JP3984341B2

JP3984341B2 - Electronic component mounting method and electronic component mounting machine

Info

Publication number: JP3984341B2
Application number: JP30741797A
Authority: JP
Inventors: 好裕味村; 典晃吉田; 敦田邉
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 1997-11-10
Filing date: 1997-11-10
Publication date: 2007-10-03
Anticipated expiration: 2017-11-10
Also published as: JPH11145686A

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品の吸着姿勢を撮像により検出したのち、撮像された電子部品を回路基板上に自動的に実装する電子部品実装方法及び電子部品実装機に関する。
【０００２】
【従来の技術】
従来の電子部品実装機のー般的な構成として、全体の斜視図および平面図をそれぞれ図５，図６に示す。図１４の従来の制御シーケンスおよび図５，図６を参照しながら、回路基板上に電子部品を実装する電子部品実装機による従来の電子部品実装方法について説明する。
図７に示すように、回路基板１は複数の実装パターン２（２ａ、２ｂ、２ｃ、…）およびターゲットマーク３（３ａ、３ｂ、３ｃ、…）によって構成され、電子部品実装機による回路基板の生産は、実装パターン２に所望の電子部品を実装することによって行う。ここで、ターゲットマーク３は、回路基板１に実装パターン２が焼成される際に発生する回路基板の収縮と回路基板支持装置４による回路基板１の支持状態によって、回路基板毎に微妙に異なる実装位置を補正するために使用する。
【０００３】
電子部品実装機による回路基板の生産は、まず、生産する回路基板の実装パターンから実装データを作成する（ステップ＃１）。図８は実装データの一例である。
この実装データに従って、所定枚数の回路基板を生産する。その手順は、まず、回路基板１が基板搬送部５から回路基板支持装置４に搬入される（ステップ＃２）。
その後、電子部品実装装置６を部品供給装置７（７ａ、７ｂ、７ｃ、７ｄ）の電子部品上に移動させ、吸装着ノズル８を部品供給位置に位置決めし、実装データに応じた所望の電子部品を吸着する（ステップ＃３）。他のヘッド部でも電子部品の吸着を行う場合にはこの動作を繰り返す（ステップ＃３ａ）。
次いで、吸着した電子部品の吸着姿勢の検出を部品撮像装置９にて行うために、電子部品実装装置６を部品撮像動作開始位置Ｐ１へ移動する（ステップ＃４）。部品撮像装置９はラインセンサで構成されており、部品撮像動作終了位置Ｐ２を目標位置として部品撮像動作開始位置Ｐ１から部品撮像装置上Ｐ３を等速度で電子部品を移動させることで部品撮像を完了する（ステップ＃５）。この部品撮像開始位置Ｐ１および部品撮像終了位置Ｐ２は、吸装着ノズルによって吸着されたすべての電子部品が撮像できるように、それぞれ、予め唯一つのデータとして設定されている。
【０００４】
ここで得られた撮像結果をもとに、当該電子部品の最終実装位置／角度を決定する（ステップ＃６）。ここで、部品撮像装置としてカメラではなくラインセンサを使用しているが、これには下記経過がある。
電子部品実装装置６に装填可能な吸装着ノズルの数がーつで部品撮像装置がカメラの場合、図９のようなタイミングとなる。しかし、連続する実装対象の電子部品が部品供給装置７上において同位置または隣接位置の場合、吸着→撮像→実装→吸着→撮像→実装よりも吸着→吸着→撮像→撮像→実装→実装の方が電子部品実装装置６が効率的な動作となり高速化につながる。このような背景から電子部品実装装置６には複数本の吸装着ノズルが装填可能となっており、その場合のタイミングは図１０のようになる。
ところが、この場合、電子部品の撮像の度毎に部品撮像位置Ｐ３上に電子部品が位置するように電子部品実装装置６を移動／停止させなければならす、都度、加速動作／減速動作が伴い効率的ではない。これに対して、部品撮像装置がカメラではなくラインセンサであれば、タイミングは図１１のようになり、電子部品実装装置６に装填されている吸装着ノズルの数が複数本の場合でも、電子部品実装装置６の加速動作／減速動作がー回で済み高速化につながる。このような背景から部品撮像装置にはカメラではなくラインセンサを使用している。
【０００５】
また、ラインセンサによる電子部品の撮像は図１２に示す撮像距離データを使用して行う。その仕組みを図１３を用いて説明すると、部品撮像開始位置Ｐ１から部品撮像終了位置Ｐ２に向けて電子部品実装装置６を動作させる際に、ヘッド部の近傍に取り付けられた原点センサ１０によって、軸上に貼付されたリニアスケール１１から第一の原点１２（１２ａ、１２ｂ、…）を検出する。その後、撮像距離データに定義された所定パルス数をカウント後から所定パルスの間、ライン入力の繰返しで部品撮像を行うものである。なお、図１３では、紙面左方に部品撮像開始位置Ｐ１、紙面右方に部品撮像終了位置Ｐ２を設定しているが、逆に紙面右方に部品撮像開始位置Ｐ１、紙面左方に部品撮像終了位置Ｐ２を設定した場合の撮像距離データが別に設定されていれば、吸装着ノズルによって吸着した電子部品の画像を撮像する部品撮像装置およびその部品撮像装置にて取り込んだ電子部品の画像を解析する認識制御装置の処理は同様に行える。
【０００６】
最後に、得られた回路基板上の実装位置に当該電子部品が位置するように電子部品実装装置６を位置決めし、吸装着ノズル８を下降させることで電子部品の実装を行う（ステップ＃７）。他のヘッド部において電子部品を吸着している場合には同様に実装を行う（ステップ＃７ａ）。
このような一連の吸装着動作を、予め作成した実装データに従って繰返し行うことで一枚の回路基板を生産するわけであるが、この時点で当該回路基板の生産が完了したか否かを調べる（ステップ＃８）。生産完了であれば回路基板を回路基板支持装置４から基板搬送部５へ搬出し（ステップ＃９）、生産完了でなければ、次の電子部品の吸装着処理（ステップ＃３〜＃７）を行うことになる。
【０００７】
【発明が解決しようとする課題】
しかしながら、図１３に示す電子部品実装装置６に３本の吸装着ノズル（Ｈ１、Ｈ２、Ｈ３）が併設されている場合を例に考えてみると、吸着→撮像→実装のー連の動作の間にＨ１、Ｈ２の吸装着ノズルは使用せず、一つの電子部品をＨ３だけを使用して吸着→撮像→実装する場合、部品撮像終了位置Ｐ２はすべての吸装着ノズル（Ｈ１、Ｈ２、Ｈ３）によって吸着されたすべての電子部品が撮像できるように、唯一つ設定されているため、吸装着ノズルＨ３によって吸着された電子部品を撮像後、吸装着ノズルＨ１、Ｈ２によって吸着された電子部品の撮像も見込んだ不要な間、電子部品実装装置を移動させることになり、無駄な動作が発生し高速化の妨げとなる。
さらに、図６で明らかなように、部品供給装置７ａでの電子部品吸着後の部品撮像開始位置Ｐ１への移動は効率的であるのに対し、部品供給装置７ｂでの電子部品吸着後は、部品撮像開始位置Ｐ１および部品撮像終了位置Ｐ２を唯一つのデータとして設定しており、Ｐ２を部品撮像開始位置とできないため、部品撮像開始位置Ｐ１まで移動しなければならす非効率的である。
【０００８】
また、同様に図６から明らかなように、部品供給装置７ｃおよび７ｄで電子部品を吸着した場合、部品の吸着姿勢を部品撮像装置９にて撮後・検出するために、電子部品の実装対象である回路基板１を一度隔てることになり、無駄な動作が発生する。
したがって、本発明の目的は、上記従来の問題に鑑み、撮像が不要なヘッド部も含めた移動をなくすために部品撮像終了位置を部品撮像が必要な最終撮像ヘッド部に応じて動的に変化させ、部品撮像の必要なヘッド部の撮像が完了した時点で部品撮像動作を終了する効率的な動作を行う電子部品実装方法及び電子部品実装機を提供することにある。
【０００９】
【課題を解決するための手段】
本発明は、上述の問題を解決するために、以下のように構成している。
本発明の第１態様によれば、複数の電子部品を供給する部品供給ユニットを有する部品供給装置と、上記電子部品を実装する回路基板を定位置に固定する回路基板支持装置と、所望の吸装着ノズルを装填でき、かつ、装填した吸装着ノズルを上下動作又は回転動作させることが可能な機構を有するヘッド部が複数併設され、上記部品供給装置から所望の電子部品を吸着し上記回路基板上の所定位置へ実装することか可能な電子部品実装装置と、上記吸装着ノズルによって吸着した上記電子部品の画像を撮像するラインセンサである部品撮像装置と、上記部品撮像装置にて取り込んだ上記電子部品の画像を解析し、上記電子部品の吸着状態を検査する認識制御装置とを備えた電子部品実装機において、
上記部品供給装置から所望の電子部品吸着後に部品撮像開始位置へ上記電子部品実装装置を移動させる第一工程と、
電子部品撮像が必要な最終撮像ヘッド部を求める第二工程と、
上記第二工程によって求めた最終撮像ヘッド部から部品撮像終了位置を求める第三工程と、
上記第三工程によって求められた部品撮像終了位置へ上記電子部品実装装置を移動させる第四工程とを備える部品撮像動作を有することを特徴とする電子部品実装方法を提供する。
【００１０】
本発明の第２態様によれば、上記部品供給装置からの電子部品吸着位置と部品撮像装置との位置関係から、上記電子部品実装装置の動作が最短となるような部品撮像開始位置を求め、部品撮像方向を切り換える第１態様に記載の電子部品実装方法を提供する。
【００１１】
本発明の第３態様によれば、上記部品供給装置からの電子部品吸着位置と上記部品撮像装置との位置関係から、上記電子部品実装装置の動作が最短となるような部品撮像装置を求め、上記電子部品実装装置の前後の上記部品供給装置毎に複数台設置された部品撮像装置の中から使用する部品撮像装置を切り換える第１又は２態様に記載の電子部品実装方法を提供する。
【００１２】
本発明の第４態様によれば、複数の電子部品を供給する部品供給ユニットを有する部品供給装置と、
上記電子部品を実装する回路基板を定位置に固定する回路基板支持装置と、
所望の吸装着ノズルを装填でき、かつ、装填した吸装着ノズルを上下動作又は回転動作させることが可能な機構を有するヘッド部が複数併設され、上記部品供給装置から所望の電子部品を吸着し上記回路基板上の所定位置へ実装することか可能な電子部品実装装置と、
上記吸装着ノズルによって吸着した上記電子部品の画像を撮像するラインセンサである部品撮像装置と、
上記部品撮像装置にて取り込んだ上記電子部品の画像を解析し、上記電子部品の吸着状態を検査する認識制御装置と、
上記部品供給装置から所望の電子部品吸着後に部品撮像開始位置へ上記電子部品実装装置を移動させ、電子部品撮像が必要な最終撮像ヘッド部を求め、上記第二工程によって求められた最終撮像ヘッド部から部品撮像終了位置を求め、上記第三工程によって求められた部品撮像終了位置へ上記電子部品実装装置を移動させる部品撮像動作を行わせる制御部と、
を備えるようにしたことを特徴とする電子部品実装機を提供する。
【００１３】
本発明の第５態様によれば、上記制御部は、上記部品供給装置からの電子部品吸着位置と部品撮像装置との位置関係から、上記電子部品実装装置の動作が最短となるような部品撮像開始位置を求め、部品撮像方向を切り換える第４態様に記載の電子部品実装機を提供する。
【００１４】
本発明の第６態様によれば、上記電子部品実装装置の前後の上記部品供給装置毎に部品撮像装置を複数台設置した第４又は５態様に記載の電子部品実装機を提供する。
【００１５】
本発明の第７態様によれば、上記制御部は、上記部品供給装置からの電子部品吸着位置と上記部品撮像装置との位置関係から、上記電子部品実装装置の動作が最短となるような部品撮像装置を求め、使用する部品撮像装置を切り換える第６態様に記載の電子部品実装機を提供する。
【００１６】
【発明の実施の形態】
本発明の下記する種々の実施形態にかかる電子部品実装方法及び電子部品実装機は、上記した従来の技術において、上記したように、以下の不具合を解消するものである。
従来の技術で述べた電子部品実装方法では、電子部品実装装置に併設された吸装着ノズルによって吸着された電子部品の部品撮像動作において、部品撮像の不要なヘッド部まで見込んだ不要な間、電子部品実装装置を移動させる無駄な動作が発生する場合があり高速化の妨げとなる。
さらに、部品撮像開始位置Ｐ１および部品撮像終了位置Ｐ２を唯一つのデータとして設定しているため、制御上可能であってもＰ２を部品撮像開始位置とできず、したかって、部品撮像のために、部品供給装置での撮像前最終の部品吸着位置によってはＰ２より遠方にあるＰ１まで移動しなければならず非効率的な動作が発生する。
また、部品撮像装置が装置後方にーつだけしか据え付けていないために、装置前方の部品供給装置にて電子部品を吸着した場合、部品撮像のために電子部品の実装対象である回路基板をー度隔てることになり、無駄な動作が発生する。
【００１７】
本発明の上記種々の実施形態にかかる電子部品実装方法及び実装機は、部品撮像終了位置、部品撮像方向および部品撮像装置を生産時に動的に切り換えることで、電子部品実装装置の無駄な動作をなくし効率的な動作が行える作用が得られる。
すなわち、上記種々の実施形態にかかる電子部品実装方法及び実装機について図面を参照しながら説明する。
【００１８】
（第１実施形態）
図１に本発明の第１実施形態の電子部品実装方法の制御シーケンスを示す。図３（Ａ）、図６に示す電子部品実装機の全体の斜視図、平面図（制御部などの本実施形態の特徴とする構成を除く部分は基本的には従来と同じ）、および図１を参照しながら本発明の第１実施形態の電子部品実装方法及び該方法を実施する電子部品実装機について説明する。
上記実装機は、図３（Ａ）に示すように、複数の電子部品を供給する部品供給ユニット７ａ，７ｂ，７ｃ，７ｄ，・・・を有する部品供給装置７と、上記電子部品を実装する回路基板１を定位置に固定する回路基板支持装置４と、所望の吸装着ノズル８を１個装填でき、かつ、装填した吸装着ノズル８を上下動作及び回転動作させることが可能な機構を有するヘッド部６ｈ（図１３参照）が複数ヘッド部保持部６ａに併設され、該ヘッド部６ｈをＸＹロボット４０でＸＹ方向の任意の位置に位置決めさせるとともに、上記部品供給装置７から所望の電子部品を吸着し上記回路基板１上の所定位置へ実装することか可能な電子部品実装装置６と、上記吸装着ノズル８によって吸着した上記電子部品の画像を撮像するラインセンサである部品撮像装置９と、上記部品撮像装置９にて取り込んだ上記電子部品の画像を解析し、上記電子部品の吸着状態を検査する認識制御装置と、上記部品供給装置７から所望の電子部品吸着後に部品撮像開始位置へ上記電子部品実装装置６を移動させ（ステップ＃４）、電子部品撮像が必要な最終撮像ヘッド部を求め（ステップ＃１０）、求められた最終撮像ヘッド部から部品撮像終了位置を求め（ステップ＃１１）、求められた部品撮像終了位置へ上記電子部品実装装置を移動させる（ステップ＃５）部品撮像動作を行わせる制御部１００と、制御部１００による各種制御及び各種演算に必要な情報を記憶するメモリ１０１とを備えている。上記認識制御装置は、一例として、図１５に示す画像解析部２０２より構成している。図１５では、原点センサ１０からの信号の入力により、ヘッド部保持部６ａを移動させるＸＹロボット４０の駆動モータのエンコーダ２００からのパルスを画像入力部２０１に入力する。この画像入力部２０１へ入力されたパルスが所定数になるまでの間、撮像装置９からの画像の取り込みを行う。画像入力部２０１に取り込まれた画像は、画像解析部２０２で解析され、部品の姿勢の良否などを解析したのち、解析結果を制御部１００に向けて出力する。
上記構成にかかる上記実装機は、以下のように動作して上記実装方法を実施する。
【００１９】
まず、従来と同様に、生産開始前に生産する回路基板１の実装パターンから、実装データを作成する（ステップ＃１）。この動作は、図１６に示すように、操作盤２１０から作業者が必要なデータを指令部２１１に入力して上記実装データを作成し、データ保存用メモリ２１２に記憶させる。記憶された実装データは必要に応じて制御部１００に送られる。
次いで、従来と同様に、生産する回路基板１が基板搬送部５により回路基板支持装置４に搬入される（ステップ＃２）。
その後、予めステップ＃１で作成されている実装データに従って、部品供給装置７にて所望の電子部品を電子部品実装装置６の複数のヘッド部のうちの１つのヘッド部で吸着後（ステップ＃３）、他のヘッド部での電子部品の吸着を行う場合には上記と同様に電子部品の吸着を行ったのち（ステップ＃３ａ）、吸着した電子部品の吸着姿勢の検出を部品撮像装置９にて行うために、電子部品実装装置６を部品撮像開始位置Ｐ１（図１３参照）へ移動する（ステップ＃４）。
【００２０】
次に、電子部品実装装置６のヘッド部において部品撮像が必要なヘッド部のうちの最終撮像ヘッド部Ｈ_ENDを求める（ステップ＃１０）。ここで、最終撮像ヘッド部Ｈ_ENDとは、複数のヘッド部６ｈのそれぞれで電子部品を吸着しているとき、電子部品実装装置６が部品撮像開始位置Ｐ１から部品撮像終了位置に移動するとき最終に部品撮像を行うと考えられる部品９０を吸着しているヘッド部６ｈのことである。具体的には、図１７（Ａ）に示すように、撮像方向すなわち電子部品実装装置６のヘッド部保持部６ａの移動方向が図１７（Ａ）の左から右への方向である場合でかつ右端のヘッド部６ｈと真ん中のヘッド部６ｈがそれぞれ電子部品９０を吸着している場合、上記移動方向に対して最も最後に電子部品９０が撮像装置９で撮像されるヘッド部６ｈ、すなわち真ん中のヘッド部６ｈが最終撮像ヘッド部Ｈ_ENDとなる。また、もし、図１７（Ｂ）に示すように、撮像方向すなわちヘッド部保持部６ａの移動方向が逆の場合には、右端のヘッド部６ｈが最終撮像ヘッド部Ｈ_ENDとなる。また、図１７（Ｂ）に示すように、撮像方向が右から左で、かつ、左端のヘッド部６ｈのみ電子部品９０を吸着する場合には、そのヘッド部６ｈが最終撮像ヘッド部Ｈ_ENDとなる。従って、複数本のヘッド部６ｈがヘッド部保持部６ａに保持されているとき、電子部品９０を吸着するヘッド部６ｈが１本の場合には直ちにそのヘッド部６ｈが最終撮像ヘッド部Ｈ_ENDとなり、複数本のヘッド部６ｈが電子部品９０を吸着している場合には、撮像方向に対して最も逆方向側に配置されているヘッド部６ｈが最終撮像ヘッド部Ｈ_ENDとなる。このようにして最終撮像ヘッド部Ｈ_ENDが決定されるが、この動作は、図１８に示すように、制御部１００の最終撮像ヘッド部演算部１００ｅで行われる。制御部１００は、回路基板搬送制御部１００ａと実装ブロック指示部１００ｂとを備えて大略構成されており、各制御部での動作情報や後記する演算部などで求められた情報は必要に応じてメモリ１０１に記憶され、また、それらの情報に基づきメモリ１０１内の情報が適宜更新される。回路基板搬送制御部１００ａは、回路基板１の搬送部５による搬送を制御する。実装ブロック指示部１００ｂは、電子部品吸着動作制御部１００ｃと、電子部品撮像動作制御部１００ｄと、電子部品装着動作制御部１００ｇとを備えて、実装動作を指示する。電子部品吸着動作制御部１００ｃは、実装ブロック指示部１００ｂからの実装指示に基づき、各ヘッド部６ｈの吸装着ノズル８による電子部品９０の吸着動作吸着解除動作などを制御する。電子部品撮像動作制御部１００ｄは、最終撮像ヘッド部演算部１００ｅと撮像開始位置／終了位置演算部１００ｆとを備え、実装ブロック指示部１００ｂからの実装指示に基づき、部品撮像装置９による電子部品９０の撮像動作を制御する。最終撮像ヘッド部演算部１００ｅは、上記したように、上記電子部品装着動作制御部１００ｇでの上記電子部品実装装置６のヘッド部保持部６ａの移動方向の情報と、電子部品吸着動作制御部１００ｃでの電子部品９０の吸着動作情報とに基づき、上記したように最終撮像ヘッド部Ｈ_ENDを求める。撮像開始位置／終了位置演算部１００ｆは、後記するように撮像装置９に対するヘッド部保持部６ａの撮像開始位置及び終了位置を演算により求める。電子部品装着動作制御部１００ｇは、補正演算部１００ｈを備えて、電子部品実装装置６のＸＹロボット４０によるＸＹ方向の移動、各ヘッド部６ａでの吸装着ノズル８の上下動などを制御する。補正演算部１００ｈは、撮像された画像の解析結果に基づき、吸装着ノズル８に吸着された電子部品９０の姿勢を補正する。
【００２１】
次に、最終撮像ヘッド部Ｈ_ENDによって吸着された電子部品の部品撮像が行え、かつ、電子部品実装装置６の移動動作がより最短となる部品撮像終了位置Ｐ２’を求める（ステップ＃１１）。例えば、図１３に示すように、ヘッド部保持部６ａに取り付けられた原点センサ１０が、軸上に貼付されたリニアスケール１１から第一の原点１２（１２ａ、１２ｂ、…）を検出後、最終撮像ヘッド部Ｈ_ENDについての撮像距離Ｌと撮像区間Ｓとをメモリ１０１に記憶された図１２のテーブルを参照してそれぞれ求めて、撮像距離Ｌ_END及び撮像区間Ｓ_ENDとし、それらの合計から得られる移動距離（Ｌ_END＋Ｓ_END）を見込んで、図１９に示すように、撮像開始位置／終了位置演算部１００ｆにおいて部品撮像終了位置Ｐ２’（図１３でのＰ２又はその付近）を求める等である。なお、図１９において、Ｌは第１の原点を原点センサ１０で検出したのち、撮像を開始するまでの距離であり、Ｓは撮像の間に電子部品実装装置６のヘッド部保持部６ａが移動する区間を意味する。
【００２２】
次いで、制御部１００により、部品撮像動作終了位置Ｐ２’を目標位置として部品撮像装置上Ｐ３を等速度でヘッド部保持部６ａとともに電子部品９０を移動させるように制御することで部品撮像を完了する（ステップ＃５）。この撮像結果をもとに、補正演算部１００ｈで当該電子部品９０の実装位置又は角度又はその両方の補正量を演算して制御部１００によりその補正量に従って補正する（ステップ＃６）。
最後に、得られた回路基板１上の実装位置に当該電子部品が位置するように電子部品実装装置６を位置決めし、吸装着ノズル８を下降させることで電子部品の回路基板１に対する実装を行う（ステップ＃７）。他のヘッド部６ｈにおいて電子部品を吸着している場合には同様に実装を行う（ステップ＃７ａ）。
この時点で、当該回路基板１の生産が完了したか否かを調べ（ステップ＃８）、生産完了であれば実装が完了した上記回路基板１を回路基板支持装置４から搬出し（ステップ＃９）、次の回路基板１が実装位置に搬入されると、ステップ＃２に戻る（ステップ＃９ａ）。ステップ＃８で生産完了でなければ、上記回路基板１に対して引き続き、次の電子部品の吸装着処理（ステップ＃３，＃４，＃１０，＃１１，＃５〜＃７）を行う。
【００２３】
上記第１実施形態によれば、部品撮像終了位置を部品撮像が必要な最終撮像ヘッド部６ｈに応じて求めることで、部品撮像が不要なヘッド部の部品撮像動作をなくすことができ、効率的な電子部品実装装置６の部品撮像動作を行うことができ、回路基板１の生産を高速に行うことができる。
【００２４】
（第２実施形態）
図２に本発明の第２実施形態の電子部品実装方法の制御シーケンスを示す。図３（Ａ）、図６の電子部品実装機の全体の斜視図、平面図（制御部などの本実施形態の特徴とする構成を除く部分は基本的には従来と同じ）、及び図２を参照しながら本発明の第２実施形態の電子部品実装方法について説明する。第２実施形態での特有の機能は、図３（Ａ）の上記制御部１００で行うようにしている。
まず、従来と同様に、生産開始前に生産する回路基板１の実装パターンから、実装データを作成し（ステップ＃１）、次いで、生産時には生産する回路基板１の搬入（ステップ＃２）、実装データに応じた所望の電子部品を吸着（ステップ＃３）を行う。
【００２５】
ここで、電子部品実装装置６の部品撮像動作がより最短となる部品撮像開始位置Ｐ１”を電子部品撮像開始位置／終了位置演算部１００ｆにより求める（ステップ＃１２）。すなわち、部品供給装置７からの撮像前の最終部品吸着位置のＸＹ座標を（Ｘ_VAC、Ｙ_VAC）、従来の部品撮像開始位置Ｐ１および部品撮像終了位置Ｐ２の座標をそれぞれ（Ｘ_P1、Ｙ_P1）、（Ｘ_P2、Ｙ_P2）とするとき、下記の（１）式を満たす場合は、図２０に点線で示すように、部品撮像終了位置Ｐ２を部品撮像開始位置Ｐ１”、部品撮像開始位置Ｐ１を部品撮像終了位置Ｐ２”として設定し、（１）式を満たさない場合は、図２０に実線で示すように、従来通り部品撮像開始位置Ｐ１”をＰ１、部品撮像終了位置Ｐ２”をＰ２として設定する。なお、この（１）式は、図３（Ａ）のメモリ１０１内に記憶されて、制御部１００での上記演算に使用される。
【００２６】
【数１】
√｛（Ｘ_VAC−Ｘ_P1）²＋（Ｙ_VAC−Ｙ_P1）²｝＞√｛（Ｘ_VAC−Ｘ_P2）²＋（Ｙ_VAC−Ｙ_P2）²｝・・・・（１）
【００２７】
そして、吸着した電子部品の吸着姿勢の検出を部品撮像装置９にて行うために、電子部品実装装置６を部品撮像開始位置Ｐ１”へ移動し（ステップ＃４）、部品撮像動作終了位置Ｐ２”を目標位置として部品撮像装置９上の位置Ｐ３を等速度で電子部品を移動させることで部品撮像を完了する（ステップ＃５）。この撮像結果をもとに当該電子部品の実装位置又は角度又はその両方を補正し（ステップ＃６）、得られた回路基板１上の実装位置に当該電子部品が位置するように電子部品実装装置６を位置決めし、吸装着ノズル８を下降させることで電子部品の実装を行う（ステップ＃７）。
この時点で、当該回路基板１の生産が完了したか否かを調べ（ステップ＃８）、生産完了であれば回路基板１を回路基板支持装置４から搬出し（ステップ＃９）、生産完了でなければ次電子部品の吸装着処理（ステップ＃３〜＃７、＃１２）を行う。
【００２８】
上記第２実施形態によれば、Ｐ１が部品撮像開始位置でＰ２が部品撮像終了位置とする撮像距離データと、Ｐ２が部品撮像開始位置でＰ１が部品撮像終了位置とする撮像距離データを利用して、撮像前最後の部品吸着位置によって部品撮像開始位置を選択し、撮像方向を切り換えることができる。すなわち、部品供給装置７での電子部品の最終吸着位置に応じて部品撮像開始位置を求め、部品撮像方向を、都度、切り換えることで、部品供給装置７での電子部品の最終吸着位置に応じた、電子部品実装装置６の部品撮像動作を最短に設定でき、したがって、同様に、高速な回路基板１の生産を実現することができる。
【００２９】
（第３実施形態）
図３（Ｂ）に本発明の第３実施形態の電子部品実装機の全体の斜視図を示す。図３（Ａ）の第１実施形態の電子部品実装機に部品撮像装置１３を追加設置したものである。制御部１１０及びメモリ１１１は基本的には図３（Ａ）の制御部１００とメモリ１０１と同様な機能を有しているとともに、第３実施形態特有の動作を行うための機能をも有している。特有の機能とは、具体的には、例えば、制御部１１０により、部品撮像前の最終部品吸着を電子部品実装装置６の後方にある部品供給装置７ａおよび７ｂで行った場合には、部品撮像装置としては部品撮像装置９を使用し、電子部品実装装置６の前方にある部品供給装置７ｃおよび７ｄで上記最終の部品吸着を行った場合には部品撮像装置として部品撮像装置１３を使用するものである。このようにすれば、部品供給装置７での電子部品の吸着から部品撮像開始位置までの電子部品実装装置６の移動が無駄なく行うことが可能である。このように、部品撮像装置９と１３のいずれを使用するかの判断は、具体的には以下のようにして行う。吸着すべき電子部品９０、その電子部品９０を供給する部品供給装置７の位置、その位置に対応する部品撮像装置９，１３の位置が関連付けられた図２１のテーブルまたはそのような関連情報をメモリ１１１に記憶しておき、制御部１１０で次に実装すべき電子部品を選択すれば、メモリ１１１中の当該電子部品に関連する部品撮像装置の情報を制御部１１０が読みだし、制御部１１０はその情報に基づいて、電子部品実装装置６の動作を制御する。
【００３０】
本第３実施形態では、電子部品実装装置６の前方に部品撮像装置１３をーつ追設置しているが、部品供給装置７の構成に応じて、所望の位置に、また、所望の数の部品撮像装置を追加設置することも可能である。
第３実施形態によれば、部品供給装置７の構成に応じて部品撮像装置９，１３を複数台設置して、部品供給装置７からの電子部品吸着後、部品撮像装置９，１３への移動がより短くなるように、部品供給装置７の構成に応じて部品撮像装置９，１３を選択することができるので、使用する部品撮像装置９，１３を適宜切り換えて最適の部品撮像装置を使用することにより、電子部品実装装置６の移動距離を短くすることができ、生産タクトを向上させることができる。
【００３１】
（第４実施形態）
図４に本発明の第４実施形態の電子部品実装方法の制御シーケンスを示す。図３の電子部品実装機の全体の斜視図および図４を参照しながら本発明の第４実施形態の電子部品実装方法について説明する。
まず、従来と同様に、生産開始前に生産する回路基板１の実装パターンから、実装データを作成し（ステップ＃１）、次いで、生産時には生産する回路基板１の搬入（ステップ＃２）、実装データに応じた所望の電子部品を吸着（ステップ＃３）を行う。
ここで、電子部品実装装置６の動作がより最短となる部品撮像装置を求める（ステップ＃１３）。例えば、部品撮像前の最終吸着を、電子部品実装装置６の後方にある部品供給装置７ａおよび７ｂで行った場合は部品撮像装置９を使用し、電子部品実装装置６の前方にある部品供給装置７ｃおよび７ｄで行った場合は部品撮像装置１３を使用する。選択された部品撮像装置の部品撮像開始位置および部品撮像終了位置を、それぞれＰ１'''およびＰ２'''とする。
【００３２】
そして、吸着した電子部品の吸着姿勢の検出を部品撮像装置９又は１３にて行うために、電子部品実装装置６を部品撮像開始位置Ｐ１'''へ移動し（ステップ＃４）、部品撮像動作終了位置Ｐ２'''を目標位置として部品撮像装置上Ｐ３を等速度で電子部品を移動させることで部品撮像を完了する（ステップ＃５）。この撮像結果をもとに当該電子部品の実装位置又は角度又はその両方を補正し（ステップ＃６）、得られた回路基板１上の実装位置に当該電子部品が位置するように電子部品実装装置６を位置決めし、吸装着ノズル８を下降させることで電子部品の実装を行う（ステップ＃７）。
この時点で、当該回路基板１の生産が完了したか否かを調べ（ステップ＃８）、生産完了であれば回路基板１を回路基板支持装置４から搬出し（ステップ＃９）、生産完了でなければ次電子部品の吸装着処理（ステップ＃３〜＃７、＃１３）を行う。
【００３３】
上記第１実施形態では、部品撮像が必要な最終撮像ヘッド部に応じて部品撮像終了位置を求めることで、部品撮像が不要なヘッド部の部品撮像動作をなくすようにしているが、部品撮像が必要な最初の撮像ヘッド部に応じて部品撮像開始位置を求めても同様の効果が得られ、さらに、両手法を複合すればより効果が得られる。
さらに、上記実施形態の説明では、部品撮像終了位置の切換え、部品撮像方向の切換え、使用する部品撮像装置の切換えを個々に行った場合について記載しているが、それらの組合せによって、よりー層の効果を得ることができる。
【００３４】
【発明の効果】
以上のように、本発明によると、部品撮像終了位置を部品撮像が必要な最終撮像ヘッド部に応じて求めることで、部品撮像が不要なヘッド部の部品撮像動作をなくすことができ、効率的な電子部品実装装置の部品撮像動作となり、回路基板の生産を高速に行うことができる効果が得られる。
また、部品供給装置での電子部品の最終吸着位置に応じて部品撮像開始位置を求め、部品撮像方向を、都度、切り換えることで、部品供給装置での電子部品の最終吸着位置に応じた、電子部品実装装置の動作を最短に設定でき、したがって、同様に、高速な回路基板の生産を実現できる効果が得られる。
【００３５】
さらに、部品供給装置の構成に応じて部品撮像装置を複数台設置し、部品供給装置での電子部品の最終吸着位置に応じて使用する部品撮像装置を、都度、切り換えることで、部品供給装置での電子部品の最終吸着位置に応じた、電子部品実装装置の動作を最短に設定でき、したがって、より高速かつ効率的に回路基板を生産できる効果が得られる。
また、上記構成においては、部品撮像が必要な最終撮像ヘッド部に応じて部品撮像終了位置を求めることで、部品撮像が不要なヘッド部の部品撮像動作をなくすようにしているが、部品撮像が必要な第一撮像ヘッド部に応じて部品撮像開始位置を求めても同様の効果が得られ、さらに、両手法を複合すればより効果を得ることができる。
さらに、上記構成において、部品撮像終了位置の切換え、部品撮像方向の切換え、使用する部品撮像装置の切換えを個々に行った場合について記述しているが、それらの組合せによって、よりー層の効果を得ることができる。
【図面の簡単な説明】
【図１】本発明の第１実施形態の電子部品実装方法の制御シーケンスを示すフローチャートである。
【図２】本発明の第２実施形態の電子部品実装方法の制御シーケンスを示すフローチャートである。
【図３】（Ａ），（Ｂ）はそれぞれ本発明の第１，２実施形態の電子部品実装機の概略斜視図、第３実施形態の電子部品実装機の概略斜視図である。
【図４】本発明の第４実施形態の電子部品実装方法の制御シーケンスを示すフローチャートである。
【図５】従来の電子部品実装機の全体の斜視図である。
【図６】従来の電子部品実装機の全体の平面図である。
【図７】ターゲットマークと実装パターンを説明するための回路基板のー例の図である。
【図８】実装データの一例の図である。
【図９】ヘッド部数は１、部品撮像装置はカメラの場合の第１タイミングチャートである。
【図１０】ヘッド部数は３、部品撮像装置はカメラの場合の第２タイミングチャートである。
【図１１】ヘッド部数は３、部品撮像装置はラインセンサの場合の第３タイミングチャートである。
【図１２】撮像距離データの一例の図である。
【図１３】ラインセンサによる部品撮像のしくみを説明するための図である。
【図１４】従来の電子部品実装方法の制御シーケンスを示すフローチャートである。
【図１５】上記実施形態での電子部品実装装置の画像認識制御関係の構成を示す概略図である。
【図１６】上記実施形態での電子部品実装装置において実装データを作成する構成を示す概略図である。
【図１７】（Ａ），（Ｂ）はそれぞれ上記実施形態での電子部品実装装置においてヘッド部で電子部品を吸着しているときの電子部品実装装置の撮像動作を説明するための説明図である。
【図１８】上記実施形態での電子部品実装装置において制御部の構成を示す概略ブロック図である。
【図１９】上記実施形態での電子部品実装装置において最終撮像ヘッド部Ｈ_ENDについての撮像距離Ｌと撮像区間Ｓを説明するための説明図である。
【図２０】上記第２実施形態での電子部品実装装置において電子部品実装装置の部品撮像動作がより最短となる部品撮像開始位置などを求める場合を説明するための説明図である。
【図２１】上記第３実施形態での電子部品実装装置において電子部品と部品供給装置と部品撮像装置との関係のテーブルを示す図である。
【符号の説明】
１回路基板
２実装パターン
３ターゲットマーク
４回路基板支持装置
５基板搬送部
６電子部品実装装置
６ａヘッド部保持部
６ｈヘッド部
７部品供給装置
８吸装着ノズル
９部品撮像装置（装置後方）
１０原点センサ
１１リニアスケール
１２リニアスケール上の原点
１３部品撮像装置（装置前方）
９０電子部品
１００制御部
１００ａ回路基板搬送制御部
１００ｂ実装ブロック指示部
１００ｃ電子部品吸着動作制御部
１００ｄ電子部品撮像動作制御部
１００ｅ最終撮像ヘッド部演算部
１００ｆ撮像開始位置／終了位置演算部
１００ｇ電子部品装着動作制御部
１００ｈ補正演算部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method and an electronic component mounting machine for automatically mounting an imaged electronic component on a circuit board after detecting the suction posture of the electronic component by imaging.
[0002]
[Prior art]
As a general configuration of a conventional electronic component mounting machine, an overall perspective view and a plan view are shown in FIGS. 5 and 6, respectively. With reference to the conventional control sequence of FIG. 14 and FIGS. 5 and 6, a conventional electronic component mounting method by an electronic component mounting machine for mounting electronic components on a circuit board will be described.
As shown in FIG. 7, the circuit board 1 is composed of a plurality of mounting patterns 2 (2a, 2b, 2c,...) And target marks 3 (3a, 3b, 3c,...). Production is performed by mounting a desired electronic component on the mounting pattern 2. Here, the target mark 3 is mounted slightly differently for each circuit board depending on the contraction of the circuit board that occurs when the mounting pattern 2 is fired on the circuit board 1 and the support state of the circuit board 1 by the circuit board support device 4. Used to correct the position.
[0003]
In the production of a circuit board by the electronic component mounting machine, first, mounting data is created from the mounting pattern of the circuit board to be produced (step # 1). FIG. 8 is an example of mounting data.
A predetermined number of circuit boards are produced according to the mounting data. The procedure is as follows. First, the circuit board 1 is carried into the circuit board support device 4 from the board conveyance section 5 (step # 2).
Thereafter, the electronic component mounting device 6 is moved onto the electronic component of the component supply device 7 (7a, 7b, 7c, 7d), the suction mounting nozzle 8 is positioned at the component supply position, and a desired electronic component corresponding to the mounting data is obtained. Is adsorbed (step # 3). This operation is repeated when the electronic component is also picked up by another head (step # 3a).
Next, the electronic component mounting device 6 is moved to the component imaging operation start position P1 in order to detect the suction orientation of the sucked electronic component by the component imaging device 9 (step # 4). The component imaging device 9 is composed of a line sensor, and the component imaging is completed by moving the electronic component at a constant speed on the component imaging device P3 from the component imaging operation start position P1 with the component imaging operation end position P2 as a target position. (Step # 5). The component imaging start position P1 and the component imaging end position P2 are set as unique data in advance so that all electronic components sucked by the suction mounting nozzle can be imaged.
[0004]
Based on the imaging result obtained here, the final mounting position / angle of the electronic component is determined (step # 6). Here, a line sensor is used as a component imaging device instead of a camera.
When the number of suction mounting nozzles that can be loaded into the electronic component mounting apparatus 6 is one and the component imaging apparatus is a camera, the timing is as shown in FIG. However, when the electronic components to be continuously mounted are at the same position or adjacent positions on the component supply device 7, suction → imaging → mounting → suction → imaging → mounting rather than suction → suction → imaging → imaging → mounting → mounting However, the electronic component mounting apparatus 6 operates efficiently and leads to higher speed. From such a background, the electronic component mounting apparatus 6 can be loaded with a plurality of suction mounting nozzles, and the timing in this case is as shown in FIG.
However, in this case, the electronic component mounting apparatus 6 must be moved / stopped so that the electronic component is positioned on the component imaging position P3 every time the electronic component is imaged. Not right. On the other hand, if the component imaging device is not a camera but a line sensor, the timing is as shown in FIG. 11, and the electronic component mounting device 6 has a plurality of suction mounting nozzles even when there are a plurality of suction mounting nozzles. The acceleration / deceleration operation of the component mounting apparatus 6 can be performed once, leading to higher speed. From such a background, a line sensor is used instead of a camera in the component imaging device.
[0005]
Further, the imaging of the electronic component by the line sensor is performed using the imaging distance data shown in FIG. The mechanism will be described with reference to FIG. 13. When the electronic component mounting apparatus 6 is operated from the component imaging start position P1 to the component imaging end position P2, the origin sensor 10 attached in the vicinity of the head unit causes the axis to be moved. The first origin 12 (12a, 12b,...) Is detected from the linear scale 11 attached on the top. After that, the component imaging is performed by repeating the line input for a predetermined pulse after counting the predetermined number of pulses defined in the imaging distance data. In FIG. 13, the component imaging start position P1 is set on the left side of the page, and the component imaging end position P2 is set on the right side of the page. Conversely, the component imaging start position P1 is set on the right side of the page, and the component imaging is set on the left side of the page. If the imaging distance data when the end position P2 is set is set separately, the component imaging device that captures an image of the electronic component sucked by the suction mounting nozzle and the image of the electronic component captured by the component imaging device are analyzed. The processing of the recognition control device can be performed in the same way.
[0006]
Finally, the electronic component mounting apparatus 6 is positioned so that the electronic component is positioned at the mounting position on the obtained circuit board, and the suction mounting nozzle 8 is lowered to mount the electronic component (step # 7). . When the electronic component is adsorbed in the other head part, the mounting is performed in the same manner (step # 7a).
One circuit board is produced by repeating such a series of sucking and mounting operations according to mounting data prepared in advance. At this time, it is checked whether or not the production of the circuit board is completed ( Step # 8). If the production is completed, the circuit board is unloaded from the circuit board support device 4 to the board conveyance unit 5 (step # 9). If the production is not completed, the next electronic component suction and mounting process (steps # 3 to # 7) is performed. Will do.
[0007]
[Problems to be solved by the invention]
However, in the case where three suction mounting nozzles (H1, H2, H3) are provided in the electronic component mounting apparatus 6 shown in FIG. 13 as an example, a series of operations of suction → imaging → mounting is performed. When the suction mounting nozzles of H1 and H2 are not used and one electronic component is suctioned → imaging → mounted using only H3, the component imaging end position P2 is all the suction mounting nozzles (H1, H2, H3 ) Is set so that all the electronic components picked up by (1) can be imaged. Therefore, after imaging the electronic component picked up by the suction mounting nozzle H3, the electronic components picked up by the suction mounting nozzles H1 and H2 The electronic component mounting apparatus is moved during an unnecessary period in which imaging is also expected, and a wasteful operation occurs, which hinders speeding up.
Further, as is clear from FIG. 6, the movement to the component imaging start position P1 after the electronic component suction in the component supply device 7a is efficient, whereas the electronic component suction in the component supply device 7b is Since the component imaging start position P1 and the component imaging end position P2 are set as the only data, and P2 cannot be set as the component imaging start position, it is inefficient to move to the component imaging start position P1.
[0008]
Similarly, as is apparent from FIG. 6, when electronic components are picked up by the component supply devices 7c and 7d, the electronic component mounting target is used to detect and capture the picking posture of the components by the component imaging device 9. As a result, the circuit board 1 is separated once, and a wasteful operation occurs.
Accordingly, in view of the above-described conventional problems, the object of the present invention is to dynamically change the component imaging end position according to the final imaging head unit that requires component imaging in order to eliminate movement including the head unit that does not require imaging. Another object of the present invention is to provide an electronic component mounting method and an electronic component mounting machine that perform an efficient operation of ending a component imaging operation when imaging of a head portion that requires component imaging is completed.
[0009]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention is configured as follows.
According to the first aspect of the present invention, a component supply device having a component supply unit that supplies a plurality of electronic components, a circuit board support device that fixes a circuit board on which the electronic components are mounted in a fixed position, and a desired suction. A plurality of head portions having a mechanism capable of loading mounting nozzles and capable of moving the mounted suction mounting nozzles up and down or rotating are provided, and a desired electronic component is adsorbed from the component supply device on the circuit board. An electronic component mounting device that can be mounted at a predetermined position, a component imaging device that is a line sensor that captures an image of the electronic component sucked by the suction mounting nozzle, and the electron captured by the component imaging device In an electronic component mounting machine equipped with a recognition control device that analyzes an image of a component and inspects the suction state of the electronic component,
A first step of moving the electronic component mounting device from the component supply device to a component imaging start position after suction of the desired electronic component;
A second step for obtaining a final imaging head part that requires electronic component imaging;
A third step for obtaining a component imaging end position from the final imaging head portion obtained by the second step;
An electronic component mounting method comprising: a component imaging operation including a fourth step of moving the electronic component mounting apparatus to the component imaging end position obtained in the third step.
[0010]
According to the second aspect of the present invention, from the positional relationship between the electronic component suction position from the component supply device and the component imaging device, a component imaging start position that minimizes the operation of the electronic component mounting device is obtained, An electronic component mounting method according to a first aspect for switching a component imaging direction is provided.
[0011]
According to the third aspect of the present invention, from the positional relationship between the electronic component suction position from the component supply device and the component imaging device, a component imaging device that minimizes the operation of the electronic component mounting device is obtained. The electronic component mounting method according to the first or second aspect is provided in which a component imaging device to be used is switched among a plurality of component imaging devices installed for each of the component supply devices before and after the electronic component mounting device.
[0012]
According to the fourth aspect of the present invention, a component supply apparatus having a component supply unit that supplies a plurality of electronic components;
A circuit board support device for fixing the circuit board on which the electronic component is mounted in a fixed position;
A plurality of head units having a mechanism capable of loading a desired suction mounting nozzle and capable of moving the mounted suction mounting nozzle up and down or rotating, and adsorbing a desired electronic component from the component supply device An electronic component mounting apparatus capable of being mounted at a predetermined position on a circuit board;
A component imaging device that is a line sensor that captures an image of the electronic component sucked by the suction mounting nozzle;
A recognition control device that analyzes the image of the electronic component captured by the component imaging device and inspects the suction state of the electronic component;
After the electronic component is picked up from the component supply device, the electronic component mounting apparatus is moved to the component imaging start position to obtain a final imaging head unit that requires electronic component imaging, and the final imaging head unit obtained by the second step A component imaging end position from the controller, and a control unit that performs a component imaging operation for moving the electronic component mounting apparatus to the component imaging end position determined in the third step;
An electronic component mounting machine characterized by comprising:
[0013]
According to the fifth aspect of the present invention, the control unit picks up a component image that minimizes the operation of the electronic component mounting device based on the positional relationship between the electronic component suction position from the component supply device and the component image pickup device. An electronic component mounting machine according to a fourth aspect, in which a start position is obtained and the component imaging direction is switched is provided.
[0014]
According to a sixth aspect of the present invention, there is provided the electronic component mounting machine according to the fourth or fifth aspect, wherein a plurality of component imaging devices are installed for each of the component supply devices before and after the electronic component mounting device.
[0015]
According to the seventh aspect of the present invention, the control unit is a component that minimizes the operation of the electronic component mounting device from the positional relationship between the electronic component suction position from the component supply device and the component imaging device. According to a sixth aspect of the present invention, there is provided an electronic component mounting machine according to a sixth aspect, wherein an imaging device is obtained and a component imaging device to be used is switched.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
As described above, the electronic component mounting method and the electronic component mounting machine according to various embodiments described below of the present invention solve the following problems as described above.
In the electronic component mounting method described in the conventional technology, in the component imaging operation of the electronic component adsorbed by the suction mounting nozzle provided in the electronic component mounting apparatus, the electronic component is unnecessary while the head portion unnecessary for component imaging is expected. There is a case where a useless operation of moving the component mounting apparatus may occur, which hinders speeding up.
Furthermore, since the component imaging start position P1 and the component imaging end position P2 are set as the only data, even if it is possible to control, P2 cannot be set as the component imaging start position. Depending on the final component suction position before imaging in the component supply device, it must move to P1, which is farther than P2, and inefficient operation occurs.
In addition, since only one component imaging device is installed at the rear of the device, when the electronic component is picked up by the component supply device in front of the device, the circuit board on which the electronic component is to be mounted is used for component imaging. This will cause a wasteful operation.
[0017]
The electronic component mounting method and the mounting machine according to the above-described various embodiments of the present invention dynamically switch the component imaging end position, the component imaging direction, and the component imaging device at the time of production, so that a wasteful operation of the electronic component mounting device is performed. It is possible to obtain an effect of performing efficient operation.
That is, an electronic component mounting method and a mounting machine according to the various embodiments will be described with reference to the drawings.
[0018]
(First embodiment)
FIG. 1 shows a control sequence of the electronic component mounting method according to the first embodiment of the present invention. 3A and FIG. 6, a perspective view of the whole electronic component mounting machine, a plan view (basic parts other than the characteristic features of the present embodiment such as the control unit are basically the same as the conventional one), and FIG. 1, an electronic component mounting method according to a first embodiment of the present invention and an electronic component mounter that implements the method will be described.
As shown in FIG. 3A, the mounting machine mounts the electronic component and a component supply device 7 having component supply units 7a, 7b, 7c, 7d,... For supplying a plurality of electronic components. A circuit board support device 4 for fixing the circuit board 1 at a fixed position, and a mechanism capable of loading one desired suction mounting nozzle 8 and capable of moving the mounted suction mounting nozzle 8 up and down and rotating. A head unit 6h (see FIG. 13) is attached to the plurality of head unit holding units 6a, and the head unit 6h is positioned at an arbitrary position in the XY direction by the XY robot 40, and a desired electronic component is received from the component supply device 7. An electronic component mounting apparatus 6 that can be sucked and mounted at a predetermined position on the circuit board 1 and a component imaging that is a line sensor that captures an image of the electronic component sucked by the suction mounting nozzle 8 Device 9, an image of the electronic component captured by the component imaging device 9, a recognition control device that inspects the suction state of the electronic component, and a component imaging after the desired electronic component suction from the component supply device 7 The electronic component mounting apparatus 6 is moved to the start position (step # 4), the final imaging head unit that needs to capture the electronic component is obtained (step # 10), and the component imaging end position is obtained from the obtained final imaging head unit. (Step # 11), the electronic component mounting apparatus is moved to the obtained component imaging end position (Step # 5), which is necessary for various controls and various calculations by the control unit 100 for performing the component imaging operation, and the control unit 100 And a memory 101 for storing information. As an example, the recognition control apparatus includes an image analysis unit 202 shown in FIG. In FIG. 15, a pulse from the encoder 200 of the drive motor of the XY robot 40 that moves the head holding unit 6 a is input to the image input unit 201 by inputting a signal from the origin sensor 10. The image is captured from the imaging device 9 until the number of pulses input to the image input unit 201 reaches a predetermined number. The image captured by the image input unit 201 is analyzed by the image analysis unit 202, and after analyzing the quality of the component posture, the analysis result is output to the control unit 100.
The mounting machine according to the above configuration operates as follows to implement the mounting method.
[0019]
First, as in the prior art, mounting data is created from the mounting pattern of the circuit board 1 produced before the start of production (step # 1). In this operation, as shown in FIG. 16, data necessary for the operator is input from the operation panel 210 to the command unit 211 to create the mounting data, and the data is stored in the data storage memory 212. The stored mounting data is sent to the control unit 100 as necessary.
Next, as in the prior art, the circuit board 1 to be produced is carried into the circuit board support device 4 by the board transport section 5 (step # 2).
Thereafter, according to the mounting data created in advance in step # 1, a desired electronic component is picked up by one of the plurality of head portions of the electronic component mounting apparatus 6 in the component supply device 7 (step # 3). When the electronic component is picked up by another head part, the electronic component is picked up in the same manner as described above (step # 3a), and then the picked-up position of the picked-up electronic component is detected by the component imaging device 9. Therefore, the electronic component mounting apparatus 6 is moved to the component imaging start position P1 (see FIG. 13) (step # 4).
[0020]
Next, the final imaging head portion H among the head portions that require component imaging in the head portion of the electronic component mounting apparatus 6. _END Is obtained (step # 10). Here, the final imaging head part H _END Is a component that is supposed to finally perform component imaging when the electronic component mounting apparatus 6 moves from the component imaging start position P1 to the component imaging end position when each of the plurality of head portions 6h sucks the electronic component. The head portion 6h adsorbing 90. Specifically, as shown in FIG. 17A, the imaging direction, that is, the moving direction of the head portion holding portion 6a of the electronic component mounting apparatus 6 is the direction from left to right in FIG. When the rightmost head portion 6h and the middle head portion 6h are respectively sucking the electronic component 90, the head portion 6h in which the electronic component 90 is imaged by the imaging device 9 last in the moving direction, that is, the middle portion The head 6h is the final imaging head H _END It becomes. Also, as shown in FIG. 17B, when the imaging direction, that is, the moving direction of the head unit holding unit 6a is reversed, the rightmost head unit 6h is used as the final imaging head unit H. _END It becomes. Further, as shown in FIG. 17B, when the imaging direction is from right to left and the electronic component 90 is picked up only by the leftmost head portion 6h, the head portion 6h is the final imaging head portion H. _END It becomes. Therefore, when a plurality of head portions 6h are held by the head portion holding portion 6a, if there is one head portion 6h that sucks the electronic component 90, the head portion 6h immediately becomes the final imaging head portion H. _END Thus, when the plurality of head parts 6h adsorb the electronic component 90, the head part 6h arranged on the most reverse side with respect to the imaging direction is the final imaging head part H. _END It becomes. In this way, the final imaging head portion H _END This operation is performed by the final imaging head unit arithmetic unit 100e of the control unit 100 as shown in FIG. The control unit 100 is roughly configured to include a circuit board transport control unit 100a and a mounting block instruction unit 100b, and operation information in each control unit and information obtained by a calculation unit, which will be described later, are obtained as necessary. The information stored in the memory 101 is updated as appropriate based on the information. The circuit board conveyance control unit 100 a controls conveyance of the circuit board 1 by the conveyance unit 5. The mounting block instruction unit 100b includes an electronic component suction operation control unit 100c, an electronic component imaging operation control unit 100d, and an electronic component mounting operation control unit 100g, and instructs a mounting operation. The electronic component suction operation control unit 100c controls the suction operation suction release operation of the electronic component 90 by the suction mounting nozzle 8 of each head unit 6h based on the mounting instruction from the mounting block instruction unit 100b. The electronic component imaging operation control unit 100d includes a final imaging head unit arithmetic unit 100e and an imaging start position / end position arithmetic unit 100f, and an electronic component 90 by the component imaging device 9 based on a mounting instruction from the mounting block instruction unit 100b. The imaging operation is controlled. As described above, the final imaging head unit arithmetic unit 100e includes information on the moving direction of the head unit holding unit 6a of the electronic component mounting apparatus 6 in the electronic component mounting operation control unit 100g and the electronic component suction operation control unit 100c. Based on the suction operation information of the electronic component 90 at the final imaging head portion H as described above. _END Ask for. The imaging start position / end position calculation unit 100f obtains the imaging start position and end position of the head unit holding unit 6a with respect to the imaging apparatus 9 by calculation as described later. The electronic component mounting operation control unit 100g includes a correction calculation unit 100h and controls movement of the electronic component mounting apparatus 6 in the XY direction by the XY robot 40, vertical movement of the suction mounting nozzle 8 in each head unit 6a, and the like. The correction calculation unit 100h corrects the posture of the electronic component 90 sucked by the suction mounting nozzle 8 based on the analysis result of the captured image.
[0021]
Next, the final imaging head part H _END The component imaging end position P2 ′ at which the component imaging of the electronic component picked up by the electronic component can be performed and the moving operation of the electronic component mounting apparatus 6 becomes the shortest is obtained (step # 11). For example, as shown in FIG. 13, the origin sensor 10 attached to the head holding unit 6a detects the first origin 12 (12a, 12b,...) From the linear scale 11 affixed on the shaft, and finally Imaging head H _END The imaging distance L and the imaging section S for each of the images are obtained with reference to the table of FIG. _END And imaging section S _END And the movement distance (L _END + S _END 19), as shown in FIG. 19, the imaging start position / end position calculation unit 100f obtains the component imaging end position P2 ′ (P2 in FIG. 13 or its vicinity). In FIG. 19, L is the distance from when the first origin point is detected by the origin sensor 10 until imaging is started, and S is the movement of the head holding unit 6 a of the electronic component mounting apparatus 6 during imaging. It means the section to do.
[0022]
Next, the component imaging is completed by controlling the component imaging operation end position P2 ′ as a target position by the control unit 100 so that the electronic component 90 is moved together with the head unit holding unit 6a on the component imaging apparatus P3 at a constant speed. (Step # 5). Based on the imaging result, the correction calculation unit 100h calculates the correction amount of the mounting position and / or angle of the electronic component 90, and the control unit 100 corrects the correction according to the correction amount (step # 6).
Finally, the electronic component mounting apparatus 6 is positioned so that the electronic component is positioned at the mounting position on the obtained circuit board 1, and the suction mounting nozzle 8 is lowered to mount the electronic component on the circuit board 1. (Step # 7). If the electronic component is picked up by the other head portion 6h, the mounting is performed in the same manner (step # 7a).
At this time, it is checked whether or not the production of the circuit board 1 is completed (step # 8). If the production is completed, the circuit board 1 that has been mounted is unloaded from the circuit board support device 4 (step # 9). ) When the next circuit board 1 is carried into the mounting position, the process returns to step # 2 (step # 9a). If the production is not completed in step # 8, the next electronic component sucking and mounting process (steps # 3, # 4, # 10, # 11, # 5 to # 7) is subsequently performed on the circuit board 1.
[0023]
According to the first embodiment, by obtaining the component imaging end position in accordance with the final imaging head unit 6h that requires component imaging, the component imaging operation of the head unit that does not require component imaging can be eliminated, which is efficient. The component imaging operation of the electronic component mounting apparatus 6 can be performed, and the circuit board 1 can be produced at high speed.
[0024]
(Second Embodiment)
FIG. 2 shows a control sequence of the electronic component mounting method according to the second embodiment of the present invention. 3A, FIG. 6 is a perspective view of the entire electronic component mounting machine, a plan view (the parts other than the characteristic features of this embodiment such as a control unit are basically the same as those in the prior art), and FIG. The electronic component mounting method according to the second embodiment of the present invention will be described with reference to FIG. The unique function in the second embodiment is performed by the control unit 100 in FIG.
First, as before, mounting data is created from the mounting pattern of the circuit board 1 to be produced before the start of production (step # 1), and then the circuit board 1 to be produced at the time of production is carried in (step # 2) and mounted. A desired electronic component corresponding to the data is sucked (step # 3).
[0025]
Here, the component imaging start position P1 ″ at which the component imaging operation of the electronic component mounting apparatus 6 becomes the shortest is obtained by the electronic component imaging start position / end position calculation unit 100f (step # 12). The XY coordinates of the final component suction position before imaging of (X _VAC , Y _VAC ), The coordinates of the conventional component imaging start position P1 and the component imaging end position P2 are respectively (X _P1 , Y _P1 ), (X _P2 , Y _P2 ), When the following expression (1) is satisfied, as shown by the dotted line in FIG. 20, the component imaging end position P2 is the component imaging start position P1 ″, and the component imaging start position P1 is the component imaging end position P2 ″. If the equation (1) is not satisfied, the component imaging start position P1 ″ is set as P1 and the component imaging end position P2 ″ is set as P2, as shown by a solid line in FIG. The equation (1) is stored in the memory 101 of FIG. 3A and used for the above calculation in the control unit 100.
[0026]
[Expression 1]
√ {(X _VAC -X _P1 ) ² + (Y _VAC -Y _P1 ) ² }> √ {(X _VAC -X _P2 ) ² + (Y _VAC -Y _P2 ) ² } (1)
[0027]
Then, in order to detect the suction posture of the sucked electronic component by the component imaging device 9, the electronic component mounting device 6 is moved to the component imaging start position P1 "(step # 4), and the component imaging operation end position P2" The component imaging is completed by moving the electronic component at a constant speed at the position P3 on the component imaging device 9 with the target position as a target position (step # 5). Based on this imaging result, the mounting position and / or angle of the electronic component is corrected (step # 6), and the electronic component mounting apparatus is positioned so that the electronic component is positioned at the mounting position on the circuit board 1 obtained. The electronic component is mounted by positioning 6 and lowering the suction mounting nozzle 8 (step # 7).
At this time, it is checked whether or not the production of the circuit board 1 is completed (step # 8). If the production is completed, the circuit board 1 is unloaded from the circuit board support device 4 (step # 9). If not, the next electronic component sucking and mounting process (steps # 3 to # 7 and # 12) is performed.
[0028]
According to the second embodiment, the imaging distance data in which P1 is the component imaging start position and P2 is the component imaging end position, and the imaging distance data in which P2 is the component imaging start position and P1 is the component imaging end position are used. Thus, the component imaging start position can be selected according to the last component suction position before imaging, and the imaging direction can be switched. That is, the component imaging start position is obtained according to the final suction position of the electronic component in the component supply device 7, and the component imaging direction is switched each time, so that the electronic component is determined according to the final suction position of the electronic component in the component supply device 7. Thus, the component imaging operation of the electronic component mounting apparatus 6 can be set to the shortest, and therefore, the production of the high-speed circuit board 1 can be similarly realized.
[0029]
(Third embodiment)
FIG. 3B is a perspective view of the entire electronic component mounting machine according to the third embodiment of the present invention. A component imaging device 13 is additionally installed in the electronic component mounter of the first embodiment shown in FIG. The control unit 110 and the memory 111 basically have the same functions as the control unit 100 and the memory 101 in FIG. 3A, and also have a function for performing operations peculiar to the third embodiment. ing. Specifically, the specific function is, for example, when the controller 110 performs final component suction before component imaging with the component supply devices 7a and 7b behind the electronic component mounting device 6, and component imaging. The component imaging device 9 is used as the device, and the component imaging device 13 is used as the component imaging device when the final component suction is performed by the component supply devices 7c and 7d in front of the electronic component mounting device 6. It is. In this way, it is possible to move the electronic component mounting apparatus 6 from the adsorption of the electronic component by the component supply device 7 to the component imaging start position without waste. Thus, the determination as to which of the component imaging devices 9 and 13 is used is specifically performed as follows. The table of FIG. 21 in which the electronic component 90 to be picked up, the position of the component supply device 7 that supplies the electronic component 90, the positions of the component imaging devices 9 and 13 corresponding to the position, or such related information is stored in the memory. When the electronic component to be mounted next is selected by the control unit 110, the control unit 110 reads out information of the component imaging device related to the electronic component in the memory 111. Based on the information, the operation of the electronic component mounting apparatus 6 is controlled.
[0030]
In the third embodiment, one component imaging device 13 is additionally installed in front of the electronic component mounting device 6. However, depending on the configuration of the component supply device 7, a desired number and a desired number of components are mounted. It is also possible to additionally install a component imaging device.
According to the third embodiment, a plurality of component imaging devices 9 and 13 are installed according to the configuration of the component supply device 7, moved to the component imaging devices 9 and 13 after suction of the electronic components from the component supply device 7. The component imaging devices 9 and 13 can be selected in accordance with the configuration of the component supply device 7 so that the component imaging device 9 and 13 to be used is appropriately switched to use the optimal component imaging device. Thereby, the movement distance of the electronic component mounting apparatus 6 can be shortened, and a production tact can be improved.
[0031]
(Fourth embodiment)
FIG. 4 shows a control sequence of the electronic component mounting method according to the fourth embodiment of the present invention. An electronic component mounting method according to a fourth embodiment of the present invention will be described with reference to the overall perspective view of the electronic component mounting machine in FIG. 3 and FIG.
First, as before, mounting data is created from the mounting pattern of the circuit board 1 to be produced before the start of production (step # 1), and then the circuit board 1 to be produced at the time of production is carried in (step # 2) and mounted. A desired electronic component corresponding to the data is sucked (step # 3).
Here, a component image pickup device in which the operation of the electronic component mounting apparatus 6 is the shortest is obtained (step # 13). For example, when the final suction before imaging the component is performed by the component supply devices 7a and 7b at the rear of the electronic component mounting device 6, the component imaging device 9 is used, and the component supply device at the front of the electronic component mounting device 6 is used. In the case of 7c and 7d, the component imaging device 13 is used. Let the component imaging start position and the component imaging end position of the selected component imaging apparatus be P1 ′ ″ and P2 ′ ″, respectively.
[0032]
The electronic component mounting apparatus 6 is moved to the component imaging start position P1 ′ ″ to detect the suction orientation of the sucked electronic component by the component imaging device 9 or 13 (step # 4), and the component imaging operation is performed. The component imaging is completed by moving the electronic component at a constant speed on the component imaging device P3 with the end position P2 ′ ″ as the target position (step # 5). Based on this imaging result, the mounting position and / or angle of the electronic component is corrected (step # 6), and the electronic component mounting apparatus is positioned so that the electronic component is positioned at the mounting position on the circuit board 1 obtained. The electronic component is mounted by positioning 6 and lowering the suction mounting nozzle 8 (step # 7).
At this time, it is checked whether or not the production of the circuit board 1 is completed (step # 8). If the production is completed, the circuit board 1 is unloaded from the circuit board support device 4 (step # 9). If not, the next electronic component sucking and mounting process (steps # 3 to # 7 and # 13) is performed.
[0033]
In the first embodiment, the component imaging end position is obtained according to the final imaging head unit that requires component imaging, thereby eliminating the component imaging operation of the head unit that does not require component imaging. The same effect can be obtained even if the component imaging start position is obtained in accordance with the required first imaging head unit, and more effective if both methods are combined.
Furthermore, in the description of the above embodiment, the case where the switching of the component imaging end position, the switching of the component imaging direction, and the switching of the component imaging device to be used is described individually is described. The effect of can be obtained.
[0034]
【The invention's effect】
As described above, according to the present invention, it is possible to eliminate the component imaging operation of the head portion that does not require component imaging by efficiently obtaining the component imaging end position according to the final imaging head unit that requires component imaging. This makes it possible to perform the component imaging operation of the electronic component mounting apparatus and to produce the circuit board at high speed.
Also, the component imaging start position is obtained according to the final suction position of the electronic component in the component supply device, and the electronic component corresponding to the final suction position of the electronic component in the component supply device is switched by changing the component imaging direction each time. The operation of the component mounting apparatus can be set to the shortest. Therefore, similarly, the effect of realizing high-speed circuit board production can be obtained.
[0035]
Furthermore, by installing a plurality of component imaging devices according to the configuration of the component supply device and switching the component imaging device to be used according to the final suction position of the electronic component in the component supply device, the component supply device The operation of the electronic component mounting apparatus according to the final suction position of the electronic component can be set to the shortest, and therefore, an effect that a circuit board can be produced more quickly and efficiently is obtained.
Further, in the above configuration, the component imaging end position is determined according to the final imaging head unit that needs component imaging, thereby eliminating the component imaging operation of the head unit that does not require component imaging. The same effect can be obtained even if the component imaging start position is obtained in accordance with the required first imaging head unit, and further, if both methods are combined, more effect can be obtained.
Furthermore, in the above configuration, the case where the switching of the component imaging end position, the switching of the component imaging direction, and the switching of the component imaging device to be used is individually described is described. Obtainable.
[Brief description of the drawings]
FIG. 1 is a flowchart showing a control sequence of an electronic component mounting method according to a first embodiment of the present invention.
FIG. 2 is a flowchart showing a control sequence of an electronic component mounting method according to a second embodiment of the present invention.
3A and 3B are a schematic perspective view of an electronic component mounting machine according to first and second embodiments of the present invention, and a schematic perspective view of an electronic component mounting machine according to a third embodiment, respectively.
FIG. 4 is a flowchart showing a control sequence of an electronic component mounting method according to a fourth embodiment of the present invention.
FIG. 5 is an overall perspective view of a conventional electronic component mounting machine.
FIG. 6 is an overall plan view of a conventional electronic component mounting machine.
FIG. 7 is a diagram of an example of a circuit board for explaining a target mark and a mounting pattern.
FIG. 8 is a diagram of an example of mounting data.
FIG. 9 is a first timing chart when the number of head units is 1 and the component imaging apparatus is a camera.
FIG. 10 is a second timing chart in the case where the number of head units is 3 and the component imaging apparatus is a camera.
FIG. 11 is a third timing chart in the case where the number of head units is 3 and the component imaging device is a line sensor.
FIG. 12 is a diagram illustrating an example of imaging distance data.
FIG. 13 is a diagram for explaining a mechanism of component imaging by a line sensor.
FIG. 14 is a flowchart showing a control sequence of a conventional electronic component mounting method.
FIG. 15 is a schematic diagram illustrating a configuration of an image recognition control relationship of the electronic component mounting apparatus in the embodiment.
FIG. 16 is a schematic diagram showing a configuration for creating mounting data in the electronic component mounting apparatus according to the embodiment.
FIGS. 17A and 17B are explanatory diagrams for explaining an imaging operation of the electronic component mounting apparatus when the electronic component is sucked by the head portion in the electronic component mounting apparatus in the embodiment. is there.
FIG. 18 is a schematic block diagram illustrating a configuration of a control unit in the electronic component mounting apparatus according to the embodiment.
19 is a final imaging head portion H in the electronic component mounting apparatus according to the embodiment. FIG. _END It is explanatory drawing for demonstrating the imaging distance L and imaging area S about.
FIG. 20 is an explanatory diagram for explaining a case where a component imaging start position where the component imaging operation of the electronic component mounting apparatus is the shortest is obtained in the electronic component mounting apparatus according to the second embodiment.
FIG. 21 is a diagram illustrating a table of relationships among electronic components, a component supply device, and a component imaging device in the electronic component mounting apparatus according to the third embodiment.
[Explanation of symbols]
1 Circuit board
2 Mounting pattern
3 Target mark
4 Circuit board support device
5 Board transfer section
6 Electronic component mounting equipment
6a Head holding part
6h head
7 Parts supply device
8 Suction mounting nozzle
9 Component imaging device (device rear)
10 Origin sensor
11 Linear scale
12 Origin on linear scale
13 Component imaging device (front of device)
90 electronic components
100 Control unit
100a Circuit board conveyance control unit
100b Mounting block instruction section
100c Electronic component suction operation control unit
100d Electronic component imaging operation control unit
100e Final imaging head unit arithmetic unit
100f Imaging start position / end position calculation unit
100g Electronic component mounting operation controller
100h correction calculation unit

Claims

A component supply device (7) having a component supply unit for supplying a plurality of electronic components (90), a circuit board support device (4) for fixing the circuit board (1) on which the electronic components are mounted in place, and a desired And a plurality of head portions (6h) having a mechanism capable of moving up and down or rotating the loaded suction mounting nozzle (8). component suction to the electronic component mounting apparatus capable of mounting to a predetermined position on the circuit board (6), the component imaging device is a line sensor for capturing an image of the electronic component adsorbed by the吸装deposition nozzle ( 9) and an electronic component mounting machine including a recognition control device that analyzes an image of the electronic component captured by the component imaging device and inspects an adsorption state of the electronic component,
A first step of moving the electronic component mounting device to a component imaging start position, which is a position where the component imaging device starts moving the component in order to image the component after the desired electronic component is picked up from the component supply device; Step # 4),
A second step of obtaining a final imaging head part that is a head part that needs electronic part imaging and finally picks up a part to be imaged (step # 10);
A third step of obtaining a component imaging end position from the final imaging head unit obtained in the second step (step # 11);
An electronic component comprising: a component imaging operation including a fourth step (step # 5) for moving the electronic component mounting apparatus from the component imaging start position to the component imaging end position obtained by the third step. Implementation method.

Based on the positional relationship between the electronic component suction position from the component supply device and the component imaging device, a component imaging start position that minimizes the operation of the electronic component mounting device is obtained (step # 12), and the component imaging direction is switched. The electronic component mounting method according to claim 1.

Based on the positional relationship between the electronic component suction position from the component supply device and the component imaging device, a component imaging device that minimizes the operation of the electronic component mounting device is obtained (step # 13), and the electronic component mounting device is obtained. The electronic component mounting method according to claim 1 or 2, wherein a component imaging device (9, 13) to be used is switched from among a plurality of component imaging devices (9, 13) installed for each of the component supply devices before and after.

A component supply device (7) having a component supply unit for supplying a plurality of electronic components (90);
A circuit board support device (4) for fixing the circuit board (1) on which the electronic component is mounted in a fixed position;
A plurality of head portions (6h) having a mechanism that can be loaded with a desired suction mounting nozzle (8) and that can move the mounted suction mounting nozzle up and down or rotate are provided. an electronic component mounting apparatus capable of adsorbing the electronic components mounted on a predetermined position on the circuit board (6),
A component imaging device (9) that is a line sensor that captures an image of the electronic component sucked by the suction mounting nozzle;
A recognition control device that analyzes an image of the electronic component captured by the component imaging device and inspects the suction state of the electronic component, and after the desired electronic component is sucked from the component supply device, the component imaging device picks up the component. The electronic component mounting apparatus is moved to the component imaging start position, which is the position where the movement of the component is started for imaging (step # 4), and the head that needs to capture the electronic component and finally picks up the component to be imaged A final imaging head unit that is a part (step # 10), a component imaging end position is determined from the determined final imaging head unit (step # 11), and the component imaging end position determined from the component imaging start position (100) for moving the electronic component mounting apparatus to (step # 5) and performing a component imaging operation;
An electronic component mounting machine characterized by comprising:

The control unit obtains a component imaging start position that minimizes the operation of the electronic component mounting device from the positional relationship between the electronic component suction position from the component supply device and the component imaging device (step # 12). The electronic component mounting machine according to claim 4, wherein the component imaging direction is switched.

The electronic component mounting machine according to claim 4 or 5, wherein a plurality of component imaging devices (9, 13) are installed for each of the component supply devices before and after the electronic component mounting device.

The control unit obtains a component imaging device that minimizes the operation of the electronic component mounting device from the positional relationship between the electronic component suction position from the component supply device and the component imaging device (step # 13). The electronic component mounting machine according to claim 6, wherein the component imaging device (9, 13) to be used is switched.