JP4943300B2 - Component mounting equipment - Google Patents

Description

  The present invention relates to a component mounting apparatus, and in particular, acquires an image of at least one of a first electronic component mounted on a mounting substrate and a second electronic component mounted on the first electronic component, and A component comprising image processing means for holding and processing image information, and a mounting head for holding and mounting the first and second electronic components by suction nozzles based on the results processed by the image processing means Component mounting suitable for use in a mounting apparatus and capable of appropriate correction when stacking and mounting a second electronic component on the first electronic component without imaging the first electronic component mounted on the mounting substrate Relates to the device.

  An example of the configuration of a conventional component mounting apparatus will be described. FIG. 1 is a perspective view of the component mounting apparatus. In FIG. 1, a component mounting apparatus 100 includes a mounting head 108 including a suction nozzle 106 that sucks an electronic component, and includes an X-axis moving mechanism 110, a Y-axis moving mechanism 112, and a component supply device that position the mounting head 108. A component supply unit 116 to be installed, a substrate transport unit 118 for transporting and positioning the mounting substrate 104, a component recognition camera 120 for recognizing the state of the sucked electronic component, and a substrate recognition camera 122 for recognizing a substrate mark on the mounting substrate 104 , And the main body 130.

  Conventionally, in order to mount with high accuracy in the stacked mounting in which another electronic component (referred to as the second electronic component) is mounted on the electronic component (referred to as the first electronic component 102a (FIG. 10)) after being mounted on the mounting substrate 104 such as a bare chip. In this case, the component recognition on the upper surface of the first electronic component 102a after mounting or a part of the pattern is recognized by the substrate recognition camera 122, and the mounting is performed after correcting the mounting position ( Patent Documents 1 and 2).

JP 2006-93321 A JP 2007-27300 A

  However, when the second electronic component is stacked and mounted on the first electronic component 102a after being mounted on the mounting substrate 104, the first electronic component 102 in the first electronic component 102a is mounted on the first electronic component 102a previously mounted. Both the operation of imaging the supply state of the component 102a by the board recognition camera 122 and the operation of imaging the component mark on the upper surface of the first electronic component 102a after mounting are necessary, and the time required for mounting the second electronic component There was a problem that (tact) was long.

  In addition, as shown in FIG. 10, when the top surface height of the first electronic component 102a after mounting is a distance D that deviates from the focal range FD of the focal length d of the substrate recognition camera 122, the first electron after mounting. Since the component 102a cannot be recognized, the correction function becomes ineffective. When dealing with such a first electronic component 102a, it is necessary to adjust the focal length of the board recognition camera 122, add an autofocus function, or add a new camera with a different focal range. There was a problem that the cost increased.

  The present invention has been made to solve the above-mentioned conventional problems, and when mounting the second electronic component on the first electronic component after mounting on the mounting board, the component mark of the first electronic component after mounting is marked. It is an object of the present invention to provide a component mounting apparatus capable of shortening the tact time by omitting an image capturing operation.

  The invention according to claim 1 of the present application acquires an image of at least the first electronic component among the first electronic component mounted on the mounting substrate and the second electronic component mounted on the first electronic component, and the image Component mounting comprising image processing means for holding and processing information, and a mounting head for holding and mounting the first and second electronic components by suction nozzles based on the results processed by the image processing means In the apparatus, storage means for storing a correction value of the suction posture performed when the first electronic component is mounted on the mounting board, an image of a supply state of the first electronic component before suction, and the correction value are used. The image generation means for generating a virtual image with the first electronic component mounted thereon, and correction means for correcting the suction posture of the second electronic component based on the virtual image. It has been solved.

  According to the present invention, a virtual image is obtained using an image of a supply state before suction of the first electronic component and a correction value (correction value A) of the suction posture performed when the first electronic component is mounted on the mounting board. By creating, it is possible to obtain positional deviation information of the first electronic component equivalent to imaging the component mark of the first electronic component after mounting without imaging the component mark of the first electronic component after mounting. Can do.

  According to the present invention, since the suction posture of the second electronic component is controlled based on the virtual image, the second electronic component can be mounted with high accuracy. At that time, since there is no operation for acquiring the image of the first electronic component after mounting, the tact time can be shortened. At the same time, it can be mounted with high accuracy without being affected by the height of the first electronic component after mounting.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  First, an embodiment of the present invention will be described with reference to FIGS. 1 is a perspective view of a component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a configuration block diagram of the component mounting apparatus, FIG. 3 is a mounting flow diagram of a first electronic component, and FIG. 4 is a mounting flow of a second electronic component. 5 is a diagram showing an example of an image of the first electronic component in a supply state before suction, FIG. 6 is a diagram showing an example when the first electronic component is mounted on an inclined mounting board, and FIG. FIG. 8 is a diagram showing another example of the image of the first electronic component in the previous supply state, FIG. 8 is a virtual image when the first electronic component of FIG. 7 is mounted on the mounting substrate of FIG. FIG. 9 is a virtual image when the first electronic component of FIG. 7 is mounted on the mounting board of FIG. 6 with an inclination angle of 90 degrees.

  The component mounting apparatus will be described in detail with reference to FIGS.

  Similar to the configuration of the conventional component mounting apparatus, the component mounting apparatus 100 is disposed at the front of the mounting head 108, the X-axis moving mechanism 110, the Y-axis moving mechanism 112, and the component mounting apparatus 100. A component supply unit 116 for supplying an electronic component 102 (consisting of a first electronic component 102a and a second electronic component 102b) to be mounted on the board, and board conveyance extending in the left-right direction slightly behind the center of the component mounting apparatus 100 And a main body 130 including at least a part of the image processing means. The image processing means acquires at least an image of the first electronic component 102a out of the first electronic component 102a mounted on the mounting substrate 104 and the second electronic component 102b mounted on the first electronic component 102a. Hold and process image information. Therefore, in the present embodiment, the image processing means captures, for example, the first electronic component 102a and the second electronic component 102b and performs image processing on the first electronic component 102a and the second electronic component 102b. And an image recognition device 142 to be described later.

  The mounting head 108 includes a Z-axis moving mechanism (not shown) that moves the suction nozzle 106 so as to be movable up and down in the vertical direction (Z-axis direction). The suction nozzle 106 is centered on the nozzle axis (suction axis). A θ-axis moving mechanism (not shown) for rotation is provided. The mounting head 108 is mounted with a substrate recognition camera 122 that images the substrate mark 104 a (FIG. 6) formed on the mounting substrate 104. The substrate recognition camera 122 can take an image of the electronic component 102 in a supply state before being sucked by the suction nozzle 106.

  The X-axis moving mechanism 110 can move the mounting head 108 in the X-axis direction by an X-axis motor 111 that is a drive source of the X-axis moving mechanism 110.

  The Y-axis moving mechanism 112 can move the X-axis moving mechanism 110 including the mounting head 108 in the Y-axis direction by a Y-axis motor 113 that is a drive source of the Y-axis moving mechanism 112.

  The board transport unit 118 is for receiving and delivering the board 104 from the component mounting apparatuses on both sides when a mounting line is configured with a plurality of component mounting apparatuses. It can be fixed at 100 predetermined positions.

  The component recognition camera 120 is provided in the vicinity of the component supply unit 116 and is arranged so as to capture an image of the electronic component 102 sucked by the suction nozzle 106 from below.

  As shown in FIG. 2, the main body 130 includes a controller 132, a storage device 134, a display device 136, a keyboard 138, a mouse 140, and an image recognition device 142.

  The controller 132 is, for example, a microcomputer such as a CPU that controls the entire apparatus, and includes a RAM and a ROM. As shown in the block diagram of FIG. 2, the entire component mounting apparatus 100 can be controlled by being connected to each component. Further, each axis moving mechanism can be controlled based on a virtual image, which will be described later, and a correction command and mounting of the suction posture of the electronic component 102 can be performed. That is, in this embodiment, for example, the controller 132 and each axis moving mechanism can constitute a correction unit.

  The storage device 134 is composed of, for example, a flash memory and the like. The layout data of the mounting board 104 and the layout data of the first and second electronic components 102a and 102b input by the keyboard 138 and the mouse 140 are not shown. It can also be used to store the above data supplied from the host computer. Further, it can also be used to store a suction posture correction value (referred to as correction value A) performed when the first electronic component 102a is mounted on the mounting substrate 104. That is, in the present embodiment, for example, the storage device 134 can be used as a storage unit.

  The display device (monitor) 136 can display, for example, component data, calculation data, the image of the electronic component 102 captured by the component recognition camera 120 and the substrate recognition camera 122 on the display surface.

  The image recognition device 142 is connected to the component recognition camera 120, can perform image recognition of the component 102 sucked by the suction nozzle 106, and can include an A / D converter 144, a CPU 146, and a memory 148. . The analog image signal of the electronic component 102 output from the component recognition camera 120 is converted into a digital signal by the A / D converter 144 and stored in the memory 148, and the electronic component is picked up by the CPU 146 based on the image information. 102 is recognized. That is, the image recognition device 142 can calculate the positional deviation and the suction angle between the center of the component 102 and the suction position, and can recognize the suction posture of the component 102 (component recognition processing).

  The image recognition device 142 functions to process the image information of the board mark 104a (FIG. 6) imaged by the board recognition camera 122, calculate the position of the board mark 104a, and recognize the displacement of the mounting board 104 and the like. Also have. Further, the image recognition device 142 can store the image information of the electronic component 102 in the supplied state before being picked up by the board recognition camera 122, and the first electronic component is mounted using the correction value A. Virtual images can be created. In other words, in the present embodiment, for example, the image recognition device 142 can be used as an image creating unit. It also has a function of processing the above-described image information and transferring correction values and the like to the controller 132.

  Next, the operation of the component mounting apparatus according to the present embodiment will be described in detail with reference to FIGS.

  First, the operation of mounting the first electronic component 102a on the mounting substrate 104 will be described mainly with reference to FIG.

  First, in order to correct the displacement of the mounting substrate 104, the substrate mark 104a (FIG. 6) of the mounting substrate 104 is imaged by the substrate recognition camera 122, and the displacement of the mounting substrate 104 is recognized (step S2). Note that this operation need only be performed first when one mounting substrate 104 is fixed by the substrate transport unit 118, and thus does not need to be performed every time the stacked mounting is performed.

  Next, the board recognition camera 122 is moved to the suction position of the first electronic component 102a of the component supply unit 116 (step S4), and the supply state before suction of the first electronic component 102a in the cavity 103 (FIG. 5) is imaged. (Step S6). The captured image information is held in the memory 148. Here, the cavity 103 indicates, for example, a concave space of the reel tape in which the electronic component 102 is stored when the electronic component 102 is supplied as a reel tape.

  Next, the component mark 102c (FIG. 5) of the first electronic component 102a is confirmed from the captured image information, and a specific suction position of the first electronic component 102a is sucked by the suction nozzle 106 (step S8).

  Here, the specific suction position SP will be specifically described with reference to FIG. The center PC of the first electronic component 102a is offset from the center position CC of the cavity 103, but is not angularly shifted from the cavity 103. In this case, a positional shift (x1, y1) from the center position CC (xc, yc) of the cavity 103 to the component center PC of the first electronic component 102a is obtained from the image information. Further, the specified position SP (x2, y2) for avoiding the suction prohibition position is confirmed from the component center PC, the position of the suction nozzle 106 is corrected and adjusted, and the first electronic component 102a is picked up at the specific position SP. To do. The suction prohibition position is, for example, a position where there is a risk of impairing the function of the electronic component 102 when it is suctioned, a position where a bump or the like is formed, and a shape that is not suitable for suction. Further, the component center PC here can be calculated with reference to the component mark 102c, for example.

  Next, the component recognition camera 120 images the first electronic component 102 a sucked by the suction nozzle 106. Then, a deviation amount and an angle between the center of the first electronic component 102a and the suction position are acquired by the component recognition process (step S10). Then, the suction posture of the first electronic component 102a is corrected in consideration of the positional deviation of the mounting substrate 104 (step S12). At this time, the correction value (corrected value A) actually corrected is held in the storage device 134.

  Finally, the first electronic component 102a is mounted on the mounting board 104 in a state corrected with the correction value A.

  Next, the operation of mounting the second electronic component 102b on the first electronic component 102a mounted on the mounting substrate 104 will be described mainly with reference to FIG.

  First, the suction nozzle 106 is moved to suck the second electronic component 102b of the component supply unit 116. The sucked second electronic component 102b is imaged by the component recognition camera 120. Then, a deviation amount and an angle between the center of the second electronic component 102b and the suction position are acquired by the component recognition process (step S20).

  Next, the suction posture of the second electronic component 102b is corrected with respect to the mounting position (step S22). That is, the suction posture of the second electronic component 102b is corrected in consideration of the displacement of the mounting substrate 104.

  Next, a virtual image is created using the image of the first electronic component 102a in the supply state before suction held in the memory 148 and the correction value A held in the storage device 134 (step S24). Here, the virtual image will be described with reference to FIGS.

  For example, as shown in FIG. 6, a case is assumed where the mounting substrate 104 has an angular deviation of 5 degrees. Then, (a) the state of the first electronic component 102a mounted at an angle of 0 degrees with respect to the mounting substrate 104, and (b) the state of the first electronic component 102a mounted at an angle of 90 degrees, respectively. Consider getting a virtual image.

  As shown in FIG. 7, it is assumed that the first electronic component 102 a is inclined at an angle of −10 degrees in the cavity 103. The angle inclination determination is based on the component mark 102c. The reason is that even in the conventional stacked mounting, the second electronic component 102b is corrected based on the component mark 102c of the first electronic component 102a. For simplification of description, it is assumed that there is no positional deviation between the center PC of the first electronic component 102a and the center CC of the cavity 103.

  The image information of FIG. 7 can be obtained in step S6. The correction value A is image information obtained by the component recognition process of the component recognition camera 120, and is a value actually corrected. Therefore, by providing the correction value A to the image information of the first electronic component 102a in FIG. 7, the position of the component mark 102c of the first electronic component 102a actually mounted on the mounting board 104 is calculated with high accuracy. Can be created as a virtual image. That is, a rotation correction of 15 degrees is performed on the first electronic component 102a and mounted on the mounting board 104 so as to have an inclination of 0 degree with respect to the mounting board 104. In this case, when the image information of FIG. 7 is rotated by 15 degrees of the correction value A, the image of FIG. 8 can be obtained as a virtual image. That is, this virtual image becomes equal to the state of FIG.

  Similarly, a rotation correction of 105 degrees is performed on the first electronic component 102a as the correction value A of the first electronic component 102a so that the first electronic component 102a has a 90 degree inclination with respect to the mounting board 104, and is mounted on the mounting board 104. . In this case, when the image information of FIG. 7 is rotated by 105 degrees of the correction value A, the image of FIG. 9 can be obtained as a virtual image. That is, this virtual image is equal to the state shown in FIG.

  For this reason, the operation | movement which images the component mark 102c of the 1st electronic component 102a after mounting can be made unnecessary. That is, the virtual image of the first electronic component 102a equivalent to the image of the component mark 102c of the first electronic component 102a after mounting is captured without imaging the component mark 102c of the first electronic component 102a after mounting. Misalignment information can be provided.

  Next, the suction posture of the second electronic component 102b is corrected with respect to the mounting position of the first electronic component 102a based on the virtual image (step S26). If there is no deviation between the reference by the substrate mark 104a of the mounting board 104 and the reference by the component mark 102c of the first electronic component 102a obtained based on the virtual image, the correction is made at this step by the correction at step 22. And can be mounted with high accuracy. However, if there is a deviation between the reference by the substrate mark 104a of the mounting board 104 and the reference by the component mark 102c of the first electronic component 102a obtained based on the virtual image, the amount of positional deviation is corrected. .

  Finally, the second electronic component 102b is mounted on the first electronic component 102a (step S28).

  In this way, a virtual image is created using the image of the supply state of the first electronic component 102a before suction and the correction value A of the suction posture performed when the first electronic component 102a is mounted on the mounting board 104. Therefore, even if the component mark 102c of the first electronic component 102a after mounting is not imaged, the positional deviation information of the first electronic component 102a equivalent to the imaging of the component mark 102c of the first electronic component 102a after mounting is obtained. Obtainable.

  Therefore, according to the present embodiment, since the suction posture of the second electronic component 102b is controlled based on the virtual image, the second electronic component 102b can be mounted with high accuracy. At that time, since there is no operation for acquiring the image of the first electronic component 102a after mounting, the tact time can be shortened. At the same time, the first electronic component 102a after mounting can be mounted with high accuracy without being affected by the component height.

  In the present embodiment, the first electronic component 102a in the supply state before suction is stored in the cavity 103, but the present invention is not limited to this. For example, the present invention can be applied even when a bare chip is directly sucked and mounted from a silicon wafer or when it is supplied in bulk.

  In this embodiment, the correction value A is stored in the storage device 134 and the supplied image information is stored in the memory 148. However, the present invention is not limited to this. Either the correction value A or the supply state image information may be held in the storage device 134 or the memory 148. This is because the present invention exhibits its effect in any case. Further, it is obvious that the processing or the like may be performed by either the CPU 146 or the controller 132.

  In this embodiment, the component recognition process is performed by using the component recognition camera 120 (steps S10 and S20), but the component recognition process performed by the component recognition camera 120 is performed by the board recognition camera 122. As a result, the suction posture can be corrected (steps S12 and S22). Further, instead of using the component recognition camera 120, component recognition by a laser may be performed instead.

  Further, in the present invention, it is obvious that the first electronic component 102a and the second electronic component 102b do not matter in the form of a package or the difference between an IC and a chip component. For example, a chip resistor or a chip capacitor may be mounted on the IC package, or a stacked mounting of ICs may be used. In the case of ICs, any combination of insertion type DIP and SIP, surface mount type BGA, SOP, SON, QFP, CSP, bear chip and the like may be used. In any case, the present invention exhibits its effect.

  Even when the electronic component is not mounted on the second electronic component 102b, the substrate recognition camera 122 may image the second electronic component 102b in the supplied state. Even when the second electronic component 102b itself such as a bare chip is mounted, it is required to accurately adsorb to the specified position SP by removing the adsorption prohibition position for the purpose of reducing damage at the time of adsorption. This is because it is desirable that the board recognition camera 122 recognizes the supply state of the second electronic component 102b and corrects and adjusts the suction position.

  Further, in the creation of the virtual image, only the rotation is shown as the correction value A. However, if the center PC of the first electronic component 102a is misaligned, the correction value A is naturally changed by that amount. It will be. Also in the above embodiment, it goes without saying that the second electronic component 102b is mounted in consideration of the layout data of the first electronic component 102a and the mounting substrate 104.

The perspective view of the component mounting apparatus which is embodiment of this invention Similarly, block diagram of component mounting equipment Similarly, mounting flow diagram for the first electronic component Similarly, the mounting flow diagram of the second electronic component The figure which similarly shows an example of the image of the 1st electronic component of the supply state before adsorption | suction The figure which shows an example at the time of mounting a 1st electronic component on the mounting board similarly inclined The figure which shows an example of a different image of the 1st electronic component of the supply state before adsorption | suction similarly A virtual image when the first electronic component of FIG. 7 is mounted on the mounting substrate of FIG. 6 without an inclination angle. A virtual image when the first electronic component of FIG. 7 is mounted on the mounting substrate of FIG. 6 with an inclination angle of 90 degrees. Schematic showing the problem of the focal length of the conventional board recognition camera

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Component mounting apparatus 102, 102a, 102b ... Electronic component 102c ... Component mark 103 ... Cavity 104 ... Mounting board 104a ... Board mark 106 ... Suction nozzle 108 ... Mounting head 110 ... X-axis moving mechanism 112 ... Y-axis moving mechanism 116 ... Component supply unit 120 ... Component recognition camera 122 ... Board recognition camera 130 ... Main body 132 ... Controller 134 ... Storage device 142 ... Image processing device 146 ... CPU
148 ... Memory

Claims (1)

Image processing means for acquiring an image of at least the first electronic component of the first electronic component mounted on the mounting substrate and the second electronic component mounted on the first electronic component, and holding and processing the image information When,
In a component mounting apparatus comprising a mounting head for mounting and holding the first and second electronic components by a suction nozzle based on the result processed by the image processing means,
Storage means for storing a correction value of the suction posture performed when mounting the first electronic component on the mounting substrate;
Image creating means for creating a virtual image of a state in which the first electronic component is mounted using the image of the supply state before suction of the first electronic component and the correction value;
Correction means for correcting the suction posture of the second electronic component based on the virtual image;
A component mounting apparatus characterized by comprising: