JP3942456B2 - Electronic equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic device that houses a circuit board on which an integrated circuit element such as a CPU or an LSI that requires countermeasures against heat generation is mounted in a single case.
[0002]
[Prior art]
In recent years, semiconductor integrated circuit elements such as CPUs and LSIs having a microelectronic circuit in which elements having a large number of semiconductors and internal wirings are combined as one solid by a special method have been increasingly used. . An integrated circuit device having such a microelectronic circuit generates a large amount of heat during operation. When the temperature of the integrated circuit element rises, a problem that its operation becomes unstable occurs, and when the temperature rises further, the semiconductor is destroyed. Therefore, the heat sink is attached to the integrated circuit element to exchange heat between the heat sink and the air, and the heat of the integrated circuit element is released into the air to cool the integrated circuit element. It prevented unstable operation and thermal destruction due to high temperatures.
[0003]
On the other hand, in a data communication network using a communication line and a computer network (LAN) that performs high-speed data transfer using a private line within a limited range such as in a building or site, an integrated circuit element as described above is used. A server provided with a large number of electronic devices using the. That is, in such a server, the temperature rises significantly due to the operation of a large number of integrated circuit elements. Conventionally, the entire room where the server is installed is cooled by a cooling device, the cold air is taken into the electronic device, and the integrated circuit elements are installed. A method of cooling was taken.
[0004]
[Problems to be solved by the invention]
Conventionally, however, cold air is taken in by a propeller fan (blower) provided on the back of the electronic device so that the flow of cold air generated in the electronic device hits the integrated circuit element. It was not a good cooling efficiency.
[0005]
Therefore, a part of the cool air taken into the case by the blower has been discharged outside the electronic device without cooling the integrated circuit element.
[0006]
The present invention has been made to solve the problems of the related art, and an object thereof is to provide an electronic device in which the cooling efficiency of an integrated circuit element using brine is improved.
[0007]
[Means for Solving the Problems]
In other words, the electronic device according to the present invention stores a circuit board on which a plurality of integrated circuit elements that need countermeasures against heat generation are mounted in a single case, and each integrated circuit element can be moved by heat. A cold plate attached to each circuit element, a brine heated by each cold plate circulates, a heat exchanger that cools this brine, and a crossflow fan provided in an opening on one side of the case leads to the heat exchanger Each of the cold plates is composed of a fan casing constituting an air passage, a reserve tank for storing brine and a pump for circulating the brine, and a cold plate provided in order in the flow of brine from the heat exchanger to the cold plate. And at least a pair of reciprocating linear brine passages in between, Along with the air inflow side of the exchanger, a plurality of radiating fins are provided on the side opposite to the integrated circuit element of each cold plate, and after the air from the cross flow fan is blown to the heat exchanger, the circuit It is configured to reach the substrate , and a cold plate blower is attached to the heat dissipating fin .
[0008]
According to a second aspect of the present invention, in addition to the above-described invention, the cold plate blower includes a centrifugal blower type fan.
[0009]
In addition to the above-described inventions, the electronic device according to a third aspect of the present invention includes at least either a blower fan or a pump so that when the temperature near the outer periphery of the case is + 35 ° C. or higher, the temperature of the cold plate is + 70 ° C. It has a control part which controls either.
[0010]
According to the present invention, there is provided an electronic device that houses a circuit board on which a plurality of integrated circuit elements that require countermeasures against heat generation are mounted in a single case, and each integrated circuit element is capable of heat transfer from the integrated circuit element. Cold plates attached to each of them, brine heated by each cold plate circulates, a heat exchanger that cools the brine, and an air passage that leads from the crossflow fan provided in the opening on one side of the case to the heat exchanger Are arranged in order in the flow of the brine from the heat exchanger to the cold plate, the reserve tank for storing the brine and the pump for circulating the brine, and the cold plate are arranged between the cold plates. A cross-flow fan as a heat exchanger and at least a pair of reciprocating linear brine flow paths Along with the air inflow side, a plurality of heat radiation fins are provided on the opposite side of each cold plate to the integrated circuit element, and the air from the cross flow fan is blown to the heat exchanger and then reaches the circuit board. As a result, the heat generated by the integrated circuit element of the cold plate can be cooled by the radiation fins in addition to the cooling by the brine, so that rapid and accurate cooling of the integrated circuit element can be realized. become able to.
[0011]
In particular, since the cold plate air blower is attached to the heat dissipating fin, in addition to the above, the heat dissipating fin can be forcibly cooled by the air blower such as the cold plate. It becomes possible to realize the cooling.
[0012]
According to the invention of claim 2, in the above invention , since the cold plate blower device includes the centrifugal blower type fan, the cold plate is forcibly cooled by a fan having a relatively small height. As a result, the apparatus can be reduced in size.
[0013]
According to the invention of claim 3, in addition to each of the above inventions , when the temperature in the vicinity of the outer periphery of the case is + 35 ° C. or higher, at least either the blower fan or the pump is set so that the temperature of the cold plate becomes + 70 ° C. or lower. Since the control part which controls one side is provided, the cooling capability by a cold plate can be controlled now by a ventilation fan or a pump. As a result, it is possible to quickly increase the cooling capacity against sudden heat generation of the integrated circuit element, and to avoid the occurrence of damage to the element.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a front view of a server rack 2 on which a plurality of servers 1 as an embodiment of an electronic apparatus to which the present invention is applied, and FIG. 2 is a perspective view of the server 1 as an embodiment of the electronic apparatus of the present invention. 3 is a perspective view of the server 1 with the top cover 4 of the case 3 removed, and FIG. 4 is a plan view of the server 1 of FIG.
[0015]
In each figure, a server (1U server) 1 according to the embodiment is a center for providing various services to a computer connected to a network, and a frame 2B of a server rack 2 having a caster 2A for movement on the bottom surface. And a plurality of units are installed over a plurality of upper and lower stages. Each server 1 houses a circuit board 5 on which a plurality of semiconductor integrated circuit elements 6 such as LSI and CPU are mounted. In addition, a controller 52 is provided at the lower part of the server rack 2 for managing task assignments and operating conditions to each server 1.
[0016]
The server 1 has a circuit board 5, a flexible disk drive 31, a CD-ROM drive 32, a power supply circuit (POWER) 9, a connector (I) in a case 3 having a thin rectangular shape with a height of 45 mm, a width of 450 mm, and a depth of 530 mm, for example. / O) In addition to electronic components such as 8, a plate fin type heat exchanger 11, a cross flow fan 14 as a blower fan, a pump 15 for circulating brine, a reserve tank 26 for storing brine, an integrated circuit element 6 And a brine cooling device 10 that includes a cold plate 16 or the like that is attached so as to be capable of heat transfer and cools the integrated circuit element 6. The case 3 includes a front surface 3A, a bottom surface 3B, a rear surface 3C, and left and right side surfaces 3D and 3D, and an upper surface is covered with a removable upper surface cover 4.
[0017]
In this case, the flexible disk drive 31 and the CD-ROM drive 32 face the right end of the front surface 3A of the case 3 and an opening 30 is formed on the left side thereof. The heat exchanger 11 is disposed in the case 3 corresponding to the inside of the opening 30. The heat exchanger 11 has a plurality of plates 12 having heat conductivity such as aluminum thin plates arranged at intervals of 1 mm to 5 mm, and penetrates through these plates 12 so that heat can be transferred. It is comprised from the meandering aluminum piping 13 which flows.
[0018]
In addition, when the space | interval of the plate 12 is narrow, the air filter 34 mentioned later of an appropriate eye is used, and when a space | interval is wide, safety structures, such as a slit, are used instead of the air filter 34.
[0019]
Further, a fan casing 39 of the cross flow fan 14 is disposed on the opening 30 side of the heat exchanger 11 so as to correspond to the opening 30. Thereby, the cross flow fan 14 is provided in the vicinity of the opening 30. The fan casing 39 is for forming an air passage connected to the heat exchanger 11 from the opening 30. The opening 33 of the fan casing 39 faces the outside while facing downward from the opening 30 of the case 3, and An air filter 34 for removing dust is attached.
[0020]
A curved opening angle adjusting plate 36 is attached to the upper edge of the opening 33 of the fan casing 39 in a bowl shape. The opening angle adjusting plate 36 can be freely engaged with and disengaged from ribs 37A projecting at a predetermined interval in the front-rear direction on a locking plate 37 provided in the upper part of the opening 33. By changing the position of the mating rib 37A, the amount protruding from the upper edge of the opening 33 can be changed in three stages. As a result, the amount of protrusion on the extension of the fan casing 39 can be changed, and the downward angle of the opening 33 can be changed in three stages such as 15 °, 30 °, and 45 ° from the horizontal. Inhalation of air from the combined direction is effectively performed.
[0021]
Here, in the computer room in which this kind of server rack 2 is installed, a circulation path in which cooling air is blown from the floor side and sucked from the ceiling side is configured. As described above, the server 1 is attached to the server rack 2 in a plurality of stages. In the upper server 1, the downward angle of the opening 33 is shallow (closer to the horizontal), and in the lower server 1, the downward angle of the opening 33 is set. By deepening (directing downward), the cooling air rising from the floor surface can be easily and smoothly taken in from the opening 33 and circulated in the case 3 by each stage of the server 1. It becomes like this. The cooling air (cold air) flows through the case 3 and is discharged from the back surface (rear surface) of the case 3.
[0022]
Further, a rectifying flap plate 38 is attached to the fan casing 39 on the rear side of the cross flow fan 14, that is, on the heat exchanger 11 side, and air from the cross flow fan 14 strikes the heat exchanger 11 in a biased manner. Is preventing. Further, on both sides of the fan casing 39, air passage members 41 extending to both sides and the lower side of the plurality of plates 12 of the rear heat exchanger 11 are integrally formed. The air passage member 41 may be constituted by an extension member that is separate from the fan casing 39.
[0023]
Here, the upper edge of the plate 12 of the heat exchanger 11 is in contact with the upper surface cover 4 of the case 3, and the lower edge is in contact with the lower surface of the air passage member 41 in contact with the bottom surface 3 </ b> B of the case 3. Since the left and right surfaces of the air passage member 41 are positioned on the left and right sides of the outermost plate 12, the casing of the heat exchanger 11 is configured by these. Further, the air passage member 41 of the fan casing 39 concentrates the air from the cross flow fan 14 on the plates 12 of the heat exchanger 11.
[0024]
As a result, the air sucked into the case 3 is guided only to the space between the plates 12 of the heat exchanger 11, so that a decrease in heat exchange efficiency that occurs when the air leaks to other locations is avoided. The heat exchange efficiency with the brine flow in the heat exchanger 11 described later is improved.
[0025]
In this case, the cross flow fan 14 corresponds along the longitudinal direction (left-right direction) on the air inflow side (front side) of the heat exchanger 11, and the air sucked from the opening 30 (opening 33) Supply in a line along the longitudinal direction. Thereby, the air sucked into the case 3 from the opening 30 by the cross flow fan 14 can be efficiently blown to the heat exchanger 11. Reference numeral 14M denotes a motor of the cross flow fan 14 (a DC motor whose rotational speed changes according to the applied voltage), and is attached to the outer surface of the fan casing 39.
[0026]
On the other hand, vents 42 and 42 are formed on the left and right of the rear surface 3C of the case 3, and exhaust fans 43 are attached to the vents 42 and 42, respectively. The circuit board 5 is located on the bottom surface 3 </ b> B of the case 3 so as to be positioned between the heat exchanger 11 and the vent holes 42 and 42. Further, the power supply circuit 9 is provided corresponding to the inside of the left vent 42. In addition, a plurality of vent holes 44 are formed on the left and right side surfaces 3D and 3D of the case 3 at a position surrounding the circuit board 5 by cutting the side surfaces 3D and 3D corresponding to the circuit board 5 inward. (FIG. 6). Note that the raising and lowering of the vent 44 is directed obliquely rearward.
[0027]
When the cross flow fan 14 is operated, the air sucked into the case 3 from the opening 30 is blown to the heat exchanger 11 and passes between the plates 12 to reach the circuit board 5. Thereafter, it passes through the cold plate 16... And the periphery of the power supply circuit 9, is sucked into the blower fans 43 and 43, and is discharged to the outside through the vent holes 42 and 42. As a result, a series of ventilation paths from the opening 30 to the vent holes 42 and 42 are formed in the case 3.
[0028]
Also, fresh air (outside air that has not passed through the heat exchanger 11) is sucked from the vent holes 44 formed in the side surfaces 3D and 3D by such ventilation, and passes through the cold plate 16 on the circuit board 5 and the periphery. Similarly, the air is discharged from the vents 42 and 42. Thereby, it is possible to avoid an abnormal rise in the temperature in the case 3 due to the air exchanged with the heat exchanger 11 and to improve the air cooling effect of the cold plate 16. Moreover, since the vent hole 44 is formed by cutting and raising, the productivity of the case 3 is also improved.
[0029]
The brine outlet 13A of the pipe 13 of the heat exchanger 11 is arranged at the upper end of the front left side toward the heat exchanger 11, and the pipe 46 connected to the outlet 13A is connected to the inlet of the reserve tank 26. ing. A pipe 47 connected from the outlet of the reserve tank 26 is connected to a suction port of the pump 15, and a discharge port of the pump 15 is connected to an inlet of an aluminum pipe 23 of the cold plate 16 described later. The outlet of the pipe 23 is connected to the brine inlet 13 </ b> B of the pipe 13 of the heat exchanger 11 via the pipe 48 to constitute an annular brine circulation path of the brine cooling device 10. That is, the reserve tank 26 and the pump 15 are sequentially provided in the flow of brine from the outlet 13 </ b> A of the heat exchanger 11 toward the cold plate 16. Then, brine is enclosed in the annular brine circulation path.
[0030]
As the brine, a liquid heat medium that does not boil due to the heat generated by the integrated circuit element 6 is used. In the embodiment, the brine is filled with antifreeze. The brine may be normal water, pure water, HFE (hydrofluoroether), or the like.
[0031]
In this case, the inlet 13B of the pipe 13 of the heat exchanger 11 is directly below the outlet 13A at the left front portion of the heat exchanger 11, and these inlet 13B and outlet 13A (at least the outlet 13A) are positioned higher than the cold plate 16. Is arranged. In addition, the bottom surface 3B of the case 3 at a position corresponding to the lower side of the heat exchanger 11 is set higher than the other parts (FIG. 7). A lower portion 49 lower than the lower end of the vessel 11 is formed. The outlet 13A and the inlet 13B of the pipe 13 of the heat exchanger 11, the pipes 46 and 48, the reserve tank 26, the pump 15 and the pipe 47 (these pipes become pipes through which brine circulates) are all in this lower portion. 49 or correspondingly above.
[0032]
The circuit board 5 is attached by being raised by a spacer at a position higher than the upper surface of the lower portion 49. In addition, the reserve tank 26 and the pump 15 are disposed in the front part on the lower part 49. Further, the upper surface of the lower portion 49 as a whole is inclined lower forward (FIG. 8), and a detection sensor 51 for detecting the brine when the brine is accumulated is attached to the lowest front end portion.
[0033]
With such a configuration, the inlet / outlet 13A, 13B of the pipe 13 of the heat exchanger 11 and the pipes 46, 47, 48, 23, the reserve tank 26, the pump 15, etc. are connected to each other, and cracks / damage are generated in the brine. Even in the case of leakage, the leaked brine flows down along the slope of the lower portion 49 of the bottom surface 3 </ b> B of the case 3 and is collected at the front portion in the lower portion 49. As a result, it is possible to delay and avoid the inconvenience that the circuit board 5, the integrated circuit element 6 attached thereto, the pump 15, the heat exchanger 11 and the like are immersed in brine and cause a failure as much as possible. .
[0034]
In particular, since the outlet 13A of the heat exchanger 11 is located higher than the cold plate 16, even if a connection failure with the pipe 48 occurs at the outlet 13A portion, the heat exchanger until the pump 15 is stopped as will be described later. It is possible to minimize the amount of brine that leaks out of the inside. The brine leaking to the lower portion 49 is detected by the detection sensor 51 described above, and the pump 15 is stopped and an alarm is output as will be described later. Further, when the rib 50 is erected from the bottom surface 3B of the case 3 and the brine leaks between the lower portion 49 and the heat exchanger 11 and the circuit board 5, the brine flows toward the circuit board 5 side. It is preventing.
[0035]
As described above, a plurality of semiconductor integrated circuit elements 6 (three but one may be used in the present embodiment) are attached to the circuit board 5, and the integrated circuit elements 6. In addition to being arranged in a straight line, each integrated circuit element 6... Is attached to the circuit board 5 via a socket 7 (FIG. 9). A cold plate 16 is attached to each of the integrated circuit elements 6 in a heat exchange manner, and grease 24 having a high thermal conductivity is applied between the cold plate 16 and the integrated circuit element 6. Yes. The grease 24 closely contacts the integrated circuit element 6 and the cold plate 16, thereby efficiently transferring the heat of the integrated circuit element 6 to the cold plate 16. Instead of the grease 24, an elastic sheet material having good thermal conductivity as described later may be used.
[0036]
The cold plate 16 is configured, for example, by caulking and joining two aluminum plates having high thermal conductivity (thermal conductivity). The cold plate 16 includes a base member 17 serving as a plate-like heat conductive material positioned on the integrated circuit element 6 side, and a lid member 18 serving as a plate-like heat conductive material that is closely attached to the base member 17. The above-described piping 23 is sandwiched between the base member 17 and the lid member 18 (FIG. 9).
[0037]
A plurality of pipe grooves 21 (one pair in this embodiment) are formed in the base member 17 from the front end to the rear end, and the pipe grooves 21 are formed in parallel at a predetermined interval (FIG. 10). ). The pipe grooves 21 and 21 are recessed in the base member 17 as a semicircular arc shape equivalent to the outer peripheral shape of the pipe 23, and both the pipe grooves 21 and 21 have a predetermined distance from both sides of the base member 17. It is formed inside.
[0038]
Further, an engagement groove (concave portion) 19 having a predetermined depth and a predetermined width is formed between one pipe groove 21 and one side of the base member 17 from the front end to the rear end of the base member 17. Yes. The engagement groove 19 is formed in a substantially U-shaped cross section and is recessed in the base member 17 so as to be substantially parallel to the pipe groove 21. An engagement groove 19A is formed between the pipe grooves 21 from the front end to the rear end of the base member 17 in parallel with the pipe groove 21. The engagement groove 19A is the same as the engagement groove 19 described above. Is formed.
[0039]
Further, the base member 17 is formed with an engagement protrusion (projection) 20B having a predetermined height and a predetermined width from the front end to the rear end. The engaging protrusion 20B is formed so as to protrude from the base member 17 and is formed between the one pipe groove 21 and the engaging groove 19A and parallel to the pipe groove 21. Further, the base member 17 is formed with an engaging projection 20C extending from the front end to the rear end, and this engaging projection 20C is formed in the same shape as the engaging projection 20B. It is located on the opposite side to the engagement groove 19A. That is, the engagement groove 19, the pipe groove 21, the engagement protrusion 20B, the engagement groove 19A, the pipe groove 21, and the engagement protrusion 20C are formed at predetermined intervals in order from one side of the base member 17. Are formed on one side of the base member 17.
[0040]
On the other hand, a plurality (two) of pipe grooves 21 are also formed in the lid member 18, and these pipe grooves 21 are formed in the same shape as the pipe grooves 21 formed in the base member 17. Both pipe grooves 21 formed in the lid member 18 are formed at positions facing both pipe grooves 21 formed in the base member 17 when the lid member 18 is superposed on the base member 17. The pipes 23 and 23 are respectively sandwiched between the pipe grooves 21 formed in the pipe 18.
[0041]
Here, a sheet material 53 having thermal conductivity and elasticity made of a thin graphite sheet having a thickness of 50 μm or the like is interposed between the pipe 23 and the lid member 18, and the base member 17, the pipe 23, and the lid member 18. Sandwiched between. The sheet material may be on the base member 17 side of the pipe 23. Further, as described above, it may be provided between the integrated circuit element 6 and the cold plate 16 or may be attached to the upper surface of the cold plate 16. Further, as the material of the sheet material 53, a copper foil or the like can be considered.
[0042]
The sheet material 53 has a high thermal conductivity in the surface direction, and thus, heat transfer between the pipe 23 and the base member 17 and the lid member 18 is favorably performed in a wide range, and the heat conduction efficiency is improved. Will be able to. By such an action, heat transfer from the integrated circuit element 6 to the brine flowing in the pipe 23 of the cold plate 16 is performed extremely smoothly. In addition, you may apply | coat the grease similar to the above-mentioned to the surface (for example, the upper surface of the base member 17 of FIG. 10) which does not provide the sheet material 53 concerned.
[0043]
In this case, the cover member 18 is formed with engagement protrusions 20 and 20A similar to the engagement protrusions 20B and 20C from the front end to the rear end. The engaging protrusions 20 and 20A are formed at positions facing the engaging grooves 19 and 19A formed in the base member 17, and both the engaging protrusions 20 and 20A have the lid member 18 as the base member 17. When superposed, they are press-fitted into the engagement grooves 19 and 19A, respectively. The lid member 18 has engagement grooves 19B and 19C similar to the engagement grooves 19 and 19A from the front end to the rear end. The engagement grooves 19B and 19C are formed at positions facing the engagement protrusions 20B and 20C formed on the base member 17, and when the lid member 18 is superposed on the base member 17, both the engagement grooves 19B. , 19C are press-fitted into the engaging protrusions 20B and 20C, respectively.
[0044]
That is, the cold plate 16 is superposed in a state where the pipes 23 and 23 and the above-described sheet material 53 are sandwiched between the base member 17 and the lid member 18 (pipe grooves 21 and 21), and engages with the engagement grooves 19 and 19A. The base member 17 and the lid member 18 are tightly fixed by crimping the portions 20 and 20A by press-fitting the engaging protrusions 20B and 20C into the engaging grooves 19B and 19C. At this time, the outer circumferences of the pipes 23 and 23 are tightly fixed to the base member 17 and the lid member 18 (via the sheet material 53). Further, both the pipes 23, 23 are located outward from the front and rear ends of the base member 17 and the lid member 18.
[0045]
Three cold plates 16 configured in this way are prepared in the embodiment, and the ends of the pipes 23 of the cold plates 16 are connected by connectors 23A. At this time, each cold plate 16... Is connected to each of the three integrated circuit elements 6 attached to the circuit board 5 with dimensions respectively positioned, and the pipe 23 at the end of the one cold plate 16 is It connects with the bend pipe (arc-shaped pipe) 23B.
[0046]
By connecting the cold plates 16 in this way, a linear brine flow path having a pair of reciprocations between the cold plates 16 is formed. A plurality of pairs of linear brine channels may be formed between the cold plates 16 by providing more pipes 23. Each cold plate 16 is abutted and fixed on each integrated circuit element 6 through the grease 24 having a high thermal conductivity as described above (FIG. 9).
[0047]
The cold plate 16 is detachably fixed to the socket 7 by a clip 69 made of an elastic metal spring plate with the integrated circuit element 6 sandwiched between the cold plate 16 and the socket 7 as shown in FIG. Further, a plurality of aluminum heat radiation fins 68 are attached to the upper surface of the lid member 18 of the cold plate 16, that is, the surface opposite to the lower surface with which the integrated circuit element 6 abuts.
[0048]
At this time, the radiating fin 68 is formed with a notch 68A into which the clip 69 can be inserted. Further, a blower device 71 for the cold plate 16 is attached to the upper surface of the radiating fins 68 (not shown in FIGS. 3 and 4). The blower 71 is composed of a centrifugal blower type turbo fan having a small thickness, and sucks air from the lower radiation fins 68... And discharges it from a discharge port 72 on the side surface.
[0049]
With such a configuration, in addition to cooling with brine, which will be described later, the cold plate 16 is cooled strongly by the heat dissipation from the heat radiation fins 68 and the forced ventilation by the blower 71, so that the integrated circuit element 6 can be quickly cooled. And it can be achieved accurately. Further, since the blower 71 is a centrifugal blower type fan, it is possible to reduce the size by minimizing the expansion of the height dimension.
[0050]
Of the three cold plates 16 connected as described above, the left end of the cold plate 16 facing the pipe 23 located on the opposite side of the bend pipe 23B exchanges heat with the discharge port from the pump 15 as described above. Connected to the pipe 48 to the vessel 11 above the lower portion 49.
[0051]
Next, FIG. 11 shows an electric circuit diagram of the brine cooling device 10 of the server 1. In this figure, reference numeral 54 denotes a general-purpose microcomputer constituting a control unit and a detection unit. An input port of the microcomputer 54 is attached to each of the cold plates 16. The thermistors TH1, TH2, and TH3 for detecting the temperatures (or detecting the temperatures in the vicinity of the integrated circuit element 6) and the inlet 13B of the pipe 13 of the heat exchanger 11 or the pipe 48 connected thereto. A thermistor TH4 that is attached in a heat exchange manner and detects the return temperature of the brine to the heat exchanger 11 is connected.
[0052]
Further, a resistor (volume or the like) 56 for setting a maximum value Tmax (for example, + 80 ° C.) of the return temperature of the brine is connected to the input port of the microcomputer 54, and a mode switch 57 is further connected. . Further, a voltage that changes based on temperature detection of the detection sensor 51 is applied to an A / D (analog / digital conversion) input port of the microcomputer 54, and power is turned on to a RESET input port of the microcomputer 54. A reset signal (linked to the power supply) is input. Further, the microcomputer 54 exchanges data with the controller 52.
[0053]
A signal output from the output port of the microcomputer 54 is supplied to the switching power supply circuits SW1 and SW2 via the buffer, and the output voltages of the switching power supply circuits SW1 and SW2 are controlled in the range of + 6V to + 12V in this embodiment. A transistor 59 for controlling energization of the relay 58 (relay coil) is also connected via a buffer, and ON / OFF is controlled by the microcomputer 54. An LED display 61 is also connected to the output of the microcomputer 54.
[0054]
The switching power supply circuits SW1 and SW2 are supplied with DC + 12V output from the power supply circuit 9, and the output of the switching power supply circuit SW1 is supplied to the motor 15M of the pump 15 through the resistor 62 and the normally open contact 58A of the relay 58. Is done. The output of the switching power supply circuit SW2 is supplied to the motor 14M of the cross flow fan 14 through the resistor 63 and the normally open contact 58B of the relay 58.
[0055]
Further, a series circuit of a resistor 64 and a light emitting diode of a photocoupler PH1 is connected in parallel with the resistor 62 on the output side of the switching power supply circuit SW1, and the output of the phototransistor of the photocoupler PH1 is an input port of the microcomputer 54. It is connected to the. In addition, a series circuit of a resistor 66 and a light emitting diode of a photocoupler PH2 is connected in parallel with the resistor 63 on the output side of the switching power supply circuit SW2. The output of the phototransistor of the photocoupler PH2 is input to the input port of the microcomputer 54. It is connected to the.
[0056]
Next, the operation of the brine cooling device 10 of the server 1 under the control of the microcomputer 54 will be described with reference to the flowcharts shown in FIGS. When the power is turned on, a power ON reset signal is input to the microcomputer 54 in step S1 of FIG. As the reset signal, the microcomputer 54 uses an edge trigger by DC + 5V which is a power source for the relay 58 and the photocouplers PH1 and PH2.
[0057]
Next, the microcomputer 54 determines the maximum value Tmax of the return temperature of the brine set by the resistor 56 in step S2, and stores it in the storage unit (memory). In the embodiment, + 80 ° C. is not always set as Tmax. Next, in step S3, the microcomputer 54 starts counting a timer (for example, a 5-minute timer) that it has as its function. In step S4, it is determined whether the timer count has elapsed. If not, the process proceeds to step S5 to output a voltage signal indicating that DC + 12V is output to the switching power supply circuits SW1 and SW2, respectively. 59 is turned on to energize the relay 58. When the relay 58 is energized, the contacts 58A and 58B are closed.
[0058]
As a result, DC + 12V is supplied to the motor 15M of the pump 15 and the motor 14M of the cross flow fan 14, respectively, and both are operated at the maximum capacity. When the cross flow fan 14 is operated, air (outside air) is sucked from the opening 30 of the case 3 as described above and blown in a line along the longitudinal direction of the heat exchanger 11. As a result, the air after the plates 12 of the heat exchanger 11 and the pipes 13 are air-cooled passes through the cold plate 16 of the circuit board 5 and the periphery of the power supply circuit 9 and then ventilated by the blower fans 43 and 43. It is discharged to the outside through the ports 42 and 42.
[0059]
Further, as described above, fresh air (outside air) is also sucked from the vent holes 44 of the side surfaces 3D and 3D, and after air cooling through the cold plate 16 of the circuit board 5 and the periphery of the power supply circuit 9, the same manner. The air is discharged from the vents 42 and 42 to the outside.
[0060]
On the other hand, when the pump 15 is operated, brine is discharged from the discharge port, and after the heat exchange with the cold plates 16... 13 inlets 13B. The brine that has entered the inlet 13B exchanges heat with the pipe 13 itself and the plate 12 in the process of passing through the pipe 13 inside the heat exchanger 11 in a meandering manner, and is cooled by ventilation from the crossflow fan 14.
[0061]
The brine from the outlet 13 </ b> A of the pipe 13 of the heat exchanger 11 reaches the reserve tank 26 through the pipe 46, and repeats circulation that is sucked again from the suction port of the pump 15 through the reserve tank 26. In this way, the cold plates 16 are cooled by the brine that is air-cooled in the heat exchanger 11, and the integrated circuit elements 6 are cooled by the cold plates 16.
[0062]
In step S6, the microcomputer 54 determines whether the phototransistors PH1 and PH2 are turned on. Here, when no output is generated from the switching power supply circuits SW1 and SW2, the light emitting diodes of the photocouplers PH1 and PH2 do not emit light, and the respective phototransistors are turned off. When the phototransistors of the photocouplers PH1 and PH2 are turned on, the microcomputer 54 determines that outputs are generated from the respective switching power supply circuits SW1 and SW2, and returns to step S4. When the PH2 phototransistor is OFF, there may be an abnormality in which the pump 15 and the cross flow fan 14 are stopped. Therefore, the process proceeds from step S6 to step S7, and the abnormality is displayed on the LED display 61. Output an alarm.
[0063]
The microcomputer 54 continues to operate the crossflow fan 14 and the pump 15 with the maximum capacity after the power is turned on until the timer counts up, thereby responding to heat generated when the server 1 is started, and at the same time the brine cooling device 10 To stabilize the cooling capacity. When 5 minutes have elapsed since the power was turned on and the timer counts up, the microcomputer 54 proceeds from step S4 to step S8, and determines whether the return temperature of the brine detected by the thermistor TH4 is equal to or higher than the maximum value Tmax.
[0064]
When the temperature of the brine returned by heat exchange with each cold plate 16... Rises to a temperature equal to or higher than Tmax, the microcomputer 54 proceeds to step S12 and, similarly to the above, the maximum of the cross flow fan 14 and the pump 15 is reached. The operation of the capacity is continued, an abnormality is displayed on the LED display 61 in step S13, and the process returns to step S8. As a result, there is a possibility that the cold plate 16 is not cooling the integrated circuit element 6 effectively, so an alarm is given.
[0065]
On the other hand, if the return temperature of the brine is lower than Tmax in step S8, the process proceeds to step S9, and the temperature of each cold plate 16... Detected by each thermistor TH1, TH2, TH3 is taken in. Then, the highest temperature is selected from the thermistors TH1 to TH3 and set to T0. Next, in step S10, it is determined whether or not T0 is equal to or higher than Tmax-5 (that is, + 75 ° C.). In the above case, the process proceeds to step S14 and the cross flow fan 14 and the pump 15 are operated at the maximum capacity as described above. Then, the process returns to step S8.
[0066]
If T0 is lower than Tmax-5 in step S10, the process proceeds to step S11, where it is determined whether T0 is equal to or higher than Tmax-40 (ie, + 40 ° C.). If T0 is Tmax−40 or more and less than Tmax−5 (that is, + 40 ° C. or more and less than + 75 ° C.), the microcomputer 54 proceeds to step S20 in FIG.
[0067]
In step S20, the microcomputer switches the switching power source from the data table calculated in advance by PID (proportional differential integration) or fuzzy calculation based on the current T0 and ΔT obtained from the deviation (change) between the previous T0 and the current T0. An increase / decrease value ΔV of the output voltages of the circuits SW1 and SW2 is obtained. The routine cycle in this case is, for example, 0.5 seconds. In the calculation in step S20, when the temperature near the outer periphery of the case 3 is + 35 ° C. or higher, the temperature of the cold plate 16 is a set value of + 50 ° C. to + 70 ° C. In such a manner, the calculation is performed in such a way that the capacities of the pump 15 and the cross flow fan 14 are increased according to the rise in the temperature of the brine, and the capacities are decreased according to the decrease in the temperature.
[0068]
The set value may be controlled by the controller 52 in accordance with the operating rate of the server 1, or may be configured to be arbitrarily set manually.
[0069]
In step S21, the microcomputer 54 sets the voltage signal Vnew output to each of the switching power supply circuits SW1 and SW2 to the current voltage signal + ΔV, and in step S22, the voltage signal Vnew ranges from the lower limit DC + 8V to the upper limit + 12V. The voltage signal is corrected so as not to exceed the value, and the relay 58 is energized. As a result, the pump 15 and the cross flow fan 14 are operated with the adjusted capacity.
[0070]
In step S24, the microcomputer 54 determines whether the phototransistors of the photocouplers PH1 and PH2 are turned on in the same manner as described above. No output is generated from the switching power supply circuits SW1 and SW2, and the photocouplers PH1 and PH2 When the phototransistor is not emitting light and each phototransistor is OFF, an alarm is output by displaying an abnormality on the LED display 61 in the same manner as described above in step S25. If each switching power supply circuit SW1, SW2 is normal, the process returns to step S8.
[0071]
On the other hand, if T0 is lower than Tmax-40 (ie, + 40 ° C.) in step S11, the microcomputer 54 proceeds to step S15 in FIG. 14 and determines whether or not the mode switch 57 is turned on. Assuming that the mode switch 57 is ON, the microcomputer 54 proceeds from step S15 to step S17, outputs a DC + 8V voltage signal to the switching power supply circuit SW1, and outputs a 0V voltage signal to the switching power supply circuit SW2. The relay 58 is energized.
[0072]
As a result, the pump 15 is operated at the minimum capacity, and the cross flow fan 14 is stopped and ventilation is interrupted while ensuring the minimum brine circulation in the brine circulation path of the brine cooling device 10. Thereby, when the return temperature of the brine is lower than + 40 ° C., if the mode switch 57 is turned on, the microcomputer 54 maintains the minimum cooling of the integrated circuit element 6 by the brine cooling device 10. In step S18, similarly, it is determined whether or not the output of the switching power supply circuit SW1 is generated by the phototransistor of the photocoupler PH1, and if not, the LED display 61 similarly displays an abnormality. In either case, the process returns to step S8.
[0073]
On the other hand, when the mode switch 57 is OFF, the microcomputer 54 proceeds from step S15 to step S16, outputs a voltage signal of 0 V to the switching power supply circuits SW1 and SW2, deenergizes the relay 58, and returns to step S8. That is, when the return temperature of the brine is lower than + 40 ° C. and the mode switch 57 is turned off, the microcomputer 54 stops the cooling of the integrated circuit element 6 by the brine cooling device 10.
[0074]
Next, the flowcharts of FIGS. 15 and 16 show another embodiment of control by the microcomputer 54. The controller 52 provided in the server rack 2 calculates the operation rate of the integrated circuit elements 6 provided in the respective servers 1 through data communication. Although the temperature rise of the integrated circuit element 6 can be grasped from this operating rate, each operating rate is transmitted to the microcomputer 54. The flowchart in this case performs control using this operating rate.
[0075]
That is, when the power is turned on, the same power ON reset signal as that described above is input to the microcomputer 54 in step S31 of FIG. Next, the microcomputer 54 determines the maximum value Tmax of the return temperature of the brine set by the resistor 56 in step S32 and stores it in the storage unit (memory). Also in this case, + 80 ° C. is not always set as Tmax. Next, in step S33, the microcomputer 54 starts counting a timer (the above-mentioned 5-minute timer) that is provided as its function. In step S34, it is determined whether or not the timer count has elapsed. If not, the process proceeds to step S35 to output voltage signals to output DC + 12V to the switching power supply circuits SW1 and SW2, respectively. 59 is turned on to energize the relay 58. When the relay 58 is energized, the contacts 58A and 58B are closed.
[0076]
As a result, DC + 12V is supplied to the motor 15M of the pump 15 and the motor 14M of the cross flow fan 14, respectively, and both are operated at the maximum capacity as described above. In step S36, the microcomputer 54 determines whether or not the phototransistors of the photocouplers PH1 and PH2 are turned on. Outputs are generated from the switching power supply circuits SW1 and SW2, and the phototransistors of the photocouplers PH1 and PH2 are turned on. If it is determined that the output is generated from each of the switching power supply circuits SW1 and SW2, the process returns to step S34, but if the phototransistors of the photocouplers PH1 and PH2 are OFF, step S36 is performed. Then, the process proceeds to step S37 to display an abnormality on the LED display 61 to output an alarm.
[0077]
The microcomputer 54 stabilizes the cooling capacity of the brine cooling device 10 by continuing the operation of the cross flow fan 14 and the pump 15 with the maximum capacity until the timer counts up after the power is turned on. When 5 minutes have elapsed since the power was turned on and the timer counted up, the microcomputer 54 proceeds from step S34 to step S38, and determines whether the return temperature of the brine detected by the thermistor TH4 is equal to or higher than the maximum value Tmax.
[0078]
If the temperature of the brine returned by heat exchange with each cold plate 16... Rises to a temperature equal to or higher than Tmax, the microcomputer 54 proceeds to step S42 and, similarly to the above, the highest flow of the cross flow fan 14 and the pump 15. The operation of the capacity is continued, an abnormality is displayed on the LED display 61 in step S43, and the process returns to step S38. As a result, an alarm is given that the integrated circuit element 6 is at an abnormally high temperature.
[0079]
On the other hand, if the return temperature of the brine is lower than Tmax in step S38, the operation rate F1, F2, F3 of each integrated circuit element 6... Sent from the controller 52 is fetched in step S39. Then, the highest operating rate is selected from the operating rates F1 to F3 and is set to F0. Next, in step S40, it is determined whether F0 is, for example, 80% or more. In the above case, the process proceeds to step S44, and the cross flow fan 14 and the pump 15 are operated at the maximum capacity as described above. Then, the process returns to step S38.
[0080]
If F0 is lower than 80% in step S40, the process proceeds to step S41, where it is determined whether F0 is 40% or more, for example. If F0 is 40% or more and less than 80%, the microcomputer 54 proceeds to step S50 in FIG.
[0081]
In step S50, the microcomputer outputs the output voltages of the switching power supply circuits SW1 and SW2 from the data table calculated in advance by PID (proportional differential integration) or fuzzy calculation based on the deviation (change) between the previous F0 and the current F0. An increase / decrease value ΔV is obtained. The routine cycle in this case is, for example, 0.5 seconds. In the calculation in step S50, when the temperature outside the case 3 is + 35 ° C., the temperature of the brine is set so that the temperature of the cold plate 16 becomes + 70 ° C. or less. Calculations are performed in the direction of increasing the capacity of the pump 15 and the cross flow fan 14 in response to the increase and decreasing the capacity in response to a decrease in temperature.
[0082]
In step S51, the microcomputer 54 sets the voltage signal Vnew output to each of the switching power supply circuits SW1 and SW2 to the current voltage signal + ΔV, and in step S52, the voltage signal Vnew ranges from the lower limit DC + 8V to the upper limit + 12V. The voltage signal is corrected so as not to exceed the value, and the relay 58 is energized. As a result, the pump 15 and the cross flow fan 14 are operated with the adjusted capacity. Such control makes it possible to quickly increase the cooling capacity against sudden heat generation of the integrated circuit element 6 and to prevent damage to the element.
[0083]
In step S54, the microcomputer 54 determines whether or not the phototransistors of the photocouplers PH1 and PH2 are turned on in the same manner as described above. No output is generated from the switching power supply circuits SW1 and SW2, and the photocouplers PH1 and PH2 If the phototransistor is not turned on and each phototransistor is OFF, an alarm is output by displaying an abnormality on the LED display 61 in the same manner as described above in step S55. If each switching power supply circuit SW1, SW2 is normal, the process returns to step S38.
[0084]
On the other hand, if F0 is lower than 40% in step S41, the microcomputer 54 proceeds to step S15 in FIG. 14, and thereafter executes the same control. Note that the control in FIG. 14 is the same as that described above, and a description thereof will be omitted. In this way, the brine cooling device 10 can also be controlled by the operating rate of the integrated circuit elements 6.
[0085]
Here, when the detection sensor 51 detects the brine, the microcomputer 54 displays an abnormality on the LED display 61 and outputs an alarm in response thereto. At the same time, a voltage signal of 0 V is output to the switching power supply circuit SW1 to stop the pump 15. This minimizes the amount of brine leakage. Note that, for example, a maximum + 12V voltage signal is output to the switching power supply circuit SW2 and blown into the case 3 with the maximum capacity to ensure cooling in the case 3.
[0086]
In this way, brine leaks at the connection portions of the inlets 13A and 13B of the pipe 13 of the heat exchanger 11 and the pipes 46, 47, 48, and 23, the reserve tank 26, the pump 15, and the like. If the detection sensor 51 stays in the front part in the lower part 49 of the bottom surface 3B and detects it, an alarm is output from the LED display 61, so that the user can quickly maintain a leakage failure of the brine. It becomes like this. Further, since the pump 15 is also stopped, the forced leakage of brine is stopped. In addition, since the outlet 13A of the heat exchanger 11 is located higher than the cold plate 16 as described above, if leakage occurs at the outlet 13A, the brine in the heat exchanger 11 is brought into the interior by stopping the pump 15. Will stay. Therefore, the amount of leakage of brine from the heat exchanger 11 is minimized.
[0087]
Next, FIG. 17 and FIG. 18 show the structure of another embodiment of the server 1 relating to the arrangement of the cross flow fan 14. In each figure, the same reference numerals as those in FIGS. 4 and 5 have the same or similar functions. In this case, an opening 67 is formed in the rear surface 3 </ b> C of the case 3, and a fan casing 39 of the cross flow fan 14 is disposed corresponding to the inside of the opening 67. Thereby, the cross flow fan 14 is provided in the vicinity of the opening 67.
[0088]
In this case, the fan casing 39 is for forming an air passage leading from the cross flow fan 14 to the front heat exchanger 11, and the opening 33 of the fan casing 39 is directed outward from the opening 67 of the case 3. A similar dust removing filter 34 is attached to the opening 33.
[0089]
When the cross flow fan 14 is operated, air around the circuit board 5 in the front case 3 is sucked. As a result, air is sucked from the opening 30 of the front surface 3A and the vent holes 44 of the side surfaces 3D and 3D described above, and after heat exchange of the heat exchanger 11 and the like, the cross flow fan 14 opens the opening 33 (opening 67). Discharged to the outside. As a result, the heat exchanger 11 and the cold plate 16... Of the brine cooling device 10 that cools the integrated circuit elements 6.
[0090]
At this time, a curved opening angle adjusting plate 36 is attached to the lower edge of the opening 33 of the fan casing 39. Also in this case, the opening angle adjusting plate 36 can be engaged with and disengaged from the ribs 37A projecting at a predetermined interval on the front and rear of a locking plate 37 provided in the lower portion of the opening 33, and is moved back and forth. By changing the position of the engaging rib 37A, the amount protruding from the lower edge of the opening 33 can be changed in three stages. Thereby, the upward angle of the opening 33 can be changed in three stages such as 15 °, 30 °, and 45 ° from the horizontal.
[0091]
In the office where this kind of server rack 2 is installed as described above, air for air conditioning is blown out from the floor. The server 1 is mounted in a plurality of stages on the server rack 2 as described above, but the upward angle of the opening 33 is shallower (closer to the horizontal) in the upper server 1 and the upward angle of the opening 33 in the lower server 1. Deepen (turn upward). Thereby, the air in the case 3 can be easily discharged to the outside, and the cooling efficiency of the integrated circuit elements 6 can be further improved.
[0092]
The numerical values shown in the embodiments are not limited thereto, and the capability of the integrated circuit element is appropriately set according to the quantity. In the embodiment, the microcomputer 54 controls the operation of the pump 15 and the cross flow fan 14 based on the return temperature of the brine, the temperature of each cold plate 16... And the operation rate of each integrated circuit element 6. However, the present invention is not limited to this, and the pump 15 may be operated at all times to control the capacity of only the cross flow fan 14, or the cross flow fan 14 may be operated at all times to control the capacity of the pump 15.
[0093]
【The invention's effect】
As described above in detail, according to the present invention, an electronic device that houses a circuit board on which a plurality of integrated circuit elements that require countermeasures against heat generation are mounted in a single case, and is capable of heat transfer from the integrated circuit elements. The cold plate attached to each integrated circuit element, the brine heated by each cold plate circulates, heat exchange from the heat exchanger that cools this brine, and the crossflow fan provided in the opening on one side of the case A fan casing that constitutes an air passage leading to the cooler, a reserve tank for storing brine, a pump that circulates the brine, and a cold plate that are provided in order in the flow of brine from the heat exchanger to the cold plate, Cross-flow with at least a pair of reciprocating brine flow paths across each cold plate The heat flow is made to correspond to the air inflow side of the heat exchanger, and a plurality of radiating fins are provided on the opposite side of each cold plate to the integrated circuit element so that air from the cross flow fan is blown to the heat exchanger. After that, since it is configured to reach the circuit board, the heat generated by the integrated circuit element of the cold plate can be cooled by the radiation fins in addition to the cooling by the brine, and the integrated circuit element can be quickly and accurately It becomes possible to realize the cooling.
[0094]
In particular, since the cold plate air blower is attached to the heat dissipating fin, in addition to the above, the heat dissipating fin can be forcibly cooled by the air blower such as the cold plate. It becomes possible to realize the cooling.
[0095]
According to the invention of claim 2, in the above invention , since the cold plate blower device includes the centrifugal blower type fan, the cold plate is forcibly cooled by a fan having a relatively small height. As a result, the apparatus can be reduced in size.
[0096]
According to the invention of claim 3, in addition to each of the above-mentioned inventions , when the temperature near the outer periphery of the case is + 35 ° C. or higher, at least either a blower fan or a pump is used so that the temperature of the cold plate becomes + 70 ° C. or lower. Since the control part which controls one side is provided, the cooling capability by a cold plate can be controlled now by a ventilation fan or a pump. As a result, it is possible to quickly increase the cooling capacity against sudden heat generation of the integrated circuit element, and to avoid the occurrence of damage to the element.
[Brief description of the drawings]
FIG. 1 is a front view of a server rack loaded with servers as an embodiment of an electronic apparatus to which the present invention is applied.
FIG. 2 is a perspective view of a server as an embodiment of the electronic device of the present invention.
3 is a perspective view of the server case of FIG. 2 with a top cover removed. FIG.
4 is a cross-sectional plan view of the server of FIG. 3. FIG.
FIG. 5 is a vertical side view of the front part of the server in FIG. 2;
6 is an enlarged view of a vent portion on a side surface of the case of the server in FIG. 2;
7 is a longitudinal rear view of the server of FIG. 3. FIG.
FIG. 8 is a vertical side view of the server of FIG. 3;
9 is a side view of an integrated circuit element and a cold plate attached to the circuit board of the server of FIG. 3. FIG.
10 is an exploded perspective view of the cold plate of FIG.
11 is an electric circuit diagram of the brine cooling device of the server of FIG. 3;
12 is a flowchart for explaining a control operation of the microcomputer shown in FIG.
13 is another flowchart for explaining the control operation of the microcomputer shown in FIG. 11. FIG.
14 is another flowchart for explaining the control operation of the microcomputer shown in FIG. 11; FIG.
FIG. 15 is a flowchart illustrating a control operation of another embodiment of the microcomputer shown in FIG.
FIG. 16 is another flowchart for explaining the control operation of another embodiment of the microcomputer shown in FIG. 15;
FIG. 17 is a plan sectional view of a server according to another embodiment of the electronic apparatus of the present invention.
18 is a longitudinal side view of the rear part of the server in FIG. 17;
19 is a perspective view of an integrated circuit element and a cold plate attached to the circuit board of the server of FIG. 3;
[Explanation of symbols]
1 Server (electronic device)
2 server rack 3 case 5 circuit board 6 integrated circuit element 10 brine cooling device 11 heat exchanger 12 plate 13, 23, 46, 48 piping 13A outlet 13B inlet 14 cross flow fan (blower fan)
DESCRIPTION OF SYMBOLS 15 Pump 16 Cold plate 17 Base member 18 Lid member 26 Reserve tank 30 Opening 36 Opening angle adjustment plate 39 Fan casing 41 Air channel member 44 Ventilation hole 49 Low part 51 Detection sensor 53 Sheet material 54 Microcomputer 61 LED indicator 68 Radiation fin 71 Blower SW1, SW2 Switching power supply circuit TH1-TH4 Thermistor

Claims (3)

In an electronic device that houses a circuit board on which a plurality of integrated circuit elements that require countermeasures against heat generation are mounted in a single case,
A cold plate attached to each integrated circuit element so as to allow heat transfer from the integrated circuit element;
A heat exchanger that circulates the heated brine in each cold plate and cools the brine;
A fan casing constituting an air passage connected to the heat exchanger from a cross flow fan provided in an opening on one surface of the case;
A reserve tank for storing the brine and a pump for circulating the brine, which are sequentially provided in a flow of brine from the heat exchanger to the cold plate;
A flow path of linear brine configured in the cold plate and forming at least a pair of reciprocations between the cold plates;
The cross flow fan is made to correspond along the air inflow side of the heat exchanger, and a plurality of heat radiating fins are provided on the opposite side of the cold plate to the integrated circuit element so that the air from the cross flow fan An electronic device, wherein the electronic device is configured so as to reach the circuit board after being sprayed to the heat exchanger , and a cold plate air blower is attached to the radiating fin . The electronic device according to claim 1 , wherein the cold plate blower includes a centrifugal blower fan . And a control unit that controls at least one of the blower fan and the pump so that the temperature of the cold plate becomes + 70 ° C. or lower when the temperature near the outer periphery of the case is + 35 ° C. or higher. The electronic device according to claim 1 or 2 .

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