14 ... Invalid layer 15 ... Laminate

Claims (16)

Step A for attaching a conductor pattern to the one main surface of the support film having an adhesive on one main surface;
By pressing and peeling the dielectric sheet against both the main surface of the support film and the portion where the conductor pattern is present and the portion where the conductive pattern is not present and the adhesive is exposed , a nonexistent region of the conductor pattern of the one main surface of the support film, a step B selectively depositing a corresponding portion of the dielectric sheet,
A step C of forming a laminate by stacking a plurality of layers composed of said conductor pattern and the dielectric deposition portion of the sheet,
Of electronic parts including   The method of manufacturing an electronic component according to claim 1, further comprising a step D of firing the laminate.   3. The method of manufacturing an electronic component according to claim 1, wherein the step A includes pressing and transferring the conductor pattern existing on the support to one main surface of the support film. In the step B, the dielectric sheet, a method of manufacturing an electronic component according to any of claims 1 to 3, characterized in that it is pressed against the support film by pressure roll. The method of manufacturing an electronic component according to claim 4 , wherein a surface portion of the pressure roll is formed using a urethane rubber coat, a neoprene rubber coat, or a natural rubber coat. Wherein step B, the dielectric sheet formed on the surface of the resin film, method for manufacturing the electronic component according to any one of claims 1 to 5, characterized in that for pressing against the support film. The method of manufacturing an electronic component according to claim 6 , wherein the dielectric sheet is formed on the resin film via a silicone resin or a fluororesin. In the said process D, the said adhesive is thermally decomposed by the said baking, The manufacturing method of the electronic component in any one of the Claims 2 thru | or 7 characterized by the above-mentioned. 9. The method of manufacturing an electronic component according to claim 8 , wherein the pressure-sensitive adhesive is made of an acrylic, acrylic emulsion, or butyral material. Step C includes
Forming a layer-forming green sheet on the layer composed of the conductor pattern and the attached portion of the dielectric sheet;
A step of laminating a plurality of layers formed by forming the layer-forming green sheet on a layer composed of the conductive pattern and the attached portion of the dielectric sheet; and
Method of manufacturing an electronic component according to any one of claims 1 to 9, characterized in that it comprises a. Method of manufacturing an electronic component according to any of claims 1 to 10, characterized in that said conductor pattern is formed by a metal plating film. The method of manufacturing an electronic component according to claim 11 , wherein the metal plating film is made of copper, nickel, chrome, or an alloy thereof. The manufacturing temperature of the electronic component according to claim 11 or 12 , wherein the firing temperature in the step D is lower than the melting point of the metal forming the metal plating film and higher than the recrystallization temperature of the metal. Method. The dielectric sheet, a method of manufacturing an electronic component according to any of claims 1 to 13, characterized in that a ceramic green sheet. The dielectric sheet, a method of manufacturing an electronic component according to any of claims 1 to 13, characterized in that it consists of an organic material. 16. The method of manufacturing an electronic component according to claim 1, wherein the support film is made of polyethylene terephthalate, polyethylene naphthalate, or polypropylene.

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