JP3941826B2 - Led照明器具の製造方法 - Google Patents
Led照明器具の製造方法 Download PDFInfo
- Publication number
- JP3941826B2 JP3941826B2 JP2005272881A JP2005272881A JP3941826B2 JP 3941826 B2 JP3941826 B2 JP 3941826B2 JP 2005272881 A JP2005272881 A JP 2005272881A JP 2005272881 A JP2005272881 A JP 2005272881A JP 3941826 B2 JP3941826 B2 JP 3941826B2
- Authority
- JP
- Japan
- Prior art keywords
- led chip
- lens
- light
- light emitting
- color conversion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Description
1 発光モジュール
10 LEDチップ
20 実装基板
50 封止部
60 レンズ
70 色変換部材
101 ボディ
102 底壁
104 配光レンズ
110 配線基板
Claims (1)
- 真空減圧下で実装基板を器具本体に対して熱圧着し、器具本体に固着された実装基板にLEDチップを実装した後、前記LEDチップを透明樹脂材料で樹脂封止して封止部を形成するとともに、前記封止部に重ねてレンズを実装した後、前記LEDチップからの照射光によって励起されて前記LEDチップの発光色とは異なる色の光を発する蛍光体を透明材料とともに成形したドーム状の色変換部材を、前記封止部および前記レンズとの間に空気層を設けた状態で前記実装基板に実装することを特徴とするLED照明器具の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005272881A JP3941826B2 (ja) | 2005-09-20 | 2005-09-20 | Led照明器具の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005272881A JP3941826B2 (ja) | 2005-09-20 | 2005-09-20 | Led照明器具の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007087669A JP2007087669A (ja) | 2007-04-05 |
JP3941826B2 true JP3941826B2 (ja) | 2007-07-04 |
Family
ID=37974451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005272881A Active JP3941826B2 (ja) | 2005-09-20 | 2005-09-20 | Led照明器具の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3941826B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7935978B2 (en) | 2008-08-28 | 2011-05-03 | Kabushiki Kaisha Toshiba | Light emitting device and method for manufacturing the same |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG184740A1 (en) * | 2007-10-22 | 2012-10-30 | Amcrew Inc | Surface emitting body and internally illuminated sign having the surface emitting body assembled therein |
JP5581029B2 (ja) * | 2009-09-18 | 2014-08-27 | パナソニック株式会社 | 照明モジュール |
CN104089214B (zh) * | 2014-05-05 | 2017-03-29 | 中山市木林森照明工程有限公司 | 一种发光均匀的去电源化led路灯 |
-
2005
- 2005-09-20 JP JP2005272881A patent/JP3941826B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7935978B2 (en) | 2008-08-28 | 2011-05-03 | Kabushiki Kaisha Toshiba | Light emitting device and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
JP2007087669A (ja) | 2007-04-05 |
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