JP3948321B2 - 3-terminal capacitor mounting structure - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention , The present invention relates to a three-terminal capacitor mounting structure.
[0002]
[Prior art]
Conventionally, for example, in order to reduce the equivalent series inductance (ESL) of a two-terminal capacitor for noise current removal used in a power line of a high-speed IC, as shown in FIG. 15, a plurality of two-terminal capacitors 1A and 1B are hot. The side conductor pattern 60 and the ground side conductor pattern G11 are electrically connected in parallel and mounted on the circuit board 30. In other words, two 2-terminal capacitors are mounted in parallel when the equivalent series inductance is to be halved, and three 2-terminal capacitors are mounted in parallel when the equivalent series inductance is to be ３. In FIG. 15, arrows Ia and Ib indicate the noise current flowing in the two-terminal capacitors 1A and 1B and their directions, respectively.
[0003]
[Problems to be solved by the invention]
Therefore, in order to realize a small equivalent series inductance, it is necessary to mount a large number of capacitors on the circuit board 30. The circuit board 30 is required to have a wide mounting space, which is one factor of high cost. .
[0004]
Accordingly, an object of the present invention is to reduce the mounting space and cost, and to reduce the equivalent series inductance of the capacitor. 3 The object is to provide a terminal capacitor mounting structure.
[0005]
[Means and Actions for Solving the Problems]
In order to achieve the above object, a three-terminal capacitor mounting structure according to the present invention includes a chip element body, a through electrode provided inside the chip element body, and an internal electrode provided to face the through electrode. The first external terminal and the second external terminal provided on both end faces of the chip body and electrically connected to the through electrode, and provided on the side surface of the chip body and electrically connected to the internal electrode A three-terminal capacitor mounting structure in which a three-terminal capacitor having a third external terminal is mounted on a circuit board having a hot-side conductor pattern and a ground-side conductor pattern. And the second external terminal are electrically connected to the hot-side conductor pattern, and the ground-side conductor pattern is provided on at least one of the inside and the back surface of the circuit board. And a direction of noise current flowing through the ground-side conductor pattern and a direction of noise current flowing through the three-terminal capacitor are electrically connected to the third external terminal of the three-terminal capacitor via electrical connection means provided inside A three-terminal capacitor is mounted on the circuit board and the ground-side conductor pattern is arranged so that are opposite to each other.
[0006]
Alternatively, in the three-terminal capacitor mounting structure according to the present invention, the third external terminal is electrically connected to the ground-side conductor pattern, and the hot-side conductor pattern is provided on at least one of the inside and the back surface of the circuit board. And the direction of the noise current flowing in the hot-side conductor pattern that is electrically connected to the first external terminal and the second external terminal of the three-terminal capacitor via electrical connection means provided inside the circuit board. The three-terminal capacitor is mounted on the circuit board and the hot-side conductor pattern is arranged so that the directions of the noise currents flowing through the three-terminal capacitor are opposite to each other.
[0007]
With the above configuration, noise currents in directions opposite to the directions of the respective noise currents flowing through the three-terminal capacitor flow through the ground-side conductor pattern and the hot-side conductor pattern provided inside or on the back surface of the circuit board. Therefore, the magnetic fields generated by these noise currents cancel each other. As a result, the total equivalent series inductance of the three-terminal capacitor and the circuit board is reduced.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a capacitor mounting structure according to the present invention will be described below with reference to the accompanying drawings.
[0009]
[First Embodiment, FIGS. 1 to 5]
FIG. 1 is a plan view showing an embodiment of a mounting structure of a two-terminal capacitor used for removing noise current in a power line of a high-speed IC, and FIG. 2 is a cross-sectional view thereof. On the surface of the circuit board 30, multilayer type two-terminal capacitors 1A and 1B are mounted with solder or the like.
[0010]
The multilayer two-terminal capacitors 1A and 1B are provided with first external terminals 2a and second external terminals 2b on both end surfaces of a rectangular parallelepiped ceramic element (chip element), respectively, and the inside of the ceramic element. A plurality of internal electrodes are provided.
[0011]
The circuit board 30 is a ceramic substrate made of a dielectric, and a hot-side conductor pattern (first conductor pattern) to which the first external terminals 2a and 2a of the two-terminal capacitors 1A and 1B are electrically connected is provided on the surface thereof. ) 31 and ground side conductor patterns (second conductor patterns) G1, G2 to which the second external terminals 2b, 2b are electrically connected, respectively. The ground side conductor patterns G1, G2 are arranged with the hot side conductor pattern 31 in between. The two-terminal capacitors 1A and 1B are mounted facing each other so as to be substantially symmetrical with respect to the hot-side conductor pattern 31.
[0012]
Further, a ground side conductor pattern G is also provided inside the circuit board 30 and is electrically connected to the ground side conductor patterns G1 and G2 through through holes 34a and 34b provided in the circuit board 30, respectively. Yes. The ground-side conductor pattern G may be a line having a relatively narrow conductor width, or may be a plane having a large area. In the ground side conductor pattern G, a common through hole 35 is disposed at a position approximately equidistant from the through holes 34a and 34b and at a position approximately in the middle of the two-terminal capacitors 1A and 1B in plan view.
[0013]
In the above configuration, the signal current (DC current) flows through the hot conductor pattern 31. On the other hand, the noise current (high-frequency current) that has entered the hot conductor pattern 31 flows through the two-terminal capacitors 1A and 1B to the ground. That is, approximately half of the noise current flows through the two-terminal capacitor 1A—the ground side conductor pattern G1—the through hole 34a—the ground side conductor pattern G (substantially the left half portion in FIG. 2) —the common through hole 35; Terminal capacitor 1B—ground side conductor pattern G2—through hole 34b—ground side conductor pattern G (substantially right half portion in FIG. 2) —common through hole 35 flows.
[0014]
Here, since the two-terminal capacitors 1A and 1B are mounted so as to be substantially line-symmetric with respect to the hot-side conductor pattern 31, the size of each of the two-terminal capacitors 1A and 1B is large. Noise currents Ia and Ib that are substantially equal to each other flow in opposite directions. As a result, the magnetic fields generated by the noise currents Ia and Ib cancel each other. As a result, the equivalent series inductance of the capacitor generated by the two two-terminal capacitors 1A and 1B is not halved but can be suppressed to approximately ３ or less. Therefore, the number of capacitors mounted on the circuit board 30 can be reduced.
[0015]
FIG. 3 shows insertion loss characteristics (see solid line A1) of two two-terminal capacitors 1A and 1B arranged so that the directions of the noise currents Ia and Ib flowing therethrough are opposite to each other. For comparison, FIG. 3 shows an insertion loss characteristic of one two-terminal capacitor (see the dashed line A2) and an insertion loss characteristic of two conventional two-terminal capacitors connected in parallel as shown in FIG. 15 (see the dotted line A3). ).
[0016]
Furthermore, in the first embodiment, the circuit board 30 on which the two-terminal capacitors 1A and 1B are mounted is multilayered so that the ground-side conductor patterns G1, G2, and G are substantially line-symmetric with respect to the hot-side conductor pattern 31. And through holes 34a, 34b, and 35 are arranged. Accordingly, the magnetic fields generated by the noise currents Ia and Ib flowing through the two-terminal capacitors 1A and 1B and the noise currents Ic, Id, Ie and If flowing through the ground side conductor patterns G1, G2 and G of the circuit board 30, respectively. The magnetic fields generated by the two cancel each other out.
[0017]
That is, the sum of the magnetic fields generated by the noise current Ia flowing through the two-terminal capacitor 1A and the noise current Ic flowing through the ground-side conductor pattern G1, and the ground-side conductor pattern G ( The magnetic fields generated by the noise current Ie flowing in the substantially left half portion in FIG. 2 cancel each other. Similarly, the sum of the magnetic fields generated by the noise current Ib flowing through the two-terminal capacitor 1B and the noise current Id flowing through the ground-side conductor pattern G2, and the ground-side conductor pattern G (a portion on the substantially right half in FIG. 2). ) Cancel each other out with the magnetic field generated by the noise current If flowing through. As a result, the total equivalent series inductance of the two-terminal capacitors 1A and 1B and the circuit board 30 can be reduced.
[0018]
Also, as shown in FIGS. 4 and 5, two hot-side conductor patterns (second conductor patterns) 38 and 39 may be arranged with a ground-side conductor pattern (first conductor pattern) G3 in between. A common through hole 35 is arranged at the center of the ground side conductor pattern G3. Through holes 34a and 34b are disposed in the ground-side conductor pattern G provided inside the circuit board 30 at positions approximately equidistant from the common through hole 35 and at positions of the two-terminal capacitors 1A and 1B in plan view, respectively. ing. The noise current that has entered the hot-side conductor patterns 38 and 39 passes through the two-terminal capacitors 1A and 1B and becomes one current through the ground-side conductor pattern G3-common through hole 35. Then, it branches again into two and flows to the through holes 34a and 34b, respectively.
[0019]
Here, since the two-terminal capacitors 1A and 1B are mounted so as to be substantially line-symmetric with respect to the ground-side conductor pattern G3, the sizes of the two-terminal capacitors 1A and 1B are respectively large. Noise currents Ia and Ib that are substantially equal to each other flow in opposite directions. As a result, the magnetic fields generated by the noise currents Ia and Ib cancel each other. As a result, the equivalent series inductance of the capacitor generated by the two two-terminal capacitors 1A and 1B can be suppressed to about 1/3 or less.
[0020]
Furthermore, the sum of the magnetic field generated by the noise current Ia flowing through the two-terminal capacitor 1A and the noise current Ic flowing through the ground-side conductor pattern G3 (substantially the left half portion in FIG. 5), and the inside of the circuit board 30 And the magnetic field generated by the noise current Ie flowing through the ground-side conductor pattern G (substantially the left half portion in FIG. 5) formed on each other cancel each other. Similarly, the sum of the magnetic field generated by the noise current Ib flowing through the two-terminal capacitor 1B and the noise current Id flowing through the ground side conductor pattern G3 (substantially the right half portion in FIG. 5), and the ground side conductor pattern The magnetic field generated by the noise current If flowing through G (substantially right half in FIG. 5) cancels each other. As a result, the total equivalent series inductance of the two-terminal capacitors 1A and 1B and the circuit board 30 can be reduced.
[0021]
[Second Embodiment, FIGS. 6 to 11]
FIG. 6 is a schematic plan view showing an embodiment of a mounting structure of a three-terminal capacitor used for noise current removal, and FIG. 7 is a schematic cross-sectional view thereof. A multilayer three-terminal capacitor 11 is mounted on the surface of the circuit board 30 with solder 50 or the like.
[0022]
The three-terminal capacitor 11 is provided with a first external terminal 13 and a second external terminal 14 on both end faces of a rectangular parallelepiped ceramic body (chip body) 12 made of a dielectric, respectively, and inside the ceramic body 12. An electrode 17 and a through electrode 16 are provided. Each internal electrode 17 is electrically connected to third external terminals 15 a and 15 b provided on both side surfaces of the ceramic body 12, and the through electrode 16 electrically connects the first external terminal 13 and the second external terminal 14. Connected.
[0023]
On the surface of the circuit board 30, hot-side connection lands (hot-side conductor patterns) 40 and 41 to which the first external terminal 13 and the second external terminal 14 of the three-terminal capacitor 11 are electrically connected, respectively, and a third external Ground side connection lands (ground side conductor patterns) G4 and G5 to which the terminals 15a and 15b are electrically connected are formed.
[0024]
Inside the circuit board 30, a hot-side conductor pattern (not shown) and a ground-side conductor pattern G are usually stacked in different layers. The hot-side conductor pattern and the ground-side conductor pattern G in the circuit board 30 may be a line shape having a relatively narrow conductor width, or may be a plane shape having a large area. The ground side conductor pattern G is electrically connected to the ground side connection lands G4 and G5 via through holes 34a and 34b provided in the circuit board 30. The hot side conductor pattern is electrically connected to the hot side connection lands 40 and 41 through through holes 34 c and 34 d provided in the circuit board 30.
[0025]
The through holes 34 a and 34 b are preferably disposed at positions that are substantially symmetrical with respect to the position of the common through hole 35. The third external terminals 15a and 15b of the three-terminal capacitor 11 are preferably located at substantially equal distances from the through holes 34a and 34b, respectively.
[0026]
A signal current (DC current) flows through the through electrode 16 of the three-terminal capacitor 11. On the other hand, the noise current (high-frequency current) that has entered the through electrode 16 flows to the ground through the internal electrode 17. That is, approximately half of the noise current is the internal electrode 17 of the three-terminal capacitor 11 (substantially the left half portion in FIG. 7) -third external terminal 15a-ground side connection land G4-through hole 34a-ground side conductor pattern G ( 7 (approximately the left half portion in FIG. 7)-flows with the common through hole 35, and the rest is the internal electrode 17 of the three-terminal capacitor 11 (approximately right half portion in FIG. 7) -the third external terminal 15b-the ground side connection land G5-. The through-hole 34b flows through the ground side conductor pattern G (substantially right half portion in FIG. 7) and the common through-hole 35.
[0027]
FIG. 8 is an electrical equivalent circuit diagram of the mounting structure of the three-terminal capacitor 11. In FIG. 8, L1 and L2 are equivalent series inductances based on magnetic fields generated by noise currents Ia and Ib flowing in the left and right directions in the three-terminal capacitor 11, respectively. L3 and L4 are equivalent series inductances based on magnetic fields generated by the noise currents Ic and Id flowing through the ground side connection lands G4 and G5, respectively. L5a is a magnetic field generated by the noise current Ie1 flowing in a portion (a portion on the left outer side below the three-terminal capacitor 11) facing the ground-side connection land G4 of the ground-side conductor pattern G (substantially the left half portion). The equivalent series inductance based on L5b is an equivalent based on the magnetic field generated by the noise current Ie2 flowing in the portion not facing the ground-side connection land G4 (the left-side portion below the three-terminal capacitor 11) of the ground-side conductor pattern G (substantially the left half portion). Series inductance. L6a is a magnetic field generated by the noise current If1 flowing in a portion (a portion on the right outside of the lower side of the three-terminal capacitor 11) facing the ground-side connection land G5 of the ground-side conductor pattern G (substantially right-half portion). The equivalent series inductance based on L6b is an equivalent based on the magnetic field generated by the noise current If2 flowing in the portion not facing the ground-side connection land G5 (the right-side portion below the three-terminal capacitor 11) of the ground-side conductor pattern G (substantially right-half portion). Series inductance.
[0028]
Here, in FIG. 7, a part of the magnetic field generated by the noise current Ia flowing in the left direction in the three-terminal capacitor 11 and the noise current Ib flowing in the right direction (in other words, the equivalent series inductance L1) Part and part of L2 cancel each other out (this is the same as the conventional three-terminal capacitor). Further, the magnetic field (in other words, equivalent series) generated by the noise current Ic flowing through the ground side connection land G4 and the noise current Ie1 flowing through the portion facing the ground side connection land G4 of the ground side conductor pattern G, respectively. Inductances L3 and L5a) cancel each other. Further, the magnetic field generated by the remainder of the noise current Ia and the noise current Ie2 flowing through the portion of the ground side conductor pattern G not facing the ground side connection land G4 (in other words, the remainder of the equivalent series inductance L1 and L5b). ) Cancel each other.
[0029]
Similarly, a magnetic field (in other words, equivalent) generated by a noise current Id flowing through the ground side connection land G5 and a noise current If1 flowing through a portion of the ground side conductor pattern G facing the ground side connection land G5. Series inductances L4 and L6a) cancel each other. Further, the magnetic field generated by the remainder of the noise current Ib and the noise current If2 flowing through the portion of the ground-side conductor pattern G that does not face the ground-side connection land G5 (in other words, the remainder of the equivalent series inductance L2 and L6b). ) Cancel each other. Furthermore, the magnetic fields generated by the remaining noise current Ie2 and the remaining noise current If2 (in other words, the remaining equivalent series inductance L5b and the remaining L6b) cancel each other.
[0030]
As a result, the total equivalent series inductance of the three-terminal capacitor 11 and the circuit board 30 can be reduced to about ½ or less of the conventional one.
[0031]
FIG. 9 shows the insertion loss characteristic (see solid line A4) of the three-terminal capacitor 11 of the second embodiment. For comparison, an insertion loss characteristic (see dotted line A5) of a three-terminal capacitor having a conventional mounting structure is also shown.
[0032]
The three-terminal capacitor is provided with internal electrodes 17a and 17b facing the same layer as shown in FIG. 10, or alternately provided with internal electrodes 17a and 17b as shown in FIG. Also good. These three-terminal capacitors 11 </ b> A and 11 </ b> B also have the same effects as the three-terminal capacitor 11.
[0033]
Further, as shown in FIG. 11, the third external terminal connected to the ground is a third external terminal 15 having a circular shape formed so as to wrap around the central body of the capacitor, and the lower surface of the third external terminal 15. A mounting structure in which the common through hole 35 located in the center is electrically connected via the ground side connection land 51 may be used.
[0034]
As a result, part of the magnetic field generated by the noise current Ia flowing toward the left in the three-terminal capacitor 11B and the noise current Ib flowing toward the right cancel each other (this point is related to the conventional three terminals Like capacitor). Further, the magnetic fields generated by the rest of the noise current Ia and the noise current Ih flowing through the substantially left half of the ground side connection land 51 cancel each other. Similarly, the magnetic fields generated by the remainder of the noise current Ib and the noise current Ii flowing through the substantially right half of the ground side connection land 51 cancel each other. Further, the magnetic fields generated by the remaining noise current Ih and the remaining noise current Ii cancel each other. As a result, the total equivalent series inductance of the three-terminal capacitor 11B and the circuit board 30 can be reduced.
[0035]
[Other Embodiments]
The capacitor mounting structure according to the present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the gist thereof. For example, the ground-side conductor pattern G is not necessarily arranged inside the circuit board 30 and may be provided on the back surface of the circuit board 30. Also in this case, the electrical connection with the ground side conductor patterns G1 to G3 and the ground side connection lands G4 and G5 provided on the surface of the circuit board 30 is performed through the through holes. Furthermore, the chip body is not limited to a multilayer ceramic capacitor, and may be a multilayer capacitor made of a resin material or a composite material. The circuit board 30 may be made of glass ceramic, resin, composite material, or the like.
[0036]
In the first embodiment, when three or more two-terminal capacitors are mounted, the vector sum in the direction of the noise current is preferably zero. For example, as shown in FIG. 12, when three two-terminal capacitors 1A to 1C are mounted, they may be arranged radially at intervals of 120 degrees. In FIG. 12, reference numeral 55 denotes a hot side conductor pattern, and G6 to G8 denote ground side conductor patterns.
[0037]
Further, FIG. 13 shows that the hot-side connection land 56 and the ground side are connected to the large-area hot-side conductor plane 57 and the ground-side conductor plane G provided on different layers inside the circuit board 30 through the through holes 58 and 59. Connection lands G9 and G10 are electrically connected. The through holes 59 a and 59 b prevent a short circuit with the hot-side conductor plane 57 by inserting a large-diameter hole 57 a provided in the hot-side conductor plane 57.
[0038]
FIG. 14 is a schematic cross-sectional view showing another embodiment of a three-terminal capacitor mounting structure used for removing noise current. A multilayer three-terminal capacitor 11 is mounted on the surface of the circuit board 30 with solder or the like. The three-terminal capacitor 11 is the same as that described in the second embodiment, and a detailed description thereof is omitted. On the surface of the circuit board 30 are hot-side connection lands 71 and 72 to which the first external terminal 13 and the second external terminal 14 of the three-terminal capacitor 11 are electrically connected, respectively, and third external terminals 15a and 15b, respectively. An electrically connected ground side connection land G12 (a ground side connection land to which the third external terminal 15b is electrically connected is not shown) is formed.
[0039]
Inside the circuit board 30, line-like hot-side conductor patterns 73 and 74 having a relatively narrow conductor width and a large-area plain-like ground-side conductor pattern G are usually laminated in different layers. The ground side conductor pattern G is electrically connected to the ground side connection land G <b> 12 through a through hole 85 provided in the circuit board 30. The through holes 83 and 84 connected to the other ends of the hot-side conductor patterns 73 and 74 are short-circuited with the ground-side conductor pattern G by inserting a large-diameter hole 77 provided in the ground-side conductor pattern G. It is preventing.
[0040]
The through holes 81, 83 and 82, 84 are preferably disposed at substantially symmetrical positions with respect to the position of the through hole 85. Further, it is preferable that the first external terminal 13 and the second external terminal 14 of the three-terminal capacitor 11 are located at substantially equal distances from the through holes 81 and 82, respectively.
[0041]
The noise current (high-frequency current) that enters the through electrode 16 through the second external terminal 14 is generated through the through hole 83 of the circuit board 30 -the hot side conductor pattern 73 -the through hole 81 -the hot side connection land 71 -the second external terminal. It flows through 14 through electrode 16 internal electrode 17 third external terminals 15a and 15b through hole 85 ground conductor pattern G. On the other hand, the noise current (high-frequency current) that enters the through electrode 16 through the first external terminal 13 is caused by the through hole 84 -the hot side conductor pattern 74 -the through hole 82 -the hot side connection land 72 -the first of the circuit board 30. It flows through the external terminal 13-the through electrode 16-the internal electrode 17-the third external terminals 15a and 15b-the through hole 85-the ground side conductor pattern G.
[0042]
Here, in FIG. 14, part of the magnetic field generated by the noise current Ia flowing to the right in the three-terminal capacitor 11 and the noise current Ib flowing to the left cancel each other (this point is , Similar to conventional three-terminal capacitors). Further, the magnetic fields generated by the noise current Ic flowing through the hot side connection land 71 and the noise current Ie1 flowing through the portion facing the hot side connection land 71 of the hot side conductor pattern 73 cancel each other. Further, the magnetic fields generated by the remaining noise current Ia and the noise current Ie2 flowing through the portion of the hot-side conductor pattern 73 that does not face the hot-side connection land 71 cancel each other.
[0043]
Similarly, the magnetic fields generated by the noise current Id flowing through the hot side connection land 72 and the noise current If1 flowing through the portion facing the hot side connection land 72 of the hot side conductor pattern 74 cancel each other. . Further, the magnetic fields generated by the remaining noise current Ib and the noise current If2 flowing in the portion of the hot side conductor pattern 74 not facing the hot side connection land 72 cancel each other. Further, the magnetic fields generated by the remaining noise current Ie2 and the remaining noise current If2 cancel each other.
[0044]
As a result, the total equivalent series inductance of the three-terminal capacitor 11 and the circuit board 30 can be reduced. Further, a three-terminal capacitor having both the structure of the hot-side conductor pattern of FIG. 14 and the structure of the ground-side conductor pattern of the first and second embodiments may be used.
[0045]
Further, the electrical connection means provided inside the circuit board may be a via hole (the inside of the hole is filled with the conductive paste) in addition to the through hole (the inside peripheral surface of the hole is provided with the conductive paste). .
[0046]
【The invention's effect】
As is clear from the above description, according to the present invention, the noise current flowing in the capacitor and the noise current flowing in the ground side conductor pattern of the circuit board are set so as to be opposite to each other. Magnetic fields generated by noise currents cancel each other. As a result, it is possible to obtain a mounting structure in which the mounting space is small and the cost is low and the equivalent series inductance of the capacitor and the circuit board is small.
[Brief description of the drawings]
FIG. 1 is a plan view showing a first embodiment of a capacitor mounting structure;
2 is a cross-sectional view of the capacitor mounting structure shown in FIG. 1. FIG.
FIG. 3 is a graph showing insertion loss characteristics.
FIG. 4 is a plan view showing a modification of the first embodiment.
5 is a cross-sectional view of the capacitor mounting structure shown in FIG. 4;
FIG. 6 is a plan view showing a second embodiment of a capacitor mounting structure according to the present invention.
7 is a schematic cross-sectional view of the capacitor mounting structure shown in FIG. 6;
8 is an electrical equivalent circuit diagram of the capacitor mounting structure shown in FIG. 6;
FIG. 9 is a graph showing insertion loss characteristics.
FIG. 10 is a schematic cross-sectional view showing a modification of the second embodiment.
FIG. 11 is a schematic cross-sectional view showing another modification of the second embodiment.
FIG. 12 is a plan view showing another embodiment.
FIG. 13 is a schematic cross-sectional view showing another embodiment.
FIG. 14 is a schematic cross-sectional view showing still another embodiment.
FIG. 15 is a plan view showing a conventional capacitor mounting structure;
[Explanation of symbols]
11, 11A, 11B ... 3 terminal capacitor
12 ... Ceramic body
13: First external terminal
14 ... Second external terminal
15a, 15b, 15 ... third external terminal
16 ... Penetration electrode
17, 17a, 17b ... internal electrodes
30 ... Circuit board
31, 38, 39 ... hot side conductor pattern
34a, 34b, 58, 59a, 59b, 81-85 ... through hole
35 ... Common through hole
40, 41, 71, 72 ... hot-side connection land (hot-side conductor pattern)
51 ... Ground side connection land
55, 73, 74 ... Hot side conductor pattern
G6 to G8, G ... Ground side conductor pattern
G4, G5: Ground side connection land (ground side conductor pattern)
G9, G10, G12 ... Ground side connection land
Ia, Ib, Ic, Id, Ie1, Ie2, If1, If2, Ih, Ii ... noise current

Claims (2)

A chip element body, a through electrode provided inside the chip element body, an internal electrode provided so as to face the through electrode, and both end surfaces of the chip element body, A three-terminal capacitor having a first external terminal and a second external terminal electrically connected, and a third external terminal provided on a side surface of the chip body and electrically connected to the internal electrode, A mounting structure of a three-terminal capacitor mounted on a circuit board having a side conductor pattern and a ground side conductor pattern,
In the three-terminal capacitor, the first external terminal and the second external terminal are electrically connected to the hot-side conductor pattern, and the ground-side conductor pattern is provided on at least one of the inside and the back surface of the circuit board. Through the electrical connection means provided in the circuit board, and electrically connected to the third external terminal of the three-terminal capacitor, and the direction of the noise current flowing in the ground-side conductor pattern and the The three-terminal capacitor is mounted on the circuit board so that the directions of noise currents flowing in the three-terminal capacitor are opposite to each other, and the ground-side conductor pattern is disposed. Implementation structure. A chip element body, a through electrode provided inside the chip element body, an internal electrode provided so as to face the through electrode, and both end surfaces of the chip element body, A three-terminal capacitor having a first external terminal and a second external terminal electrically connected, and a third external terminal provided on a side surface of the chip body and electrically connected to the internal electrode, A mounting structure of a three-terminal capacitor mounted on a circuit board having a side conductor pattern and a ground side conductor pattern,
In the three-terminal capacitor, the third external terminal is electrically connected to the ground-side conductor pattern, and the hot-side conductor pattern is provided on at least one of the inside and the back surface of the circuit board, Via the electrical connection means provided in the circuit board, the first external terminal and the second external terminal of the three-terminal capacitor are electrically connected, and the direction of the noise current flowing in the hot-side conductor pattern and the The three-terminal capacitor, wherein the three-terminal capacitor is mounted on the circuit board and the hot-side conductor pattern is disposed so that the directions of noise currents flowing through the three-terminal capacitor are opposite to each other. Implementation structure.

Images