KR101042232B1 - Method for manufacturing wire bonding tool - Google Patents

Method for manufacturing wire bonding tool Download PDF

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KR101042232B1
KR101042232B1 KR1020080125315A KR20080125315A KR101042232B1 KR 101042232 B1 KR101042232 B1 KR 101042232B1 KR 1020080125315 A KR1020080125315 A KR 1020080125315A KR 20080125315 A KR20080125315 A KR 20080125315A KR 101042232 B1 KR101042232 B1 KR 101042232B1
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raw material
bonding tool
grinding
bonding
groove
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KR1020080125315A
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KR20100066831A (en
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김동일
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주식회사 맥텍
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Abstract

본 발명은 와이어 본딩 툴 제작방법에 관한 것이다. 이는 알루미늄 웨지 본딩(Aluminum Wedge Bonding)공정에 사용되는 본딩 툴(bonding tool)을 제작하는 방법으로서, 길이방향으로 일정단면을 가지는 봉형 원소재를 준비하는 준비단계와; 연삭을 통해 상기 원소재의 측부를 깎아 선단부에 원소재의 길이방향에 직교하는 평평한 사각의 선단면을 형성하는 선단면 형성단계와; 상기 선단면에 V홈을 형성하는 V홈가공단계와; 다이아몬드분말이 함침(含浸)되어 있는 연삭실을 길이방향으로 이동시켜, 상기 V홈의 바닥면과 원소재의 측면이 이어지는 절곡부위를 연삭하여 곡면화 하는 실연삭단계를 포함하는 것을 특징으로 한다.The present invention relates to a wire bonding tool manufacturing method. It is a method of manufacturing a bonding tool (bonding tool) used in the aluminum wedge bonding process (Aluminum Wedge Bonding process), the preparation step of preparing a rod-shaped raw material having a predetermined cross-section in the longitudinal direction; A front end surface forming step of grinding the side of the raw material through grinding to form a flat rectangular front end surface perpendicular to the longitudinal direction of the raw material at the front end portion; A V groove processing step of forming a V groove on the front end surface; And a thread grinding step of moving the grinding chamber in which the diamond powder is impregnated in the longitudinal direction, thereby grinding and bending the bent portion where the bottom surface of the V groove and the side surface of the raw material are curved.

상기와 같이 이루어지는 본 발명의 와이어 본딩 툴 제작방법은, 공업용 다이아몬드분말이 함침(含浸)된 실을 사용하여 본딩툴 선단부의 형상을 최적 가공함으로써 와이어 본딩시 와이어가 절단되지 않도록 함은 물론 매우 저렴한 비용으로 본딩툴의 성능을 향상시킨다.The wire bonding tool manufacturing method of the present invention made as described above uses a thread impregnated with industrial diamond powder to optimally process the shape of the tip of the bonding tool to prevent the wire from being cut during wire bonding, and of course, a very low cost. Improves the performance of the bonding tool.

와이어본더, 본딩툴, 웨지본딩, 알루미늄 본딩 Wire Bonding, Bonding Tools, Wedge Bonding, Aluminum Bonding

Description

와이어 본딩툴 제작방법{Method for manufacturing wire bonding tool}Method for manufacturing wire bonding tool

본 발명은 와이어 본딩툴 제작방법에 관한 것이다.The present invention relates to a wire bonding tool manufacturing method.

와이어본딩(wire bonding)은 실리콘 칩과 반도체 디바이스를 가느다란 전도성 와이어로 접속시키는 공정이다. 상기 와이어로는 금이나 구리 또는 알루미늄 등을 주로 사용한다. 상기 와이어로 금을 사용하는 볼 본딩(ball bonding)은 와이어가 통과하는 바늘모양의 캐필러리에 와이어를 통과시키고 고전압을 가하여, 와이어의 단부가 녹아 볼의 형태가 되도록 유도한 후 이를 접속지점에 눌러 붙이는 공정을 포함한다.Wire bonding is a process of connecting silicon chips and semiconductor devices with thin conductive wires. As the wire, gold, copper or aluminum is mainly used. Ball bonding using gold as the wire passes the wire through a needle-shaped capillary through which the wire passes and applies a high voltage to induce the end of the wire to melt into a ball shape, and then press it to a connection point. It includes the attaching process.

또한 상기 알루미늄은 금보다 값이 싸고 나름대로 전기적으로 우수한 성질을 가지므로 금을 대신한 와이어본딩에 많이 사용된다. 상기 알루미늄 와이어를 이용하는 본딩 방식은 금(gold) 와이어 본딩 방식과 다른 특징을 갖는데, 이와같이 차이가 있는 것은 금과 알루미늄의 물성이 다르기 때문이다.In addition, since aluminum is cheaper than gold and has excellent electrical properties, it is widely used for wire bonding instead of gold. The bonding method using the aluminum wire has a different feature from the gold wire bonding method, because the difference is that the physical properties of gold and aluminum are different.

알루미늄을 본딩하기 위해서는 도 1에 도시한 본딩툴(11)을 사용한다. 상기 본딩툴(11)의 하단부(도면에서는 상단부)에는 알루미늄 와이어를 잡아 기판에 대고 누를 수 있도록 홈(11b)이 형성되어 있다. 상기와 같이 알루미늄 와이어의 단부를 잡아 기판에 가압한 상태로 초음파를 가하면 알루미늄이 그 자리에 녹아 붙는다. 이러한 방식의 본딩을 알루미늄 웨지 본딩(Aluminum Wedge Bonding)이라고 한다.In order to bond aluminum, the bonding tool 11 shown in FIG. 1 is used. A groove 11b is formed at the lower end of the bonding tool 11 (the upper end in the drawing) to hold the aluminum wire and press it against the substrate. If the ultrasonic wire is applied while holding the end of the aluminum wire and pressurized the substrate, the aluminum melts in place. Bonding in this manner is called aluminum wedge bonding.

도 1에 상기 알루미늄 웨지 본딩을 위해 사용되는 종래의 본딩툴(11)을 도시하였다.1 shows a conventional bonding tool 11 used for the aluminum wedge bonding.

도시한 바와같이, 종래의 본딩툴(11)은, 환봉의 형태를 취하며 그 일단부가 뾰족하고 뾰족한 선단부에 V자형 홈(11b)을 갖는다. 상기 홈(11b)은 알루미늄 와이어(미도시)를 기판에 대고 가압할 때 와이어를 고정하는 역할을 한다.As shown in the drawing, the conventional bonding tool 11 takes the form of a round bar and has a V-shaped groove 11b at one end thereof with a sharp and pointed tip. The groove 11b serves to fix the wire when pressing the aluminum wire (not shown) against the substrate.

한편, 상기한 본딩툴(11)의 제작과정은 환봉형 원소재(10)의 측면에 경사면(11e)을 형성하여 원소재의 일단부를 뾰족하게 만들되 뾰족한 선단부에 평평한 사각의 선단면(도 2a의 11a)을 형성하는 1차가공과정과, 상기 선단면(11a)을 방전 가공하여 홈(11b)을 성형하는 2차가공과정으로 이루어진다.On the other hand, the manufacturing process of the above-described bonding tool 11 is to form an inclined surface 11e on the side of the round bar-shaped raw material 10 to make one end of the raw material, but the flat end surface of the flat square on the sharp tip (Fig. 2a 11a) and a secondary machining process of forming the groove 11b by discharging the tip end surface 11a.

상기 2차가공은 방전장치에 의해 이루어진다. 즉, 1차가공을 마친 소재를 방전장치에 고정시키고, 선단면(11a)에 방전열을 가하여 선단면(11a)의 표면을 침식시킴으로써 홈(11b)을 형성하는 것이다.The secondary processing is performed by a discharge device. In other words, the groove 11b is formed by fixing the finished material to the discharge device and applying heat of discharge to the tip surface 11a to erode the surface of the tip surface 11a.

도 2a 및 도 2b는 상기한 종래의 와이어 본딩툴(11)을 제작하기 위한 방법 및 그 문제점을 설명하기 위하여 도시한 도면이다.2A and 2B are diagrams for explaining a method and a problem for manufacturing the conventional wire bonding tool 11 described above.

도 2a를 참조하면, 환봉형 원소재(10)의 선단부에 평평한 선단면(11a)이 형성되어 있음을 알 수 있다. 상기 선단면(11a)은 사각의 평면으로서 방전가공이 시작되는 부분이다. 상기 선단면(11a)에 방전열을 가해 빗금친 A부분을 제거함으로써 V홈 형태의 홈(11b)을 얻는다.Referring to FIG. 2A, it can be seen that a flat tip surface 11a is formed at the tip of the round bar-shaped raw material 10. The tip end surface 11a is a rectangular plane and is a portion at which discharge machining starts. V-groove-shaped groove 11b is obtained by applying discharge heat to the tip end face 11a to remove the hatched A portion.

그런데 상기한 종래의 본딩툴 제작방법은, 홈(11b)을 형성하기 위하여 방전장치를 사용하므로 가공면(13)의 정밀성이 보장되지 않는다는 문제를 갖는다. 예컨대 작업자가 숙련되지 않을 경우 또는 기타의 이유로 가공면(13) 중 어떤 부분이 과침식 되어 오목하게 들어갈 수 있는 것이다. 이 경우 불량으로 처리되어 상기한 1,2차가공 과정을 다시 하거나 아니면 원소재를 버려야 한다.However, the conventional bonding tool manufacturing method described above has a problem that the precision of the machining surface 13 is not guaranteed because the discharge device is used to form the grooves 11b. For example, if the operator is not skilled or for some other reason, any part of the machining surface 13 may be over eroded and may be recessed. In this case, it is treated as defective and the above-mentioned 1st and 2nd process must be repeated or the raw materials should be discarded.

또한, 특히 상기 홈(11b)의 가공면(13)과 경사면(11e)이 만나는 부분(도 2b의 Z부분)이 절곡된 형태를 취하므로, 와이어 본딩시 본딩툴(11)이 와이어(W)를 기판(R)측으로 가압할 때, 상기 절곡부위(Z)에 눌리는 부분에 응력이 집중되어 와이어(W)가 쉽게 절단될 수 있다는 심각한 문제를 갖는다. In addition, in particular, since the portion where the machining surface 13 and the inclined surface 11e of the groove 11b meet (Z portion in FIG. 2B) is bent, the bonding tool 11 is connected to the wire W during wire bonding. When pressing to the substrate (R) side, there is a serious problem that the stress is concentrated in the portion pressed to the bent portion (Z) can be easily cut wire (W).

아울러 상기 방전장치는 매우 고가의 장비이며 전기를 많이 소모하기 때문에 본딩툴의 생산비용을 증가시킨다. 더욱이 고전압을 이용하므로 감전이나 화상 등의 위험이 있으며, 방전장치를 메인터넌스 하기 위한 별도의 전문 엔지니어를 두어야 하는 등의 번거로움이 있었다.In addition, the discharge device is a very expensive equipment and consumes a lot of electricity, thereby increasing the production cost of the bonding tool. Moreover, there is a risk of electric shock or burns due to the use of high voltage, and it is troublesome to have a separate professional engineer to maintain the discharge device.

본 발명은 상기 문제점을 해소하고자 창출한 것으로서, 공업용 다이아몬드분말이 함침(含浸)된 실을 사용하여 본딩툴 선단부의 형상을 최적 가공함으로써 와이어 본딩시 와이어가 절단되지 않도록 함은 물론 매우 저렴한 비용으로 본딩툴의 성능을 향상시킬 수 있는 와이어 본딩 툴 제작방법을 제공함에 목적이 있다.The present invention has been created to solve the above problems, by using the yarn impregnated with industrial diamond powder to optimally process the shape of the tip of the bonding tool to prevent the wire from being cut during bonding, as well as bonding at a very low cost An object of the present invention is to provide a wire bonding tool manufacturing method which can improve the performance of the tool.

상기 목적을 달성하기 위한 본 발명의 와이어본딩 툴 제작방법은, 알루미늄 웨지 본딩(Aluminum Wedge Bonding)공정에 사용되는 본딩 툴(bonding tool)을 제작하는 방법으로서, 길이방향으로 일정단면을 가지는 봉형 원소재를 준비하는 준비단계와; 연삭을 통해 상기 원소재의 측부를 깎아 원소재의 선단부(先端部)에, 원소재의 길이방향에 직교하며 평평한 사각형의 형태를 취하는 선단면(先端面)을 형성하는 선단면 형성단계와; 상기 선단면(先端面)에 V홈을 형성하되, 상기 원소재의 길이방향으로 파여 원소재의 측면방향에서 보았을 때 V자 모양이 되도록 V홈을 형성하는 V홈가공단계와; 다이아몬드분말이 함침(含浸)되어 있는 연삭실을 길이방향으로 이동시켜, 상기 V홈의 바닥면과 원소재의 측면이 이어지는 절곡부위를 연삭하여 곡면화 하는 실연삭단계를 포함하는 것을 특징으로 한다.
또한, 상기 실연삭단계에 이어지는 공정으로서, 상기 실연삭단계를 통해 얻은 곡면부를 샌딩처리하여 표면조도를 높이는 샌딩단계가 더 포함되는 것을 특징으로 한다.
아울러, 상기 실연삭단계는; 폴리아미드사, 폴리에스테르사, 아크릴사, 폴리올레핀사, 탄소섬유사, 비닐계섬유사 중 어느 하나에, 100메시(mesh) 내지 10000메시(mesh)의 입도를 갖는 다이아몬드파우더를 함침시킨 실을, 1m/min 내지 500m/min의 속도로 이송시키는 단계인 것을 특징으로 한다.The wire bonding tool manufacturing method of the present invention for achieving the above object is a method of manufacturing a bonding tool (bonding tool) used in the aluminum wedge bonding (Aluminum Wedge Bonding) process, rod-shaped raw material having a predetermined cross-section in the longitudinal direction A preparation step of preparing; A front end surface forming step of cutting the side of the raw material through grinding to form a front end surface having a flat quadrangle shape perpendicular to the longitudinal direction of the raw material at a front end of the raw material; A V-groove processing step of forming a V-groove on the front end surface, and forming a V-groove to be V-shaped when viewed in the longitudinal direction of the raw material and dug in the longitudinal direction of the raw material; And a thread grinding step of moving the grinding chamber in which the diamond powder is impregnated in the longitudinal direction, thereby grinding and bending the bent portion where the bottom surface of the V groove and the side surface of the raw material are curved.
In addition, as a process subsequent to the actual grinding step, a sanding step of increasing the surface roughness by sanding the curved surface obtained through the actual grinding step is characterized in that it further comprises.
In addition, the actual grinding step; A yarn in which a diamond powder having a particle size of 100 mesh to 10000 mesh is impregnated into any one of polyamide yarn, polyester yarn, acrylic yarn, polyolefin yarn, carbon fiber yarn and vinyl fiber yarn, Characterized in that the step of transferring at a speed of 1m / min to 500m / min.

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상기와 같이 이루어지는 본 발명의 와이어 본딩 툴 제작방법은, 공업용 다이아몬드분말이 함침(含浸)된 실을 사용하여 본딩툴 선단부의 형상을 최적 가공함으로써 와이어 본딩시 와이어가 절단되지 않도록 함은 물론 매우 저렴한 비용으로 본딩툴의 성능을 향상시킨다.The wire bonding tool manufacturing method of the present invention made as described above uses a thread impregnated with industrial diamond powder to optimally process the shape of the tip of the bonding tool to prevent the wire from being cut during wire bonding, and of course, a very low cost. This improves the performance of the bonding tool.

이하, 본 발명에 따른 하나의 실시예를 첨부된 도면을 참조하여 보다 상세히 설명하기로 한다.Hereinafter, one embodiment according to the present invention will be described in detail with reference to the accompanying drawings.

도 3은 본 발명의 일 실시예에 따른 와이어 본딩툴 제작방법을 위해 사용되는 장치를 개략적으로 도시한 구성도이고, 도 4는 상기 도 3의 본딩툴 선단부 주변을 화살표 S방향으로 바라본 모습을 도시한 도면이다.Figure 3 is a schematic view showing a device used for the wire bonding tool manufacturing method according to an embodiment of the present invention, Figure 4 is a view showing the direction around the tip of the bonding tool of Figure 3 in the direction of the arrow S. One drawing.

기본적으로 본 실시예에 따른 본딩툴 제작방법은, 다이아몬드분말이 함침되어 있는 부드러운 연삭실을 원소재에 마찰시킴으로써, 원소재가 다이아몬드분말에 의해 미세하고 정밀하게 깎여 나가게 유도하여, 원하는 형상의 선단부를 갖는 본딩툴을 제작할 수 있다는 견해에 기초하고 있다.Basically, the method of manufacturing the bonding tool according to the present embodiment, by rubbing the soft grinding chamber in which the diamond powder is impregnated with the raw material, induces the raw material to be cut finely and precisely by the diamond powder, so that the tip of the desired shape It is based on the view that a bonding tool can be manufactured.

본 실시예에 따른 제작방법으로 제작된 본딩툴(31)은 도 6에 도시한 형태를 취한다. 즉 본딩툴(31)의 선단부에 형성된 홈(31a)의 바닥면(31b)과 경사면(11e)의 사이에 곡면부(31c)를 형성함으로써 상기한 응력의 집중을 막아 본딩 공정시 와이 어의 절단을 방지하는 것이다.The bonding tool 31 produced by the manufacturing method according to the present embodiment takes the form shown in FIG. That is, by forming the curved portion 31c between the bottom surface 31b of the groove 31a and the inclined surface 11e formed at the distal end portion of the bonding tool 31 to prevent concentration of the above stress, cutting of the wire during the bonding process To prevent.

도 3을 참조하면, 본딩툴(도 6의 31)로 변모할 원소재(10)가 홀더(21)에 물려 수평으로 고정되어 있고, 상기 연삭실(19)이 원소재(10) 선단부의 앞을 통과해 화살표 t방향으로 이송됨을 알 수 있다. 상기 원소재(10)의 선단부에는 경사면(11e)과 V홈(14) 미리 형성되어 있다.Referring to FIG. 3, the raw material 10 to be transformed by the bonding tool (31 in FIG. 6) is held horizontally by the holder 21, and the grinding chamber 19 is placed in front of the tip of the raw material 10. It can be seen that it is passed in the direction of arrow t through. The inclined surface 11e and the V groove 14 are formed in advance at the tip end of the raw material 10.

특히 상기 홀더(21)에 물려 있는 원소재(10)는 물려 있는 상태로 화살표 X방향으로 회동운동이 가능하다. 따라서 도 6에 도시한 바와같이 홈(31a) 양측의 연삭할 부분을 연삭실(19)측으로 들이댈 수 있는 것이다.In particular, the raw material 10 held by the holder 21 is capable of rotating in the direction of the arrow X in the bite state. Therefore, as shown in FIG. 6, the part to grind on both sides of the groove 31a can enter into the grinding chamber 19 side.

상기 연삭실(19)은 두 개의 스풀(15a,15b)에 감긴 상태로 다수의 지지롤러(17)에 가이드 되며 화살표 t방향을 따라 계속적으로 이동한다. 상기 연삭실(19)의 이송속도는 경우에 따라 달라지며 예컨대 1m/min 내지 500m/min 정도로 유지할 수 있다. 상기 지지롤러(17)는 이송 중의 연삭실(19)을 수평으로 팽팽하게 유지한다.The grinding chamber 19 is guided to the plurality of support rollers 17 while being wound around the two spools 15a and 15b and continuously moves along the direction of the arrow t. The feed rate of the grinding chamber 19 varies depending on the case and can be maintained at about 1 m / min to about 500 m / min, for example. The support roller 17 keeps the grinding chamber 19 tensioned horizontally during transportation.

상기 연삭실(19)은 폴리아미드사, 폴리에스테르사, 아크릴사, 폴리올레핀사, 탄소섬유사, 비닐계섬유사 중 어느 하나의 실에, 100메시 내지 10000메시의 다이아몬드파우더를 함침(含浸)시킨 것을 사용한다. 즉, 상기 연삭실(19)은 소정 점도를 갖는 기계유에 상기 입도를 갖는 다이아몬드분말을 고르게 혼합한 후 상기한 여러 종류의 실 중 선택된 하나의 실을 담궈 실의 표면 및 내부 조직에 다이아몬드분말이 침투되도록 한 것이다.The grinding chamber 19 is impregnated with a diamond powder of 100 mesh to 10,000 mesh in any one of polyamide yarn, polyester yarn, acrylic yarn, polyolefin yarn, carbon fiber yarn and vinyl fiber yarn. Use it. That is, the grinding chamber 19 is evenly mixed with the diamond powder having the particle size in the machine oil having a predetermined viscosity, and then immersed one of the selected yarns of the various types of yarns so that the diamond powder penetrates the surface and internal structure of the yarn It was made possible.

상기 실에 있어서, 폴리아미드사로서는 나일론 6, 나일론 66, 나일론 MXD, 나일론 11, 나일론 12 등을 사용하고, 폴리에스테르사로서는 폴리에틸렌테레프탈레이트사, 폴리부틸렌테레프탈레이트사, 액정 폴리에스테르섬유사를 적용할 수 있다. 또한 아크릴사로서는 폴리아크릴로니트릴 섬유사를, 폴리올레핀사로서는 폴리에틸렌 섬유사나 폴리프로필렌 섬유사를 사용한다. 아울러, 비닐계 섬유사로서는 폴리비닐알콜 섬유사, 폴리비닐클로라이드 섬유사, 폴리비닐리덴클로라이드를 선택할 수 있다.In the yarn, nylon 6, nylon 66, nylon MXD, nylon 11, nylon 12 and the like are used as the polyamide yarn, and polyethylene terephthalate yarn, polybutylene terephthalate yarn and liquid crystalline polyester fiber yarn are used as the polyester yarn. Applicable Polyacrylonitrile fiber yarns are used as acrylic yarns, and polyethylene fiber yarns and polypropylene fiber yarns are used as polyolefin yarns. As the vinyl fiber yarn, polyvinyl alcohol fiber yarn, polyvinyl chloride fiber yarn, polyvinylidene chloride can be selected.

여하튼, 상기와 같이, 팽팽하게 유지된 상태로 화살표 t방향을 따라 연속 이송하는 연삭실(19)에, V홈(14)의 양측부(상기 바닥면(31b)과 경사면(11e)이 만나는 모서리부위)를 접촉시키면 해당 부위가 연삭실에 의해 미세하게 깎여나가며 곡면화된다. (도 5 참조)In any case, the edge where the both sides (the bottom surface 31b and the inclined surface 11e) of the V-groove 14 meet in the grinding chamber 19 that is continuously fed along the arrow t direction while being kept taut as described above. Area), the area is finely cut and curved by the grinding chamber. (See Fig. 5)

도 5는 상기 연삭실(19)의 작용을 설명하기 위하여 도시한 도면이다.5 is a view for explaining the operation of the grinding chamber 19.

기본적으로 상기 연삭실(19)은, V홈(14)의 바닥면(도 6의 31b)과, 상기 경사면(11e)이 연접하며 절곡된 모서리부(도 1의 z부분)를 연삭하여 곡면부(도 6의 31c)로 만드는 역할을 한다. 특히 연삭실(19)이 계속적으로 수평 이송되는 동안 곡면부(31c)를 형성하기 위하여 원소재(10)는 설정된 각도 범위(θ) 내에서 회동운동 한다. 상기 회동 각도는 경우에 따라 달라진다. Basically, the grinding chamber 19 is a curved portion by grinding the bent edge (z portion of Figure 1) and the bent surface (31b of Fig. 6) and the inclined surface (11e) in contact with the bottom surface (31b of Fig. 6) of the V groove (14). (31c in Fig. 6). In particular, in order to form the curved portion 31c while the grinding chamber 19 is continuously horizontally fed, the raw material 10 rotates within the set angle range θ. The angle of rotation depends on the case.

도 5에 도시한 바와같이, 원소재(10)를 기울여 일측 가공 대상면을 연삭실(19)에 접촉시킨 후 가공이 완료되면, 원소재(10)를 반대방향으로 각도 θ만큼 회전시켜 반대측 가공 대상면을 연삭한다. 상기와 같이 연삭실(19)에 대한 원소재(10)의 위치를 적절히 조절함으로써 도 6에 도시한 곡면부(31c)를 얻을 수 있게 된다.As shown in FIG. 5, when the machining is completed after tilting the raw material 10 to bring the one-side processing target surface into contact with the grinding chamber 19, the raw material 10 is rotated by the angle θ in the opposite direction to process the opposite side. Grind the target surface. By adjusting the position of the raw material 10 with respect to the grinding chamber 19 as mentioned above, the curved part 31c shown in FIG. 6 can be obtained.

도 6은 본 발명의 일 실시예에 따른 본딩툴 제작방법을 통해 제작된 본딩툴(31)의 요부 사시도이다.6 is a perspective view of main parts of the bonding tool 31 manufactured by the bonding tool manufacturing method according to the exemplary embodiment of the present invention.

도시한 바와같이, 본딩툴(31)의 선단부에 홈(31a)이 형성되어 있고, 또한 상기 홈(31a)의 바닥면(31b)과 본딩툴의 측면인 경사면(11e)의 사이에 곡면부(31c)가 위치하고 있다. 상기 곡면부(31c)는 연삭실(19)을 이용해 원소재(10)의 V홈(14) 주변의 모서리부를 연삭 가공함으로써 얻은 것이다. 상기와 같이 곡면부(31c)를 형성함으로써 종래의 절곡부위(도 1의 Z)가 없어져 본딩공정시 와이어의 절단 현상이 발생하지 않는다.As shown in the figure, a groove 31a is formed at the tip of the bonding tool 31, and a curved portion (3) is formed between the bottom surface 31b of the groove 31a and the inclined surface 11e which is a side surface of the bonding tool. 31c) is located. The curved portion 31c is obtained by grinding a corner portion around the V groove 14 of the raw material 10 using the grinding chamber 19. By forming the curved portion 31c as described above, the conventional bending portion (Z in FIG. 1) is eliminated, and the wire cutting phenomenon does not occur during the bonding process.

즉 도 7에 도시한 바와같이, 본딩툴(31)의 홈(31a)에 와이어(W)를 끼운 상태로 와이어를 기판(R)측으로 가압하는 경우, 가압되는 부위와 가압되지 않는 부위의 사이에 상기한 절곡부위 대신 곡면부(31c)가 위치하므로 와이어가 절단될 염려가 없는 것이다.That is, as shown in FIG. 7, when the wire is pressed toward the substrate R side with the wire W inserted into the groove 31a of the bonding tool 31, between the pressed portion and the unpressed portion. Since the curved portion 31c is positioned instead of the bent portion, there is no fear of cutting the wire.

도 8은 본 발명의 일 실시예에 따른 와이어 본딩툴 제작방법을 정리하여 나타낸 블록도이다.8 is a block diagram illustrating a method of manufacturing a wire bonding tool according to an embodiment of the present invention.

본 실시예에 따른 본딩툴 제작방법은, 길이방향으로 일정단면을 가지는 봉형 원소재(10)를 준비하는 원소재 준비단계(100)로 시작한다. 상기 원소재(10)로는 초경합금을 사용할 수 있다. The method of manufacturing a bonding tool according to the present embodiment starts with a raw material preparation step 100 of preparing a rod-shaped raw material 10 having a predetermined cross section in the longitudinal direction. As the raw material 10, cemented carbide may be used.

상기와 같이 원소재가 준비되었다면 선단면형성단계(102)를 수행한다. 상기 선단면형성단계(102)는 원소재(10)의 일단부 외주면을 연삭 가공함으로써 원소재의 측면에 경사면(11e)을 형성하는 공정이다. 상기 경사면(11e)을 형성하는 이유는 원소재(10)의 일단부를 뾰족하게 하되 선단부에 원소재의 길이방향에 직교하는 평평한 사각 선단면(11a)을 만들기 위한 것이다.When the raw material is prepared as described above, the front end surface forming step 102 is performed. The front end surface forming step 102 is a step of forming an inclined surface 11e on the side surface of the raw material by grinding the outer peripheral surface of one end of the raw material 10. The reason for forming the inclined surface 11e is to make one end of the raw material 10 pointed to make a flat rectangular tip end surface 11a perpendicular to the longitudinal direction of the raw material at the tip.

상기 선단면형성단계(102)의 완료 후 V홈가공단계(104)가 이어진다. 상기 V홈가공단계(104)는 상기 선단면(11a)의 중앙부에 일정폭을 갖는 V홈(14)을 형성하는 과정이다. 상기 V홈(14) 가공은 정밀 연삭방법에 의한다.After completion of the front end surface forming step 102, V groove processing step 104 is continued. The V groove processing step 104 is a process of forming a V groove 14 having a predetermined width in the center of the front end surface (11a). The V groove 14 is processed by a precision grinding method.

상기 과정을 통해 V홈(14)이 형성되었다면 실연삭단계(106)를 통해 상기 곡면부(31c)를 가공한다. 상기 실연삭단계(106)는 연삭실(19)을 V홈(14)에 밀착시킨 상태로 길이방향으로 이동시켜, 상기 V홈 주변의 모서리부 즉 절곡부위(Z)를 둥글게 곡면처리 하는 단계이다.If the V groove 14 is formed through the above process, the curved portion 31c is processed through the actual grinding step 106. The actual grinding step 106 is a step of roundly curved the corners, ie, the bent portion Z, around the V groove by moving the grinding chamber 19 in the longitudinal direction in close contact with the V groove 14. .

상기 실연삭단계(106) 이후 샌딩단계(108)가 이어진다. 상기 샌딩단계(108)는 선택적인 공정으로서, 실연삭단계(106)를 통해 얻은 곡면부(31c)나 홈(31a)의 바닥면(도 6의 31b)을 거칠게 하는 공정이다. 상기 샌딩가공을 통해 가공면(13) 표면의 조도를 높임으로써, 와이어 본딩시 와이어의 미끌림을 방지할 수 있다.The sanding step 108 is followed by the real grinding step 106. The sanding step 108 is an optional process that roughens the curved surface 31c or the bottom surface 31b of FIG. 6 obtained through the real grinding step 106. By increasing the roughness of the surface of the processing surface 13 through the sanding process, it is possible to prevent the sliding of the wire during wire bonding.

이상, 본 발명을 구체적인 실시예를 통하여 상세하게 설명하였으나, 본 발명은 상기 실시예에 한정하지 않고, 본 발명의 기술적 사상의 범위내에서 통상의 지식을 가진 자에 의하여 여러 가지 변형이 가능하다.While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

도 1은 알루미늄 웨지 본딩(Aluminum Wedge Bonding)을 위해 사용되는 종래 와이어 본딩툴의 일 예를 도시한 사시도이다.1 is a perspective view showing an example of a conventional wire bonding tool used for aluminum wedge bonding.

도 2a 및 도 2b는 상기 와이어 본딩툴을 제작하기 위한 종래의 방법 및 그 문제점을 설명하기 위하여 도시한 도면이다.2A and 2B illustrate a conventional method for manufacturing the wire bonding tool and a problem thereof.

도 3은 본 발명의 일 실시예에 따른 와이어 본딩툴 제작방법을 위해 사용되는 장치를 개략적으로 도시한 구성도이다.Figure 3 is a schematic diagram showing an apparatus used for the wire bonding tool manufacturing method according to an embodiment of the present invention.

도 4는 상기 도 3의 화살표 S방향에서 바라본 모습을 도시한 사시도이다.4 is a perspective view illustrating a state viewed from the arrow S direction of FIG. 3.

도 5는 상기 연삭실의 작용을 설명하기 위하여 도시한 도면이다.5 is a view for explaining the operation of the grinding chamber.

도 6은 본 발명의 일 실시예에 따른 본딩툴 제작방법을 통해 제작된 본딩툴의 요부 사시도이다.Figure 6 is a perspective view of the main portion of the bonding tool produced by the bonding tool manufacturing method according to an embodiment of the present invention.

도 7은 상기 도 6에 도시한 본딩툴을 이용해 알루미늄 와이어를 가압할 때의 모습을 나타내 보인 단면도이다7 is a cross-sectional view showing a state when pressing the aluminum wire using the bonding tool shown in FIG.

도 8은 본 발명의 일 실시예에 따른 와이어 본딩툴 제작방법을 정리하여 나타낸 블록도이다.8 is a block diagram illustrating a method of manufacturing a wire bonding tool according to an embodiment of the present invention.

<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>

10:원소재 11:본딩툴10: Raw material 11: bonding tool

11a:선단면 11b:홈11a: End face 11b: Groove

11e:경사면 13:가공면11e: Inclined surface 13: Machined surface

14:V홈 15a,15b:스풀(spool)14: V groove 15a, 15b: Spool

17:지지롤러 19:연삭실17: support roller 19: grinding chamber

21:홀더 31:본딩툴21: holder 31: bonding tool

31a:홈 31b:바닥면31a: groove 31b: bottom

31c:곡면부31c: curved surface

W:와이어 R:기판W: Wire R: Substrate

Z:절곡부위Z: Bending part

Claims (3)

알루미늄 웨지 본딩(Aluminum Wedge Bonding)공정에 사용되는 본딩 툴(bonding tool)을 제작하는 방법으로서,As a method of manufacturing a bonding tool used in the aluminum wedge bonding process, 길이방향으로 일정단면을 가지는 봉형 원소재를 준비하는 준비단계와;Preparing a rod-shaped raw material having a predetermined cross section in the longitudinal direction; 연삭을 통해 상기 원소재의 측부를 깎아 원소재의 선단부(先端部)에, 원소재의 길이방향에 직교하며 평평한 사각형의 형태를 취하는 선단면(先端面)을 형성하는 선단면 형성단계와;A front end surface forming step of cutting the side of the raw material through grinding to form a front end surface having a flat quadrangle shape perpendicular to the longitudinal direction of the raw material at a front end of the raw material; 상기 선단면(先端面)에 V홈을 형성하되, 상기 원소재의 길이방향으로 파여 원소재의 측면방향에서 보았을 때 V자 모양이 되도록 V홈을 형성하는 V홈가공단계와;A V-groove processing step of forming a V-groove on the front end surface, and forming a V-groove to be V-shaped when viewed in the longitudinal direction of the raw material and dug in the longitudinal direction of the raw material; 다이아몬드분말이 함침(含浸)되어 있는 연삭실을 길이방향으로 이동시켜, 상기 V홈의 바닥면과 원소재의 측면이 이어지는 절곡부위를 연삭하여 곡면화 하는 실연삭단계를 포함하는 것을 특징으로 하는 와이어 본딩 툴 제작방법.A wire grinding step of moving the grinding chamber in which the diamond powder is impregnated in the longitudinal direction, and grinding and bending the bent portion where the bottom surface of the V groove and the side surface of the raw material are curved. How to make a bonding tool. 제 1항에 있어서,The method of claim 1, 상기 실연삭단계에 이어지는 공정으로서, 상기 실연삭단계를 통해 얻은 곡면부를 샌딩처리하여 표면조도를 높이는 샌딩단계가 더 포함되는 것을 특징으로 하는 와이어 본딩 툴 제작방법.And a sanding step of increasing a surface roughness by sanding the curved portion obtained through the real grinding step. 제 1항 또는 제 2항에 있어서,The method according to claim 1 or 2, 상기 실연삭단계는; The actual grinding step is; 폴리아미드사, 폴리에스테르사, 아크릴사, 폴리올레핀사, 탄소섬유사, 비닐계섬유사 중 어느 하나에, 100메시(mesh) 내지 10000메시(mesh)의 입도를 갖는 다이아몬드파우더를 함침시킨 실을, 1m/min 내지 500m/min의 속도로 이송시키는 단계인 것을 특징으로 하는 와이어 본딩 툴 제작방법.A yarn in which a diamond powder having a particle size of 100 mesh to 10000 mesh is impregnated into any one of polyamide yarn, polyester yarn, acrylic yarn, polyolefin yarn, carbon fiber yarn and vinyl fiber yarn, Wire bonding tool manufacturing method characterized in that the step of transferring at a speed of 1m / min to 500m / min.
KR1020080125315A 2008-12-10 2008-12-10 Method for manufacturing wire bonding tool KR101042232B1 (en)

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Publication number Priority date Publication date Assignee Title
JP2002289639A (en) 2001-03-26 2002-10-04 Mitsubishi Materials Corp Wedged tool
JP2002289638A (en) 2001-03-26 2002-10-04 Mitsubishi Materials Corp Wedged tool
KR20040010583A (en) * 2001-01-30 2004-01-31 쿨리케 앤드 소파 인베스트먼츠 인코퍼레이티드 Bonding tool with polymer coating
JP2004087822A (en) 2002-08-27 2004-03-18 Mitsubishi Materials Corp Wedge tool

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040010583A (en) * 2001-01-30 2004-01-31 쿨리케 앤드 소파 인베스트먼츠 인코퍼레이티드 Bonding tool with polymer coating
JP2002289639A (en) 2001-03-26 2002-10-04 Mitsubishi Materials Corp Wedged tool
JP2002289638A (en) 2001-03-26 2002-10-04 Mitsubishi Materials Corp Wedged tool
JP2004087822A (en) 2002-08-27 2004-03-18 Mitsubishi Materials Corp Wedge tool

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