CN1891669A - Jig for baking electronic component - Google Patents

Jig for baking electronic component Download PDF

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Publication number
CN1891669A
CN1891669A CNA2006101005436A CN200610100543A CN1891669A CN 1891669 A CN1891669 A CN 1891669A CN A2006101005436 A CNA2006101005436 A CN A2006101005436A CN 200610100543 A CN200610100543 A CN 200610100543A CN 1891669 A CN1891669 A CN 1891669A
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CN
China
Prior art keywords
zro
middle layer
stabilization
jig
electronic component
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Chinese (zh)
Inventor
二本松浩明
堀田启之
中西泰久
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NGK Insulators Ltd
NGK Adrec Co Ltd
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NGK Insulators Ltd
NGK Adrec Co Ltd
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Publication of CN1891669A publication Critical patent/CN1891669A/en
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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/14—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silica
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64—Burning or sintering processes
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/87—Ceramics
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00—Charging; Discharging; Manipulation of charge
    • F27D3/12—Travelling or movable supports or containers for the charge

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

The invention provides a firing tool for electronic components to which an electronic component is not adhered after being fired and which can prevent the separation of the coating layer therefrom and the formation of appearance defects on the electronic components. The firing tool for electronic components has a coating layer on the surface of a substrate made of a ceramic. The coating layer comprises an intermediate layer formed on the surface of the substrate and containing at least one layer comprising a material which absorbs components coming from the component to be fired and passing the surface layer, and adversely affecting the substrate and the surface layer formed on the surface of the intermediate layer and made of a material less reactive with the component to be fired.

Description

Jig for baking electronic component
Technical field
The present invention relates to jig for baking electronic component.
Background technology
In the past, when the electronic unit that Low fire ceramic electrical condenser, thermistor, ferrite etc. are made of pottery, for example adopt always aluminum oxide burn till with anchor clamps (for example saggar, plate etc.) above mounting electronic unit and the method for burning till.But, produce dysgenic composition (silicon-dioxide (SiO for example in order to prevent characteristic to electronic unit (by sintered body) 2) etc.) disperse, above-mentioned firing clamp need improve aluminum oxide (Al as much as possible 2O 3) content, if but improve aluminum oxide (Al 2O 3) content, thermal expansivity will increase, and resistance to sudden heating reduces, the lost of life.
In order to address the above problem, people use on the surface of stupalith (base material) always and form zirconium white (ZrO 2) burning till of coating use anchor clamps, perhaps at stupalith (base material) and zirconium white (ZrO 2) spraying plating aluminum oxide (Al between the coating 2O 3) and burning till of middle layer of formation used anchor clamps.
In addition, the burning till with anchor clamps (with reference to patent documentation 1) of the coating that aluminum oxide constituted that has on the surface of stupalith (base material) by with respect to not zirconic total amount of stabilized zirconia and complete stabilityization or the zirconic total amount of partially stabilizedization being 2～15 quality % also once disclosed, and, will contain aluminum oxide (Al 2O 3) and zirconium white (ZrO 2) eutectiferous spraying plating overlay film with the firing clamp (with reference to patent documentation 2) in making coatings or middle layer.Compare with firing clamp in the past, the firing clamp of patent documentation 1 and patent documentation 2 can prevent that when reality is used coating peels off and prevent to produce the coating or the growth crackle from base material, so resistance to sudden heating excellence and life-span are long.
But, in recent years because the variation of electronic unit, the chance that employing firing clamp in the past burns till the electronic unit that contains various compositions increases, when burning till electronic unit, because base material is had dysgenic composition to be soaked into by coating (top layer and middle layer) from electronic unit, cause to such an extent that its access times reduce, burn till the back electronic unit and can adhere on the firing clamp, peeling off or the problems such as bad order of electronic unit of coating perhaps taken place.
Patent documentation 1: the spy opens flat 10-1369 communique
Patent documentation 2: the spy opens the 2001-220248 communique
Summary of the invention
The present invention finishes in view of above-mentioned problems of the prior art, the objective of the invention is to, when burning till electronic unit, utilize the middle layer absorb from electronic unit by coating (top layer and middle layer) base material is had dysgenic composition, burn till the jig for baking electronic component that back electronic unit can not adhere on the firing clamp and can prevent coating stripping or electronic unit bad order thereby be provided at.
To achieve these goals, the invention provides following jig for baking electronic component.
(1) jig for baking electronic component, it is characterized in that, on the surface of the base material that constitutes by pottery, has coating, described coating comprises middle layer and top layer, described middle layer is to form on the surface of described base material, and comprise one deck at least and contain the layer of absorption from the material that had dysgenic composition by sintered body by the top layer, to described base material, described top layer is positioned at the surface in described middle layer, by with formed by the reactive low material of sintered body.
(2) above-mentioned (1) described jig for baking electronic component contains not stabilization ZrO in the described middle layer 2
(3) above-mentioned (1) or (2) described jig for baking electronic component, described middle layer are stabilization ZrO not 2And Al 2O 3Mixture.
(4) any one described jig for baking electronic component in above-mentioned (1)～(3), described middle layer forms by sintering or plasma spray coating.
(5) any one described jig for baking electronic component in above-mentioned (2)～(4), described not stabilization ZrO 2Median size be 1～50 μ m.
(6) any one described jig for baking electronic component in above-mentioned (2)～(5), described not stabilization ZrO 2Addition be 5～80 quality %.
(7) any one described jig for baking electronic component in above-mentioned (1)～(6), the principal constituent on described top layer is by stabilization ZrO 2, ZrCaO 3, TiO 2In at least a formation.
(8) any one described jig for baking electronic component in above-mentioned (1)～(7), the principal constituent on described top layer is by ZrCaO 3With stabilization ZrO 2Mixture constitute.
Jig for baking electronic component of the present invention burns till the back electronic unit and can not adhere on the firing clamp, can prevent the bad order of coating stripping or electronic unit.
Embodiment
Embodiments of the present invention below are described, but the present invention is not limited to following embodiment, should be understood to, in the scope that does not exceed aim of the present invention, can suitably carries out change, improvement of scheme etc. based on those skilled in the art's general knowledge.
Jig for baking electronic component of the present invention, on the surface of the base material that constitutes by pottery, has coating, described coating comprises middle layer and top layer, described middle layer is to form on the surface of described base material, and comprise one deck at least and contain the layer of absorption from the material that had dysgenic composition by sintered body by the top layer, to described base material, described top layer is positioned at the surface in described middle layer, by with formed by the reactive low material of sintered body.
At this, the principal character of jig for baking electronic component of the present invention is, by add the not stabilization ZrO of specified amount in middle layer in the past 2, when burning till electronic unit, utilize the not stabilization ZrO that is present in the middle layer 2Absorption from electronic unit by coating (top layer and middle layer), base material is had dysgenic composition, thereby can prevent that base material is had dysgenic composition to be penetrated in the base material.Thereby even use jig for baking electronic component of the present invention repeatedly, electronic unit can not adhere on the firing clamp yet after burning till electronic unit, can prevent coating stripping or electronic unit bad order for a long time.
In addition, jig for baking electronic component of the present invention since in the middle layer base material had dysgenic composition also the playing not stabilization ZrO of solid solution 2Function of stabilizer, therefore can prevent owing in the middle layer, add not stabilization ZrO 2And the middle layer efflorescence phenomenon that is easy to generate, and then the stabilization in middle layer can help to comprise the stabilization of the coating in top layer and middle layer.
Base material is had dysgenic composition be not particularly limited, can enumerate for example compositions such as Ca, Mn, Ba, in addition,, for example can enumerate compositions such as Si from also being not particularly limited of base material diffusion to had dysgenic composition by sintered body.
The principal constituent that constitutes middle layer of the present invention is preferably not stabilization ZrO 2And Al 2O 3Mixture.This is because this mixture is for making the not stabilization ZrO that has dysgenic composition and middle layer from electronic unit (by burning till product) by coating (top layer and middle layer), to base material 2Solid solution produces the effect absorbed by the middle layer and is absolutely necessary, and it also is crucial the top layer being fixed on aspect the effect of the cushioning material of using on the base material in performance simultaneously.
On the other hand, the middle layer is aluminum oxide (Al 2O 3) and zirconium white (ZrO 2) eutectic (with certain blending ratio crystalline crystal) time owing to there is not independently a not stabilization ZrO 2, to base material have dysgenic composition (for example compositions such as Ca, Mn, Ba) can not with stabilization ZrO not 2Solid solution, base material is had dysgenic composition (for example compositions such as Ca, Mn, Ba) can be penetrated in the base material and reaction, thereby after burning till electronic unit, electronic unit adheres on the firing clamp easily, can not prevent coating stripping or electronic unit bad order.
In addition, constituting middle layer of the present invention preferably forms by sintering or plasma spray coating.The thickness that constitutes middle layer of the present invention is preferably smaller or equal to 1000 μ m, 50～500 μ m more preferably, 100～300 μ m more preferably prevent that the angle of the weight that produces stress and alleviate anchor clamps from considering that such thickness range is an ideal when applying the middle layer.
At this moment, constitute the not stabilization ZrO in middle layer of the present invention 2Median size comparatively suitable at 1～50 μ m, this be because, above-mentioned not stabilization ZrO 2Median size less than 1 μ m the time, the intensity in the middle layer at logical kiln initial stage reduces bigger, has the danger of peeling off; Otherwise, above-mentioned not stabilization ZrO 2Median size when surpassing 50 μ m, stabilization ZrO not 2Particle become thick, base material is had dysgenic composition (for example compositions such as Ca, Mn, Ba) can not carry out solutionizing effectively.
In addition, constitute the not stabilization ZrO in middle layer of the present invention 2Addition be 5～80 quality %, more preferably 20～70 quality %, more preferably 40～60 quality %.This be because, above-mentioned not stabilization ZrO 2Addition less than 5 quality % the time, can not prevent that base material is had dysgenic composition (for example compositions such as Ca, Mn, Ba) to permeate in base material; Otherwise, above-mentioned not stabilization ZrO 2Addition when surpassing 80 quality %, stabilization ZrO not 2Addition too much, can not keep the intensity in middle layer.
In addition, constitute the principal constituent on top layer of the present invention preferably by stabilization ZrO 2, ZrCaO 3, TiO 2In at least a formation.At this, the top layer of using among the present invention must be with as the electronic unit material by the reactive low material of sintered body, this material is according to by the kind of sintered body and difference.
The thickness that constitutes top layer of the present invention is preferably smaller or equal to 1000 μ m, 30～300 μ m more preferably, 50～150 μ m more preferably consider that from the angle of the stress that reduces the residual expansion that produces with being reacted by sintered body etc. as far as possible such thickness range is an ideal.
In addition, the stabilization ZrO that uses among the present invention 2Be not particularly limited, can suitably select to use Y 2O 3Stabilization ZrO 2, Y 2O 3Partially stabilizedization ZrO 2, CaO stabilization ZrO 2, partially stabilizedization of CaO ZrO 2In a kind, more than 2 kinds or 2 kinds.
And then the principal constituent that constitutes base material of the present invention preferably is selected from the Al by crumpling resistance and resistance to bend(ing) excellence 2O 3-SiO 2, SiC-Si 3N 4, Al 2O 3-SiO 2At least a in the group that-MgO, Si-SiC, SiC form.
Constitute the Al of base material of the present invention 2O 3Content be advisable at 70～95 quality %.This be because, the Al of base material 2O 3Contain quantity not sufficient 70% time, the thermal conductivity of base material is low, occurs the temperature deviation in the firing clamp easily, causes quilt on the firing clamp to burn till the product characteristic heterogeneity that becomes; Otherwise, the Al of base material 2O 3Content greater than 95% o'clock, the coefficient of thermal expansion of base material increases, the stress that is caused by temperature head increases, thereby is easy to generate crackle.
The manufacture method of firing clamp of the present invention is, at first, utilizes sintering or plasma spray to be plated in and forms the middle layer on the base material, then, is plated on the resulting middle layer by spray sintering or plasma spray and forms the top layer, thereby form coating on base material.
Here said spraying plating is meant that the micropowder (hereinafter referred to as " depositing materials ") with metal or pottery adds the thermosetting molten state, and jetting forms the method for spraying plating overlay film to the surface of object.The method of spraying plating has, and adopts heating means to use the gas spraying plating of burning flame, utilizes the whole bag of tricks such as arc spraying of electric arc, in the present invention, preferably forms the spraying plating overlay film in middle layer by the plasma spray coating that utilizes plasma spraying.
For the present invention, in plasma spray coating, especially preferably make water plasma spray coating (water-stable plasma spray coating).This be because, utilizing the maximum film thickness of the spraying plating overlay film that the gas plasma spraying plating forms is about 300 μ m, and if adopt water (stabilization) plasma spray coating, can form maximum film thickness and be the thick overlay film about 1000 μ m.In addition, because water (stabilization) plasma spray coating can form comparison porous, shaggy overlay film, aspect the tack of base material, also be preferred therefore improving.
Be described more specifically the present invention by the following examples, but the present invention is not limited to these embodiment.
Embodiment 1～13, comparative example 1～5
Adopt the method for the following stated, make the test film of jig for baking electronic component respectively.
The making method of＜base material 〉
(1)Al 2O 3-SiO 2
In the fused corundom particle of maximum particle diameter 150 μ m, add clay, Calcined polishing aluminum oxide, make alumina content reach 85 quality %, and carry out mixingly, utilize the oil pressure pressing machine with 1000kg/cm 2Pressure the base soil after mixing is configured as the tabular body of length 200mm * width 200mm * thickness 5mm, obtain molding.With the molding drying that obtains, burn till 1650 ℃ of following maintenances 5 hours, make test film (embodiment 1～7, embodiment 9～13, comparative example 1～5).
(2)SiC-Si 3N 4
The metal Si of SiC, the 5 quality % of the median size 1 μ m of the SiC particle of the maximum particle diameter 100 μ m of 70 quality %, 25 quality % is mixed, mixed raw material is made slurry, utilize gypsum mold to carry out castable, obtain the tabular body of length 150mm * width 150mm * thickness 8mm.With resulting tabular body drying, in nitrogen atmosphere stove, keep burning till in 5 hours in 1400 ℃, make test film (embodiment 8).
The making method in＜middle layer 〉
(1) sintering processing A: make water as solvent, (median size 1 μ m) makes slurry with sintered alumina.The slurry that obtains is applied on the base material, kept 5 hours at 1450 ℃ then, respectively the middle layer (comparative example 1 and comparative example 2) of sintering thickness 100 μ m.
(2) sintering processing B: make water as solvent, will add the not stabilization ZrO of median size shown in the table 1 and ratio (quality %) 2Sintered alumina (median size 1 μ m) make slurry.The slurry that obtains is applied on the base material, kept 5 hours at 1450 ℃ then, respectively the middle layer (embodiment 1～4, embodiment 6～12, comparative example 3～5) of sintering thickness 100 μ m.
(3) plasma spray coating processing: use and added the not stabilization ZrO of median size shown in the table 1 and ratio (quality %) 2Fused corundom (median size 70 μ m), base material is carried out plasma spray coating, make the middle layer (embodiment 5) of thickness 100 μ m.
(4) 2 of the middle layer layers of processing: the not stabilization ZrO that uses the median size 20 μ m that added 50 quality % 2, the Y that contains 8 quality % 2O 3Stabilization ZrO 2(median size 70 μ m) carry out plasma spray coating to base material, the 1st layer of the centre of making thickness 100 μ m.Then, the sintered alumina (median size 1 μ m) of coating sizing-agentization (solvent is a water) on middle the 1st layer kept the 2nd layer of the centre of sintering thickness 50 μ m (embodiment 13) 5 hours down at 1450 ℃ then.
The making method on＜top layer: except that embodiment 9 (50 μ m), coat-thickness 100 μ m 〉
(1) plasma spray coating processing A: use the Y that contains 8 quality % 2O 3Stabilization ZrO 2(median size 70 μ m) (embodiment 1～4, embodiment 6～8, embodiment 13, comparative example 1, comparative example 3～5).
(2) plasma spray coating processing B: the not stabilization ZrO that uses the median size 20 μ m that added 50 quality % 2, the Y that contains 8 quality % 2O 3Stabilization ZrO 2(median size 70 μ m) (comparative example 2).
(3) plasma spray coating processing C: use TiO 2(median size 20 μ m) (embodiment 9).
(4) plasma spray coating processing D: use ZrCaO 3(median size 70 μ m) (embodiment 10).
(5) plasma spray coating processing E: the Y that contains 8 quality % that uses median size 70 μ m 2O 3Stabilization ZrO 2The ZrCaO of (50 quality %)+median size 70 μ m 3(50 quality %) (embodiment 11).
(6) plasma spray coating processing F: the Y that contains 8 quality % that uses median size 70 μ m 2O 3Stabilization ZrO 2The TiO of (70 quality %)+median size 20 μ m 2(30 quality %) (embodiment 12).
(7) sintering processing: use the Y that contains 8 quality % 2O 3Stabilization ZrO 2(median size 5 μ m) (embodiment 5).
Table 1
The top layer Middle layer ([1]: the 1st layer, [2]: the 2nd layer) Base material
Material Art stabilization ZrO 2(quality %) Coating method Coat-thickness (μ m) Material Stabilization ZrO not 2(quality %) Median size (μ m) Coating method Coat-thickness (μ m) Material
Embodiment 1 Stabilization ZrO 2 0 Spraying plating 100 Al 2O 3+ stabilization ZrO not 2 5 20 Sintering 100 Al 2O 3+SiO 2
Embodiment 2 Stabilization ZrO 2 0 Spraying plating 100 Al 2O 3+ stabilization ZrO not 2 50 1 Sintering 100 Al 2O 3+SiO 2
Embodiment 3 Stabilization ZrO 2 0 Spraying plating 100 Al 2O 3+ stabilization ZrO not 2 50 5 Sintering 100 Al 2O 3+SiO 2
Embodiment 4 Stabilization ZrO 2 0 Spraying plating 100 Al 2O 3+ stabilization ZrO not 2 50 20 Sintering 100 Al 2O 3+SiO 2
Embodiment 5 Stabilization ZrO 2 0 Spraying plating 100 Al 2O 3+ stabilization ZrO not 2 50 20 Spraying plating 100 Al 2O 3+SiO 2
Embodiment 6 Stabilization ZrO 2 0 Spraying plating 100 Al 2O 3+ stabilization ZrO not 2 50 50 Sintering 100 Al 2O 3+SiO 2
Embodiment 7 Stabilization ZrO 2 0 Spraying plating 100 Al 2O 3+ stabilization ZrO not 2 80 20 Sintering 100 Al 2O 3+SiO 2
Embodiment 8 Stabilization ZrO 2 0 Spraying plating 100 Al 2O 3+ stabilization ZrO not 2 50 20 Sintering 100 SiC+Si 3N 4
Embodiment 9 TiO 2 0 Spraying plating 50 Al 2O 3+ stabilization ZrO not 2 50 20 Sintering 100 Al 2O 3+SiO 2
Embodiment 10 ZrCaO 3 0 Spraying plating 100 Al 2O 3+ last stabilization ZrO 2 50 20 Sintering 100 Al 2O 3+SiO 2
Embodiment 11 Stabilization ZrO 2+ ZrCaO 3 0 Spraying plating 100 Al 2O 3+ stabilization ZrO not 2 50 20 Sintering 100 Al 2O 3+SiO 2
Embodiment 12 Stabilization ZrO 2+ TiO 2 0 Spraying plating 100 Al 2O 3+ stabilization ZrO not 2 50 20 Sintering 100 Al 2O 3+SiO 2
Embodiment 13 Stabilization ZrO 2 0 Spraying plating 100 [1] stabilization ZrO 2+ stabilization ZrO not 2 [2]Al 2O 3 50 20 [1] spraying plating [2] sintering [1]100 [2]50 Al 2O 3+SiO 2
Comparative example 1 Stabilization ZrO 2 0 Spraying plating 100 Al 2O 3 0 - Sintering 100 Al 2O 3+SiO 2
Comparative example 2 Stabilization ZrO 2+ stabilization ZrO not 2 50 Spraying plating 100 Al 2O 3 0 - Sintering 100 Al 2O 3+SiO 2
Comparative example 3 Stabilization ZrO 2 0 Spraying plating 100 Al 2O 3+ stabilization ZrO not 2 3 20 Sintering 100 Al 2O 3+SiO 2
Comparative example 4 Stabilization ZrO 2 0 Spraying plating 100 Al 2O 3+ stabilization ZrO not 2 50 100 Sintering 100 Al 2O 3+SiO 2
Comparative example 5 Stabilization ZrO 2 0 Spraying plating 100 Al 2O 3+ stabilization ZrO not 2 90 20 Sintering 100 Al 2O 3+SiO 2
The test piece of adopting following method evaluation to obtain by above-mentioned making method.It the results are shown in the table 2.
The evaluation method 1 of＜test piece: the logical kiln number of times when base material being had dysgenic composition (object component) arrival base material 〉
BaCO with 2 quality % 3, 2 quality % MnCO 3, 26 quality % BaTiO 3Be dispersed in the water of 70 quality %, make dispersion liquid, this dispersion liquid (0.8g) is applied on the surface of test piece, carry out repeatedly then keeping 1 hour burn till at 1350 ℃.After per burn till for 5 times, observe the section of test piece, according to Ba, burn till number of times evaluation when Mn composition (object component) arrives base material with SEM.
The evaluation method 2 of＜test piece: strength of coating 〉
Carry out adhesion test according to JIS H8666, estimate strength of coating by the following stated.
◎: do not find that the top layer therefrom peels off on the interbed.
Zero: find the part top layer (smaller or equal to whole 50%) peel off from the middle layer.
△: find most of top layer (greater than whole 50%) peel off from the middle layer.
The evaluation method 3 of＜test piece: with the reactivity (workpiece reactivity) of workpiece (by sintered body) 〉
By with BaTiO 3For the material of principal constituent is made the tabular (workpiece of size: 40mm * 40mm * 2mm).The workpiece that obtains is placed in the test piece, keeps down burning till in 5 hours, then, observe the status degenerativus of estimating workpiece by outward appearance at 1300 ℃.
◎: do not find that workpiece is rotten.
Zero: find workpiece a part (smaller or equal to whole 50%) rotten.
△: find workpiece major part (greater than whole 50%) rotten.
Table 2
Arrive the logical kiln number of times (inferior) of base material until object component Strength of coating The workpiece reactivity
Embodiment 1 25 ◎ ○
Embodiment 2 40 ○ ○
Embodiment 3 40 ◎ ○
Embodiment 4 45 ◎ ○
Embodiment 5 45 ◎ ○
Embodiment 6 30 ○ ○
Embodiment 7 70 ○ ○
Embodiment 8 45 ◎ ○
Embodiment 9 70 ◎ ◎
Embodiment 10 50 ◎ ◎
Embodiment 11 50 ◎ ◎
Embodiment 12 60 ◎ ◎
Embodiment 13 50 ○ ○
Comparative example 1 20 ◎ ○
Comparative example 2 40 ◎ △
Comparative example 3 20 ◎ ○
Comparative example 4 20 ○ ○
Comparative example 5 80 △ ○
＜investigate: embodiment 1～13, comparative example 1～5 〉
As can be known from the results of Table 2, embodiment 1～13 since the middle layer used and be added with not stabilization ZrO 2Aluminum oxide, compare with comparative example 1～5, even use repeatedly, electronic unit can not adhere on the firing clamp yet after burning till electronic unit, can prevent peeling off or the bad order of electronic unit of coating for a long time.Particularly embodiment 9～12, and this effect is very remarkable.
On the other hand, though comparative example 1 strength of coating is good, the workpiece reactivity is also no problem, and logical kiln number of times is insufficient.Comparative example 2 is by increasing the not stabilization ZrO on top layer 2Addition, can increase logical kiln number of times, but workpiece reactivity existing problems find that workpiece is rotten.Comparative example 3 is because the not stabilization ZrO that adds in the middle layer 2Very few, can not obtain effect of sufficient (with reference to comparative example 1) aspect logical kiln number of times, strength of coating and the workpiece reactivity.Comparative example 4 is because the not stabilization ZrO that adds in the middle layer 2Median size excessive, can not obtain effect of sufficient aspect logical kiln number of times, strength of coating and the workpiece reactivity.As for comparative example 5, though can increase logical kiln number of times, because the not stabilization ZrO that in the middle layer, adds 2Too much, can not obtain sufficient strength of coating.
The possibility of utilizing on the industry
Jig for baking electronic component of the present invention can be suitable for the electronic unit that Low fire ceramic capacitor, thermistor, ferrite etc. are made of pottery.

Claims (8)

1. jig for baking electronic component, it is characterized in that, on the surface of the base material that constitutes by pottery, has coating, described coating comprises middle layer and top layer, described middle layer is to form on the surface of described base material, and comprise one deck at least and contain the layer of absorption from the material that had dysgenic composition by sintered body by the top layer, to described base material, described top layer is positioned at the surface in described middle layer, by with formed by the reactive low material of sintered body.
2. jig for baking electronic component according to claim 1 wherein, contains not stabilization ZrO in the described middle layer 2
3. jig for baking electronic component according to claim 1 and 2, wherein, described middle layer is stabilization ZrO not 2With Al 2O 3Mixture.
4. according to any one the described jig for baking electronic component in the claim 1～3, wherein, described middle layer is to form by sintering or plasma spray coating.
5. according to any one the described jig for baking electronic component in the claim 2～4, wherein, described not stabilization ZrO 2Median size be 1～50 μ m.
6. according to any one the described jig for baking electronic component in the claim 2～5, wherein, described not stabilization ZrO 2Addition be 5～80 quality %.
7. according to any one the described jig for baking electronic component in the claim 1～6, wherein, the principal constituent on described top layer is by stabilization ZrO 2, ZrCaO 3, TiO 2In at least a formation.
8. according to any one the described jig for baking electronic component in the claim 1～7, wherein, the principal constituent on described top layer is by ZrCaO 3With stabilization ZrO 2Mixture constitute.
CNA2006101005436A 2005-07-06 2006-07-03 Jig for baking electronic component Pending CN1891669A (en)

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CN113387725A (en) * 2021-06-30 2021-09-14 江西省萍乡市湘东石油化工填料厂 Modified zirconia corundum slurry for honeycomb ceramic heat accumulator surface and pulping method thereof
CN113387725B (en) * 2021-06-30 2022-07-19 江西省萍乡市湘东石油化工填料厂 Modified zirconia corundum slurry for honeycomb ceramic heat accumulator surface and pulping method and application thereof

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JP2007015882A (en) 2007-01-25

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