JP2004087822A - Wedge tool - Google Patents

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Publication number
JP2004087822A
JP2004087822A JP2002247234A JP2002247234A JP2004087822A JP 2004087822 A JP2004087822 A JP 2004087822A JP 2002247234 A JP2002247234 A JP 2002247234A JP 2002247234 A JP2002247234 A JP 2002247234A JP 2004087822 A JP2004087822 A JP 2004087822A
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Japan
Prior art keywords
tool
bonding
tip
end surface
wedge tool
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JP2002247234A
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Japanese (ja)
Inventor
Tsutomu Fukuda
福田　努
Takeshi Takahashi
高橋　健
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Priority to JP2002247234A priority Critical patent/JP2004087822A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85203—Thermocompression bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01023—Vanadium [V]
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wedge tool in which bonding strength of a tool main body and a tip member is improved, wear-resistance of a holding part is improved, shortening of the life and shorting of the semiconductor device due to welding can be prevented. <P>SOLUTION: The wedge tool 10 holding and bonding bonding wire in wire bonding of the semiconductor device is provided with the tool main body 1 fitted to an ultrasonic vibration means, and the tip member 11 bonded to the tip of the tool main body 1 so as to be disposed. The holding part 2 holding bond wire is arranged at a tip of the tip member 11. The holding part 2 is formed of a super-high sintered body 9, and an uneven face adapted to a tip face of the tool main body 1 and a base end face of the tip member 11 is formed on the body. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
この発明は、ＩＣやパワーデバイスなどの半導体装置の製造工程においてワイヤボンディングを行う際に使用されるウェッジツールに関するものである。
【０００２】
【従来の技術】
この種の半導体装置の製造工程において、半導体チップと基板とを電気的に接続する方法として、ウェッジツールを用いた超音波ワイヤボンディングが一般的に知られている。すなわち、この超音波ワイヤボンディングにおいては、上記ウェッジツールのツール本体の先端に配設された先端部材に設けられた楔状の保持部に、ボンディングワイヤを保持して半導体チップや基板のボンディングパッドに密着させ、このツール本体に取り付けられた超音波振動手段によってツール本体を介して上記ボンディングワイヤに超音波振動を印加することにより、ボンディングワイヤをボンディングパッドに接合する。また、このような超音波振動による接合に加えて熱圧着を併用することもある。
【０００３】
【発明が解決しようとする課題】
ところで、このようなウェッジツールの先端部材の材質としては、従来より各種の鋼材が用いられていたが、そのようなものでは、ボンディングワイヤを保持してボンディングパッドに密着させた状態で超音波振動が与えられるという使用の状況上、先端部材の保持部が摩耗し易く、これによってボンディングの精度が損なわれてしまうため、ウェッジツールを頻繁に交換しなければならないという問題があった。そこで、最近では、このような保持部の耐摩耗性を向上させるために、先端部材の材質として超硬合金を使用したものも用いられるようになってきているが、このようなウェッジツールでも、長期の使用のうちには保持部に摩耗が生じてボンディング精度が損なわれるのは避けられない。
【０００４】
しかも、ボンディングワイヤの材質であるアルミニウムや金は、これら鋼材や超硬合金に対して溶着を生じ易く、上記保持部にこのような溶着が生じると、やはりボンディング精度が損なわれてウェッジツールの寿命の短縮を招く上、溶着したアルミニウムや金が保持部から剥離して半導体チップや基板に付着すると短絡を生じるおそれもあり、そのような半導体装置は使用不可能となるため、製品検査に多くの時間や労力を要したり、製品歩留まりの低下を招くことにもなる。しかも、このような溶着は、上述のように超音波振動に加えて熱圧着を併用した場合に一層顕著となる。
【０００５】
また、本発明の発明者は先に特願２００１−８８４９９において、ウェッジツールをツール本体と、その先端に配設される先端部材とから構成して、ツール本体の先端面に先端部材の基端面をロウ付けなどにより接合することを提案しているが、単にロウ付けしただけではウェッジツールに印加される超音波振動によって、ツール本体と先端部材との接合面が剥離してしてしまい、先端部材が脱落してしまうという問題がある。
【０００６】
本発明は、このような事情を鑑みて為されたもので、上述のようなワイヤボンディングに使用されるウェッジツールにおいて、ツール本体と先端部材との接合強度を高めると共に、保持部の耐摩耗性の向上を図るのは勿論、溶着による寿命の短縮や半導体装置の短絡などを防ぐことが可能なウェッジツールを提供することを目的としている。
【０００７】
【課題を解決するための手段】
上記課題を解決して、このような目的を達成するために、本発明は、半導体装置のワイヤボンディングにおいてボンディングワイヤを保持して接合するウェッジツールであって、超音波振動手段に取り付けられるツール本体と、該ツール本体の先端に接合されて配設されている先端部材とを備えて構成され、該先端部材の先端部に上記ボンディングワイヤを保持する保持部が設けられており、少なくともこの保持部が、超高硬度焼結体により形成されていると共に、上記ツール本体の先端面と上記先端部材の基端面とに互いに適合する凹凸面が形成されていることを特徴とする。
【０００８】
この発明に係るウェッジツールによれば、保持部に超高硬度焼結体を用いることにより、超硬合金などに比べても硬質であって耐摩耗性が高く、極めて長期の使用においても摩耗が生じることはない上、アルミニウムや金などのボンディングワイヤ材質に対する耐溶着性も高く、たとえ熱圧着を併用した超音波ワイヤボンディングでも保持部への溶着を防ぐことができる。
また、ツール本体の先端面に形成された凹凸面と先端部材の基端面に形成された凹凸面とを互いに適合させ、ツール本体の先端に先端部材を接合して配設させるので、たとえば従来のように平面同士をロウ付けによって接合して配設させた場合より、強固に接合させることができる。つまり、ツール本体の凹凸面と先端部材の凹凸面とが互いに係合し合うと共に、接合面積が増加することによるロウ付け強度の向上によって、ツール本体と先端部材との接合強度が増加するのである。
【０００９】
また、上記ウェッジツールにおいて、上記先端面および基端面の凹凸面は、上記超音波振動手段による振動方向と異なる方向に向かって延在する凸条または凹溝が設けられた面であることを特徴とする。
この発明に係るウェッジツールによれば、凹凸面の形状として凸条または凹溝が設けられ、かつ凸条または凹溝が超音波振動手段による振動方向と異なる方向に向かって延在するように設けられているので、振動方向と同方向に向かって延在するように凸条または凹溝を設けて凹凸面が形成されている場合より、接合強度を向上させることができる。
【００１０】
また、上記ウェッジツールにおいて、上記先端面および基端面の凹凸面が断面Ｖ字型に形成されていることを特徴とする。
この発明に係るウェッジツールによれば、一方の凹凸面の断面形状が凸状Ｖ字型で、他方の凹凸面の断面形状が凹状Ｖ字型に形成されているので、互いに適合させてツール本体の先端に先端部材を接合させる場合に、ツール本体の中心軸と先端部材の中心軸とを容易に一致させることができる。
【００１１】
また、上記ウェッジツールにおいて、上記超高硬度焼結体は、ダイヤモンド焼結体またはｃＢＮ焼結体より成ることを特徴とする。
また、上記ウェッジツールにおいて、上記保持部を形成した前記超高硬度焼結体は、その表面が焼結されたままの非研磨状態とされていることを特徴とする。この発明に係るウェッジツールによれば、表面が非研磨状態の超高硬度焼結体よりなる保持部により、その表面粗さが大きくなるため、保持部によってボンディングワイヤを確実に保持することが可能となる。
【００１２】
【発明の実施の形態】
以下、図面を参照し、この発明の実施の形態について説明する。
図１ないし図５は、本発明の一実施形態を示すものである。本実施形態においてウェッジツール１０は、軸線Ｏを中心とする略円柱状に形成された超硬合金製のツール本体１と、ツール本体１の先端に配設された先端部材１１とを有して構成されている。図１ないし図３に示すようにツール本体１は、その一方の側面に平坦面１ａが設けられているとともに、先端部が軸線Ｏを中心とした四角錐状に面取りされて先端側（図１および図２において下側）に向かうに従い幅および厚さとも漸次小さくなる先細りの楔状をなしている。なお、この楔状をなす先端部を画成する上記四角錐の４つの錐面３，３，４，４は、軸線Ｏを挟んで互いに反対側に位置する一対の錐面３，３が、他の一対の錐面４，４よりも後端側から、この他の一対の錐面４，４よりも軸線Ｏに対して小さな角度で傾斜するように形成されており、これによりツール本体１の先端部がなす上記四角錐は、正四角錐よりも厚さ方向（図２、図５における左右方向）に偏平した形状をなし、軸線Ｏに直交する断面においてもこの厚さ方向に偏平した長方形状を呈することとなる。
【００１３】
また、先端部材１１の側面には上記偏平した四角錐の錐面３，３，４，４に連続するように側面５，５，６，６が形成されている。図４および図５に示すように、上記偏平した四角錐の幅方向（図１、図４における左右方向）を向く側面５，５は、この四角錐の上記他の一対の錐面４，４と同傾斜の傾斜面で、先端側に向かうに従い軸線Ｏ側に向かう傾斜面とされる。一方、上記厚さ方向を向く側面６，６は、上記一対の錐面３，３と同傾斜の傾斜面６ａ，６ａと、傾斜面６ａ，６ａから曲折して軸線Ｏに等距離をおいて平行となるように、かつ互いにも平行となるとともに側面５，５に対しては垂直となるように形成された平行面６ｂ，６ｂとからなっており、従って平行面６ｂ，６ｂが形成されている部分において先端部材１１の厚さは一定とされている。また、先端部材１１の先端部に設けられている保持部２は、上記幅方向における両端部が軸線Ｏに垂直な平坦面とされる先端面７と、先端面７の幅方向の中央部に形成されている上記厚さ方向視に軸線Ｏを中心とした断面Ｖ字状をなして平行面６ｂ，６ｂに開口する凹溝部８と、凹溝部８と平行面６ｂ，６ｂとを連続的な曲面で繋ぐように形成されているアール面８ａ，８ａとを有している。
【００１４】
そして、本実施形態では、図４、図５に示すようにツール本体１の先端面１２は、幅方向視に軸線Ｏを中心とした断面凸状Ｖ字型をなしており、凹溝部８が延在する方向に対して直交する方向に向かって延在するように凸条状に形成されている。つまり、先端面１２は、錐面３，３から曲折して軸線Ｏに向かう一対の平面部１２ａ，１２ａから構成されており、一対の平面部１２ａ，１２ａのなす角度αは１２０°〜１５０°とされている。また、先端部材１１の基端面１３は、ツール本体１の先端面１２に適合する断面凹状Ｖ字型をなしており、傾斜面６ａ，６ａから鋭角に曲折して軸線Ｏに向かう一対の平面部１３ａ，１３ａから構成され、一対の平面部１３ａ，１３ａのなす角度は、一対の平面部１２ａ，１２ａのなす角度αと同角度である。そして、先端面１２と基端面１３とを適合させた状態でツール本体１に先端部材１１がロウ付けなどで接合されている。
【００１５】
また、先端部材１１の保持部２全体が、ダイヤモンド焼結体またはｃＢＮ焼結体より成る超高硬度焼結体９によって形成されており、より具体的には、上記側面６，６が曲折して平行面６ｂ，６ｂが形成される部分より軸線Ｏ方向先端側が上記超高硬度焼結体によって形成されているとともに、後端側が超硬合金によって形成されている。ここで、上記保持部２をこのような超高硬度焼結体によって形成するには、例えば焼結前の圧粉成形時において、先端部材１１の保持部２となる部分に超高硬度焼結体９の原料粉末を充填するとともに、これよりも後端側には超硬合金の原料粉末を充填しておいて、これらを一体に焼結することによって形成する。また、本実施形態では、少なくともこの超高硬度焼結体９によって形成された保持部２の表面は、当該超高硬度焼結体９が焼結されたままの非研磨の状態、すなわち焼結地肌のままの状態であって、その表面粗さは、例えばＪＩＳ　Ｂ　０６０１における最大高さＲｙにおいて０．８μｍ〜３．２μｍの範囲とされている。
【００１６】
しかるに、このように構成されたウェッジツール１０においては、先端部材１１の保持部２によってボンディングワイヤを保持してボンディングパッドに密着させ、ツール本体１が取り付けられた超音波振動手段によって、凹溝部８の延在する方向に超音波振動を印加してボンディングワイヤとボンディングパッドとを接合するのに、ツール本体１の先端面１２と先端部材１１の基端面１３とが互いに適合させた状態で接合されているので、先端面１２と基端面１３とが互いに係合し合うと共に、接合面積が増加することによるロウ付け強度の向上によって、ツール本体１と先端部材１１とが強固に接合され、先端部材１１が脱落することを防止することができる。
【００１７】
また、ツール本体１の先端面１２と先端部材１１の基端面１３とに形成されている凹凸面が、超音波振動の方向に直交する方向に向けて延在する凸状Ｖ字型および凹状Ｖ字型とされているので、接合面におけるせん断方向以外の方向で振動による力を受けることができ、接合面の剥離が抑制され、さらに先端部材１１が脱落することを防止することができる。
また、先端面１２が凸状Ｖ字型で、基端面１３が凹状Ｖ字型であるので、ツール本体１に先端部材１１を接合する際に、互いの中心軸を容易に一致させることができ、ボンディングワイヤとボンディングパッドとの接合において誤差を減少させることができる。
【００１８】
また、保持部２が、硬質なダイヤモンド焼結体またはｃＢＮ焼結体より成る超高硬度焼結体９によって形成されているので、極めて長期間このような超音波ワイヤボンディングに使用してもこの保持部２に生じる摩耗は少なく、従ってかかる摩耗によるボンディング精度の劣化も抑えることができる。このため、当該ウェッジツールの寿命の大幅な延長を図ることが可能となって、逆にボンディング装置におけるツール交換回数は削減することができ、交換作業や交換後のツールの調整作業に要する時間や労力の軽減を促すとともに、効率的かつ円滑なワイヤボンディングを行うことができる。
【００１９】
また、このようなダイヤモンド焼結体やｃＢＮ焼結体等の超高硬度焼結体９は、超硬合金などに比べてボンディングワイヤ材質となるアルミニウムや金との溶着性が低く、従ってこのような材質よりなるボンディングワイヤの接合に長期間使用しても、またボンディングの際に熱圧着を併用したりしても、ワイヤの溶着によるボンディング精度の劣化が生じたり、溶着物が剥離して半導体装置に付着することにより短絡が生じたりすることもない。このため、上記構成のウェッジツールによれば、このような溶着によるボンディング精度の劣化によってツールの交換を余儀なくされたり、あるいは頻発する短絡によって半導体装置の検査作業に多大な時間や労力を要し、また製品歩留まりが低下したりするような事態を防止することができる。
【００２０】
また、本実施形態のウェッジツールでは、この超高硬度焼結体９によって形成された保持部２の表面が、当該超高硬度焼結体９を焼結によって成形した際のままの非研磨あるいは未研磨の状態とされていて、その表面粗さが焼結したダイヤモンド粒子やｃＢＮ粒子径の大きさに準じた大きなものとされている。そして、本実施形態によれば、このような超高硬度焼結体９によって形成された保持部２がボンディングワイヤを保持することになるため、当該ウェッジツールによるボンディングワイヤの保持力の向上を図ることができ、ボンディングの際にワイヤを確実に保持してボンディングパッドに接合することが可能となる。
【００２１】
ただし、このように保持部２を形成する超高硬度焼結体９の表面が非研磨であるとしても、上記ダイヤモンド粒子やｃＢＮ粒子の粒子径が小さくて保持部２の表面粗さも比較的小さい場合には、このような効果を確実に奏することができなくなるおそれがある一方、逆にこの粒子径が大きすぎて表面粗さも過大となると、保持部２の表面によってボンディングワイヤが削られることにより、この削られたボンディングワイヤが粉体となって保持部２に付着したり清浄な環境が要求される半導体装置の製造工程を汚染したりするおそれがある。このため、上記非研磨の状態におけるこの超高硬度焼結体９より成る保持部２の表面粗さは、本実施形態のように最大高さＲｙにおいて０．８μｍ〜３．２μｍの範囲に設定されるのが望ましい。
【００２２】
また、図６に示す変形例のように、一対の平面部１２ａ，１２ａを曲面部１２ｂによって連続的な曲面で繋ぎ、対応するように一対の平面部１３ａ，１３ａを曲面部１３ｂで繋いで凹凸面を形成することで、角部が形成された場合などに考えられる応力集中による欠損を防止することができる。
【００２３】
なお、本実施形態においては、先端面１２が凸状Ｖ字型で、基端面１３が凹状Ｖ字型とされているが、たとえば先端面１２には複数の凸条が設けられ、基端面１３には先端面１２に適合する複数の凹溝が形成されていてもよい。また、凸条および凹溝の延在する方向が直交する方向でなくても、超音波振動の方向と同方向でなければよい。また、先端面１２と基端面１３とが平面でなく、互いに適合する凹凸面であれば、どのような形状でもよい。
また、超高硬度焼結体９は、ボンディングワイヤを保持する先端部材１１先端部の上記保持部２を少なくとも形成するようにされていればよいが、例えば先端部材１１の全てが超高硬度焼結体９によって形成するようにしてもよい。この場合に先端部材１１を超硬合金製のツール本体１に接合するには、活性ロウ材を用いることが望ましい。
また、本実施形態ではツール本体１の材質として超硬合金を用いているが、これ以外にもＳｉＣやＳｉ３Ｎ４などのセラミックスを用いることも可能である。さらに、上述した実施形態のウェッジツール１０の保持部２を含めた形状はあくまでも一例であり、これとは異なる形状のツール本体および先端部材を有するウェッジツールに本発明を適用することも、勿論可能である。
【００２４】
【発明の効果】
以上説明したように、本発明によれば、半導体装置の製造工程におけるワイヤボンディングに使用されるウェッジツールにおいて、ツール本体の先端面の凹凸面と先端部材の基端面の凹凸面とが互いに適合するので、ツール本体と先端部材とを強固に接合させることができ、先端部材の脱落を防止することができる。また、超音波振動手段による振動方向と異なる方向に向かって延在するような凸条または凹溝が設けられて凹凸面を形成することによって、さらに接合強度を向上させることができる。また、ツール本体の先端面の凹凸面が凸状Ｖ字型、先端部材の基端面の凹凸面が凹状Ｖ字型に形成されているので、ツール本体の中心軸と先端部材の中心軸とを容易に一致させることができ、ウェッジツールによる作業の精度を向上させることができる。
【００２５】
また、先端部材の保持部を、超高硬度焼結体によって形成することにより、この保持部の耐摩耗性の向上を図って長期に渡ってボンディング精度を安定かつ正確に維持することができる。また、たとえボンディングの際に熱圧着を併用したりしたとしても、ボンディングワイヤの保持部への溶着が生じるのを抑えることができ、このような溶着によってボンディング精度が損なわれたり、溶着物の剥離によって半導体装置に短絡が生じたりするのも防ぐことができる。
これらにより、ウェッジツール寿命の延長を図るとともに、円滑なボンディング作業を促すことが可能となる。
【図面の簡単な説明】
【図１】本発明の一実施形態を示す上記厚さ方向視の平面図である。
【図２】図１に示す実施形態の上記幅方向視の側面図である。
【図３】図１に示す実施形態を後端側から見た背面図である。
【図４】図１に示す実施形態の先端部材を示す拡大平面図である。
【図５】図１に示す実施形態の先端部材を示す拡大側面図である。
【図６】凹凸面の変形例を示す側面図である。
【符号の説明】
１　ツール本体
２　保持部
９　超高硬度焼結体
１０　ウェッジツール
１１　先端部材
１２　先端面
１３　基端面[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wedge tool used when wire bonding is performed in a manufacturing process of a semiconductor device such as an IC or a power device.
[0002]
[Prior art]
In a manufacturing process of this type of semiconductor device, ultrasonic wire bonding using a wedge tool is generally known as a method for electrically connecting a semiconductor chip and a substrate. That is, in this ultrasonic wire bonding, a bonding wire is held in a wedge-shaped holding portion provided on a tip member disposed at the tip of the tool body of the wedge tool so as to adhere to a bonding pad of a semiconductor chip or a substrate. The bonding wire is bonded to the bonding pad by applying ultrasonic vibration to the bonding wire through the tool body by the ultrasonic vibration means attached to the tool body. Moreover, in addition to joining by such ultrasonic vibration, thermocompression bonding may be used together.
[0003]
[Problems to be solved by the invention]
By the way, as a material of the tip member of such a wedge tool, various steel materials have been conventionally used. However, in such a case, the ultrasonic vibration is maintained in a state where the bonding wire is held and closely adhered to the bonding pad. Since the holding portion of the tip member is likely to be worn due to the situation of use, the accuracy of bonding is impaired, so that there is a problem that the wedge tool must be frequently replaced. Therefore, recently, in order to improve the wear resistance of such a holding portion, those using cemented carbide as the material of the tip member have been used, but even with such a wedge tool, During long-term use, it is inevitable that the holding portion is worn and bonding accuracy is impaired.
[0004]
Moreover, aluminum and gold, which are the materials of the bonding wire, are likely to be welded to these steel materials and cemented carbides. If such welding occurs in the holding part, the bonding accuracy is impaired and the life of the wedge tool is also lost. In addition, the welded aluminum or gold may peel from the holding part and adhere to the semiconductor chip or the substrate, which may cause a short circuit. Time and labor are required, and the product yield is reduced. Moreover, such welding becomes more prominent when thermocompression bonding is used in combination with ultrasonic vibration as described above.
[0005]
The inventor of the present invention previously described in Japanese Patent Application No. 2001-88499, the wedge tool is composed of a tool main body and a tip member disposed at the tip thereof, and the base end surface of the tip member is disposed on the tip surface of the tool body. It is proposed to join the tool body by brazing, etc. However, if it is simply brazed, the joint surface between the tool body and the tip member peels off due to the ultrasonic vibration applied to the wedge tool, and the tip There is a problem that the member falls off.
[0006]
The present invention has been made in view of such circumstances, and in the wedge tool used for wire bonding as described above, the bonding strength between the tool body and the tip member is increased and the wear resistance of the holding portion is increased. It is an object of the present invention to provide a wedge tool that can shorten the life due to welding and prevent a short circuit of a semiconductor device.
[0007]
[Means for Solving the Problems]
In order to solve the above problems and achieve such an object, the present invention is a wedge tool for holding and bonding a bonding wire in wire bonding of a semiconductor device, and a tool body attached to ultrasonic vibration means And a tip member that is joined to the tip of the tool body, and a holding portion that holds the bonding wire is provided at the tip of the tip member. Is formed of an ultra-high hardness sintered body, and an uneven surface is formed on the distal end surface of the tool body and the proximal end surface of the distal end member.
[0008]
According to the wedge tool according to the present invention, by using an ultra-high hardness sintered body for the holding portion, it is harder and has higher wear resistance than cemented carbide, etc., and wear even in extremely long-term use. It does not occur, and also has high welding resistance to bonding wire materials such as aluminum and gold, so that welding to the holding portion can be prevented even by ultrasonic wire bonding combined with thermocompression bonding.
Further, the uneven surface formed on the distal end surface of the tool body and the uneven surface formed on the proximal end surface of the distal end member are adapted to each other, and the distal end member is joined and disposed at the distal end of the tool body. Thus, it can be made to join firmly rather than the case where planes are joined and arranged by brazing. That is, the unevenness surface of the tool body and the uneven surface of the tip member are engaged with each other, and the joining strength between the tool body and the tip member is increased by improving the brazing strength by increasing the joining area. .
[0009]
In the wedge tool, the concavo-convex surfaces of the distal end surface and the proximal end surface are surfaces provided with ridges or grooves extending in a direction different from a vibration direction by the ultrasonic vibration means. And
According to the wedge tool of the present invention, the ridges or grooves are provided as the shape of the concavo-convex surface, and the ridges or grooves are provided to extend in a direction different from the vibration direction by the ultrasonic vibration means. Therefore, the bonding strength can be improved as compared with the case where the ridges or grooves are provided so as to extend in the same direction as the vibration direction and the uneven surface is formed.
[0010]
In the wedge tool, the concavo-convex surfaces of the distal end surface and the proximal end surface are formed in a V-shaped cross section.
According to the wedge tool according to the present invention, the cross-sectional shape of one concave-convex surface is a convex V shape, and the cross-sectional shape of the other concave-convex surface is a concave V-shape. When the tip member is joined to the tip of the tool, the center axis of the tool body and the center axis of the tip member can be easily matched.
[0011]
In the wedge tool, the ultra-high hardness sintered body is composed of a diamond sintered body or a cBN sintered body.
In the wedge tool, the ultra-high hardness sintered body in which the holding portion is formed is in a non-polished state with the surface thereof being sintered. According to the wedge tool according to the present invention, since the surface roughness is increased by the holding portion made of an ultra-high hardness sintered body whose surface is not polished, the bonding wire can be reliably held by the holding portion. It becomes.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
1 to 5 show an embodiment of the present invention. In the present embodiment, the wedge tool 10 includes a tool body 1 made of cemented carbide formed in a substantially cylindrical shape centering on the axis O, and a tip member 11 disposed at the tip of the tool body 1. It is configured. As shown in FIGS. 1 to 3, the tool body 1 is provided with a flat surface 1a on one side surface, and the tip is chamfered in a quadrangular pyramid shape with the axis O as the center, and the tip side (FIG. 1). In addition, it has a tapered wedge shape in which the width and thickness gradually decrease toward the lower side in FIG. The four pyramid surfaces 3, 3, 4 and 4 of the quadrangular pyramid that define the wedge-shaped tip are a pair of conical surfaces 3 and 3 positioned on opposite sides of the axis O. Are formed so as to be inclined at a smaller angle with respect to the axis O than the other pair of conical surfaces 4, 4 from the rear end side of the pair of conical surfaces 4, 4. The quadrangular pyramid formed by the tip has a shape that is flattened in the thickness direction (left and right direction in FIGS. 2 and 5) than the regular quadrangular pyramid, and a rectangular shape that is flattened in the thickness direction even in a cross section perpendicular to the axis O. Will be presented.
[0013]
Further, side surfaces 5, 5, 6, and 6 are formed on the side surface of the tip member 11 so as to be continuous with the flat surfaces 3, 3, 4, and 4 of the flat quadrangular pyramid. As shown in FIGS. 4 and 5, the side surfaces 5 and 5 facing the width direction of the flattened quadrangular pyramid (left and right directions in FIGS. 1 and 4) are the other pair of conical surfaces 4 and 4 of the quadrangular pyramid. The inclined surface is inclined to the axis O side toward the tip side. On the other hand, the side surfaces 6 and 6 facing the thickness direction are inclined from the inclined surfaces 6a and 6a having the same inclination as the pair of conical surfaces 3 and 3, and the axis O is equidistant from the inclined surfaces 6a and 6a. The parallel surfaces 6b and 6b are formed so as to be parallel to each other and to be parallel to the side surfaces 5 and 5, so that the parallel surfaces 6b and 6b are formed. The thickness of the tip member 11 is constant in the portion. Further, the holding portion 2 provided at the distal end portion of the distal end member 11 has a distal end surface 7 whose both ends in the width direction are flat surfaces perpendicular to the axis O, and a central portion in the width direction of the distal end surface 7. The groove 8 formed in a V-shaped cross section centered on the axis O as viewed in the thickness direction and opened to the parallel surfaces 6b and 6b, and the groove 8 and the parallel surfaces 6b and 6b are continuously formed. It has rounded surfaces 8a and 8a formed so as to be connected by curved surfaces.
[0014]
In the present embodiment, as shown in FIGS. 4 and 5, the distal end surface 12 of the tool body 1 has a convex V-shaped cross section centered on the axis O in the width direction, and the concave groove portion 8 is formed. It is formed in a ridge shape so as to extend in a direction orthogonal to the extending direction. That is, the front end surface 12 is composed of a pair of flat portions 12a and 12a bent from the conical surfaces 3 and 3 and directed toward the axis O, and an angle α formed by the pair of flat portions 12a and 12a is 120 ° to 150 °. It is said that. Further, the proximal end surface 13 of the distal end member 11 has a concave V-shaped cross section that fits the distal end surface 12 of the tool main body 1, and a pair of plane portions that are bent at an acute angle from the inclined surfaces 6 a and 6 a toward the axis O. The angle formed by the pair of flat portions 13a and 13a is the same as the angle α formed by the pair of flat portions 12a and 12a. The distal end member 11 is joined to the tool body 1 by brazing or the like with the distal end surface 12 and the proximal end surface 13 fitted.
[0015]
Further, the entire holding portion 2 of the tip member 11 is formed of an ultra-high hardness sintered body 9 made of a diamond sintered body or a cBN sintered body. More specifically, the side surfaces 6 and 6 are bent. Thus, the tip end side in the direction of the axis O from the portion where the parallel surfaces 6b, 6b are formed is formed of the ultra-high hardness sintered body, and the rear end side is formed of cemented carbide. Here, in order to form the holding part 2 with such an ultra-high hardness sintered body, for example, at the time of compacting before sintering, ultra-high hardness sintering is performed on a portion that becomes the holding part 2 of the tip member 11. The raw material powder of the body 9 is filled, and the rear end side is filled with the raw material powder of the cemented carbide, and these are integrally sintered. In the present embodiment, at least the surface of the holding part 2 formed by the ultra-high hardness sintered body 9 is in an unpolished state in which the ultra-high hardness sintered body 9 remains sintered, that is, sintered. The surface remains as it is, and the surface roughness is, for example, in the range of 0.8 μm to 3.2 μm at the maximum height Ry in JIS B 0601.
[0016]
However, in the wedge tool 10 configured as above, the bonding wire is held by the holding portion 2 of the tip member 11 and brought into close contact with the bonding pad, and the concave groove portion 8 is formed by ultrasonic vibration means to which the tool body 1 is attached. In order to bond the bonding wire and the bonding pad by applying ultrasonic vibration in the extending direction, the distal end surface 12 of the tool body 1 and the proximal end surface 13 of the distal end member 11 are bonded together. Therefore, the front end surface 12 and the base end surface 13 are engaged with each other, and the brazing strength is improved by increasing the bonding area, whereby the tool body 1 and the front end member 11 are firmly bonded to each other. 11 can be prevented from falling off.
[0017]
In addition, the convex and concave surfaces formed on the distal end surface 12 of the tool body 1 and the proximal end surface 13 of the distal end member 11 extend in a direction perpendicular to the direction of ultrasonic vibration and a concave V shape. Since it is shaped like a letter, it can receive a force due to vibration in a direction other than the shearing direction on the joint surface, the separation of the joint surface can be suppressed, and the tip member 11 can be prevented from falling off.
Further, since the distal end surface 12 is a convex V-shape and the proximal end surface 13 is a concave V-shape, when the distal end member 11 is joined to the tool body 1, the center axes can be easily matched. In addition, an error in bonding between the bonding wire and the bonding pad can be reduced.
[0018]
In addition, since the holding portion 2 is formed by an ultra-high hardness sintered body 9 made of a hard diamond sintered body or a cBN sintered body, even if it is used for such ultrasonic wire bonding for an extremely long time, The wear generated in the holding portion 2 is small, and therefore deterioration of bonding accuracy due to such wear can be suppressed. For this reason, it is possible to greatly extend the life of the wedge tool, and conversely, the number of tool replacements in the bonding apparatus can be reduced, and the time required for replacement work and tool adjustment work after replacement can be reduced. It is possible to reduce labor and to perform efficient and smooth wire bonding.
[0019]
In addition, the ultra-high hardness sintered body 9 such as a diamond sintered body or a cBN sintered body has a lower weldability with aluminum or gold as a bonding wire material than a cemented carbide or the like. Even if it is used for a long time to bond bonding wires made of various materials or when thermocompression bonding is used at the time of bonding, the bonding accuracy deteriorates due to the welding of the wires, or the welded material peels off and becomes a semiconductor There is no short circuit caused by adhering to the device. For this reason, according to the wedge tool having the above-described configuration, the tool must be replaced due to the deterioration of the bonding accuracy due to such welding, or the inspection work of the semiconductor device due to frequent short circuit takes a lot of time and labor, In addition, it is possible to prevent a situation in which the product yield decreases.
[0020]
Further, in the wedge tool of the present embodiment, the surface of the holding portion 2 formed by the ultra-high hardness sintered body 9 is not polished or left as it is when the ultra-high hardness sintered body 9 is formed by sintering. It is in an unpolished state, and its surface roughness is large according to the size of the sintered diamond particle or cBN particle diameter. And according to this embodiment, since the holding | maintenance part 2 formed with such an ultra-high hardness sintered body 9 hold | maintains a bonding wire, it aims at the improvement of the holding power of the bonding wire by the said wedge tool. It is possible to securely hold the wire during bonding and bond it to the bonding pad.
[0021]
However, even if the surface of the ultra-high hardness sintered body 9 forming the holding part 2 is not polished in this way, the particle diameter of the diamond particles or cBN particles is small and the surface roughness of the holding part 2 is relatively small. In such a case, there is a possibility that such an effect cannot be reliably obtained. On the other hand, if the particle diameter is too large and the surface roughness is excessive, the bonding wire is scraped by the surface of the holding portion 2. There is a possibility that the scraped bonding wire may become powder and adhere to the holding unit 2 or contaminate a semiconductor device manufacturing process that requires a clean environment. For this reason, the surface roughness of the holding portion 2 made of the ultra-high hardness sintered body 9 in the non-polished state is set in the range of 0.8 μm to 3.2 μm at the maximum height Ry as in this embodiment. It is desirable to be done.
[0022]
Further, as in the modification shown in FIG. 6, the pair of flat portions 12a and 12a are connected by a curved surface by a curved surface portion 12b, and the pair of flat portions 13a and 13a are connected by a curved surface portion 13b so as to correspond. By forming the surface, it is possible to prevent a defect due to stress concentration that may occur when corners are formed.
[0023]
In the present embodiment, the distal end surface 12 is convex V-shaped and the proximal end surface 13 is concave V-shaped. For example, the distal end surface 12 is provided with a plurality of ridges, and the proximal end surface 13 is formed. A plurality of concave grooves that match the tip surface 12 may be formed. Moreover, even if the direction in which the ridges and the grooves extend is not a perpendicular direction, it does not have to be the same direction as the ultrasonic vibration direction. Moreover, as long as the front-end | tip surface 12 and the base end surface 13 are not planes, but the uneven | corrugated surface which mutually fits, what kind of shape may be sufficient.
In addition, the ultra-high hardness sintered body 9 may be formed so as to form at least the holding portion 2 at the tip portion of the tip member 11 that holds the bonding wire. You may make it form with the tied body 9. FIG. In this case, in order to join the tip member 11 to the tool body 1 made of cemented carbide, it is desirable to use an active brazing material.
In the present embodiment, cemented carbide is used as the material of the tool body 1, but ceramics such as SiC and Si 3 N 4 can also be used. Furthermore, the shape including the holding portion 2 of the wedge tool 10 of the above-described embodiment is merely an example, and it is of course possible to apply the present invention to a wedge tool having a tool body and a tip member having a shape different from this. It is.
[0024]
【The invention's effect】
As described above, according to the present invention, in the wedge tool used for wire bonding in the manufacturing process of a semiconductor device, the uneven surface on the distal end surface of the tool body and the uneven surface on the proximal end surface of the distal end member are compatible with each other. Therefore, the tool body and the tip member can be firmly joined, and the tip member can be prevented from falling off. Further, the bonding strength can be further improved by forming the concavo-convex surface by providing the ridges or grooves that extend in a direction different from the vibration direction by the ultrasonic vibration means. In addition, since the uneven surface of the tip surface of the tool body is formed in a convex V shape and the uneven surface of the base end surface of the tip member is formed in a concave V shape, the center axis of the tool body and the center axis of the tip member are They can be easily matched and the accuracy of the work by the wedge tool can be improved.
[0025]
Further, by forming the holding portion of the tip member with an ultra-high hardness sintered body, it is possible to improve the wear resistance of the holding portion and maintain the bonding accuracy stably and accurately over a long period of time. In addition, even if thermocompression bonding is used at the time of bonding, it is possible to suppress the occurrence of welding to the holding portion of the bonding wire. Therefore, it is possible to prevent a short circuit from occurring in the semiconductor device.
As a result, the lifetime of the wedge tool can be extended and a smooth bonding operation can be promoted.
[Brief description of the drawings]
FIG. 1 is a plan view in the thickness direction showing an embodiment of the present invention.
FIG. 2 is a side view of the embodiment shown in FIG. 1 as viewed in the width direction.
FIG. 3 is a rear view of the embodiment shown in FIG. 1 as viewed from the rear end side.
4 is an enlarged plan view showing a tip member of the embodiment shown in FIG. 1. FIG.
FIG. 5 is an enlarged side view showing a tip member of the embodiment shown in FIG. 1;
FIG. 6 is a side view showing a modification of the uneven surface.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Tool main body 2 Holding part 9 Super-hard sintered body 10 Wedge tool 11 Tip member 12 Tip surface 13 Base end surface

Claims (5)

半導体装置のワイヤボンディングにおいてボンディングワイヤを保持して接合するウェッジツールであって、
超音波振動手段に取り付けられるツール本体と、該ツール本体の先端に接合されて配設されている先端部材とを備えて構成され、該先端部材の先端部に上記ボンディングワイヤを保持する保持部が設けられており、少なくともこの保持部が、超高硬度焼結体により形成されていると共に、
上記ツール本体の先端面と上記先端部材の基端面とに互いに適合する凹凸面が形成されていることを特徴とするウェッジツール。A wedge tool for holding and bonding a bonding wire in wire bonding of a semiconductor device,
A tool body attached to the ultrasonic vibration means; and a tip member that is joined to the tip of the tool body, and a holding part that holds the bonding wire at the tip of the tip member. Provided, at least this holding part is formed of an ultra-high hardness sintered body,
A wedge tool characterized in that a concavo-convex surface adapted to each other is formed on a distal end surface of the tool body and a proximal end surface of the distal end member. 請求項１に記載のウェッジツールにおいて、
上記先端面および基端面の凹凸面は、上記超音波振動手段による振動方向と異なる方向に向かって延在する凸条または凹溝が設けられた面であることを特徴とするウェッジツール。The wedge tool according to claim 1,
The wedge tool according to claim 1, wherein the concavo-convex surfaces of the distal end surface and the base end surface are surfaces provided with ridges or grooves extending in a direction different from a vibration direction by the ultrasonic vibration means. 請求項１または請求項２に記載のウェッジツールにおいて、上記先端面および基端面の凹凸面が断面Ｖ字型に形成されていることを特徴とするウェッジツール。The wedge tool according to claim 1 or 2, wherein the concave and convex surfaces of the distal end surface and the proximal end surface are formed in a V-shaped cross section. 請求項１から請求項３のいずれかに記載のウェッジツールにおいて、
上記超高硬度焼結体は、ダイヤモンド焼結体またはｃＢＮ焼結体より成ることを特徴とするウェッジツール。In the wedge tool in any one of Claims 1-3,
The wedge tool characterized in that the ultra-high hardness sintered body comprises a diamond sintered body or a cBN sintered body. 請求項１から請求項４のいずれかに記載のウェッジツールにおいて、
上記保持部を形成した前記超高硬度焼結体は、その表面が焼結されたままの非研磨状態とされていることを特徴とするウェッジツール。In the wedge tool in any one of Claims 1-4,
A wedge tool characterized in that the ultra-high hardness sintered body in which the holding portion is formed is in an unpolished state with its surface being sintered.
JP2002247234A 2002-08-27 2002-08-27 Wedge tool Withdrawn JP2004087822A (en)

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Cited By (13)

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JP2009113083A (en) * 2007-11-07 2009-05-28 Ultrasonic Engineering Co Ltd Ultrasonic joining tool, and fitting method for ultrasonic joining tool
JP2009540624A (en) * 2006-07-03 2009-11-19 クリック アンド ソッファ インダストリーズ、インク． Bonding tool with improved finish
KR101042232B1 (en) 2008-12-10 2011-06-17 주식회사 맥텍 Method for manufacturing wire bonding tool
CN103658963A (en) * 2012-09-26 2014-03-26 Toto株式会社 Welded chopper
USD753739S1 (en) 2015-04-17 2016-04-12 Coorstek, Inc. Wire bonding wedge tool
USD771168S1 (en) 2014-10-31 2016-11-08 Coorstek, Inc. Wire bonding ceramic capillary
USD797171S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
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USD797826S1 (en) 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
US9931709B2 (en) 2016-01-26 2018-04-03 Orthodyne Electronics Corporation Wedge bonding tools, wedge bonding systems, and related methods
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JP2009540624A (en) * 2006-07-03 2009-11-19 クリック アンド ソッファ インダストリーズ、インク． Bonding tool with improved finish
JP2009113083A (en) * 2007-11-07 2009-05-28 Ultrasonic Engineering Co Ltd Ultrasonic joining tool, and fitting method for ultrasonic joining tool
KR101042232B1 (en) 2008-12-10 2011-06-17 주식회사 맥텍 Method for manufacturing wire bonding tool
CN103658963A (en) * 2012-09-26 2014-03-26 Toto株式会社 Welded chopper
KR101482597B1 (en) 2012-09-26 2015-01-14 토토 가부시키가이샤 Bonding capillary
USD771168S1 (en) 2014-10-31 2016-11-08 Coorstek, Inc. Wire bonding ceramic capillary
USD824970S1 (en) 2015-02-03 2018-08-07 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797171S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797172S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797826S1 (en) 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
USD821468S1 (en) 2015-02-03 2018-06-26 Coorstek, Inc. Ceramic bonding tool with textured tip
USD824969S1 (en) 2015-02-03 2018-08-07 Coorstek, Inc. Ceramic bonding tool with textured tip
USD753739S1 (en) 2015-04-17 2016-04-12 Coorstek, Inc. Wire bonding wedge tool
US9931709B2 (en) 2016-01-26 2018-04-03 Orthodyne Electronics Corporation Wedge bonding tools, wedge bonding systems, and related methods
US10449627B2 (en) 2016-01-26 2019-10-22 Kulicke And Soffa Industries, Inc. Wedge bonding tools, wedge bonding systems, and related methods
US10987753B2 (en) 2016-01-26 2021-04-27 Kulicke And Soffa Industries, Inc. Wedge bonding tools, wedge bonding systems, and related methods
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool
KR101970285B1 (en) * 2018-11-22 2019-04-18 에스피반도체통신(주) Wire bonding tool for semiconductor
KR20220157658A (en) * 2021-05-21 2022-11-29 스테코 주식회사 PCD-integrated bonding tool and its manufacturing method
KR102542224B1 (en) * 2021-05-21 2023-06-12 스테코 주식회사 PCD-integrated bonding tool and its manufacturing method

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