CN1235246C - Holding frame for ceramic electric part baking - Google Patents
Holding frame for ceramic electric part baking Download PDFInfo
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- CN1235246C CN1235246C CNB021462968A CN02146296A CN1235246C CN 1235246 C CN1235246 C CN 1235246C CN B021462968 A CNB021462968 A CN B021462968A CN 02146296 A CN02146296 A CN 02146296A CN 1235246 C CN1235246 C CN 1235246C
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- surface roughness
- overlay
- rack
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/62222—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic coatings
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/87—Ceramics
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
- C04B2235/9623—Ceramic setters properties
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Composite Materials (AREA)
- Furnace Charging Or Discharging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The object of the present invention is to provide a setter for firing ceramic electronic components allowing no incomplete recovery of fired products in an automated firing process, in which its components do not react with the firing setter and binders contained in the firing setter are easily evaporated also from the side contacting the setter to provide uniformly fired products. The setter has a coating layer on the surface of a base material. The coating layer has a surface roughness, expressed as an arithmetic average roughness height (Ra), of 1/20-1/65 against the thickness of the fired product.
Description
Technical field
The present invention relates to ceramic capacitor piezoelectric element, the rack that the ceramic electronic components of ferrite etc. is adopted when curing.
Background technology
Ceramic electronic components cures with rack and refers to, place baked body and (cure the goods that the back forms electronic unit when making the electronic unit of ceramic component by curing.Also identical below) parts, in today that progress is handled in the automation of baking step, after curing, this rack is tilted, the ceramic electronic components after curing is collected in the position of regulation.
In addition, in this rack, when curing, its constituent acts on baked body, product properties is degenerated, by the placed side of this rack, suppress the volatilization of the bonding agent in the baked body, these aspects all requirement will not produce and cure uneven situation as important characteristic.
In the past, as rack that is conceived to such characteristic etc., disclose the support (the special fair 4-21330 document of JP) that on substrate surface, forms deposited metal, and following electronic unit cures with support (TOHKEMY 2001-200378 document), wherein on substrate surface, has deposited metal, with regard to the surface roughness of the face of placing baked body, 10 mean roughness are in the scope of 150～1000 μ m.
These supports prevent the reaction with baked body by being formed at the deposited metal on the substrate surface.In addition, in the latter's support, because the deposited metal of the surface roughness by having regulation, reduce, so the bonding agent in the baked body is not suppressed fully by the existence of support, realize volatilization, the baked body in acquisition prison with the contact area of baked body.
But for these supports, in the bigger type of surface roughness, after curing, even make under the situations such as this rack inclination, baked body still is hung on the recess of rack surface, remains on the rack same as before.For this reason, the electronic unit that formation will once be cured also supplies to baking step etc., one of problem of automation processing aspect.Particularly, in recent years, in ceramic capacitor, its size is more and more small, and key dimension is from 1.6mm * 0.8mm, 1.0mm the size of * 0.5mm etc., transfer to the size of 0.6mm * 0.3mm, adopting support in the past, the occasion of curing the ceramic capacitor of this size, present case be this baked body with higher ratio, be hung on the recess of rack surface.
Summary of the invention
The present invention be directed to the problems referred to above proposes, the object of the present invention is to provide a kind of ceramic electronic components to cure and use rack, wherein when curing, constituent can not react with baked body, and the bonding agent in the baked body also easily from the volatilization of rack placed side side, can obtain uniform baked body, in the baking step of automation more, during goods after collection is cured, do not collect bad.
Be used to solve the technical scheme of problem
That is, the invention provides a kind of ceramic electronic components and cure and use rack, wherein on substrate surface, have overlay, it is characterized in that:
This overlay has the surface roughness of ratio in 1/20～1/65 scope of arithmetic average roughness (Ra) and the thickness of baked body.
In addition, the invention provides a kind of ceramic electronic components and cure and use rack, wherein on substrate surface, have overlay, it is characterized in that:
Above-mentioned overlay has following surface roughness, wherein 10 average surface roughness (Rz) and the ratio of the thickness of baked body be in 1/3.5～1/11.0 scope, and the ratio of the average headway of convex-concave portion (Sm) and the length of baked body is in 1/1.3～1/10.0 scope.
Here, arithmetic average roughness (Ra) and 10 mean roughness (Rz) are according to JIS specification B0601, in evaluation length is 12.5mm, and the cut-out value is the value of measuring under the condition of 2.5mm, and the average headway of convex-concave portion (Sm) is for being the value of measuring under the condition of 0.8mm at datum length.
In the present invention, in order to tackle the baked body of 0.6mm (length) * 0.3mm (thickness), ceramic electronic components at the former cures with in the rack, preferably this overlay has the surface roughness of arithmetic average roughness (Ra) in the scope of 5～15 μ m, ceramic electronic components the latter cures with in the rack, preferably this overlay has 10 average surface roughness (Rz) in the scope of 27～86 μ m, and the surface roughness of the average headway of convex-concave portion (Sm) in the scope of 60～461 μ m.
In the present invention, also can pass through single top layer, form the overlay of such surface roughness, but, form above-mentioned overlay, in fact,, limit the surface roughness of this overlay by the surface roughness in this intermediate layer preferably by intermediate layer and top layer.At this moment, best, with regard to arithmetic mean roughness (Ra), the ratio of the surface roughness in above-mentioned intermediate layer and the surface roughness of above-mentioned overlay is controlled in 0.3～2.4 times the scope.In addition, best, with regard to the surface roughness in intermediate layer, arithmetic average roughness (Ra) is in the scope of 5～20 μ m, in order to tackle the baked body of 0.6mm (length) * 0.3mm (thickness), particularly best, above-mentioned arithmetic average roughness (Ra) is in the scope of 5～15 μ m.
In addition, for resemble above-mentioned according to the surface roughness of centre, the surface roughness of overlay is controlled, preferably the average thickness on top layer is in the scope of 20～200 μ m.
Cure with in the rack at ceramic electronic components of the present invention, because as above-mentioned, surface roughness with regard to above-mentioned overlay, arithmetic average roughness (Ra) is that the ratio of thickness of baked body is in 1/20～1/65 scope, or, surface roughness with regard to this overlay, the ratio of 10 average surface roughness (Rz) and the thickness of baked body is in 1/3.5～1/10.0 scope, and the ratio of the average headway of convex-concave portion (Sm) and the length of baked body is in 1/1.3～1/10.0 scope, so obviously, when curing, the constituent of this rack does not react with baked body, bonding agent in the baked body from the placed side volatilization of baked body, obtains uniform baked body easily, and after being to cure, make the operation of this rack inclination etc., when collecting ceramic electronic components, whole electronic units can not be hung on the rack recess, can successfully collect.
Embodiment
Below form of implementation of the present invention is specifically described.
In ceramic electronic components of the present invention cures with rack (below it being abbreviated as " rack "), on substrate surface, have overlay, this overlay has the surface roughness of particular range.At each element, specifically describe below.
The material of base material of the present invention has no particular limits, can be by as rack and the pottery that usually is suitable for forms.In addition, the method for making base material has no particular limits, such as, can after the pottery raw material being shaped, it be cured by modes such as punching presses, it is made.
With regard to the surface roughness of overlay of the present invention, the ratio of arithmetic average roughness (Ra) and the thickness of baked body in 1/20～1/65 scope, preferably with the ratio of the thickness of baked body in 1/25～1/62 scope.
If surface roughness with regard to overlay, arithmetic average roughness (Ra) then suppresses the volatilization of the bonding agent in the baked body less than 1/65 of the thickness of baked body, can't obtain uniform baked body, according to circumstances, the constituent of rack also reacts with baked body.If surface roughness with regard to overlay, arithmetic average roughness (Ra) surpass baked body thickness 1/20, then in operations such as inclination by rack, during electronic unit after collection is cured, most cases is the recess that electronic unit is hung on the placed side, and this electronic unit is residual same as before.
Specifically, such as, in the occasion of the electronic unit of the size of making 1.6mm (length) * 0.8mm (thickness), best, overlay has the surface roughness of arithmetic average roughness (Ra) in the scope of 12～40 μ m.In addition, such as, such in the size of making 1.0mm (length) * 0.5mm (thickness) etc., less than the occasion of the electronic unit of the size of 1.6mm (length) * 0.8mm (thickness), best, overlay has the surface roughness of arithmetic average roughness (Ra) in the scope of 5～20 μ m.Particularly, best in the occasion of the ceramic capacitor of the size of making 0.6mm (the length) * 0.3mm (thickness) transferring key dimension to, have the surface roughness of arithmetic average roughness (Ra) in the scope of 5～15 μ m.Therefore, resemble as described in, in the rack in the past, can't fully tackle the electronic unit of this size, constitute to hinder the reason of the automation of curing.
In addition, preferably with regard to the surface roughness of overlay of the present invention, 10 average surface roughness (Rz) be baked body thickness 1/3.5～1/11.0, and the average headway of convex-concave portion (Sm) be baked body length 1/1.3～1/10.0, particularly best, 10 average surface roughness (Rz) be baked body thickness 1/4.0～1/10.0, and the average headway of convex-concave portion (Sm) be baked body length 1/1.5～1/8.5.
If surface roughness with regard to overlay of the present invention, 10 average surface roughness (Rz) are less than 1/11.0 of the thickness of baked body, owing between baked body and rack, can't guarantee sufficient space, so suppress the volatilization of bonding agent, be easy to generate cure inhomogeneous.If surface roughness with regard to overlay of the present invention, 10 average surface roughness (Rz) surpass baked body thickness 1/3.5, then in operations such as inclination by rack, during electronic unit after collection is cured, most cases is the recess that electronic unit is hung on the placed side, and it is residual same as before.
In addition, because with regard to the surface roughness of overlay, the average headway of convex-concave portion (Sm) is less than 1/10.0 of the length of baked body, or surpass 1/1.3, between baked body and rack, can't guarantee sufficient space, so the volatilization of bonding agent is suppressed, be easy to generate cure inhomogeneous.
Specifically, such as, recently, occasion at the ceramic capacitor of the size of making 0.6mm (the length) * 0.3mm (thickness) transferring key dimension to, best, with regard to the surface roughness of overlay, 10 average surface roughness (Rz) are in the scope of 27～86 μ m, and the average headway of convex-concave portion (Sm) is in the scope of 60～461 μ m.
In addition, overlay can adopt the type of the placement part of covering substrates, if but when curing, react between gas in the stove and the base material, then have the danger that base material deforms, thus best, also, form overlay in other part.
In addition, the overlay type that independent top layer forms of both can having served as reasons also can be the type that is formed by intermediate layer and top layer.
Obviously, best in the occasion that forms overlay by intermediate layer and top layer, in fact, and according to the surface roughness in intermediate layer, the surface roughness of restriction overlay.
In such overlay, the method for plasma spray coating that can be by being difficult to obtain above-mentioned required surface roughness etc. forms the top layer.
Also have, in this occasion, with regard to the surface roughness in intermediate layer, its arithmetic average roughness (Ra) is preferably 0.3～2.4 times of overlay surface roughness, is preferably 0.5～2.0 times.
With regard to the surface roughness in intermediate layer, the ratio of its arithmetic average roughness (Ra) and the surface roughness of overlay is in above-mentioned scope, because the thickness on top layer is that the performance degradation of overlay takes place equably, so this top layer is difficult to peel off uniformly basically.
Specifically, size at every kind of baked body, best, form the surface roughness substantially the same with the surface roughness of above-mentioned overlay, such as, in the occasion of manufacturing, best greater than the ceramic condenser of the size of 0.6mm (length) * 0.3mm (thickness), with regard to the surface roughness in intermediate layer, its arithmetic roughness (Ra) is in the scope of 5～20 μ m.In addition, in the occasion of the ceramic condenser of the size of making 0.6mm (length) * 0.3mm (thickness), best, with regard to the surface roughness in intermediate layer, arithmetic average roughness (Ra) is in the scope of 5～15 μ m.
Also have, in the occasion that overlay is formed by intermediate layer and top layer, the average thickness on top layer is preferably in the scope of 20～200 μ m, particularly is preferably in the scope of 20～100 μ m.When the average thickness on top layer during less than 20 μ m, have on the part that the top layer is not attached to the intermediate layer, the situation that expose in the intermediate layer, the constituent of rack easily and baked body react.If the average thickness on top layer is difficult to the surface roughness by the intermediate layer greater than 200 μ m, the surface roughness of overlay is controlled.In addition, the thickness in intermediate layer has no particular limits, and still, preferably it is preferably in the scope of 70～300 μ m.
In the present invention, in the occasion that forms overlay by single top layer, also can pass through spraying, or follow the mode of the spraying plating of surface roughening processing, form this top layer.At this moment, in spraying, to raw material particle size, concentration of slurry, coating condition etc. is controlled, and can form required surface roughness, for the spraying plating of following surface roughening to handle, can be to raw material, raw material is thrown in condition, forms required surface roughness.
Same in the occasion that forms overlay by intermediate layer and top layer, same as described above, such as, can pass through spraying, or follow the mode of the spraying plating of surface roughening processing, form this intermediate layer.In addition, such as, can pass through spraying, or follow the mode of the spraying plating of surface roughening processing, form this top layer.
In addition, passing through spraying, when forming the top layer, can be to raw material particle size, concentration of slurry, coating condition etc. is controlled, and forms required surface roughness, by spraying plating, when forming the top layer, can select and control method of spray plating, raw material particle size and raw material placement position etc. form required surface roughness.
As spraying plating, can exemplify such as, method by heating, adopt the scorching gas spraying plating of burning fire, adopt the arc spraying of electric arc, the plasma spray coating that using plasma sprays etc., but from precision that can be good, form average thickness aspect the layer of 20～250 μ m,, form the top layer preferably by plasma spray coating.In addition, as plasma spray coating, can exemplify the plasma spray coating of water stabilized treatment, modes such as gas plasma spraying plating, from intermediate layer relatively, form the aspect on the higher top layer of fitting tightly property, preferably the average thickness of gas plasma spraying plating is in the scope of 20～50 μ m, so that form thin top layer, can more directly reflect the surface roughness in intermediate layer by the surface roughness of placed side.
In addition, in the present invention, the material on intermediate layer and top layer has no particular limits, and rack can be formed by the rack that has carried out the coating processing usually.
Embodiment
According to embodiment, the present invention is carried out more concrete description below.But the present invention is not limited to these embodiment fully.
(evaluation method)
1. surface roughness
To arithmetic average roughness (Ra), 10 average surface roughness (Rz), the average headway of convex-concave portion (Sm) is estimated.This evaluation is carried out according to JIS specification B0601, arithmetic average roughness (Ra), and 10 average surface roughness (Rz) all are to be 12.5mm in evaluation length, cut value is to measure under the condition of 2.5mm, the average headway of convex-concave portion (Sm) is to be 4.0mm in evaluation length, and datum length is to measure under the condition of 0.8mm.
2. thickness proportion (1)
The goods that this ratio refers to be of a size of 0.6mm (length) * 0.3mm (thickness) are during as baked body, the ratio of the thickness of the relative baked body of arithmetic average roughness (Ra) of the rack of each embodiment and each comparative example.
3. thickness proportion (2)
The goods that this ratio refers to be of a size of 0.6mm (length) * 0.3mm (thickness) are during as baked body, the ratio of the thickness of the relative baked body of 10 mean roughness (Rz) of the rack of each embodiment and each comparative example.
4. length ratio
The goods that this ratio refers to be of a size of 0.6mm (length) * 0.3mm (thickness) are during as baked body, the ratio of the length of the relative baked body of average headway (Sm) of the convex-concave portion of the rack of each embodiment and each comparative example.
5. hook frequency
With the barium titanate is raw material, and manufactured size is 0.6mm (length) * 0.3mm (thickness), with the identical sample of selling on the market of ceramic capacitor shape.In addition, after this sample being positioned on the rack that obtains by each embodiment and comparative example, the state making 30 ° of this rack inclinations applies vibration, observes moving of sample, and collection status is estimated.
In this is estimated, whole samples is not hung on the recess of overlay, and the occasion of whole sample collections is evaluated as zero, when a part of sample is hung on above-mentioned recess, the occasion of whole sample collections is evaluated as △, to be hung on recess, not the occasion with whole sample collections be evaluated as *.
6. bonding agent volatility
Employing is main material with the barium titanate, employing comprises as bonding agent, the raw material of acrylic acid series bonding agent 30%, by the scraping blade method, make synusia, then, carry out crimping, cut off to handle,, the goods identical with the ceramic capacitor shape of selling on the market are made as sample according to the size of 0.6mm (length) * 0.3mm (thickness).In addition, this sample is positioned on the rack that obtains by each embodiment and comparative example, at N
2Under the atmosphere, under 300 ℃ temperature,,, the bonding dosage of volatilization is estimated according to the weight that reduces before and after the heating to its heating 2 hours.
In this is estimated, as 100%, be evaluated as zero with 80～100% with theoretic weight reduction, be evaluated as △ with 50～80%, will less than 50% be evaluated as *.
7. fissility
On the rack that obtains by each embodiment and each comparative example, coating then, is carried out under 1350 ℃ temperature for 5 times repeatedly as the barium titanate solution of dielectric medium, to its operation of curing 2 hours, confirms that whether overlay and base material are peeled off.
In evaluation, do not have the goods of peeling off of overlay to be evaluated as zero full confirmation, will confirm to have the goods of peeling off to be evaluated as △ in the part below 20% of overlay, will have in the part affirmation 20% or more of overlay the goods of peeling off be evaluated as *.
8. top layer tack
Cut-out is formed with each embodiment on intermediate layer and top layer and the rack of each comparative example, by microscope, observes section, will be evaluated as zero less than the occasion of bonding portion not, will have not that the occasion of bonding portion is evaluated as *.
9. controlled to the surface roughness of the overlay in intermediate layer
At intermediateness, overlay (top layer), measure arithmetic average arithmetic mean (Ra), the arithmetic average arithmetic mean (Ra) in intermediate layer is evaluated as zero for 0.3～2.4 times occasion of the arithmetic average roughness (Ra) of overlay (top layer), the occasion beyond this occasion is evaluated as *.
(the 1st embodiment)
Will be as base material, by Al
2O
3Content is 80 weight %, SiO
2Content be 19 weight %, other material is that the material that 1 weight % forms carries out extrusion molding, then, it is cured, and makes Al
2O
3-SiO
2Component, be of a size of the goods of the plate body of vertical 150mm * horizontal 150mm * thickness 5mm.
Then, with 60 weight %, average grain diameter is the Al of 2 μ m
2O
3, 40 weight %'s, average grain diameter is the Al of 20 μ m
2O
3Mix, the modulation solid constituent, then, the water of relative 30 weight portions mixes the above-mentioned solid constituent of 67 weight portions, the bonding agent of 3 weight portions, modulation slurries.Then, according to 5kg/cm
2Air pressure, adopt spray gun, these slurries are sprayed on the surface of base material, then, under 1450 ℃ temperature, it is carried out burn-back handled 2 hours, form Al
2O
3Composition, thickness is 100 μ m, arithmetic average roughness is the intermediate layer of 5 μ m for (Ra).
Then, adopting average grain diameter is the zirconia particles of 80umm, plasma spray coating is carried out on the surface of base material handle, and forms ZrO
2Composition, thickness is 100 μ m, arithmetic average roughness (Ra) is the top layer of 15 μ m, makes the ceramic electronic components rack.Its characteristic and evaluation are summarized in the table 1.
(the 2nd～4 embodiment and the 1st～3 comparative example)
Adopting average grain diameter respectively is 60 μ m, 50 μ m, 40 μ m, 110 μ m, 80 μ m, or the zirconia particles of 30 μ m, carry out plasma spray coating and handle, forming arithmetic average roughness (Ra) respectively is 12 μ m, 8 μ m, 5 μ m, 20 μ m, 16 μ m, or the top layer of 4 μ m, in addition, according to the mode identical, make rack with the 1st embodiment.Its characteristic and evaluation are summarized in the table 1.
(evaluation)
As shown in the table 1, at arithmetic average roughness (Ra) in the scope of 5～15 μ, the ceramic electronic components of 1st～4 embodiment of thickness proportion (1) in 1/20.0～1/60.0 scope is with in the rack, if this rack is tilted 30 °, then successfully with the sample collection of whole placements, the volatility of bonding agent is also good.
Relative therewith, be respectively 20 μ m at arithmetic average roughness (Ra), 15 μ m, thickness proportion (1) is respectively 1/15.0 greatly, 1/18.8 the ceramic electronic components of the 1st, 2 comparative example with in the rack, though the volatility of bonding agent is all good, if but this rack is tilted 30 °, then the sample of Fang Zhiing is with higher ratio generation hook.At arithmetic average roughness (Ra) is 4 μ m, thickness proportion (1) is less and be that the ceramic electronic components of 1/75.0 the 3rd comparative example is with in the rack, if this rack is tilted 30 °, though successfully with the sample collection of whole placements, but, confirm to have the weight reduction less than 80% goods for the volatility of bonding agent.
Table 1
| Arithmetic average roughness (Ra) | Thickness proportion (1) (1/) | The hook frequency | The bonding agent volatility | The construction method on top layer | |
| Embodiment 1 | 15 | 20.0 | ○ | ○ | Spraying plating |
| Embodiment 2 | 12 | 25.0 | ○ | ○ | Spraying plating |
| Embodiment 3 | 8 | 37.5 | ○ | ○ | Spraying plating |
| Embodiment 4 | 5 | 60.0 | ○ | ○ | Spraying plating |
| Comparative example 1 | 20 | 15.0 | × | ○ | Spraying plating |
| Comparative example 2 | 16 | 18.8 | △ | ○ | Spraying plating |
| Comparative example 3 | 4 | 75.0 | ○ | △ | Spraying plating |
(the 5th～10 and the 4th～7 comparative example)
Adopting average grain diameter respectively is the zirconia particles of 50 μ m, adjusts the distance between paint spray gun and the base material, carries out plasma spraying and handles, and forms the top layer of the surface roughness of regulation respectively, identical with the 1st embodiment in addition, makes rack.
(evaluation)
As shown in the table 2, in the scope of thickness proportion (2) 1/4.0～1/10.0, the ceramic electronic components of 5th～10 embodiment of length ratio in 1/1.5～1/8.0 scope is with in the rack, if this rack is tilted 30 °, then successfully with the sample collection of whole placements, the volatility of bonding agent is also good.
Relative therewith, in thickness proportion (2) is 1/7.0, and length ratio is greatly 1/1.2 the 4th comparative example, and length ratio less and be that the ceramic electronic components of 1/12.0 the 5th comparative example is with in the rack, if this rack is tilted 30 °, though the sample collection that will all place smoothly for the volatility of bonding agent, confirms to have the weight reduction less than 50% goods.
In addition, at length ratio is 1/3.0, and thickness proportion (2) is big and be that the ceramic electronic components of 1/3.0 the 6th comparative example is with in the rack, though the volatility of bonding agent is good, if but this rack is tilted 30 °, then the sample of Fang Zhiing is with higher ratio generation hook.In addition, at length ratio is 1/3.0, and thickness proportion is less and be that the ceramic electronic components of 1/12.0 the 7th comparative example is with in the rack, if this rack is tilted 30 °, though the sample collection that will all place smoothly, but for the volatility of bonding agent, in nearly all sample, the weight reduction is less than 50%.
Table 2
| The average headway of convex-concave portion (Sm (μ m)) | Length ratio (1/) | 10 average surface roughness (Rz (μ m)) | Thickness proportion (2) (1/) | The hook frequency | The bonding agent volatility | |
| Embodiment 5 | 400 | 1.6 | 43 | 7.0 | ○ | ○ |
| Embodiment 6 | 200 | 3.0 | 43 | 7.0 | ○ | ○ |
| Embodiment 7 | 100 | 6.0 | 43 | 7.0 | ○ | ○ |
| Embodiment 8 | 75 | 8.0 | 43 | 7.0 | ○ | ○ |
| Comparative example 4 | 500 | 1.2 | 43 | 7.0 | ○ | × |
| Comparative example 5 | 50 | 12.0 | 43 | 7.0 | ○ | × |
| Embodiment 9 | 200 | 3.0 | 75 | 4.0 | ○ | ○ |
| Embodiment 10 | 200 | 3.0 | 30 | 10.0 | ○ | ○ |
| Comparative example 6 | 200 | 3.0 | 100 | 3.0 | × | ○ |
| Comparative example 7 | 200 | 3.0 | 25 | 12.0 | ○ | × |
(the 11st～14 embodiment and the 8th～10 comparative example)
Adopting average grain diameter respectively is 30 μ m, 50 μ m, 60 μ m, 90 μ m, 25 μ m, 120 μ m, or the zirconia particles of 150 μ m are to forming the base material in intermediate layer, carry out plasma spray coating and handle, forming arithmetic average roughness (Ra) respectively is 2.5 μ m, 8.0 μ m, 10.0 μ m, 16 μ m, 1.5 μ m, 17.0 μ m, or the top layer of 20.0 μ m make the ceramic electronic components rack, in addition, identical with the 1st embodiment, make rack.
(evaluation)
As shown in the table 3, surface roughness than the ceramic electronic components of the 11st～14 embodiment in the scope 0.313～2.381 with in the rack, unconfirmed fully have the peeling off of overlay.
Relative therewith, surface roughness bigger and be 3.333 the 8th comparative example and surface roughness smaller be the ceramic electronic components of 0.294 the 9th comparative example with in the rack, in the part of coating, confirm to peel off.In addition, surface roughness littler and be the ceramic electronic components of 0.250 the 10th comparative example with in the rack, in the almost entire portion of overlay, confirm to peel off.
Table 3
| Arithmetic average roughness (Ra (μ m)) | Surface roughness is than (intermediate layer/overlay) | Fissility | ||
| The intermediate layer | Overlay | |||
| Embodiment 11 | 5 | 2.1 | 2.381 | ○ |
| Embodiment 12 | 5 | 8.0 | 0.625 | ○ |
| Embodiment 13 | 5 | 10.0 | 0.500 | ○ |
| Embodiment 14 | 5 | 16.0 | 0.313 | ○ |
| Comparative example 8 | 5 | 1.5 | 3.333 | △ |
| Comparative example 9 | 5 | 17.0 | 0.294 | △ |
| Comparative example 10 | 5 | 20.0 | 0.250 | × |
(the 15th～18 embodiment and the 11st, 12 comparative example)
At first, with 60 weight %, average grain diameter is the Al of 2 μ m
2O
3, 40 weight %'s, average grain diameter is the Al of 20 μ m
2O
3Mix, the modulation solid constituent, then, the water of relative 25 weight portions mixes the above-mentioned solid constituent of 72 weight portions, the bonding agent of 3 weight portions, modulation slurries.
Then, identical with the 1st embodiment, the substrate surface to making according to the mode identical with the 1st embodiment sprays above-mentioned slurries, then it is carried out burn-back and handles 2 hours, and forming arithmetic average roughness (Ra) is the intermediate layer of 20.0 μ m.
Then, adopting average grain diameter is the zirconia particles of 110umm, plasma spray coating is carried out on the surface of base material handle, and respectively according to 20.0 μ m, 50.0 μ m, 100.0 μ m, 200.0 μ m, 15.0 μ m, or the thickness of 250.0 μ m form ZrO
2The top layer, make the ceramic electronic components rack.
(evaluation)
As shown in the table 4, use in the rack at the ceramic electronic components of the 15th～18 embodiment of skin depth in the scope of 20.0～200.0 μ m, between intermediate layer and top layer, the complete not bonding portion that has unconfirmed, the ratio of the arithmetic average roughness (Ra) of arithmetic average roughness in intermediate layer (Ra) and overlay (top layer) is in 0.3～2.4 times scope.
Relative therewith, skin depth be the ceramic electronic components of the 11st comparative example of 15.0 μ m with in the rack, between intermediate layer and top layer,, confirm to have not bonding portion in a part.In addition, skin depth be the ceramic electronic components of the 12nd comparative example of 250.0 μ m with in the rack, overlay (top layer) is bigger with the difference of the arithmetic average roughness (Ra) in intermediate layer, the control of the surface roughness of the overlay in intermediate layer is insufficient.
Table 4
| Intermediate layer arithmetic average roughness (Ra (μ m)) | The average thickness on top layer (μ m) | The top layer tack | Controlled | |
| Embodiment 15 | 20.0 | 20.0 | ○ | ○ |
| Embodiment 16 | 20.0 | 50.0 | ○ | ○ |
| Embodiment 17 | 20.0 | 100.0 | ○ | ○ |
| Embodiment 18 | 20.0 | 200.0 | ○ | ○ |
| Comparative example 11 | 20.0 | 15.0 | × | ○ |
| Comparative example 12 | 20.0 | 250.0 | ○ | × |
Effect of the present invention
As above-described, according to holding frame for ceramic electric part baking of the present invention, can obtain when curing, form hardly and the baked body reaction, do not suppress the volatilization of the bonding agent in the baked body, uniformly baked body. In addition, in the baking step of automation, during goods after collection is cured, do not collect badly fully, can tackle and cure automation and process.
Claims (5)
1. a ceramic electronic components cures and uses rack, wherein on substrate surface, has overlay, it is characterized in that:
This overlay has the surface roughness of ratio in 1/20～1/65 scope of arithmetic average roughness (Ra) and the thickness of baked body, and above-mentioned overlay has the surface roughness of arithmetic average roughness (Ra) in the scope of 5～15 μ m.
2. a ceramic electronic components cures and uses rack, wherein on substrate surface, has overlay, it is characterized in that:
Above-mentioned overlay has following surface roughness, wherein 10 average surface roughness (Rz) and the ratio of the thickness of baked body be in 1/3.5～1/11.0 scope, and the length of the average headway of convex-concave portion (Sm) and baked body is than in 1/1.3～1/10.0 scope.
3. ceramic electronic components according to claim 2 cures uses rack, it is characterized in that above-mentioned overlay has 10 average surface roughness (Rz) in the scope of 27～86 μ m, and the surface roughness of the average headway of convex-concave portion (Sm) in the scope of 60～461 μ m.
4. a ceramic electronic components cures and uses rack, wherein on substrate surface, has overlay, it is characterized in that:
Above-mentioned overlay is formed by intermediate layer and top layer, and with regard to arithmetic mean roughness (Ra), the surface roughness in above-mentioned intermediate layer is 0.3～2.4 times of surface roughness of above-mentioned overlay, and the average thickness on above-mentioned top layer is in the scope of 20～200 μ m.
5. ceramic electronic components according to claim 4 cures uses rack, it is characterized in that the surface roughness with regard to above-mentioned intermediate layer, and arithmetic average roughness (Ra) is in the scope of 5～20 μ m.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002013912 | 2002-01-23 | ||
| JP2002013912A JP4024544B2 (en) | 2002-01-23 | 2002-01-23 | Ceramic electronic parts firing setter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1434470A CN1434470A (en) | 2003-08-06 |
| CN1235246C true CN1235246C (en) | 2006-01-04 |
Family
ID=27650753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021462968A Expired - Lifetime CN1235246C (en) | 2002-01-23 | 2002-10-21 | Holding frame for ceramic electric part baking |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4024544B2 (en) |
| KR (1) | KR100491805B1 (en) |
| CN (1) | CN1235246C (en) |
| TW (1) | TWI225042B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4713981B2 (en) * | 2005-08-08 | 2011-06-29 | コバレントマテリアル株式会社 | Ceramic electronic component firing container |
| JP2011046562A (en) * | 2009-08-27 | 2011-03-10 | Nec Tokin Corp | Setter for firing ceramic green sheet |
| CN107195490B (en) * | 2017-06-22 | 2018-09-21 | 刘奇美 | A kind of drying unit for capacitor case production and processing |
| CN108088263A (en) * | 2018-02-05 | 2018-05-29 | 江苏三恒高技术窑具有限公司 | The high temperature load bearing board that a kind of surface topography accurately controls |
| JP2020073432A (en) * | 2019-10-23 | 2020-05-14 | 三井金属鉱業株式会社 | Ceramic lattice body |
-
2002
- 2002-01-23 JP JP2002013912A patent/JP4024544B2/en not_active Expired - Lifetime
- 2002-10-21 CN CNB021462968A patent/CN1235246C/en not_active Expired - Lifetime
- 2002-10-25 TW TW091125182A patent/TWI225042B/en not_active IP Right Cessation
- 2002-12-17 KR KR10-2002-0080582A patent/KR100491805B1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| CN1434470A (en) | 2003-08-06 |
| JP2003212665A (en) | 2003-07-30 |
| KR20030064267A (en) | 2003-07-31 |
| KR100491805B1 (en) | 2005-05-27 |
| JP4024544B2 (en) | 2007-12-19 |
| TWI225042B (en) | 2004-12-11 |
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