JP4015045B2 - 配線基板、電子装置及び電子機器 - Google Patents
配線基板、電子装置及び電子機器 Download PDFInfo
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- JP4015045B2 JP4015045B2 JP2003070553A JP2003070553A JP4015045B2 JP 4015045 B2 JP4015045 B2 JP 4015045B2 JP 2003070553 A JP2003070553 A JP 2003070553A JP 2003070553 A JP2003070553 A JP 2003070553A JP 4015045 B2 JP4015045 B2 JP 4015045B2
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- Prior art keywords
- insulating film
- wiring board
- interlayer insulating
- partition member
- film
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| KR100864001B1 (ko) * | 2002-06-14 | 2008-10-16 | 삼성전자주식회사 | 유기 전계발광장치 |
| JP4564364B2 (ja) * | 2004-01-19 | 2010-10-20 | 株式会社 日立ディスプレイズ | 有機エレクトロルミネッセンス表示装置とその製造方法 |
| JP4606767B2 (ja) * | 2004-04-14 | 2011-01-05 | 共同印刷株式会社 | 表示装置用素子基板の製造方法 |
| JP2006134624A (ja) * | 2004-11-04 | 2006-05-25 | Seiko Epson Corp | 電気光学装置、及び、それを用いた電子機器 |
| JP4687179B2 (ja) * | 2005-03-25 | 2011-05-25 | カシオ計算機株式会社 | ディスプレイパネル |
| JP4706296B2 (ja) * | 2005-03-25 | 2011-06-22 | カシオ計算機株式会社 | ディスプレイパネル |
| JP4781776B2 (ja) * | 2005-10-24 | 2011-09-28 | 三菱電機株式会社 | 配線基板、表示装置及び配線基板の製造方法 |
| KR101084166B1 (ko) * | 2006-01-13 | 2011-11-17 | 삼성모바일디스플레이주식회사 | 픽셀 구조 및 이를 구비한 유기 전계 발광소자 |
| JP4809087B2 (ja) | 2006-03-14 | 2011-11-02 | セイコーエプソン株式会社 | エレクトロルミネッセンス装置、電子機器、およびエレクトロルミネッセンス装置の製造方法 |
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| KR100660383B1 (ko) * | 1998-03-17 | 2006-12-21 | 세이코 엡슨 가부시키가이샤 | 유기이엘장치의 제조방법 |
| JP4683696B2 (ja) * | 1999-07-09 | 2011-05-18 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2001284297A (ja) * | 2000-03-31 | 2001-10-12 | Sony Corp | 研磨装置、研磨方法および半導体装置の製造方法 |
| JP4889872B2 (ja) * | 2000-04-17 | 2012-03-07 | 株式会社半導体エネルギー研究所 | 発光装置及びそれを用いた電気器具 |
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