JP2003248530A - Electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device capable of effectively cooling an integrated circuit element arranged so as to enable heat exchange in a cold plate. <P>SOLUTION: The device accommodates a circuit board 5 where an integrated circuit element is packaged in a case 3. There are provided: a heat exchanger 11 for cooling a brine heated at a cold plate 16 attached to the integrated circuit element; a fan casing 39 for constituting a wind path communicating from a cross flow fan 14 arranged at one opening of the case to the heat exchanger; a passageway of the brine constituted in the cold plate; and a plurality of vents 44 formed at the position facing to the circuit board of the surface surrounding the circuit board of the case. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device that houses a circuit board on which integrated circuit elements such as CPU and LSI, which require measures against heat generation, are mounted in a single case.

[0002]

2. Description of the Related Art In recent years, semiconductor integrated circuit elements such as CPUs and LSIs having a microminiature electronic circuit in which elements having a large number of semiconductors and internal wiring are combined as a single solid by a special method are often used. Is becoming. An integrated circuit device equipped with this microelectronic circuit generates a large amount of heat during its operation. When the temperature of this integrated circuit element rises, a problem occurs that the operation of itself becomes unstable,
If the temperature rises further, the semiconductor will be destroyed. Therefore, the heat sink is attached to the integrated circuit element to exchange heat between the heat sink and the air, and the heat of the integrated circuit element is released into the air to cool the integrated circuit element. It was intended to prevent unstable operation and thermal destruction due to high temperature.

On the other hand, in a data communication network using a communication line and a computer network (LAN) for performing high-speed data transfer using a private line within a limited range such as a building or a premises, the above is used. A server provided with a large number of electronic devices using integrated circuit elements is used. That is, in such a server, a large temperature rise occurs due to the operation of a large number of integrated circuit elements. Therefore, conventionally, the entire room in which the server is installed is cooled by a cooling device, and the cool air is taken into an electronic device, so The method of cooling was taken.

[0004]

However, conventionally, a propeller fan (blower) provided on the back surface of an electronic device is conventionally used.
Although the cold air is taken in by the so that the flow of the cold air generated in the electronic device hits the integrated circuit element, only a part of the cold air hits the integrated circuit element, and the cooling efficiency was not good.

Therefore, a part of the cool air taken into the case by the blower is discharged to the outside of the electronic device without cooling the integrated circuit element.

The present invention has been made in order to solve the problems of the related art, and provides an electronic device capable of effectively cooling an integrated circuit element provided in a cold plate by heat exchange. The purpose is to

[0007]

That is, the electronic device of the present invention accommodates a circuit board on which an integrated circuit element requiring heat generation is mounted in a single case. A cold plate attached to this integrated circuit element to allow heat transfer from the heat exchanger, a heat exchanger that circulates the brine heated by this cold plate to cool the brine, and a blower fan installed in the opening on one side of the case. From the heat exchanger to the heat exchanger, a fan tank that is provided in order in the flow of brine from the heat exchanger to the cold plate, and a pump that circulates the brine and a reservoir that stores the brine, and a cold plate. At least one pair of reciprocating linear flow paths of brine and the circuit board of the surface surrounding the circuit board of the case face each other. Characterized in that it comprises a plurality of vents formed in that position.

According to the electronic device of a second aspect of the present invention, in addition to the first aspect of the present invention, the vent hole is formed by cutting and raising a part of the case.

According to the electronic device of the invention of claim 3, in addition to the invention of claim 1 or 2, the temperature of the cold plate is +70 when the temperature around the outer periphery of the case is + 35 ° C. or more.
It is characterized by including a control unit for controlling at least one of the blower fan and the pump so that the temperature becomes equal to or lower than ° C.

According to the present invention, in an electronic device that accommodates a circuit board on which an integrated circuit element requiring heat generation countermeasures is mounted in a single case, heat can be transferred from the integrated circuit element. A cold plate that is attached to the cold plate, a brine that is heated by this cold plate circulates, a heat exchanger that cools this brine, and an air passage that connects the blower fan installed in the opening on one side of the case to the heat exchanger are configured. A fan casing, which is provided in the flow of brine from the heat exchanger to the cold plate in order, a reserve tank for storing the brine and a pump for circulating the brine, and a cold plate,
Since at least a pair of reciprocating linear flow paths of brine and a plurality of vent holes formed at positions facing the circuit board of the case surrounding the circuit board are provided in the case by a blower fan inside the case After the air taken into the case is heated by exchanging heat with the heat exchanger, new outside air can be taken into the case from a plurality of vent holes formed in the case, and the heat exchanger and the heat It is possible to avoid the disadvantage that the temperature inside the case remarkably rises due to the exchanged air.

According to the invention of claim 2, in addition to the invention of claim 1, since the vent hole is formed by cutting and raising a part of the case, the vent hole can be easily formed. It becomes possible to improve productivity.

According to the invention of claim 3, in addition to the invention of claim 1 or 2, the temperature in the vicinity of the outer periphery of the case is +3.
When the temperature is 5 ° C or higher, a control unit for controlling at least one of the blower fan and the pump is provided so that the temperature of the cold plate becomes + 70 ° C or lower, so that the cooling capacity of the cold plate is controlled by the blower fan or pump. Will be able to. As a result, the cooling capacity can be quickly increased even with rapid heat generation of the integrated circuit element,
It becomes possible to avoid occurrence of damage to the element.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described in detail with reference to the drawings. 1 is a front view of a server rack 2 on which a plurality of servers 1 as an embodiment of an electronic device to which the present invention is applied are stacked, and FIG. 2 is a perspective view of a server 1 as an embodiment of an electronic device of the present invention. 3 is a perspective view of the case 1 of the server 1 with the top cover 4 removed, and FIG. 4 is a plan view of the server 1 of FIG.

In each figure, a server (1U server) 1 of the embodiment is the center for providing various services to a computer connected to a network, and a server rack 2 having casters 2A for movement on the bottom surface. Is attached to the frame 2B, and a plurality of units are installed over a plurality of upper and lower stages.

Each server 1 houses a circuit board 5 on which a plurality of semiconductor integrated circuit elements 6 such as LSI and CPU are mounted (or may be single). Further, at the bottom of the server rack 2, there is provided a controller 52 for managing task allocation to each server 1 and operation status.

The server 1 has a height of 45 mm and a width of 450, for example.
3 mm and a thin rectangular shape with a depth of 530 mm
Inside the circuit board 5 and the flexible disk drive 3
1, CD-ROM drive 32, power supply circuit (POWER
R) 9, connector (I / O) 8 and other electronic components, a plate fin type heat exchanger 11, a cross flow fan 14 as a blower fan, and a brine circulation pump 1
5. A brine cooling device 10 including a reserve tank 26 for storing brine, a cold plate 16 that is attached to the integrated circuit element 6 so as to be capable of heat transfer and cools the integrated circuit element 6, and the like. It is configured. The case 3 includes a front surface 3A, a bottom surface 3B, a rear surface 3C, and left and right side surfaces 3D and 3D, and an upper surface thereof is covered with a removable upper surface cover 4.

In this case, the flexible disk drives 31 and C are provided at the right end when facing the front surface 3A of the case 3.
The D-ROM drive 32 is exposed, and the opening 30 is formed on the left side thereof. The heat exchanger 11 is disposed inside the case 3 so as to correspond to the inside of the opening 30. The heat exchanger 11 has a plurality of plates 12 having a good heat conductivity such as aluminum thin plates arranged at intervals of 1 mm to 5 mm, and penetrates through the plates 12 so as to be able to transfer heat, and the inside thereof is covered with brine. And a meandering aluminum pipe 13 through which the flowing water flows.

When the space between the plates 12 is small, an air filter 34, which will be described later, is used with appropriate eyes, and when the space is wide, a safety structure such as a slit is used instead of the air filter 34.

On the side of the opening 30 of the heat exchanger 11, a fan casing 39 of the cross flow fan 14 is arranged corresponding to the opening 30. As a result, the cross flow fan 14 is provided near the opening 30. The fan casing 39 is for forming an air passage connecting from the opening 30 to the heat exchanger 11, and the opening 33 of the fan casing 39 faces the outside while directing downward from the opening 30 of the case 3 and also to the opening 33. An air filter 34 for removing dust is attached.

A curved opening angle adjusting plate 36 is attached to the upper edge of the opening 33 of the fan casing 39 in the shape of an eaves. The opening angle adjusting plate 36 is detachably attached to a locking plate 37 provided at an upper part of the opening 33 at ribs 37A ... By changing the position of the matching rib 37A, the amount of protrusion from the upper edge of the opening 33 can be changed in three steps.

As a result, the amount of protrusion of the fan casing 39 on the extension can be changed, and the downward angle of the opening 33 can be changed in three steps, for example, 15 °, 30 °, 45 ° from the horizontal, and Air is effectively sucked in from a direction that matches this angle.

Here, in the computer room in which this kind of server rack 2 is installed, a circulation path is formed in which cooling air is blown out from the floor side and sucked from the ceiling side. As described above, the servers 1 are mounted on the server rack 2 in a plurality of stages, but the downward angle of the opening 33 is shallow (closer to horizontal) in the upper server 1, and the downward angle of the opening 33 is lower in the lower server 1. By making the depth deeper (toward the lower side), the cooling air rising from the floor can be easily and smoothly taken into the case 3 by the servers 1 ... Like

The cooling air (cold air) is the case 3
It flows through the inside and is discharged from the back surface (rear surface) of the case 3.

A flap plate 38 for rectification is attached to the fan casing 39 at the rear side of the cross flow fan 14, that is, on the heat exchanger 11 side, and the air from the cross flow fan 14 is introduced into the heat exchanger 11. It prevents one side from hitting. Further, on both sides of the fan casing 39, the plurality of plates 12 of the rear heat exchanger 11 are ...
Air passage members 41 extending to both sides and the lower side are integrally formed. The air passage member 41 may be an extension member separate from the fan casing 39.

Here, the upper edge of the plate 12 of the heat exchanger 11 is in contact with the upper surface cover 4 of the case 3, and the lower edge is in contact with the lower surface of the air passage member 41 which is in contact with the bottom surface 3B of the case 3. ing. Since the left and right surfaces of the air passage member 41 are located on the left and right of the outermost plate 12, these constitute the casing of the heat exchanger 11. Further, due to the air passage member 41 of the fan casing 39, the air blown from the cross flow fan 14 is transmitted to the plate 12 of the heat exchanger 11.
・ ・ Will be concentrated on.

As a result, the air sucked into the case 3 is guided only between the plates 12 of the heat exchanger 11, so that the heat exchange efficiency is reduced when it leaks to other places. To avoid the heat exchanger 1 described later
The heat exchange efficiency with the brine flow in 1 is improved.

In this case, the cross flow fan 14 is arranged in the longitudinal direction (left-right direction) of the heat exchanger 11 on the air inflow side (front side).
The air sucked from the opening 30 (opening 33) is supplied in a line along the longitudinal direction of the heat exchanger 11. As a result, the air drawn into the case 3 from the opening 30 by the cross flow fan 14 can be efficiently blown to the heat exchanger 11.
Incidentally, 14M is a motor of the cross flow fan 14 (a DC motor whose rotation speed changes according to an applied voltage) and is attached to the outer surface of the fan casing 39.

On the other hand, ventilation holes 42, 42 are formed on the left and right of the rear surface 3C of the case 3, and ventilation fans 43 for exhaust are attached to the ventilation holes 42, 42, respectively. The circuit board 5 is located between the heat exchanger 11 and the ventilation holes 42, 42, and is located on the bottom surface 3B of the case 3.
Is mounted on. Further, the power supply circuit 9 is provided corresponding to the inside of the left vent hole 42.

The left and right side surfaces 3D and 3D of the case 3 surrounding the circuit board 5 have side surfaces 3 corresponding to the circuit board 5.
A plurality of vent holes 44 ... Are formed by cutting and raising D and 3D inward (FIG. 6). The cut-and-raised portion of the vent hole 44 is directed obliquely rearward.

When the cross flow fan 14 is operated,
The air sucked into the case 3 through the opening 30 is blown onto the heat exchanger 11, passes through the plates 12, ... And reaches the circuit board 5. After that, cold plate 16 ・
.. Blower fans 43, 43 passing around the power supply circuit 9
Is sucked in and discharged from the vent holes 42, 42 to the outside. As a result, a series of ventilation paths extending from the opening 30 to the ventilation holes 42, 42 are formed in the case 3.

Further, fresh air (heat exchanger 11 is also supplied from the vents 44 formed in the side surfaces 3D, 3D by such ventilation.
Outside air) is sucked in, passes through the cold plate 16 on the circuit board 5 ...
It will be discharged from 2, 42. As a result, it is possible to prevent the temperature in the case 3 from abnormally rising due to the air that has exchanged heat with the heat exchanger 11, and at the same time, the cold plate 1
The air cooling effect of 6 ... Further, since the vent hole 44 is formed by cutting and raising, the productivity of the case 3 is also improved.

The brine outlet 13A of the pipe 13 of the heat exchanger 11 is disposed at the upper end of the left front side facing the heat exchanger 11, and the pipe 46 connected to this outlet 13A is the inlet of the reserve tank 26. It is connected to the. The pipe 47 connected from the outlet of the reserve tank 26 is connected to the suction port of the pump 15, and the discharge port of the pump 15 is connected to the inlet of the aluminum pipe 23 of the cold plate 16 described later.

The outlet of the pipe 23 is connected to the brine inlet 13B of the pipe 13 of the heat exchanger 11 via the pipe 48 to form an annular brine circulation passage of the brine cooling device 10. That is, the reserve tank 26 and the pump 15
Is from the outlet 13A of the heat exchanger 11 to the cold plate 16
They are provided in sequence in the flow of brine towards. Then, the brine is enclosed in this annular brine circulation path.

As the brine, a liquid heat medium that does not boil due to the heat generated by the integrated circuit element 6 is used, and is filled with antifreeze in the embodiment. The brine may be ordinary water, pure water, HFE (hydrofluoroether), or the like.

In this case, the inlet 13B of the pipe 13 of the heat exchanger 11 is located directly below the outlet 13A in the left front part of the heat exchanger 11, and these inlet 13B and outlet 13A (at least the outlet 13A) are provided from the cold plate 16. Is also located in a high position. Further, the bottom surface 3B of the case 3 at a position corresponding to the lower side of the heat exchanger 11 is set to be higher than the other portions (FIG. 7), whereby the heat exchanger 11 is
A lower part 49 lower than the lower end of the heat exchanger 11 is formed on the left side of the heat exchanger 11. The outlet 13A and the inlet 13B of the pipe 13 of the heat exchanger 11, the pipes 46 and 4
8 and the reserve tank 26, the pump 15, the pipe 47 (these pipes serve as a pipe line through which brine circulates), etc. are all arranged on or above the lower portion 49.

The circuit board 5 is mounted at a position higher than the upper surface of the lower portion 49 by raising it with a spacer. Further, the reserve tank 26 and the pump 15 are arranged in the front portion on the lower portion 49. Further, the upper surface of the lower portion 49 is inclined downward toward the front as a whole (FIG. 8), and a detection sensor 51 for detecting the brine when the brine is accumulated is attached to the lowest front end portion.

With such a configuration, the inlet / outlet ports 13A, 13B of the pipe 13 of the heat exchanger 11 and the respective pipes 46, 47, 4
When the brine leaks due to cracks or damages to the connecting parts such as 8, 23, the reserve tank 26, the pump 15 or the like, the leaked brine flows down along the slope of the lower part 49 of the bottom surface 3B of the case 3. However, they are collected in the front part in the lower part 49. This makes it possible to delay and avoid the disadvantage that the circuit board 5, the integrated circuit element 6 attached to the circuit board 5, the pump 15, the heat exchanger 11 and the like are immersed in the brine and cause a failure as much as possible. .

In particular, since the outlet 13A of the heat exchanger 11 is located higher than the cold plate 16, even if a poor connection with the pipe 48 occurs at the outlet 13A, the pump 15 is stopped by the time described later. It is possible to minimize the amount of brine leaking from the inside of the heat exchanger 11.
The brine that has leaked to the lower portion 49 is detected by the detection sensor 51, and the pump 15 is stopped and an alarm is output, as will be described later. Further, between the lower portion 49 and the heat exchanger 11 and the circuit board 5, a rib 50 is erected from the bottom surface 3B of the case 3 to prevent the brine from flowing to the circuit board 5 side when the brine leaks. To prevent.

As described above, a plurality (three in the present embodiment, but a single number) of semiconductor integrated circuit elements 6 are attached to the circuit board 5, and each integrated circuit element 6 ...
Are linearly arranged at a predetermined interval, and the integrated circuit elements 6 ... Are attached to the circuit board 5 via the sockets 7 (FIG. 9).

A cold plate 16 is attached to each of the integrated circuit elements 6 ... In a heat exchange manner, and a grease 24 having a high thermal conductivity is provided between the cold plate 16 and the integrated circuit element 6. It has been applied.
The grease 24 corresponds to the integrated circuit element 6 and the cold plate 1
6 and 6 are closely contacted with each other without a gap, whereby heat of the integrated circuit element 6 is efficiently transferred to the cold plate 16. Instead of the grease 24, an elastic sheet material having good thermal conductivity as described later may be used.

The cold plate 16 is constituted by, for example, caulking two aluminum plates having a high thermal conductivity (heat conductivity) to join them. Cold plate 1
Reference numeral 6 is composed of a base member 17 as a plate-shaped heat-conducting material located on the integrated circuit element 6 side, and a lid member 18 as a plate-shaped heat-conducting material that is adhered to and adhered to the base member 17. The above-mentioned pipe 23 is sandwiched between the member 17 and the lid member 18 (FIG. 9).

A plurality of pipe grooves 21 (a pair in this embodiment) are formed on the base member 17 from the front end to the rear end, and the pipe grooves 21 are formed in parallel at a predetermined interval. (FIG. 10). The pipe grooves 21, 21 are pipes 23
The pipe groove 21 is formed as a semi-circular shape equivalent to the outer peripheral shape of the base member 17, and both pipe grooves 21 are formed inside from the both sides of the base member 17 with a predetermined interval.

Further, one pipe groove 21 and the base member 1
An engaging groove (recess) 19 having a predetermined depth and a predetermined width is formed between one side of the base member 17 and the rear end of the base member 17. The engaging groove 19 is formed in a substantially U-shaped cross section, and is formed in the base member 17 so as to be substantially parallel to the pipe groove 21. Further, an engaging groove 19A is formed between both pipe grooves 21 in parallel with the pipe groove 21 from the front end to the rear end of the base member 17, and the engaging groove 19A is similar to the engaging groove 19 described above. Has been formed.

The base member 17 has an engaging projection (projection) 2 having a predetermined height and width from the front end to the rear end thereof.
0B is formed. The engagement protrusion 20B is formed so as to protrude from the base member 17, and the one pipe groove 21 is formed.
Is formed in parallel with the pipe groove 21. Further, the base member 17 is formed with an engaging protrusion 20C from the front end to the rear end thereof, and the engaging protrusion 20C is formed in the same shape as the engaging protrusion 20B, and is formed in the other pipe groove 21. On the other hand, it is located on the opposite side of the engagement groove 19A. That is, the engaging groove 19, the pipe groove 21, the engaging protrusion 20B, and the engaging groove 19 are sequentially arranged from one side of the base member 17.
A, the pipe groove 21, and the engaging protrusion 20C are formed at a predetermined interval, and all of them are formed on one surface side of the base member 17.

On the other hand, a plurality of (two) pipe grooves 21 are formed in the lid member 18, and these pipe grooves 21 are formed in the same shape as the pipe grooves 21 formed in the base member 17. . Both pipe grooves 21 formed in the lid member 18 are formed at positions facing the both pipe grooves 21 formed in the base member 17 when the lid member 18 is overlapped with the base member 17, and the base member 17 and the lid member are formed. The pipes 23 and 23 are respectively sandwiched between the pipe grooves 21 formed in 18 and.

A sheet material 53 made of a thin graphite sheet having a thickness of 50 μ and having thermal conductivity and elasticity is interposed between the pipe 23 and the lid member 18, and the base member 17, the pipe 23 and It is sandwiched between the lid members 18.
The sheet material may be on the side of the base member 17 of the pipe 23.
Further, as described above, the integrated circuit element 6 and the cold plate 1
It may be provided between 6 and may be stuck to the upper surface of the cold plate 16. Further, as the material of the sheet material 53, copper foil or the like can be considered.

The sheet material 53 has a high heat conductivity in the surface direction, which allows good heat transfer between the pipe 23 and the base member 17 and the lid member 18 in a wide range, and the heat transfer efficiency. Will be able to improve. Due to such an action, the heat transfer from the integrated circuit element 6 to the brine flowing in the pipe 23 of the cold plate 16 is extremely smoothly performed. The same grease as described above may be applied to the surface on which the sheet material 53 is not provided (for example, the upper surface of the base member 17 in FIG. 10).

In this case, the lid member 18 has an engaging projection 2 similar to the engaging projections 20B and 20C extending from its front end to its rear end.
0 and 20A are formed. The engaging protrusions 20, 20
A is the engagement grooves 19 and 19A formed in the base member 17.
Is formed at a position facing each other, and both engaging protrusions 20,
20A is press-fitted into the engaging grooves 19 and 19A, respectively, when the lid member 18 is superposed on the base member 17.
Further, the lid member 18 is formed with engagement grooves 19B and 19C similar to the engagement grooves 19 and 19A from the front end to the rear end thereof. The engagement grooves 19B, 19C are formed at positions facing the engagement protrusions 20B, 20C formed on the base member 17, and both engagement grooves 19B are formed when the lid member 18 is superposed on the base member 17. , 19C are engaged with the engaging projections 20B, 20C by press fitting.

That is, the cold plate 16 is connected to the pipe 2 between the base member 17 and the lid member 18 (pipe grooves 21, 21).
3, 23 and the above-mentioned sheet material 53 are overlapped with each other, and the engaging projections 20 and 20A are press fit into the engaging grooves 19 and 19A, and the engaging projections 20B and 20C are press fit into the engaging grooves 19B and 19C. By combining and crimping, the base member 17 and the lid member 1
Fix 8 tightly. At this time, the outer peripheries of the pipes 23, 23 are tightly fixed to the base member 17 and the lid member 18 (via the sheet material 53). Both pipes 23, 23 are located outside the front and rear ends of the base member 17 and the lid member 18.

Cold plate 16 constructed in this way
In the example, three cold plates are prepared, and each cold plate 16 ...
The ends of the pipes 23 are connected by the connectors 23A. At this time, the cold plates 16 are connected in such a size that they are located on the three integrated circuit elements 6 mounted on the circuit board 5, and the piping 23 at the end of the cold plate 16 on one side is connected. A bend pipe (arc-shaped pipe) 23B is used for connection.

By connecting the cold plates 16 ... In this way, a pair of reciprocating linear brine flow paths are formed between the cold plates 16. By providing more pipes 23, a plurality of pairs of linear brine channels may be formed between the cold plates 16 ... Each cold plate 16 ... Is contacted and fixed onto each integrated circuit element 6 through the grease 24 having high thermal conductivity as described above (FIG. 9).

Of the three cold plates 16 connected in this way, the left end of the cold plate 16 located on the opposite side of the bend pipe 23B toward the pipe 23 is the discharge port from the pump 15 as described above. And heat exchanger 1
It is connected to the pipe 48 to 1 above the lower part 49.

Next, FIG. 11 shows an electric circuit diagram of the brine cooling device 10 of the server 1. 54 in this figure
Is a general-purpose microcomputer that constitutes a control unit and a detection unit. The input port of this microcomputer 54 is attached to each of the cold plates 16 ... Thermistors TH1, TH2, TH for detecting (or detecting the temperature in the vicinity of the integrated circuit element 6) respectively.
3 and a thermistor TH4 that is installed in the inlet 13B of the pipe 13 of the heat exchanger 11 or the pipe 48 connected thereto in a heat exchange manner to detect the return temperature of the brine to the heat exchanger 11 are connected.

A resistance (volume control) 56 for setting the maximum value Tmax (for example, + 80 ° C.) of the return temperature of the brine is connected to the input port of the microcomputer 54, and a mode switch 57 is also connected. Has been done. In addition, A of the microcomputer 54
A voltage that changes based on the temperature detection of the detection sensor 51 is applied to the / D (analog / digital conversion) input port, and the RESET of the microcomputer 54 is set.
A power ON (interlocked with power supply) reset signal is input to the input port. Furthermore, the microcomputer 5
4 exchanges data with the controller 52.

The signal output from the output port of the microcomputer 54 is supplied to the switching power supply circuits SW1 and SW2 via the buffer so that the output voltage of the switching power supply circuits SW1 and SW2 is + 6V to +1 in this embodiment.
It is controlled in the range of 2V. Further, a transistor 59 for controlling the energization of the relay 58 (relay coil) is also connected via a buffer, and the microcomputer 54 controls the O
N / OFF is controlled. An LED display 61 is also connected to the output of the microcomputer 54.

DC + 12V output from the power supply circuit 9 is supplied to each of the switching power supply circuits SW1 and SW2, and the output of the switching power supply circuit SW1 is the motor of the pump 15 via the resistor 62 and the normally open contact 58A of the relay 58. Supplied to 15M. The output of the switching power supply circuit SW2 is the resistor 63 and the normally open contact 58B of the relay 58.
Is supplied to the motor 14M of the cross flow fan 14 via the.

Further, on the output side of the switching power supply circuit SW1, a resistor 64 and a photocoupler PH are provided in parallel with the resistor 62.
A series circuit of 1 light emitting diode is connected, and the output of the phototransistor of this photocoupler PH1 is connected to the input port of the microcomputer 54.
Further, the resistor 6 is also provided on the output side of the switching power supply circuit SW2.
A series circuit of a resistor 66 and a light emitting diode of a photocoupler PH2 is connected in parallel with 3, and the output of the phototransistor of this photocoupler PH2 is connected to the input port of the microcomputer 54.

Next, the operation of the brine cooling device 10 of the server 1 under the control of the microcomputer 54 will be described with reference to the flow charts shown in FIGS. When the power is turned on, the power-on reset signal is input to the microcomputer 54 in step S1 of FIG. As the reset signal, the microcomputer 54 uses the relay 58 and the photocoupler PH.
The edge trigger by DC + 5V which becomes the power source of 1 and PH2 is used.

Next, the microcomputer 54 determines the maximum value Tmax of the return temperature of the brine set by the resistor 56 in step S2 and stores it in the memory (memory). In the embodiment, + 80 ° C. is set as Tmax. Next, in step S3, the microcomputer 54 has its own timer (for example, 5).
Minute timer) starts counting. Then, in step S4, it is determined whether or not the count of the timer has elapsed for 5 minutes, and if it has not elapsed, the process proceeds to step S5 to output the voltage signals for outputting DC + 12V to the switching power supply circuits SW1 and SW2, respectively, and 59 to O
Then, the relay 58 is energized. By energizing the relay 58, the contacts 58A and 58B are closed.

As a result, the motor 15M of the pump 15 and the motor 14M of the cross flow fan 14 respectively have D
C + 12V is supplied and both are operated at maximum capacity.
When the cross flow fan 14 is operated, air (outside air) is sucked from the opening 30 of the case 3 and blown in a line along the longitudinal direction of the heat exchanger 11 as described above. As a result, the air after cooling the plate 12 of the heat exchanger 11 and the piping 13 is cooled after passing through the cold plate 16 of the circuit board 5 and the periphery of the power circuit 9,
The air is blown out from the ventilation holes 42, 42 by the blower fans 43, 43.

Further, as described above, fresh air (outside air) is sucked from the vent holes 44 ... Of the side faces 3D, 3D, and after air cooling through the cold plate 16 of the circuit board 5 ... Similarly, the gas is discharged to the outside from the ventilation holes 42, 42.

On the other hand, when the pump 15 is operated, brine is discharged from the discharge port, and heat is sequentially exchanged with each cold plate 16 ... In the process of passing through the pipe 23, and then the heat exchanger is exchanged from the pipe 48. Inlet 13 of pipe 11
To B. The brine entering the inlet 13B is the heat exchanger 11
In the process of passing through the internal pipe 13 in a meandering manner, heat is exchanged with the pipe 13 itself and the plates 12, ...
It is cooled by the ventilation from 4.

The outlet 1 of the pipe 13 of the heat exchanger 11
The brine discharged from 3A reaches the reserve tank 26 via the pipe 46, and is repeatedly sucked from the suction port of the pump 15 through the reserve tank 26 to repeat the circulation. In this way, the cold plates 16 ... Are cooled by the brine which is air-cooled in the heat exchanger 11, and the integrated circuit elements 6 ... are cooled by the cold plates 16.

The microcomputer 54 determines in step S6 whether or not the phototransistors of the photocouplers PH1 and PH2 are turned on. Here, when no output is generated from the switching power supply circuits SW1 and SW2, the light emitting diodes of the photocouplers PH1 and PH2 do not emit light, and the phototransistors are off. The microcomputer 54 uses these photo couplers P
When the phototransistors of H1 and PH2 are turned on, it is determined that an output is generated from each of the switching power supply circuits SW1 and SW2, and the process returns to step S4, but the phototransistors of the photocouplers PH1 and PH2 are OF.
If it is F, there is a possibility that the pump 15 and the cross flow fan 14 are abnormal.
From step S7, an alarm is output by displaying an abnormality on the LED display 61.

After turning on the power of the microcomputer 54,
By continuing the operation of the cross flow fan 14 and the pump 15 at the maximum capacity until the timer counts up, heat generation at the startup of the server 1 is dealt with, and at the same time, the cooling capacity of the brine cooling device 10 is stabilized. Then, when 5 minutes have passed after the power was turned on and the timer counts up, the microcomputer 54 proceeds to step S4.
From step S8, it is determined whether the brine return temperature detected by the thermistor TH4 is equal to or higher than the maximum value Tmax.

If the temperature of the brine returned by exchanging heat with each cold plate 16 ... Has risen to a temperature of Tmax or higher, the microcomputer 54 executes step S.
12, the operation of the cross flow fan 14 and the pump 15 with the maximum capacity is continued in the same manner as described above, and at step S13, L
An error is displayed on the ED display 61 and the process returns to step S8. As a result, it is possible that the cold plate 16 is not effectively cooling the integrated circuit element 6, and an alarm is issued.

On the other hand, when the return temperature of the brine is lower than Tmax in step S8, the process proceeds to step S9 and the temperatures of the cold plates 16 ... Detected by the thermistors TH1, TH2, TH3 are fetched. Then, the highest temperature is selected from the thermistors TH1 to TH3 to be T0. Next, in step S10, T0 is T
It is determined whether or not the temperature is equal to or higher than max-5 (that is, + 75 ° C), and if it is higher than or equal to, the process proceeds to step S14, and the crossflow fan 14 and the pump 15 are operated at the maximum capacity as described above. Then, the process returns to step S8.

If T0 is lower than Tmax-5 in step S10, the process proceeds to step S11, in which T0 is T
It is determined whether or not it is equal to or higher than max-40 (that is, + 40 ° C). Then, when T0 is Tmax-40 or more and less than Tmax-5 (that is, + 40 ° C. or more and less than + 75 ° C.), the microcomputer 54 proceeds to step S20 in FIG.

In step S20, the microcomputer calculates a data table calculated in advance by PID (proportional differential integration) or fuzzy calculation based on ΔT obtained by the difference (change) between the current T0 and the previous T0 and the current T0. From this, the increase / decrease value ΔV of the output voltage of the switching power supply circuits SW1 and SW2 is obtained. The routine cycle in this case is, for example, 0.5 seconds, and in the calculation in step S20,
When the temperature around the outer circumference of the case 3 is + 35 ° C or higher, the temperature of the cold plate 16 is + 50 ° C to + 70 ° C.
The capacity of the pump 15 and the cross flow fan 14 is increased according to the temperature rise of the brine so that the set value becomes
Calculations are performed in the direction of decreasing the capacity according to the temperature decrease. The controller 52 may control the set value according to the operating rate of the server 1, or may have a structure that can be manually set arbitrarily.

Then, in step S21, the microcomputer 54 outputs the voltage signal Vnew output to each of the switching power supply circuits SW1 and SW2 to the current voltage signal + ΔV above.
At the same time, in step S22, the voltage signal is corrected so that the voltage signal Vnew does not exceed the lower limit of DC + 8V and the upper limit of + 12V, and the relay 58 is energized. As a result, the pump 15 and the cross flow fan 14 are operated with the adjusted capacity.

In step S24, the microcomputer 54 determines whether or not the phototransistors of the photocouplers PH1 and PH2 are turned on, and no output is generated from the switching power supply circuits SW1 and SW2. When the phototransistors of PH1 and PH2 do not emit light and each phototransistor is OFF, an alarm is output by performing an abnormal display on the LED display 61 in step S25 as described above. If the switching power supply circuits SW1 and SW2 are normal, the process returns to step S8.

On the other hand, in step S11, T0 is Tmax-
If it is lower than 40 (that is, + 40 ° C.), the microcomputer 54 proceeds to step S15 of FIG. 14 and determines whether or not the mode switch 57 is turned on. Now, assuming that the mode switch 57 is turned on, the microcomputer 54 proceeds from step S15 to step S17.
To output a voltage signal of DC + 8V to the switching power supply circuit SW1 and 0V to the switching power supply circuit SW2.
The voltage signal of is output to energize the relay 58.

As a result, the pump 15 is operated at the minimum capacity, and while maintaining the minimum brine circulation in the brine circulation passage of the brine cooling device 10, the cross flow fan 1
4 stops and ventilation is interrupted. This allows the mode switch 5 to operate when the brine return temperature is below + 40 ° C.
If 7 is turned on, the microcomputer 54 maintains the minimum cooling of the integrated circuit element 6 by the brine cooling device 10. In step S18, similarly, it is determined whether or not the output of the switching power supply circuit SW1 is generated by the phototransistor of the photocoupler PH1, and if it is not generated, the LED display 61 similarly displays an abnormality. Then, in any case, the process returns to step S8.

On the other hand, if the mode switch 57 is off, the microcomputer 54 proceeds to step S15.
To Step S16, the switching power supply circuit SW
A voltage signal of 0 V is output to 1 and SW2, the relay 58 is de-energized, and the process returns to step S8. That is, if the return temperature of the brine is lower than + 40 ° C., or if the mode switch 57 is off, the microcomputer 54
Stops the cooling of the integrated circuit element 6 by the brine cooling device 10.

Next, the flow charts of FIGS. 15 and 16 show another embodiment of the control by the microcomputer 54. Controller 52 provided in server rack 2
Calculates the operating rate of the integrated circuit element 6 provided for each server 1 by data communication with each server 1.
Although the temperature rise of the integrated circuit element 6 can be grasped from this operating rate, each operating rate is transmitted to the microcomputer 54. The flowchart in this case uses this operating rate for control.

That is, when the power is turned on, the power-on reset signal similar to the above is input to the microcomputer 54 in step S31 of FIG. Next, the microcomputer 54 determines the maximum value Tmax of the return temperature of the brine set by the resistor 56 in step S32 and stores it in the storage unit (memory). Also in this case, Tmax is set to + 80 ° C. all the time. Next, in step S33, the microcomputer 54 starts counting the timer (the above-mentioned 5 minute timer) which has its own function. Then, in step S34, it is determined whether or not the count of the timer has elapsed for 5 minutes, and if it has not elapsed, the process proceeds to step S35 to output the voltage signals indicating that DC + 12V is output to the switching power supply circuits SW1 and SW2, respectively. 59 is turned on to energize the relay 58. By energizing the relay 58, each contact 58A,
58B closes.

As a result, the motor 15M of the pump 15 and the motor 14M of the cross flow fan 14 respectively have D
Power is supplied from C + 12V, and both are operated at maximum capacity as described above. Further, the microcomputer 54 determines in step S36 whether or not the phototransistors of the photocouplers PH1 and PH2 are turned on, and an output is generated from the switching power supply circuits SW1 and SW2 so that the phototransistors of the photocouplers PH1 and PH2 are turned on. If so, it is determined that an output is generated from each of the switching power supply circuits SW1 and SW2, and the process returns to step S34. However, if the phototransistors of the photocouplers PH1 and PH2 are off, step S36. From step S37 to step S37, an alarm is output by displaying an abnormality on the LED display 61.

After turning on the power of the microcomputer 54,
The cooling capacity of the brine cooling device 10 is stabilized by continuing the operation of the cross flow fan 14 and the pump 15 with the maximum capacity until the timer counts up. Then, when 5 minutes elapses after the power is turned on and the timer counts up, the microcomputer 54 proceeds from step S34 to step S38, and the thermistor T
It is determined whether or not the brine return temperature detected by H4 is equal to or higher than the maximum value Tmax.

If the temperature of the brine returned after exchanging heat with each cold plate 16 ... Has risen to a temperature of Tmax or higher, the microcomputer 54 executes the step S.
In step 42, the crossflow fan 14 and the pump 15 continue to operate at the maximum capacity in the same manner as described above.
An abnormality is displayed on the ED display 61 and the process returns to step S38. This alerts that the integrated circuit elements 6 ... Have an abnormally high temperature.

On the other hand, when the return temperature of the brine is lower than Tmax in step S38, the process proceeds to step S39 and each integrated circuit element 6 sent from the controller 52.
The operation rates F1, F2, and F3 of .. Then, the highest operation rate is selected from the operation rates F1 to F3 and is set as F0. Next, in step S40, it is determined whether or not F0 is, for example, 80% or more.
Proceeding to step 4, the cross flow fan 14 and the pump 15 are operated at the maximum capacity as described above. Then, the process returns to step S38.

If F0 is lower than 80% in step S40, the process proceeds to step S41, in which F0 is, for example, 4%.
Judge whether it is 0% or more. And F0 is 40% or more,
If it is less than 80%, the microcomputer 54 proceeds to step S50 in FIG.

At step S50, the microcomputer switches the switching power supply circuits SW1 and SW2 from the data table calculated in advance by PID (proportional differential integration) or fuzzy calculation based on the deviation (change amount) between the previous F0 and the present F0. The increase / decrease value ΔV of the output voltage is obtained. The routine cycle in this case is, for example, 0.5 seconds, and the temperature outside case 3 is +35 in the calculation in step S50.
When the temperature is ℃, the temperature of the cold plate 16 is +70.
Calculations are performed so that the capacity of the pump 15 and the cross flow fan 14 is increased according to the temperature increase of the brine so that the temperature becomes equal to or lower than 0 ° C., and the capacity is decreased according to the temperature decrease.

Then, in step S51, the microcomputer 54 outputs the voltage signal Vnew output to each of the switching power supply circuits SW1 and SW2 to the current voltage signal + ΔV above.
At the same time, in step S52, the voltage signal is corrected so that the voltage signal Vnew does not exceed the lower limit DC + 8V and the upper limit + 12V, and the relay 58 is energized. As a result, the pump 15 and the cross flow fan 14 are operated with the adjusted capacity. By such control, it becomes possible to rapidly increase the cooling capacity even with rapid heat generation of the integrated circuit element 6 and prevent damage to the element from occurring.

The microcomputer 54 determines in step S54 whether or not the phototransistors of the photocouplers PH1 and PH2 are turned on as described above, and no output is generated from the switching power supply circuits SW1 and SW2. If the light emitting diodes of PH1 and PH2 do not emit light and each phototransistor is OFF, an alarm is output by performing an abnormal display on the LED display 61 in step S55 as described above. If the switching power supply circuits SW1 and SW2 are normal, the process returns to step S38.

On the other hand, if F0 is lower than 40% in step S41, the microcomputer 54 proceeds to step S15 of FIG. 14 and executes the same control thereafter. Incidentally, FIG.
Since the control in 4 is the same as the above, the description is omitted.
In this way, the brine cooling device 10 can be controlled also by the operating rates of the integrated circuit elements 6.

Here, when the detection sensor 51 detects the brine, the microcomputer 54 responds to the L by sending L
An error is displayed on the ED display 61 and an alarm is output. At the same time, a voltage signal of 0 V is output to the switching power supply circuit SW1 to stop the pump 15. This minimizes the amount of brine leakage. In addition, for example, a maximum voltage signal of +12 V is output to the switching power supply circuit SW2 and is blown into the case 3 with the maximum capacity to ensure the cooling of the case 3.

In this way, the inlet / outlet ports 13A, 13B of the pipe 13 of the heat exchanger 11 and the respective pipes 46, 47, 48, 23,
Brine leaks at the connecting portion such as the reserve tank 26 and the pump 15, and the leaked brine is the bottom surface 3B of the case 3.
When the sensor 51 accumulates in the front part of the lower portion 49 of the vehicle and is detected by the detection sensor 51, an alarm is output from the LED display 61, so that the user can quickly perform maintenance for the leakage failure of the brine. Become. Further, since the pump 15 is also stopped, the forced leakage of brine is stopped. Further, as described above, the outlet 13A of the heat exchanger 11 is located at a position higher than the cold plate 16. Therefore, when a leak occurs at the outlet 13A portion, the brine inside the heat exchanger 11 is kept inside by the stop of the pump 15. Will stay. Therefore, the leakage amount of brine from the heat exchanger 11 is minimized.

Next, FIG. 17 and FIG. 18 show the structure of another embodiment of the server 1 regarding the arrangement of the cross flow fan 14. In each drawing, the same reference numerals as those in FIGS. 4 and 5 have the same or similar functions. In this case, the opening 67 is formed in the rear surface 3C of the case 3,
The cross flow fan 14 is provided corresponding to the inside of the opening 67.
Fan casing 39 is disposed. As a result, the cross flow fan 14 is provided near the opening 67.

In this case, the fan casing 39 is for forming an air path connecting the cross flow fan 14 to the front heat exchanger 11, and the opening 33 of the fan casing 39 is directed upward from the opening 67 of the case 3. While facing the outside, a similar dust removing filter 34 is attached to the opening 33.

When the cross flow fan 14 is operated,
The air around the circuit board 5 in the front case 3 is sucked.
As a result, the opening 30 of the front surface 3A and the above-mentioned side surfaces 3D, 3
Air is sucked from the ventilation port 44 of D, and the heat exchanger 1
After exchanging heat such as 1, heat is discharged to the outside from the opening 33 (opening 67) by the cross flow fan 14. As a result, the heat exchanger 11 and the cold plate 16 of the brine cooling device 10 for cooling the integrated circuit elements 6 ...
・ ・ Etc. can be air-cooled.

At this time, the opening 33 of the fan casing 39
A curved opening angle adjusting plate 36 is attached to the lower edge of the. In this case as well, the opening angle adjusting plate 36 is detachable from the locking plates 37 provided in the lower portion of the opening 33 at the ribs 37A ... By changing the positions of the ribs 37A that are engaged with each other, the amount of protrusion from the lower edge of the opening 33 can be changed in three steps. As a result, the upward angle of the opening 33 can be changed in three steps from horizontal, such as 15 °, 30 °, and 45 °.

In the office where the server rack 2 of this type is installed as described above, air for air conditioning is blown from the floor surface. The servers 1 are mounted on the server rack 2 in a plurality of stages as described above, but the upward angle of the opening 33 is shallow (closer to horizontal) in the upper server 1, and the upward angle of the opening 33 is lower in the lower server 1. Deepen (turn to the upper side). As a result, the air in the case 3 can be easily discharged to the outside, and the integrated circuit element 6
・ ・ The cooling efficiency can be further improved.

Next, FIG. 19 shows an example in which the radiation fins 68 are attached to the cold plate 16. Also in this figure, the same reference numerals as those in FIGS. 9 and 10 are the same. However, in this case, the cold plate 16 is detachably fixed to the socket 7 by the clip 69 made of an elastic metal spring plate while the integrated circuit element 6 is sandwiched between the cold plate 16 and the socket 7.

Then, the cold plate 16 in this case
A plurality of aluminum heat dissipating fins 68 ... Are attached to the upper surface of the cover member 18, that is, the surface opposite to the lower surface with which the integrated circuit element 6 abuts. At this time, the heat radiation fin 68 is formed with a notch 68A into which the clip 69 can be inserted. Further, an air blower 71 for the cold plate 16 is attached to the upper surface of the heat radiation fins 68 ... The blower 71 is composed of a centrifugal blower type turbofan having a small thickness, sucks air from the lower radiating fins 68 ...
Discharge from 2.

According to this structure, in addition to the cooling by the brine, the cold plate 16 is strongly cooled by the heat dissipation from the radiation fins 68 and the forced ventilation by the blower 71, so that the integrated circuit element 6 is cooled. Can be achieved quickly and accurately. In addition, the air blower 71
Is a centrifugal blower type fan, it is possible to reduce the size by minimizing the expansion of the height dimension.

The numerical values shown in the embodiments are not limited to them, and the capability of the integrated circuit element is appropriately set according to the quantity. Further, in the embodiment, the microcomputer 54 uses the return temperature of the brine, the temperature of each cold plate 16, ... And the operating rate of each integrated circuit element 6 ,.
The capacity of the operation of No. 4 was controlled, but the operation is not limited to this, and the pump 15
May be constantly operated to control the capacity of only the crossflow fan 14, or may be always operated to control the capacity of the pump 15.

[0097]

As described above in detail, according to the present invention, in an electronic device that accommodates a circuit board on which an integrated circuit element requiring heat generation countermeasures is mounted in a single case, heat is transferred from the integrated circuit element. The cold plate that can be attached to this integrated circuit element, the heat exchanger that circulates the brine that is heated by this cold plate, cools this brine, and the heat exchange from the blower fan that is installed in the opening on one side of the case. A fan casing that constitutes an air passage leading to the air conditioner, a brine provided from the heat exchanger to the cold plate in that order, a reserve tank that stores the brine and a pump that circulates the brine, and a cold plate, At least one pair of reciprocating linear flow paths of brine and the circuit board of the surface surrounding the circuit board of the case face each other. Since a plurality of vent holes formed in the case are provided, the plurality of vent holes formed in the case after the air taken into the case by the blower fan from the opening is heated by exchanging heat with the heat exchanger. From now on, it becomes possible to take in fresh air into the case,
It is possible to avoid the inconvenience that the temperature inside the case remarkably rises due to the air exchanged with the heat exchanger.

According to the invention of claim 2, in addition to the invention of claim 1, since the vent hole is formed by cutting and raising a part of the case, the vent hole can be easily formed. It becomes possible to improve productivity.

According to the invention of claim 3, in addition to the invention of claim 1 or 2, the temperature near the outer periphery of the case is +3.
When the temperature is 5 ° C or higher, a control unit for controlling at least one of the blower fan and the pump is provided so that the temperature of the cold plate becomes + 70 ° C or lower. Will be able to. As a result, the cooling capacity can be quickly increased even with rapid heat generation of the integrated circuit element,
It becomes possible to avoid occurrence of damage to the element.

[Brief description of drawings]

FIG. 1 is a front view of a server rack loaded with servers as an example of an electronic device to which the present invention is applied.

FIG. 2 is a perspective view of a server as an embodiment of the electronic device of the present invention.

FIG. 3 is a perspective view of the server case of FIG. 2 with a top cover removed.

FIG. 4 is a plan sectional view of the server of FIG.

5 is a vertical sectional side view of a front portion of the server of FIG.

FIG. 6 is an enlarged view of a vent hole portion on the side surface of the case of the server of FIG.

7 is a longitudinal rear view of the server of FIG.

8 is a vertical side view of the server of FIG.

9 is a side view of an integrated circuit device and a cold plate mounted on a circuit board of the server of FIG.

10 is an exploded perspective view of the cold plate of FIG.

11 is an electric circuit diagram of a brine cooling device of the server of FIG.

FIG. 12 is a flowchart illustrating a control operation of the microcomputer shown in FIG.

13 is another flowchart explaining the control operation of the microcomputer shown in FIG.

14 is another flowchart explaining the control operation of the microcomputer shown in FIG.

15 is a flowchart illustrating a control operation of another embodiment of the microcomputer shown in FIG.

16 is another flowchart explaining the control operation of another embodiment of the microcomputer shown in FIG.

FIG. 17 is a plan sectional view of a server of another embodiment of the electronic device of the present invention.

18 is a vertical cross-sectional side view of the rear part of the server in FIG.

FIG. 19 is a perspective view of a cold plate and an integrated circuit device of a server of another embodiment of the electronic device of the present invention.

[Explanation of symbols]

1 server (electronic device) 2 server rack 3 cases 5 circuit board 6 integrated circuit elements 10 Brine cooling system 11 heat exchanger 12 plates 13, 23, 46, 48 Piping 13A exit 13B entrance 14 cross flow fan 15 pumps 16 cold plate 17 Base member 18 Lid member 26 Reserve tank 30 openings 36 Opening angle adjustment plate 39 Fan casing 41 Airway member 44 Vent 49 Lower part 51 detection sensor 53 sheet materials 54 Microcomputer 61 LED display 68 Heat dissipation fin 71 Blower SW1, SW2 switching power supply circuit TH1 to TH4 thermistors

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G06F 1/00 360A 360C F term (reference) 5E322 AA07 BA01 BB02 BB06 DA01 EA05 FA01 5F036 AA01 BA04 BA05 BA24 BB35 BB41 BF01

Claims (3)

[Claims] 1. An electronic device containing a circuit board on which an integrated circuit element requiring heat generation is mounted in a single case, wherein heat is transferred from the integrated circuit element to the integrated circuit element. The cold plate and the brine heated on this cold plate circulate,
A heat exchanger that cools the brine; a fan casing that forms an air passage that connects an air blower fan that is provided in an opening on one surface of the case to the heat exchanger; and a brine that faces the cold plate from the heat exchanger. A reserve tank that is provided in sequence in the flow, a pump that circulates the brine and a brine that circulates the brine, a linear brine flow path that is configured in the cold plate and that makes at least a pair of reciprocations, and the case of the case An electronic device comprising: a plurality of vent holes formed at positions facing the circuit board on a surface surrounding the circuit board. 2. The electronic device according to claim 1, wherein the vent hole is formed by cutting and raising a part of the case. 3. The temperature near the outer periphery of the case is + 35 ° C.
The electronic device according to claim 1 or 2, further comprising: a control unit that controls at least one of the blower fan and the pump so that the temperature of the cold plate becomes + 70 ° C or lower in the above case. apparatus.