JP4006934B2 - Manufacturing method of multilayer ceramic electronic component - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a multilayer ceramic electronic component, and in particular, in order to obtain a laminate by laminating a plurality of ceramic green sheets, a ceramic green sheet is laminated, and then a binder contained in the ceramic green sheet is added. The present invention relates to a method for manufacturing a multilayer ceramic electronic component, comprising the steps of pressing a ceramic green sheet that has been laminated to a ceramic green sheet that has been laminated in advance while heating to soften.
[0002]
[Prior art]
In manufacturing a multilayer ceramic electronic component such as a multilayer ceramic substrate, a multilayer ceramic capacitor, or a multilayer ceramic inductor, a process of laminating a plurality of ceramic green sheets is performed.
[0003]
In addition, in order to prevent positional displacement of the ceramic green sheet in such a laminating process, every time a single ceramic green sheet is laminated, the ceramic green sheet is added to the previously laminated ceramic green sheet. There is a case where a pressure bonding process is performed in which pressure is applied so as to cause pressure bonding.
[0004]
In the above-described crimping process, for example, heating at a temperature of 60 to 90 ° C. is applied in order to soften the binder contained in the ceramic green sheet.
[0005]
Such repetition of the laminating step and the crimping step is described in, for example, Japanese Patent Laid-Open No. 9-104016.
[0006]
[Problems to be solved by the invention]
However, the laminate composed of a plurality of ceramic green sheets immediately after the above-described crimping step is in a very weak state because the binder contained therein remains softened due to heating during the crimping. . For this reason, if the laminated body is brought into a subsequent process such as a cutting process in this state, undesired elongation or deformation occurs in the laminated body. May occur.
[0007]
Therefore, an object of the present invention is to provide a method for manufacturing a multilayer ceramic electronic component that can solve the above-described problems.
[0008]
[Means for Solving the Problems]
In order to obtain a laminate in which a plurality of ceramic green sheets are laminated, the present invention provides a lamination process of laminating ceramic green sheets, and then heating while softening the binder contained in the ceramic green sheets. The present invention is directed to a method for manufacturing a laminated ceramic electronic component comprising a crimping step for crimping the ceramic green sheet to a laminated ceramic green sheet. It is characterized by having such a configuration.
[0009]
That is, the lamination process and crimping process described above, the step of respectively, thereby crimping the ceramic green sheets of ceramic green sheets steps and stacking bases on the under sheet held by at stacking on the under sheet held on stacking bases It has. Here, the undersheet is composed of a plastic sheet having a rough surface. The method for manufacturing the multilayer ceramic electronic component further includes a cooling step of cooling the multilayer body with the undersheet attached to the multilayer body obtained through the lamination step and the crimping step, and taking out the multilayer body from the multilayer base. And a separation step of separating the undersheet from the laminate after the cooling step.
[0010]
In the cooling process described above, the laminate is cooled to room temperature, for example.
[0011]
In the present invention, a pin insertion hole is provided in the peripheral portion of the ceramic green sheet, and a plurality of ceramic green sheets are aligned in the state in which the above-described laminating process is aligned by inserting a guide pin into the pin insertion hole. It is preferable to carry out so as to laminate.
[0012]
In this preferred embodiment, it is preferable that a removal step of cutting and removing the peripheral portion of the ceramic green sheet provided with the pin insertion hole of the laminate is further performed after the separation step described above.
[0013]
When the manufacturing method according to the present invention further includes a step of pressing the laminated body in the laminating direction, such a pressing step is preferably performed after the removing step described above.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a plan view showing an arrangement of main working units provided in a manufacturing apparatus 1 used for carrying out a method for manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention.
[0015]
The manufacturing apparatus 1 is provided with each operation | work part of the sheet supply part 2, the corner cut part 3, the lamination | stacking part 4, the crimping | compression-bonding part 5, and the film discharge part 6, and these are arrange | positioned as shown in FIG. In addition, the concrete operation | work implemented in these operation parts 2-6 is mentioned later.
[0016]
FIG. 2 is a diagram corresponding to FIG. 1 and is a plan view showing a schematic configuration of the manufacturing apparatus 1. FIG. 3 is a front view illustrating a schematic configuration of the manufacturing apparatus 1.
[0017]
The elements shown in FIGS. 2 and 3 will be described with reference to FIG. 1. A rack 7 is disposed in the sheet supply unit 2. In the rack 7, a plurality of trays 8 containing ceramic green sheets to be described later are set in a state of being arranged in two rows.
[0018]
A corner cut base 9 is disposed in the corner cut portion 3.
[0019]
A stacking table 10 is disposed in the stacking unit 4.
[0020]
A crimping device 11 is disposed in the crimping section 5.
[0021]
A film discharge box 12 is disposed in the film discharge unit 6.
[0022]
Further, a tray pulling device 13 is disposed in association with the rack 7.
[0023]
In order to convey the ceramic green sheet, first and second suction holding devices 14 and 15 are provided that move while sucking and holding the ceramic green sheet based on vacuum suction.
[0024]
The stacking table 10 is movable between the position shown in FIGS. 2 and 3 and the position where the crimping device 11 is provided, and a rail 16 is provided to guide this movement.
[0025]
The tray pulling device 13 is for pulling out the tray 8, and rails 17 and 18 are provided to guide such pulling operation. 2 and 3, illustration of the tray pulling device 13 provided in association with the rail 18 is omitted.
[0026]
The first suction holding device 14 can be moved between the tray drawing device 13 and the corner cut table 9, and the second suction holding device 15 can be moved between the corner cut table 9 and the stacking table 10. Rails 19 are provided to be movable and to guide these movements.
[0027]
The ceramic green sheet 20 accommodated in the tray 8 set in the rack 7 arranged in the sheet supply unit 2 is shown in FIG.
[0028]
With reference to FIG. 4, for example, a carrier film 21 having a thickness of 50 μm is prepared, and ceramic green sheet 20 is formed by applying a ceramic slurry onto carrier film 21. In forming the ceramic green sheet 20, a doctor blade method, a die coater method, a roll coater method or the like is applied.
[0029]
The thickness of the ceramic green sheet 20 to be molded is, for example, 10 μm to 300 μm, and a plurality of types having different thicknesses are prepared according to the design of the multilayer ceramic electronic component to be obtained.
[0030]
In addition, the ceramic green sheet 20 backed by the carrier film 21 is stored in a state of being wound in a roll shape (not shown). The ceramic green sheet 20 is drawn from the roll and cut along with the carrier film 21 along the cutting line 22 so as to have a size of, for example, 150 mm × 150 mm.
[0031]
The ceramic green sheet 20 cut to a predetermined size as described above is provided with a plurality of pin insertion holes 23 and a plurality of reference holes 24 so as to also penetrate the carrier film 21. The pin insertion hole 23 and the reference hole 24 are simultaneously formed using a mold or a laser. As a result, there is no room for misalignment between the pin insertion hole 23 and the reference hole 24.
[0032]
The pin insertion hole 23 has a diameter of 3 to 5 mm, for example, and is disposed in the peripheral portion of the cut rectangular ceramic green sheet 20, more specifically, in each corner portion and each side portion. In this embodiment, five pin insertion holes 23 are arranged along each side, for example, at a position 3 to 7 mm inside from each side of the ceramic green sheet 20.
[0033]
The reference hole 24 has a size of, for example, 1 mm, and is arranged one by one at the center of each side of the cut rectangular ceramic green sheet 20.
[0034]
In the process described with reference to FIG. 4, the ceramic green sheet is cut and then the pin insertion hole 23 and the reference hole 24 are provided. However, as shown in FIG. 5, the ceramic green sheet 20 drawn from the roll is provided. In addition, the pin insertion hole 23 and the reference hole 24 may be provided, and then the ceramic green sheet 20 may be cut to a predetermined size. In FIG. 5, elements corresponding to those shown in FIG. 4 are denoted by the same reference numerals, and redundant description is omitted.
[0035]
FIG. 6 shows a ceramic green sheet 20 cut to a predetermined size. The ceramic green sheet 20 is subjected to several processes according to the design of the multilayer ceramic electronic component to be obtained.
[0036]
First, as shown in FIG. 6, a via hole 25 is formed, the via hole 25 is filled with a conductive paste 26, and a conductive film 27 having a predetermined pattern is formed by printing the conductive paste. The filling of the conductive paste 26 into the via hole 25 and the formation of the conductor film 27 may be achieved in the same process or in different processes.
[0037]
As the conductive paste 26 and the conductive film 27 in the via hole 25 described above, for example, a paste containing copper, nickel, silver or silver / palladium as a conductive component is used.
[0038]
A laser or a mold is applied to form the via hole 25.
[0039]
In filling the via hole 25 with the conductive paste 26, the conductive paste 26 is preferably applied in a state where a negative pressure is applied to the via hole 25. It may be performed from the carrier film 21 side using the film 21 as a mask, or from the ceramic green sheet 20 side while applying screen printing or the like.
[0040]
The formation of the via hole 25, the filling of the conductive paste 26, and the formation of the conductor film 27 are performed while sensing the reference hole 24 with a CCD camera, for example, and using this as a positioning reference.
[0041]
Note that some ceramic green sheets 20 are formed only with a conductor film, and other via holes are not filled with a conductive paste. Furthermore, there are some in which neither such a conductor film nor a via hole is formed.
[0042]
As shown in FIGS. 7 and 8, the ceramic green sheet 20 subjected to the desired processing as described above is accommodated in the tray 8, and the tray 8 is set in the rack 7. As described above, FIG. 7 shows a state in which a plurality of trays 8 are set in the rack 7 in two rows.
[0043]
As shown in FIG. 7, the rack 7 is disposed in the outer frame 28 and can be moved up and down by a lifting mechanism (not shown). By moving the rack 7 up and down, the specific tray 8 is configured to be brought to a predetermined height position. In each tray 8, a plurality of the same type of ceramic green sheets 20 are stacked and accommodated. And the laminated body for the multilayer ceramic electronic components to be obtained can be produced by laminating the ceramic green sheets accommodated in each of the plurality of trays 8 in a predetermined order.
[0044]
In one tray 8, a plurality of types of ceramic green sheets 20 may be stacked and accommodated in a predetermined order. In this case, the target laminated body can be produced by taking out and laminating a plurality of ceramic green sheets 20 accommodated in a specific tray 8 in order from the top.
[0045]
As shown in FIG. 7, the area efficiency can be increased by setting a plurality of trays 8 in the rack 7, and the diversification of the ceramic green sheets 20 required in the multilayer ceramic electronic component to be obtained is achieved. Can be accommodated without increasing the area. However, if such an advantage is not desired, a plurality of trays 8 may be laid flat.
[0046]
When the required ceramic green sheet 20 is to be taken out, the tray 8 that accommodates the required ceramic green sheet 20 is pulled out by the above-described tray pulling device 13 as shown for the specific tray 8 in FIG. It is assumed that FIG. 9 shows details of the tray drawing device 13.
[0047]
Referring to FIG. 9, the rack 7 is raised and lowered as indicated by an arrow 29 in order to bring the desired tray 8 to the height position of the tray pulling device 13. Next, the chuck 32 moves along the rail 31 extending in the direction of the arrow 30, and at the end of this movement, the chuck 32 rises in the direction of the arrow 33, and the engaging pin 34 provided at the tip of the chuck 32 moves to the tray 8. Engage. Next, the chuck 32 moves in the reverse direction along the rail 31, so that the tray 8 is pulled out.
[0048]
In this state, the first suction holding device 14 described above conveys the uppermost ceramic green sheet 20 in the tray 8 to the corner cut table 9 while sucking and holding it.
[0049]
The ceramic green sheet 20 immediately below may adhere to the uppermost ceramic green sheet 20 adsorbed and held by the first adsorbing and holding device 14 due to static electricity or the like. The ceramic green sheet 20 may also be taken out at the same time. In order to prevent this, it is preferable that the first suction holding device 14 has the following configuration.
[0050]
That is, the first adsorption holding device 14 adsorbs and holds the ceramic green sheet 20 in the vicinity of the opposing sides, and at the moment of lifting the ceramic green sheet 20, these adsorbing and holding portions are temporarily brought close to each other. Thus, the ceramic green sheet 20 is configured to sag. This slack acts to forcibly separate the ceramic green sheet 20 immediately below.
[0051]
After the removal of the ceramic green sheet 20 by the first suction holding device 14 is finished, the chuck 32 moves along the rail 31 and pushes the tray 8 back into the rack 7. Then, after the chuck 32 is lowered in the direction of the arrow 33 to release the engagement state of the engagement pin 34, the chuck 32 moves along the rail 31 and stands by at a position outside the rack 7.
[0052]
In this embodiment, the ceramic green sheet 20 backed by the carrier film 21 is handled with the carrier film 21 facing upward. Therefore, in FIGS. 7 and 8, the ceramic green sheet 20 accommodated in the tray 8 is covered with the carrier film 21.
[0053]
Regarding the removal of the ceramic green sheet 20 described above, data relating to the type, stacking order, number of sheets, etc. of the ceramic green sheets 20 required in the multilayer body for the multilayer ceramic electronic component to be obtained is an arithmetic unit (not shown). The tray 8 for storing the necessary ceramic green sheets 20 is pulled out based on such an arithmetic unit, and the first green ceramic holding sheets 14 are drawn from the tray 8 one by one. It is made to be taken out by.
[0054]
10 and 11 show the configuration of the corner cut portion 3 shown in FIG. In these drawings, the corner cut base 9 shown in FIGS. 2 and 3 is shown.
[0055]
In the corner cut portion 3, four corners of the ceramic green sheet 20 backed by the carrier film 21 are cut and removed. As a result, only the carrier film 21 is left in the four corners. The four corners of the carrier film 21 make it easy to grip only the carrier film 21, and therefore make it easy to peel from the ceramic green sheet 20 while gripping only the carrier film 21 in the peeling step described later. .
[0056]
A pressing plate 35 is disposed above the corner cut table 9. The pressing plate 35 is movable in the vertical direction. As a result of the downward movement, the pressing plate 35 presses the ceramic green sheet 20 conveyed on the corner cut table 9 toward the corner cut table 9.
[0057]
Further, the four corners of the corner cutting base 9 are cut out, and chamfered portions 9a are formed therein, and the cutting blades 36 are respectively arranged so as to face the chamfered portions 9a. The operation of the cutting blade 36 is shown in FIG.
[0058]
As shown in FIG. 12 (1), when the cutting blade 36 is raised, only the ceramic green sheet 20 is cut at each corner of the ceramic green sheet 20, leaving the carrier film 21.
[0059]
Next, as shown in FIG. 12 (2), the cutting blade 36 slides in the direction of the arrow 37, whereby the corner piece 38 of the ceramic green sheet 20 is removed. As a result, a state where only the carrier film 21 protrudes from the four corners is obtained.
[0060]
Then, as shown in FIG. 12 (3), the cutting blade 36 returns to the original position.
[0061]
As shown in FIG. 13, the cutting blade 36 may be configured to rotate or swing in the direction of the arrow 39 around a predetermined fulcrum.
[0062]
Moreover, in the corner cut part 3, it is checked whether the ceramic green sheet 20 set | placed on the corner cut stand 9 should be laminated | stacked. Therefore, a mark is displayed on the ceramic green sheet 20 in advance according to the type. This mark is given by a bar code, for example. Such a barcode is printed at the same time as printing for forming the conductive film 27 described above, for example.
[0063]
In order to read the barcode, a barcode reader 40 is disposed below the corner cut table 9, and a window 41 is provided at a portion of the corner cut table 9 where the barcode is located.
[0064]
Instead of the barcode described above or together with the barcode, a plurality of symbolized punch holes may be provided so as to penetrate the ceramic green sheet 20. The punch hole can be formed simultaneously with the via hole 25 in the step of forming the via hole 25 described above. The punch hole can be read by a camera, for example.
[0065]
In this embodiment, the thickness of the ceramic green sheet 20 placed on the corner cut table 9 is checked. Therefore, as shown in FIG. 11, a contact type dial gauge 42 is provided above the corner cut table 9. The dial gauge 42 adjusts the thickness of the ceramic green sheet 20 on the corner cut table 9 by bringing the probe 43 into contact with the ceramic green sheet 20 on the corner cut table 9, more precisely, the carrier film 21 thereon. taking measurement.
[0066]
In this thickness measurement, it is checked whether or not a plurality of ceramic green sheets 20 taken out from the tray 8 by the first suction holding device 14 and placed on the corner cut table 9 are undesirably overlapped. This is the main purpose.
[0067]
For thickness measurement, a non-contact type measuring device such as a laser displacement meter may be used.
[0068]
As described above, when the bar code or punch hole displayed according to the type of the ceramic green sheet 20 is inappropriate or the thickness is inappropriate, the ceramic green sheet 20 is removed from the corner cut base 9. Removed.
[0069]
Note that the barcode or punch hole reading process and the thickness measurement process using the dial gauge 42 may be performed substantially simultaneously, or one of them may be performed first and the other may be performed later.
[0070]
Moreover, in this embodiment, after determining the suitability of the ceramic green sheet 20 described above, corner cutting of the ceramic green sheet 20 on the corner cut table 9 is performed. The step of determining the suitability of the ceramic green sheet 20 is performed. Is performed at a place other than the corner cut portion 3, and only the ceramic green sheet 20 determined to be appropriate may be conveyed to the corner cut portion 3.
[0071]
The ceramic green sheet 20 on the corner cut table 9 that has finished the corner cut operation is conveyed onto the stacking table 10 by the second suction holding device 15 as described above.
[0072]
FIGS. 14 and 15 are a plan view and a front view, respectively, showing the stacking table 10.
[0073]
The laminated table 10 is cut out at each corner and forms a chamfered portion 10a there. In addition, the stacking table 10 is provided with a plurality of guide pins 44. The guide pins 44 are to be inserted into the above-described pin insertion holes 23 provided in the ceramic green sheet 20, and have the same arrangement state as the pin insertion holes 23.
[0074]
The diameter of the guide pin 44 is substantially the same as the diameter of the pin insertion hole 23. As described above, when the diameter of the pin insertion hole 23 is 3 to 5 mm, the diameter of the guide pin 44 is also selected to be 3 to 5 mm. . If the diameter of the guide pin 44 is too small compared to the diameter of the pin insertion hole 23, the accuracy of the alignment of the ceramic green sheet 20 is deteriorated. Conversely, if the diameter is too large, the insertion into the pin insertion hole 23 becomes difficult. The ceramic green sheet 20 may be damaged around the pin insertion hole 23.
[0075]
The tip of the guide pin 44 is preferably provided with a tapered taper.
[0076]
Further, the guide pin 44 is held so as to be movable up and down with respect to the stacking table 10, thereby being able to take a projecting state as shown in FIG. 15 and a non-projecting state (not shown).
[0077]
Further, when the plurality of ceramic green sheets 20 are stacked on the stacking table 10, an undersheet 45 (not shown in FIGS. 4 and 5) is disposed so as to contact the stacking table 10. The undersheet 45 is illustrated in FIGS. 19 and 21. Under the seat 45 is composed of a plastic sheet front surface is roughened.
[0078]
The stacking table 10 is preferably provided with means for fixing the undersheet 45. The undersheet 45 can be held with respect to the stacking table 10 by adhesion, for example, by vacuum suction, or by mechanical means.
[0079]
When held by vacuum suction, a plurality of suction holes are provided in the stacking table 10, and the undersheet 45 is held on the stacking table 10 based on vacuum suction. The cross-sectional shape of the suction hole can be arbitrarily selected, but the diameter is preferably about 0.4 to 1.0 mm. If the diameter is smaller than 0.4 mm, processing for providing the suction hole becomes difficult and sufficient holding force cannot be obtained. On the other hand, if the diameter is larger than 1.0 mm, the ceramic green sheet 20 has suction holes. Traces may remain, leading to poor appearance, and in the worst case, the ceramic green sheet 20 may be damaged.
[0080]
Note that the arrangement of the guide pins 44 provided in the stacking base 10 is determined in accordance with the arrangement of the pin insertion holes 23 provided in the ceramic green sheet 20, but the arrangement of the pin insertion holes 23 is changed. Accordingly, the guide pins 44 may be provided on the stacking table 10 with the arrangement as shown in FIG. 16 or FIG.
[0081]
In FIG. 16, guide pins 44 are provided at each corner portion of the stacking table 10, and one guide pin 44 is provided at substantially the center of each side. As a result, three guide pins 44 are provided along each side of the stacking table 10. Guide pins 44 are arranged.
[0082]
In FIG. 17, two guide pins 44 are provided at each corner portion of the stacking table 10, and two guide pins 44 are provided at positions offset from the center of each side. As a result, four guide pins 44 are provided along each side. Guide pins 44 are provided.
[0083]
The arrangement of the guide pins 44 is taken into consideration so that undesired deformation of the ceramic green sheet 20 is less likely to occur in the crimping process described later.
[0084]
As described above, the ceramic green sheet 20 that has undergone the corner cutting in the corner cutting unit 3 is conveyed to the stacking unit 4 by the second suction holding device 15 and stacked on the undersheet 45 on the stacking table 10. . Each time this stacking is completed, the stacking table 10 is moved along the rail 16 and moved to a position below the crimping device 11 disposed in the crimping section 5.
[0085]
FIG. 18 illustrates an upper mold 46 provided in the crimping device 11 disposed in the crimping section 5. 18 (1) is a top view of the upper mold 46, FIG. 18 (2) is a front view of the upper mold 46, and also shows the stacking table 10, and FIG. FIG. 6 is a bottom view of the upper mold 46.
[0086]
The upper mold 46 is driven so as to move in the vertical direction as a whole. A part of the upper mold 46 also constitutes a movable part 47, and the movable part 47 can be moved laterally away from the remaining part of the upper mold 46.
[0087]
On the lower surface side of the upper mold 46, a pressure bonding member 48 for providing a pressure bonding surface is provided. As shown well in FIG. 18 (3), the planar shape of the crimping member 48 is substantially the same as the planar shape of the stacking table 10, and the four corner portions are cut out, and chamfered there. A portion 48a is formed. An escape hole 49 for receiving the guide pin 44 protruding from the stacking base 10 is provided on the crimping surface of the crimping member 48.
[0088]
Further, gripping mechanisms 50 and 51 are provided on the lower surface side of the upper mold 46 so as to face the four chamfered portions 48 a of the crimping member 48. Of these gripping mechanisms 50 and 51, the gripping mechanism 51 is positioned on the movable portion 47.
[0089]
The gripping mechanisms 50 and 51 have substantially the same structure as each other, and include a chuck portion 52 for gripping a corner of the carrier film 21, and the chuck portion 52 grips and releases the carrier film 21. Therefore, the carrier film 21 can be opened and closed, and can be moved in the diagonal direction of the carrier film 21 so as to be close to and separated from the crimping member 48.
[0090]
FIG. 19 shows operations related to the upper mold 46 in the crimping apparatus 11.
[0091]
First, FIG. 19 (1) shows a state in which the stacking table 10 has been moved to a position below the upper mold 46. A ceramic green sheet 20 having a predetermined size and backed by a carrier film 21 is placed on the stacking table 10 with an undersheet 45 laid thereon. The ceramic green sheet 20 and the carrier film 21 are aligned with the stacking base 10 by receiving the guide pins 44 in the pin insertion holes 23. Moreover, the ceramic green sheet 20 has finished the corner cut process in the corner cut part 3, and the four corners are removed.
[0092]
Next, as shown in FIG. 19 (2), the upper mold 46 is lowered, and the crimping member 48 exerts a crimping action on the ceramic green sheet 20. At this time, each chuck portion 52 of the gripping mechanisms 50 and 51 moves to receive the corner of the carrier film 21 and then closes to grip the corner of the carrier film 21.
[0093]
Next, as shown in FIG. 19 (3), the upper mold 46 is raised. At this time, since the chuck portions 52 of the gripping mechanisms 50 and 51 are gripping the corners of the carrier film 21, the carrier film 21 is peeled from the ceramic green sheet 20 as the upper mold 46 is raised. Is done.
[0094]
Next, as shown in FIG. 19 (4), the chuck portion 52 of the gripping mechanism 50 is opened to release the carrier film 21. On the other hand, the chuck portion 52 of the gripping mechanism 51 maintains a gripping state.
[0095]
Next, as shown in FIG. 19 (5), the movable portion 47 moves sideways while the chuck portion 52 of the gripping mechanism 51 grips the carrier film 21. At the end of this movement, the carrier film 21 is positioned above the film discharge box 12 disposed in the film discharge unit 6 shown in FIGS. At this end position, the chuck portion 52 of the gripping mechanism 51 is opened, the carrier film 21 is released, and dropped into the film discharge box 12.
[0096]
Next, the stacking table 10 is moved back to the stacking unit 4 shown in FIG. 1, where it waits for the next stacking of the ceramic green sheets 20.
[0097]
Each process from the removal of the ceramic green sheet 20 from the tray 8 described above to the pressing of the ceramic green sheet 20 and the peeling of the carrier film 21 is repeated until a laminated body for the target laminated ceramic electronic component is obtained. .
[0098]
In addition, in the crimping | compression-bonding process mentioned above, in order to soften the binder contained in the ceramic green sheet 20, the temperature of 40-100 degreeC is provided with respect to the ceramic green sheet 20. FIG.
[0099]
In the crimping step, for example, a pressure of 200 to 350 Kg / cm ² is applied. In this case, the type and amount of the ceramic raw material and binder contained in the ceramic green sheet 20, the peelability of the carrier film 21, the area of the conductor film 27 formed on the ceramic green sheet 20, the ceramic green sheet 20 to be pressed. Depending on the number of layers, etc., the load exerted on the ceramic green sheet 20 such as pressure and time during crimping may be changed.
[0100]
FIG. 20 shows a modification of the crimping device. 20, elements corresponding to those shown in FIG. 18 and FIG. 19 described above are denoted by the same reference numerals, and redundant description is omitted.
[0101]
The crimping device 11a shown in FIG. 20 has a configuration upside down as compared with the above-described crimping device 11. That is, the stacking table 10 is held on the upper mold 46 side, and the crimping member 48 and the gripping mechanisms 50 and 51 are disposed below the stacking table 10.
[0102]
As described above, when the necessary lamination of the ceramic green sheets 20 for obtaining the laminated body is completed on the laminated table 10, the laminated body 53 (see FIG. 21 or FIG. 22) is taken out together with the undersheet 45. It is. In addition, when taking out the laminated body 53, the guide pin 44 provided in the lamination | stacking stand 10 will fall once, and will be in the retracted state. This is to prevent a mistake in taking out the laminated body 53 due to the resistance of the guide pin 44.
[0103]
The taken-out laminated body 53 is cooled to room temperature, for example, with the undersheet 45 attached, and then the undersheet 45 is separated from the laminated body 53 as shown in FIG. Thereby, undesired elongation and deformation of the laminate 53 can be prevented.
[0104]
Next, as shown in FIG. 22, the laminate 53 is cut along a cutting line 54 in order to remove the peripheral portion of the ceramic green sheet 20 in which the pin insertion hole 23 and the reference hole 24 are provided. . By doing so, it is possible to prevent the laminated body 53 from undesirably extending or deforming due to the presence of the pin insertion hole 23 and the reference hole 24 in a pressing process performed later.
[0105]
Next, although not shown, the laminated body 53 is arranged in a press die composed of a concave lower mold and an upper punch, and in that state, for example, a pressing process by a rigid press is performed so that the laminated body 53 is placed in the laminating direction. Pressed.
[0106]
It should be noted that this pressing step can be omitted by increasing the pressure in the above-described crimping step.
[0107]
Next, the multilayer body 53 is cut by, for example, a dicing saw or a cutting blade in order to obtain a multilayer chip for individual multilayer ceramic electronic components.
[0108]
Next, the laminate chip is fired. Next, a conductive paste containing a conductive component such as copper, silver, or nickel is applied to the outer surface, for example, an end surface, of the laminated chip after sintering, and the external electrode is formed by drying and baking. The external electrode is subjected to nickel and / or tin plating as necessary.
[0109]
In order to form the external electrode, a conductive paste may be applied on the laminate chip before firing, and baking for forming the external electrode may be performed simultaneously with firing of the laminate chip. In this case, as the conductive paste for forming the external electrode, a paste having substantially the same composition as the conductive paste 26 filled in the via hole 25 and the conductive paste for forming the conductor film 27 is used. Is preferred.
[0110]
In this way, a desired multilayer ceramic electronic component is completed.
[0111]
【The invention's effect】
As described above, according to the present invention, both the laminating step and the crimping step are performed on the undersheet held on the laminating table, and the undersheet is made of a plastic sheet having a rough surface, and is laminated. The laminate is cooled with the undersheet attached to the laminate obtained through the process and the crimping step, and after this cooling step, the undersheet is separated from the laminate, so the crimping while heating Elongation and deformation problems that are easily encountered in the laminate immediately after the process can be avoided by reinforcement with the undersheet, and therefore, the laminate can be prevented from undesirably extending or deforming.
[0112]
Also, leaving the under-sheet, since so as to cool the stack, Ru can retrieve the stacking bases or et laminate using a base of the stack and crimp in the laminating step and the crimping step immediately. Moreover, since the laminated body is cooled in the state of being taken out from the laminated body, it is possible to prevent the laminated body from being hindered from being cooled by contact with the laminated base, and the cooling process can be efficiently advanced. it can.
[0113]
In this invention, a pin insertion hole is provided in the peripheral part of the ceramic green sheet, and a plurality of ceramic green sheets are stacked in a state of being aligned by inserting a guide pin into the pin insertion hole. In addition, it is possible to easily align the ceramic green sheets at the time of lamination, and it is possible to reliably prevent the displacement of the ceramic green sheets before and after the lamination, and to improve the accuracy of the lamination.
[0114]
In the above-mentioned case, if the laminate is separated from the undersheet and then the peripheral portion of the ceramic green sheet provided with the pin insertion hole is cut and removed, the cutting for such removal is performed. In this case, undesired deformation and elongation of the laminate can be made difficult to occur.
[0115]
Also, if the laminate is pressed in the laminating direction after the above-described removal step, the laminate is prevented from undesirably extending or deforming due to the presence of pin insertion holes in this pressing step. can do.
[Brief description of the drawings]
FIG. 1 is a plan view showing an arrangement of main working units provided in a manufacturing apparatus 1 used for carrying out a method for manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention.
FIG. 2 corresponds to FIG. 1 and is a plan view illustrating a schematic configuration of a manufacturing apparatus 1;
3 is a front view showing a schematic configuration of the manufacturing apparatus 1 shown in FIG. 2. FIG.
4 is a plan view for explaining a process for obtaining a ceramic green sheet 20 supplied in the sheet supply unit 2 shown in FIG. 1; FIG.
FIG. 5 is a plan view for explaining a modified example of the process for obtaining the ceramic green sheet 20;
6 is a plan view showing a state in which a via hole 25 and a conductor film 27 are formed in the ceramic green sheet 20. FIG.
7 is a perspective view showing a part of a rack 7 arranged in the sheet supply unit 2 shown in FIG. 1. FIG.
8 is a perspective view independently showing a tray 8 set in the rack 7 shown in FIG. 7. FIG.
FIG. 9 is a side view for explaining the operation of the tray drawing device 13 shown in FIG. 2;
10 is a plan view for explaining a configuration of a corner cut portion 3 shown in FIG. 1; FIG.
FIG. 11 is a front view of the corner cut portion 3 shown in FIG.
12 is a cross-sectional view for explaining a corner cut operation of the corner cut portion 3 shown in FIGS. 10 and 11. FIG.
13 is a view for explaining a modification of the operation of the cutting blade shown in FIG.
14 is a plan view showing the stacking table 10 shown in FIG. 2. FIG.
15 is a front view of the stacking table 10 shown in FIG.
16 is a plan view showing a first modification of the stacking table 10. FIG.
17 is a plan view showing a second modification of the stacking table 10. FIG.
18 shows an upper mold 46 provided in the crimping apparatus 11 shown in FIG. 2, wherein (1) is a top view, (2) is a front view and also shows the stacking table 10; 3) is a bottom view.
FIG. 19 is a front view for explaining the operation of the upper mold shown in FIG.
FIG. 20 is a front view showing a modification of the crimping apparatus.
21 is a front view showing a state in which the undersheet 45 is about to be peeled off from the laminated body 53. FIG.
22 is a plan view for explaining a process of cutting the peripheral portion of the stacked body 53. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Manufacturing apparatus 4 Lamination | stacking part 5 Crimping part 10 Laminating table 11, 11a Crimping apparatus 20 Ceramic green sheet 23 Pin insertion hole 44 Guide pin 45 Under sheet 46 Upper die 48 Crimping member 53 Laminate 54 Cutting line

Claims (4)

In order to obtain a laminate in which a plurality of ceramic green sheets are laminated, the ceramic green sheets are laminated, and then laminated in advance while heating to soften the binder contained in the ceramic green sheets. A method of manufacturing a multilayer ceramic electronic component comprising a crimping step of crimping the ceramic green sheet to a ceramic green sheet,
In the laminating step and the crimping step, the ceramic green sheet is laminated on the undersheet held on the laminating table and the ceramic green sheet is crimped on the undersheet held on the laminating table , respectively. The undersheet is made of a plastic sheet with a roughened surface , and
Cooling in a state where the laminated body is taken out from the lamination table while the undersheet is attached to the laminated body obtained through the lamination step and the pressure bonding step;
The manufacturing method of a multilayer ceramic electronic component provided with the isolation | separation process of isolate | separating the said undersheet from the said laminated body after the said cooling process. A pin insertion hole is provided in a peripheral portion of the ceramic green sheet, and the laminating step is performed by laminating a plurality of the ceramic green sheets in an aligned state by inserting a guide pin into the pin insertion hole. The manufacturing method of the multilayer ceramic electronic component of Claim 1 provided with the process to do. 3. The multilayer ceramic electronic component according to claim 2, further comprising a removal step of cutting and removing a peripheral portion of the ceramic green sheet provided with the pin insertion hole of the multilayer body after the separation step. Production method. The method for manufacturing a multilayer ceramic electronic component according to claim 3, further comprising a step of pressing the multilayer body in a stacking direction after the removing step.

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