JP4500778B2 - Induction heating cooker - Google Patents

Description

  The present invention relates to a cooling structure for an induction heating cooker that supplies a high-frequency current to a heating coil to heat a metal cooking pan.

  In induction heating, a high-frequency current is supplied to a heating coil provided below the cooking pan, and an eddy current is generated near the surface of the cooking pan by a magnetic field generated around the heating coil. The pot self-heats and cooks.

  In addition, in induction heating, the heating efficiency θ of the cooking pan differs depending on the material of the cooking pan (relative magnetic permeability and resistivity), and the iron pan with higher relative permeability and resistivity is heated by the eddy current. Is large and the heating efficiency is good at θ> 90%, but the heating efficiency is lowered in an aluminum pan or copper pan having a low resistivity.

  For this reason, the amount of heat that does not contribute to heating of the cooking pan relative to the electric power supplied to the heating coil increases as the cooking pan has a lower resistivity, and the amount of heat increases the heat generation of the heating coil and electronic components. ing.

  On the other hand, in order to perform stable cooking with an induction heating cooker, it is necessary to cool the heating coil and the circuit board that generate heat to suppress the temperature rise of the components.

In the conventional induction heating cooker, as shown in FIG. 15, the fan device 5 is provided inside the main body, the cooling air sucked by the fan device 5 is blown out toward the circuit board 43, and the air that has passed through the circuit board 43 is used. The structure which cools the heating coil 20 is generally performed.

  In addition, a roaster that cooks fish, meat, etc. with a heater is provided inside the main body, so the volume of the space where the circuit board and the fan device are provided is limited. The mounting density of the board increases, and the heat generation density of the parts that generate heat increases.

  Furthermore, along with the increase in the density of component mounting, the circuit board and heating coil, and the circuit board and operation panel, etc., connect the electronic / electrical components in the device and the circuit board with a large number of wirings. The air path through which the air flows is narrowed, preventing cooling of the parts.

  In addition, a heat sink is provided for air cooling of electronic components that generate a large amount of heat. In order to increase the heat dissipation area of the component, a large heat sink volume is required to obtain high cooling performance. The mounting density will increase.

  On the other hand, there are two conventional methods for cooling electronic components that generate heat: air cooling using a fan device and water cooling using an antifreeze aqueous solution. The water cooling method includes electronic devices such as personal computers and household appliances. Application to is progressing.

  The induction heating cooker is also equipped with a water cooling system as shown in Patent Document 1, and the heating coil and the circuit board are water-cooled by interlocking the cooker body and the ventilation fan with a water-cooled pipe to increase their temperature. Suppressing heat treatment systems have been proposed.

JP 2005-26124 A

  In the conventional induction heating cooker, as a method of cooling electronic components that generate heat, in the air cooling method using a fan device, along with an increase in heat generation of electronic components, an increase in mounting density accompanying an increase in heat sink size, It becomes difficult to allow sufficient cooling air to flow through the circuit board.

  In addition, since signal wiring and power supply wiring are performed using an air passage for flowing cooling air to electronic components, the flow resistance of the air passage increases, and this air passage is necessary for cooling electronic components and has sufficient cooling. In order to flow the amount of air, the fan must be enlarged or rotated at a high speed, and a large fan power is required.

  Moreover, with the increase in the cooling air volume due to the increase in the size and speed of the fan device, the motor sound of the fan device and the wind noise (fluid sound) of the components increase, and the kitchen environment deteriorates due to the noise.

  In addition, in the mounting portion of the circuit board that is mounted at a high density, a gap is likely to be generated in the fitting portion when the fan device or the circuit board is mounted. Flow circulation (short circuit) occurs inside, and the temperature of the cooling air rises, making it difficult to cool the parts.

  In addition, it is difficult to secure a sufficient air volume to use the air after cooling the circuit board as the cooling air of the heating coil disposed downstream of the cooling flow path.

  Furthermore, since the temperature of the air after cooling the circuit board rises due to the heat generated by the electronic components on the circuit board, it becomes difficult to cool the heating coil arranged downstream of the circuit board.

  Patent Document 1 describes an induction heating cooker equipped with a water cooling system. A circuit board heat absorption part having a size corresponding to the circuit board is attached to the circuit board. The substrate heat absorbing portion has a structure in which a liquid refrigerant that absorbs heat from the circuit board passes through the inside. A coil heat absorption part is attached to the heating coil in close contact with the upper or lower surface of the heating coil. The coil heat absorption part has a structure in which the liquid refrigerant passes through the inside as in the case of the substrate heat absorption part.

  The liquid refrigerant that has deprived heat from the heat-generating components exchanges heat with the cooling air that is sent to the heat-dissipating heat exchanger and taken in from the outside by a pump that is a liquid-feeding means for circulating the liquid refrigerant in the system. And sent to each heat absorption part.

  The heat-dissipating heat exchanger is disposed behind the main body and exchanges heat with the air taken in from the intake port. The air that has exchanged heat with the liquid refrigerant is exhausted from an exhaust port disposed behind the main body.

  As described above, Patent Document 1 describes an induction heating cooker having a basic water cooling system, but does not clearly show a specific component mounting or structure.

  The present invention has been made to solve at least one of the above problems.

  In order to solve the above-described problems, an induction heating cooker according to the present invention includes a heating coil provided below the top plate for induction heating the cooking pan, a circuit board for supplying high-frequency current to the heating coil, and cooling air. At least at least air supplied to the circuit board from the fan device, a liquid cooling system having a heat exchanger for exchanging heat between the electronic component of the circuit board and the liquid and air heat-exchanged with the electronic components of the circuit board An air flow path leading to the heat exchanger.

  According to the first aspect of the present invention, since the high heat generation electronic component of the circuit board is cooled on the downstream side of the cooling air flow through the heat exchanger, the liquid cooling system is compactly mounted in the main body. The above electronic components can be cooled effectively.

  According to the second aspect of the present invention, since the temperature of the air supplied to the circuit board is small, the heating coil disposed downstream of the circuit board is cooled by the cooling air, so that the air can be efficiently cooled.

  According to claim 3 of the present invention, heat can be taken from both the front and back surfaces of the heating coil, and higher coil cooling performance can be realized.

  According to claim 4 of the present invention, by separating the exhaust port of the heat exchanger having a high exhaust heat temperature from the exhaust port of the air that has cooled the heating coil, the exhaust port is widened to reduce the ventilation resistance of the exhaust, The exhaust heat performance inside the main body can be improved.

  Since this system exchanges heat with a heat exchanger having a wide heat radiation area, the heat of the electronic components generating high heat on the circuit board can be efficiently cooled via the heat receiving portion.

  In addition, since the air that has passed through the circuit board is air that has cooled electronic components that generate less heat, the temperature rise is small, and the cooling air cools the heating coil disposed downstream of the circuit board through the duct. Therefore, it can cool efficiently.

  Further, since air with a small temperature rise can be used for cooling the heating coil, high cooling performance can be maintained even with a low air flow, and a low-noise kitchen environment can be provided.

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

  1 to 7 show an embodiment of the present invention, which shows a built-in induction heating cooker in which three pan mounting parts 73a, 73b, 73c are provided on a top plate 70. FIG.

  The present invention is not limited to this configuration, and may be an induction heating cooker provided with at least one pan mounting portion for induction heating. Further, it may be a stationary induction heating cooker that is placed in the kitchen instead of the built-in type that fits in the kitchen.

  FIG. 1 shows a state in which the top plate 70 is removed from the main body 9 of the induction heating cooker in the present embodiment. The induction heating cooker according to the present embodiment has pan mounting parts 73a and 73b that supply high-frequency current to the heating coil 20 to induction-heat a cooking pan (not shown) on the left and right of the main body 9, and an electric heater The pan mounting part 73c heated by the radiant heat of 10 is provided in the center back of the main body 9.

The top frame 72 constituting the upper surface of the main body 9 of the induction heating cooker has a top plate 70, ventilation openings 71a and 71b for allowing the air inside the main body 9 to enter and exit, and an upper operation for operating the cooking pot to be heated and reduced. A panel 6b is provided. The ventilation openings 71a and 71b are located at the rear part of the top frame 72, and the upper operation panel 6b is located at the front part.

  Pan mounting parts 73a, 73b, and 73c are provided on the left and right sides of the top plate 70 and the back side of the center. Heating coils 20a and 20b are provided at substantially lower positions of the pan mounting portions 73a and 73b. An electric heater 10 is provided at a substantially lower position of the pan placing portion 73c. A metal pan that can be induction-heated is placed on the pan placement portions 73a and 73b, and an earthen pan that cannot be induction-heated is placed on the pan placement portion 73c and can be cooked.

  The main body 9 is provided with an inlet for a roaster 8 for grilling fish or the like on the left side of the front, and provided with a main power source 69, a dial 67 for operating the cooking pan and heating of the roaster 8 on the right side of the front. An operation panel 6a is arranged. As in this embodiment, it is not necessary to arrange the roaster 8 and the operation panel 6 in the illustrated positional relationship. For example, the configuration may be such that the roaster 8 is provided in the center or right side of the front surface of the main body 9.

  The heating power adjustment amount of each heating unit operated and adjusted by the operation panel 6 a is displayed on the display panel 65 provided in the main body 9. The displayed thermal power adjustment amount can be visually recognized through a transmission window (not shown) of the top plate 70. The front operation panel 6a and the upper operation panel 6b may be configured to be disposed on only one of them.

Outside air 81 is sucked from the air intake duct 60 on the rear side of the main body 9 through the vent hole 71 a on the top frame 72. The intake duct 60 is a part of the substrate case 4 and communicates with the internal fan device 5.

  As shown in FIG. 2, a circuit board 43 provided with electronic components that supply high-frequency current to the heating coils 20a and 20b, a fan case 5 that cools the circuit board 43, etc. It is arranged behind the operation panel 6a on the side surface of the roaster 8, that is, on the side of the main body 9.

  In the structure shown in FIG. 2, circuit boards 43a, 43b, and 43c are stacked in three layers in the vertical direction on the substrate case 4, and the highly heat-generating electronic component 41 that is liquid-cooled to the circuit boards 43a, 43b, and 43c or air-cooled. Other electronic components 42 and a heat sink 40 for cooling the electronic components are mounted. As in this embodiment, the circuit board 43 may not be provided on the board case 4 and the circuit board 43 may be provided directly on the main body 9.

As shown in FIG. 6, the liquid cooling system of the present embodiment includes a heat receiving portion 31 that receives heat of the electronic component 41 that generates high heat via a pipe 99, a heat exchanger 30 that dissipates the received heat, and these The liquid supply means 33 such as a pump, for example, and the water storage means 32 for storing the liquid are circulated. In FIG. 6, the heat exchanger 30 and the water storage means 32 are separately provided. However, a configuration in which a portion for storing water is provided in the middle of the pipe of the heat exchanger 30.

  Moreover, the liquid feeding means 33 and the water storage means 32 are arrange | positioned behind the roaster 8 used as the back side of the main body 9, as shown in FIG. The water storage means 32 prevents air bubbles from being mixed into the liquid supplied to the liquid supply means 33, and ensures the necessary liquid amount in the liquid cooling system even when surface volatilization or leakage occurs in the pipe line 32y or the connecting portion. There is work to do.

  Moreover, the liquid used for the liquid cooling system connected with the water storage means 32 by the pipe line 32x may be an aqueous solution obtained by adding an antifreeze or preservative to water, or a refrigerant.

  The heat exchanger 30 may be a plate fin tube type heat exchanger in which a metal tube is penetrated through a thin fin such as an air conditioner outdoor unit, or a thin liquid fin such as a car radiator bent and bent into a liquid pipe. A corrugated fin tube heat exchanger connected between them may be used.

  The heat exchanger 30 is arranged on the side wall of the main body 9 behind the left heating coil 20b, and is connected to the connecting duct 7 connected to the first duct 3 into which air that has cooled the circuit board 43 flows. It is lined up.

  In the present embodiment, the air blown to the circuit board 43 by the fan device 5 cools the right heating coil 20a through the first duct 3 that is an air flow path, and the left heating coil 20b through the connecting duct 7. And the flow which cools heat exchanger 30 is constituted. That is, as shown in FIG. 5, the air 85 blown out from the fan device 5 to the circuit board 43 passes through the board case 4 on which the circuit board 43 is mounted, and then the left and right heating coils 20a and 20b and the heat exchanger. A parallel flow toward 30 is configured, and each is cooled.

  On the other hand, the number of the circuit boards 43 accommodated in the board case 4 below the right heating coil 20a is determined by the volume of the roaster 8, the number of electronic parts 41 and 42, the amount of wiring thereof, and the like. As the numbers 41 and 42 increase, a plurality of circuit boards 43 are arranged at a higher density in the space on the side of the roaster 8 according to the volume shape.

In this embodiment, the substrate case 4 is provided in the space on the side of the roaster 8 and the circuit board 43 and the like can be accommodated in the body case 9 after being assembled in the substrate case 4, so that the assembly workability is improved. Yes.

  4 shows a configuration in which circuit boards 43a, 43b, and 43c are stacked in three stages in the height direction of the substrate case 4. However, a plurality of circuit boards 43 may be juxtaposed in the width direction. It arrange | positions in parallel with the flow direction of the cooling air 85a and 85b which blows off from the fan apparatus 5. FIG.

  Further, the arrangement order of the circuit boards 43a, 43b, 43c is determined by the assembly workability and the board weight, but it goes without saying that the configuration of the present invention can be applied regardless of the arrangement order of the circuit boards 43. .

  The fan device 5 of this embodiment is a sirocco fan in which air flows in the rotational direction of an impeller (not shown), as shown in the figure, and is located behind the circuit board 43 in the board case 4 when viewed from the front side of the main body 9. Placed in. Here, the illustrated fan device 5 is a sirocco fan, but it may be a turbo fan, an axial fan, or a cross-flow fan.

  Of the electronic components arranged on the circuit board 43, the electronic components 41a and 41b that generate a large amount of heat are fixed to the heat receiving portion 31 that constitutes the liquid cooling system. At this time, if the heat receiving member such as a heat conductive grease or a heat conductive sheet is sandwiched and fixed between the heat receiving portion 31 and the electronic component 41, the heat of the electronic component 41 is efficiently conducted to the heat receiving portion 31. Can do.

  Here, examples of the electronic components 41a and 41b that generate a large amount of heat include an IGBT, an inverter, and a diode bridge.

  In the heat receiving part 31 shown in FIG. 7, the liquid flows from the liquid feeding means 33 through the pipe lines 33y and 31x, the liquid 101 flows through the fin part 100 provided inside, and heat exchange is performed from the pipe line 31y. The structure flows out to the vessel 30.

  As shown in the figure, the inside of the heat receiving part 31 may have a one-pass flow path configuration, or a fine fin part may be provided, and the flow path may be divided into multiple paths. In addition, the pipe lines 31x and 31y may be provided on any surface of the heat receiving portion 31 and may be arranged in accordance with the mounting of the circuit board 43.

  As shown in FIG. 4, the heat receiving portions 31a and 31b are provided for each of the circuit boards 43a and 43b, and are configured to fix the electronic component 41 that generates a large amount of heat on the circuit boards 43a and 43b. Therefore, for example, if the circuit boards for induction heating the left heating coil 20b and the right heating coil 20a are separately divided and provided one by one, the heat receiving portion 31 may be provided for each circuit board.

  Here, since the heat receiving part 31 of the liquid cooling system does not need to be air-cooled, for example, as shown in FIG. 2, it is provided at the end of the circuit board 43 (left side as viewed from the front in the figure), and resistance or obstruction of the air-cooling flow. It is desirable not to become. Of course, it may be the right side or the front side of the circuit board 43.

  In the present embodiment, a shielding plate 45 (see FIG. 4) is provided between the circuit board 43 and the fan device 5 that blows the cooling air 85 to the circuit board 43 in the board case 4 to separate the respective spaces. The air 85 blown out from the fan device 5 to the circuit board 43 side is configured not to flow backward to the fan device 5 side. That is, only the flow 85 in which the air 81 sucked from the ventilation holes 71 a is blown out toward the circuit board 43 by the fan device 5 is configured.

  Here, the contact portion between the fan device 5 and the shielding plate 45 is provided with a level difference or unevenness to reduce the gap, or a heat-resistant elastic member, for example, silicon rubber or resin is sandwiched to reduce air leakage. Thus, a short circuit of the flow is less likely to occur, and the cooling effect by the fan device 5 can be enhanced.

  Further, even in a configuration in which the circuit board 43 is directly laminated on the main body 9 without using the substrate case 4, the fan device 5 and the circuit board 43 are separated by the shielding plate 45, so that there is no backflow and the fan device 5 Air can be blown out.

  Next, the flow of cooling air will be described with reference to FIG. 4. First, the outside air 81 is sucked into the fan device 5 from the vent hole 71 a on the top frame 72 through the intake duct 60 on the back side of the main body 9.

  In the fan device 5, air 85 is blown out toward the circuit board 43, and the electronic parts 42 with a small amount of heat generated on the circuit board 43 and the electronic parts provided with the heat sink 40 are air-cooled.

In this embodiment, heat receiving portions 31a and 31b are provided on the first-stage circuit board 43a and the second-stage circuit board 43b from the bottom of the substrate case 4, and only the electronic component 41 that generates a large amount of heat is received on the boards 43a and 43b. It is fixed to the part 31.

  The air 85 that has cooled the circuit board 43 of the board case 4 enters the first duct 3 provided above the board case 4, that is, below the heating coil 20 a, and part of the air 85 enters the first duct 3. A flow 88a is formed from the provided opening 3a toward the lower surface of the right heating coil 20a.

  The first duct 3 is connected to the left heating coil 20b and a connecting duct 7 for blowing cooling air to the heat exchanger 30. The opening 7a of the connecting duct 7 is connected to the lower surface of the left heating coil 20b. It constitutes a flow 88b toward it and a flow 89 to the heat exchanger 30.

  Here, the air of the first duct 3 or a part of the connecting duct 7 may be used for cooling the display panel 65 or the like.

  If the amount of air flowing through the circuit board 43 to the first duct 3 and the connecting duct 7 is insufficient for cooling the display panel 65, another cooling fan may be provided in the vicinity of the display panel 65. In order to improve the cooling performance, the cooling may be performed by using a structure using cooler air sucked from the side surface or the front surface of the main body 9.

  The coil base 21 on which the heating coil 20 is mounted is pressed against the top plate 70 via a resilient support portion 27 using, for example, a spring provided at least at three locations, and provided at the center portion thereof. The sensor unit 29, for example, a thermistor that is a contact temperature sensor, is in good contact with the top plate 70.

The air entering the first duct 3 from the substrate case 4 directly cools the right heating coil 20a by the air 88a blown out from the opening 3a, and the other air is a connecting duct connected to the first duct 3. 7 and is blown toward the left coil base 21 and the heat exchanger 30 as air 88b through an opening 7a provided on the upper surface of the connecting duct 7.

The air 88a, 88b that cools the left and right heating coils 20a, 20b flows in the space in which the heating coils 20a, 20b below the top plate 70 are disposed toward the back surface of the main body 9, and the air vent 71b on the top frame 72. The air is exhausted 82 from the outside. On the other hand, the air 89 whose temperature has increased by exchanging heat with the heat exchanger 30 in order to take the heat of the electronic component 41 is exhausted from a vent (not shown) on the side of the main body 9. The cooling air 88a and 88b and the air 89 may be merged and exhausted collectively from the ventilation port 71b.

  Here, in the present embodiment, the air intake 81 of the fan device 5 is configured to be performed through the vent hole 71a disposed on the top frame 72, but the side surface of the main body 9 is increased in order to increase the amount of blown air from the fan device 5. Another air inlet may be provided separately.

  Further, the exhaust 82 may have a structure in which another exhaust port is provided on the other side of the main body 9 and the ventilation resistance is reduced so that the air can be easily blown out of the main body 9.

The present embodiment is configured as described above. Next, the operation will be described by taking as an example the case where the cooking pot is placed on the right side pan mounting portion 73a on the top plate 70.

  For example, the cooking pot containing liquid such as water is heated by placing the cooking pot on the pan placing portion 73a on the top plate 70 and then turning on the main power supply 69 of the operation panel 6a provided in front of the main body 9. For example, by rotating the dial 67 for adjusting the thermal power, the heating control according to the thermal power adjustment amount displayed on the display panel 65 disposed in front of the top plate 70 is performed.

  Further, in the induction heating cooker of the present embodiment, the operation panel 6b is provided on the top frame 72, and the same operation as the operation panel 6a can be performed on the operation panel 6b.

  Therefore, the amount of high-frequency current supplied according to the heating power adjusted by the operation panel 6a or 6b is controlled in the heating coil 20a located below the cooking pot, and induction cooking of the cooking pot is performed while adjusting the heating power. Can do.

  At the same time as the current flows through the heating coil 20 a, the fan device 5 is operated and the cooling air 81 is sucked from the intake duct 60 located below the ventilation holes 71 a on the top frame 72 and is arranged inside the substrate case 4. The air is supplied to the fan device 5. In addition, the liquid is circulated to the heat receiving unit 31 and the heat exchanger 30 of the liquid cooling system by the liquid feeding means 33.

  When the cooking pot is induction-heated with the heating coil 20a, the heating efficiency depends on the material of the cooking pot, and the heat loss becomes the heat generation of the heating coil 20a and the electronic components 41 and 42 on the circuit board 43. The component temperature will rise.

  Here, the highly heat-generating electronic component 41 is fixed to the heat receiving portion 31 constituting the liquid cooling system, and the generated heat quantity is transported to the heat exchanger 30 and efficiently cooled.

  The air flowing into the fan device 5 provided behind the circuit board 43 from the intake duct 60 passes cooling air 85a, 85b toward the circuit boards 43a, 43b, 43c arranged in three stages in the height direction of the main body 9. The air flows from the back side to the front side of the main body 9 so that the electronic components 42 on the circuit board 43 are cooled and blown out.

  Here, in the circuit board 43, the electronic component 41 having a large heat generation is radiated by the heat exchanger 30 through the heat receiving portion 31, so that the temperature rise of the air flowing on the circuit board 43 can be small, and the circuit Cooling air 88a having a small temperature rise can be supplied to the heating coil 20a that cools the first coil 3 downstream of the substrate 43.

  Similarly, air 88b for cooling the left heating coil 20b and air 89 for cooling the heat exchanger 30 can be supplied.

  That is, the air that has entered the board case 4 efficiently cools the electronic components 42 on the circuit board 43, and a part of the air 88 a that has flowed into the first duct 3 provided on the ceiling surface of the board case 4 is on the right side. The heating coil 20 a is cooled, a part of the air 88 b flowing into the connection duct 7 cools the left heating coil 20 b, and the air 89 that flows downstream of the connection duct 7 cools the heat exchanger 30.

Here, in this embodiment, all the air that has cooled the circuit board 43 is connected to the left and right heating coils 20a and 20b and the heat exchanger 30 via the first duct 3 and the connecting duct 7 connected to the first duct 3. The display panel 65 is cooled. Alternatively, a separate air path may be formed from the substrate case 4, or a small fan may be disposed and cooled.

  The air that has cooled the heating coil 20 and the display panel 65 flows around the coil base 21, and a part of the air is exhausted to the outside through the vent hole 71 b of the top frame 72 from the exhaust port 61 at the rear of the main body 9.

  Here, the fan device 5 may control the air volume stepwise or steplessly in advance by the heating adjustment amount by the operation panels 6a and 6b, or may measure the temperature of the heating coil 20 and the electronic component 42 to turn on / off. The air volume may be adjusted by OFF control or intermittent operation.

  Further, the liquid feeding means 33 may control the amount of the water feeding liquid stepwise or steplessly in advance by the heating adjustment amount by the operation panels 6a and 6b, or measure the temperature of the heating coil 20 and the electronic component 42. It may be controlled by ON / OFF control or intermittent operation.

  Thus, in the case of an induction heating cooker equipped with a liquid cooling system as in this embodiment, the electronic component 41 that generates high heat on the circuit board is cooled by liquid cooling, and the other electronic components 42 are cooled by air cooling. Thus, it is possible to efficiently cool each electronic component by separating the cooling method according to the required cooling capacity of the electronic component.

  Further, since the heat exchange system 30 has a wide heat radiation area, the heat of the electronic component 41 that generates high heat on the circuit board 43 can be efficiently cooled via the heat receiving portion 31.

  Further, since the air that has passed through the circuit board 43 is air that has cooled the electronic component 42 that generates little heat, the temperature rise is small, and the cooling air is disposed downstream of the circuit board 43 via the ducts 3 and 7. The heating coil 20 can be efficiently cooled.

  Furthermore, since air with a small temperature rise can be efficiently used for cooling the heating coil 20, high cooling performance can be maintained even with a low air volume, and a low noise kitchen environment can be provided.

  Further, the liquid cooling system can be mounted compactly without changing the arrangement of the conventional heating coil 20 and the like.

  Further, the exhaust port of the heat exchanger 30 having a high exhaust heat temperature is provided on the side surface of the cooker body 9, and the exhaust port of the air that has cooled the heating coil 20 is separated, so that the exhaust port is widened and the ventilation resistance of the exhaust is increased. And the exhaust heat performance inside the main body can be improved.

  In addition, since the heat exchanger 30 having a large heat transfer area can provide a sufficient cooling capacity even with a low airflow, an induction heating cooker with quiet fan noise can be provided.

  FIG. 8 shows a perspective view of another embodiment of the present invention.

In this embodiment, the heat exchanger 30 constituting the liquid cooling system is provided at two locations 30a,
30b is a configuration in which the volume of the heat exchanger 30 is larger than in the above-described embodiment, and the heat dissipation performance of the electronic component 41 that generates high heat is further increased.

  An exhaust port 9a connected to the air passage of the first duct 3 and the heat exchanger 30a is provided on the right side surface of the main body 9, and an exhaust port (not shown) connected to the air passage of the connecting duct 7 and the heat exchanger 30b on the left side surface of the main body 9. ) Are provided, and the flow resistance of the exhaust heat air is reduced so that a sufficient amount of cooling air can be easily supplied by the internal fan device. In addition, the other component structure and effect are the same as that of the induction heating cooking appliance shown in FIG. 1, and description is abbreviate | omitted.

  As in this embodiment, the air after cooling the circuit board 43 flows in, the first duct 3 provided with the opening 3a for blowing the cooling air to the right heating coil 20a, and the first duct 3 are connected to the left side. The heat exchangers 30a and 30b for dissipating the heat of the highly heat-generating electronic component 41 of the circuit board 43 are provided at both ends of the connecting duct 7 provided with openings 7a for blowing cooling air to the heating coil 20b. The heating coil 20a, 20b downstream of the circuit board 43 can be efficiently cooled by further suppressing the temperature rise of the air passing through the inside.

  In the embodiments so far, the exhaust port of the heat exchanger 30 provided in the ducts 3 and 7 is provided on the side surface of the main body 9, but the exhaust gas of the heat exchanger 30 is discharged into the space where the heating coil 20 is disposed. The cooling air 88a and 88b of the heating coil 20 may be exhausted from the back side of the main body 9.

  FIGS. 9 to 13 show still another embodiment of the present invention, and are perspective views in which air paths for cooling the upper surface and the lower surface of the heating coil 20 are separately configured.

That is, as shown in FIG. 11, two paths of a flow 87 from the fan device 5 toward the upper surface of the heating coil 20 and a flow 85 toward the circuit board 43 are configured, and the air after passing through the circuit board 43 is left and right. It has a flow configuration for cooling the heating coils 20a and 20b and the heat exchanger 30.

  Here, in this embodiment shown in FIGS. 9 and 10, the fan device 5 that supplies cooling air to the circuit board 43 and the heat exchanger 30 is configured by a turbo fan. Of course, the fan device 5 can be applied regardless of the type of fan such as a sirocco fan, an axial fan, and a cross-flow fan. Therefore, FIG. 13 shows an example in which two fan devices 5a and 5b including a sirocco fan 5b and an axial fan 5a are configured.

  10 is a side sectional view on the heating coil 20a side in the perspective view of FIG. 9, and FIG. 13 is a side sectional view on the heating coil 20a side in the perspective view of FIG.

In the present embodiment, the first duct 3 that allows the air blown from the fan device 5 to flow in through the circuit board 43 and the second duct 1 that directly flows in from the fan device 5 are provided. At least the heating coil 20a via the connecting duct 7 connected to the duct 3;
The air is supplied to 20b and the heat exchanger 30 and also to the gap between the heating coils 20a and 20b and the top plate 70 via the second duct 1.

  The heating coils 20a and 20b according to the present embodiment are obtained by increasing the number of coil wires and the number of litz wires in order to increase the thermal power with respect to, for example, higher frequency of the coil supply current. This is suitable when it is necessary to supply air to both the upper and lower surfaces of the heating coils 20a and 20b for cooling.

As shown in FIG. 10, the air 87 a that cools the upper surface side of the heating coils 20 a and 20 b flows between the heating coil 20 and the top plate 70 from the center of the coil base 21 through the second duct 1 connected to the fan device 5. It flows into the gap 19.

In FIG. 9, the second duct 1 is separated at the connecting portion with the fan device 5, and two parallel flows of an air path flowing through the right heating coil 20 a and an air path flowing through the left heating coil 20 b are configured. did.

  Here, in FIG. 9, the second duct 1 for cooling the upper surfaces of the heating coils 20a and 20b is constituted by two air passages from the fan device 5, but two openings 1a and 1b are provided by one air passage. It may be a configuration.

  On the other hand, the configuration of the first duct 3 and the connecting duct 7 is the same as that of the first embodiment, and the description thereof is omitted. In this embodiment, the air 88 that blows the ducts 3 and 7 from below the heating coil 20 has a plurality of small sizes. It is configured to blow out from the opening toward the lower surface of the heating coil 20 (jet flow).

  In the jet configuration, a plurality of opening holes are provided on the lower surfaces of the heating coils 20a and 20b on the surfaces of the wide heating coils 20a and 20b, and air is blown out over the entire lower surface to uniformly blow the temperature, thereby reducing temperature unevenness. In addition, the smaller the diameter of the blown air, the higher the air velocity, the higher the air velocity, the higher the cooling performance can be obtained.

  If the heating coil 20 can be easily cooled, air may be supplied from the opening of the duct as in the first embodiment.

  Similarly, in the present configuration, the electronic component 41 that generates a large amount of heat is radiated by the heat exchanger 30 via the heat receiving unit 31 of the liquid cooling system. Even if it flows through the gap between the substrates 43a and 43b, the heat generation of the electronic component 42 is small, so the temperature rise of the air flowing into the first duct 3 is small.

  For this reason, even if the air to be heat-exchanged by the heating coils 20a and 20b and the heat exchanger 30 is low in air volume, the cooling of the heating coil 20 and the heat of the electronic component 41 generating high heat can be sufficiently radiated.

  With the configuration shown in FIGS. 9 and 10, the single fan device 5 can efficiently perform the heating coils 20 a and 20 b, the upper and lower surfaces of the heating coils 20, the electronic component 42 that generates little heat on the circuit board 43, and the electronic component 41 that generates high heat. The cooling air can be supplied to the heat exchanger 30 that dissipates the heat.

  Further, if the two fan devices 5a and 5b are used as shown in FIG. 13, the air volume distribution between the first duct 3, the connecting duct 7 and the second duct 1 can be easily adjusted, and the heating coil 20 and the circuit can be adjusted more efficiently. The substrate 43 can be cooled.

  12 and 13, the flow 87 from the fan device 5b toward the upper surface of the heating coil 20 and the flow 85 from the fan device 5a toward the circuit board 43 are shown in FIG. The path is configured so that the air that has passed through the circuit board 43 cools the left and right heating coils 20a, 20b and the heat exchanger 30, and uses the first duct 3, the connecting duct 7, and the second duct 1. Thus, the same cooling effect as in FIGS. 9 and 10 can be realized.

It is a perspective view of the state which removed the top plate 70 from the main body 9 of the induction heating cooking appliance in the 1st Example of this invention. FIG. 3 is a perspective sectional view showing an internal structure of a substrate case 4 incorporated in a main body 9 shown in FIG. FIG. 2 is a perspective cross-sectional view showing a liquid cooling system incorporated in a main body 9 shown in FIG. 1. It is side surface sectional drawing by the side of the pan mounting part 73a shown in FIG. It is explanatory drawing which shows the flow structure of the cooling air of the induction heating cooking appliance shown in FIG. It is explanatory drawing which shows the structure of the liquid cooling system of the induction heating cooking appliance shown in FIG. It is a perspective sectional view of the heat receiving part 31 which comprises the liquid cooling system of FIG. It is a perspective view of the state which removed the top plate 70 from the main body 9 of the induction heating cooking appliance in the other Example of this invention. It is a perspective view of the state which removed the top plate 70 from the main body 9 of the induction heating cooking appliance in further another 3rd Example of this invention. It is side surface sectional drawing of the induction heating cooking appliance shown in FIG. It is explanatory drawing of the flow structure of the cooling air of the induction heating cooking appliance shown in FIG. It is a perspective view of the state which removed the top plate 70 from the main body 9 of the induction heating cooking appliance shown in FIG. It is side surface sectional drawing of the other induction heating cooking appliance shown in FIG. It is a flow block diagram of the cooling air of the other induction heating cooking appliance shown in FIG. It is a flow block diagram of the cooling air in the conventional induction heating cooking appliance.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... 2nd duct, 3 ... 1st duct, 4 ... Board case, 5 ... Fan apparatus, 6 ... Operation panel, 7 ... Connection duct, 9 ... Main body, 20a, 20b ... Heating coil, 30 ... Heat exchanger, 31 DESCRIPTION OF SYMBOLS ... Heat receiving part, 32 ... Water storage means, 40 ... Heat sink, 43 ... Circuit board, 70 ... Top plate, 71 ... Ventilation hole.

Claims (4)

  Heat exchange was performed with a heating coil provided under the top plate for induction heating the cooking pan, a circuit board for supplying high-frequency current to the heating coil, a fan device for supplying cooling air, and electronic components of the circuit board. Induction heating cooking comprising: a liquid cooling system having a heat exchanger that performs heat exchange between liquid and air; and an air flow path that guides air supplied from the fan device to the circuit board to at least the heat exchanger. vessel.   The induction heating cooker according to claim 1, wherein the air flow path guides the air supplied to the circuit board to the heating coil.   The induction heating cooker according to claim 2, wherein the air supplied from the fan device to the circuit board is communicated with the fan device in addition to an air flow path for guiding the air to the heating coil and the heat exchanger. An induction heating cooker provided with another air flow path for guiding the air supplied from the fan device between a heating coil and a top plate. The induction heating cooker according to claim 1, wherein an exhaust port for air exchanged by the heat exchanger is provided on a side surface of the cooker body.

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