TWI271394B - Jig for heat-treating ceramic for electronic part and its manufacturing process - Google Patents

Jig for heat-treating ceramic for electronic part and its manufacturing process Download PDF

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TWI271394B
TWI271394B TW091109669A TW91109669A TWI271394B TW I271394 B TWI271394 B TW I271394B TW 091109669 A TW091109669 A TW 091109669A TW 91109669 A TW91109669 A TW 91109669A TW I271394 B TWI271394 B TW I271394B
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layer
ceramic
heat treatment
jig
heat
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Chinese (zh)
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Kazunori Yamada
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Toshiba Ceramics Co
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Abstract

To provide a jig for heat-treating a ceramic for electronic parts which has an improved peeling resistance of a coating layer such as a sprayed coating film, etc., shows excellent strength under heat, creep resistance and durability and can be suitably used in a heat-treatment or baking process of the ceramic for the electronic parts such as a ceramic capacitor, a ceramic transformer, etc., and its manufacturing process. On each of upper and lower surfaces of a first layer which is an SiC ceramic substrate 1, a second layer comprising at least one ceramic 2 chosen from Al2O3, Al2O3-SiO2, Al2O3-SiO2-MgO and MgO-Al2O3-ZrO2 ceramics is formed. On a partial or entire surface of the second layer, a third layer comprising a single or multiple sprayed coating film layers 3 containing at least one chosen from Al2O3, mullite, ZrO2 and Y2O3 is formed.

Description

1271394 五、發明說明Q) 技術隻沒 本發明係關於電子交丰 — 具)及其製造方法,更^ *今究之熱處理用夹具(JIG,治 容器、陶瓷變壓器等之 σ ^係關於可適用於陶瓷電 驟中的電子零件用陶瓷 ^ ^陶瓷之熱處理及焙燒步 是之熱處理用夾具及其製造方法。 陶瓷在近年來廣被使用作為電 之強介電體陶瓷之用於陶瓷 哭才科,例如,鈦酸鋇等 系、Ni-Zn系等)等的逐電陶竟2用D於二,質鐵素體(Mn-Zn 作為電子零件的構成材料。 、陶瓷變壓器等,已用 上述電子零件用陶瓷,通常係於丨 圍下施行熱處理或培燒。因此, j70〇 c的/皿度辄 處理用夾具,俜使用以〇 乍f電子零件用陶竟之熱 ' … 便用 Al2〇「Sl02 質、Al2〇3 - Si〇9 - Mg〇 皙、 g :A、120厂Zr〇2質、碳化石夕質等之耐熱性優異的陶竟、。其 為適當的材料。 了‘,、、強度及耐潛變性優異,故 然而,在上述熱處理用夾具上直接載置被處理物等,盥 其接觸之情況,依據其成分,於熱處理之時,會發生與^ 熱處理用夾具的構成材料反應之情形。此等情況下,為了 防止被處理物與該夾具反應,係使用以難反應性方面&異 之Zr02等的陶瓷來構成夾具表面者。 例如,於施行鈦酸鋇(BaT i 〇3 )的熱處理之情況下,係使 用Zr〇2陶瓷材,又,於施行軟質鐵素體(Mn-Zn系、Ni-Zn 系等)之熱處理之情況,係使用A丨2〇3、Zr〇2或與被處理物 12713941271394 V. INSTRUCTION DESCRIPTION Q) Technology is not only the invention relates to electronic cross-flow - and its manufacturing method, and more * * The heat treatment jig (JIG, treatment container, ceramic transformer, etc.) The heat treatment and baking step of the ceramics for electronic parts in the ceramic electric circuit is a heat treatment jig and a manufacturing method thereof. Ceramics have been widely used as electric strong dielectric ceramics for ceramic crying in recent years. For example, a ceramics such as a barium titanate or the like, a Ni-Zn system, or the like, is used for an electron-based ceramic body, and a ferrite body (Mn-Zn is used as a constituent material of an electronic component. The ceramics for the parts are usually heat-treated or fired under the circumference of the crucible. Therefore, the j70〇c/container is used for the processing of the 〇乍f electronic parts, and the heat of the ceramics is used... Sl02, Al2〇3 - Si〇9 - Mg〇皙, g: A, 120 plant Zr〇2, carbon carbide, etc., which are excellent in heat resistance, etc. It is a suitable material. Excellent in strength and resistance to latent deformation, therefore, in the above heat treatment When the workpiece is directly placed on the jig, and the contact is made, depending on the composition, a reaction with the constituent material of the jig for heat treatment may occur during the heat treatment. In this case, in order to prevent the object to be treated and The jig reaction is performed by using a ceramic having a poorly reactive side, such as Zr02, to form a jig surface. For example, in the case of performing heat treatment of barium titanate (BaT i 〇 3 ), Zr〇2 ceramic is used. In the case of heat treatment of soft ferrite (Mn-Zn system, Ni-Zn system, etc.), A丨2〇3, Zr〇2 or treated material 1271394 is used.

相同組成的陶瓷 材0 或以此等陶瓷被 覆之碳化矽質陶瓷基 欲得 料施行 等來形 性的密 作為 號公報 質陶瓷 理用材 上述 表面粗 的方式 到上述被覆材之時,多使用例 塗佈之後,用高溫下烘烤之 ’將所要的陶瓷漿 成。其中尤以熔射法:、苴 :、CVD法、熔射法 合的方法’被膜不易剝離,d合效果進行物理 此等被覆材,例如,於日太破採用。 中,祕描干+ μ ^ 、本專利特開200 1 -278685 :材=0”強度及耐潛變性優異之碳化石夕 = 紅柱石、叫等之熔射之熱處 Γν:ΓΛ示般,係使碳切質陶兗基材11的 t搂ί 層所構成之熔射被膜12、13不易剝離 來構成。 =而,/上述材料,由於係在碳化石夕質陶究基材η的表面 上直接形成ΑΙΑ、多鋁紅柱石、Zr〇2等的熔射被膜12、13 者,故在使用於電子零件用陶瓷之熱處理及焙燒步驟中使 用的情況,由於通過熔射被膜丨2、丨3的氧氣,會使得碳化 石夕負陶竟基材1 1的表面被氧化而導致脆弱化。且隨著使用 頻率的增加,會有發生熔射被膜丨2、i 3自碳化矽質陶瓷基 材11的表面剝離之情形。 ' 因而,即使在由上述所構成之熱處理用夾具中,熔射被 膜的剝離尚未能充分的防止,又對於具有長的耐用壽命之 熱處理用夾具受到殷切的期盼。 發明之概要When the ceramic material of the same composition is used, or the ceramic-coated carbonized enamel ceramic base is used as a material, the surface of the ceramic material is thickened to the above-mentioned coated material, and a plurality of use cases are used. After coating, the desired ceramic slurry is formed by baking at a high temperature. Among them, the spraying method: 苴:, CVD method, and the method of the fusion method are not easily peeled off, and the d-effect is physical. These coated materials are, for example, too worn. In the middle, the secret description dry + μ ^, this patent special opening 200 1 -278685: material = 0" strength and excellent resistance to latent carbonization of the fossil eve = andalusite, called the heat of the spray Γ ν: as shown, The melted coating films 12 and 13 formed of the t搂ί layer of the carbon-cut ceramic substrate 11 are not easily peeled off. </ RTI> The above materials are formed on the surface of the carbonized stone ceramsite substrate η. Since the spray coatings 12 and 13 of ruthenium, mullite, and Zr〇2 are formed directly on the surface, they are used in the heat treatment and baking step of the ceramic for electronic parts, because the film is passed through the film 丨2, 丨The oxygen of 3 causes the surface of the substrate of the carbonized stone to be oxidized and becomes fragile. As the frequency of use increases, the sprayed coating 丨2, i3 from the carbonized enamel ceramic base occurs. In the case of the heat treatment jig formed by the above, the peeling of the sprayed film is not sufficiently prevented, and the heat treatment jig having a long durability life is subjected to an ardent period. Hope. Summary of invention

C:\2D-CODE\91-07\91109669.ptd 第5頁 1271394 五'發明說明(7) 又’上述第2層的表面之中心線平均粗度Ra,以3 以 上20 //m以下為佳。 、表面之中心線平均粗度r a若未滿3 # m的情況,第2層與 熔射被膜層的密合力不夠,會有自境界部分產生剝離的情 形0 另一方面,表面之中心線平均粗度Ra若超過2〇 的情 況,隨著熱環境的變化,於第2層容易產生裂痕及破損, 且於第2層的表面欲形成具有均一而適度地平滑的表面之 熔射被膜層會有困難。 又,第3層之熔射被膜層的膜厚,以5〇 上5 下為佳。 Μ丨丨I Μ =厚未滿50 _的情況,由於膜厚太薄,於熱處理及 ^ ^ ^驟中,無法充分防止該夾具與相接觸的被處理物 反應。 \ 身合;!厚超過5°0^的情況,於炼射時的膜本 身之熱應力會增大,致容易剝離。 上述熔射被膜層,可為單—層,亦可^#㈣ 熔射被膜層的最外声,以ώ A勒考 准 °亥 妯卢裡札♦ 士 ί 在熱處理及焙燒步.驟中不會與 ^ ^+ r 7件用陶是發生反應的材料來形成為佳。 又,於作成為複數層的情況,以熱膨 介 Λ/值之材料形成作為底層之溶射被 、曰,+a由如此構成,可抑制隨著熱環境的變彳t m # 致之熔射被膜層的剝離。 、衣兄的k化所導 以下’就本發明之電子零件用陶竟之熱處理用夾具之製C:\2D-CODE\91-07\91109669.ptd Page 5 1271394 V'Invention Description (7) Further, the center line average roughness Ra of the surface of the second layer is 3 or more and 20 // m or less. good. If the average thickness of the center line of the surface is less than 3 #m, the adhesion between the second layer and the sprayed coating layer is insufficient, and there is a case where peeling occurs from the boundary portion. On the other hand, the center line of the surface is averaged. When the roughness Ra exceeds 2 ,, cracks and breakage are likely to occur in the second layer as the thermal environment changes, and a spray coating layer having a uniform and moderately smooth surface is formed on the surface of the second layer. Difficulties. Further, the film thickness of the third layer of the deposited film layer is preferably 5 Å or more. Μ丨丨I Μ = When the thickness is less than 50 _, since the film thickness is too thin, the heat treatment and the heat treatment may not sufficiently prevent the jig from reacting with the object to be treated. \ Body fit;! When the thickness exceeds 5°0^, the thermal stress of the film itself increases during the refining, which makes it easy to peel off. The above-mentioned spray coating layer may be a single layer, or may be the most external sound of the spray coating layer, and may not be used in the heat treatment and roasting steps. It is better to form with ^ ^ + r 7 pieces of materials that react with ceramics. Further, in the case of forming a plurality of layers, a material of a thermal expansion enthalpy/value is formed as a molten film of the underlayer, and +a is formed in such a manner that the film can be suppressed from being deformed by the thermal environment tm # Peeling of the layers. The kimono of the kimono is guided by the following:

1271394 五、發明說明(9) 助劑為佳。 藉由在上 防止自外表 上述熔射 子體熔射法 成比較平滑 觀點考量, 又,熔射 物理性的密 高,因此, 表面作成粗 在此情況 度Ra以3 // m (實施例) 述所形 面起第 被膜層 等之無 的外表 以藉由 被膜層 合來形 通常以 糙為佳 下,如 以上2 0 成之第2層的表面形成熔射被膜層,可 1層的碳化石夕質陶竟之氧氣的透過。 ’可用火焰熔射法、爆發熔射法、等離 特別限定的各種熔射法來形成,就可形 面,且可形成耐熱性更加優異的被膜之 等離子體熔射來形成為佳。 ,如上述般,由於係利用錨合效果進行 成’故可加大接觸面積以圖密合力的提 藉由砂磨機等使被熔射基材之第2層的 〇 上述般’第2層的表面之中心線平均粗 // m以下為佳。 以下,依據實施例就本發明更具體地加以說明,惟,本 發明並非限定於下述之實施例。 (實施例1 )1271394 V. Description of the invention (9) Auxiliaries are preferred. By preventing the above-mentioned sprayed child body melting method from being superficially smooth, and the physical density of the spray is high, the surface is made coarse, and the degree Ra is 3 // m (Example) It is preferable that the surface of the shape of the first coating layer or the like is formed by lamination of the film, and the surface of the second layer of the above 20% is formed into a molten film layer, and the carbon layer of the layer can be formed. The passage of oxygen in the fossil ceremonial pottery. The flame spray method, the burst spray method, and the various types of spray methods which are specifically defined by the flame spray method can be formed, and it is preferable to form a plasma spray of a film which is more excellent in heat resistance. As described above, since the anchoring effect is used, the contact area can be increased to increase the contact force, and the second layer of the substrate to be melted can be made by a sand mill or the like. The center line of the surface is preferably coarser / m or less. Hereinafter, the present invention will be more specifically described based on the examples, but the present invention is not limited to the following examples. (Example 1)

在第1層之碳化矽質粒子層的上下面,配置作為第2層之 Al2〇3-Si02 質(Al2〇3 8 7wt%、Si02 1 2wt%)之粒子層,經成形 、培燒’得到第1層的厚度為4πηπ、第2層的厚度為1. 5mm、 表面之中心線平均粗度Ra為4· 8 // m之30〇_ X 300mm的板 狀陶瓷。 於所得之板狀陶瓷的表面,形成厚度為UOvm的Al2〇3熔 射被膜層,再於其表面形成厚度為200 &quot;m的8wt% γ2 03 -On the upper and lower surfaces of the first layer of the niobium carbide particle layer, a particle layer of Al2〇3-SiO2 (Al2〇3 8 7 wt%, SiO 2 22 wt%) as the second layer is placed, and formed and fired. The thickness of the first layer is 4πηπ, the thickness of the second layer is 1. 5 mm, and the center line average roughness Ra of the surface is 4·8 // m of 30 〇 _ X 300 mm of plate-shaped ceramic. On the surface of the obtained plate-like ceramic, an Al2〇3 molten film layer having a thickness of UOvm is formed, and a thickness of 200 wt% m γ2 03 - is formed on the surface thereof.

C:\2D-00DE\91-07\91109669.ptd 第12頁 1271394 五、發明說明(10)C:\2D-00DE\91-07\91109669.ptd Page 12 1271394 V. Description of invention (10)

Zr02熔射被膜層,製作成板狀的熱處理用夾具。 自所得之板狀的熱處理用夾具製作出150mm X 150mm的 試料板,對此試料板施行熱循環試驗。試驗條件為反覆施 行在1 3 5 0 °C下保持2小時後進行冷卻之步驟。其結果示如 表1 〇 (實施例2〜5 ) 將第2層的厚度及表面之中心線平均粗度Ra作成如表1的 實施例2〜4中所示者,除此之外,以與實施例1同樣的做 法,製作成試料板。 對此等試料板,以與實施例1同樣的作法,施行熱循環 彳蒙 試驗。 此專結果不如表1。 (比較例1 ) 在300mm X 30 0mm X 4mm的碳化矽質陶瓷基板表面上直 接形成厚度為1 5 0 // m的A 12 03炼射被膜層,再於其表面上形 成厚度為200 //m之8wt°/。Y2 03 -Zr02熔射被膜層,製作成板 狀的熱處理用夾具。 自所得之板狀的熱處理用夾具製作出15〇111111 xl50mm的The Zr02 is sprayed with a film layer to form a plate-shaped heat treatment jig. A 150 mm X 150 mm sample plate was produced from the obtained plate-shaped heat treatment jig, and the sample plate was subjected to a heat cycle test. The test conditions were as follows: a step of cooling after maintaining at 1 3 50 ° C for 2 hours. The results are shown in Table 1 (Examples 2 to 5). The thickness of the second layer and the center line average roughness Ra of the surface were as shown in Examples 2 to 4 of Table 1, except that A sample plate was produced in the same manner as in Example 1. For the sample plates, the thermal cycle entangled test was carried out in the same manner as in the first embodiment. This special result is not as shown in Table 1. (Comparative Example 1) An A 12 03 refining film layer having a thickness of 150 k m was directly formed on the surface of a 300 mm X 30 0 mm X 4 mm carbonized tantalum ceramic substrate, and a thickness of 200 // was formed on the surface thereof. 8 wt ° / m. Y2 03 -Zr02 is sprayed on the film layer to form a plate-shaped heat treatment jig. 15〇111111 xl50mm was produced from the obtained plate-shaped heat treatment jig

試料板,對此試料板,以與實施例1同樣的作法施行熱循 環試驗。 . 其結果示如表1。 (比較例2及3) 將第2層的厚度及表面之中心線平均粗度Ra作成如表i的 比較例2、3所示者,除此之外,以與實施例i同樣的做The sample plate was subjected to a heat cycle test in the same manner as in Example 1 for this sample plate. The results are shown in Table 1. (Comparative Examples 2 and 3) The same procedure as in Example i was carried out except that the thickness of the second layer and the center line average roughness Ra of the surface were as shown in Comparative Examples 2 and 3 of Table i.

__丨丨―j 1271394__丨丨-j 1271394

五、發明說明(11) 比較例2、3所示者,除此之外,以與實施 法’製作成試料板。 樣的做 例1同樣的作法’施行熱循環 對此等試料板,以與實施 試驗。 此等結果示如表1 表1 il2〇3 · Si02M陶瓷層 (第2層)的厚度(ym) 1 1 2 2 3 3 4 3 5 7 1 2 ^3 0.7 / Γ* S®祖度Ra (βτα) 4.8 4.0 4.1 20 3 〇 ----------------- 2.1 溶射被膜層(第3層) 的厚度(//in) Al2〇3 150 1 c.n 4.5 8wt% Y203-Zr02 200 ?ηή 熱循環試驗結果 &quot;主 1 ή匕 Art · 至1〇〇次未發生剝離 於2^^ 熔射被膜 層剝離 於4 〇次時1 熔射被膜 層剝離 於 在第1層 與第2層 的境界部 « W /丁 ’又丄U1 111从丄,111 m Μ下,且第2 層的表面之中心線平均粗度以為3 以上20 以下的十主 況中(實施例卜5 ),即使反覆施行熱循環試驗丨〇 〇次,月 皆未剝離,其耐熱性、耐久性優異得以確認。 每 另一方面,在未形成第2層之下,在碳化矽質陶 表面直接形成A丨2〇3熔射被膜層之情況(比較例丨)、及^ 的表面之中心線平均粗度Ra為未滿3 ”之情況(比較曰 2),其熱循環試樣分別在反覆2〇次及4〇次之時, 被膜層的剝離。 &amp; i &amp;射 又 於第2層的厚度為未滿lmm的情況(比較例3) 熱循V. INSTRUCTION OF THE INVENTION (11) In addition to the above, the sample sheets were prepared in accordance with the method of the present invention. The same procedure as in Example 1 was carried out to perform a thermal cycle on the test plates for the test. These results are shown in Table 1. Table 1 il2〇3 · Si02M ceramic layer (2nd layer) thickness (ym) 1 1 2 2 3 3 4 3 5 7 1 2 ^3 0.7 / Γ* S® probability Ra ( Ττα) 4.8 4.0 4.1 20 3 〇----------------- 2.1 Thickness of the sprayed coating layer (3rd layer) (//in) Al2〇3 150 1 cn 4.5 8wt% Y203-Zr02 200 ?ηή Thermal cycle test result&quot;Main 1 ή匕Art ·1 未1 peeling occurred in 2^^ When the film layer was peeled off at 4 〇 times 1 The film was peeled off at the first 1 The boundary between the layer and the second layer « W / Ding ' and U1 111 from 丄, 111 m under the armpit, and the average thickness of the center line of the surface of the second layer is in the ten main conditions of 3 or more and 20 or less (Example (5) Even if the heat cycle test was repeated, the month was not peeled off, and the heat resistance and durability were confirmed. On the other hand, in the case where the A丨2〇3 spray coating layer is directly formed on the surface of the carbonized tantalum ceramic without forming the second layer (Comparative Example), and the center line average roughness Ra of the surface of the ^ In the case of less than 3" (compare 曰2), the thermal cycle samples were peeled off at 2 times and 4 times, respectively. &amp; i &amp; Less than 1mm (Comparative Example 3)

第14頁 1271394Page 14 1271394

之剝離。 如上述4又’依據本發明之雷 呈,於以紂勃政洛 ^子零件用陶瓷之熱處理用夾 具,於以耐熱強度、耐潛變性優 A , , . ^ ^ ^ + 艾1 1愛呉的奴化矽質陶瓷用作為 基材之熱處理用夾具中,可防μ本 ^ J防止表面的熔射被膜及中間的 陶瓷層的剝離,可期待耐久性之提高。 、陶瓷變壓器 可有貢獻於收 因而,上述熱處理用夾具,於陶瓷電容器 等之電子零件用陶瓷之熱處理及焙燒步驟中 率的提高。 且,依據本發明之製造方法,可有效率地製得上述 零件用陶瓷之熱處理用夾具。 元件編號說明 1、11 碳化矽質陶瓷基板(基板) 2 陶瓷 3 熔射被膜層 4 混在層(陶莞混在層) 12 ^ 13 熔射被膜Stripping. According to the above-mentioned 4 and 'the invention according to the present invention, the heat treatment jig for the heat treatment of the ceramics of the 纣Baozheng Luozi parts is excellent in heat resistance and latent denaturation A, . . . ^ ^ ^ + Ai 1 1 love In the jig for heat treatment using the enamel ceramic as the substrate, it is possible to prevent peeling of the spray film on the surface and the ceramic layer in the middle, and it is expected to improve durability. The ceramic transformer can contribute to the heat treatment, and the heat treatment jig is improved in the heat treatment and baking step of the ceramic for electronic parts such as ceramic capacitors. Further, according to the production method of the present invention, the heat treatment jig for the above-mentioned ceramics for parts can be efficiently produced. Component No. Description 1, 11 Carbonized Tantalum Ceramic Substrate (Substrate) 2 Ceramic 3 Sprayed Coating Layer 4 Mixed in Layer (Polycan Mixed Layer) 12 ^ 13 Sprayed Film

1271394 圖式簡單說明 圖1為顯示本發明之電子零件用陶瓷之熱處理用夾具的 構成之示意截面圖。 圖2為表示習知的炫射被膜碳化石夕基板的構成之示意截 面圖。1271394 Brief Description of the Drawings Fig. 1 is a schematic cross-sectional view showing the configuration of a heat treatment jig for ceramics for electronic parts of the present invention. Fig. 2 is a schematic cross-sectional view showing a configuration of a conventional glazing film carbon carbide substrate.

C:\2D-mDE\91-07\91109669.ptd 第16頁C:\2D-mDE\91-07\91109669.ptd Page 16

Claims (1)

2006 1 6 AU8 替換本 熱處理用^^徵在於’ Al2〇3、Al2 03 -Si02質' A1 〇〜1·:的上下面’具有由選自 中之至少i種的陶£所^102—Mg0質、Μδ0-Α1Α-ΖΙ·02質 的表面的一部份或全J成且之第24,並且,於上述第2層 石、Zr〇2、Υ2〇3之中至'插有。由含有選自Α“〇3、多鋁紅柱 所構成之第3層· 夕種的單一或複數層的熔射被膜層 其中,上述第2層的厘;# ^ 第1層與第2層的境界部八又為 上7關以下,且於上述 2層之陶兗混合存在之層刀;以&quot;及在有碳化矽質陶究與構成第 以下述第2層的表面之中心、線平均粗度Ra為3 //in以上20心 夾2具如Π專:之電子零件用陶究之熱處理用 3· - ^ t ^ ; ΓΛ Λ#Λ50 &quot; &quot;500 &quot;τ ° 特徵在於,在碳切質粒子層ς以具之製造方法’其 , 4:ΐ^;Ι\^ΜΓΑΐ2°3^ 以上20❹以下的粒子層,經成形]:::度=為3心 之板狀陶莞之表面的一部份或全部,H後再於得到 Α12〇3、多鋁紅柱石、zr〇 、γ〇,Α少 έ有選自 層的熔射被膜層。 2 2 至少1種的單一或複數 4·如申請專利範圍第3項之電子愛 夾具之製造方法,其中,在 ν 究之熱處理用 述奴化石夕質粒子層與由選自 C:\ 總檔\91 \91109669\9110%69(替換)-2.ptc ΛΜ 91109Rfig 1271394 曰 六、申請專利範圍 — ai2〇3、ai2〇3〜Si〇2 質、Ai2〇3 —Si〇2 ^ ^ 中之至少1種所構成之粒子層的境界J二〜zr〇2質 使該境界附近的粒子粗大,使其〃。为處,藉由成形、 自 AW、Al2〇3-Sl〇2f、Al2〇3 —叫成由:化/^^ 質中之至少1種的所構成之粒子的# f—A Zr〇2 5·如申請專利範圍第3或4項之子在之陶瓷層。 用夹具之製造方法,其中,上述 ,件用陶瓷之熱處理 子體熔射所形成。〃、 ^…于被膜層,係經由等離2006 1 6 AU8 Replacement This heat treatment is characterized by 'Al2〇3, Al2 03 -Si02 quality 'A1 〇~1·: upper and lower 'with at least one species selected from the group of Taos ^102-Mg0 A part of the surface of the mass, Μδ0-Α1Α-ΖΙ·02, or the whole of the 24th, and the second layer of the above-mentioned second layer of stone, Zr〇2, Υ2〇3 to 'insert. a molten film layer containing a single layer or a plurality of layers selected from the group consisting of Α3, 多3, and a polyaluminum column, wherein the second layer is PCT; #^ the first layer and the second layer The boundary of the Ministry of the Eighth is the upper 7 levels, and the layer of knives in the above two layers of pottery mash; in the center and line of the surface of the second layer below The average roughness Ra is 3 // in. 20 core clips 2 such as Π special: the heat treatment for electronic parts used in ceramics 3· - ^ t ^ ; ΓΛ Λ #Λ50 &quot;&quot;500&quot;τ ° In the carbon-cutted particle layer, the particle layer of the method of manufacturing, which is 4: ΐ^; Ι\^ΜΓΑΐ2°3^ and above 20❹, is formed]::: Degree = 3 hearts of the plate-shaped pottery Part or all of the surface, after H, Α12〇3, mullite, zr〇, γ〇, 熔 έ have a spray coating layer selected from the layer. 2 2 at least one single or plural 4. The method for manufacturing an electronic love jig according to item 3 of the patent application scope, wherein the heat treatment of the nucleus is carried out by using a sinusoidal particle layer and a selected from C:\ total file\91\91 109669\9110%69 (replacement)-2.ptc ΛΜ 91109Rfig 1271394 曰6. Patent application scope - at least one of ai2〇3, ai2〇3~Si〇2, Ai2〇3—Si〇2 ^ ^ The boundary of the particle layer of the composition J 2 ~ zr〇 2 makes the particles near the boundary coarse and makes it 〃. For the formation, by AW, Al2〇3-Sl〇2f, Al2〇3 : a f-A Zr 〇 2 5 of the constituent particles of at least one of the nucleus of the chemistry. The ceramic layer is in the ceramic layer according to the third or fourth aspect of the patent application. The piece is formed by the heat treatment of the ceramic heat treatment body. The 〃, ^... are in the film layer, and are separated by
TW091109669A 2002-04-12 2002-05-09 Jig for heat-treating ceramic for electronic part and its manufacturing process TWI271394B (en)

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