JP4049608B2 - Capillary fastener for wire bonding equipment - Google Patents

Capillary fastener for wire bonding equipment Download PDF

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Publication number
JP4049608B2
JP4049608B2 JP2002112507A JP2002112507A JP4049608B2 JP 4049608 B2 JP4049608 B2 JP 4049608B2 JP 2002112507 A JP2002112507 A JP 2002112507A JP 2002112507 A JP2002112507 A JP 2002112507A JP 4049608 B2 JP4049608 B2 JP 4049608B2
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capillary
fastener
wire bonding
fixing
ultrasonic vibration
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JP2003309143A (en
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悌司 平嶋
直樹 峠
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Noritake Co Ltd
Noritake Super Abrasive Co Ltd
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Noritake Co Ltd
Noritake Super Abrasive Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は半導体装置のワイヤボンディングに使用するキャピラリの締結具に関する。
【０００２】
【従来の技術】
半導体装置の製造工程において、半導体素子の電極とパッケージのリード電極とを接続するワイヤボンディング作業には、金またはアルミニウムよりなる細線を先端から繰り出す細孔を備えたキャピラリが使用される。このキャピラリを使用したワイヤボンディング作業は、概略以下のようにして行われる。
【０００３】
図３の（ａ）はワイヤボンディング装置の要部を示す図で、超音波振動伝達ホーンであるボンディングアーム１１の先端部に設けたキャピラリ挿入孔１１ａに、中心部の貫通孔１０ａから金線１２を繰り出すキャピラリ１０を挿入した後、同図（ｂ）に示すようにネジ１３により半割部材１１ｂ、１１ｃを締め付けることによってキャピラリ１０を固定する。このキャピラリ１０から繰り出した金線１２の先端を電気トーチ（図示せず）との放電により溶融させて金球を形成する。つぎにキャピラリ１０をヒータブロックによって加熱された半導体素子（図示せず）の電極上に降下させ、キャピラリ１０により電極に超音波振動を加えながら金球を電極と接合する。ついでキャピラリ１０をヒータブロックによって加熱されたインナーリード（図示せず）上に移動させ、キャピラリ１０によりインナーリードに超音波振動を加えながら接合を行う。
【０００４】
このようなワイヤボンディング作業に用いられるワイヤボンディング装置において、ボンディングアーム１１にキャピラリ１０を固定する方法は、図３の（ｂ）に示すように、ボンディングアーム１１の先端部にスリット１１ｄを形成し、ネジ１３を締め付けることにより半割部材１１ｂ，１１ｃでキャピラリ挿入孔１１ａに挿入されたキャピラリ１０を固定する方法が一般的である。なお、キャピラリ１０の挿入位置とネジ１３による締め付け位置が図３の場合と異なる別の例を図４の（ａ）に示している。この例では、ネジ１３の締め付け位置がスリット１１ｄの先端部となっている。
【０００５】
しかし、これらのキャピラリ固定方法では、スリット１１ｄをネジ１３で締め込んでキャピラリ１０を固定すると、キャピラリ１０が支点となり、てこの原理によりスリット１１ｄの先端または奥の部分が撓み、強く締め込むとさらに撓みが大きくなり、キャピラリ１０の固定が安定しなくなる。スリット１１ｄの撓みが大きくなるとキャピラリ１０がボンディングアーム１１に密着しなくなるため、超音波振動の伝達ロスが大きくなる。また、スリット１１ｄの存在自体が、ボンディングアーム１１とキャピラリ１０との接合面積を減ずることになり、超音波振動の伝達効率が低下する原因となる。
【０００６】
このような問題に対して、超音波振動伝達ホーンとキャピラリの密着性を高めるように改善されたキャピラリ固定方法が提案されている。たとえば特開平６−１４０４５７号公報には、キャピラリ挿入孔にネジ溝を形成し、硬化性樹脂を塗布したキャピラリをキャピラリ挿入孔に挿入し、ネジで締め付けて硬化性樹脂を介してキャピラリを接着固定する方法が記載されている。
【０００７】
また特開平８−２３０１２号公報には、キャピラリ挿通孔の中心を横切るように形成されたスリットが超音波振動伝達ホーンの軸中心に対してほぼ垂直となる構成として、超音波振動伝達ホーンとキャピラリの接合面積がスリットによって減じられないようにしたキャピラリの固定方法が記載されている。
【０００８】
また特開平８−１６２５０７号公報には、超音波振動伝達ホーンの先端部に、キャピラリ挿通孔と、超音波振動伝達ホーンの先端から開口しキャピラリ挿通孔に貫通しているビス孔とを設け、キャピラリ挿通孔に挿通したキャピラリをビス孔からセットビスで固定することによって、超音波振動の方向と一致する方向でのキャピラリの遊びがなくなるようにしたキャピラリの固定方法が記載されている。
【０００９】
【発明が解決しようとする課題】
上記の公開公報に記載のキャピラリ固定方法によれば、超音波振動の方向におけるキャピラリの固定の不安定さは幾分改善されるものの、キャピラリの固定力そのものはさして向上しない。この点を改善するものとして、近年は図４（ｂ）に示す固定方法が採用されている。この固定方法は、図３（ａ）および図４（ａ）に示した固定方法の改良型に相当するもので、図３（ａ）および図４（ａ）に示す部材と同じ機能を果たす部材については同じ符号を付して説明は省略する。
【００１０】
図４（ｂ）に示す固定方法は、スリット１１ｄを形成したボンディングアーム１１の先端部に、キャピラリ挿通孔１１ａと直交する方向の貫通孔１１ｅを形成し、この貫通孔１１ｅに概略円筒状の２個の締結具本体１４ａと１４ｂとからなる締結具１４を挿通し、締結具１４内にネジ１３を締め込むことにより、締結具本体１４ａと１４ｂとによりキャピラリ挿通孔１１ａに挿通されたキャピラリ１０を超音波振動伝達方向およびそれと直角な方向に押し付けて固定する方法である。
【００１１】
ボンディングアーム１１の貫通孔１１ｅには、締結具１４の回転阻止用の平坦面１１ｆが形成され、締結具本体１４ａ，１４ｂには貫通孔１１ｅの平坦面１１ｆに対応する平坦面１４ｆが形成されている。また締結具本体１４ａの貫通孔にはネジ山は形成されてはおらず、締結具本体１４ｂの貫通孔にはネジ１３に対応するネジ山が形成され、さらにフランジ１４ｇが形成されている。
【００１２】
この固定方法において、締結具１４はステンレス鋼製の部材が用いられている。ステンレス鋼にもある程度の耐摩耗性はあるが、ワイヤボンディング作業中は締結具には常時超音波振動が付加されているので、部材の摩耗が激しい。部材が摩耗するとキャピラリの固定能力が著しく低下する。これに対して、締結具とキャピラリの接する部位に硬質物質をコーティングすることが試みられたが、表面のみのコーティングでは摩耗を防止するには不充分であった。
【００１３】
本発明はかかる問題に鑑みて、締結具を用いたキャピラリの固定に用いる締結具の耐摩耗性、とくにキャピラリと接する部分の耐摩耗性を高めることを目的とする。
【００１４】
【課題を解決するための手段】
本発明は、半導体素子の電極とパッケージのリード電極とを接続するワイヤボンディング装置用キャピラリを、超音波振動伝達ホーンであるボンディングアームに固定するための締結具であり、スリットを形成した前記ボンディングアームの先端部に、キャピラリ挿入孔と直交する方向に形成された貫通孔に挿通された２つの締結具本体とからなり、前記締結具本体内にネジが締め込まれて前記キャピラリを前記ボンディングアームに固定する締結具であって、ステンレス鋼で製作された締結具本体の前記キャピラリと接する部分に、ステンレス鋼よりも強度の高い超硬合金からなる下層とダイヤモンド焼結体からなる上層を積層したことを特徴とする。
【００１５】
キャピラリ固定用の締結具本体は従来と同様にステンレス鋼で製作されているが、本発明では締結具本体のキャピラリと接する部分に、ステンレス鋼よりも強度の高い超硬合金層を形成し、さらにその上にダイヤモンド焼結体層（以下、ＰＣＤ層という）を積層する。超硬合金層およびＰＣＤ層を積層する範囲は、キャピラリと接する部分だけで十分ではあるが、その近傍も含めて積層することを妨げない。
【００１６】
本発明の締結具では、締結具本体のキャピラリと接する部分に超硬合金層とＰＣＤ層が積層されているので、常時キャピラリと接している部分であっても摩耗が少なく、キャピラリは長期にわたり強固に固定される。キャピラリが強固に固定されることにより、ボンディングの精度が向上する。
【００１７】
ここで、ＰＣＤ層の厚さは０．１〜２．０ｍｍとするのが望ましい。ＰＣＤ層の厚さが０．１ｍｍより薄いとＰＣＤ層の摩滅までの期間が短く、頻繁な交換が必要になる。ＰＣＤ層の厚さを厚くすると、その分、ＰＣＤ層のバックアップ層としての超硬合金層の厚さが薄くなり積層体の靱性が低下するので、ＰＣＤ層の厚さを必要以上に厚くするのは好ましくない。ネジ部も含めた締結具本体の全体の寿命とのバランスからみて、ＰＣＤ層の厚さは２．０ｍｍ以下で十分である。
【００１８】
また、ＰＣＤ層の表面粗さＲｚを０．５〜１．５μｍとするのが好ましい。Ｒｚが０．５μｍより小さいとＰＣＤ層表面とキャピラリ表面との間の摩擦力が小さすぎて、キャピラリを固定する力が弱くなる。Ｒｚが１．５μｍより大きいと超音波振動伝達ホーンから伝わってくる超音波振動をキャピラリに正確に伝えられなくなる。
【００１９】
【発明の実施の形態】
以下、ワイヤボンディング装置用キャピラリを超音波振動伝達ホーンに固定するための締結具として図４の（ｂ）に示した締結具に本発明を適用した実施形態について説明する。図１の（ａ）は本実施形態における締結具の斜視図、（ｂ）は側面図であり、図２は締結具を用いたキャピラリ固定方法を説明するための分解斜視図である。
【００２０】
本実施形態の締結具１４を用いたキャピラリ１０の固定方法は図４の（ｂ）に示した固定方法と同様であり、スリット１１ｄを形成したボンディングアーム１１の先端部に、キャピラリ挿通孔１１ａと直交する方向の貫通孔１１ｅを形成し、この貫通孔１１ｅに概略円筒状の２個の締結具本体１４ａと１４ｂとからなる締結具１４を挿通し、締結具１４内にネジ１３を締め込むことにより、キャピラリ１０を固定する方法である。
【００２１】
キャピラリ１０の固定は、図２に示すように、まず、キャピラリ１０をキャピラリ挿通孔１１ａに挿通し、つぎに締結具本体１４ａと１４ｂをそれぞれ対向させて貫通孔１１ｅに挿通し、ワッシャ１５を介してネジ１３を締結具本体１４ａと１４ｂの貫通孔に挿通し、締結具本体１４ｂのネジ山にねじ込む。ネジ１３を強くねじ込むことによって、半割部材１１ｂ，１１ｃでキャピラリ１０を締め付けるとともに、締結具本体１４ａ，１４ｂの端部に形成された斜面１４ｈでキャピラリ１０を締め付ける。これにより、キャピラリ１０は超音波振動伝達方向およびそれと直角な方向に締め付けられて強固に固定される。
【００２２】
締結具本体１４ａ，１４ｂには、ボンディングアーム１１の貫通孔１１ｅの平坦面１１ｆに対応する平坦面１４ｆが形成されており、これにより貫通孔１１ｅ内の締結具本体１４ａ，１４ｂの回転が阻止される。また締結具本体１４ａの貫通孔１４ｉにはネジ山は形成されてはおらず、締結具本体１４ｂの貫通孔１４ｊにはネジ１３に対応するネジ山１４ｋが形成され、さらにフランジ１４ｇが形成されている。
【００２３】
以上の態様で使用される締結具本体１４ａ，１４ｂにおいて、締結具本体１４ａ，１４ｂのキャピラリ１０と接する部分に、超硬合金からなる下層とダイヤモンド焼結体からなる上層を積層している。キャピラリ１０と接する部分とは、図１において、締結具本体１４ａ，１４ｂの端部に形成された斜面１４ｈとその周辺である。この斜面１４ｈは、前出の図４（ｂ）に示すように、ネジ１３を締め付けることによって斜面１４ｈでキャピラリ１０を押圧することになり、同時にその周辺の一部（斜面１４ｈの頂点に続く胴部の一部）１４ｍもキャピラリ１０と接触する。
【００２４】
締結具本体１４ａ，１４ｂの材質はステンレス鋼であるが、斜面１４ｈとその周辺の一部１４ｍにステンレス鋼よりも強度の高い超硬合金層が形成され、さらにその上にＰＣＤ層が積層されている。ここで、締結具本体１４ａ，１４ｂの外径は２．６ｍｍであり、超硬合金層の厚さは０．８ｍｍ、ＰＣＤの厚さは１．０ｍｍである。ＰＣＤ層の表面粗さＲｚは約１．０μｍである。
【００２５】
本実施形態の締結具１４においては、キャピラリ１０と接する部分に耐摩耗層が積層されているので、常時キャピラリ１０と接している部分であっても摩耗が少なく、キャピラリ１０は長期にわたり強固に固定される。キャピラリ１０が強固に固定されることにより、ボンディングの精度が向上する。
【００２６】
本発明の効果を確認するために、超硬合金層とＰＣＤ層からなる耐摩耗層を積層した本実施形態の締結具（発明品）と、耐摩耗層のない従来の締結具（従来品）を用いて、３００日間の使用試験を行った。従来品は８〜１０日で表面の面粗さが悪くなり、再研磨を必要としたのに対し、発明品では３００日使用しても表面粗さは大きな変化はなかった。
【００２７】
【発明の効果】
スリットを形成したボンディングアームの先端部に、キャピラリ挿入孔と直交する方向に形成された貫通孔に挿通された２つの締結具本体とからなり、締結具本体内にネジが締め込まれてキャピラリをボンディングアームに固定する締結具の、ステンレス鋼で製作された締結具本体の前記キャピラリと接する部分に、ステンレス鋼よりも強度の高い超硬合金からなる下層とダイヤモンド焼結体からなる上層を積層したことにより、常時キャピラリと接している部分であっても使用中の超音波振動による締結具の摩耗を抑制することができ、適正な表面粗さを長期間維持できるため、締結具の寿命が大幅に向上する。さらに、キャピラリが長期にわたり強固に固定されることにより、ボンディング回数とボンディング精度が顕著に向上する。
【図面の簡単な説明】
【図１】 （ａ）は本発明の実施形態における締結具の斜視図、（ｂ）は側面図である。
【図２】 図１の締結具を用いたキャピラリ固定方法を説明するための分解斜視図である。
【図３】 従来のキャピラリ固定方法を説明するための図である。
【図４】 従来の別のキャピラリ固定方法を説明するための図である。
【符号の説明】
１０ キャピラリ
１１ ボンディングアーム
１１ａ キャピラリ挿通孔
１１ｂ，１１ｃ 半割部材
１１ｄ スリット
１１ｅ 貫通孔
１１ｆ 平坦面
１３ ネジ
１４ 締結具
１４ａ，１４ｂ 締結具本体
１４ｆ 平坦面
１４ｇ フランジ
１４ｈ 斜面
１４ｉ，１４ｊ 貫通孔
１４ｋ ネジ山
１４ｍ 周辺部
１５ ワッシャ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a capillary fastener used for wire bonding of a semiconductor device.
[0002]
[Prior art]
In a manufacturing process of a semiconductor device, a capillary having a fine hole for drawing out a thin wire made of gold or aluminum from the tip is used for wire bonding work for connecting an electrode of a semiconductor element and a lead electrode of a package. The wire bonding operation using this capillary is generally performed as follows.
[0003]
FIG. 3A is a view showing a main part of the wire bonding apparatus. The capillary insertion hole 11a provided at the distal end of the bonding arm 11 which is an ultrasonic vibration transmission horn is inserted into the gold wire 12 from the central through hole 10a. Then, the capillary 10 is fixed by tightening the half members 11b and 11c with screws 13 as shown in FIG. The tip of the gold wire 12 fed out from the capillary 10 is melted by discharge with an electric torch (not shown) to form a gold ball. Next, the capillary 10 is lowered onto an electrode of a semiconductor element (not shown) heated by a heater block, and a gold ball is joined to the electrode while applying ultrasonic vibration to the electrode by the capillary 10. Next, the capillary 10 is moved onto an inner lead (not shown) heated by a heater block, and bonding is performed while applying ultrasonic vibration to the inner lead by the capillary 10.
[0004]
In the wire bonding apparatus used for such wire bonding work, the method for fixing the capillary 10 to the bonding arm 11 is to form a slit 11d at the tip of the bonding arm 11, as shown in FIG. A general method is to fix the capillary 10 inserted into the capillary insertion hole 11a by the half members 11b and 11c by tightening the screw 13. FIG. 4A shows another example in which the insertion position of the capillary 10 and the tightening position by the screw 13 are different from those in FIG. In this example, the tightening position of the screw 13 is the tip of the slit 11d.
[0005]
However, in these capillary fixing methods, if the slit 11d is tightened with the screw 13 and the capillary 10 is fixed, the capillary 10 becomes a fulcrum. The deflection becomes large, and the fixation of the capillary 10 becomes unstable. When the bending of the slit 11d increases, the capillary 10 does not adhere to the bonding arm 11 and the transmission loss of ultrasonic vibration increases. Further, the presence of the slit 11d itself reduces the bonding area between the bonding arm 11 and the capillary 10 and causes a reduction in transmission efficiency of ultrasonic vibration.
[0006]
In order to solve such a problem, an improved capillary fixing method has been proposed which improves the adhesion between the ultrasonic vibration transmission horn and the capillary. For example, in Japanese Patent Laid-Open No. 6-140457, a screw groove is formed in a capillary insertion hole, a capillary coated with a curable resin is inserted into the capillary insertion hole, and tightened with a screw to fix the capillary through the curable resin. How to do is described.
[0007]
Japanese Patent Laid-Open No. 8-23012 discloses an ultrasonic vibration transmission horn and a capillary having a configuration in which a slit formed so as to cross the center of the capillary insertion hole is substantially perpendicular to the axial center of the ultrasonic vibration transmission horn. A capillary fixing method is described in which the bonding area is not reduced by a slit.
[0008]
In JP-A-8-162507, a capillary insertion hole and a screw hole that opens from the tip of the ultrasonic vibration transmission horn and passes through the capillary insertion hole are provided at the tip of the ultrasonic vibration transmission horn. A method for fixing a capillary is described in which the capillary inserted through the capillary insertion hole is fixed with a set screw from the screw hole so that there is no play in the capillary in the direction that coincides with the direction of ultrasonic vibration.
[0009]
[Problems to be solved by the invention]
According to the capillary fixing method described in the above publication, the instability of capillary fixing in the direction of ultrasonic vibration is somewhat improved, but the capillary fixing force itself is not improved. In order to improve this point, a fixing method shown in FIG. 4B has been adopted in recent years. This fixing method corresponds to an improved version of the fixing method shown in FIGS. 3 (a) and 4 (a), and has the same function as the members shown in FIGS. 3 (a) and 4 (a). Are denoted by the same reference numerals and description thereof is omitted.
[0010]
In the fixing method shown in FIG. 4B, a through hole 11e in a direction perpendicular to the capillary insertion hole 11a is formed at the tip of the bonding arm 11 in which the slit 11d is formed, and the substantially cylindrical 2 is formed in the through hole 11e. The capillary 10 inserted into the capillary insertion hole 11a by the fastener main bodies 14a and 14b is inserted by inserting the fastener 14 composed of the fastener main bodies 14a and 14b and tightening the screw 13 into the fastener 14. This is a method of pressing and fixing in the direction of ultrasonic vibration transmission and the direction perpendicular thereto.
[0011]
A flat surface 11f for preventing rotation of the fastener 14 is formed in the through hole 11e of the bonding arm 11, and a flat surface 14f corresponding to the flat surface 11f of the through hole 11e is formed on the fastener main bodies 14a and 14b. Yes. Further, no thread is formed in the through hole of the fastener body 14a, the thread corresponding to the screw 13 is formed in the through hole of the fastener body 14b, and a flange 14g is further formed.
[0012]
In this fixing method, the fastener 14 is a stainless steel member. Although stainless steel also has a certain degree of wear resistance, since the ultrasonic vibration is always applied to the fastener during the wire bonding operation, the member is heavily worn. When the member is worn, the fixing ability of the capillary is remarkably reduced. On the other hand, an attempt has been made to coat a hard substance at a portion where the fastener and the capillary are in contact with each other, but the coating of only the surface is insufficient to prevent wear.
[0013]
The present invention has been made in view of such a problem, and an object thereof is to improve the wear resistance of a fastener used for fixing a capillary using the fastener, particularly the wear resistance of a portion in contact with the capillary.
[0014]
[Means for Solving the Problems]
The present invention provides a bonding tool for fixing a capillary for a wire bonding apparatus that connects an electrode of a semiconductor element and a lead electrode of a package to a bonding arm that is an ultrasonic vibration transmission horn , and the bonding arm having a slit formed therein. And two fastener bodies inserted into through holes formed in a direction orthogonal to the capillary insertion holes, and screws are tightened into the fastener bodies to attach the capillaries to the bonding arms. the fastener for fixing it, the portion in contact with the capillary of the fastener body which is made of stainless steel, were laminated layer consisting of a lower layer and the diamond sintered body made of hard metal higher strength than stainless steel It is characterized by.
[0015]
The fastener body for fixing the capillary is made of stainless steel as in the prior art, but in the present invention, a cemented carbide layer having a strength higher than that of stainless steel is formed on the portion of the fastener body that comes into contact with the capillary. A diamond sintered body layer (hereinafter referred to as a PCD layer) is laminated thereon. The range in which the cemented carbide layer and the PCD layer are laminated is sufficient only for the portion in contact with the capillary, but does not prevent the lamination including the vicinity thereof.
[0016]
In the fastener of the present invention, since the cemented carbide layer and the PCD layer are laminated on the portion of the fastener body that contacts the capillary, there is little wear even in the portion that is always in contact with the capillary, and the capillary is strong for a long time. Fixed to. Since the capillary is firmly fixed, bonding accuracy is improved.
[0017]
Here, the thickness of the PCD layer is preferably 0.1 to 2.0 mm. If the thickness of the PCD layer is less than 0.1 mm, the period until the PCD layer is worn is short, and frequent replacement is required. When the thickness of the PCD layer is increased, the thickness of the cemented carbide layer as a backup layer of the PCD layer is reduced correspondingly, and the toughness of the laminate is reduced. Therefore, the thickness of the PCD layer is increased more than necessary. Is not preferred. In view of the balance with the entire life of the fastener main body including the screw portion, the thickness of the PCD layer is 2.0 mm or less.
[0018]
Further, the surface roughness Rz of the PCD layer is preferably 0.5 to 1.5 μm. When Rz is smaller than 0.5 μm, the frictional force between the PCD layer surface and the capillary surface is too small, and the force for fixing the capillary is weak. When Rz is larger than 1.5 μm, the ultrasonic vibration transmitted from the ultrasonic vibration transmission horn cannot be accurately transmitted to the capillary.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment in which the present invention is applied to the fastener shown in FIG. 4B as a fastener for fixing the capillary for wire bonding apparatus to the ultrasonic vibration transmission horn will be described. FIG. 1A is a perspective view of a fastener in the present embodiment, FIG. 1B is a side view, and FIG. 2 is an exploded perspective view for explaining a capillary fixing method using the fastener.
[0020]
The fixing method of the capillary 10 using the fastener 14 of this embodiment is the same as the fixing method shown in FIG. 4B, and the capillary insertion hole 11a and the tip of the bonding arm 11 in which the slit 11d is formed are provided. A through-hole 11e in a direction orthogonal to each other is formed, a fastener 14 composed of two substantially cylindrical fastener bodies 14a and 14b is inserted into the through-hole 11e, and a screw 13 is tightened in the fastener 14 In this way, the capillary 10 is fixed.
[0021]
As shown in FIG. 2, the capillary 10 is fixed by first inserting the capillary 10 into the capillary insertion hole 11 a, and then inserting the fastener bodies 14 a and 14 b into the through holes 11 e so as to face each other, and through the washer 15. Then, the screw 13 is inserted into the through holes of the fastener bodies 14a and 14b and screwed into the threads of the fastener body 14b. By strongly screwing the screw 13, the capillary 10 is tightened by the half members 11b and 11c, and the capillary 10 is tightened by the inclined surface 14h formed at the ends of the fastener main bodies 14a and 14b. As a result, the capillary 10 is tightened in the ultrasonic vibration transmission direction and a direction perpendicular thereto to be firmly fixed.
[0022]
A flat surface 14f corresponding to the flat surface 11f of the through hole 11e of the bonding arm 11 is formed in the fastener main bodies 14a and 14b, thereby preventing rotation of the fastener main bodies 14a and 14b in the through hole 11e. The Further, no thread is formed in the through hole 14i of the fastener body 14a, a thread 14k corresponding to the screw 13 is formed in the through hole 14j of the fastener body 14b, and a flange 14g is further formed. .
[0023]
In the fastener main bodies 14a and 14b used in the above-described manner, a lower layer made of cemented carbide and an upper layer made of a diamond sintered body are laminated on the portions of the fastener main bodies 14a and 14b that are in contact with the capillary 10. In FIG. 1, the portion in contact with the capillary 10 is an inclined surface 14h formed at the ends of the fastener main bodies 14a and 14b and its periphery. As shown in FIG. 4B, the inclined surface 14h presses the capillary 10 with the inclined surface 14h by tightening the screw 13, and at the same time, a part of the periphery of the capillary 10 (the trunk following the apex of the inclined surface 14h). 14m also contacts the capillary 10.
[0024]
The fastener body 14a, 14b is made of stainless steel, but a cemented carbide layer having a higher strength than stainless steel is formed on the slope 14h and a part 14m around the slope 14h, and a PCD layer is further laminated thereon. Yes. Here, the outer diameters of the fastener bodies 14a and 14b are 2.6 mm, the thickness of the cemented carbide layer is 0.8 mm, and the thickness of the PCD is 1.0 mm. The surface roughness Rz of the PCD layer is about 1.0 μm.
[0025]
In the fastener 14 of the present embodiment, since the wear-resistant layer is laminated on the portion in contact with the capillary 10, there is little wear even in the portion in contact with the capillary 10 at all times, and the capillary 10 is firmly fixed over a long period of time. Is done. Since the capillary 10 is firmly fixed, the bonding accuracy is improved.
[0026]
In order to confirm the effect of the present invention, the fastener of the present embodiment (invention product) in which a wear-resistant layer composed of a cemented carbide layer and a PCD layer is laminated, and a conventional fastener without a wear-resistant layer (conventional product) A 300-day use test was conducted. The surface roughness of the conventional product deteriorated in 8 to 10 days and required re-polishing, whereas the surface roughness of the invention product did not change greatly even after 300 days of use.
[0027]
【The invention's effect】
It consists of two fastener bodies inserted through the through-holes formed in the direction perpendicular to the capillary insertion hole at the tip of the bonding arm in which the slit is formed, and screws are tightened into the fastener body. fasteners for securing the bonding arm, the capillary in contact with portions of the fastener body which is made of stainless steel, were laminated layer consisting of a lower layer and the diamond sintered body made of high strength cemented carbide than stainless steel This makes it possible to suppress the wear of the fastener due to ultrasonic vibration during use even at the part that is always in contact with the capillary, and maintain a proper surface roughness for a long period of time, greatly increasing the life of the fastener. To improve. Furthermore, since the capillary is firmly fixed over a long period, the number of bondings and the bonding accuracy are remarkably improved.
[Brief description of the drawings]
FIG. 1A is a perspective view of a fastener according to an embodiment of the present invention, and FIG.
2 is an exploded perspective view for explaining a capillary fixing method using the fastener of FIG. 1. FIG.
FIG. 3 is a diagram for explaining a conventional capillary fixing method.
FIG. 4 is a view for explaining another conventional capillary fixing method.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Capillary 11 Bonding arm 11a Capillary insertion hole 11b, 11c Half member 11d Slit 11e Through-hole 11f Flat surface 13 Screw 14 Fastener 14a, 14b Fastener main body 14f Flat surface 14g Flange 14h Slope 14i, 14j Through-hole 14k Screw thread 14m Perimeter 15 Washer

Claims (3)

半導体素子の電極とパッケージのリード電極とを接続するワイヤボンディング装置用キャピラリを、超音波振動伝達ホーンであるボンディングアームに固定するための締結具であり、スリットを形成した前記ボンディングアームの先端部に、キャピラリ挿入孔と直交する方向に形成された貫通孔に挿通された２つの締結具本体とからなり、前記締結具本体内にネジが締め込まれて前記キャピラリを前記ボンディングアームに固定する締結具であって、ステンレス鋼で製作された締結具本体の前記キャピラリと接する部分に、ステンレス鋼よりも強度の高い超硬合金からなる下層とダイヤモンド焼結体からなる上層を積層したことを特徴とするワイヤボンディング装置用キャピラリ締結具。This is a fastener for fixing a capillary for a wire bonding apparatus, which connects an electrode of a semiconductor element and a lead electrode of a package , to a bonding arm which is an ultrasonic vibration transmission horn , and is attached to the tip of the bonding arm where a slit is formed. A fastener for fixing the capillary to the bonding arm by a screw being tightened in the fastener body, the fastener body being inserted into a through hole formed in a direction orthogonal to the capillary insertion hole a is, the part in contact with the capillary of the fastener body which is made of stainless steel, characterized in that the upper layer comprising a lower layer and the diamond sintered body comprising a higher strength than stainless steel cemented carbide laminated Capillary fastener for wire bonding equipment. 前記ダイヤモンド焼結体の積層厚さを０．１〜２．０ｍｍとした請求項１記載のワイヤボンディング装置用キャピラリ締結具。  The capillary fastener for a wire bonding apparatus according to claim 1, wherein the laminated thickness of the diamond sintered body is 0.1 to 2.0 mm. 前記ダイヤモンド焼結体の積層面の表面粗さＲｚを０．５〜１．５μｍとした請求項１または２記載のワイヤボンディング装置用キャピラリ締結具。  The capillary fastener for a wire bonding apparatus according to claim 1 or 2, wherein a surface roughness Rz of the laminated surface of the diamond sintered body is 0.5 to 1.5 µm.
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US20220338838A1 (en) * 2021-04-27 2022-10-27 Kulicke And Soffa Industries, Inc. Ultrasonic transducers, wire bonding machines including ultrasonic transducers, and related methods

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JP2024073306A (en) * 2022-11-17 2024-05-29 株式会社新川 Horn unit, ultrasonic horn, and jig

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Publication number Priority date Publication date Assignee Title
US20220338838A1 (en) * 2021-04-27 2022-10-27 Kulicke And Soffa Industries, Inc. Ultrasonic transducers, wire bonding machines including ultrasonic transducers, and related methods
US11937979B2 (en) * 2021-04-27 2024-03-26 Kulicke And Soffa Industries, Inc. Ultrasonic transducers, wire bonding machines including ultrasonic transducers, and related methods

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