JP3972889B2 - 発光装置およびそれを用いた面状光源 - Google Patents

発光装置およびそれを用いた面状光源 Download PDF

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Publication number
JP3972889B2
JP3972889B2 JP2003366046A JP2003366046A JP3972889B2 JP 3972889 B2 JP3972889 B2 JP 3972889B2 JP 2003366046 A JP2003366046 A JP 2003366046A JP 2003366046 A JP2003366046 A JP 2003366046A JP 3972889 B2 JP3972889 B2 JP 3972889B2
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Japan
Prior art keywords
light
light emitting
wall surface
emitting device
emitting element
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Expired - Fee Related
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JP2003366046A
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Japanese (ja)
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JP2004207688A5 (enrdf_load_stackoverflow
JP2004207688A (ja
Inventor
昌志 石田
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Nichia Corp
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Nichia Corp
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Publication of JP2004207688A5 publication Critical patent/JP2004207688A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/732—Location after the connecting process
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    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

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JP2003366046A 2002-12-09 2003-10-27 発光装置およびそれを用いた面状光源 Expired - Fee Related JP3972889B2 (ja)

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JP2003366046A JP3972889B2 (ja) 2002-12-09 2003-10-27 発光装置およびそれを用いた面状光源

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JP2002356464 2002-12-09
JP2003366046A JP3972889B2 (ja) 2002-12-09 2003-10-27 発光装置およびそれを用いた面状光源

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JP2004207688A JP2004207688A (ja) 2004-07-22
JP2004207688A5 JP2004207688A5 (enrdf_load_stackoverflow) 2006-10-05
JP3972889B2 true JP3972889B2 (ja) 2007-09-05

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JP4608294B2 (ja) * 2004-11-30 2011-01-12 日亜化学工業株式会社 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP2006351708A (ja) * 2005-06-14 2006-12-28 Toyoda Gosei Co Ltd 発光ダイオードランプ及び光源装置
JP4923771B2 (ja) * 2005-06-17 2012-04-25 三菱化学株式会社 表示装置
JP4778745B2 (ja) * 2005-07-27 2011-09-21 パナソニック株式会社 半導体発光装置及びその製造方法
CN101278416B (zh) * 2005-09-30 2011-01-12 日亚化学工业株式会社 发光装置以及使用该发光装置的背光光源单元
KR100637476B1 (ko) 2005-11-09 2006-10-23 알티전자 주식회사 측면발광 다이오드 및 그 제조방법
KR100780176B1 (ko) 2005-11-25 2007-11-27 삼성전기주식회사 측면 방출 발광다이오드 패키지
JP5119621B2 (ja) * 2006-04-21 2013-01-16 日亜化学工業株式会社 発光装置
JP5722759B2 (ja) * 2006-04-21 2015-05-27 日亜化学工業株式会社 発光装置
US9502624B2 (en) 2006-05-18 2016-11-22 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
KR100792034B1 (ko) * 2006-08-21 2008-01-04 알티전자 주식회사 측면발광 다이오드
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JP5380774B2 (ja) 2006-12-28 2014-01-08 日亜化学工業株式会社 表面実装型側面発光装置及びその製造方法
JP5233992B2 (ja) * 2007-03-26 2013-07-10 日亜化学工業株式会社 発光装置
JP5196107B2 (ja) * 2007-03-29 2013-05-15 日亜化学工業株式会社 発光装置
JP4983348B2 (ja) * 2007-04-04 2012-07-25 豊田合成株式会社 発光装置
KR101326888B1 (ko) 2007-06-20 2013-11-11 엘지이노텍 주식회사 반도체 발광소자 패키지
US7905618B2 (en) 2007-07-19 2011-03-15 Samsung Led Co., Ltd. Backlight unit
KR100951274B1 (ko) * 2007-07-19 2010-05-06 삼성엘이디 주식회사 백라이트 유닛
JP5358104B2 (ja) * 2008-02-25 2013-12-04 豊田合成株式会社 発光装置
JP5236406B2 (ja) * 2008-03-28 2013-07-17 ローム株式会社 半導体発光モジュールおよびその製造方法
JP5549759B2 (ja) * 2013-05-22 2014-07-16 日亜化学工業株式会社 発光装置及び面発光装置並びに発光装置用パッケージ
JP6414427B2 (ja) * 2013-10-03 2018-10-31 日亜化学工業株式会社 発光装置実装構造体
FR3078140B1 (fr) * 2018-02-19 2020-09-11 Automotive Lighting Rear Lamps France Dispositif de signalisation de securite attractive pour un vehicule automobile
JP2024040624A (ja) * 2022-09-13 2024-03-26 Ｎｉｓｓｈａ株式会社 樹脂成形品の製造方法及び樹脂成形品

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Publication number Priority date Publication date Assignee Title
US8410502B2 (en) 2009-09-01 2013-04-02 Sharp Kabushiki Kaisha Light-emitting device, planar light source including the light-emitting device, and liquid crystal display device including the planar light source

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