JP4046837B2 - 撮像装置 - Google Patents

撮像装置 Download PDF

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Publication number
JP4046837B2
JP4046837B2 JP07644898A JP7644898A JP4046837B2 JP 4046837 B2 JP4046837 B2 JP 4046837B2 JP 07644898 A JP07644898 A JP 07644898A JP 7644898 A JP7644898 A JP 7644898A JP 4046837 B2 JP4046837 B2 JP 4046837B2
Authority
JP
Japan
Prior art keywords
solid
imaging device
regulating member
photoelectric conversion
state imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP07644898A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11261904A (ja
JPH11261904A5 (enExample
Inventor
幸司 石川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP07644898A priority Critical patent/JP4046837B2/ja
Priority to US09/081,931 priority patent/US6654064B2/en
Publication of JPH11261904A publication Critical patent/JPH11261904A/ja
Publication of JPH11261904A5 publication Critical patent/JPH11261904A5/ja
Application granted granted Critical
Publication of JP4046837B2 publication Critical patent/JP4046837B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
JP07644898A 1997-05-23 1998-03-11 撮像装置 Expired - Fee Related JP4046837B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP07644898A JP4046837B2 (ja) 1998-03-11 1998-03-11 撮像装置
US09/081,931 US6654064B2 (en) 1997-05-23 1998-05-21 Image pickup device incorporating a position defining member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07644898A JP4046837B2 (ja) 1998-03-11 1998-03-11 撮像装置

Publications (3)

Publication Number Publication Date
JPH11261904A JPH11261904A (ja) 1999-09-24
JPH11261904A5 JPH11261904A5 (enExample) 2007-03-08
JP4046837B2 true JP4046837B2 (ja) 2008-02-13

Family

ID=13605447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP07644898A Expired - Fee Related JP4046837B2 (ja) 1997-05-23 1998-03-11 撮像装置

Country Status (1)

Country Link
JP (1) JP4046837B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7308195B2 (en) 2002-09-30 2007-12-11 Matsushita Electric Industrial Co., Ltd. Collapsible lens barrel and optical instrument using the same
US7714931B2 (en) * 2004-06-25 2010-05-11 Flextronics International Usa, Inc. System and method for mounting an image capture device on a flexible substrate
JP5173298B2 (ja) * 2007-07-25 2013-04-03 キヤノン株式会社 プリント配線板およびそれを用いた電子機器
JP4921286B2 (ja) 2007-08-24 2012-04-25 キヤノン株式会社 撮像装置および光電変換素子パッケージ保持ユニット
JP5084480B2 (ja) * 2007-12-10 2012-11-28 キヤノン株式会社 光電変換素子ユニット及び撮像装置
JP4898762B2 (ja) * 2008-11-12 2012-03-21 パナソニック株式会社 レンズ鏡筒
JP5225171B2 (ja) 2009-03-27 2013-07-03 キヤノン株式会社 撮像装置
JP2011018954A (ja) 2009-07-07 2011-01-27 Sanyo Electric Co Ltd 撮像装置
JP6301738B2 (ja) * 2014-05-29 2018-03-28 京セラ株式会社 電子素子搭載用パッケージおよび電子装置

Also Published As

Publication number Publication date
JPH11261904A (ja) 1999-09-24

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