JP3942282B2 - ポリッシング方法及び装置 - Google Patents

ポリッシング方法及び装置 Download PDF

Info

Publication number
JP3942282B2
JP3942282B2 JP23499598A JP23499598A JP3942282B2 JP 3942282 B2 JP3942282 B2 JP 3942282B2 JP 23499598 A JP23499598 A JP 23499598A JP 23499598 A JP23499598 A JP 23499598A JP 3942282 B2 JP3942282 B2 JP 3942282B2
Authority
JP
Japan
Prior art keywords
polishing
polished
water
ions
vicinity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP23499598A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000052235A5 (https=
JP2000052235A (ja
Inventor
勇蔵 森
憲雄 木村
充彦 白樫
康 當間
明 福永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP23499598A priority Critical patent/JP3942282B2/ja
Publication of JP2000052235A publication Critical patent/JP2000052235A/ja
Publication of JP2000052235A5 publication Critical patent/JP2000052235A5/ja
Application granted granted Critical
Publication of JP3942282B2 publication Critical patent/JP3942282B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP23499598A 1998-08-06 1998-08-06 ポリッシング方法及び装置 Expired - Fee Related JP3942282B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23499598A JP3942282B2 (ja) 1998-08-06 1998-08-06 ポリッシング方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23499598A JP3942282B2 (ja) 1998-08-06 1998-08-06 ポリッシング方法及び装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006139857A Division JP4409539B2 (ja) 2006-05-19 2006-05-19 研磨装置及び研磨部材

Publications (3)

Publication Number Publication Date
JP2000052235A JP2000052235A (ja) 2000-02-22
JP2000052235A5 JP2000052235A5 (https=) 2005-10-27
JP3942282B2 true JP3942282B2 (ja) 2007-07-11

Family

ID=16979508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23499598A Expired - Fee Related JP3942282B2 (ja) 1998-08-06 1998-08-06 ポリッシング方法及び装置

Country Status (1)

Country Link
JP (1) JP3942282B2 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6413149B1 (en) * 1998-04-28 2002-07-02 Ebara Corporation Abrading plate and polishing method using the same
JP2001064799A (ja) 1999-08-27 2001-03-13 Yuzo Mori 電解加工方法及び装置
US6638143B2 (en) * 1999-12-22 2003-10-28 Applied Materials, Inc. Ion exchange materials for chemical mechanical polishing
JP4141114B2 (ja) 2000-07-05 2008-08-27 株式会社荏原製作所 電解加工方法及び装置
JP4043234B2 (ja) * 2001-06-18 2008-02-06 株式会社荏原製作所 電解加工装置及び基板処理装置
TWI224531B (en) 2001-09-11 2004-12-01 Ebara Corp Substrate processing apparatus and method
JP4409807B2 (ja) * 2002-01-23 2010-02-03 株式会社荏原製作所 基板処理方法
TWI275436B (en) 2002-01-31 2007-03-11 Ebara Corp Electrochemical machining device, and substrate processing apparatus and method
JP2004255479A (ja) * 2003-02-24 2004-09-16 Ebara Corp 電解加工方法及び電解加工装置
WO2004041467A1 (ja) * 2002-11-08 2004-05-21 Ebara Corporation 電解加工装置及び電解加工方法
US7527723B2 (en) 2004-01-16 2009-05-05 Ebara Corporation Electrolytic processing apparatus and electrolytic processing method
JP6188152B2 (ja) * 2014-02-27 2017-08-30 国立大学法人大阪大学 Ｓｉ基板の平坦化加工方法及びその装置

Also Published As

Publication number Publication date
JP2000052235A (ja) 2000-02-22

Similar Documents

Publication Publication Date Title
JP3311203B2 (ja) 半導体装置の製造方法及び半導体製造装置、半導体ウェーハの化学的機械的ポリッシング方法
JP3942282B2 (ja) ポリッシング方法及び装置
CN100334691C (zh) 衬底加工设备和衬底加工方法
US7160176B2 (en) Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
US20070020918A1 (en) Substrate processing method and substrate processing apparatus
KR100663662B1 (ko) 마이크로전자 기판으로부터 도전성 물질을 전기적, 기계적 및/또는 화학적으로 제거하기 위한 장치 및 방법
KR20050092130A (ko) 도금장치 및 도금방법
JPH10321572A (ja) 半導体ウェーハの両面洗浄装置及び半導体ウェーハのポリッシング方法
TW200305470A (en) Electrochemical machining device and electrochemical machining method
JP4409539B2 (ja) 研磨装置及び研磨部材
JP2000052235A5 (https=)
TW200403121A (en) Polishing apparatus and polishing method
US20040256237A1 (en) Electrolytic processing apparatus and method
JP4233376B2 (ja) 基板処理方法
TW200425301A (en) Electropolishing apparatus and polishing method
US20040182715A1 (en) Process and apparatus for air bubble removal during electrochemical processing
JP2004015028A (ja) 基板処理方法及び半導体装置
JP2004353014A (ja) めっき装置及びめっき方法
JP2005042158A (ja) めっき方法及びめっき装置
JP4172945B2 (ja) 電解加工用イオン交換体の再生方法及び再生装置
JP4130073B2 (ja) イオン交換体の再生方法及び再生装置
US7563356B2 (en) Composite processing apparatus and method
JP3426866B2 (ja) 半導体装置の製造装置および製造方法
JP2003225830A (ja) 電解加工装置および方法
JP2004360026A (ja) めっき装置及びめっき方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050720

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050720

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20061221

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070109

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070306

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070403

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070403

R150 Certificate of patent (=grant) or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110413

Year of fee payment: 4

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120413

Year of fee payment: 5

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130413

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees