JP2000052235A5 - - Google Patents
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- Publication number
- JP2000052235A5 JP2000052235A5 JP1998234995A JP23499598A JP2000052235A5 JP 2000052235 A5 JP2000052235 A5 JP 2000052235A5 JP 1998234995 A JP1998234995 A JP 1998234995A JP 23499598 A JP23499598 A JP 23499598A JP 2000052235 A5 JP2000052235 A5 JP 2000052235A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- polished
- water
- ion
- electric field
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims description 71
- 239000000463 material Substances 0.000 claims description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 150000002500 ions Chemical group 0.000 claims description 16
- 230000005684 electric field Effects 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 239000006061 abrasive grain Substances 0.000 claims description 7
- 238000010494 dissociation reaction Methods 0.000 claims description 7
- 230000005593 dissociations Effects 0.000 claims description 7
- 239000003014 ion exchange membrane Substances 0.000 claims description 7
- 229910021642 ultra pure water Inorganic materials 0.000 claims description 7
- 239000012498 ultrapure water Substances 0.000 claims description 7
- 230000001737 promoting effect Effects 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 3
- 230000035699 permeability Effects 0.000 claims description 3
- 239000000725 suspension Substances 0.000 claims description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000010559 graft polymerization reaction Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23499598A JP3942282B2 (ja) | 1998-08-06 | 1998-08-06 | ポリッシング方法及び装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23499598A JP3942282B2 (ja) | 1998-08-06 | 1998-08-06 | ポリッシング方法及び装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006139857A Division JP4409539B2 (ja) | 2006-05-19 | 2006-05-19 | 研磨装置及び研磨部材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000052235A JP2000052235A (ja) | 2000-02-22 |
| JP2000052235A5 true JP2000052235A5 (https=) | 2005-10-27 |
| JP3942282B2 JP3942282B2 (ja) | 2007-07-11 |
Family
ID=16979508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23499598A Expired - Fee Related JP3942282B2 (ja) | 1998-08-06 | 1998-08-06 | ポリッシング方法及び装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3942282B2 (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6413149B1 (en) * | 1998-04-28 | 2002-07-02 | Ebara Corporation | Abrading plate and polishing method using the same |
| JP2001064799A (ja) | 1999-08-27 | 2001-03-13 | Yuzo Mori | 電解加工方法及び装置 |
| US6638143B2 (en) * | 1999-12-22 | 2003-10-28 | Applied Materials, Inc. | Ion exchange materials for chemical mechanical polishing |
| JP4141114B2 (ja) | 2000-07-05 | 2008-08-27 | 株式会社荏原製作所 | 電解加工方法及び装置 |
| JP4043234B2 (ja) * | 2001-06-18 | 2008-02-06 | 株式会社荏原製作所 | 電解加工装置及び基板処理装置 |
| TWI224531B (en) | 2001-09-11 | 2004-12-01 | Ebara Corp | Substrate processing apparatus and method |
| JP4409807B2 (ja) * | 2002-01-23 | 2010-02-03 | 株式会社荏原製作所 | 基板処理方法 |
| TWI275436B (en) | 2002-01-31 | 2007-03-11 | Ebara Corp | Electrochemical machining device, and substrate processing apparatus and method |
| JP2004255479A (ja) * | 2003-02-24 | 2004-09-16 | Ebara Corp | 電解加工方法及び電解加工装置 |
| WO2004041467A1 (ja) * | 2002-11-08 | 2004-05-21 | Ebara Corporation | 電解加工装置及び電解加工方法 |
| US7527723B2 (en) | 2004-01-16 | 2009-05-05 | Ebara Corporation | Electrolytic processing apparatus and electrolytic processing method |
| JP6188152B2 (ja) * | 2014-02-27 | 2017-08-30 | 国立大学法人大阪大学 | Ｓｉ基板の平坦化加工方法及びその装置 |
-
1998
- 1998-08-06 JP JP23499598A patent/JP3942282B2/ja not_active Expired - Fee Related
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