JP3963187B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP3963187B2 JP3963187B2 JP2005272836A JP2005272836A JP3963187B2 JP 3963187 B2 JP3963187 B2 JP 3963187B2 JP 2005272836 A JP2005272836 A JP 2005272836A JP 2005272836 A JP2005272836 A JP 2005272836A JP 3963187 B2 JP3963187 B2 JP 3963187B2
- Authority
- JP
- Japan
- Prior art keywords
- led chip
- lens
- light
- light emitting
- sealing portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
14 ボンディングワイヤ
20 実装基板
21 金属板
22 絶縁性基材
23 リードパターン
30 サブマウント部材
40 枠体
50 封止部
60 レンズ
60a 光入射面
60b 光出射面
70 色変換部材
80 空気層
Claims (2)
- LEDチップと、LEDチップが実装された実装基板と、当該実装基板におけるLEDチップの実装面側でLEDチップを囲む枠体と、枠体の内側に透明樹脂材料を充填して形成されてLEDチップおよび当該LEDチップに電気的に接続されたボンディングワイヤを封止し且つ弾性を有する封止部と、封止部に重ねて配置されたレンズと、LEDチップから放射された光によって励起されてLEDチップの発光色とは異なる色の光を放射する蛍光体を透明材料とともに成形した成形品であって実装基板の前記実装面側でレンズおよび枠体を覆いレンズの光出射面および枠体との間に空気層が形成される形で配設されるドーム状の色変換部材とを備え、枠体が透明樹脂の成形品からなり、レンズが凹レンズからなることを特徴とする発光装置。
- 前記レンズは、前記光出射面が、前記封止部側の光入射面から入射した光を前記光出射面と前記空気層との境界で全反射させない凹曲面状に形成されてなることを特徴とする請求項1記載の発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005272836A JP3963187B2 (ja) | 2005-09-20 | 2005-09-20 | 発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005272836A JP3963187B2 (ja) | 2005-09-20 | 2005-09-20 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007088071A JP2007088071A (ja) | 2007-04-05 |
JP3963187B2 true JP3963187B2 (ja) | 2007-08-22 |
Family
ID=37974782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005272836A Active JP3963187B2 (ja) | 2005-09-20 | 2005-09-20 | 発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3963187B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5040863B2 (ja) * | 2008-09-03 | 2012-10-03 | 豊田合成株式会社 | 半導体発光装置 |
-
2005
- 2005-09-20 JP JP2005272836A patent/JP3963187B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2007088071A (ja) | 2007-04-05 |
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