CN111295046A

CN111295046A - Mobile terminal

Info

Publication number: CN111295046A
Application number: CN201910245585.6A
Authority: CN
Inventors: 严进林; 蔡元元; 杨远尧
Original assignee: Spreadtrum Communications Shanghai Co Ltd
Current assignee: Spreadtrum Communications Shanghai Co Ltd
Priority date: 2019-03-28
Filing date: 2019-03-28
Publication date: 2020-06-16

Abstract

A mobile terminal, comprising: PCB board, be fixed in electric capacity group on the PCB board, electric capacity group includes a plurality of paster stromatolite ceramic capacitor, wherein: the capacitor bank at least comprises a first capacitor and a third capacitor which are positioned on the same side face of the PCB, the first capacitor and the third capacitor are arranged in a straight line shape in a first direction, and a first terminal of the first capacitor is parallel to a first terminal of the third capacitor. By adopting the scheme, the howling noise can be reduced, and meanwhile, the cost is considered.

Description

Mobile terminal

Technical Field

The embodiment of the invention relates to the technical field of communication, in particular to a mobile terminal.

Background

In a battery Power supply system of communication equipment such as a mobile phone, a mobile phone battery is connected with a battery connector to supply Power for a Power Management Unit (PMU) and a radio frequency Power amplifier. However, when the Mobile phone is in a Global System for Mobile Communication (GSM) high power transmission or other low frequency and high current conditions, the chip stacked ceramic capacitor on the circuit board is prone to vibrate, thereby causing a howling phenomenon and affecting the Communication quality and effect.

At present, in order to solve the howling problem, tantalum capacitors or howling-preventing terminal capacitors are generally adopted to replace patch laminated ceramic capacitors. However, the above solution is costly.

Disclosure of Invention

The technical problem solved by the embodiment of the invention is that the cost for reducing the howling noise is higher.

To solve the above technical problem, an embodiment of the present invention provides a mobile terminal, including: the method comprises the following steps: PCB board, be fixed in electric capacity group on the PCB board, electric capacity group includes a plurality of paster stromatolite ceramic capacitor, wherein: the capacitor bank at least comprises a first capacitor and a third capacitor which are positioned on the same side face of the PCB, the first capacitor and the third capacitor are arranged in a straight line shape in a first direction, and a first terminal of the first capacitor is parallel to a first terminal of the third capacitor.

Optionally, the first terminal of the first capacitor is adjacent to and connected to the first terminal of the third capacitor; a second terminal of the first capacitor is connected to a second terminal of the third capacitor.

Optionally, the capacitor bank further includes: the first capacitor, the third capacitor, the fourth capacitor and the fifth capacitor are positioned on the same side face of the PCB, a first terminal of the fourth capacitor is parallel to a first terminal of the fifth capacitor, and the first direction is different from the second direction.

Optionally, the first direction is perpendicular to the second direction.

Optionally, the first terminal of the first capacitor, the first terminal of the third capacitor, the first terminal of the fourth capacitor, and the first terminal of the fifth capacitor are connected; a second terminal of the first capacitor, a second terminal of the third capacitor, a second terminal of the fourth capacitor, and a second terminal of the fifth capacitor are connected.

Optionally, the capacitor bank further includes: and the second capacitor and the first capacitor are respectively positioned on different side surfaces of the PCB, and projections of the first capacitor and the second capacitor in the direction vertical to the PCB are superposed.

Optionally, an overlapping portion of the projection of the first capacitor and the second capacitor in the direction perpendicular to the PCB is not less than one half of the first capacitor, and an area of the first capacitor in contact with the PCB is not greater than an area of the second capacitor in contact with the PCB.

Optionally, the projection of the first capacitor and the projection of the second capacitor in the direction perpendicular to the PCB board are completely coincident.

Optionally, the extending directions of the sheet planes of the capacitor and the third capacitor are both parallel to the PCB respectively; or the extending directions of the sheet planes of the first capacitor and the third capacitor are respectively vertical to the PCB.

Optionally, the capacitor bank includes a capacitor bank corresponding to at least one of the following devices in the mobile terminal: the device comprises a radio frequency power amplifier, a battery management chip, a screen backlight circuit, an audio power amplifier, an ambient light sensor and a camera flash lamp.

Compared with the prior art, the technical scheme of the embodiment of the invention has the following beneficial effects:

the third capacitor and the first capacitor which are positioned on the same side face of the PCB in the capacitor bank of the mobile terminal are distributed in a straight line shape in the first direction, the first terminal of the first capacitor is parallel to the first terminal of the third capacitor, and deformation acting forces generated by the first capacitor and the second capacitor can be partially offset, so that acting forces acting on the PCB can be reduced, the influence of the deformation acting forces on the PCB is reduced, the vibration amplitude of the PCB is further reduced, and squeal noise can be further reduced. In addition, other capacitors with higher cost do not need to be adopted to replace the patch laminated ceramic capacitor with lower cost, so that the howling noise can be reduced while the cost is taken into consideration.

Furthermore, the capacitor bank further comprises a fourth capacitor and a fifth capacitor which are located on the same side face as the first capacitor, the fourth capacitor and the fifth capacitor are arranged in a straight line shape in the second direction, a first terminal of the fourth capacitor is parallel to a first terminal of the fifth capacitor, and the first direction is different from the second direction, so that the influence of deformation acting force on the PCB can be further reduced, the vibration amplitude of the PCB is further reduced, and squeaking noise can be further reduced.

Furthermore, the extending directions of the sheet planes of the first capacitor and the third capacitor are respectively perpendicular to the PCB, the deformation acting force of the first capacitor and the third capacitor, which is generated due to the voltage effect, is mainly the acting force parallel to the PCB, and the acting force parallel to the PCB is not directly contacted with the PCB, so that the PCB is less in stress and smaller in vibration amplitude, and the squeaking noise can be further reduced.

Furthermore, the capacitor bank comprises a second capacitor, and the second capacitor is positioned on the other side face of the PCB. When voltage effect occurs, due to the fact that projections of the first capacitor and the second capacitor in the direction perpendicular to the PCB are overlapped, partial acting force generated due to deformation can be mutually offset, the acting force acting on the PCB can be reduced, vibration phenomena of the PCB and the patch laminated ceramic capacitors in the capacitor bank are relieved, and squeaking noise can be further reduced.

Drawings

FIG. 1 is a schematic cross-sectional view of a chip-on-chip ceramic capacitor;

FIG. 2 is a schematic diagram of a relative position of a chip-on-board ceramic capacitor to a PCB under voltage effect;

FIG. 3 is a diagram illustrating a battery-powered system of a mobile terminal in the prior art;

FIG. 4 is a schematic diagram illustrating a linear distribution of capacitors in a capacitor bank according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a cross-shaped distribution of capacitors in a capacitor bank according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of an arrangement of capacitors in a capacitor bank according to an embodiment of the present invention;

FIG. 7 is a schematic diagram of the arrangement of capacitors in another capacitor bank in an embodiment of the invention;

FIG. 8 is a schematic diagram of an arrangement of capacitors in a capacitor bank according to another embodiment of the present invention;

FIG. 9 is a schematic diagram of an arrangement of capacitors in a capacitor bank according to still another embodiment of the present invention;

FIG. 10 is a schematic diagram illustrating relative positions of a portion of capacitors in a capacitor bank and a PCB in an embodiment of the invention;

fig. 11 is a schematic diagram illustrating relative positions of partial capacitors and a PCB in another capacitor bank according to an embodiment of the present invention.

Detailed Description

Under the condition of GSM high-power emission or other low-frequency large currents, a chip laminated ceramic capacitor on a circuit board (PCB) vibrates and drives the PCB to vibrate together.

According to the sound production principle, when the east and west vibrate and the vibration frequency is within the hearing range of human ears, sound production is possible, and vibration occurs and needs to be periodically deformed or moved. Referring to fig. 1, a schematic cross-sectional view of a chip-on-chip ceramic capacitor is shown. The chip multilayer ceramic capacitor 10 includes electrodes 11, terminals 12, and a sheet structure 13 made of a ceramic material. Currently, the chip stacked ceramic capacitor 10 is usually disposed side by side on one side of the PCB board. The patch laminated ceramic capacitor 10 has electrostrictive characteristics, i.e., voltage effect.

Referring to fig. 2, a schematic diagram of the relative position of a chip-on-chip ceramic capacitor to a PCB under the effect of voltage is shown. When a large voltage ripple exists at two ends of the chip ceramic capacitor, the chip multilayer ceramic capacitor 10 can expand and contract in the vertical and horizontal directions of the PCB 20, and the chip multilayer ceramic capacitor 10 and the PCB 20 vibrate together. The solid line shows the shapes of the chip multilayer ceramic capacitor 10 and the PCB 20 when no voltage effect is generated, and the dotted line shows the shapes of the chip multilayer ceramic capacitor 10 'and the PCB 20' after the voltage effect is generated. When the chip multilayer ceramic capacitor 10 generates a voltage effect, the chip multilayer ceramic capacitor 10 is deformed by stretching outward in a direction perpendicular to the sheet multilayer structure 13. Under the pulling force of the outward tensile deformation in the vertical direction, the chip multilayer ceramic capacitor 10 shrinks inward in the horizontal direction with respect to the sheet multilayer structure 13, and the direction of the arrow in fig. 2 is the direction of the acting force when the chip multilayer ceramic capacitor 10 deforms.

Referring to fig. 3, a diagram of a battery power supply system of a mobile terminal in the prior art is provided. The mobile phone battery is connected with the battery connector and mainly supplies power for the PMU and the GSM PA (GSM power amplifier). When a GSM call is transmitted with a weak signal, i.e. the GSM PA maximum power, the current is about 1.7A, and the frequency is 217 Hz.

The battery supplies power to the GSM PA, and the impedance on the line is R1+ R2+ R3, where R1 is PCB trace impedance, R2 is battery internal resistance, R3 is battery connector impedance, and the battery level detector (Fuel gauge) resistor R5 and R5 are typically 10m Ω. The GSM PA end capacitor group includes capacitors C1, C2, C3 and C4, and the GSM PA end voltage ripple dV can be calculated by formula (1):

dV＝I×(R1+R2+R3+R5)＝1.7×(R1+R2+R3+R5)； (1)

if R1+ R2+ R3+ R5 is 0.15 Ω, the voltage ripple dV is 1.7 × (R1+ R2+ R3+ R5) is 0.255V.

The PMU end capacitor group comprises capacitors C6, C7, C8, … … and CX. At this time, the voltage ripple at the PMU end is large, and the ripple dV 'is I × (R2+ R3+ R5), where R2+ R3+ R5 is about 0.13 Ω, and R4 is about 0.02 Ω, the voltage ripple dV' can be calculated by using equation (2):

dV’＝I×(R2+R3+R5)＝1.7×0.13＝0.221V；(2)

from the above calculation results, the voltage ripple amplitude of the GSM PA end is large, and the frequency thereof is 217Hz, so that the GSM tends to generate howling at the weak signal communication PA end in the hearing range of human ears. In addition, the voltage ripple amplitude of the PMU end is also large, and the frequency of the voltage ripple is 217Hz, so that howling is easily caused by a large amount of capacitors of the PMU end in the hearing range of human ears.

In summary, when the mobile phone is in a GSM call with a weak signal, when the voltage ripple is at a low frequency and has a large amplitude, a whistling of the mobile phone capacitor is generated, which affects the call quality and the call effect.

In the embodiment of the invention, the third capacitor and the first capacitor which are positioned on the same side of the PCB in the capacitor bank of the mobile terminal are distributed in a straight line shape in the first direction, the first terminal of the first capacitor is parallel to the first terminal of the third capacitor, and deformation acting forces generated by the first capacitor and the second capacitor can be partially offset, so that acting forces acting on the PCB can be reduced, the influence of the deformation acting forces on the PCB is reduced, the vibration amplitude of the PCB is further reduced, and howling noise can be further reduced. In addition, other capacitors with higher cost do not need to be adopted to replace the patch laminated ceramic capacitor with lower cost, so that the howling noise can be reduced while the cost is taken into consideration.

In order to make the aforementioned objects, features and advantages of the embodiments of the present invention more comprehensible, specific embodiments accompanied with figures are described in detail below.

Referring to fig. 4, a schematic diagram of a capacitor in a capacitor bank in a linear distribution according to an embodiment of the present invention is shown.

In an implementation, the mobile terminal may include a PCB 50 and a capacitor bank fixed to the PCB 50. The capacitor bank may include a number of chip-on-chip ceramic capacitors, each chip-on-chip ceramic capacitor including a multilayer chip structure. For convenience of description, in the following embodiments of the present invention, the patch laminated ceramic capacitor is simply referred to as a capacitor.

The capacitor bank may include at least a first capacitor 51 and a third capacitor 53. The third capacitor 53 and the first capacitor 51 are located on the same side of the PCB 50. The third capacitor 53 and the first capacitor 51 are located on the front surface of the PCB 50, or may be located on the back surface of the PCB 50. The third capacitor 53 and the first capacitor 51 are distributed in a straight line shape in the first direction, and the first terminal 511 of the first capacitor 51 is parallel to the first terminal 531 of the third capacitor 53, that is, the second terminal 512 of the first capacitor 51, the second terminal 532 of the third capacitor 53, the first terminal 511 of the first capacitor 51, and the first terminal 531 of the third capacitor 53 are all parallel to each other. The first direction shown in fig. 4 is a horizontal direction, and it is understood that the first direction may be other directions.

In the embodiment of the present invention, when the capacitors in the capacitor bank are distributed in a straight line on the front or back of the PCB 50, the first terminal 511 of the first capacitor 51 and the first terminal 531 of the third capacitor 53 are connected together to form a termination power supply; the second terminal 512 of the first capacitor 51 and the second terminal 532 of the third capacitor 53 are connected together at one end to ground. Fig. 4 illustrates only 2 capacitors on one side of the PCB 50. It can be understood that the number of the capacitors distributed in a word may be more than 2, and more than 2 capacitors may be arranged in a word. The capacitors on the other side of the PCB 50 may also be arranged in the same manner. The direction of the arrow in fig. 4 indicates the direction of the deformation acting force generated by the first capacitor 51 or the third capacitor 53 under the voltage effect, and as can be seen from fig. 4, the directions of the deformation acting forces generated at the adjacent positions of the first capacitor 51 and the third capacitor 53 are opposite, and a part of the acting force can be offset, so that the acting force acting on the PCB 50 can be reduced, the influence of the acting force on the PCB 50 can be reduced, the vibration amplitude of the PCB 50 can be further reduced, and the howling noise can be reduced.

According to the scheme, the third capacitor and the first capacitor which are positioned on the same side face of the PCB in the capacitor bank of the mobile terminal are distributed in a straight line shape in the first direction, the first terminal of the first capacitor is parallel to the first terminal of the third capacitor, and deformation acting forces generated by the first capacitor and the third capacitor can be partially offset, so that acting forces acting on the PCB can be reduced, the influence of the deformation acting forces on the PCB is reduced, the vibration amplitude of the PCB is further reduced, and howling noise can be further reduced. In addition, the purpose of reducing the squeaking noise can be achieved without adopting other capacitors with higher cost to replace patch laminated ceramic capacitors with lower cost, so that the squeaking noise can be reduced while the cost is taken into consideration.

Referring to fig. 5, a schematic diagram of a capacitor in a capacitor bank in a cross-shaped distribution according to an embodiment of the present invention is shown. The cross-shaped distribution is suitable for the situation when the number of capacitors on the same side of the PCB 50 in the capacitor bank is greater than or equal to 4.

The capacitor bank may further include fourth and

fifth capacitors

54 and 55 arranged in a line in the second direction. The fourth capacitor 54, the fifth capacitor 55 and the first capacitor 51 are located on the same side, the first terminal 541 of the fourth capacitor 54 is parallel to the first terminal 551 of the fifth capacitor 55, and the first direction is different from the second direction.

In an embodiment of the present invention, the first direction is perpendicular to the second direction. The first direction shown in fig. 5 is a horizontal direction, the second direction is a vertical direction, and the capacitors on the same side of the PCB are arranged in a cross shape. It can be understood that, according to the practical application scenario and the application requirement, the first direction or the second direction may also be other directions, and the angle between the first direction and the second direction may also be a non-perpendicular angle.

The first terminal 511 of the first capacitor 51, the first terminal 531 of the third capacitor 53, the first terminal 541 of the fourth capacitor 54 and the first terminal 551 of the fifth capacitor 55 which are arranged in a cross shape can be connected together to be used as a termination power supply; the second terminal 512 of the first capacitor 51, the second terminal 532 of the third capacitor 53, the second terminal 542 of the fourth capacitor 54, and the second terminal 552 of the fifth capacitor 55 may be connected together as one end to ground. The directions of arrows in fig. 5 indicate the directions of the deformation forces generated by the first capacitor 51, the third capacitor 53, the fourth capacitor 54 and the fifth capacitor 55 under the voltage effect. As can be seen from fig. 5, the directions of the deformation acting forces generated by the first capacitor 51 and the third capacitor 53 at the adjacent positions are opposite, and the directions of the deformation acting forces generated by the fourth capacitor 54 and the fifth capacitor 55 at the adjacent positions are opposite, so that when the generated deformation acting forces act on the PCB 50, a part of the acting forces can be offset, thereby reducing the acting forces acting on the PCB 50, further reducing the vibration amplitude of the PCB 50, and further reducing the howling noise.

In specific implementation, the capacitors are arranged in a straight line or a cross shape on the same side of the PCB 50, and the extending direction of the sheet-shaped plane of the capacitor may be parallel to the PCB 50 or perpendicular to the PCB 50.

Referring to fig. 6, a schematic diagram of the arrangement of the capacitors in the capacitor bank according to the embodiment of the present invention is shown, where the extending directions of the plate-shaped planes 51a of the first capacitors 51 and the extending directions of the plate-shaped planes 53a of the third capacitors 53 are all parallel to the PCB 50.

Referring to fig. 7, a schematic diagram of the arrangement of the capacitors in another capacitor bank in the embodiment of the present invention is shown, wherein the extending direction of the plate-shaped plane 51a of the first capacitor 51 and the extending direction of the plate-shaped plane 53a of the third capacitor 53 are both perpendicular to the PCB 50.

In specific implementation, according to the number of capacitors in the capacitor bank, the requirement for howling noise, and the like, the capacitors on the same side of the PCB 50 may have other deformations, such as being arranged in a shape of a Chinese character 'mi', or in other shapes, which all belong to the protection scope of the embodiment of the present invention, and are not described herein again.

Referring to fig. 8, a schematic diagram of the arrangement of the capacitors in another capacitor bank in the embodiment of the present invention is shown. Fig. 8 is a schematic diagram showing a mixed distribution of in-line and cross-shaped capacitors in the capacitor bank. The

capacitors

84, 82 and 86 are arranged in a straight line, the

capacitors

81 and 83 are arranged in a straight line, and the capacitors 85 and 87 are arranged in a straight line. The capacitor 81, the capacitor 82, the capacitor 83 and the capacitor 84 are distributed in a cross shape. The capacitor 82, the capacitor 85, the capacitor 86 and the capacitor 87 are distributed in a cross shape.

Referring to fig. 9, a schematic diagram of an arrangement of capacitors in another capacitor bank according to an embodiment of the present invention is shown. The capacitor 84, the capacitor 82, the capacitor 88 and the capacitor 89 are arranged in a straight line, the capacitor 81 and the capacitor 83 are arranged in a straight line, and the capacitor 81, the capacitor 82, the capacitor 83 and the capacitor 84 are arranged in a cross shape.

In a specific implementation, the capacitor bank may include a second capacitor 52. The first capacitor 51 and the second capacitor 52 are respectively located at two sides of the PCB 50, that is, the first capacitor 51 and the second capacitor 52 are located at different sides of the PCB 50, and the first capacitor 51 and the second capacitor 52 are arranged back to back. For example, in fig. 10, the first capacitor 51 is located on the front surface of the PCB 50, and the second capacitor 52 is located on the back surface of the PCB 50. For another example, the first capacitor 51 is located on the back side of the PCB 50, and the second capacitor 52 is located on the front side of the PCB 50. The first capacitor 51 and the second capacitor 52 have a projection in a direction perpendicular to the PCB 50.

The direction of the arrow in fig. 10 is a deformation force generated when the first capacitor 51 and the second capacitor 52 are deformed when the voltage effect is generated. The direction of the deformation acting force generated by the deformation of the first capacitor 51 in the direction perpendicular to the PCB 50 is opposite to the direction of the deformation acting force generated by the deformation of the first capacitor 52 in the direction perpendicular to the PCB 50, so that a part of the acting force can be offset, and the influence of the deformation acting force generated by the first capacitor 51 and the second capacitor 52 on the PCB 50 can be reduced, thereby reducing the vibration of the PCB 50, reducing the vibration amplitude of the PCB 50, and further reducing the squeal noise.

In a specific implementation, in order to improve the howling noise reduction effect, in an embodiment of the present invention, an overlapping portion of projections of the first capacitor 51 and the second capacitor 52 in a direction perpendicular to the PCB 50 is not less than one half of the first capacitor 51, and an area of the first capacitor 51 in contact with the PCB 50 is not greater than an area of the second capacitor 52 in contact with the PCB 50.

In a specific implementation, the projections of the first capacitor 51 and the second capacitor 52 in the direction perpendicular to the PCB 50 may completely coincide.

In a specific implementation, when the first capacitor 51 and the second capacitor 52 are arranged relative to the PCB 50, there may be a plurality of arrangements.

In an embodiment of the present invention, as shown in fig. 10, an extending direction of a sheet plane formed by the sheet structure 51a of the first capacitor 51 may be parallel to the PCB 50; the extending direction of the sheet plane formed by the sheet structure 52b of the second capacitor 52 may be parallel to the PCB 50.

In another embodiment of the present invention, as shown in fig. 11, the extending direction of the plate-shaped plane 51a of the first capacitor 51 is perpendicular to the PCB 50, the extending direction of the plate-shaped plane 52b of the second capacitor 52 may also be perpendicular to the PCB 50, and the direction of the arrow in fig. 11 indicates the direction of the deformation force generated by the voltage effect of the first capacitor 51 and the second capacitor 52. The extending directions of the sheet planes of the first capacitor 51 and the second capacitor 52 are perpendicular to the PCB 50, and when the first capacitor 51 and the second capacitor 52 generate voltage effect, because the first capacitor 51 and the second capacitor 52 are welded on two side surfaces of the PCB 50, the direction of the acting force of the first capacitor 51 on the PCB 50 due to deformation is opposite to the direction of the acting force of the second capacitor 52 on the PCB 50 due to deformation, so that part of the acting force can be counteracted. Most importantly, the deformation acting force of the first capacitor 51 and the second capacitor 52 generated by the voltage effect is mainly the acting force in the direction parallel to the PCB 50, and the acting force in the direction parallel to the PCB 50 is not directly contacted with the PCB 50, so that the influence on the PCB 50 is small, the stress on the PCB 50 is small, and the vibration amplitude is small, thereby further reducing the squeal noise.

In a specific implementation, since the capacitance value of the capacitor is related to the volume of the capacitor, the larger the capacitance value of the capacitor is, the larger the volume of the capacitor is, and the larger the volume of the capacitor is, the larger the noise caused by the squeal due to the vibration may be, therefore, when the capacitors in the capacitor bank are arranged, the capacitors with the same or no difference in capacitance value may be arranged as a pair on two sides of the PCB 50.

In the embodiment of the present invention, the capacitance values of the first capacitor 51 and the second capacitor 52 may be greater than or equal to 1 μ F. It can be understood that the capacitance value of the selected capacitor can also be adjusted according to the requirements of the actual application scenario. For capacitors with large capacitance values, the capacitance volume is large, and the influence on the vibration of the PCB 50 is large, and the capacitors can be arranged on both sides of the PCB 50 according to the arrangement method provided by the above embodiment of the present invention. For the capacitor with the capacitance value less than 1 μ F, because the capacitance value is small, the volume is also small, the vibration influence on the PCB 50 during vibration is also small, and the capacitor can be arranged according to actual requirements, and can be uniformly arranged on the front side of the PCB 50, also can be uniformly arranged on the back side of the PCB 50, and also can be pairwise distributed on the front side and the back side of the PCB 50 in a back-to-back manner.

It is to be understood that when the capacitors in the capacitor bank in the mobile terminal are arranged, any of the capacitor arrangements provided in the above embodiments of the present invention may be combined by itself, and are not illustrated here.

In a specific implementation, the capacitor bank may include a capacitor bank corresponding to at least one of a radio frequency power amplifier, a battery management chip, a screen backlight circuit, an audio power amplifier, an ambient light sensor, and a camera flash in the mobile terminal.

In a specific implementation, the radio frequency Power Amplifier (PA) may be a GSM PA, a 3G PA, a 4GPA, or a 5G PA. It is understood that PAs corresponding to other types of communication modules are also possible.

It can be understood that, in other application scenarios with the problem of capacitance howling, the layout manner of the capacitors may refer to the layout description of the capacitors in the capacitor bank of the mobile terminal provided in the above embodiment of the present invention, and details are not described here.

Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A mobile terminal, comprising: the method comprises the following steps: PCB board, be fixed in electric capacity group on the PCB board, electric capacity group includes a plurality of paster stromatolite ceramic capacitor, wherein:

the capacitor bank at least comprises a first capacitor and a third capacitor which are positioned on the same side face of the PCB, the first capacitor and the third capacitor are arranged in a straight line shape in a first direction, and a first terminal of the first capacitor is parallel to a first terminal of the third capacitor.

2. The mobile terminal of claim 1, wherein the first terminal of the first capacitor is adjacent to and connected to the first terminal of the third capacitor; a second terminal of the first capacitor is connected to a second terminal of the third capacitor.

3. The mobile terminal of claim 1, wherein the capacitor bank further comprises: the first capacitor, the third capacitor, the fourth capacitor and the fifth capacitor are positioned on the same side face of the PCB, a first terminal of the fourth capacitor is parallel to a first terminal of the fifth capacitor, and the first direction is different from the second direction.

4. The mobile terminal of claim 3, wherein the first direction is perpendicular to the second direction.

5. The mobile terminal of claim 3, wherein the first terminal of the first capacitor, the first terminal of the third capacitor, the first terminal of the fourth capacitor, and the first terminal of the fifth capacitor are connected; a second terminal of the first capacitor, a second terminal of the third capacitor, a second terminal of the fourth capacitor, and a second terminal of the fifth capacitor are connected.

6. The mobile terminal of claim 1, wherein the capacitor bank further comprises: and the second capacitor and the first capacitor are respectively positioned on different side surfaces of the PCB, and projections of the first capacitor and the second capacitor in the direction vertical to the PCB are superposed.

7. The mobile terminal of claim 6, wherein the projection of the first capacitor and the second capacitor in the direction perpendicular to the PCB overlaps by no less than one-half of the first capacitor, and the area of the first capacitor in contact with the PCB is no greater than the area of the second capacitor in contact with the PCB.

8. The mobile terminal of claim 7, wherein the first capacitance and the second capacitance have a projection that is substantially coincident in a direction perpendicular to the PCB.

9. The mobile terminal of claim 1, wherein the extending directions of the sheet planes of the first capacitor and the third capacitor are parallel to the PCB respectively; or the extending directions of the sheet planes of the first capacitor and the third capacitor are respectively vertical to the PCB.

10. The mobile terminal of any of claims 1 to 9, wherein the capacitance group comprises a capacitance group corresponding to at least one of the following devices in the mobile terminal:

the device comprises a radio frequency power amplifier, a battery management chip, a screen backlight circuit, an audio power amplifier, an ambient light sensor and a camera flash lamp.