JP3936523B2 - Mounting structure of solid-state image sensor - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a mounting structure for a solid-state imaging device, and more particularly to a mounting structure for a solid-state imaging device used in a copying machine, a facsimile apparatus, a scanner apparatus, or the like that reads an optical image using the solid-state imaging element.
[0002]
[Prior art]
  In general, an image apparatus that reads an image as an optical image using a solid-state imaging device such as a CCD reads and images an object 1 on a solid-state imaging device 3 via an imaging lens 2 as shown in FIG. . Further, the solid-state image pickup device 3 has a single line of solid state in which a plurality of minute photoelectric conversion elements (hereinafter simply referred to as pixels, which usually have a minute size of several μm × several μm) are arranged on a straight line. An image sensor is used.
[0003]
  In such an image reading apparatus, the line image formed by the imaging lens 2 is positioned on the solid-state imaging device 1, and the image is formed in order to read the optical characteristics (focus, magnification, etc.) with a predetermined required accuracy. As shown in FIG. 5, the lens 2 and the pixel line 4 of the one-line solid-state imaging device 3 are rotated in the X axis, the Y axis, the Z axis, the β rotation direction around the Y axis, and the γ rotation direction around the Z axis in three axes and two rotations. It is necessary to adjust the position by finely moving in the direction (hereinafter, the two rotation directions are also axial directions, and the X, Y, Z, β, and γ axes are simply referred to as five axes). 4 and 5, reference numeral 5 denotes an optical axis.
[0004]
  Here, the reason why the adjustment about the axis around the X-axis is not performed is that the β-axis and the γ-axis are directions orthogonal to the pixel line. While the distance from the element 3 differs for each pixel and the accuracy of the optical characteristics is lowered, the X axis is in the same direction (parallel) as the pixel line, so the imaging lens 2 and the solid-state imaging element 3 This is because the distance is not different for each pixel and is not affected by the optical characteristics.
[0005]
  On the other hand, recently, in order to read a color image, as shown in FIG. 6, the spectral sensitivity peaks are shown in Red (hereinafter simply referred to as R), Green (hereinafter simply referred to as G), and Blue (hereinafter simply referred to as B). In some cases, the solid-state imaging device 6 arranged in three lines on a straight line is used for each of the pixels R (6a), B (6b), and G (6c).
[0006]
  Usually, the position adjustment accuracy of such a solid-state imaging device 6 is required to be high in both of the five axis directions. In particular, the solid-state imaging device 6 is indispensable for achieving this requirement as described above. When the solid-state image sensor 6 is fixed to the frame after the position is adjusted to the position, the position of the solid-state image sensor 6 is prevented from being displaced.
[0007]
  This technology is necessary even if the position is adjusted with high accuracy, if the position is shifted during fixing, it will be necessary to adjust the position again, or if a separable fixing method is used, that part will be discarded. This is because there is no other way but to dispose, and the position adjustment time becomes longer or the cost is increased.
[0008]
  Conventionally, fixing with screws has been often used for this fixing. However, when such fixing is used, there is a problem that the amount of positional deviation increases to several hundred μm to several tens μm.
[0009]
  In order to solve such a problem, it is conceivable to use complicated structural parts such as a file, a ball, and a spring as a means to replace the screw. However, since the parts are expensive in this way, the cost is further increased. turn into.
[0010]
  Therefore, at present, many attempts have been made to fix with an adhesive, which is less misaligned than a screw and has few problems with the number of parts. There are roughly two methods for fixing with the adhesive. One is a method in which the adherends are in contact with each other, and the other is a method in which there is a gap in the adherend. The former is called close adhesion and the latter is called filling adhesion.
[0011]
  Filling adhesion is a method in which there is a gap larger than the adjustment allowance for position adjustment between the adherends, and the gap is filled with an adhesive and fixed. As a conventional filling and bonding method of this kind, for example, there is a method described in JP-A-7-297993. In this product, even if there is an influence on the shape accuracy of the adherends, the gap amount between the adherends is set so that the adherends do not come into contact with each other, and the gap is filled with an adhesive and fixed. To do.
[0012]
  Further, as a method of attaching to the head holding member via an ultraviolet curable adhesive, there is a method as shown in FIG.
[0013]
  In the method shown in FIG. 7, as shown in FIG. 7A, the adhesive 12 is applied to one surface of the work 11 to position the work 11 with respect to the work holding member 13, When fixing the workpiece 11 to the workpiece holding member 13, as shown in FIG. 5B, by irradiating the adhesive 12 with ultraviolet light from the gap between the workpiece 11 and the workpiece holding member 13 by the light guide L, The adhesive 12 is cured to fix the work 11 to the work holding member 13. If one of the workpiece 11 and the workpiece holding member 13 is a material that transmits ultraviolet rays, the adhesive 12 is irradiated with ultraviolet rays through the material.
[0014]
[Problems to be solved by the invention]
  However, in such a conventional mounting structure, the gap amount between the adherends is set so that the adherends do not contact each other, and the gap is filled with an adhesive and fixed. As a result, the following problems occurred.
[0015]
  In the following, this filling and bonding method will be described based on the model diagram shown in FIG.
[0016]
  In FIG. 8, 14 is a workpiece to be bonded, 15 is a workpiece holding member, and 16 is an adhesive. In this method, the adhesive 16 is filled in the gap between the workpiece 14 and the workpiece holding member 15 and cured. Thus, the work 14 is fixed to the work holding member 15.
[0017]
  For this reason, in order to bond and fix the workpiece 14 and the workpiece holding member 15 without contacting each other, the positional variation amount A (position adjustment allowance of the workpiece 4) between the workpiece 14 and the bonding surface 14a and the bonding surface 15a on the workpiece holding member 15 side. In order to ensure a gap for filling the adhesive 16, the adhesive surface 14a on the workpiece 14 side and the adhesive surface 15a on the workpiece holding member 15 side do not come into contact with each other. I need it. Therefore, the film thickness of the adhesive 16 is B at the minimum and A + B + C at the maximum, and the film thickness of the adhesive 16 varies by the length of A + C.
[0018]
  Furthermore, the film thickness of the adhesive 16 may vary by I + J due to the influence of the surface accuracy of the workpiece 14 side adhesive surface 14a and the workpiece holding member 15 side adhesive surface 15a.
[0019]
  In general, since the adhesive shrinks when it is cured, it is important to reduce the application amount of the adhesive as much as possible in order not to shift the position of the adherend after the adhesive is cured. However, in the filling and bonding method described above, since the film thickness of the adhesive cannot be made B or less, when the film thickness of the adhesive is B, the displacement due to the curing shrinkage of the adhesive is more than the allowable value. Even if it does, it becomes impossible to respond by changing the film thickness of the adhesive, and there is a case where the amount of positional deviation after fixing cannot be improved.
[0020]
  Further, when only the film thickness of the adhesive is A + C, the amount of cure shrinkage of the adhesive also changes according to the variation. As a result, the position of the work 14 after fixing varies, and the required position accuracy may not be ensured. Usually, the volume shrinkage rate at the time of curing of an ultraviolet curable adhesive is about 5 to 10%. Considering the case where the volume shrinkage is 7%, when the cured shape of the adhesive is a rectangular parallelepiped, the shrinkage is about 2% in each of the three dimensions.
[0021]
  Therefore, when a difference of about 0.5 mm occurs in the film thickness of the adhesive, a difference of about 10 μm in the amount of curing shrinkage occurs in each direction. When the adherend is manufactured by resin injection molding, the above-described variation A + C in the thickness of the adhesive may be 0.5 mm or more, and thus there may be a problem of misalignment after fixing. There is enough.
[0022]
  As described above, in the conventional filling and bonding method, the required accuracy of the workpiece fixing position may not be maintained. Therefore, the yield during production is reduced, and the adherend with poor fixing accuracy is discarded. A problem has arisen that the manufacturing cost increases because it has to be disposed of.
[0023]
  In order to solve such a problem, for example, there is one described in JP-A-10-309801.
[0024]
  This is configured to interpose an intermediate holding member between the workpiece and the workpiece holding member, and fix the intermediate holding member to the workpiece with an adhesive and to the workpiece holding member via the adhesive, Adhesive between the adhesive surface of the workpiece and the adhesive surface of the intermediate holding member and the adhesive surface of the workpiece holding member and the intermediate holding member as much as the intermediate holding member is interposed between the workpiece and the workpiece holding member By simply controlling the film thickness of the adhesive to be bonded to the surface to the minimum and constant level, it is possible to install the workpiece without strictly managing the position accuracy of the workpiece adhesion point and the workpiece holding member adhesion point. Is a technology that can increase the yield, increase the yield, and prevent a decrease in the fixing force of the workpiece after production.
[0025]
  However, when the workpiece is a solid-state imaging device, the workpiece holding member is a solid-state imaging device holding member, and the intermediate holding member is interposed between the solid-state imaging device and the workpiece holding member via an adhesive, the solid-state imaging device is bonded and fixed. When the line image formed by the imaging lens in the previous position adjustment is positioned on the solid-state image sensor and the optical characteristics are read with a predetermined required accuracy, the position is easily adjusted with the five axes of the solid-state image sensor. After that, the solid-state imaging device can be mounted with high accuracy, the yield can be increased, and there is no specific configuration for preventing the fixing force of the solid-state imaging device after production from being reduced. Therefore, there is still room for improvement.
[0026]
  Therefore, the present invention can easily perform the 5-axis adjustment of the solid-state image sensor before bonding and fixing the solid-state image sensor, and can attach the solid-state image sensor with high accuracy after the 5-axis adjustment. It is an object of the present invention to provide a solid-state image sensor mounting structure that can increase the height of the solid-state image sensor and does not cause a decrease in fixing force of the solid-state image sensor after production (after curing of the adhesive).
[0027]
[Means for Solving the Problems]
  In order to solve the above-mentioned problem, the invention described in claim 1 includes an imaging lens holding member to which an imaging lens is fixed and a pixel line composed of a photoelectric conversion element arranged on a straight line, and the surface is provided with the pixel line Terminals that can be connected to the circuit board formed on the back glass and the back glass that covers the photoelectric conversion elementWas providedA solid-state image sensor, and an intermediate holding member that supports the solid-state image sensor so as to face the imaging lens;AndThe imaging lens holding member and the intermediate holding member are fixed by an adhesive, and the solid-state imaging element and the intermediate holding member are fixed by an adhesive. And the first adhesive surface between the intermediate holding member,A surface that is parallel to the pixel line and the optical axis of the solid-state image sensor, and a second adhesive surface between the front or back surface of the solid-state image sensor and the intermediate holding member is,To be a plane perpendicular to the optical axis,Intermediate holding memberButArrangementHas beenIt is characterized by that.
[0028]
  In order to solve the above-mentioned problem, the second aspect of the invention is that in the first aspect of the invention, the second adhesive surface of the solid-state imaging device is a cover glass of the solid-state imaging device.SpecialIt is a sign.
[0029]
  In order to solve the above problems, the invention according to claim 3An imaging lens holding member to which the imaging lens is fixed and a pixel line made up of photoelectric conversion elements are arranged on a straight line, and a cover glass covering the photoelectric conversion elements on the front surface and a circuit board formed on the back surface A solid-state image sensor provided with a connectable terminal; an intermediate holding member that supports the solid-state image sensor so as to face the imaging lens; and the imaging lens holding member and the intermediate holding member. An attachment structure for a solid-state imaging device that is fixed by an adhesive and the solid-state imaging device and the intermediate holding member are fixed by an adhesive, wherein a first adhesive surface between the imaging lens holding member and the intermediate holding member is And a terminal provided on the back surface of the solid-state imaging device, which is parallel to the pixel line and the optical axis of the solid-state imaging device, is connected to the circuit board, and is intermediate to the circuit board. Adhesive surface of the support member is such that a plane perpendicular to the optical axis, the intermediate holding member is disposedIt is characterized by that.
[0030]
In order to solve the above-mentioned problems, the invention according to claim 4 is the invention according to any one of claims 1 to 3, wherein the adhesive is composed of an ultraviolet curable adhesive. It is characterized by that.
[0031]
In order to solve the above-mentioned problem, the invention according to claim 5 is the invention according to any one of claims 1 to 4, wherein the intermediate holding member is made of a material that transmits ultraviolet rays. It is characterized by being.
[0032]
  According to the first to third aspects of the present invention, the line image formed by the imaging lens is positioned on the solid-state image sensor before the solid-state image sensor is bonded and fixed, and the optical characteristics (focus, magnification) are set to a predetermined value. When reading with the required accuracy, the intermediate holding member 23 is slid in parallel with the adhesive surface of the imaging lens holding member 21 as shown in FIG. Adjustment can be performed, and the X, Y, and γ triaxial adjustments can be performed by sliding the solid-state imaging device 22 parallel to the bonding surface of the intermediate holding member 23. As a result, it is possible to easily adjust the position of fine movement only in the five-axis directions of X, Y, Z, β, and γ excluding the axes around the X axis.
[0033]
  That is, the first adhesive surface A between the imaging lens holding member 21 and the intermediate holding member 23 becomes a plane parallel to the pixel line and the optical axis 28 of the solid-state image pickup device 22, and the front surface (or back surface) of the solid-state image pickup device 22. By arranging the intermediate holding member 23 so that the second adhesive surface B between the intermediate holding member 23 and the intermediate holding member 23 is a surface orthogonal to the optical axis 28, the position of the axis around the X axis is positively adjusted. It is possible to easily adjust only the five axis directions of X, Y, Z, β and γ.
[0034]
  Here, the reason for not adjusting the rotation axis around the X axis is that the Y and Z axes are perpendicular to the pixel lines, and the γ and β axes around the Y and Z axes are not adjusted. While the distance between the image lens and the solid-state image sensor varies from pixel to pixel and the accuracy of optical characteristics decreases, the X axis is coaxial with the pixel line (parallel), so adjustment around this X axis This is because the distance between the imaging lens and the solid-state imaging device does not differ for each pixel without being affected by the optical characteristics.
[0035]
  In addition, after the 5-axis adjustment, the adhesive bonded to the bonding surface of the solid-state imaging element and the bonding surface of the intermediate holding member is equivalent to the amount of the intermediate holding member interposed between the solid-state imaging element and the imaging lens holding member. The solid-state image sensor can be bonded to the solid-state image sensor only by managing the film thickness of the adhesive bonded to the adhesive surface of the adhesive and the imaging lens holding member and the adhesive surface of the intermediate holding member to a minimum and constant level. Even if the position accuracy of the holding part is not strictly controlled, the solid-state imaging device can be mounted with high accuracy, the yield can be increased, and the solid after production (after curing of the adhesive) It is possible to prevent a reduction in the fixing force of the image sensor.
[0036]
  The invention described in claim 1 limits the adhesive surface of the solid-state image sensor to the front or back surface of the solid-state image sensor, and the invention described in claim 2 limits the adhesive surface of the solid-state image sensor to a cover glass.The invention described in claim 3The bonding surface of the solid-state imaging device is limited to the circuit board to which the terminals of the solid-state imaging device are attached.
[0037]
In the inventions according to claims 4 and 5, the adhesive is made of an ultraviolet curable adhesive, and the intermediate holding member is made of a material that transmits ultraviolet rays, so that the ultraviolet curable adhesive is passed through the intermediate holding member. Since the adhesive can be irradiated with ultraviolet rays, it can be irradiated simultaneously with the entire area of the adhesive and from the direction perpendicular to the adhesive surface, reducing the time until the adhesive cures and improving productivity. Can be improved.
[0038]
DETAILED DESCRIPTION OF THE INVENTION
  Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0039]
  As shown in the reference example of FIG. 1, when the positions of the first member 101 and the second member 102 are adjusted, the intermediate holding member 103 is slid in parallel with the bonding surface of the first member 101, , Y, and γ can be adjusted in three axes, and by sliding the second member 102 parallel to the bonding surface of the intermediate holding member 103, adjustment in the three axes in X, Z, and β can be performed. It can be performed. As a result, it is possible to easily adjust the position of fine movement only in the five-axis directions of X, Y, Z, β, and γ excluding the axes around the X axis.
[0040]
  In other words, the first adhesive surface A between the first member 101 and the intermediate holding member 103 and the second adhesive surface B between the second member 102 and the intermediate holding member 103 are in the arrangement direction of the plurality of working members of the second member 102. By arranging the intermediate holding member 103 so that the first adhesive surface A and the second adhesive surface B are perpendicular to each other while being parallel to each other, position adjustment in the direction of the axis around the X axis is positively performed. It is possible to easily adjust only the five axis directions of X, Y, Z, β, and γ without doing so.
[0041]
  Here, the reason for not adjusting the rotation axis around the X axis is that the Y and Z axes are orthogonal to the work member, and the γ and β axes around the Y and Z axes are not adjusted. While the distance between the first member and the second member varies from work member to work member and the work accuracy of the work member is reduced, the X axis is coaxial (parallel) with the work member. This is because the distance between the first member and the second member does not differ for each work member without adjusting the axis, and the workability of the work member is not affected.
[0042]
  In addition, after the five-axis adjustment, the adhesive that is bonded to the bonding surface of the second member and the bonding surface of the intermediate holding member, as much as the intermediate holding member is interposed between the second member and the first member By only managing the film thickness of the adhesive bonded to the bonding surface of the first member and the bonding surface of the intermediate holding member to the minimum necessary and constant, the bonding position of the second member and the bonding position of the first member Even if the positional accuracy is not strictly controlled, the second member can be mounted with high accuracy, the yield can be increased, and the fixing force of the second member after production (after curing of the adhesive) can be increased. It is possible to prevent the decrease from occurring.
[0043]
[First Reference Example]
  2 to 4 are views showing a first reference example of a member mounting structure and a member mounting apparatus. The member mounting structure is used for an image reading apparatus such as a copying machine, a facsimile apparatus, a scanner apparatus, and a printing apparatus. It is applied to an image forming apparatus.
[0044]
  First, the configuration will be described. 2 and 3, reference numeral 21 denotes a frame, which is formed in an L-shape and includes a horizontal portion 21a and a vertical portion 21b, and the frame 21 constitutes a first member according to the present invention.
[0045]
  A V-groove 24 is formed in the horizontal portion 21a, and an imaging lens 25 is positioned in the V-groove 24. The image forming lens 25 forms an image of a document on each pixel line 22a, 22b, 22c provided for each RGB of the photoelectric conversion element 22 such as a CCD, and is fixed to the horizontal portion 21a by a lens presser 26. Yes.
[0046]
  In addition, an opening 27 is formed in the vertical portion 21b, and the opening 27 guides the line image converged by the imaging lens 25 to the pixel lines 22a, 22b, and 22c of the solid-state imaging device 22. Yes.
[0047]
  The solid-state imaging device 22 has pixel lines 22 a, 22 b, and 22 c made of photoelectric conversion elements arranged in a straight line, and a vertical portion so that the pixel lines 22 a, 22 b, and 22 c are opposed to the imaging lens 25 by the intermediate holding member 23. 21b is supported. The solid-state imaging device 22 and the pixel lines 22a, 22b, and 22c constitute a second member and an operation member according to the present invention.
[0048]
  2 and 3, reference numeral 28 denotes an optical axis, which corresponds to the Z direction in terms of coordinates. The X-axis direction is the main scanning direction in the image reading apparatus, and the Y-axis direction corresponds to the sub-scanning direction.
[0049]
  In addition, a circuit board 29 is attached to the solid-state image pickup device 22, and the circuit board 29 drives the solid-state image pickup device 22, and electrically outputs an electric output signal of the solid-state image pickup device 22 associated with the formed optical image. After processing, it is transmitted to the image reading apparatus.
[0050]
  On the other hand, the intermediate holding member 23 is formed in an L shape and is made of a material that transmits ultraviolet light. The intermediate holding member 23 is fixed to the vertical portion 21b and the solid-state imaging element 22 by ultraviolet curable adhesives 30 and 31, respectively. The bonding surface (hereinafter referred to as a first bonding surface) between the vertical portion 21b and the intermediate holding member 23. ) A and an adhesion surface (hereinafter referred to as a second adhesion surface) B between the solid-state image pickup device 22 and the intermediate holding member 23 are parallel to the pixel lines 22a to 22c of the solid-state image pickup device 22, and the first adhesion surface A The intermediate holding member 23 is disposed between the vertical portion 21 b and the solid-state imaging device 22 so that the second bonding surface B is in a perpendicular direction.
[0051]
  Next, a method for adjusting the position of the solid-state image sensor 22 will be described.
[0052]
  First, the adhesives 30 and 31 are applied to the two orthogonal surfaces A and B of the intermediate holding member 23 by a solid-state imaging device mounting device (not shown). At this time, the film thickness of the adhesives 30 and 31 is adjusted to be constant while monitoring the film thicknesses of the adhesives 30 and 31 with a camera (not shown), and then the solid-state imaging device 22 is attached to the intermediate holding member 23 by the attachment device. At the same time, the intermediate holding member 23 is attached to the vertical portion 21b.
[0053]
  Next, the line image formed by the imaging lens 25 is positioned on the solid-state imaging device 22, and the optical characteristics (focus, magnification, etc.) are read with a predetermined required accuracy. At this time, the position of the solid-state image sensor 22 is adjusted while outputting the data photoelectrically converted by the solid-state image sensor 22 on the monitor.
[0054]
  First, when adjusting the position in the X-axis direction, the solid-state image sensor 22 is held by a chuck or the like, and the solid-state image sensor 22 is slid on the adhesive 31. In this case, as shown in FIG. 3A, the adhesive area of the adhesive 31 is smaller than that of the adhesive 30. There is one place.
[0055]
  However, at the time of adjustment in the X-axis direction, both the intermediate holding member 23 and the solid-state imaging device 22 may slide through the adhesive 30.
[0056]
  Further, when the position of the β axis around the Y axis is adjusted, the solid state image pickup device 22 is held by a chuck or the like so that the solid image pickup device 22 slides on the adhesive 31.
[0057]
  In addition, when adjusting the position in the Y-axis direction, the intermediate holding member 23 is gripped with a chuck or the like, and the solid-state imaging device 22 and the intermediate holding member 23 are adjusted to slide on the adhesive 30 at the same time.
[0058]
  Further, when the position adjustment in the Z-axis direction is performed, the solid-state imaging device 22 is gripped with a chuck or the like so that the solid-state imaging device 22 slides on the adhesive 31 at the same time.
[0059]
  Further, when adjusting the position of the γ-axis around the Z-axis, the intermediate holding member 23 is gripped with a chuck or the like and adjusted so that the solid-state imaging device 22 and the intermediate holding member 23 slide on the adhesive 30 simultaneously. .
[0060]
  In this reference example, since the intermediate holding member 23 is disposed between the frame 21 and the solid-state imaging device 22 so that the first adhesive surface A and the second adhesive surface B are at right angles, X, Y, Z, The individual movements of β and γ can be performed independently for each axis, and the movement of sliding and adjusting the intermediate holding member 23 and the solid-state imaging device 22 can be made to coincide with the rectangular coordinates.
[0061]
  Here, the reason for not adjusting the rotation axis around the X axis is that the Y and Z axes are perpendicular to the pixel lines 22a to 22c, and the γ and β axes around the Y and Z axes are adjusted. Otherwise, the distance between the imaging lens 25 and the solid-state imaging device 22 differs for each pixel and the accuracy of the optical characteristics decreases, whereas the X-axis is coaxial with the pixel lines 22a to 22c (parallel). For this reason, the distance between the imaging lens 25 and the solid-state imaging element 22 does not vary from pixel to pixel without being adjusted around the X axis, and is not affected by the optical characteristics.
[0062]
  When the position of the solid-state image pickup device 22 is adjusted as described above and it is determined from the monitor output that the optical characteristics satisfy a predetermined required accuracy, the adhesives 30 and 31 are irradiated with an ultraviolet irradiation light (not shown). The adhesives 30 and 31 are cured by irradiating ultraviolet rays through the intermediate holding member 23 from the direction perpendicular to the bonding surface at the same time throughout the bonding area.
[0063]
  As described above, in the present reference example, the first adhesive surface A and the second adhesive surface are parallel to the pixel lines 22a to 22c of the solid-state imaging element 22, and the first adhesive surface A and the second adhesive surface B are perpendicular to each other. Since the intermediate holding member 23 is disposed between the vertical portion 21b and the solid-state imaging element 22 so as to be oriented, the intermediate holding member 23 is parallel to the bonding surface of the frame 21 before the solid-state imaging element 22 is bonded and fixed. Can be adjusted in the three axial directions of X, Y, and γ, and X, Z, β can be adjusted by sliding the solid-state imaging device 22 in parallel with the bonding surface of the intermediate holding member 23. The three axis directions can be adjusted. As a result, it is possible to easily adjust the position of fine movement only in the five-axis directions of X, Y, Z, β, and γ excluding the axes around the X axis.
[0064]
  That is, the first adhesive surface A between the frame 21 and the intermediate holding member 23 and the second adhesive surface B between the solid-state imaging element 22 and the intermediate holding member 23 are parallel to the pixel lines 22 a to 22 c of the solid-state imaging element 22. At the same time, the intermediate holding member 23 is disposed so that the first adhesive surface A and the second adhesive surface B are perpendicular to each other so that the position adjustment in the direction of the axis around the X axis is not performed positively. Only the 5-axis directions of X, Y, Z, β, and γ can be easily adjusted.
[0065]
  Further, after the five-axis adjustment, the adhesive 30 that is bonded to the first adhesive surface A and the second adhesive surface B by the amount of the intermediate holding member 23 interposed between the solid-state imaging element 22 and the frame 21. The solid-state imaging device 22 can be attached without having to strictly manage the positional accuracy of the bonding location of the solid-state imaging device 22 and the bonding location of the frame 21 only by managing the film thickness of 31 at a necessary minimum and constant. This can be performed with high accuracy, and it is possible to increase the yield and prevent the fixing force of the solid-state imaging device 22 from being lowered after production (after curing of the adhesive).
[0066]
  In addition, the adhesives 30 and 31 are made of an ultraviolet curable adhesive, and the intermediate holding member 23 is made of a material that transmits ultraviolet rays, so that the ultraviolet curable adhesive is irradiated with ultraviolet rays through the intermediate holding member 23. Therefore, it is possible to irradiate ultraviolet rays from the vertical direction with respect to the bonding surface at the same time, and further shorten the time until the adhesives 30 and 31 are cured, thereby improving productivity. Can do.
[0067]
  The thickness of the adhesives 30 and 31 is preferably as thin as possible in order to reduce the influence of curing shrinkage. However, in practice, it is necessary to set a thickness sufficient to fill in the difference between the unevenness of the plane according to the flatness of the solid-state image sensor 22, the frame 21, and the solid-state image sensor 22.
[0068]
  Further, in the present reference example, the intermediate holding member 23 is disposed on the upper side with respect to the solid-state image pickup device 22, but not limited thereto, as shown in FIG. Even if the holding member 23 is disposed on the lower side, the same effect can be obtained.
[0069]
  Furthermore, the intermediate holding member 23 is not limited to the L shape, and may be triangular as shown by reference numeral 41 in FIG. In this case, the rigidity of the intermediate holding member 41 itself can be increased.
[0070]
[Second Reference Example]
  FIG. 5 is a view showing a second reference example of the member mounting structure. The member mounting structure is similar to the first reference example, and is an image reading apparatus such as a copying machine, a facsimile apparatus, a scanner apparatus, and a printing apparatus. It is applied to an image forming apparatus such as
[0071]
  In the first reference example, the solid-state imaging element is fixed to the intermediate holding member on the second adhesive surface B. However, in this reference example, the solid-state imaging element is fixed to the intermediate holding member via the attaching / detaching holding member. Since other configurations are the same as those of the first reference example, the same members are denoted by the same reference numerals and description thereof is omitted.
[0072]
  In the present reference example, the solid-state image sensor constitutes a disposing member, and the solid-state image sensor, the substrate, and the detachable support member constitute a second member.
[0073]
  Further, in this reference example, two intermediate holding members 23 are prepared as 23a and 23b, and two of the first adhesive surface A and the second adhesive surface B are provided, that is, the first adhesive surfaces A, A ′ and the first adhesive surface A. Two adhesive surfaces B and B ′ are provided.
[0074]
  In FIG. 5, the attaching / detaching holding member 50 is a rectangular parallelepiped having a hollow inside, and two parallel planes are penetrated (hereinafter referred to as a penetrating surface). A circuit board 29 to which the solid-state imaging device 22 is attached is inserted from one surface of the penetrating surface, and the circuit board 29 is inserted into screw holes 51 a and 51 b provided in the attaching / detaching holding member 50. It is designed to be screwed. In addition, in this screwing, the accuracy that can be achieved by ordinary screwing is sufficient, and there is no need to mount with particularly high accuracy.
[0075]
  Further, the attaching / detaching holding member 50 is a pixel line 22a of the fixed image element 22 attached to the attaching / detaching holding member 50 in the same manner as the joining method of the solid-state imaging device 22 of the first reference example and the intermediate holding member 23. The holding member 50 for attachment and detachment is bonded and fixed to the intermediate holding members 23a and 23b so that the first bonding surfaces A and A 'and the second bonding surfaces B and B' are perpendicular to each other while being parallel to ~ 22c. Yes.
[0076]
  As a result, the line image converged by the imaging lens 25 is guided from the other through surface of the attaching / detaching holding member 50 to each pixel line 22a, 22b, 22c of the solid-state imaging device 22.
[0077]
  Regarding the position adjustment method of the solid-state image pickup device 22, the solid-state image pickup device 22 is previously attached to the circuit board 29, and the circuit board 29 is attached to the attachment / detachment holding member 50, Similarly, while observing a monitor (not shown) in which the intermediate holding member 23 is photoelectrically converted by the solid-state imaging device 22, the intermediate holding member 23 to which the solid-state imaging device 22 is attached is moved in the X-axis direction, the Z-axis direction, and the β-axis direction. Adjustment is made and positioning is performed.
[0078]
  As described above, in this reference example, the effect of the first reference example, that is, only the five-axis direction can be easily adjusted, the solid-state imaging device 22 can be attached with high accuracy, and the yield is increased. In addition to the same effect that it is possible to prevent a reduction in the fixing force of the solid-state imaging device 22 after production (after curing of the adhesive), the solid-state imaging is provided inside the detachable holding member 50. Since the circuit board 29 to which the element 22 is attached is screwed, even if the position adjustment of the solid-state image sensor 22 with the imaging lens 25 fails, the solid-state image sensor 22 is removed from the attachment / detachment holding member 50. The included circuit board 29 can be removed.
[0079]
  Further, when the circuit board 29 is screwed to the attachment / detachment holding member 50, the position of the solid-state image pickup device 22 can be adjusted after the screwing, so that this screwing does not require high accuracy and can be easily attached / detached. The solid-state imaging device 22 can be attached to the holding member 50.
[0080]
  In this reference example, the solid-state imaging element member 22 is attached to the circuit board 29, and this circuit board is screwed to the detachable holding member 50 using two screws. As shown in FIG. 3, the solid-state imaging device 22 is directly fixed from the outside of the frame of the attaching / detaching holding member 50 with the three screws 53a, 53b, 53c so as to contact the two inner wall surfaces 52a, 52b of the attaching / detaching holding member 50. May be.
[0081]
  In this reference example, when the circuit board 29 is attached to the attachment / detachment holding member 50 and when the solid-state imaging device 22 is directly attached to the attachment / detachment member as described above, the circuit board 29 is fixed by screwing. It may be fixed by fitting.
[0082]
  Further, when the circuit board 29 and the solid-state imaging device 22 are fixed to the attachment / detachment holding member 50 by screwing and snap fitting as described above, the fixing points of the screwing and snap fitting are not limited as described above. .
[0083]
[Third reference example]
  FIGS. 7 to 9 are views showing a third reference example of the member mounting structure and the member mounting apparatus according to the present invention. The member mounting structure is similar to the first reference example, and is a copier, a facsimile machine, a scanner. The present invention is applied to an image reading apparatus such as a printing apparatus and an image forming apparatus such as a printing apparatus.
[0084]
  In the first reference example, the solid-state imaging device and the frame are fixed to one intermediate holding member on the first adhesive surface A and the second adhesive surface B. However, in this reference example, as in the second reference example. The two intermediate holding members are fixed to the solid-state imaging device and the frame, and these intermediate holding members have a configuration that penetrates the circuit board on which the solid-state imaging device is attached.
[0085]
  Usually, in the contraction optical system, the variation in the position of the image plane with respect to the imaging lens is several tens of μm. On the other hand, the variation in the position of the object plane with respect to the imaging lens is several mm (hereinafter referred to as a variation in conjugate length). It is. Therefore, when this variation in conjugate length occurs, it is necessary to adjust the positions of the imaging lens and the solid-state imaging device within a range of several millimeters in the optical axis direction.
[0086]
  When the imaging lens slides on the frame, the position of the imaging lens in the optical axis direction can be adjusted as long as the imaging lens has a surface for sliding. However, when the position of the solid-state image sensor is adjusted within a range of several millimeters, the width until the intermediate holding member comes into contact with the circuit board on the imaging lens side, and the intermediate holding member on the opposite side of the imaging lens. The width can be adjusted only to the extent that a margin for securing the solid-state imaging device can be secured.
[0087]
  As shown in FIG. 7, this width is t + Δh obtained by adding the plate thickness t of the solid-state image sensor 22 and the distance Δh between the solid-state image sensor 22 and the circuit board 29 at the longest. Usually, t is 2 to 3 mm, and Δh is about 1 mm, and beyond this, it cannot be made longer due to noise problems.
[0088]
  For this reason, as described above, the adjustable width is about ± 2 mm, but usually an adhesive margin of about 1 to 2 mm is necessary, and the actual adjustment width is about ± 1 mm.
[0089]
  The variation of the conjugate length varies depending on the imaging lens, but is generally about ± 2 to 5 mm. When adjusting the variation of the conjugate length of 2 mm or more, the adjustment width is adjusted in the structure as in the first reference example. The intermediate holding member 23 may come into contact with the circuit board 29 or the bonding margin may not be secured, so that the position adjustment and fixing may not be performed.
[0090]
  This reference example is characterized in that the position adjustment in the Z-axis direction is taken into consideration, and the other configurations are the same as those of the first reference example, so the same members are denoted by the same reference numerals and description thereof is omitted. To do.
[0091]
  As shown in FIGS. 8 and 9, the second adhesive surfaces B and B ′ between the intermediate holding members 23 a and 23 b and the solid-state imaging element 22 have a length L that penetrates the circuit board 29.
[0092]
  The circuit board 29 has through holes 60 a and 60 b that penetrate the intermediate holding members 23 a and 23 b around the height at which the solid-state imaging device 22 is fixed to the intermediate holding member 23.
[0093]
  With this configuration, the solid-state imaging device 22 attached to the circuit board 29 can slide in the Z-axis direction on the second bonding surfaces B and B ′ of the intermediate holding members 23a and 23b when the position is adjusted. It has become.
[0094]
  The moving distance of the solid-state imaging element 22 at this time is l1 + l2 + 2 × t− (adhesion margin) as shown in FIG. Therefore, if the movable width (l1 + l2 + 2 × t− (adhesion)) is set wider than the variation width of the conjugate length of the imaging lens 25, the solid-state image pickup device 22 can be accurately fixed even if the conjugate length varies. Can be done.
[0095]
  As described above, in this reference example, the effect of the first reference example, that is, only the five-axis direction can be easily adjusted, the solid-state imaging device 22 can be attached with high accuracy, and the yield is increased. In addition to the same effect that it is possible to prevent a decrease in the fixing force of the solid-state imaging device 22 after production (after curing of the adhesive), the imaging lens 25 has a variation width of the conjugate length. Even if this occurs, a width sufficient to correct this error width can be provided in the Z-axis direction, so that the position can be accurately adjusted.
[0096]
  In addition, the through holes 60a and 60b of the present reference example may be a curved shape such as a hole or a notch, a linear shape, or a circle as shown in FIG. However, what penetrates the intermediate holding members 23a and 23b most effectively is wider than the projection shape of the intermediate holding members 23a and 23b by the shape error and installation error of the circuit board 29 and the intermediate holding members 23a and 23b. Shape.
[0097]
  In this reference example, when adjusting the position of the second adhesive surface, when moving the solid-state imaging device 22 in the optical axis direction, the circuit board 29 is provided with through holes 60a and 60b, and the through holes 60a and 60b are provided. The intermediate holding members 23a and 23b are partially penetrated so as not to contact the circuit board 29. At that time, the solid-state imaging device 22 is attached to the circuit board 29 so as not to contact the intermediate holding members 23a and 23b. It may be arranged.
[0098]
  For example, when the intermediate holding members 23a and 23b are fixed on the upper surface of the solid-state imaging device 22, the circuit board 29 does not contact the intermediate holding members 23a and 23b even if the solid-state imaging device 22 is moved in the optical axis direction. As described above, the solid-state imaging device 22 may be mounted on the upper end portion of the circuit board 29. Even in such a configuration, the same effects as in the present reference example can be obtained.
[0099]
[Fourth Reference Example]
  FIG. 10 is a view showing a fourth reference example of a member mounting structure and a member mounting apparatus according to the present invention. The member mounting structure is an image reading apparatus such as a copying machine, a facsimile apparatus, a scanner apparatus, a printing apparatus, or the like. This is applied to the image forming apparatus.
[0100]
  In this reference example, in place of the third reference example, a through hole is provided in the circuit board, and the position of the solid-state imaging device in the Z-axis direction is adjusted so that the intermediate holding member can be passed through. The frame is characterized in that the first adhesive surface A with the intermediate holding member is moved in the Z-axis direction to adjust the distance between the imaging lens and the solid-state imaging device, and the other configuration is the third reference example. Therefore, the same members are denoted by the same reference numerals and description thereof is omitted. However, as the intermediate holding member, four members 23a, 23b, 23c, and 23d are used in the upper and lower portions of the solid-state imaging device 22 two by two.
[0101]
  As shown in FIG. 10, the frame 21 includes an imaging lens fixing surface 70 that fixes the imaging lens, a conjugate adjustment bracket 71 that performs conjugate adjustment, and a sliding surface on which the conjugate adjustment bracket 71 slides. 72 and the conjugate adjustment bracket 71 constitutes an adjustment member according to the present invention.
[0102]
  The imaging lens fixing surface 70 corresponds to the horizontal portion 21a of the first reference example, and the sliding surface 72 is lower than the imaging lens fixing surface 70. Further, when adjusting the positions of the solid-state imaging device 22 and the imaging lens 25, the conjugate adjustment bracket 71 is slid on the sliding surface 72, and the solid-state imaging device 22 and the imaging lens 25 are slid. After the position is determined, the conjugate adjustment bracket 71 is fixed.
[0103]
  As a result, as in the third reference example, if the movable width of the conjugate adjustment bracket 71 is set wider than the conjugate length variation width of the imaging lens 25, solid-state imaging can be performed even if the conjugate length variation occurs. The element 22 can be accurately fixed.
[0104]
  As described above, in this reference example, as in the third reference example, in addition to the same effects as in the first reference example, this error in the Z-axis direction can be achieved even if a conjugate width variation occurs in the imaging lens 25. Since a width sufficient to correct the width can be provided, position adjustment can be performed accurately.
[0105]
[First embodiment]
  FIGS. 11 to 13 are views showing a first embodiment of a member mounting structure and a member mounting device according to the present invention, and this mounting device is applied to a solid-state image sensor mounting device.
[0106]
  This embodiment is an embodiment of an apparatus for adjusting the position of the solid-state imaging device in the Z-axis direction in a third embodiment to be described later, and a member having a member mounting structure is the same as in the third embodiment. Therefore, the same members are denoted by the same reference numerals and description thereof is omitted.
  First, the configuration will be described.
[0107]
  A solid-state image sensor mounting apparatus 80 shown in FIG. 11 includes a light source 81, a chart 82 irradiated by the light source 81, a frame 21, a solid-state image sensor 22 and an intermediate holding member 23 according to the third embodiment. A fixing base 84 for holding the element member 83, a chart holding member 85 for holding the light source 81 and the chart 82, a base 86 for fixing the chart holding member 85 and the fixing base 84, and a controller 87 for controlling the mounting device. And.
[0108]
  The light source 81 is disposed above the chart holding member 85 so as to irradiate the chart. In the chart 82, the center of the chart 82 coincides with the optical axes of the solid-state imaging device 22 and the imaging lens 25. It is arranged.
[0109]
  The fixing base 84 has a first fixing portion (not shown) that fixes the frame 21 with a chuck or the like, and a second fixing portion 100 that fixes the solid-state imaging device 22 with a chuck or the like. The second fixed portion is translated back and forth in the Z-axis direction, that is, the chart direction by the control portion 87.
[0110]
  Further, the height of the fixed base 84 can be changed vertically, and the center of the chart can be adjusted so that the optical axis of the imaging lens 25 fixed to the fixed base 84 coincides. .
[0111]
  The distance between the fixed base 84 and the chart holding member 85 is changed according to the focal length of the imaging lens 25 so that the fixed base 84 can be translated back and forth in the chart holding member direction. It has become.
[0112]
  A control unit 87 shown in FIG. 12 receives an output image data from a circuit board (hereinafter referred to as a CCD circuit board) 29 to which the solid-state image pickup device 22 is attached, and calculates a position of the solid-state image pickup device 22. Based on the calculation result, a central processing unit (hereinafter referred to as a CPU) 89 that controls the second fixing unit 100 and the length of the first adhesive surface A of the intermediate holding member 23 shown in FIG. 20 of the third embodiment. A display unit 90 that displays the power, a light source drive control unit 91 that controls the power source of the light source 81, and a CCD circuit drive control unit 92 that drives the solid-state imaging device 22 and the CCD circuit board 29.
[0113]
  The calculation unit 88 receives image data from the solid-state image sensor 22 that forms an image of the chart 82 via the imaging lens 25, and calculates the position of the solid-state image sensor 22 from this image data.
[0114]
  In the CPU 89, the second fixing unit 100 is moved in the Z-axis direction, that is, the optical axis direction based on the calculation result calculated by the calculation unit 88. The CPU 89 controls the light source drive controller 91 and the CCD circuit drive controller 92.
[0115]
  The display unit 90 calculates and displays the length L of the first adhesive surface A after the CPU 89 adjusts the second fixing unit.
[0116]
  Next, operation | movement of this mounting apparatus 80 is demonstrated using FIG.
[0117]
  First, the solid-state imaging element member 83 is fixed to the first fixing portion and the second fixing portion 100 of the fixing base 84, the height of the fixing base 84 is matched with the center of the chart 82 and the optical axis 28, and the imaging lens Based on the focal length, the distance from the chart 82 is adjusted, and the power supply and the solid-state imaging device 22 are driven (step 1).
[0118]
  Next, the chart 82 is imaged on the solid-state imaging device 22, image data is output, and this image data is input to the calculation unit 88 (step 2).
[0119]
  Next, the computing unit 88 computes the position of the solid-state imaging device 22 based on this image data (step 3).
[0120]
  Next, the CPU 89 determines whether there is a variation in conjugate length based on the calculation result (step 4). If there is no variation in the conjugate length, the length of the first adhesive surface A of the intermediate holding member 23 is calculated, this length is displayed (step 5), and this operation is terminated. If there is a variation in the conjugate length, the second fixed unit 100 is translated to adjust the position (step 6), and the solid-state imaging device 22 inputs the chart 82 again (step 2).
[0121]
  As described above, in the present embodiment, the chart 82 irradiated by the light source 81 is imaged on the solid-state imaging device 22 via the imaging lens 25, and the position of the second fixing unit 100 is calculated from this image data. Therefore, even if the relative position shift between the frame 21 and the solid-state image sensor 22 is caused by the variation in conjugate length generated in the imaging lens 25, the second fixing unit 100 causes the solid-state image sensor 22 to move in the Z-axis direction. The solid-state imaging device 22 can be fixed with high accuracy and can be fixed to the intermediate holding member 23.
[0122]
  In the present embodiment, the solid-state imaging device is held on the second adhesive surface by a chuck, and then fixed and fixed. However, every time several kinds of intermediate holding members 23 are prepared and the position is adjusted. The intermediate holding member 23 may be replaced, and the intermediate holding member 23 corresponding to the length L may be fixed.
[0123]
  In the present embodiment, the solid-state image pickup member having the structure of the fourth embodiment may be used as the solid-state image pickup member to be used. In this case, the second fixing portion 100 holds the conjugate adjustment bracket.
[0124]
[Fifth Reference Example]
  FIGS. 14 to 16 are views showing a fifth reference example of the member mounting structure and the member mounting device, and this mounting device is applied to a solid-state image sensor mounting device.
[0125]
  A further object of the fifth reference example is to provide a mounting structure for a solid-state imaging device that does not cause layout restrictions by having all the components fit in the minimum necessary space.
[0126]
  14 and 15, an image forming lens 25 for forming an image of a document on RGB pixel lines 1a, 1b, and 1c (see FIG. 48) is provided on a frame 221 in a V groove 24 in the horizontal portion 221a. On the upper side, it is pressed and supported by the lens pressing plate 26. At this time, the optical axis 28 of the imaging lens 25 corresponds to the Z direction in terms of coordinates. In addition, the X direction is the main scanning direction in the image reading apparatus, that is, the line direction of the pixel lines, and the Y direction corresponds to the sub-scanning direction.
[0127]
  The circuit board 29 has the solid-state imaging device 22 mounted thereon. Here, the circuit board 29 has a function of driving the solid-state imaging device 22 and electrically transmitting the electrical output signal of the solid-state imaging device 22 associated with the formed optical image to the image reading apparatus after electrical processing. Have.
  The solid-state imaging device 22 is attached to the vertical portion 221b of the frame 221 via an L-shaped intermediate holding member 223.
[0128]
  In FIG. 16, the intermediate holding member 223 and the solid-state image sensor 22 are bonded and fixed by providing a second adhesive surface B on the side surface of the solid-state image sensor 22. The intermediate holding member 223 and the frame 221 are bonded and fixed on the first bonding surface A of the vertical portion 221b.
[0129]
  Here, the first bonding surface A, which is the frame-side bonding surface, is arranged at a position that intersects the optical axis 28 when viewed from the X direction as shown in FIG. Therefore, the height of the horizontal portion 223e of the intermediate holding member 223 and the vertical portion 221b of the frame 221 is substantially the same as the height of the lens pressing plate 26 as shown in FIG.
[0130]
  With respect to this height direction (Y direction), at least the dimension of the imaging lens 25 must be secured at a minimum. Therefore, as shown in FIG. 15, by expanding the vertical portion 223f of the intermediate holding member 223 to the same size as the lens size, the layout of the entire structure can be maintained as it is while increasing the adhesion area (that is, the adhesion force). . That is, since all the components are contained in the minimum necessary space, there is no layout restriction.
[0131]
  In the bonding means between the solid-state imaging device 22 and the intermediate holding member 223 and the bonding means between the imaging lens 25 and the intermediate holding member 223, it is particularly productive to use an ultraviolet curable adhesive having a fast curing speed of about 10 seconds. This is advantageous. In this case, a transparent member such as glass or plastic is used as the intermediate holding member 223, and ultraviolet rays (not shown) are transmitted through the intermediate holding member 223 to irradiate the first adhesive surface A and the second adhesive surface B. Curing is possible.
[0132]
  Before and after the adhesive curing at the time of manufacturing, the frame 221 and the solid-state imaging element 22 are held by a manufacturing apparatus (not shown), and the intermediate holding member 223 is not held.
[0133]
  For this reason, when the ultraviolet rays are irradiated, the adhesive shrinks from the initial state. Due to the shrinkage of the adhesive, the adhesive is cured while moving so that the intermediate holding member 223 is attracted to the frame 221 and the solid-state imaging device 22.
[0134]
  Then, the adhesive thickness between the second adhesive surface B and the first adhesive surface A in this adhesive fixing is preferably as thin as possible in order to reduce the influence of curing shrinkage. However, in actuality, it is necessary to set a thickness sufficient to fill in the difference between the unevenness of the plane according to the flatness of the solid-state imaging device 22, the frame 221, and the intermediate holding member 223.
[0135]
  By the way, at the time of manufacture, the solid-state imaging device 22 must first be adjusted to a predetermined position before the adhesive fixing. That is, by this position adjustment, the optical characteristics (focus, magnification) are read with a predetermined required accuracy, and the solid-state image pickup device 22 is finely moved in the 5-axis directions of x, y, z, β, and γ to adjust the position. Is required.
  On the other hand, first, in the case of the X direction, the solid-state imaging device 22 is adjusted by sliding in the X direction on the second adhesive surface B.
[0136]
  In the case of the Y direction, adjustment is performed by sliding the intermediate holding member 223 and the solid-state imaging device 22 on the first adhesive surface A in conjunction with each other.
  In the case of the Z direction, the solid-state imaging device 22 is adjusted by sliding in the Z direction on the second adhesive surface B.
[0137]
  Among the rotation adjustments, the β direction is adjusted by moving the solid-state imaging element 22 in the β direction in conjunction with the second adhesive surface B.
  The γ adjustment of the rotation adjustment is performed by rotating the first holding surface A in the γ direction in conjunction with the intermediate holding member 223 and the solid-state imaging device 22.
  These individual movements of x, y, z, β, γ can be performed completely independently in the other directions. This is because the second adhesive surface B and the first adhesive surface A are configured at right angles. Since the two bonding surfaces are perpendicular to each other, the sliding and adjusting movement can be matched with the rectangular coordinates.
[0138]
  As described above, according to the fifth reference example, the first adhesive surface A is orthogonal to the optical axis 28 and the optical axis height is disposed within the vertical width of the first adhesive surface A. For the influence of the curing shrinkage of the adhesive that occurs at the time of curing, the solid-state imaging device itself is converted by a movement (displacement) in which the intermediate holding member 223 approaches the solid-state imaging device 22 and the frame 221 as the adhesive shrinks. The solid-state image sensor 22 can be positioned with high accuracy with respect to the frame 221.
[0139]
  Furthermore, by adjusting the slide on two perpendicular surfaces (second adhesive surface B and first adhesive surface A), the entire structure is finely moved in the five axes of x, y, z, β, and γ to adjust the position. can do.
[0140]
  Furthermore, by arranging the first adhesive surface A and the optical axis at the same height in the state viewed from the X direction, the vertical (Y direction) width of the imaging lens 25 which is a basic constraint range in the layout. Since the second adhesive surface B and the first adhesive surface Ab can be accommodated in the interior, all components can be accommodated in the minimum necessary space, and the occurrence of layout restrictions can be prevented. Can do.
[0141]
[Sixth Reference Example]
  FIGS. 17 to 18 are views showing a sixth reference example of a member mounting structure and a member mounting device, and this mounting device is applied to a solid-state image sensor mounting device.
[0142]
  In the sixth reference example, as shown in FIG. 17, the number of intermediate holding members 23 that fix the solid-state imaging element 22 is two or more, and at least one intermediate holding member 23 on the solid-state imaging element 22 side. The adhesive surface 23e is disposed so as to face the adhesive surface 23f of the remaining intermediate holding member 23 on the solid-state imaging device 22 side. In the figure, 23g is a rib.
[0143]
  At this time, the adhesive surface 23e and the adhesive surface 23f are arranged in parallel as shown in FIG. 18A, or the adhesive surface 23e and the adhesive surface 23f are opposed to each other as shown in FIG. 18B. It is also possible to arrange so as to.
[0144]
  As shown in the sixth reference example, the mounting structure of the solid-state imaging device 22 in which the intermediate holding member 23 is arranged, the natural frequency of the mounting structure of the solid-state imaging device shown in the reference examples of FIGS. By analysis, up to mode 3 was obtained and compared. According to this comparison, it can be seen that the natural frequency of the mounting structure of the solid-state imaging device according to the sixth embodiment is about 30 to 50% higher, and the structure is strong against vibration.
[0145]
  As described above, according to the sixth reference example, two or more intermediate holding members are used, and at least one of the intermediate holding members has a solid-state imaging element side adhesive surface on the other intermediate holding member. By disposing in the direction facing the side adhesive surface, it is possible to make the structure stronger against external force and vibration than arranging the same number of intermediate holding members on the same surface side.
[0146]
  In the embodiment of the present specification, as the shape of the intermediate holding member, a rib may be provided as shown in the sixth reference example as an example, or a right triangular prism shape may be used.
[0147]
[Second Embodiment]
  FIG. 19 is a view showing an intermediate holding member used in the second embodiment of the member mounting structure and member mounting apparatus according to the present invention, and the configuration other than the intermediate holding member is the same as that of the sixth reference example shown in FIG. The present mounting device is applied to a mounting device for a solid-state imaging device.
[0148]
  As shown in FIG. 19, in the second embodiment, the intermediate holding member 23 has ribs at both ends of both the adhesive surfaces so as to be perpendicular to both the adhesive surfaces of the solid-state imaging element side adhesive surface and the holding member side adhesive surface. 23h is provided. Then, as shown in FIG. 17, the frame 21 and the solid-state imaging device 22 are arranged to be fixed, and ultraviolet rays are irradiated from the direction of the arrow U in FIG. 19 in order to cure the ultraviolet curable adhesive. At this time, the amount of ultraviolet light per unit area that passes through the flat portions 23e and 23f of the intermediate holding member 23 is the same as that of an L-shaped intermediate holding member (for example, see FIGS. 2 and 3) that does not have the ribs 23h. Therefore, uneven curing of the ultraviolet curable adhesive is unlikely to occur. In addition, in terms of strength, the rib 23h is provided as compared with the L-shaped intermediate holding member not provided with the rib 23h, and thus the shape is strong against external force and vibration.
[0149]
  As described above, according to the second embodiment, since the rib-shaped ribs 23h perpendicular to both the bonding surfaces of the intermediate holding member (the second bonding surface B and the first bonding surface A) are provided at both ends of the bonding surface, intermediate holding is performed. The strength equivalent to that of the triangular prism shape of the member 23 can be obtained, and the adhesive surface can be flattened, thereby making it possible to make the amount of transmitted ultraviolet light constant when fixing the adhesive, and thus improving the adhesive quality. Since it can be made uniform, a solid-state imaging device mounting structure that is resistant to external forces and vibrations can be obtained.
[0150]
[Third Embodiment]
  20 and 22 to 25 are views showing a member mounting structure and a member mounting apparatus according to a third embodiment of the present invention. The mounting apparatus is applied to a solid-state image sensor mounting apparatus.
[0151]
  FIG. 20 shows an example of the third embodiment, and FIG. 21 is a reference example.
  As shown in FIGS. 20 and 21, after all the adjustments are completed and the adhesive is cured, the frame 21 is attached to the housing 270 using fixing means 271 such as screws. The fixing means 271 usually has two or more fixing positions 272 in order to stably fix the frame 21. At this time, the frame 21 is restrained by the fixing means 271 on the plane 278 where the frame 21 and the fixing means 271 come into contact.
[0152]
  As shown in FIG. 24 in which the main part of FIG. 20 is enlarged, a straight line 279 may be formed on the frame 21 between arbitrary points in two planes 278 that constrain arbitrary two fixed positions 272. it can.
[0153]
  As shown in FIG. 20, the first bonding surface A that bonds the intermediate holding member 23 and the frame 21 is disposed in a plane 276 obtained by extending a straight line 279 in a direction parallel to the housing fixing direction 275. .
[0154]
  In addition, as shown in FIG. 25 in which the main part of FIG. 21 is enlarged, a plane 282 is formed by connecting arbitrary points in the plane 278 that restrains each of the three or more fixed positions 272 with a straight line 281. It will be.
[0155]
  As shown in FIG. 21, the first bonding surface A that bonds the intermediate holding member 23 and the frame 21 is disposed in a space 277 obtained by extending the plane 282 in a direction parallel to the housing fixing direction 275. .
[0156]
  Here, when the first bonding surface A for bonding the intermediate holding member 23 and the frame 21 is located outside the space 277, the structure is simplified as shown in FIG. When approximated to the shape model, the fixed position 272 is approximated to the beam model fixed position 272 ′, and the system including the frame 21—the intermediate holding member 23—the solid-state image sensor 22 is approximated to the beam 279, and is represented as a cantilever model. It will be.
[0157]
  When the structure of FIG. 20 which is an example of the mounting structure of the solid-state imaging device of the third embodiment is similarly approximated to a beam-shaped model, it is expressed as a both-ends fixed beam model as shown in FIG.
  Here, when the strength and the own weight of the beam portions of both models are equal, the both-ends fixed model is stronger in strength than the cantilever beam model and has a higher natural frequency.
[0158]
  According to the third embodiment described above, the first bonding surface A that bonds the frame 21 and the intermediate holding member 23 has two arbitrary fixing points for attaching the frame 21 to the housing 270 as shown in FIG. A plane obtained by extending a straight line 279 formed by connecting any two points in each plane 278 that restrains the frame 21 by a fixing member 271 attached to the frame 272 in a direction parallel to the mounting direction 275 to the housing 270. A straight line 281 connects any point in each plane 278 that restrains the frame 21 by a fixing member 271 that is attached to a position that intersects 276 or three or more fixing points 272 that attach the frame 21 to the housing 270. Is formed in a space 277 obtained by extending in a direction parallel to the mounting direction 275 to the housing 270, When a system consisting of a ram-intermediate holding member-solid-state image sensor is viewed as a vibration model, it can be regarded as a beam with both ends fixed, and the strength of the solid-state image sensor mounting portion is higher than that of the other, Improves vibration resistance.
[0159]
[Fourth Embodiment]
  FIGS. 26 to 28 are views showing a fourth embodiment of the mounting structure of the solid-state image sensor mounting structure according to the present invention, and this mounting structure is applied to an image reading apparatus such as a copying machine, a facsimile apparatus, a scanner apparatus or the like. .
[0160]
  First, the configuration will be described. 26 to 28, reference numeral 21 denotes a frame (imaging lens holding member), and the frame 21 is formed in a planar shape.
[0161]
  A V groove 24 is formed in the frame 21, and an imaging lens 25 is positioned in the V groove 24. The imaging lens 25 forms an image of an original on each pixel line 22a, 22b, 22c provided for each of RGB of the photoelectric conversion element 22 such as a CCD, and is fixed to the frame 21 by a lens presser 26. . A screw hole 27 is formed in the frame 21, and a bolt (not shown) is inserted into an insertion hole 26 a formed in the lens holder 26, and the bolt 27 is screwed into the screw 27, whereby the presser plate 26 is attached to the frame 21. 21 is fixed.
[0162]
  In the solid-state imaging device 22, pixel lines 22a, 22b, and 22c having photoelectric conversion elements built in are arranged on a straight line on the surface of a main body 32 made of ceramics, and a cover that covers the pixel lines 22a to 22c is provided on the surface of the main body 32. A glass (a portion indicated by oblique lines in FIG. 27C) 33 is attached. Further, a pair of intermediate holding members 23 are attached to both ends of the main body 32 excluding the cover glass 33, and the main body 32 is arranged so that the pixel lines 22 a, 22 b, and 22 are opposed to the imaging lens 25 by the intermediate holding member 23. Are supported by the protruding portion 21a of the frame 21.
[0163]
  In FIG. 27, reference numeral 28 denotes an optical axis, which corresponds to the Z direction on the coordinates. The X-axis direction is the main scanning direction in the image reading apparatus, and the Y-axis direction corresponds to the sub-scanning direction.
[0164]
  Further, a terminal 34 is provided on the back surface of the main body 32, and a circuit board 29 is attached to the terminal 34. The circuit board 29 drives the solid-state imaging device 22, while the solid state associated with the formed optical image. The electrical output signal of the image sensor 22 is electrically processed and then transmitted to the image reading apparatus.
[0165]
  On the other hand, the intermediate holding member 23 is formed in an L shape and is made of a material that transmits ultraviolet light. The intermediate holding member 23 is fixed to the ceramic surface of the main body 32 excluding the protruding portion 21a and the cover glass 33 by ultraviolet curable adhesives 30 and 31, respectively. The bonding surface (the bonding surface between the protruding portion 21a and the intermediate holding member 23) (Hereinafter referred to as the first adhesive surface) A is a surface parallel to the pixel lines 22a to 22c and the optical axis 28 of the solid-state imaging device 22, and an adhesive surface (hereinafter, referred to as the solid-state imaging device 22, the main body 32 and the intermediate holding member 23). The intermediate holding member 23 is disposed between the protruding portion 21a and the ceramic surface of the main body 32 so that B (referred to as a second adhesive surface) B is orthogonal to the optical axis 28.
[0166]
  Next, a method for adjusting the position of the solid-state image sensor 22 will be described.
  First, the adhesives 30 and 31 are applied to the two orthogonal surfaces A and B of the intermediate holding member 23 by a solid-state imaging device mounting device (not shown). At this time, after adjusting the film thickness of the adhesives 30 and 31 to be constant while monitoring the film thicknesses of the adhesives 30 and 31 with a camera (not shown), the ceramic surface on the surface of the main body 32 is fixed to the intermediate holding member by the mounting device. 23 and the intermediate holding member 23 is attached to the protruding portion 21a.
[0167]
  Next, the line image formed by the imaging lens 25 is positioned on the solid-state imaging device 22, and the optical characteristics (focus, magnification, etc.) are read with a predetermined required accuracy. At this time, the position of the solid-state image sensor 22 is adjusted while outputting the data photoelectrically converted by the solid-state image sensor 22 by the monitor.
[0168]
  First, when the position of the X-axis direction is adjusted after fixing the frame 21 to the mount of the mounting apparatus, the intermediate holding member 23 is gripped with a chuck or the like so that the intermediate holding member 23 slides on the adhesive 30. Adjust.
[0169]
  Further, when the position of the β axis around the Y axis is adjusted, the intermediate holding member 23 is gripped with a chuck or the like so that the intermediate holding member 23 slides on the adhesive 30.
[0170]
  When adjusting the position in the Y-axis direction, the circuit board 29 and the intermediate holding member 23 are held by a chuck or the like so that the solid-state imaging device 22 and the intermediate holding member 23 slide on the adhesive 31 at the same time. To do.
[0171]
  Further, when adjusting the position in the Z-axis direction, the intermediate holding member 23 is held by a chuck or the like so that the solid-state imaging device 22 slides on the adhesive 30 at the same time.
[0172]
  Further, when adjusting the position of the γ-axis around the Z-axis, the circuit board 29 and the intermediate holding member 23 are gripped by a chuck or the like so that the solid-state imaging device 22 and the intermediate holding member 23 slide on the adhesive 31 simultaneously. To adjust.
[0173]
  In the present embodiment, since the intermediate holding member 23 is disposed between the frame 21 and the solid-state imaging element 22 so that the first adhesive surface A and the second adhesive surface B are at right angles, X, Y, Z, The individual movements of β and γ can be performed independently for each axis, and the movement of sliding and adjusting the intermediate holding member 23 and the solid-state image sensor 22 can be made to coincide with the rectangular coordinates.
[0174]
  Here, the reason for not adjusting the rotation axis around the X axis is that the Y and Z axes are perpendicular to the pixel lines 22a to 22c, and the γ and β axes around the Y and Z axes are adjusted. Otherwise, the distance between the imaging lens 25 and the solid-state imaging device 22 differs for each pixel and the accuracy of the optical characteristics decreases, whereas the X-axis is coaxial with the pixel lines 22a to 22c (parallel). For this reason, the distance between the imaging lens 25 and the solid-state imaging element 22 does not vary from pixel to pixel without being adjusted around the X axis, and is not affected by the optical characteristics.
[0175]
  When the position of the solid-state image pickup device 22 is adjusted as described above and it is determined from the monitor output that the optical characteristics satisfy a predetermined required accuracy, the adhesives 30 and 31 are irradiated with an ultraviolet irradiation light (not shown). The adhesives 30 and 31 are cured by irradiating ultraviolet rays through the intermediate holding member 23 from the direction perpendicular to the bonding surface at the same time throughout the bonding area.
[0176]
  As described above, in the present embodiment, the first bonding surface A between the frame 21 and the intermediate holding member 23 becomes a plane parallel to the pixel line and the optical axis 28 of the solid-state image sensor 22, and between the surface of the solid-state image sensor 22 and the middle. By arranging the intermediate holding member 23 so that the second adhesive surface B with the holding member 23 is a surface orthogonal to the optical axis 28, position adjustment in the direction of the axis around the X axis is not performed positively. Thus, only the X, Y, Z, β, and γ five-axis directions can be easily adjusted.
[0177]
  Further, after the five-axis adjustment, the adhesive 30 that is bonded to the first adhesive surface A and the second adhesive surface B by the amount of the intermediate holding member 23 interposed between the solid-state imaging element 22 and the frame 21. The solid-state imaging device 22 can be attached without having to strictly manage the positional accuracy of the bonding location of the solid-state imaging device 22 and the bonding location of the frame 21 only by managing the film thickness of 31 at a necessary minimum and constant. This can be performed with high accuracy, and it is possible to increase the yield and prevent the fixing force of the solid-state imaging device 22 from being lowered after production (after the adhesive is cured).
[0178]
  In addition, the adhesives 30 and 31 are made of an ultraviolet curable adhesive, and the intermediate holding member 23 is made of a material that transmits ultraviolet rays, so that the ultraviolet curable adhesive is irradiated with ultraviolet rays through the intermediate holding member 23. CanBecauseFurther, it is possible to irradiate ultraviolet rays from the vertical direction with respect to the bonding surface at the same time over the entire bonding area, and it is possible to further shorten the time until the adhesives 30 and 31 are cured, thereby improving productivity.
[0179]
  The thickness of the adhesives 30 and 31 is preferably as thin as possible in order to reduce the influence of curing shrinkage. However, in practice, it is necessary to set a thickness sufficient to fill in the difference between the unevenness of the plane according to the flatness of the solid-state image sensor 22, the frame 21, and the solid-state image sensor 22.
[0180]
  In the present embodiment, the intermediate holding member 23 is attached to both ends of the main body 32 excluding the cover glass 33, but the present invention is not limited thereto, and the intermediate holding member 23 may be attached to the back surface of the main body 32. In this case, the holding surface 23e of the intermediate holding member 23 shown in FIG. 26 (a) may be interposed between the circuit board 29 and the main body 32.
[0181]
  In addition, the intermediate holding member 23 may be attached to both ends of the cover glass 33 as shown in FIG. 28A, and the intermediate holding member is provided on the surface of the circuit board 29 as shown in FIG. 23 may be attached. Needless to say, even in this case, the same effect as described above can be obtained.
[0182]
[Fifth Embodiment]
  FIGS. 29-30 is a figure which shows 5th Embodiment of the attachment structure and member attachment apparatus based on this invention, and this attachment apparatus is applied to the attachment apparatus of a solid-state image sensor.
[0183]
  FIG. 29 is an exploded perspective view showing an example of a solid-state image sensor mounting structure according to the fifth embodiment of the present invention, and FIG. 30 is a solid-state image sensor mounting structure according to the fifth embodiment of the present invention. It is a perspective view which shows an example. This mounting structure is applied to an image reading apparatus such as a copying machine, a facsimile machine, and a scanner apparatus.
[0184]
  First, the component configuration of the mounting apparatus to which the mounting structure is applied will be described.
  As shown in FIGS. 29 and 30, the mounting device for the solid-state imaging device 22 has the imaging lens 22, the first adhesive surface A, and the second adhesive surface B perpendicular to each other, and both surfaces are parallel to the pixel line. Are provided with an intermediate holding member 23 having a structure disposed on the circuit board 29, a circuit board 29 on which the solid-state imaging device 22 is held, a groove 24 on which the imaging lens 25 is placed, and a screw hole 27 for fixing the lens holder 26. And a frame which is an imaging lens holding member provided with two pixel surfaces composed of photoelectric conversion elements of the solid-state imaging device 22 and two adhesive surfaces 21a parallel to the optical axis on the side facing the imaging lens 25 installation side. 21, a lens holder 26 that is a band for fixing the imaging lens 25 to the groove 24 of the frame 21, and a spacer 307 fixed to the circuit board 29 by means that can be attached and detached. As shown in FIGS. 29 and 30, the shape of the spacer 307 is an integrated shape continuous at a plurality of bonding locations.
  The frame 21 and the spacer 307 are made of materials having the same linear expansion coefficient, and the circuit board 29 has a lower rigidity than the spacer 307.
[0185]
  According to the embodiment of FIGS. 29 and 30, when the environmental temperature change occurs, the linear expansion coefficients of the frame 21 and the spacer 307 are the same, so the extension amounts are equal, and the adhesive layers of the two intermediate holding members 23 No stress is generated between them, and no peeling occurs. In addition, since the linear expansion coefficient of the circuit board 29 is not the same as that of the spacer 307, a difference in the amount of extension occurs. However, the rigidity of the circuit board 29 is weaker than the rigidity of the spacer 307, and therefore follows the extension amount of the spacer 307. Since the position of the solid-state image sensor 22 does not change, the reliability of the adhesive force between the frame 216 and the spacer 307 is maintained.
[0186]
  FIG. 31 is a perspective view showing another example of the fifth embodiment of the present invention.
  In the example of FIG. 31, the same parts as those in the example of FIG.
  As shown in FIG. 31, the spacer 307 has a separate structure at a plurality of adhesion points. Furthermore, the linear expansion coefficients of the frame 21 and the spacer 307 are made of the same material.
[0187]
  According to this configuration, when an environmental temperature change occurs, the linear expansion coefficients of the frame 21 and the circuit board 29 are the same, so the extension amounts are equal, and stress is applied between the adhesive layers of the two intermediate holding members 23. Therefore, the reliability of the adhesive force between the frame 21 and the circuit board 29 is maintained.
[0188]
  In addition, as shown in FIG. 31, the spacer 307 has a separate structure at a plurality of adhesion points, and uses materials having different coefficients of linear expansion between the frame 21 and the circuit board 29, and further the rigidity of the circuit board. Can be weaker than the rigidity of the frame.
[0189]
  According to this configuration, when an environmental temperature change occurs, the linear expansion coefficients of the frame 21 and the circuit board 29 are different, so that a difference occurs in the extension amount. However, since the rigidity of the circuit board 29 is weaker than the rigidity of the frame 21, the circuit board 29 follows the amount of extension of the frame 21. For this reason, the position of the solid-state imaging device 22 does not change, and the reliability of the adhesive force between the frame 21 and the circuit board 529 is maintained.
[0190]
  32 to 34 are cross-sectional views showing a mounting structure between the circuit board 29 and the spacer 307 in the fifth embodiment.
  As shown in FIG. 32, in this attachment structure, the circuit board 29 and the spacer 307 are attached via screws 308.
[0191]
  According to this mounting structure, even if a defective product is made in the mounting process of the solid-state imaging device, the solid-state imaging device 22 is provided from the spacer 307 by taking the screw 308 that fixes the spacer 307 to the circuit board 29. The circuit board 29 can be removed and reused.
[0192]
  As shown in FIG. 33, in this attachment structure, the circuit board 29 and the spacer 307 are attached via a patching stop 309.
  According to this mounting structure, even if a defective product is made in the mounting process of the solid-state imaging device, the solid-state imaging device 22 is removed from the spacer 307 by removing the patching stop portion 309 that fixes the spacer 307 to the circuit board 29. Can be removed and reused.
  As shown in FIG. 34, in this attachment structure, the circuit board 29 and the spacer 307 are attached via the heat welding part 310.
[0193]
  According to this mounting structure, even if a defective product is produced in the mounting process of the solid-state imaging element, the solid-state imaging element is separated from the spacer 307 by cutting the heat welding portion 310 that fixes the spacer 307 to the circuit board 29. The circuit board 29 having 22 can be removed and reused.
[0194]
[Sixth Embodiment]
  35 to 37 are views showing a member mounting structure and a member mounting apparatus according to a sixth embodiment of the present invention, and this mounting apparatus is applied to a solid-state image sensor mounting apparatus.
[0195]
  The sixth embodiment is different from the above-described embodiments of FIGS. 29 and 30 in the spacer portion and the other configurations are the same.
  As shown in FIGS. 35 and 36, the spacer 307 is disposed so as to surround the solid-state image pickup device 22 at the opening thereof, and is attached to the solid-state image pickup device 22 with a fixing screw 308 which is a detachable fixing means. The spacer 307 and the intermediate holding member 2 are bonded in the same manner as the structure shown in FIGS. In the structure of this embodiment, the frame 21, the spacer 307, and the intermediate holding member 23 are composed of members having the same linear expansion coefficient.
  FIG. 37 shows an intermediate holding member similar to that used in FIGS.
[0196]
  According to the above configuration, even if a defective product is produced in the process of attaching the circuit board 29 having the solid-state image pickup device 22, the circuit board 29 having the solid-state image pickup device 22 is removed from the defective product by loosening the fixing screw 308. The circuit board 29 having the solid-state image sensor 22 can be reused.
[0197]
  In addition, by being composed of members having the same linear expansion coefficient, even when an environmental temperature change occurs, there is no advantage in that stress is generated on the adhesive surface and no peeling occurs, so that the reliability of the adhesive force is maintained. Also have.
[0198]
  In addition, as shown in FIG. 36, when the standard holding characteristics cannot be obtained after the intermediate holding member 23 and the frame 21 and the intermediate holding member 23 and the spacer 307 are positioned and bonded and fixed in the solid-state imaging device mounting process. By loosening the screw 308 fixed to the solid-state image sensor 22, the circuit board 29 having the solid-state image sensor 22 can be removed from the spacer 307 and reused.
[0199]
[Seventh Embodiment]
  38 to 41 are views showing a member mounting structure and a member mounting apparatus according to a seventh embodiment of the present invention. The mounting apparatus is applied to a solid-state image sensor mounting apparatus.
[0200]
  38 and 39 are configuration diagrams showing the seventh embodiment, FIG. 38 is an exploded perspective view, and FIG. 39 is a perspective view. 40 is an enlarged perspective view of the periphery of the solid-state imaging device, and FIG. 41 is a front view of the solid-state imaging device.
  The seventh embodiment is different from the above-described embodiment of FIGS. 29 and 30 in the portion relating to the adhesion of the intermediate holding member, and the other configurations are the same.
[0201]
  As shown in FIGS. 38 to 40, the position where the circuit board 29 is bonded is on the extension of the pixel line of the solid-state image sensor 22 and is separated from the end of the solid-state image sensor 22 by the distance of the adjustment margin 320 of the solid-state image sensor 22. It is characterized by that.
[0202]
  As shown in FIGS. 40 and 41, the intermediate holding member 23 used for adhering the circuit board 29 is on the extension line of the pixel line 22a of the solid-state image sensor 22, and the adjustment of the solid-state image sensor 22 in the main scanning direction. It is arranged at a position where 320 can be secured.
  Further, the adhesive surface of the circuit board 29 is a solder coat surface 321, and the solder coat surface 321 is located at a position where the intermediate holding member 23 is arranged, and the region is an area for adjusting the solid-state imaging device 22 in the main scanning direction and the sub scanning direction. It is configured to ensure. Reference numeral 22d denotes an adhesion position.
[0203]
  When adjusting the solid-state image sensor 22, it is necessary to hold the solid-state image sensor 22. FIG. 42 is a configuration diagram for gripping the solid-state imaging device.
  When adjusting the positions of the imaging lens 25 attached to the frame 21 and the solid-state imaging device 22 so as to ensure the target optical characteristics, the solid-state imaging device 22 is held and the position of the solid-state imaging device 22 is moved. To make adjustments. At that time, chuck portions 401 and 402 provided in a CCD position adjusting machine (not shown) hold the solid-state imaging device 22.
[0204]
  Since the bonding position of the circuit board 29 is on the extension of the pixel line of the solid-state image pickup device 22 and close to the end of the solid-state image pickup element, the circuit board 29 is deformed by heat or vibration as shown in FIG. Even so, since the amount of variation does not occur with respect to the pixel position of the solid-state imaging device 22, the target optical characteristic value can be guaranteed.
[0205]
  On the other hand, in FIG. 44, since the bonding position of the circuit board 29 is far from the end of the solid-state image sensor, as shown in FIG. 44, when the circuit board 29 is deformed by heat or vibration, the solid-state image sensor Since the amount of variation for the 22 pixel positions occurs, the target optical characteristic value cannot be guaranteed.
[0206]
  FIG. 45 is a front view of another example of the solid-state imaging device. In the figure, reference numeral 22f indicates an area having a mounting height of 1 mm or less.
  The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the scope of the present invention.
[0207]
【The invention's effect】
  According to the first to third aspects of the present invention, the first adhesive surface between the imaging lens holding member and the intermediate holding member is a surface parallel to the pixel line and the optical axis of the solid-state image sensor, and the surface of the solid-state image sensor. Alternatively, by arranging the intermediate holding member so that the second adhesive surface between the back surface and the intermediate holding member is a surface perpendicular to the optical axis, position adjustment in the direction of the axis around the X axis is not performed positively. Thus, only the X, Y, Z, β, and γ five-axis directions can be easily adjusted.
[0208]
  In addition, after the 5-axis adjustment, the adhesive bonded to the bonding surface of the solid-state imaging element and the bonding surface of the intermediate holding member is equivalent to the amount of the intermediate holding member interposed between the solid-state imaging element and the imaging lens holding member. The solid-state image sensor can be bonded to the solid-state image sensor only by managing the film thickness of the adhesive bonded to the adhesive surface of the adhesive and the imaging lens holding member and the adhesive surface of the intermediate holding member to a minimum and constant level. Even if the position accuracy of the holding part is not strictly controlled, the solid-state imaging device can be mounted with high accuracy, the yield can be increased, and the solid after production (after curing of the adhesive) It is possible to prevent a reduction in the fixing force of the image sensor.
[0209]
According to the fourth and fifth aspects of the present invention, the adhesive is made of an ultraviolet curable adhesive, and the intermediate holding member is made of a material that transmits ultraviolet rays. Since the mold adhesive can be irradiated with ultraviolet light, it can be irradiated with UV light from the direction perpendicular to the adhesive surface simultaneously throughout the bonding area, and the time until the adhesive is cured can be further shortened. Productivity can be improved.
[Brief description of the drawings]
FIG. 1 is a diagram for explaining a reference example.
FIGS. 2A and 2B are views showing a first reference example of a member mounting structure of a solid-state imaging device, in which FIG. 2A is a perspective view thereof, and FIG. 2B is a side view thereof.
3A is a diagram showing a connection relationship among a frame, an intermediate holding member, and a solid-state image sensor of a first reference example, and FIG. 3B is a schematic front view of the solid-state image sensor.
4A is a view showing another connection relationship of the frame, the intermediate holding member, and the solid-state imaging device of the first reference example, and FIG. 4B is a view showing another shape of the intermediate holding member.
5A is a diagram showing another connection relationship of the frame, the intermediate holding member, and the solid-state imaging device of the second reference example, and FIG. 5B is a cross-sectional view taken along line OO ′ of FIG. 5A.
6A is a view showing another connection relationship of the frame in which the solid-state image sensor of the second reference example is directly attached to the detachable holding member, the intermediate holding member, and the solid-state image sensor; FIG. It is sectional drawing of PP '.
FIG. 7 is a diagram for explaining an adjustment width when the solid-state imaging device of the third reference example is attached to an intermediate holding member.
FIG. 8 is a diagram showing another connection relationship of the frame, the intermediate holding member, and the solid-state imaging device of the third reference example.
FIG. 9 is a cross-sectional view illustrating a connection relationship between an intermediate holding member and a solid-state imaging device according to a third reference example.
FIGS. 10A and 10B are diagrams showing another connection relationship of the frame, the intermediate holding member, and the solid-state imaging device of the fourth reference example, where FIG. 10A is a top view and FIG. 10B is a side view.
FIG. 11 is a side view of the solid-state image sensor mounting device according to the first embodiment of the present invention.
FIG. 12 is a block diagram of a control unit according to the first embodiment of the present invention.
FIG. 13 is a flowchart showing the operation of the first embodiment according to the present invention.
FIG. 14 is a perspective view showing a fifth reference example of the member mounting structure of the solid-state imaging device.
FIG. 15 is a side view showing a fifth reference example of the mounting structure of the member of the solid-state imaging device.
16 is an enlarged view of a main part of FIG.
FIGS. 17A and 17B are diagrams illustrating a connection relationship between a frame, an intermediate holding member, and a solid-state imaging device according to a sixth reference example, where FIG. 17A is a top view, FIG. 17B is a side view, and FIG. It is a figure which shows the state adhere | attached on.
18A and 18B are diagrams showing the arrangement of intermediate holding members, where FIG. 18A shows a case where they are arranged in parallel, and FIG. 18B shows a case where they are arranged facing each other.
FIG. 19 is a view showing an intermediate holding member used in the second embodiment of the member mounting structure and member mounting apparatus according to the present invention.
FIG. 20 is an exploded perspective view showing an example of a third embodiment of a member mounting structure and a member mounting apparatus according to the present invention.
FIG. 21 is an exploded perspective view showing another example of the seventh reference example of the member mounting structure and the member mounting apparatus.
FIG. 22 is a model diagram of a beam shape when a first bonding surface that bonds the intermediate holding member and the holding member is located outside the space;
23 is a model diagram of a beam shape when the structure of FIG. 20 which is an example of the mounting structure of the solid-state imaging device of the third embodiment or the structure of FIG. 21 which is another example is similarly approximated to a beam shape model. is there.
24 is an enlarged view of a main part of FIG.
25 is an enlarged view of a main part of FIG. 21. FIG.
FIGS. 26A and 26B are views showing a fourth embodiment of the mounting structure of the solid-state imaging device according to the present invention, wherein FIG. 26A is an exploded perspective view of the mounting structure, and FIG. 26B is a perspective view of the mounting structure.
27A is a side view of the mounting structure of the fourth embodiment, FIG. 27B is a diagram showing a connection relationship between the frame, the intermediate holding member, and the solid-state image sensor, and FIG. 27C is an outline of the solid-state image sensor. It is a front view.
28A is a perspective view of another mounting structure, and FIG. 28B is a perspective view of another mounting structure different from FIG.
FIG. 29 is an exploded perspective view showing an example of a solid-state image sensor mounting structure according to a fifth embodiment of the present invention.
FIG. 30 is a perspective view showing an example of a mounting structure for a solid-state imaging device according to a fifth embodiment of the present invention.
FIG. 31 is a perspective view showing another example of the fifth embodiment of the present invention.
FIG. 32 is a cross-sectional view showing a first example of an attachment structure between a circuit board and a spacer in the fifth embodiment.
FIG. 33 is a cross-sectional view showing a second example of the circuit board and spacer mounting structure in the fifth embodiment.
FIG. 34 is a cross-sectional view showing a third example of the circuit board and spacer mounting structure in the fifth embodiment.
FIG. 35 is a perspective view showing an example of a mounting structure for a solid-state imaging device according to a sixth embodiment of the present invention.
36 is an enlarged view showing a main part of FIG. 35. FIG.
37 is a perspective view of an intermediate holding member used in the embodiment shown in FIGS. 35 and 36. FIG.
FIG. 38 is an exploded perspective view showing an example of a mounting structure for a solid-state imaging device according to a seventh embodiment of the present invention.
FIG. 39 is a perspective view of the same.
40 is an enlarged perspective view of the periphery of the solid-state imaging device of FIGS. 38 and 39. FIG.
FIG. 41 is a front view showing an example of a solid-state imaging device attached to a substrate.
FIG. 42 is a configuration diagram for gripping a solid-state imaging device.
FIGS. 43A and 43B are views showing the operation of the solid-state image sensor mounting structure according to the seventh embodiment. FIG. 43A shows a state before deformation and FIG. 43B shows a state after deformation.
44A and 44B are diagrams showing the operation of the reference example of the mounting structure of the solid-state imaging device, in which FIG.
FIG. 45 is a front view showing another example of a solid-state imaging device attached to a substrate.
FIG. 46 is a diagram illustrating an optical positional relationship between a conventional object, an imaging lens, and a solid-state image sensor.
FIG. 47 is a diagram illustrating five-axis coordinates of a conventional solid-state imaging device and an imaging lens.
FIG. 48 is a schematic front view of a conventional solid-state imaging device.
49 (a) and 49 (b) are views showing a conventional workpiece mounting procedure.
50A and 50B are model views of a conventional filling and bonding method, in which FIG. 50A is a top view and FIG. 50B is a cross-sectional view taken along line HH in FIG.
[Explanation of symbols]
21 frame (first member, imaging lens holding member)
22 Solid-state imaging device (second member, arrangement member)
22a to 22c Pixel line (operational member)
23 Intermediate holding member
25 Imaging lens
28 Optical axis
29 Circuit board / CCD circuit board (substrate)
30, 31 UV curable adhesive
50 Detachable support member
60a, 60b Through hole
81 light source
82 Chart (Position adjustment image)
84 Fixing base (adhesion working part)

Claims (5)

An imaging lens holding member to which an imaging lens is fixed and a pixel line made up of photoelectric conversion elements are arranged on a straight line, and a cover glass covering the photoelectric conversion elements on the front surface and a circuit board formed on the back surface A solid-state imaging device provided with a connectable terminal; an intermediate holding member that supports the solid-state imaging device so as to face the imaging lens; and the imaging lens holding member and the intermediate holding member. A solid-state image sensor mounting structure that is fixed by an adhesive and the solid-state image sensor and the intermediate holding member are fixed by an adhesive,
First adhesive surface of the imaging lens holding member and the intermediate holding member, it becomes a pixel line and parallel to the optical axis plane of the solid-state imaging device of the front or rear surface and the intermediate holding member of the solid-state imaging device mounting structure of a solid-state imaging device in which the second adhesive surface is such that a plane orthogonal to the optical axis, wherein the intermediate holding member is disposed.   The solid-state image sensor mounting structure according to claim 1, wherein the second adhesive surface of the solid-state image sensor is a cover glass of the solid-state image sensor. An imaging lens holding member to which the imaging lens is fixed and a pixel line made up of photoelectric conversion elements are arranged on a straight line, and a cover glass covering the photoelectric conversion elements on the front surface and a circuit board formed on the back surface A solid-state image sensor provided with a connectable terminal; an intermediate holding member that supports the solid-state image sensor so as to face the imaging lens; and the imaging lens holding member and the intermediate holding member. A solid-state image sensor mounting structure in which the solid-state image sensor and the intermediate holding member are fixed by an adhesive while being fixed by an adhesive,
A first adhesive surface between the imaging lens holding member and the intermediate holding member is a surface parallel to the pixel line and the optical axis of the solid-state image sensor, and a terminal provided on the back surface of the solid-state image sensor is a circuit board. It is connected to the adhesive surface between the circuit board and the intermediate holding member, so that the plane orthogonal to the optical axis, the mounting structure of the solid-state imaging device, characterized in that the intermediate holding member is disposed .   4. The mounting structure for a solid-state imaging device according to claim 1, wherein the adhesive is made of an ultraviolet curable adhesive. 5.   The solid-state imaging device mounting structure according to any one of claims 1 to 4, wherein the intermediate holding member is made of a material that transmits ultraviolet rays.

Images