JP4172757B2 - Component mounting equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting apparatus, and more specifically, sucks a component supplied from a component supply device, and corrects a positional deviation at the time of suction required by image recognition of the sucked component and mounts the component on a substrate. The present invention relates to a component mounting apparatus.
[0002]
[Prior art]
Conventionally, in order to accurately mount electronic components (hereinafter simply referred to as components) on a printed circuit board in a component mounting machine, the components are picked up by an image pickup device such as a CCD camera before the components sucked by the suction nozzle are mounted on the printed circuit board. Then, the amount of misalignment at the time of suction is calculated and corrected to accurately mount the component on the printed circuit board. In addition, in the case of a mounting machine having a plurality of nozzles, the components are sequentially imaged sequentially, the components are imaged simultaneously by a plurality of imaging devices, or a lens that secures a field of view size that can be imaged by all the components is used. The amount of misalignment at the time of suction is calculated by picking up images of the components or sequentially picking up the components with a line sensor, and the components are mounted on the printed circuit board.
[0003]
[Problems to be solved by the invention]
However, when only one image pickup device is provided, the recognition device of the mounting machine starts recognition after all data accumulated in the image pickup device after image pickup is output from the area sensor. It took a long time. In the case of having a plurality of nozzles, the imaging time is simply a multiple of the number of nozzles, which greatly affects the mounting tact. In order to solve this, if an imaging device is provided for each nozzle, there is a problem that the installation area is increased and the cost is increased.
[0004]
In addition, with the line sensor, it is sufficient to image the amount corresponding to the size of the component in the vertical direction, but the left and right positions of the component are not necessary as data, and similarly, it takes time to image this part, and the mounting tact time is slow. There was a problem of becoming.
[0005]
Furthermore, since the recognition apparatus performs image processing regardless of the captured component size, image processing is performed not only on the effective component including the component but also on an extra region that does not include the component on the left and right or top and bottom. There was a problem that the mounting tact time was slow.
[0006]
The present invention has been made to solve the above problems, and aims to provide a component mounting apparatus that can be efficiently imaged parts.
[0007]
[Means for Solving the Problems]
In order to solve the above problems, in the present invention,
A component mounting device that adsorbs a component supplied from a component supply device, corrects a positional deviation at the time of adsorption required by image recognition of the adsorbed component, and mounts the component on a substrate,
An imaging device capable of setting an imaging region;
A setting means for setting an imaging region of the imaging device in consideration of a suction deviation based on the component size and the type of the component supply device ;
An image recognizing image recognition apparatus captures an image of the component taken at the center which is set to the imaging area of the adsorption centers of each of the imaging region of the part products,
It means for mounting components on a substrate by correcting the adsorption amount of deviation obtained by the images recognized,
The structure with is adopted.
[0009]
In the present invention,
A component mounting device that simultaneously sucks a plurality of components supplied from a component supply device, corrects a positional shift at the time of suction required by image recognition of the sucked components, and mounts each component on a substrate,
An imaging area capable of setting an imaging region in consideration of a suction deviation based on the component size and the type of the component supply device, and capable of accommodating each simultaneously sucked component in the field of view;
Setting means for the imaging region of the imaging device, set in a row for each part,
An image recognizing image recognition apparatus captures images of each part taken by the center which is set to the imaging area of the adsorption centers of each of the imaging region of the part products,
Means for correcting the amount of suction displacement required by image recognition and mounting the component on the board,
The image recognition apparatus is configured such that every time imaging of one component is completed, the image of the component is captured and recognized, and imaging of one component and image recognition of the previous component are executed in parallel. Also adopted.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.
[0013]
FIG. 1 is a schematic diagram of a component mounting apparatus (component mounter) according to the present invention, and FIG. 2 is a block diagram showing its control configuration. The component mounting apparatus has a head portion 3 having a suction nozzle 3a for sucking a component (electronic component) 20 supplied from a feeder 8 or a tray 9, and the head portion 3 is a controller 10 composed of a CPU. Is moved along the X-axis 1 by the X-axis motor 11 driven by the X-axis, and the X-axis 1 can be moved along the Y-axis 2, 2 ′ by the Y-axis motor 12. 3 is configured to be movable in the XY-axis direction. The head unit 3 is driven in the Z-axis direction by the Z-axis motor 13 to move up and down, and the suction nozzle 3a can be rotated about the nozzle axis by the θ-axis motor 14. A plurality of suction nozzles can be provided in the head unit 3, and the other suction nozzles 3 b, 3 c,. . . . . It is shown in the figure.
[0014]
The component mounting apparatus includes an imaging device 5 including a lens 5a such as a CCD camera that captures an image of the component 20. The head unit 3 moves to the imaging device 5 after component adsorption, and the illumination device 15 The illuminated component 20 is imaged by the imaging device 5. The captured image of the component is input to an image recognition device 7 that includes a CPU 7a, a memory 7b, and an A / D converter 7c. As will be described later, the imaging device 5 can capture an image of an arbitrary region designated by the CPU 7a, and the image recognition device 7 captures an image of a set region and uses a known algorithm. Recognize the suction posture of the component, and calculate the position shift between the component center and the suction center, and the suction angle shift. The controller 10 composed of a CPU corrects this misalignment when driving the X-axis, Y-axis, and θ-axis motors 11, 12, and 14, and mounts the component 20 on the substrate 6 being conveyed.
[0015]
The component mounting apparatus is provided with input devices such as a keyboard 21 and a mouse 22 for inputting component data, and the generated component data can be stored in a storage device 23 including a hard disk, a flash memory, and the like. It is like that. The component data supplied from a host computer (not shown) connected to the component mounting apparatus may be stored in the storage device 23 without using the input device as described above. In addition, a monitor (display device) 24 is provided, and on this screen, component data, calculation data, and a component image captured by the imaging device 5 can be displayed.
[0016]
In FIG. 3, the component 20 a sucked by the suction nozzle 3 a and in FIG. 4, the components 20 a to 20 c sucked by the suction nozzles 3 a to 3 c are illuminated by the illumination device 15 and imaged by the imaging device 5. The state is shown. The imaging device 5 sets a region that can be captured by the control line 7d from the CPU 7a, and captures an image of the set region. The captured image is input to the image recognition device 7 through the signal line 7e, converted into a digital signal through the A / D converter 7c, stored in the memory 7b, and subjected to image processing to obtain the posture of the component. Is recognized. Further, the image to be processed can be displayed on the monitor 24.
[0017]
The component mounting operation having such a configuration will be described with reference to the flowchart of FIG.
[0018]
First, the image recognition device 7 is notified of specifications (component parameters) such as the dimensions (size) of the component 20 recognized by the controller 10 (step S1). Based on this condition, the CPU 7a sets an area that requires image data in the imaging device 5 via the control line 7d (step S2). The imaging device can capture an image of an arbitrary region in the visual field range. For example, as shown in FIG. 6, the visual field that can be captured by the combination of the imaging device 5 and the lens 5a is, for example, L × L (L = 30 mm). ), When the size of the component 20 is L / 3 × L / 3, the suction nozzle 3a sucks the substantially center of the component 20, and the nozzle center (suction center) is set to be at the center P of the visual field. When the inclination of the component 20 and the suction displacement at the time of suction of the suction nozzle 3a are taken into consideration and this is set to a constant α indicating a margin, the CPU 7a takes the imaging region 30 ((L / 3 + α) × ( L / 3 + α)) is set to the screen center (field center) P, and this is transmitted to the imaging device 5 via the control line 7d. The constant α in consideration of the suction deviation at the time of suction can be determined according to the type of component supply device such as the reel-type feeder 8 or the tray-type supply device 9. For example, in the case of the reel type, α is set to a larger value than that of the tray type.
[0019]
Next, when the suction nozzle 3a sucks the component 20 supplied from the reel-type feeder 8 or the component supply device such as the tray 9 and reaches the place where the imaging device 5 is disposed, the controller 10 recognizes the image. An image recognition command is issued to the device 7. The CPU 7a of the image recognition device 7 receives this image recognition execution command (step S3), and transmits an imaging start instruction for the imaging region set in step S2 to the imaging device 5 (step S4). In response to this, the imaging device 5 starts imaging, and outputs the set image data of the imaging region 30 via the signal line 7e. The image data is converted into a digital signal by the A / D converter 7c and then stored in the image storage memory 7b. After the image data is stored, the CPU 7a calculates a suction position shift amount (a shift amount between the component center and the suction center and a suction tilt) of the component 20 with respect to the suction nozzle 3a according to a known algorithm (steps S5 and S6). As shown in FIG. 3, when one component is picked up by the suction nozzle 3a, the determination in step S7 is affirmed, and thus the recognition process ends here.
[0020]
The calculated positional deviation amount is notified to the controller 10, and when the controller 10 drives the X-axis motor 11, the Y-axis motor 12, and the θ-axis motor 14, the positional deviation amount is corrected and the component 20 is It is mounted accurately at a predetermined position on the substrate.
[0021]
As described above, since an image of an arbitrary region in the image can be captured by the imaging device, the imaging time can be limited to the processing target portion, the imaging time can be reduced, and the capacity of the image storage memory can be reduced. This makes it possible to mount components at a high speed by an inexpensive method.
[0022]
In the above-described embodiment, an example is shown in which one component is imaged. However, as illustrated in FIG. 4, the plurality of suction nozzles 3 a to 3 c simultaneously suck the components 20 a to 20 c. In this case, the magnification of the lens 5a of the imaging device 5 is set to the same magnification as when one component is picked up. When the imaging device 5 can image these components 20a to 20c at a time, the CPU 7a considers each component size and a predetermined suction deviation as shown in FIG. 6B. Imaging regions 30a to 30c that can be imaged are set based on the constants. When the imaging is started and the imaging of the component 20a in the imaging area 30a is completed (step S5 in FIG. 4), the CPU 7a takes in the image data of this component and starts calculating the amount of displacement (step S6). At this time, the CPU 7a starts imaging of the component 20b in the next imaging area 30b (steps S7 and S5). In this way, the image recognition device 5 can start calculating the amount of suction position deviation at the same time as the input of the image of the first component 20a is completed. At this time, the second component 20b is imaged, so the nth component. And the calculation of the amount of suction position deviation of the (n−1) -th component can be executed in parallel. When the imaging of the part 20c in the imaging region 30c and the calculation of the suction position deviation are completed, the amount of positional deviation of each part is notified to the controller 10, and the controller 10 transmits the X-axis motor 11, the Y-axis motor 12, and the θ-axis motor. When driving 14, the amount of misalignment is corrected, and the components 20a to 20c are mounted at predetermined positions on the board.
[0023]
In this way, recognition processing can be started from a component for which imaging has been completed. At this time, imaging of the next component and calculation of positional deviation with respect to the previous component can be performed in parallel, so that image recognition of the component can be performed at high speed. .
[0024]
Further, as shown in FIG. 7, when the imaging region 30d of the component 20d is a small region compared to the entire field of view, the CPU 7a causes the center P1 of the imaging region 30d to be shifted from the field of view center P. Set the imaging area. Specifically, where to set P1 is related to the suction position P2 and the mounting position (mounting position) P3 of the component. Since the CPU 7a is informed of the positions of P2 and P3 from the controller 10, it sets P1 so that the sum of the distances of P2 to P1 and P1 to P3 is the shortest. In the case shown in FIG. 7, the center P1 of the imaging region 30d is located at the upper left. Thus, since the distance from adsorption to mounting can be minimized, high-speed component mounting is possible.
[0025]
In the above-described embodiment, the imaging region is set as an area having a two-dimensional extent. However, as illustrated in FIG. 8, the imaging region is defined as an imaging line 40 having a length that takes into account the component external dimensions and the suction displacement. It can also be set in a line shape. The imaging device captures an image corresponding to the size of the component by moving the component 20 by one line every time one line is captured. When the suction inclination is large, there is a possibility that the component protrudes from the imaging line. Therefore, at least one auxiliary line 41 that is the same as the imaging line is set below the imaging line 40, and the auxiliary line 41 An image of the component to be read is read in advance, and it is determined whether the imaging line can reliably capture the component. For example, when the part moves from the position shown in FIGS. 8A to 8B to the position shown in FIG. 8B, the auxiliary line 41 has already made it impossible to reliably image the part. , 41 in the line direction is increased by a predetermined amount. In FIGS. 8C and 8D, the imaging line 40 and the auxiliary line 41 have increased lengths. When the component moves by one line, the imaging line 40 must always image the component. Is possible. When the line imaging of the entire component is completed in this way, the CPU 7a calculates the amount of positional deviation of the component, and the controller 10 corrects this positional deviation amount as described above to place the component at a predetermined position on the board. To be installed.
[0026]
The above is an example in which the length of the imaging line is increased. However, when it is determined that the component reading is sufficient by the auxiliary line, the length of the imaging line can be decreased. As described above, since the imaging line can be dynamically changed each time the component moves, the length of the imaging line in the line direction moves as imaging progresses even for a component having a large suction deviation. Therefore, it is possible to image only data of a necessary size, and efficient and high-speed imaging is possible.
[0027]
In each embodiment described above, the imaging device 5 and the image recognition device 7 are connected by signal lines 7d and 7e. However, these signal lines may be made unnecessary by using infrared communication or the like. Further, although the image recognition device 7 is provided with the A / D converter 7c, if the video output from the imaging device 5 is a digital signal, this may be omitted.
[0028]
【The invention's effect】
As described above, in the present invention, by using an imaging device capable of capturing an image of an arbitrary region in an image, the imaging region can be set to be only a part recognition target part. The imaging time can be reduced, and the capacity of the image storage memory can be reduced, so that electronic components can be mounted at high speed with an inexpensive configuration.
[0030]
In the present invention, when imaging the components by simultaneously adsorbing a plurality of components, since the calculation of the positional deviation between the imaging of one part with respect to the previous part can be executed in parallel, efficient components at high speed Implementation is possible.
[Brief description of the drawings]
FIG. 1 is a top view showing a schematic configuration of a component mounting apparatus.
FIG. 2 is a block diagram showing a schematic configuration of a component mounting apparatus.
FIG. 3 is a configuration diagram illustrating a configuration of a component recognition device that processes an image of a component imaged by an imaging device.
FIG. 4 is a configuration diagram showing a configuration of a component recognition device that processes an image of a component imaged by an imaging device.
FIG. 5 is a flowchart showing a flow of part image recognition.
FIG. 6 is an explanatory diagram illustrating a state in which an imaging region is set according to a component size.
FIG. 7 is an explanatory diagram showing a state where an imaging region is set by being shifted from the center of the visual field.
FIG. 8 is an explanatory diagram illustrating a state in which an imaging region is set as an imaging line and the imaging line is dynamically changed.
[Explanation of symbols]
3a, 3b, 3c Suction nozzle 5 Imaging device 7 Image recognition device 10 Controller 30, 30a, 30b, 30c Imaging region 40 Imaging line 41 Auxiliary line

Claims (2)

A component mounting device that adsorbs a component supplied from a component supply device, corrects a positional deviation at the time of adsorption required by image recognition of the adsorbed component, and mounts the component on a substrate,
An imaging device capable of setting an imaging region;
A setting means for setting an imaging region of the imaging device in consideration of a suction deviation based on the component size and the type of the component supply device ;
An image recognizing image recognition apparatus captures an image of the component taken at the center which is set to the imaging area of the adsorption centers of each of the imaging region of the part products,
It means for mounting components on a substrate by correcting the adsorption amount of deviation obtained by the images recognized,
A component mounting apparatus comprising: A component mounting device that simultaneously sucks a plurality of components supplied from a component supply device, corrects a positional shift at the time of suction required by image recognition of the sucked components, and mounts each component on a substrate,
An imaging area capable of setting an imaging region in consideration of a suction deviation based on the component size and the type of the component supply device, and capable of accommodating each simultaneously sucked component in the field of view;
Setting means for the imaging region of the imaging device, set in a row for each part,
An image recognizing image recognition apparatus captures images of each part taken by the center which is set to the imaging area of the adsorption centers of each of the imaging region of the part products,
Means for correcting the amount of suction displacement required by image recognition and mounting the component on the board,
The image recognition device captures and recognizes an image of the component every time imaging of one component is completed, and imaging of one component and image recognition of the previous component are executed in parallel. A component mounting apparatus characterized by

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