JP4063892B2 - サーマルディテクタアレー - Google Patents

サーマルディテクタアレー Download PDF

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Publication number
JP4063892B2
JP4063892B2 JP50034999A JP50034999A JP4063892B2 JP 4063892 B2 JP4063892 B2 JP 4063892B2 JP 50034999 A JP50034999 A JP 50034999A JP 50034999 A JP50034999 A JP 50034999A JP 4063892 B2 JP4063892 B2 JP 4063892B2
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JP
Japan
Prior art keywords
layer
microbridge
array
thermal detector
detector
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Expired - Fee Related
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JP50034999A
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English (en)
Japanese (ja)
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JP2002500763A (ja
JP2002500763A5 (enExample
Inventor
レックス ワットン
シリル ヒルサム
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Qinetiq Ltd
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Qinetiq Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/34—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
    • H10N15/10—Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP50034999A 1997-05-28 1998-05-14 サーマルディテクタアレー Expired - Fee Related JP4063892B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9710843.5 1997-05-28
GBGB9710843.5A GB9710843D0 (en) 1997-05-28 1997-05-28 A thermal detector array
PCT/GB1998/001379 WO1998054554A1 (en) 1997-05-28 1998-05-14 A thermal detector array

Publications (3)

Publication Number Publication Date
JP2002500763A JP2002500763A (ja) 2002-01-08
JP2002500763A5 JP2002500763A5 (enExample) 2005-12-08
JP4063892B2 true JP4063892B2 (ja) 2008-03-19

Family

ID=10813076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50034999A Expired - Fee Related JP4063892B2 (ja) 1997-05-28 1998-05-14 サーマルディテクタアレー

Country Status (9)

Country Link
US (1) US6388256B1 (enExample)
EP (1) EP0985137B1 (enExample)
JP (1) JP4063892B2 (enExample)
KR (1) KR100530440B1 (enExample)
AU (1) AU732258B2 (enExample)
CA (1) CA2290541C (enExample)
DE (1) DE69829658T2 (enExample)
GB (1) GB9710843D0 (enExample)
WO (1) WO1998054554A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11990437B2 (en) 2019-07-26 2024-05-21 International Business Machines Corporation System and method for forming solder bumps

Families Citing this family (23)

* Cited by examiner, † Cited by third party
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JP2001153720A (ja) * 1999-11-30 2001-06-08 Nec Corp 熱型赤外線検出器
US6828545B1 (en) * 2001-05-15 2004-12-07 Raytheon Company Hybrid microelectronic array structure having electrically isolated supported islands, and its fabrication
KR20030016866A (ko) * 2001-08-22 2003-03-03 대우전자주식회사 적외선 흡수 볼로메터의 산화막 형성 방법
KR100529130B1 (ko) * 2001-08-22 2005-11-15 주식회사 대우일렉트로닉스 적외선 흡수 볼로메터 제조 방법
GB2385199A (en) * 2002-02-08 2003-08-13 Qinetiq Ltd Substrate with conducting vias
GB2392307B8 (en) * 2002-07-26 2006-09-20 Detection Technology Oy Semiconductor structure for imaging detectors
US7564125B2 (en) * 2002-12-06 2009-07-21 General Electric Company Electronic array and methods for fabricating same
JPWO2005078400A1 (ja) * 2004-02-17 2007-08-30 松下電器産業株式会社 赤外線検出装置およびその製造方法
RU2255315C1 (ru) * 2004-07-16 2005-06-27 Государственное образовательное учреждение высшего профессионального образования "Уральский государственный технический университет - УПИ" Способ тепловизионной диагностики процессов теплоотдачи
EP2029984A2 (en) * 2006-06-01 2009-03-04 Université de Liège A thermal detector
GB2449853B (en) * 2007-06-04 2012-02-08 Detection Technology Oy Photodetector for imaging system
JP5137059B2 (ja) * 2007-06-20 2013-02-06 新光電気工業株式会社 電子部品用パッケージ及びその製造方法と電子部品装置
US8049310B2 (en) * 2008-04-01 2011-11-01 Qimonda Ag Semiconductor device with an interconnect element and method for manufacture
MY147335A (en) * 2009-10-27 2012-11-30 Mimos Berhad An integrated packaged environmental sensor and roic and a method of fabricating the same
US9918023B2 (en) 2010-04-23 2018-03-13 Flir Systems, Inc. Segmented focal plane array architecture
US9948878B2 (en) 2010-04-23 2018-04-17 Flir Systems, Inc. Abnormal clock rate detection in imaging sensor arrays
US8610070B2 (en) 2010-04-28 2013-12-17 L-3 Communications Corporation Pixel-level optical elements for uncooled infrared detector devices
US8513605B2 (en) * 2010-04-28 2013-08-20 L-3 Communications Corporation Optically transitioning thermal detector structures
US8227755B2 (en) 2010-04-28 2012-07-24 L-3 Communications Corporation Pixel-level optically transitioning filter elements for detector devices
CN102798471B (zh) * 2011-10-19 2015-08-12 清华大学 一种红外探测器及其制备方法
CN204927290U (zh) * 2012-12-14 2015-12-30 菲力尔系统公司 具有分段式焦平面阵列的系统
FR2999805B1 (fr) * 2012-12-17 2017-12-22 Commissariat Energie Atomique Procede de realisation d'un dispositif de detection infrarouge
KR102197069B1 (ko) 2014-02-04 2020-12-30 삼성전자 주식회사 이미지 센서 및 이미지 처리 장치

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US3816750A (en) * 1971-06-04 1974-06-11 Honeywell Inc Pyroelectric detector
US4142207A (en) * 1977-12-20 1979-02-27 Texas Instruments Incorporated Ferroelectric imaging system
EP0098318B1 (de) * 1982-07-03 1987-02-11 Ibm Deutschland Gmbh Verfahren zum Herstellen von Gräben mit im wesentlichen vertikalen Seitenwänden in Silicium durch reaktives Ionenätzen
GB2163596B (en) 1984-08-24 1988-02-03 Philips Electronic Associated A thermal imaging device and a method of manufacturing a thermal imaging device
US5450053A (en) * 1985-09-30 1995-09-12 Honeywell Inc. Use of vanadium oxide in microbolometer sensors
GB8827661D0 (en) 1988-11-26 1989-05-17 Emi Plc Thorn Thermal imaging devices
GB8829685D0 (en) 1988-12-20 1989-02-15 Emi Plc Thorn Thermal imaging device
US4954313A (en) * 1989-02-03 1990-09-04 Amdahl Corporation Method and apparatus for filling high density vias
US5070026A (en) * 1989-06-26 1991-12-03 Spire Corporation Process of making a ferroelectric electronic component and product
GB2236016A (en) * 1989-09-13 1991-03-20 Philips Electronic Associated Pyroelectric and other infrared detection devices with thin films
US5602043A (en) * 1995-01-03 1997-02-11 Texas Instruments Incorporated Monolithic thermal detector with pyroelectric film and method
US5627082A (en) 1995-03-29 1997-05-06 Texas Instruments Incorporated High thermal resistance backfill material for hybrid UFPA's
US5618752A (en) * 1995-06-05 1997-04-08 Harris Corporation Method of fabrication of surface mountable integrated circuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11990437B2 (en) 2019-07-26 2024-05-21 International Business Machines Corporation System and method for forming solder bumps

Also Published As

Publication number Publication date
KR100530440B1 (ko) 2005-11-23
EP0985137B1 (en) 2005-04-06
AU732258B2 (en) 2001-04-12
JP2002500763A (ja) 2002-01-08
US6388256B1 (en) 2002-05-14
AU7439898A (en) 1998-12-30
WO1998054554A1 (en) 1998-12-03
KR20010013151A (ko) 2001-02-26
GB9710843D0 (en) 1997-07-23
DE69829658D1 (de) 2005-05-12
CA2290541A1 (en) 1998-12-03
DE69829658T2 (de) 2006-02-09
CA2290541C (en) 2006-08-29
EP0985137A1 (en) 2000-03-15

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