JP4011228B2 - 電子部品装着方法 - Google Patents
電子部品装着方法 Download PDFInfo
- Publication number
- JP4011228B2 JP4011228B2 JP08502499A JP8502499A JP4011228B2 JP 4011228 B2 JP4011228 B2 JP 4011228B2 JP 08502499 A JP08502499 A JP 08502499A JP 8502499 A JP8502499 A JP 8502499A JP 4011228 B2 JP4011228 B2 JP 4011228B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- imaging
- changing
- mounting
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Operations Research (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP08502499A JP4011228B2 (ja) | 1999-03-29 | 1999-03-29 | 電子部品装着方法 |
KR1020000001652A KR20000062469A (ko) | 1999-03-29 | 2000-01-14 | 전자부품 장착방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP08502499A JP4011228B2 (ja) | 1999-03-29 | 1999-03-29 | 電子部品装着方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005129896A Division JP4011589B2 (ja) | 2005-04-27 | 2005-04-27 | 電子部品装着方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2000277999A JP2000277999A (ja) | 2000-10-06 |
JP2000277999A5 JP2000277999A5 (ko) | 2005-09-29 |
JP4011228B2 true JP4011228B2 (ja) | 2007-11-21 |
Family
ID=13847168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP08502499A Expired - Lifetime JP4011228B2 (ja) | 1999-03-29 | 1999-03-29 | 電子部品装着方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4011228B2 (ko) |
KR (1) | KR20000062469A (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002214693A (ja) * | 2001-01-23 | 2002-07-31 | Matsushita Electric Ind Co Ltd | 複数対象物の撮像方法とその装置及びこれを用いた電子部品実装装置 |
KR100515958B1 (ko) * | 2002-06-19 | 2005-09-23 | 삼성테크윈 주식회사 | 적응적으로 캘리브레이션이 수행되는 부품 실장기의 제어방법 |
JP4307054B2 (ja) * | 2002-11-29 | 2009-08-05 | パナソニック株式会社 | 部品撮像装置 |
JP5054442B2 (ja) * | 2007-06-19 | 2012-10-24 | パナソニック株式会社 | 実装条件決定方法、実装条件決定装置、部品実装方法、部品実装機、およびプログラム |
US10194570B2 (en) * | 2014-11-13 | 2019-01-29 | Fuji Corporation | Mounter and method for inspecting suction posture of electronic component using mounter |
EP3767938B1 (en) * | 2018-03-14 | 2021-12-15 | Fuji Corporation | Image-capturing unit and component-mounting device |
JP7095109B2 (ja) * | 2018-11-05 | 2022-07-04 | 株式会社Fuji | 作業機、および演算方法 |
-
1999
- 1999-03-29 JP JP08502499A patent/JP4011228B2/ja not_active Expired - Lifetime
-
2000
- 2000-01-14 KR KR1020000001652A patent/KR20000062469A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR20000062469A (ko) | 2000-10-25 |
JP2000277999A (ja) | 2000-10-06 |
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