JP4011228B2 - 電子部品装着方法 - Google Patents

電子部品装着方法 Download PDF

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Publication number
JP4011228B2
JP4011228B2 JP08502499A JP8502499A JP4011228B2 JP 4011228 B2 JP4011228 B2 JP 4011228B2 JP 08502499 A JP08502499 A JP 08502499A JP 8502499 A JP8502499 A JP 8502499A JP 4011228 B2 JP4011228 B2 JP 4011228B2
Authority
JP
Japan
Prior art keywords
electronic component
imaging
changing
mounting
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP08502499A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000277999A5 (ko
JP2000277999A (ja
Inventor
真一 岡嵜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Priority to JP08502499A priority Critical patent/JP4011228B2/ja
Priority to KR1020000001652A priority patent/KR20000062469A/ko
Publication of JP2000277999A publication Critical patent/JP2000277999A/ja
Publication of JP2000277999A5 publication Critical patent/JP2000277999A5/ja
Application granted granted Critical
Publication of JP4011228B2 publication Critical patent/JP4011228B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Operations Research (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP08502499A 1999-03-29 1999-03-29 電子部品装着方法 Expired - Lifetime JP4011228B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP08502499A JP4011228B2 (ja) 1999-03-29 1999-03-29 電子部品装着方法
KR1020000001652A KR20000062469A (ko) 1999-03-29 2000-01-14 전자부품 장착방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08502499A JP4011228B2 (ja) 1999-03-29 1999-03-29 電子部品装着方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005129896A Division JP4011589B2 (ja) 2005-04-27 2005-04-27 電子部品装着方法

Publications (3)

Publication Number Publication Date
JP2000277999A JP2000277999A (ja) 2000-10-06
JP2000277999A5 JP2000277999A5 (ko) 2005-09-29
JP4011228B2 true JP4011228B2 (ja) 2007-11-21

Family

ID=13847168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP08502499A Expired - Lifetime JP4011228B2 (ja) 1999-03-29 1999-03-29 電子部品装着方法

Country Status (2)

Country Link
JP (1) JP4011228B2 (ko)
KR (1) KR20000062469A (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002214693A (ja) * 2001-01-23 2002-07-31 Matsushita Electric Ind Co Ltd 複数対象物の撮像方法とその装置及びこれを用いた電子部品実装装置
KR100515958B1 (ko) * 2002-06-19 2005-09-23 삼성테크윈 주식회사 적응적으로 캘리브레이션이 수행되는 부품 실장기의 제어방법
JP4307054B2 (ja) * 2002-11-29 2009-08-05 パナソニック株式会社 部品撮像装置
JP5054442B2 (ja) * 2007-06-19 2012-10-24 パナソニック株式会社 実装条件決定方法、実装条件決定装置、部品実装方法、部品実装機、およびプログラム
US10194570B2 (en) * 2014-11-13 2019-01-29 Fuji Corporation Mounter and method for inspecting suction posture of electronic component using mounter
EP3767938B1 (en) * 2018-03-14 2021-12-15 Fuji Corporation Image-capturing unit and component-mounting device
JP7095109B2 (ja) * 2018-11-05 2022-07-04 株式会社Fuji 作業機、および演算方法

Also Published As

Publication number Publication date
KR20000062469A (ko) 2000-10-25
JP2000277999A (ja) 2000-10-06

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