JP4026659B2 - 側面発光型発光装置 - Google Patents

側面発光型発光装置 Download PDF

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Publication number
JP4026659B2
JP4026659B2 JP2006013478A JP2006013478A JP4026659B2 JP 4026659 B2 JP4026659 B2 JP 4026659B2 JP 2006013478 A JP2006013478 A JP 2006013478A JP 2006013478 A JP2006013478 A JP 2006013478A JP 4026659 B2 JP4026659 B2 JP 4026659B2
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JP
Japan
Prior art keywords
light
light emitting
emitting device
package
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2006013478A
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English (en)
Japanese (ja)
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JP2006128719A (ja
JP2006128719A5 (enExample
Inventor
英夫 朝川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2006013478A priority Critical patent/JP4026659B2/ja
Publication of JP2006128719A publication Critical patent/JP2006128719A/ja
Publication of JP2006128719A5 publication Critical patent/JP2006128719A5/ja
Application granted granted Critical
Publication of JP4026659B2 publication Critical patent/JP4026659B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2006013478A 2002-09-05 2006-01-23 側面発光型発光装置 Expired - Lifetime JP4026659B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006013478A JP4026659B2 (ja) 2002-09-05 2006-01-23 側面発光型発光装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002259482 2002-09-05
JP2003133874 2003-05-13
JP2006013478A JP4026659B2 (ja) 2002-09-05 2006-01-23 側面発光型発光装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2003303932A Division JP3991961B2 (ja) 2002-09-05 2003-08-28 側面発光型発光装置

Publications (3)

Publication Number Publication Date
JP2006128719A JP2006128719A (ja) 2006-05-18
JP2006128719A5 JP2006128719A5 (enExample) 2006-10-05
JP4026659B2 true JP4026659B2 (ja) 2007-12-26

Family

ID=36722979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006013478A Expired - Lifetime JP4026659B2 (ja) 2002-09-05 2006-01-23 側面発光型発光装置

Country Status (1)

Country Link
JP (1) JP4026659B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009059870A (ja) * 2007-08-31 2009-03-19 Sanyo Electric Co Ltd 発光モジュールおよびその製造方法
JP4683053B2 (ja) 2008-01-28 2011-05-11 日亜化学工業株式会社 射出成形用金型及びこれによって成形される半導体パッケージ並びに半導体パッケージの製造方法
CN101939858B (zh) * 2008-02-08 2013-02-13 日亚化学工业株式会社 发光装置
KR101562773B1 (ko) * 2008-09-17 2015-10-22 서울반도체 주식회사 사이드뷰 ｌｅｄ 패키지 및 그것의 몸체를 성형하기 위한 금형 세트 및 방법
JP6229479B2 (ja) 2013-12-18 2017-11-15 豊田合成株式会社 面状光源および発光素子の製造方法
JP6544076B2 (ja) * 2014-12-26 2019-07-17 日亜化学工業株式会社 発光装置

Also Published As

Publication number Publication date
JP2006128719A (ja) 2006-05-18

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