JP4015045B2 - 配線基板、電子装置及び電子機器 - Google Patents

配線基板、電子装置及び電子機器 Download PDF

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Publication number
JP4015045B2
JP4015045B2 JP2003070553A JP2003070553A JP4015045B2 JP 4015045 B2 JP4015045 B2 JP 4015045B2 JP 2003070553 A JP2003070553 A JP 2003070553A JP 2003070553 A JP2003070553 A JP 2003070553A JP 4015045 B2 JP4015045 B2 JP 4015045B2
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Japan
Prior art keywords
insulating film
wiring board
interlayer insulating
partition member
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2003070553A
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English (en)
Japanese (ja)
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JP2004004611A5 (https=
JP2004004611A (ja
Inventor
貴士 宮澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
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Publication date
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Priority to JP2003070553A priority Critical patent/JP4015045B2/ja
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Publication of JP2004004611A5 publication Critical patent/JP2004004611A5/ja
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Publication of JP4015045B2 publication Critical patent/JP4015045B2/ja
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  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2003070553A 2002-03-20 2003-03-14 配線基板、電子装置及び電子機器 Expired - Lifetime JP4015045B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003070553A JP4015045B2 (ja) 2002-03-20 2003-03-14 配線基板、電子装置及び電子機器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002079509 2002-03-20
JP2003070553A JP4015045B2 (ja) 2002-03-20 2003-03-14 配線基板、電子装置及び電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006154857A Division JP2006309254A (ja) 2002-03-20 2006-06-02 配線基板、電子装置、及び電子機器

Publications (3)

Publication Number Publication Date
JP2004004611A JP2004004611A (ja) 2004-01-08
JP2004004611A5 JP2004004611A5 (https=) 2006-04-27
JP4015045B2 true JP4015045B2 (ja) 2007-11-28

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ID=30445754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003070553A Expired - Lifetime JP4015045B2 (ja) 2002-03-20 2003-03-14 配線基板、電子装置及び電子機器

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JP (1) JP4015045B2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100864001B1 (ko) * 2002-06-14 2008-10-16 삼성전자주식회사 유기 전계발광장치
JP4564364B2 (ja) * 2004-01-19 2010-10-20 株式会社 日立ディスプレイズ 有機エレクトロルミネッセンス表示装置とその製造方法
JP4606767B2 (ja) * 2004-04-14 2011-01-05 共同印刷株式会社 表示装置用素子基板の製造方法
JP2006134624A (ja) * 2004-11-04 2006-05-25 Seiko Epson Corp 電気光学装置、及び、それを用いた電子機器
JP4706296B2 (ja) * 2005-03-25 2011-06-22 カシオ計算機株式会社 ディスプレイパネル
JP4687179B2 (ja) * 2005-03-25 2011-05-25 カシオ計算機株式会社 ディスプレイパネル
JP4781776B2 (ja) * 2005-10-24 2011-09-28 三菱電機株式会社 配線基板、表示装置及び配線基板の製造方法
KR101084166B1 (ko) * 2006-01-13 2011-11-17 삼성모바일디스플레이주식회사 픽셀 구조 및 이를 구비한 유기 전계 발광소자
JP4809087B2 (ja) 2006-03-14 2011-11-02 セイコーエプソン株式会社 エレクトロルミネッセンス装置、電子機器、およびエレクトロルミネッセンス装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100660384B1 (ko) * 1998-03-17 2006-12-21 세이코 엡슨 가부시키가이샤 표시장치의 제조방법
JP4683696B2 (ja) * 1999-07-09 2011-05-18 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2001284297A (ja) * 2000-03-31 2001-10-12 Sony Corp 研磨装置、研磨方法および半導体装置の製造方法
JP4889872B2 (ja) * 2000-04-17 2012-03-07 株式会社半導体エネルギー研究所 発光装置及びそれを用いた電気器具

Also Published As

Publication number Publication date
JP2004004611A (ja) 2004-01-08

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