JP4024544B2 - Ceramic electronic parts firing setter - Google Patents
Ceramic electronic parts firing setter Download PDFInfo
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- JP4024544B2 JP4024544B2 JP2002013912A JP2002013912A JP4024544B2 JP 4024544 B2 JP4024544 B2 JP 4024544B2 JP 2002013912 A JP2002013912 A JP 2002013912A JP 2002013912 A JP2002013912 A JP 2002013912A JP 4024544 B2 JP4024544 B2 JP 4024544B2
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/62222—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic coatings
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/87—Ceramics
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
- C04B2235/9623—Ceramic setters properties
Description
【０００１】
【発明の属する技術分野】
本発明は、セラミックコンデンサー、圧電素子、フェライト等のセラミックス電子部品を焼成する際に使用するセッターに関するものである。
【０００２】
【従来の技術】
セラミックス電子部品焼成用セッターは、焼成によりセラミックス質の電子部品を作製する際に、被焼成体（焼成後に電子部品となるものである。以下、同様である。）を載置する部材であり、焼成工程の自動化が進んだ今日では、焼成後、当該セッターを傾斜して、焼成後のセラミック電子部品を所定の位置に収集することが行われている。
【０００３】
また、当該セッターにあっては、焼成の際に、その構成成分が被焼成体に作用して製品を劣化させないこと、更には、被焼成体中のバインダーが、当該セッターの載置面によりその揮発を抑制されることで、焼成ムラを生じさせないことが重要な特性として要求される。
【０００４】
従来、このような特性に着目したセッター等としては、基材表面に、溶射層を形成した治具（特公平４−２１３３０号公報）、更には、基材表面に、溶射層を有し、被焼成体を載置する面の表面粗さを、十点平均粗さで１５０〜１０００μｍとした電子部品焼成用治具（特開２００１−２００３７８公報）が開示されている。
【０００５】
これらの治具は、基材表面に形成された溶射層により、被焼成体との反応が防止されるものである。また、後者の治具は、所定の表面粗さを有する溶射層により、被焼成体との接触面積が小さくなっているため、被焼成体中のバインダーが、治具の存在により何ら抑制されずに揮発し、均一な焼成体が得られるものである。
【０００６】
しかし、これらの治具は、表面粗さが比較的粗いものにあっては、焼成後、当該セッターを傾斜等しても、被焼成体が、治具表面の凹部に引っ掛かって、そのままセッターに残存してしまうことがあった。このため、一度焼成された電子部品が、更に焼成工程に供されてしまう等、自動化にあたっての問題の一つとなっていた。特に、近年、セラミックコンデンサーにあっては、益々、微小化が進み、１．６ｍｍ×０．８ｍｍ、１．０ｍｍ×０．５ｍｍなどのものから０．６ｍｍ×０．３ｍｍのものへと主要サイズが移行してきており、従来の治具を用いてこのサイズのセラミックコンデンサーを焼成した場合には、高率で治具表面の凹部に引っ掛かってしまうのが現状であった。
【０００７】
【発明が解決しようとする課題】
本発明は、上述の問題に鑑みなされたものであり、焼成時に構成成分が被焼成体と反応することがなく、かつ被焼成体中のバインダーを、セッター載置面側からも容易に揮発して、均一な焼成体を得ることができ、更に自動化された焼成工程で、焼成後の製品を収集する際に、収集不良がないセラミックス電子部品焼成用セッターを提供することを目的とする。
【０００８】
【課題を解決するための手段】
すなわち、本発明によれば、基材表面に、コート層を有するセラミックス電子部品焼成用セッターであって、コート層が、算術平均粗さ（Ｒａ）で、被焼成体の厚さに対し、１／２０〜１／６５の表面粗さを有するとともに、コート層が中間層と表層とで構成され、表層が溶射により形成されたＺｒＯ ２ 質層であることを特徴とするセラミックス電子部品焼成用セッターが提供される。
【０００９】
また、本発明によれば、基材表面に、コート層を有するセラミックス電子部品焼成用セッターであって、コート層が、十点平均表面粗さ（Ｒｚ）で、被焼成体の厚さに対して１／３．５〜１／１１．０、かつ凸凹の平均間隔（Ｓｍ）で、被焼成体の長さに対して１／１．３〜１／１０．０の表面粗さを有するとともに、コート層が中間層と表層とで構成され、表層が溶射により形成されたＺｒＯ ２ 質層であることを特徴とするセラミックス電子部品焼成用セッターが提供される。
【００１０】
ここで、算術平均粗さ（Ｒａ）、及び十点平均表面粗さ（Ｒｚ）は、いずれもＪＩＳ規格Ｂ０６０１に準じて、評価長さ１２．５ｍｍ、カットオフ値２．５ｍｍとして測定した値をいい、凸凹の平均間隔（Ｓｍ）は、ＪＩＳ規格Ｂ０６０１に準じて、評価長さ４．０ｍｍ、基準長さ０．８ｍｍとして測定した値をいう。
【００１１】
本発明において、０．６ｍｍ（長さ）×０．３ｍｍ（厚さ）の被焼成体への対応を可能とするためには、前者のセラミックス電子部品焼成用セッターでは、当該コート層の表面粗さが、算術平均粗さ（Ｒａ）で、５〜１５μｍであることが好ましく、後者のセラミックス電子部品焼成用セッターでは、当該コート層の表面粗さが、十点平均表面粗さ（Ｒｚ）で２７〜８６μｍ、かつ凸凹の平均間隔（Ｓｍ）で６０〜４６１μｍであることが好ましい。
【００１２】
本発明においては、このような表面粗さのコート層を、表層単独で形成してもよいが、中間層と表層とで構成し、実質的に、当該中間層の表面粗さにより、コート層の表面粗さを規定しているものが好ましい。この際、中間層の表面粗さは、コート層の表面粗さに対して、算術平均粗さ（Ｒａ）で、０．３〜２．４倍の範囲で制御されていることが好ましい。また、中間層の表面粗さは、算術平均粗さ（Ｒａ）で、５〜２０μｍであることが好ましく、特に、０．６ｍｍ（長さ）×０．３ｍｍ（厚さ）の被焼成体への対応を可能とするためには、算術平均粗さ（Ｒａ）で、５〜１５μｍとすることがより好ましい。
【００１３】
なお、このように中間層の表面粗さでコート層の表面粗さを制御するには、表層の平均厚さが、２０〜２００μｍであることが好ましい。
【００１４】
本発明によるセラミックス電子部品焼成用セッターは、上述の如く、コート層の表面粗さが、算術平均粗さ（Ｒａ）で、被焼成体の厚さの１／２０〜１／６５であり、或いは、十点平均表面粗さ（Ｒｚ）で、被焼成体の厚さの１／３．５〜１／１１．０、かつ凸凹の平均間隔（Ｓｍ）で、被焼成体の長さの１／１．３〜１／１０．０であるため、焼成時に当該セッターの構成成分が被焼成体と反応することがないのは勿論、被焼成体中のバインダーが、被焼成体の載置面から容易に揮発され、均一な焼成体が得られるとともに、焼成後、当該セッターを傾斜等してセラミックス電子部品を収集する際に、総ての電子部品をセッター凹部に引っ掛けることなくスムーズに収集することができる。
【００１５】
【発明の実施の形態】
以下、本発明の実施形態を具体的に説明する。
本発明のセラミックス電子部品焼成用セッター（以下、単に「セッター」と省略することがある。）は、基材表面に、コート層を有するものであり、このコート層が、特定範囲の表面粗さを有するとともに、コート層が中間層と表層とで構成され、表層が溶射により形成されたＺｒＯ ２ 質層であるものである。以下、各構成要素毎に、具体的に説明する。
【００１６】
本発明における基材は、その材質について特に制限はなく、セッターとして通常適用されるセラミックスで構成させればよい。また、基材を作製する方法についても特に制限はなく、例えば、セラミックス化原料を、プレス等で成形後、焼成して作製することができる。
【００１７】
次に、本発明におけるコート層は、その表面粗さが、算術平均粗さ（Ｒａ）で、被焼成体の厚さの１／２０〜１／６５、好ましくは被焼成体の厚さの１／２５〜１／６２である。
【００１８】
コート層の表面粗さが、算術平均粗さ（Ｒａ）で、被焼成体の厚さの１／６５未満であると、被焼成体中のバインダーの揮発を抑制して、均一な焼成体が得られず、場合によっては、セッターの構成成分が被焼成体と反応してしまうこともある。一方、コート層の表面粗さが、算術平均粗さ（Ｒａ）で、被焼成体の厚さの１／２０を超えると、焼成後の電子部品をセッターの傾斜等で収集する際に、載置面の凹部に、電子部品が引っ掛かり、そのまま残置されるものが多くなる。
【００１９】
具体的には、例えば、１．６ｍｍ（長さ）×０．８ｍｍ（厚さ）のサイズの電子部品を製造する場合には、コート層の表面粗さが、算術平均粗さ（Ｒａ）で、１２〜４０μｍであることが好ましい。また、例えば、１．０ｍｍ（長さ）×０．５ｍｍ（厚さ）のサイズ等の如く、１．６ｍｍ（長さ）×０．８ｍｍ（厚さ）未満のサイズの電子部品を製造する場合には、コート層の表面粗さが、算術平均粗さ（Ｒａ）で、５〜２０μｍであることが好ましい。特に、最近、主要サイズに移行しつつある０．６ｍｍ（長さ）×０．３ｍｍ（厚さ）のサイズのセラミックスコンデンサーを製造する場合にあっては、コート層の表面粗さが、算術平均粗さ（Ｒａ）で、５〜１５μｍであることが好ましい。因みに、従来のセッターでは、このサイズの電子部品には全く対応しておらず、焼成の自動化を妨げる要因となっていたことは既に述べたところである。
【００２０】
本発明におけるコート層は、その表面粗さが、十点平均表面粗さ（Ｒｚ）で、被焼成体の厚さの１／３．５〜１／１１．０、かつ凸凹の平均間隔（Ｓｍ）で、被焼成体の長さの１／１．３〜１／１０．０であることも好ましく、十点平均表面粗さ（Ｒｚ）で、被焼成体の厚さの１／４．０〜１／１０．０、かつ凸凹の平均間隔（Ｓｍ）で、被焼成体の長さの１／１．５〜１／８．５であることがより好ましい。
【００２１】
コート層の表面粗さが、十点平均表面粗さ（Ｒｚ）で、被焼成体の厚さの１／１１．０未満であると、被焼成体とセッター間で、充分な空間が確保できないため、バインダーの揮発が抑制され、焼成ムラを生じ易くなる。一方、コート層の表面粗さが、十点平均表面粗さ（Ｒｚ）で、被焼成体の厚さの１／３．５を超えると、焼成後の電子部品をセッターの傾斜等で収集する際に、載置面の凹部に、電子部品が引っ掛かり、そのまま残置されるものが多くなる。
【００２２】
また、コート層の表面粗さが、凸凹の平均間隔（Ｓｍ）で、被焼成体の長さの１／１０．０未満、又は１／１．３超過であると、被焼成体とセッター間で、充分な空間が確保できないため、バインダーの揮発が抑制され、焼成ムラを生じ易くなる。
【００２３】
具体的には、例えば、最近、主要サイズに移行しつつある０．６ｍｍ（長さ）×０．３ｍｍ（厚さ）のサイズのセラミックスコンデンサーを製造する場合にあっては、コート層の表面粗さが、十点平均表面粗さ（Ｒｚ）で、２７〜８６μｍかつ凸凹の平均間隔（Ｓｍ）で、６０〜４６１μｍであることが好ましい。
【００２４】
次に、コート層は、基材の載置部分を被覆するものであればよいが、焼成時に炉内のガスと基材との反応が生じると、基材が変形する危険性があるので、その他の部分についてもコート層を形成しておくことが好ましい。
【００２５】
また、コート層としては、中間層と表層とからなるものが好ましい。
もっとも、コート層を中間層と表層とで構成する場合には、実質的に、中間層の表面粗さにより、コート層の表面粗さを規定しているものが好ましい。
このようなコート層では、コート層の表層が溶射により形成されたＺｒＯ ２ 質層であることが重要であり、例えば、溶射として、上述した所望の表面粗さを得難いガスプラズマ溶射を用いることがより好ましい。
【００２６】
また、この場合には、中間層の表面粗さを、コート層の表面粗さに対して、算術平均粗さ（Ｒａ）で、０．３〜２．４倍とすることが好ましく、０．５〜２．０倍とすることがより好ましい。
【００２７】
中間層の表面粗さが、コート層の表面粗さに対して、この範囲の算術平均粗さ（Ｒａ）であると、表層の厚さが略均一となり、コート層の劣化が均一に発生するため、当該表層が剥離し難くなる。
【００２８】
具体的には、被焼成体のサイズ毎に、前述したコート層の表面粗さと略同一の表面粗さとすることが好ましく、例えば、０．６ｍｍ（長さ）×０．３ｍｍ（厚さ）より大きなサイズのセラミックスコンデンサーを製造する場合にあっては、中間層の表面粗さを、算術平均粗さ（Ｒａ）で、５〜２０μｍとすることが好ましい。また、０．６ｍｍ（長さ）×０．３ｍｍ（厚さ）のサイズのセラミックスコンデンサーを製造する場合にあっては、中間層の表面粗さを、算術平均粗さ（Ｒａ）で、５〜１５μｍとすることが好ましい。
【００２９】
また、コート層を中間層と表層とで構成する場合には、表層の平均厚さを、２０〜２００μｍとすることが好ましく、２０〜１００μｍとすることがより好ましい。表層の平均厚さが２０μｍ未満では、中間層の一部に表層が付着せずに、中間層が露出する場合があり、セッターの構成成分が被焼成体と反応し易くなる。一方、表層の平均厚さが２００μｍを超えると、中間層の表面粗さにより、コート層の表面粗さを制御することが困難になる。なお、中間層の厚さについては、特に制限はないが、７０〜３００μｍ程度で形成することが好ましい。
【００３１】
本発明においてコート層を中間層と表層とで構成する場合は、当該表層については、粗面化を伴わない溶射により形成することが、精度よく平均厚さ２０〜２００μｍの層を形成させるために、重要である。また、当該中間層については、例えば、スプレーコーティング、又は粗面化を伴う溶射により形成すればよい。
【００３３】
溶射としては、例えば、加熱の方法により燃焼炎を用いるガス溶射、アークを用いるアーク溶射、プラズマジェットを用いるプラズマ溶射等を挙げることができるが、精度よく平均厚さ２０〜２５０μｍの層が形成できる点で、プラズマ溶射により表層を形成することが好ましい。また、プラズマ溶射としては、水安定化プラズマ溶射、ガスプラズマ溶射等を挙げることができ、水安定化プラズマ溶射は、中間層に対して密着性の高い表層を形成することができる点で好ましく、ガスプラズマ溶射は、平均厚さ２０〜５０μｍ程度まで、表層を薄層化でき、中間層の表面粗さを、載置面の表面粗さに、より直接的に反映できる点で好ましい。
【００３４】
なお、本発明において、中間層及び表層の材質については特に制限はなく、セッターに通常コートされるもので構成させればよい。
【００３５】
【実施例】
以下、本発明を実施例に基づいて、より具体的に説明する。但し、本発明はこれらの実施例に何ら限定されるものではない。
【００３６】
（評価方法）
▲１▼ 表面粗さ
算術平均粗さ（Ｒａ）、十点平均表面粗さ（Ｒｚ）、凸凹の平均間隔（Ｓｍ）について評価した。評価は、ＪＩＳ規格Ｂ０６０１に準じて行い、算術平均粗さ（Ｒａ）、及び十点平均表面粗さ（Ｒｚ）は、いずれも、評価長さ１２．５ｍｍ、カットオフ値２．５ｍｍとして測定し、凸凹の平均間隔（Ｓｍ）は、評価長さ４．０ｍｍ、基準長さ０．８ｍｍとして測定した。
【００３７】
▲２▼ 厚み比率（１）
寸法が０．６ｍｍ（長さ）×０．３ｍｍ（厚さ）のものを被焼成体とした際の、被焼成体の厚さに対する各実施例及び各比較例におけるセッターの算術平均粗さ（Ｒａ）の比を示した。
【００３８】
▲３▼ 厚み比率（２）
寸法が０．６ｍｍ（長さ）×０．３ｍｍ（厚さ）のものを被焼成体とした際の、被焼成体の厚さに対する各実施例及び各比較例におけるセッターの十点平均表面粗さ（Ｒｚ）の比を示した。
【００３９】
▲４▼ 長さ比率
寸法が０．６ｍｍ（長さ）×０．３ｍｍ（厚さ）のものを被焼成体とした際の、被焼成体の長さに対する各実施例及び比較例におけるセッターの凸凹の平均間隔（Ｓｍ）の比を示した。
【００４０】
▲５▼ 引っ掛かり頻度
チタン酸バリウムを原料として、寸法が０．６ｍｍ（長さ）×０．３ｍｍ（厚さ）で、市販のセラミックスコンデンサーと同形状の試料を作製した。そして、この試料を、５０００個、各実施例及び各比較例で得られたセッターに載置した後、当該セッターを３０°傾斜させた状態で振動を加え、試料の移動、収集状態を観察して評価した。
評価は、総ての試料が、コート層の凹部に引っ掛かることなく、すべて収集された場合を○、一部の試料で、引っ掛かりながらもすべて収集された場合を△、引っ掛かりがありすべての試料が収集できなかった場合を×として評価した。
【００４１】
▲６▼ バインダー揮発性
チタン酸バリウムを主原料とし、バインダーとしてアクリル系バインダー３０％を含有する原料を用い、ドクターブレード法にてシートを作製し、次いで、圧着、切断して、０．６ｍｍ（長さ）×０．３ｍｍ（厚さ）のサイズで、市販のセラミックスコンデンサーと同形状としたものを試料として作製した。そして、この試料を、各実施例及び比較例で得られたセッターに載置し、Ｎ2雰囲気下で、３００℃で２時間加熱し、加熱前後で減量した重量にて、揮発したバインダー量を評価した。
評価は、理論上の重量減量を１００％として、１００〜８０％を○、８０〜５０％を△、５０％以下を×として評価した。
【００４２】
▲７▼ 剥離性
各実施例及び各比較例で得られたセッターに誘電体であるチタン酸バリウム溶液を塗布した後、１３５０℃、２時間の焼成を５回繰り返し、基材からコート層が剥離しているかを確認した。
評価は、まったくコート層の剥離が認められないものを○、コート層の２０％以下の部分に剥離が認められるのものを△、コート層の２０％以上の部分で剥離が認められるのものを×として評価した。
【００４３】
▲８▼ 表層付着性
中間層及び表層を形成した各実施例及び各比較例のセッターを切断して、切断面を顕微鏡で観察し、未着部分の無い場合を○、未着部分の有る場合を×として評価した。
【００４４】
▲９▼ 中間層によるコート層の表面粗さに対する制御性
中間層と、コート層（表層）とについて、算術平均算術平均粗さ（Ｒａ）を測定し、中間層の算術平均算術平均粗さ（Ｒａ）が、コート層（表層）の算術平均算術平均粗さ（Ｒａ）に対して、０．３〜２．４倍である場合を○、それ以外の場合を×として評価した。
【００４５】
（実施例１）
基材としては、Ａｌ2Ｏ3含有量が８０質量％、ＳｉＯ2が１９質量％、その他の材料が１質量％からなる材料をプレス成形した後、焼成して、Ａｌ2Ｏ3−ＳｉＯ2質で、サイズが縦１５０ｍｍ×横１５０ｍｍ×厚さ５ｍｍの板状体のものを作製した。
【００４６】
次いで、平均粒径２μｍのＡｌ2Ｏ3６０質量％と、平均粒径２０μｍのＡｌ2Ｏ3４０質量％とを混合して固形成分を調製した後、水３０質量部に対して、この固形成分６７質量部と、バインダー３質量部とを含有させてスラリーを調製した。そして、このスラリーを、基材の表面に、スプレーガンを用いて、空気圧５ｋｇ／ｃｍ2でスプレーコーティングした後、１４５０℃で２時間焼付け処理を行い、Ａｌ2Ｏ3質で、厚さ１００μｍ、算術平均算術平均粗さ（Ｒａ）５μｍの中間層を形成した。
【００４７】
次いで、この基材の表面に、平均粒径８０μｍのジルコニア粒子を用いてプラズマ溶射し、ＺｒＯ2質で、厚さ１００μｍ、算術平均算術平均粗さ（Ｒａ）１５μｍの表層を形成して、セラミックス電子部品用セッターを製造した。特性及び評価については、表１にまとめて示す。
【００４８】
（実施例２〜４及び比較例１〜３）
それぞれ、平均粒径６０μｍ、５０μｍ、４０μｍ、１１０μｍ、８０μｍ、又は３０μｍのジルコニア粒子を用いてプラズマ溶射を行い、それぞれ、算術平均算術平均粗さ（Ｒａ）１２μｍ、８μｍ、５μｍ、２０μｍ、１６μｍ、又は４μｍの表層を形成したこと以外は、実施例１と同様にして、セッターを製造した。特性及び評価については、表１にまとめて示す。
【００４９】
（評価）
表１に示すように、算術平均粗さ（Ｒａ）が、５〜１５μｍの範囲で、厚み比率（１）が、１／２０．０〜１／６０．０の実施例１〜４のセラミックス電子部品用セッターでは、当該セッターを３０°傾斜させると、載置した試料が総てスムーズに収集され、バインダーの揮発性も良好であった。
【００５０】
これに対して、算術平均粗さ（Ｒａ）が、それぞれ２０μｍ、１６μｍで、厚み比率（１）が、それぞれ１／１５．０、１／１８．８と大きな比較例１、２のセラミックス電子部品用セッターでは、バインダーの揮発性がいずれも良好であったものの、当該セッターを３０°傾斜させると、載置した試料が高率で引っ掛かった。また、算術平均粗さ（Ｒａ）が４μｍで、厚み比率（１）が１／７５．０と小さな比較例３のセラミックス電子部品用セッターでは、当該セッターを３０°傾斜させると、載置した試料が総てスムーズに収集されるものの、バインダーの揮発性については、重量減量が８０％未満のものが認められた。
【００５１】
【表１】
（実施例５〜１０及び比較例４〜７）
それぞれ、平均粒径５０μｍのジルコニア粒子を用いて、溶射ガンと基材との距離を調整してプラズマ溶射を行うことにより、それぞれ所定の表面粗さの表層としたこと以外は、実施例１と同様にして、セッターを製造した。
【００５３】
（評価）
表２に示すように、厚み比率（２）が、１／４．０〜１／１０．０であり、長さ比率が、１／１．５〜１／８．０である実施例５〜１０のセラミックス電子部品用セッターでは、当該セッターを３０°傾斜させると、載置した試料が総てスムーズに収集され、バインダーの揮発性も良好であった。
【００５４】
これに対して、厚み比率（２）が、１／７．０であるものの、長さ比率が、１／１．２と大きな比較例４、及び長さ比率が、１／１２．０と小さな比較例５のセラミックス電子部品用セッターでは、いずれも、当該セッターを３０°傾斜させると、載置した試料が総てスムーズに収集されたものの、バインダーの揮発性については、殆どの試料で重量減量が５０％以下であった。
【００５５】
また、長さ比率が、１／３．０であるものの、厚み比率（２）が、１／３．０と大きな比較例６のセラミックス電子部品用セッターでは、バインダーの揮発性が良好であったものの、当該セッターを３０°傾斜させると、載置した試料が高率で引っ掛かった。また、長さ比率が、１／３．０であるものの、厚み比率が、１／１２．０と小さな比較例７のセラミックス電子部品用セッターでは、当該セッターを３０°傾斜させると、載置した試料が総てスムーズに収集されたものの、バインダーの揮発性については、殆どの試料で重量減量が５０％以下であった。
【００５６】
【表２】
（実施例１１〜１４及び比較例８〜１０）
中間層を形成した基材に、それぞれ、平均粒径３０μｍ、５０μｍ、６０μｍ、９０μｍ、２５μｍ、１２０μｍ、又は１５０μｍのジルコニア粒子を用いて、プラズマ溶射し、それぞれ、算術平均粗さ（Ｒａ）２．５μｍ、８．０μｍ、１０．０μｍ、１６μｍ、１．５μｍ、１７．０μｍ、又は２０．０μｍの表層を形成して、セラミックス電子部品用セッターを製造したこと以外は、実施例１と同様にして、セッターを製造した。
【００５８】
（評価）
表３に示すように、表面粗さ比が、０．３１３〜２．３８１である実施例１１〜１４のセラミックス電子部品用セッターでは、コート層の剥離がまったく認められなかった。
【００５９】
これに対して、表面粗さ比が、３．３３３と大きな比較例８及び表面粗さ比が、０．２９４と比較的小さな比較例９のセラミックス電子部品用セッターでは、コート層の一部に剥離が認められた。また、表面粗さ比が、０．２５０と更に小さな比較例１０のセラミックス電子部品用セッターでは、コート層の殆どの部分で剥離が認められた。
【００６０】
【表３】
（実施例１５〜１８及び比較例１１、１２）
まず、平均粒径２μｍのＡｌ2Ｏ3６０質量％と、平均粒径２０μｍのＡｌ2Ｏ3４０質量％とを混合して固形成分を調製した後、水２５質量部に対して、この固形成分７２質量部と、バインダー３質量部とを含有させてスラリーを調製した。次いで、実施例１と同様にして作製した基材表面に、このスラリーを、実施例１と同様にして、スプレーコーティング、更には焼付け処理を行い、算術平均算術平均粗さ（Ｒａ）２０．０μｍの中間層を形成した。
次いで、この基材の表面に、平均粒径１１０μｍのジルコニア粒子を用いて、プラズマ溶射し、ＺｒＯ2質の表層を、それぞれ厚さ２０．０μｍ、５０．０μｍ、１００．０μｍ、２００．０μｍ、１５．０μｍ、又は２５０．０μｍで形成して、セラミックス電子部品用セッターを製造した。
【００６２】
（評価）
表４に示すように、表層厚さが、２０．０〜２００．０μｍである実施例１５〜１８のセラミックス電子部品用セッターでは、中間層と表層との間に、未着部分はまったく認められず、中間層の算術平均算術平均粗さ（Ｒａ）が、コート層（表層）の算術平均算術平均粗さ（Ｒａ）に対して、０．３〜２．４倍の範囲内にあった。
【００６３】
これに対して、表層厚さが、１５．０μｍである比較例１１のセラミックス電子部品用セッターでは、中間層と表層との間に、一部で未着部分が認められた。また、表層厚さが、２５０．０μｍである比較例１２のセラミックス電子部品用セッターでは、コート層（表層）と中間層との算術平均算術平均粗さ（Ｒａ）の較差が大きく、中間層によるコート層の表面粗さの制御が不充分であった。
【００６４】
【表４】
【発明の効果】
以上説明した通り、本発明のセラミックス電子部品焼成用セッターによれば、焼成時に構成成分が被焼成体と反応することがないばかりか、被焼成体中のバインダーの揮発を抑制することがなく、均一な焼成体を得ることができる。加えて、自動化された焼成工程で、焼成後の製品を収集する際に、何ら収集不良がなく、焼成自動化への対応が可能となる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a setter for use in firing ceramic electronic components such as ceramic capacitors, piezoelectric elements, and ferrite.
[0002]
[Prior art]
The setter for firing a ceramic electronic component is a member on which a body to be fired (which becomes an electronic component after firing. The same applies hereinafter.) When producing a ceramic electronic component by firing. In today's automating firing process, after firing, the setter is tilted and the fired ceramic electronic components are collected at a predetermined position.
[0003]
Further, in the setter, during firing, its constituent components do not act on the body to be fired to deteriorate the product, and further, the binder in the body to be fired may be lowered by the mounting surface of the setter. By suppressing volatilization, it is required as an important characteristic not to cause firing unevenness.
[0004]
Conventionally, as a setter or the like focusing on such characteristics, a jig (Japanese Patent Publication No. 4-21330) in which a thermal spray layer is formed on the surface of the base material, and further, a thermal spray layer is provided on the base material surface, An electronic component firing jig (Japanese Patent Laid-Open No. 2001-200378) is disclosed in which the surface roughness of the surface on which the body to be fired is placed has a 10-point average roughness of 150 to 1000 μm.
[0005]
These jigs prevent the reaction with the object to be fired by the sprayed layer formed on the surface of the substrate. Moreover, since the latter jig | tool has a contact area with a to-be-fired body by the thermal spray layer which has predetermined | prescribed surface roughness, the binder in a to-be-fired body is not suppressed at all by presence of a jig | tool. It is volatilized to obtain a uniform fired body.
[0006]
However, if these jigs have a relatively rough surface, even if the setter is tilted after firing, the object to be fired is caught in the recesses on the jig surface, and the setter is used as it is. Sometimes it remained. For this reason, the electronic component once fired has been one of the problems in automation, such as being further subjected to a firing process. In particular, in recent years, ceramic capacitors have been increasingly miniaturized, and major sizes from 1.6 mm x 0.8 mm, 1.0 mm x 0.5 mm, etc. to 0.6 mm x 0.3 mm. However, when a ceramic capacitor of this size is fired using a conventional jig, it has been caught at a recess on the jig surface at a high rate.
[0007]
[Problems to be solved by the invention]
The present invention has been made in view of the above-described problems. The component does not react with the object to be fired during firing, and the binder in the object to be fired easily volatilizes from the setter mounting surface side. An object of the present invention is to provide a ceramic electronic component firing setter that can obtain a uniform fired body and has no collection failure when the fired product is collected by an automated firing process.
[0008]
[Means for Solving the Problems]
That is, according to the present invention, a ceramic electronic component firing setter having a coating layer on the surface of the substrate, the coating layer having an arithmetic average roughness (Ra) of 1 to the thickness of the body to be fired. A setter for firing a ceramic electronic component having a surface roughness of / 20 to 1/65 , a coating layer comprising an intermediate layer and a surface layer, and the surface layer being a ZrO 2 layer formed by thermal spraying Is provided.
[0009]
Further, according to the present invention, there is provided a setter for firing a ceramic electronic component having a coat layer on the surface of the substrate, the coat layer having a ten-point average surface roughness (Rz) with respect to the thickness of the object to be fired. in Te 1 / 3.5 to 1 / 11.0 and an average interval of irregularities, (Sm), and has a surface roughness of 1 / 1.3 to / 10.0 with respect to the length of the object to be fired There is provided a setter for firing a ceramic electronic component, characterized in that the coat layer is composed of an intermediate layer and a surface layer, and the surface layer is a ZrO 2 layer formed by thermal spraying .
[0010]
Here, the arithmetic average roughness (Ra) and the ten-point average surface roughness (Rz) are both values measured as an evaluation length of 12.5 mm and a cutoff value of 2.5 mm in accordance with JIS standard B0601. The average irregularity spacing (Sm) is a value measured as an evaluation length of 4.0 mm and a reference length of 0.8 mm in accordance with JIS standard B0601.
[0011]
In the present invention, in order to make it possible to cope with a fired body of 0.6 mm (length) × 0.3 mm (thickness), the former setter for firing ceramic electronic parts uses the surface roughness of the coat layer. The arithmetic average roughness (Ra) is preferably 5 to 15 μm. In the latter ceramic electronic component firing setter, the surface roughness of the coating layer is the ten-point average surface roughness (Rz). It is preferable that it is 60-461 micrometers by 27-86 micrometers and the average space | interval (Sm) of unevenness.
[0012]
In the present invention, the coating layer having such a surface roughness may be formed as a single surface layer. However, the coating layer is composed of an intermediate layer and a surface layer, and substantially depends on the surface roughness of the intermediate layer. It is preferable to define the surface roughness. Under the present circumstances, it is preferable that the surface roughness of an intermediate | middle layer is controlled in the range of 0.3-2.4 times by arithmetic mean roughness (Ra) with respect to the surface roughness of a coating layer. Further, the surface roughness of the intermediate layer is preferably an arithmetic average roughness (Ra) of 5 to 20 μm, and particularly to a fired body of 0.6 mm (length) × 0.3 mm (thickness). In order to enable this, it is more preferable that the arithmetic average roughness (Ra) is 5 to 15 μm.
[0013]
In addition, in order to control the surface roughness of the coat layer by the surface roughness of the intermediate layer, the average thickness of the surface layer is preferably 20 to 200 μm.
[0014]
In the ceramic electronic component firing setter according to the present invention, as described above, the surface roughness of the coating layer is an arithmetic average roughness (Ra) and is 1/20 to 1/65 of the thickness of the body to be fired, or The ten-point average surface roughness (Rz) is 1 / 3.5 to 1 / 11.0 of the thickness of the body to be fired, and the unevenness average interval (Sm) is 1 / of the length of the body to be fired. Since it is 1.3 to 1 / 10.0, the component of the setter does not react with the body to be fired during firing, and the binder in the body to be fired is from the mounting surface of the body to be fired. Easily volatilized and a uniform fired body can be obtained, and after firing, when collecting ceramic electronic parts by tilting the setter, etc., all electronic parts should be collected smoothly without being caught in the setter recess. Can do.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be specifically described.
The setter for firing ceramic electronic parts of the present invention (hereinafter sometimes simply referred to as “setter”) has a coating layer on the surface of the substrate, and this coating layer has a surface roughness within a specific range. The coating layer is composed of an intermediate layer and a surface layer, and the surface layer is a ZrO 2 layer formed by thermal spraying . Hereinafter, each component will be specifically described.
[0016]
There is no restriction | limiting in particular about the base material in this invention, What is necessary is just to comprise with the ceramics normally applied as a setter. Moreover, there is no restriction | limiting in particular also about the method of producing a base material, For example, after forming a ceramic raw material with a press etc., it can produce by baking.
[0017]
Next, the surface roughness of the coat layer in the present invention is an arithmetic average roughness (Ra) and is 1/20 to 1/65 of the thickness of the body to be fired, preferably 1 of the thickness of the body to be fired. / 25 to 1/62.
[0018]
When the surface roughness of the coat layer is an arithmetic average roughness (Ra) and less than 1/65 of the thickness of the body to be fired, volatilization of the binder in the body to be fired is suppressed, and a uniform fired body is obtained. In some cases, the components of the setter may react with the object to be fired. On the other hand, when the surface roughness of the coat layer is an arithmetic average roughness (Ra) and exceeds 1/20 of the thickness of the object to be fired, when the electronic parts after firing are collected by the inclination of the setter, etc. An electronic component is caught in the concave portion of the placement surface, and many of the electronic components are left as they are.
[0019]
Specifically, for example, when an electronic component having a size of 1.6 mm (length) × 0.8 mm (thickness) is manufactured, the surface roughness of the coat layer is expressed by an arithmetic average roughness (Ra). It is preferable that it is 12-40 micrometers. In addition, for example, when manufacturing an electronic component having a size of less than 1.6 mm (length) x 0.8 mm (thickness) such as a size of 1.0 mm (length) x 0.5 mm (thickness) The surface roughness of the coat layer is preferably 5 to 20 μm in terms of arithmetic average roughness (Ra). In particular, when manufacturing a ceramic capacitor having a size of 0.6 mm (length) × 0.3 mm (thickness), which has recently been shifted to the main size, the surface roughness of the coat layer is an arithmetic average. The roughness (Ra) is preferably 5 to 15 μm. Incidentally, it has already been described that the conventional setters do not support electronic components of this size at all, and hinder the automation of firing.
[0020]
The coating layer in the present invention has a surface roughness of 10-point average surface roughness (Rz), 1 / 3.5 to 1 / 11.0 of the thickness of the object to be fired, and an uneven spacing (Sm ) Is preferably 1 / 1.3-1 to 10.0 of the length of the body to be fired, and the ten-point average surface roughness (Rz) is 1/4 of the thickness of the body to be fired. It is more preferable that the average interval (Sm) of the unevenness is 1 / 1.5 to 1 / 8.5 of the length of the object to be fired.
[0021]
If the surface roughness of the coat layer is a ten-point average surface roughness (Rz) and is less than 1 / 11.0 of the thickness of the body to be fired, sufficient space cannot be secured between the body to be fired and the setter. For this reason, volatilization of the binder is suppressed, and firing unevenness is likely to occur. On the other hand, when the surface roughness of the coat layer is 10-point average surface roughness (Rz) and exceeds 1 / 3.5 of the thickness of the object to be fired, the fired electronic components are collected by the inclination of the setter or the like. At this time, an electronic component is caught in the concave portion of the mounting surface, and many of the electronic components are left as they are.
[0022]
In addition, when the surface roughness of the coat layer is an average interval (Sm) of unevenness and is less than 1 / 10.0 or more than 1 / 1.3 of the length of the body to be fired, between the body to be fired and the setter In addition, since a sufficient space cannot be secured, volatilization of the binder is suppressed and firing unevenness is likely to occur.
[0023]
Specifically, for example, in the case of manufacturing a ceramic capacitor having a size of 0.6 mm (length) × 0.3 mm (thickness), which has recently been shifted to the main size, However, the ten-point average surface roughness (Rz) is preferably 27 to 86 μm and the average unevenness (Sm) is preferably 60 to 461 μm.
[0024]
Next, the coating layer only needs to cover the mounting portion of the base material, but if the reaction between the gas in the furnace and the base material occurs during firing, there is a risk that the base material will be deformed. It is preferable to form a coat layer also for other portions.
[0025]
Moreover, as a coating layer, what consists of an intermediate | middle layer and a surface layer is preferable.
However, when the coat layer is composed of an intermediate layer and a surface layer, it is preferable that the surface roughness of the coat layer is substantially defined by the surface roughness of the intermediate layer.
In such a coating layer, it is important that the surface layer of the coating layer is a ZrO 2 layer formed by thermal spraying. For example, as the thermal spraying , it is possible to use gas plasma thermal spraying that is difficult to obtain the desired surface roughness described above. More preferred.
[0026]
In this case, the surface roughness of the intermediate layer is preferably 0.3 to 2.4 times the arithmetic surface roughness (Ra) relative to the surface roughness of the coat layer. More preferably, it is 5 to 2.0 times.
[0027]
When the surface roughness of the intermediate layer is the arithmetic average roughness (Ra) within this range relative to the surface roughness of the coat layer, the thickness of the surface layer becomes substantially uniform, and the deterioration of the coat layer occurs uniformly. Therefore, the surface layer is difficult to peel off.
[0028]
Specifically, it is preferable that the surface roughness is substantially the same as the surface roughness of the coat layer described above for each size of the body to be fired. For example, from 0.6 mm (length) × 0.3 mm (thickness) When manufacturing a ceramic capacitor of a large size, it is preferable that the surface roughness of the intermediate layer is 5 to 20 μm in terms of arithmetic average roughness (Ra). Further, in the case of producing a ceramic capacitor having a size of 0.6 mm (length) × 0.3 mm (thickness), the surface roughness of the intermediate layer is 5 to 5 in terms of arithmetic average roughness (Ra). The thickness is preferably 15 μm.
[0029]
Moreover, when comprising a coat layer with an intermediate | middle layer and a surface layer, it is preferable that the average thickness of a surface layer shall be 20-200 micrometers, and it is more preferable to set it as 20-100 micrometers. If the average thickness of the surface layer is less than 20 μm, the intermediate layer may be exposed without the surface layer adhering to a part of the intermediate layer, and the components of the setter easily react with the body to be fired. On the other hand, when the average thickness of the surface layer exceeds 200 μm, it becomes difficult to control the surface roughness of the coat layer due to the surface roughness of the intermediate layer. In addition, although there is no restriction | limiting in particular about the thickness of an intermediate | middle layer, It is preferable to form by about 70-300 micrometers.
[0031]
When configuring the coating layer in the present invention in the intermediate layer and the surface layer, for the surface layer, it is formed by a thermal spraying without roughening, in order to form a layer of high accuracy average thickness 20~200μm ,is important. The intermediate layer may be formed by spray coating or thermal spraying with roughening, for example.
[0033]
Examples of thermal spraying include gas spraying using a combustion flame, arc spraying using an arc, plasma spraying using a plasma jet, etc., depending on the heating method, but a layer with an average thickness of 20 to 250 μm can be formed with high accuracy. In this respect, it is preferable to form the surface layer by plasma spraying. Moreover, examples of the plasma spraying include water-stabilized plasma spraying, gas plasma spraying, and the like, and water-stabilized plasma spraying is preferable in that a surface layer having high adhesion to the intermediate layer can be formed. Gas plasma spraying is preferable in that the surface layer can be thinned to an average thickness of about 20 to 50 μm, and the surface roughness of the intermediate layer can be more directly reflected on the surface roughness of the mounting surface.
[0034]
In the present invention, the material of the intermediate layer and the surface layer is not particularly limited, and may be configured to be normally coated on a setter.
[0035]
【Example】
Hereinafter, the present invention will be described more specifically based on examples. However, the present invention is not limited to these examples.
[0036]
(Evaluation methods)
(1) Surface roughness Arithmetic average roughness (Ra), ten-point average surface roughness (Rz), and uneven spacing (Sm) were evaluated. The evaluation is performed according to JIS standard B0601, and the arithmetic average roughness (Ra) and the ten-point average surface roughness (Rz) are both measured with an evaluation length of 12.5 mm and a cutoff value of 2.5 mm. The average spacing (Sm) of the unevenness was measured with an evaluation length of 4.0 mm and a reference length of 0.8 mm.
[0037]
(2) Thickness ratio (1)
Arithmetic average roughness of setters in each example and each comparative example with respect to the thickness of the fired body when the dimension is 0.6 mm (length) × 0.3 mm (thickness) as the fired body The ratio of Ra) is shown.
[0038]
(3) Thickness ratio (2)
Ten-point average surface roughness of setters in each Example and each Comparative Example with respect to the thickness of the body to be fired when the dimension is 0.6 mm (length) × 0.3 mm (thickness) The ratio of (Rz) is shown.
[0039]
(4) When the length ratio dimension is 0.6 mm (length) × 0.3 mm (thickness) as the body to be fired, the setters in the respective examples and comparative examples with respect to the length of the body to be fired The ratio of the average spacing (Sm) of the unevenness is shown.
[0040]
(5) Hatch frequency Using barium titanate as a raw material, a sample having a size of 0.6 mm (length) × 0.3 mm (thickness) and the same shape as a commercially available ceramic capacitor was prepared. Then, after placing 5000 samples on the setters obtained in each example and each comparative example, vibration was applied with the setter tilted by 30 °, and the movement and collection state of the samples were observed. And evaluated.
The evaluation is ○ when all samples are collected without being caught in the concave part of the coat layer, △ when all samples are collected while being caught, and all samples are caught. The case where it was not able to collect was evaluated as x.
[0041]
(6) Binder Using volatile barium titanate as the main raw material and using a raw material containing 30% acrylic binder as the binder, a sheet was prepared by the doctor blade method, then crimped and cut to 0.6 mm ( A sample having a length of 0.3 mm (thickness) and the same shape as a commercially available ceramic capacitor was prepared. Then, this sample was placed on the setter obtained in each example and comparative example, heated in an N 2 atmosphere at 300 ° C. for 2 hours, and the amount of the volatilized binder was reduced by the weight reduced before and after heating. evaluated.
Evaluation was made by assuming that the theoretical weight loss was 100%, 100 to 80% as ○, 80 to 50% as Δ, and 50% or less as ×.
[0042]
(7) Peelability After applying the barium titanate solution, which is a dielectric material, to the setters obtained in each Example and each Comparative Example, firing at 1350 ° C. for 2 hours was repeated 5 times, and the coating layer was peeled off from the substrate. I confirmed that I was doing.
The evaluation is ○ when no peeling of the coating layer is observed, Δ when peeling is observed at 20% or less of the coating layer, and when peeling is recognized at 20% or more of the coating layer. It evaluated as x.
[0043]
(8) Cut off the setters of the Examples and Comparative Examples on which the surface layer adhesive intermediate layer and the surface layer were formed, and observed the cut surface with a microscope. Was evaluated as x.
[0044]
(9) Controllability with respect to the surface roughness of the coating layer by the intermediate layer For the intermediate layer and the coating layer (surface layer), the arithmetic average arithmetic average roughness (Ra) is measured, and the arithmetic average arithmetic average roughness ( The case where Ra) was 0.3 to 2.4 times the arithmetic average arithmetic mean roughness (Ra) of the coat layer (surface layer) was evaluated as ◯, and the other cases were evaluated as ×.
[0045]
Example 1
As the base material, a material comprising Al 2 O 3 content of 80% by mass, SiO 2 of 19% by mass, and other materials of 1% by mass was press-molded and then fired to obtain Al 2 O 3 —SiO 2. A plate-shaped body having a size of 150 mm in length, 150 mm in width, and 5 mm in thickness was produced.
[0046]
Next, 60% by mass of Al 2 O 3 having an average particle diameter of 2 μm and 40% by mass of Al 2 O 3 having an average particle diameter of 20 μm were mixed to prepare a solid component, and then this solid was added to 30 parts by mass of water. A slurry was prepared by containing 67 parts by mass of the component and 3 parts by mass of the binder. Then, this slurry was spray-coated on the surface of the base material with a spray gun at an air pressure of 5 kg / cm 2 , and then baked at 1450 ° C. for 2 hours, and made of Al 2 O 3 with a thickness of 100 μm, An intermediate layer having an arithmetic average arithmetic average roughness (Ra) of 5 μm was formed.
[0047]
Next, plasma spraying is performed on the surface of the base material using zirconia particles having an average particle diameter of 80 μm to form a surface layer of ZrO 2 with a thickness of 100 μm and an arithmetic average arithmetic average roughness (Ra) of 15 μm. A setter for electronic parts was manufactured. The characteristics and evaluation are summarized in Table 1.
[0048]
(Examples 2 to 4 and Comparative Examples 1 to 3)
Plasma spraying is performed using zirconia particles having an average particle size of 60 μm, 50 μm, 40 μm, 110 μm, 80 μm, or 30 μm, respectively, and arithmetic average arithmetic average roughness (Ra) is 12 μm, 8 μm, 5 μm, 20 μm, 16 μm, or A setter was manufactured in the same manner as in Example 1 except that a surface layer of 4 μm was formed. The characteristics and evaluation are summarized in Table 1.
[0049]
(Evaluation)
As shown in Table 1, the ceramic electrons of Examples 1 to 4 having an arithmetic average roughness (Ra) in the range of 5 to 15 μm and a thickness ratio (1) of 1 / 20.0 to 1 / 60.0. In the setter for parts, when the setter was inclined by 30 °, all the placed samples were collected smoothly, and the volatility of the binder was also good.
[0050]
On the other hand, the ceramic electronic components of Comparative Examples 1 and 2 having large arithmetic average roughness (Ra) of 20 μm and 16 μm and a thickness ratio (1) of 1 / 15.0 and 1 / 18.8, respectively. In the setter, the volatility of the binder was good, but when the setter was tilted by 30 °, the placed sample was caught at a high rate. Moreover, in the ceramic electronic component setter of Comparative Example 3 having a small arithmetic average roughness (Ra) of 4 μm and a thickness ratio (1) of 1 / 75.0, a sample placed when the setter is inclined by 30 ° Were collected smoothly, but the binder volatility was found to be less than 80% weight loss.
[0051]
[Table 1]
(Examples 5 to 10 and Comparative Examples 4 to 7)
Example 1 with the exception that each surface layer had a predetermined surface roughness by using plasma spraying by adjusting the distance between the spray gun and the base material using zirconia particles having an average particle diameter of 50 μm. Similarly, a setter was produced.
[0053]
(Evaluation)
As shown in Table 2, the thickness ratio (2) is 1 / 4.0 to 1 / 10.0, and the length ratio is 1 / 1.5 to 1 / 8.0. In the setter for ceramic electronic parts of No. 10, when the setter was inclined by 30 °, all the placed samples were collected smoothly and the volatility of the binder was also good.
[0054]
On the other hand, although the thickness ratio (2) is 1 / 7.0, the length ratio is as large as 1 / 1.2, and the length ratio is as small as 1 / 12.0. In all of the setters for ceramic electronic parts of Comparative Example 5, when the setter was tilted by 30 °, all of the placed samples were collected smoothly, but with regard to the volatility of the binder, most of the samples lost weight. Was 50% or less.
[0055]
Further, although the length ratio was 1 / 3.0, the setter for ceramic electronic component of Comparative Example 6 having a large thickness ratio (2) of 1 / 3.0 had good binder volatility. However, when the setter was tilted by 30 °, the placed sample was caught at a high rate. Moreover, although the length ratio was 1 / 3.0, the setter for ceramic electronic parts of Comparative Example 7 having a small thickness ratio of 1 / 12.0 was placed when the setter was inclined by 30 °. Although all the samples were collected smoothly, most of the samples had a weight loss of 50% or less with respect to the volatility of the binder.
[0056]
[Table 2]
(Examples 11-14 and Comparative Examples 8-10)
Plasma spraying is performed on the base material on which the intermediate layer is formed using zirconia particles having an average particle diameter of 30 μm, 50 μm, 60 μm, 90 μm, 25 μm, 120 μm, or 150 μm, respectively, and arithmetic mean roughness (Ra) 2. Except that a surface layer of 5 μm, 8.0 μm, 10.0 μm, 16 μm, 1.5 μm, 17.0 μm, or 20.0 μm was formed to produce a ceramic electronic component setter, the same as in Example 1. The setter was manufactured.
[0058]
(Evaluation)
As shown in Table 3, in the ceramic electronic component setters of Examples 11 to 14 having a surface roughness ratio of 0.313 to 2.381, no peeling of the coating layer was observed.
[0059]
On the other hand, in the ceramic electronic component setter of Comparative Example 8 having a comparatively small surface roughness ratio of 3.333 and Comparative Example 9 having a comparatively small surface roughness ratio of 0.294, a part of the coat layer was used. Peeling was observed. Moreover, in the setter for ceramic electronic parts of Comparative Example 10 having a smaller surface roughness ratio of 0.250, peeling was observed in most parts of the coat layer.
[0060]
[Table 3]
(Examples 15 to 18 and Comparative Examples 11 and 12)
First, 60% by mass of Al 2 O 3 having an average particle diameter of 2 μm and 40% by mass of Al 2 O 3 having an average particle diameter of 20 μm were mixed to prepare a solid component, and then this solid was added to 25 parts by mass of water. A slurry was prepared by containing 72 parts by mass of a component and 3 parts by mass of a binder. Subsequently, this slurry was spray coated and further baked in the same manner as in Example 1 on the surface of the base material produced in the same manner as in Example 1, and the arithmetic average arithmetic average roughness (Ra) was 20.0 μm. An intermediate layer was formed.
Next, plasma spraying is performed on the surface of the base material using zirconia particles having an average particle diameter of 110 μm, and the surface layer of ZrO 2 has a thickness of 20.0 μm, 50.0 μm, 100.0 μm, 200.0 μm, A setter for ceramic electronic parts was manufactured by forming at 15.0 μm or 250.0 μm.
[0062]
(Evaluation)
As shown in Table 4, in the ceramic electronic component setters of Examples 15 to 18 having a surface layer thickness of 20.0 to 200.0 μm, no unattached portion was observed between the intermediate layer and the surface layer. First, the arithmetic average arithmetic roughness (Ra) of the intermediate layer was within the range of 0.3 to 2.4 times the arithmetic average arithmetic average roughness (Ra) of the coat layer (surface layer).
[0063]
In contrast, in the ceramic electronic component setter of Comparative Example 11 having a surface layer thickness of 15.0 μm, a non-attached portion was observed between the intermediate layer and the surface layer. Moreover, in the setter for ceramic electronic parts of Comparative Example 12 having a surface layer thickness of 250.0 μm, the difference in the arithmetic average arithmetic average roughness (Ra) between the coat layer (surface layer) and the intermediate layer is large and depends on the intermediate layer. Control of the surface roughness of the coat layer was insufficient.
[0064]
[Table 4]
【The invention's effect】
As described above, according to the setter for firing a ceramic electronic component of the present invention, the component does not react with the body to be fired at the time of firing, and without suppressing the volatilization of the binder in the body to be fired, A uniform fired body can be obtained. In addition, when collecting the products after baking in an automated baking process, there is no collection failure and it is possible to cope with baking automation.
Claims (10)
該コート層が、算術平均粗さ（Ｒａ）で、被焼成体の厚さに対し、１／２０〜１／６５の表面粗さを有するとともに、該コート層が中間層と表層とで構成され、該表層が溶射により形成されたＺｒＯ ２ 質層であることを特徴とするセラミックス電子部品焼成用セッター。A ceramic electronic component firing setter having a coat layer on a substrate surface,
The coat layer has an arithmetic average roughness (Ra) and a surface roughness of 1/20 to 1/65 with respect to the thickness of the object to be fired , and the coat layer is composed of an intermediate layer and a surface layer. A setter for firing a ceramic electronic component , wherein the surface layer is a ZrO 2 layer formed by thermal spraying .
該コート層が、十点平均表面粗さ（Ｒｚ）で、被焼成体の厚さに対して１／３．５〜１／１１．０、かつ凸凹の平均間隔（Ｓｍ）で、被焼成体の長さに対して１／１．３〜１／１０．０の表面粗さを有するとともに、該コート層が中間層と表層とで構成され、該表層が溶射により形成されたＺｒＯ ２ 質層であることを特徴とするセラミックス電子部品焼成用セッター。A ceramic electronic component firing setter having a coat layer on a substrate surface,
The coated layer has a ten-point average surface roughness (Rz), 1 / 3.5 to 1 / 11.0 with respect to the thickness of the body to be fired, and an average spacing (Sm) of unevenness to be fired. and has a surface roughness of 1 / 1.3 to / 10.0 with respect to the length of, the coated layer is formed by the intermediate layer and the surface layer, ZrO 2 quality layers surface layer is formed by spraying A setter for firing ceramic electronic parts, wherein
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002013912A JP4024544B2 (en) | 2002-01-23 | 2002-01-23 | Ceramic electronic parts firing setter |
| CNB021462968A CN1235246C (en) | 2002-01-23 | 2002-10-21 | Holding frame for ceramic electric part baking |
| TW091125182A TWI225042B (en) | 2002-01-23 | 2002-10-25 | Setter for firing ceramic electronic component |
| KR10-2002-0080582A KR100491805B1 (en) | 2002-01-23 | 2002-12-17 | Setter for firing ceramic electronic parts |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002013912A JP4024544B2 (en) | 2002-01-23 | 2002-01-23 | Ceramic electronic parts firing setter |
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|---|---|
| JP2003212665A JP2003212665A (en) | 2003-07-30 |
| JP4024544B2 true JP4024544B2 (en) | 2007-12-19 |
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| JP2002013912A Expired - Lifetime JP4024544B2 (en) | 2002-01-23 | 2002-01-23 | Ceramic electronic parts firing setter |
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| Country | Link |
|---|---|
| JP (1) | JP4024544B2 (en) |
| KR (1) | KR100491805B1 (en) |
| CN (1) | CN1235246C (en) |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011046562A (en) * | 2009-08-27 | 2011-03-10 | Nec Tokin Corp | Setter for firing ceramic green sheet |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4713981B2 (en) * | 2005-08-08 | 2011-06-29 | コバレントマテリアル株式会社 | Ceramic electronic component firing container |
| CN107195490B (en) * | 2017-06-22 | 2018-09-21 | 刘奇美 | A kind of drying unit for capacitor case production and processing |
| CN108088263A (en) * | 2018-02-05 | 2018-05-29 | 江苏三恒高技术窑具有限公司 | The high temperature load bearing board that a kind of surface topography accurately controls |
| JP2020073432A (en) * | 2019-10-23 | 2020-05-14 | 三井金属鉱業株式会社 | Ceramic lattice body |
-
2002
- 2002-01-23 JP JP2002013912A patent/JP4024544B2/en not_active Expired - Lifetime
- 2002-10-21 CN CNB021462968A patent/CN1235246C/en not_active Expired - Lifetime
- 2002-10-25 TW TW091125182A patent/TWI225042B/en not_active IP Right Cessation
- 2002-12-17 KR KR10-2002-0080582A patent/KR100491805B1/en active IP Right Grant
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011046562A (en) * | 2009-08-27 | 2011-03-10 | Nec Tokin Corp | Setter for firing ceramic green sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003212665A (en) | 2003-07-30 |
| TWI225042B (en) | 2004-12-11 |
| KR100491805B1 (en) | 2005-05-27 |
| CN1235246C (en) | 2006-01-04 |
| KR20030064267A (en) | 2003-07-31 |
| CN1434470A (en) | 2003-08-06 |
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