CN1452191A - Clamp for heat treatment of ceramic for electronic component and mfg. method thereof - Google Patents
Clamp for heat treatment of ceramic for electronic component and mfg. method thereof Download PDFInfo
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- CN1452191A CN1452191A CN03110605A CN03110605A CN1452191A CN 1452191 A CN1452191 A CN 1452191A CN 03110605 A CN03110605 A CN 03110605A CN 03110605 A CN03110605 A CN 03110605A CN 1452191 A CN1452191 A CN 1452191A
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Abstract
In order to provide a jig for heat-treating a ceramic for electronic parts which has an improved peeling resistance of a coating layer such as a sprayed coating film, etc., shows excellent strength under heat, creep resistance and durability and can be suitably used in a heat-treatment or baking process of the ceramic for the electronic parts such as a ceramic capacitor, a ceramic transformer, etc., and its manufacturing process. On each of upper and lower surfaces of a first layer which is an SiC ceramic substrate 1, a second layer comprising at least one ceramic 2 chosen from Al2O3, Al2O3-SiO2, Al2O3-SiO2-MgO and MgO-Al2O3-ZrO2 ceramics is formed. On a partial or entire surface of the second layer, a third layer comprising a single or multiple sprayed coating film layers 3 containing at least one chosen from Al2O3, mullite, ZrO2and Y2O is formed.
Description
Technical field
The present invention relates to the heat treatment anchor clamps and the manufacture method thereof of electronic component-use pottery, in more detail, relate to the heat treatment of electronic component-use pottery of the heat treatment of the electronic component-use pottery that is applicable to ceramic capacitor, ceramic transformer etc. or ablating work procedure with anchor clamps and manufacture method thereof.
Technical background
In recent years, pottery is a large amount of as electronic material, for example, the strong dielectrics such as barium titanate pottery is used for making ceramic capacitor, again, soft magnetic ferrite (Mn-Zn system, Ni-Zn system etc.) piezoelectric ceramics is used for making ceramic transformer etc., is used as the constituent material of electronic unit.
The aforementioned electronic parts are generally heat-treated or are fired 1000～1700 ℃ temperature range with pottery.Therefore, the heat treatment anchor clamps as the electronic component-use pottery will adopt Al
2O
3-SiO
2Matter, Al
2O
3-SiO
2-MgO matter, MgO-Al
2O
3-ZrO
2The pottery of the excellent heat resistances such as matter, SiC matter.Wherein, SiC matter pottery particularly, so because high-temperature capability and anti-creep good be best material.
But, when directly placing object being treated etc. in above-mentioned heat treatment on anchor clamps they are in contact with one another, according to its composition, when heat treatment, react with the constituent material of this heat treatment with anchor clamps sometimes.At this moment, in order to prevent the reaction between object being treated and this anchor clamps, adopt the ZrO by the reactivity difference
2Consist of the design of chucking surface on pottery.
For example, carrying out barium titanate (BaTiO
3) heat treatment the time, use ZrO
2Ceramic material again, when carrying out the heat treatment of soft magnetic ferrite (Mn-Zn system, Ni-Zn system etc.), adopts Al
2O
3, ZrO
2Or with the same pottery that forms of object being treated, perhaps utilize these potteries to cover the form of SiC matter ceramic base materials etc.
Obtain above-mentioned cladding material, for example, can after smearing desirable ceramic raw material, adopt formation such as high temperature burn-back method, CVD method, metallikon.Wherein, particularly metallikon is to utilize anchor effect to carry out the method that physics connects airtight, owing to coverlay is difficult for peeling off, therefore by more employing.
As such cladding material, for example on JP 2001-278685 communique, spraying plating Al on the good SiC matter ceramic base material of high-temperature capability and anti-creep (creep) has been proposed
2O
3, mullite, ZrO
2Deng the heat treatment parts.
Above-mentioned parts as shown in Figure 2, with SiC matter ceramic base material 11 surface roughenings, are difficult to constitute the spraying plating coverlay of being made up of multilayer 12,13 then with peeling off.
But above-mentioned parts directly form Al because be on the surface of SiC matter ceramic base material 11
2O
3, mullite, ZrO
2Deng spraying plating coverlay 12,13 form, so, when the heat treatment that is used for the electronic component-use pottery or ablating work procedure, see through spraying plating coverlay 12,13 oxygen and can make the surface oxidation of SiC matter ceramic base material 11 and embrittlement.Then, along with the increase of frequency of utilization, spraying plating coverlay 12,13 can be from SiC matter ceramic substrate 11 sur-face peelings.
Therefore, though the heat treatment of above-mentioned formation with anchor clamps on, can not say fully to prevent peeling off of spraying plating coverlay, but obtain the longer heat treatment anchor clamps of Durability.
Summary of the invention
The present invention, be in order to solve the scheme of above-mentioned technical task, purpose is to provide and can improves tectal anti-fissilities such as spraying plating coverlay, and high-temperature capability, anti-creep and durability are good, thereby the heat treatment of electronic component-use pottery that is applicable to the heat treatment of electronic component-use pottery of ceramic capacitor, ceramic transformer etc. or ablating work procedure is with anchor clamps and manufacture method thereof.
The heat treatment anchor clamps of electronic component-use pottery of the present invention is characterized in that: on the 1st layer top and bottom as SiC matter ceramic substrate, have from Al
2O
3, Al
2O
3-SiO
2Matter, Al
2O
3-SiO
2-MgO matter, MgO-Al
2O
3-ZrO
2The 2nd layer of consisting of of choose in the matter at least a kind pottery, and, aforementioned the 2nd layer surface part or all, have and contain from Al
2O
3, mullite, ZrO
2, Y
2The spraying plating of at least any a kind single or multiple lift of choosing among the O covers the 3rd layer that rete consists of.
Like this, the 2nd layer of being made of above-mentioned pottery is set between the rete consists of by covering in SiC matter ceramic substrate and spraying plating, can suppress peeling off of spraying plating coverlay that the oxidation owing to SiC matter ceramic base plate surface causes.
Each thickness of aforementioned the 2nd layer top and bottom below the above 7mm of 1mm, and, be preferably in aforementioned the 1st layer with the 2nd layer boundary section, have SiC matter pottery and consist of the layer that the 2nd layer pottery mixes.
By layers 1 and 2 being designed to formation as described above, can more effectively stop and pass the oxygen that spraying plating covers rete and arrive SiC matter ceramic substrate, thus prevent from the 1st layer with the 2nd layer boundary section on peel off, and, can prevent crackle and breakage, give its good hear resistance.
Again, aforementioned the 2nd layer of each surperficial center line average roughness Ra is preferably in below the above 20 μ m of 3 μ m.
From prevent from the 1st layer with the 2nd layer boundary section on peel off, and prevent the 2nd layer crackle and breakage, and evenly and moderately form the viewpoint that the spraying plating with smooth surface covers rete and set out that the 2nd layer is preferably designed as above-mentioned surface roughness.
Again, aforementioned the 3rd layer thickness is preferably in below the above 500 μ m of 50 μ m.
By being designed to the thickness of above-mentioned scope, can obtain being difficult for peeling off the 3rd layer, and, in heat treatment or ablating work procedure, can fully prevent the reaction of these anchor clamps and the object being treated that contacts with it.
Again, the heat treatment of electronic component-use pottery of the present invention is characterized in that: on the top and bottom of SiC plasmid sublayer, dispose from Al with the manufacture method of anchor clamps
2O
3, Al
2O
3-SiO
2Matter, Al
2O
3-SiO
2-MgO matter, MgO-Al
2O
3-ZrO
2The particle layer of at least a kind of formation choosing in the matter, moulding, fire after, part or all formation on the surface of the tabular pottery that obtains contains from Al
2O
3, mullite, ZrO
2, Y
2The spraying plating of at least any a kind single or multiple lift of choosing among the O covers rete.
Like this, by the while moulding, fire SiC matter pottery (the 1st layer) and from Al
2O
3, Al
2O
3-SiO
2Matter, Al
2O
3-SiO
2-MgO matter, MgO-Al
2O
3-ZrO
2At least a kind of pottery choosing in the matter (the 2nd layer) can make two-layer strong ground sinter bonded, therefore can prevent peeling off on this boundary section.
In above-mentioned manufacture method, be preferably in aforementioned SiC plasmid sublayer with from Al
2O
3, Al
2O
3-SiO
2Matter, Al
2O
3-SiO
2-MgO matter, MgO-Al
2O
3-ZrO
2On the boundary section of the particle layer of at least a kind of formation choosing in the matter, make near the particle this boundary coarse during by moulding, form SiC plasmid with from Al2O3, Al
2O
3-SiO
2Matter, Al
2O
3-SiO
2-MgO matter, MgO-Al
2O
3-ZrO
2The ceramic layer of the mix particles of at least a kind of formation choosing in the matter.
By form the layer that constitutes two-layer mix particles in above-mentioned boundary section, can make the sinter bonded on this boundary section more strong, thereby two-layer more being difficult to peeled off.
Again, aforementioned spraying plating covers rete and preferably utilizes plasma spray coating formation.
The plasma spray coating method can form the outer surface of smoother, can form the also better coverlay of thermal endurance, from these aspects, is suitable spraying plating coverlay forming method.
As above such, if adopt the heat treatment anchor clamps of electronic component-use pottery of the present invention, the SiC matter pottery that high-temperature capability, anti-creep is good as the heat treatment of base material with anchor clamps on, the spraying plating that can prevent the surface covers peeling off of rete and middle ceramic layer, is expected to improve durability.
Therefore, above-mentioned heat treatment anchor clamps can improve the heat treatment of electronic component-use pottery of ceramic capacitor, ceramic transformer etc. or the yield rate in the ablating work procedure.
If adopt manufacture method of the present invention, can effectively obtain the heat treatment anchor clamps of above-mentioned electronic component-use pottery again.
The simple declaration of drawing
Fig. 1 is the pattern sectional drawing of the heat treatment of electronic component-use pottery of the present invention with the formation of anchor clamps.
Fig. 2 is the pattern sectional drawing that existing spraying plating coverlay SiC substrate constitutes.
[symbol description]
1,11 SiC matter ceramic substrates (the 1st layer)
2, pottery (the 2nd layer)
3, spraying plating covers rete (the 3rd layer)
4, ceramic mixed layer
12,13 spraying plating coverlays
The working of an invention form
Below, illustrate in greater detail the present invention with reference to accompanying drawing.
Shown in Figure 1 is the heat treatment of electronic component-use pottery of the present invention with an example of the formation of anchor clamps.Heat treatment anchor clamps shown in Figure 1 on the 1st layer top and bottom as SiC matter ceramic substrate 1, have from Al
2O
3, Al
2O
3-SiO
2Matter, Al
2O
3-SiO
2-MgO matter, MgO-Al
2O
3-ZrO
2The 2nd layer of consisting of of choose in the matter at least a kind pottery, and, have the 3rd layer in part or all of aforementioned the 2nd layer surface, the 3rd layer by containing from Al
2O
3, mullite, ZrO
2, Y
2The spraying plating of at least any a kind single or multiple lift of choosing among the O covers rete and consists of.
And, the boundary section between aforementioned the 1st layer and the 2nd layer, the layer (ceramic mixed layer) 4 that exists SiC matter pottery 1 and the pottery 2 that consists of the 2nd layer to mix.
Like this, in the present invention, on the surface as the 1st layer SiC matter ceramic substrate 1, directly do not form spraying plating and cover rete, but utilize as the 2nd layer from Al
2O
3, Al
2O
3-SiO
2Matter, Al
2O
3-SiO
2-MgO matter, MgO-Al
2O
3-ZrO
2At least a kind of pottery 2 of choosing in the matter covers after the surface of these SiC matter ceramic substrates 1, in its surface, forms as the 3rd layer contain from Al
2O
3, mullite, ZrO
2, Y
2The spraying plating of at least any a kind single or multiple lift of choosing among the O covers rete 3.
By being designed to have the 2nd layer such formation, can suppressing the spraying plating that the oxidation because of the surface of SiC matter ceramic substrate 1 causes and cover peeling off of rete 3.
The 1st layer, though be to utilize SiC matter ceramic substrate to constitute, its high-temperature capability and anti-creep are good, use so can be used as heat-resistant material.
The thickness of this SiC matter ceramic substrate can be determined according to size, loading etc., but usually form about 3～10mm.
Again, consist of the material of the 2nd layer and the 3rd layer, when this heat treatment is used in the heat treatment of anchor clamps or ablating work procedure, the material of the electronic component-use pottery of corresponding object being treated as contacting with these anchor clamps, treatment temperature etc., choice for use from above-mentioned material.At this moment, these anchor clamps must be selected not the material with the object being treated reaction.
Cover aforementioned the 1st layer of the 2nd layer the thickness that ground forms, be preferably in below the above 7mm of 1mm.
Thickness is during less than 1mm, can not fully play to prevent to pass the effect that oxygen that spraying plating covers rete arrives SiC matter ceramic substrate, along with the oxidation of SiC, often produces peeling off from SiC matter ceramic substrate (the 1st layer) and the 2nd layer boundary section.
On the other hand, when thickness surpassed 7mm, this heat treatment was too heavy with anchor clamps, inconvenient operation, and, easily crack or breakage, cause high-temperature capability to descend.
Again, the center line average roughness Ra of aforementioned the 2nd laminar surface is preferably in below the above 20 μ m of 3 μ m.
As the center line average roughness Ra on surface during less than 3 μ m, the 2nd layer and spraying plating cover between the rete to connect airtight power not enough, often produce peeling off from boundary section.
On the other hand, when the center line average roughness Ra on surface surpasses 20 μ m, along with the variation of thermal environment, on the 2nd layer, easily cause crackle or breakage, and, be difficult to evenly and moderately form the spraying plating with smooth surface cover rete on the 2nd layer surface.
Again, the thickness as the 3rd layer spraying plating covering rete is preferably in below the above 500 μ m of 50 μ m.
When thickness during less than 50 μ m, thickness is too small, in heat treatment or ablating work procedure, can not fully prevent the reaction of these anchor clamps and the object being treated that contacts with it.
On the other hand, when thickness surpassed 500 μ m, the thermal stress of film self increased during spraying plating, thereby peels off easily.
It can be individual layer that aforementioned spraying plating covers rete, and also multilayer, but this spraying plating covers the outermost layer of rete in heat treatment or ablating work procedure, preferably utilizes not the material that reacts with electronic component-use pottery as object being treated to form.
Again, when being designed to multilayer, the spraying plating that preferably thermal coefficient of expansion is had the material of the value between the material that consists of outermost layer and the 2nd layer covers rete and forms as substrate.By being designed to such formation, can suppress to cover peeling off of rete along with the spraying plating of the variation of thermal environment.
Below, the heat treatment that electronic component-use pottery of the present invention is described is with the manufacture method of anchor clamps.
The heat treatment anchor clamps of above-mentioned electronic component-use pottery, at first, on the top and bottom of SiC plasmid sublayer, configuration is from Al
2O
3, Al
2O
3-SiO
2Matter, Al
2O
3-SiO
2-MgO matter, MgO-Al
2O
3-ZrO
2The particle layer of at least a kind of formation choosing in the matter, moulding, fire after, obtain tabular pottery.
Then, contain from Al by part or all formation on the surface of the tabular pottery that obtains
2O
3, mullite, ZrO
2, Y
2The spraying plating of at least any a kind single or multiple lift of choosing among the O covers rete, obtains the heat treatment anchor clamps.
Like this, by the while moulding, fire as the 1st layer SiC matter pottery and as the 2nd layer from Al
2O
3, Al
2O
3-SiO
2Matter, Al
2O
3-SiO
2-MgO matter, MgO-Al
2O
3-ZrO
2At least a kind of pottery choosing in the matter can make the 1st layer and the 2nd layer of strong ground sinter bonded, therefore can prevent peeling off on this boundary section.
At this moment, be preferably in aforementioned the 1st layer with the 2nd layer boundary section on, by making near the suitable roughening of particle this boundary when the moulding, consist of above-mentioned as shown in Figure 1 SiC matter pottery 1 and consist of the layer 4 that the 2nd layer pottery 2 mixes.
Be pre-formed SiC sintered body substrate after thereon below upper moulding, sintering and form the 2nd layer method and compare, by sintering under the state that has such layer the 1st layer of boundary section with the 2nd layer, can make the sinter bonded on this boundary section more strong, can more effectively prevent from peeling off.
In addition, the 1st layer aspect the 2nd layer moulding, sintering, for abundant sintering, suitably add normally used sintering aid when being preferably in these ceramic materials of sintering.
Form spraying plating by the surface at above-mentioned such the 2nd layer of forming and cover rete, can prevent that block is from the SiC matter pottery of outer surface arrival as the 1st layer.
Aforementioned spraying plating covers rete, though can not be limited to various metallikons such as adopting flame-spray processes, outburst metallikon, plasma spray coating method especially, but from forming the outer surface of smoother, and can form the better coverlay equal angles of thermal endurance and set out, preferably adopt the plasma spray coating method to form.
Again, spraying plating covers rete, as described above, form because utilize anchor effect to carry out physical bond, so, improve and connect airtight power because be expected to improve contact area, therefore generally preferably utilize pre-sandblast etc. to make the 2nd layer rough surface as injected base material.
At this moment, as described above, the center line average roughness Ra of the 2nd laminar surface is preferably in below the above 20 μ m of 3 μ m.
[embodiment]
Below, utilize embodiment to illustrate in greater detail the present invention, but the invention is not restricted to following
Embodiment.
[embodiment 1]
Becoming on the 1st layer the top and bottom of SiC plasmid sublayer, be configured as the 2nd layer Al
2O
3-SiO
2Matter (Al
2O
387wt%, SiO
2Particle layer 12wt%), moulding, sintering, the center line average roughness Ra that obtains the 1st layer thickness 4mm, the 2nd layer thickness 1.5mm, surface is the tabular pottery of 300mm * 300mm of 4.8 μ m.
On the surface of the tabular pottery that obtains, form the Al of thickness 150 μ m
2O
3Spraying plating covers rete, forms in its surface the 8wt%Y of 20 μ m again
2O
3-ZrO
2Spraying plating covers rete, has made tabular heat treatment anchor clamps.
According to the tabular heat treatment anchor clamps that obtain, make the brassboard of 150mm * 150mm, this brassboard has been carried out thermal cycling test.Experiment condition is that maintenance was cooled off after 2 hours under 1350 ℃, is undertaken by such repeatable operation.
It the results are shown in table 1.
[embodiment 2～5]
With the thickness shown in the 2nd layer of embodiment 2～4 that is designed to table 1 and the center line average roughness Ra on surface, in addition similarly to Example 1, made brassboard.
To these brassboards, in the same manner as in Example 1, carried out thermal cycling test.
They the results are shown in table 1.
[comparative example 1]
On the SiC of 300mm * 300mm * 4mm matter ceramic base plate surface, directly form the Al of thickness 150 μ m
2O
3Spraying plating covers rete, forms in its surface the 8wt%Y of thickness 200 μ m again
2O
3-ZrO
2Spraying plating covers rete, has made tabular heat treatment anchor clamps.
According to the tabular heat treatment anchor clamps that obtain, make the brassboard of 150mm * 150mm, the same to this brassboard with embodiment 1, carried out thermal cycling test.
It the results are shown in table 1.
[comparative example 2,3]
With the thickness shown in the 2nd layer of comparative example 2,3 that is designed to table 1 and the center line average roughness Ra on surface, in addition similarly to Example 1, made brassboard.
To these brassboards, in the same manner as in Example 1, carried out thermal cycling test.
They the results are shown in table 1.
[table 1]
| Embodiment | Comparative example | |||||||
| 1 | ?2 | ?3 | ?4 | ?5 | ??1 | ?2 | ?3 | |
| ?Al 2O 3-SiO 2Matter ceramic layer (the 2nd layer) thickness (mm) | 1 | ?2 | ?3 | ?3 | ?7 | ??- | ?3 | ?0.7 |
| Surface roughness Ra (μ m) | 4.8 | ?4.0 | ?4.1 | ?20 | ?3 | ??- | ?2.1 | ?4.5 |
| Spraying plating covers rete (the 3rd layer) thickness (μ m) Al 2O 3 | 150 | ?150 | ||||||
| ?8wt％Y 2O 3-ZrO 2 | 200 | ?200 | ||||||
| The thermal cycling test result | Do not peel off to 100 times | Spraying plating covering rete is peeled off in the time of 20 times | Spraying plating covering rete is peeled off in the time of 40 times | Peel off at the 1st layer of boundary section place with the 2nd layer in the time of 85 times | ||||
As shown in table 1 like that, when the 2nd layer thickness below the above 7mm of 1mm, and, the center line average roughness Ra of the 2nd laminar surface is when 20 μ m are following more than 3 μ m (embodiment 1～5), even 100 thermal cycling tests repeatedly, each layer do not peeled off yet, and confirmed that thermal endurance, durability are good.
On the other hand, when not forming the 2nd layer, and directly form Al at SiC matter ceramic base plate surface
2O
3When spraying plating covers rete (comparative example 1), and the center line average roughness Ra on the 2nd layer of surface is during less than 3 μ m (comparative example 2), carried out respectively 20 times and 40 thermal cycling tests in, spraying plating has taken place covered peeling off of rete.
Again, when the 2nd layer thickness during less than 1mm (comparative example 2), when having carried out 85 thermal cycling tests, spraying plating has taken place and has covered peeling off of rete in the boundary section between the 1st layer and the 2nd layer.
Claims (7)
1. the heat treatment anchor clamps of an electronic component-use pottery is characterized in that: on the 1st layer top and bottom as SiC matter ceramic substrate, have from Al
2O
3, Al
2O
3-SiO
2Matter, Al
2O
3-SiO
2-MgO matter, MgO-Al
2O
3-ZrO
2The 2nd layer of consisting of of choose in the matter at least a kind pottery, and, have in part or all of aforementioned the 2nd layer surface and to contain from Al
2O
3, mullite, ZrO
2, Y
2The spraying plating of at least any a kind single or multiple lift of choosing among the O covers the 3rd layer that rete consists of.
2. the heat treatment anchor clamps of electronic component-use pottery as claimed in claim 1, it is characterized in that: each thickness of aforementioned the 2nd layer top and bottom is below the above 7mm of 1mm, and, boundary section between aforementioned the 1st layer and the 2nd layer, the layer that exists SiC matter pottery and the pottery that constitutes the 2nd layer to mix.
3. the heat treatment anchor clamps of electronic component-use pottery as claimed in claim 1 or 2 is characterized in that: aforementioned the 2nd layer of each surperficial center line average roughness Ra is below 20 μ m more than the 3 μ m.
4. as the heat treatment anchor clamps of each described electronic component-use pottery of claim 1～3, it is characterized in that: aforementioned the 3rd layer thickness is below 500 μ m more than the 50 μ m.
5. the heat treatment of an electronic component-use pottery is characterized in that: on the top and bottom of SiC plasmid sublayer, dispose from Al with the manufacture method of anchor clamps
2O
3, Al
2O
3-SiO
2Matter, Al
2O
3-SiO
2-MgO matter, MgO-Al
2O
3-ZrO
2The particle layer of at least a kind of formation choosing in the matter, moulding, fire after, part or all formation on the surface of the tabular pottery that obtains contains from Al
2O
3, mullite, ZrO
2, Y
2The spraying plating of at least any a kind single or multiple lift of choosing among the O covers rete.
6. the heat treatment of electronic component-use pottery as claimed in claim 5 is characterized in that: in aforementioned SiC plasmid sublayer and from Al with the manufacture method of anchor clamps
2O
3, Al
2O
3-SiO
2Matter, Al
2O
3-SiO
2-MgO matter, MgO-Al
2O
3-ZrO
2On the boundary section of the particle layer of at least a kind of formation choosing in the matter, make near the particle this boundary coarse during by moulding, form SiC plasmid with from Al
2O
3, Al
2O
3-SiO
2Matter, Al
2O
3-SiO
2-MgO matter, MgO-Al
2O
3-ZrO
2The ceramic layer of the mix particles of at least a kind of formation choosing in the matter.
7. use the manufacture method of anchor clamps as the heat treatment of claim 5 or 6 described electronic component-use potteries, it is characterized in that: aforementioned spraying plating covers rete and utilizes plasma spray coating to form.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP109938/2002 | 2002-04-12 | ||
| JP2002109938A JP2003306392A (en) | 2002-04-12 | 2002-04-12 | Jig for heat-treating ceramic for electronic part and its manufacturing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1452191A true CN1452191A (en) | 2003-10-29 |
Family
ID=29243214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN03110605A Pending CN1452191A (en) | 2002-04-12 | 2003-04-14 | Clamp for heat treatment of ceramic for electronic component and mfg. method thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2003306392A (en) |
| CN (1) | CN1452191A (en) |
| TW (1) | TWI271394B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4713981B2 (en) * | 2005-08-08 | 2011-06-29 | コバレントマテリアル株式会社 | Ceramic electronic component firing container |
| WO2008149435A1 (en) * | 2007-06-06 | 2008-12-11 | Ibiden Co., Ltd. | Jig for firing and process for producing honeycomb structure |
| CN104195498A (en) * | 2014-09-05 | 2014-12-10 | 佛山市新战略知识产权文化有限公司 | Metal-based ceramic coating and preparation method thereof |
| WO2020166565A1 (en) * | 2019-02-14 | 2020-08-20 | 日本碍子株式会社 | Calcination jig |
-
2002
- 2002-04-12 JP JP2002109938A patent/JP2003306392A/en active Pending
- 2002-05-09 TW TW091109669A patent/TWI271394B/en not_active IP Right Cessation
-
2003
- 2003-04-14 CN CN03110605A patent/CN1452191A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TWI271394B (en) | 2007-01-21 |
| JP2003306392A (en) | 2003-10-28 |
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