JPH07297993A - Mounting method and mounting structure of solid-state image pickup element in image reader - Google Patents

Abstract

PURPOSE:To speed up application, to eliminate unevenness and to improve assembling workability by applying adhesive and fixing it from the wider clearance between an element fixing member and an element holding member after a location adjustment is performed. CONSTITUTION:When adhesive 24 is to be adhered, the nozzle 33 provided on an adhesive application jig is approached from the upper part of the clearance part generated in the hole part 22 of the holding member of a solid-state image pickup element and the projection part 23 of an element fixing member 7 and application is performed. At this time, to quickly and evenly perform the application of adhesive 24 in the circumferential direction of the clearance part, it is preferable that a great number of nozzle tip parts 33a are arranged in the circumferential direction of the clearance part. Next, in order to harden the adhesive, ultraviolet rays are irradiated from the upper part of an application part and the hardening is made to advance from the surf ace on the side where ultraviolet rays are irradiated because the adhesive 24 is an ultraviolet ray hardening type adhesive. When the adhesive 24 is hardened, the force due to contraction is generated, the force is canceled because this force becomes the normal line direction for a center axis and little location deviations in the x and y directions of the member 6 are generated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting method and a mounting structure for a solid-state image sensor in an image reading apparatus for reading an optical image using the solid-state image sensor, a facsimile, a copying machine,
It is used as an image reading unit such as a scanner.

[0002]

2. Description of the Related Art As shown in FIG. 15, an apparatus for reading an optical image using a solid-state image pickup device forms an image of an object 3 on a solid-state image pickup device 1 through an imaging lens 2 and reads the object. In addition, the solid-state image pickup device 1 includes a one-line solid-state image pickup device in which a plurality of minute photoelectric conversion elements (hereinafter, simply referred to as pixels, each having a size of several μm × several μm) are arranged in a line. It is used.

In such an image reading apparatus, the line image formed by the image forming lens 2 is positioned on the solid-state image pickup device 1 and the optical characteristics (focus, magnification) are read with a predetermined required accuracy. The image forming lens 2 and the pixel line 4 of the solid-state image pickup device 1 of one line are shown in FIG.
It is necessary to finely move in the directions of the five axes of z, β and γ to adjust the position. In addition, 26 in the figure is an optical axis. More recently, in order to read a color image, as shown in FIG.
Red (hereinafter, simply referred to as R), Green (hereinafter,
Simply G. ), Blue (hereinafter, simply referred to as B)
In some cases, the solid-state imaging device 1a of 3 lines 4a, 4b, and 4c in which pixels having a peak of spectral sensitivity are arranged in three columns for R, G, and B is used.

In this case, in addition to the adjustment in the 5 axis directions described above, the 3-line solid-state image pickup device 1 is also operated in the α direction shown in FIG.
Since there is a degree of freedom with respect to the position of a, adjustment in the total of 6 axis directions is required. Usually, such a solid-state image sensor 1
The position adjustment accuracy of a is required to be several μm in each of the 6 axis directions, and it is particularly indispensable to achieve this request when the solid-state imaging device 1a is fixed after the position adjustment as described above. In addition, it is a technique for preventing the position of the solid-state image sensor 1a from being displaced.

This is because even if the position is adjusted with a high degree of accuracy, the position may need to be adjusted again if the position shifts when fixed.
This is because, when the separable fixing method is used, the part must be disposed of, and the position adjustment time becomes long and the cost becomes high.

Conventionally, fixing with screws has been widely used for this fixing, but the amount of positional deviation is several hundred μm.
Since it is too large, such as several tens of μm, many attempts have been made to fix it with an adhesive, which is said to cause a smaller amount of positional deviation than fixing with screws. For fixing with this adhesive,
There are roughly two methods, one is a method in which the adhered parts are in contact with each other, and the other is a method in which there is a gap in the adhered parts. The former is called close adhesion and the latter is called filling adhesion.

Various solid-state image pickup device fixing methods to which this close adhesion is applied have been proposed, and one of them is disclosed in Japanese Patent Laid-Open No. 62-139466, where the position of the solid-state image pickup device is adjusted even if the position of the solid-state image pickup device is adjusted. A complicated mechanism is provided on the side of the image reading device so that they always come into contact with each other. In such a method, not only the position adjustment itself of the solid-state image pickup device becomes complicated, but also a position adjustment mechanism which is not necessary for the original function of reading an image in the image reading apparatus must be provided. This requires a large amount of parts that are not necessary for the function, which is one of the reasons for the high cost. In addition, since there are many movable parts in the adjusting mechanism, there are inevitably many adhesion points, and there is also a disadvantage that displacement due to adhesion also increases.

Further, in the case of the method proposed in Japanese Patent Laid-Open No. 268263/1987, the contact portion for adhering and fixing the solid-state image pickup device is not formed by a complicated mechanism, which is costly. Although it is not a cause, the solid-state imaging device is brought into contact with and adhered to a part of the image reading device, and the contact portion between the two may be at a predetermined position, but if they are misaligned, they are brought into contact with each other. Since it is not possible to position the solid-state image pickup device by itself, a washer is placed between the two to perform adjustment and adhesion. However, with such a means, it is difficult to perform position adjustment of a level of several μm quickly and with high precision, and a washer must be prepared for each adjustment, which makes it difficult to cope with mass production. is there.

The problem common to the above two proposals is that the adherends are in contact with each other, but they are not completely in close contact with each other and have a gap of about several hundred μm or less. However, due to the surface tension and the density peculiar to the adhesive, or the relationship between the gaps described above, the adhesive sometimes fills the inside of the fixed member due to the capillary phenomenon. For this reason, depending on the filling state, it may cause displacement of the fixed member during curing of the adhesive, or when using a photo-curable adhesive, the interior of the fixed member is not irradiated with light and is uncured. A part remains, and even if the position is at a predetermined position during adjustment and fixing, there is a problem in that curing later progresses due to a thermal change or the like and a position shift occurs.

On the other hand, various fixing methods of a solid-state image pickup device to which filling adhesion is applied have been proposed, and one of them is proposed in Japanese Patent Laid-Open No. 61-118707. This method is provided with a complicated mechanism that enables the position adjustment of the solid-state image pickup device, and the solid-state image pickup device has a fixed side member and an abutting portion, and the adhesion is performed by adhering the abutting portion. Instead, a portion having a gap that is not in contact is filled with an adhesive to be adhered and fixed. This method has the same drawback as the above-mentioned Japanese Patent Laid-Open No. 62-139466, which contributes to the high cost, and has a contact point between the solid-state image sensor and the fixed-side member in addition to the adhesion point.
In particular, since the screw and the elastic body are contact members here, the screw loosens due to vibration or thermal change, or the elastic body vibrates or plastically deforms to apply an external force to the solid-state image sensor, and the position of the solid-state image sensor is changed. There was a case where it caused a gap.

Usually, in the case of filling and adhering, when it is desired to set the adhesive strength and the positional deviation due to the adhesive to a predetermined value without variation,
It is necessary to uniformly fill the space between the adhered portions with an adhesive to form an arbitrary shape and to reduce the amount of the adhesive as much as possible. In order to fill the adhesive evenly with this method, it is better to use an adhesive with low viscosity, but as shown in FIG. 18, unless the gap E between the mounting plate 38 and the solid-state image sensor 1 is narrowed,
The adhesive flows into the gap E. However, even if the gap E is narrowed, the adhesive may flow into the gap due to a capillary phenomenon, and when a photo-curable adhesive is used,
Light is not radiated to this gap portion and an uncured portion remains, and even if the position is at a predetermined position during adjustment and fixation, curing progresses later due to a thermal change, etc. It may lead to misalignment.

In addition, this method has a problem that the amount of the adhesive required is too large in view of the area where the adhesive contacts the adherend, which increases the displacement of the solid-state image pickup device and the cost of the adhesive. There are also problems.

On the other hand, Nikkei Mechanical (1992.6.29 P
The method of fixing a solid-state image sensor proposed in AGE88) does not have a position adjusting mechanism for the solid-state image sensor, so that it does not lead to high cost as in JP-A-62-139466 and the adherend Since it is composed of a cylindrical hole and a cylindrical pin, a wide adhesive area is secured with a small amount of adhesive, which leads to an improvement in adhesive strength and a reduction in displacement.

[0014]

However, even in this method, there is a problem that the adhesive flows downward unless the clearance between the cylindrical hole and the cylindrical pin is reduced. However, if the gap is too narrow, there is a problem that the adhesive will not easily enter the gap, and when a photo-curing adhesive is used, it will be difficult for light to penetrate to the bottom, and the adhesive will be completely cured. It takes a long time to carry out the process, or an uncured portion remains, which leads to a problem that the solid-state image sensor is displaced like the other methods described above.

It is an object of the present invention to provide a mounting method and a mounting structure for a solid-state image sensor in an image reading apparatus, which can be assembled with high precision and which is less likely to cause positional displacement thereafter.

[0016]

According to the present invention, there is provided a solid-state image sensor fixing member to which an imaging lens is fixed, a substrate to which the solid-state image sensor is attached, and a solid-state image sensor to which the substrate is detachably attached. And a holding member, and further has a coupling portion between the solid-state image sensor fixing member and the solid-state image sensor holding member, and the coupling portion after adjusting the position of the solid-state image sensor holding member with respect to the solid-state image sensor fixing member. In a mounting structure for a solid-state image sensor in an image reading device, the coupling portion is provided with a protrusion / hole provided in a solid-state image sensor fixing member and a hole / hole provided in a solid-state image sensor holding member.
It is characterized in that it is composed of the projections, and the gap formed by the projections and the holes is formed so as to be wide on the adhesive injection side or the tip end side of the projection.

In this case, portions having a constant diameter may be provided at opposite positions of the projection and the hole forming the gap of the joint, and the gap of the joint is formed. An optical reflection film may be provided on the surfaces of the protrusion and the hole, and the protrusion forming the gap between the coupling portions may be formed of a member that allows light to pass through. It is desirable that the protrusion, the hole, and the adhesive forming the gap are made of materials having the same or nearly the same linear expansion coefficient.

Further, according to the present invention, there are provided a solid-state image sensor fixing member to which an imaging lens is fixed, a substrate to which the solid-state image sensor is attached, and a solid-state image sensor holding member to which the substrate is detachably attached. And further includes a coupling portion between the solid-state image sensor fixing member and the solid-state image sensor holding member, and adhering the coupling portion after the position adjustment of the solid-state image sensor holding member to the solid-state image sensor fixing member. In the mounting method of the solid-state image sensor in the image reading device,
A protrusion provided on the solid-state image sensor fixing member with the coupling portion /
The hole and the hole / protrusion provided on the solid-state image sensor holding member are formed, and the gap formed by the protrusion and the hole is formed such that the adhesive injection side or the tip end side of the protrusion is wide. After adjusting the position with a jig, an adhesive is applied to the gap to bond the joint.

In that case, it is preferable to use a photo-curing adhesive as the adhesive and to irradiate light from the wider side of the gap when curing. Further, the bonding of the connecting portion may be performed by melting the protrusion instead of the adhesive. Further, it is desirable that the amount of the adhesive or the amount of melting of the protrusions is set to an amount that does not protrude from the surface of the joint.

[0020]

Since the present invention is constructed as described above, the mounting of the solid-state image sensor is performed by first mounting the substrate on which the solid-state image sensor is mounted on the solid-state image sensor holding member, and then by mounting the solid-state image sensor holding member. Is connected to the solid-state image sensor fixing member to which the imaging lens is fixed by a joint formed by a hole and a protrusion, and the image of the imaging lens is accurately positioned at the solid-state image sensor. The solid-state image sensor holding member is moved as described above, and when the predetermined position is reached, the joint portion is bonded and positioned.

If an optical reflection film is provided on the surface of the projection and the hole that form the gap of the joint, when the photo-curable adhesive is used as the adhesive, the irradiated light is Reflection on these surfaces accelerates the curing of the adhesive. Also,
When the protrusion is formed of a member that can transmit light, the irradiated light is transmitted to the back of the protrusion and circulates, so that the light irradiation effect can be enhanced. Further, when the protrusion forming the gap, the hole and the adhesive are made of materials having the same or nearly the same linear expansion coefficient, the solid-state image sensor holding member and the solid-state image sensor fixing member due to thermal change Positional deviation is unlikely to occur.

Further, since the mounting position of the solid-state image sensor holding member and the solid-state image sensor fixing member is adjusted by a jig, the image reading apparatus itself needs a member for adjusting the mounting position of the solid-state image sensor. do not do.

Further, when the light is applied, the light is applied from the side having the wider width of the gap, so that the light reaches all the corners of the gap and it is possible to eliminate the uncured portion of the adhesive. . If the protrusions are melted and adhered without using an adhesive, the cost required for the adhesive can be reduced. Further, at that time, since the amount of the adhesive or the amount of melting of the protruding portion is the amount that does not protrude from the surface of the bonding portion, even if the bonding portion is provided so as to penetrate the substrate, Since no adhesive or the like is attached, there is no problem in removing the substrate from the solid-state image sensor holding member.

[0024]

Embodiments of the present invention will be described below with reference to the drawings. 1 is an exploded perspective view showing an embodiment of the image reading apparatus according to the present invention, FIG. 2 is a perspective view of the assembled state thereof, and FIG. 3 is a view of the image reading apparatus A shown in FIG. It is the figure which showed the cross section by the -A line. As shown in the figure, a solid-state image sensor (hereinafter referred to as CCD) 1 is a solid-state image sensor substrate 5.
The solid-state image pickup element substrate 5 is fixed to the solid-state image pickup element holding member 6 with screws 19. At that time, the spring washer 18 and the flat washer 17 are fitted to the screw 19.

The solid-state image pickup device holding member 6 has a rigidity higher than that of the solid-state image pickup device substrate 5, and is distorted when the solid-state image pickup device holding member 6 is chucked by an image forming jig at the time of positioning adjustment described later. It's getting harder.

The solid-state image pickup element holding member 6 is fixed to the solid-state image pickup element fixing member 7 with an adhesive. Specifically, the projection of the solid-state image pickup element fixing member 7 is inserted into the hole 22 of the solid-state image pickup element holding member 6. 23 is inserted, and an adhesive 24 is applied and fixed thereto as shown in FIG. In addition, although there are three bonding points here, the number of bonding points is not limited as long as it is one or more.

Further, the solid-state image pickup element fixing member 7 is V
It has a block part 25, and the imaging lens 2 is provided in this part.
, The lens pressing leaf spring 9 is arranged from above, and the screw 8 is tightened to fix the imaging lens 2. An optical filter holding member 13 is fixed to the solid-state image sensor fixing member 7 with a screw 20, and the optical filter holding member 13 adjusts the spectral transmittances of R, G, and B to predetermined values. The optical filter 12 is fixed with screws 21 using the optical filter holding plate 11. The solid-state image sensor fixing member 7 is fixed to the main body mounting member 10 with a screw 16 via a plain washer 14 and a spring washer 15. Further, the main body mounting member 10 is fixed to the main body of the image reading apparatus (not shown).

Next, the image reading apparatus of this embodiment is replaced with the CCD 1
The procedure of adjusting the position of the imaging lens 2 and the procedure of fixing the same will be described. First, the imaging lens 2 is attached to the solid-state image sensor fixing member 7
It is fixed with a screw 8 via a lens pressing leaf spring 9. Further, in this state, it is fixed to the main body mounting member 10 with the screw 16 via the flat washer 14 and the spring washer 15. Next, in this assembled state, it is mounted on the image forming jig shown in FIG. In this image forming jig, an image reading device supporting member 27 and a light source chart supporting member 31 are arranged on a surface plate 32,
The chart glass 3 is placed on the light source chart support member 31.
0, a light source 29, and a light source reflection plate 28 are installed.

On the surface of the chart glass 30, there is formed a chart capable of detecting optical characteristics, such as focus, magnification and deflection of the optical axis.
It is possible with this image forming jig to illuminate the chart glass 30 with the light reflected by the light source reflection plate 28. Therefore, by mounting the assembly member on the image reading device supporting member 27, the chart image is imaged through the imaging lens 2.

The solid-state image pickup device substrate 5 to which the CCD 1 is soldered and fixed is fixed to a solid-state image pickup device holding member 6 by a screw, and the solid-state image pickup device holding member 6 is a solid-state image pickup device chuck (not shown). Is gripped by the part. Furthermore, x, y,
Means (not shown) capable of moving in the six axial directions of z, α, β, and γ are incorporated. Since the solid-state image sensor holding member 6 is formed of a member having a higher rigidity than the solid-state image sensor substrate 5, distortion does not easily occur even if the solid-state image sensor substrate is gripped by the chuck portion of the solid-state image sensor, and the solid-state image sensor substrate 5 is directly gripped. The influence on the solid-state image pickup device substrate 5 is extremely small as compared with the case. The solid-state image sensor fixing member 7 fixing the imaging lens 2 is held by a solid-state image sensor fixing member chuck portion (not shown) having a moving means in the direction of the optical axis 26. Therefore, the chart image is photoelectrically converted by the CCD 1, and the data is used to calculate the optical characteristics such as focus, magnification, deflection of the optical axis, and the like, so that the optical characteristics have predetermined required values. Position adjustment is performed by moving the above-mentioned solid-state image sensor chuck section and the solid-state image sensor fixing member chuck section.

After this position adjustment is completed, fixing is performed. On the surface plate 32, the adhesive applicator 34 and the nozzle 3 are provided.
3. An adhesive application jig including a UV light irradiation unit 35, an applicator irradiation unit switching unit 37, and an adhesive application unit support base 36 is provided, and the solid-state imaging device is provided by the adhesive application jig. A UV-curable adhesive is applied to the joint formed by the hole 22 and the protrusion 23 of the holding member 6 and the solid-state image sensor fixing member 7, and then the applicator irradiation unit switching unit 37 is operated, and the UV light irradiation unit is activated. The UV light irradiation section 35 is moved so that the light emitted from 35 is incident on the coupling section, and the adhesive is cured. The adhesive may be applied before adjusting the position, and then the position may be adjusted and the adhesive may be cured.

Next, the structure of this connecting portion which is also an adhesive portion will be described. FIG. 5 is an enlarged view of the joint portion, and FIG. 6 is a sectional view of the joint portion. Solid-state image sensor holding member 6
A hole portion 22 which is a portion to be adhered is formed in this, and the projection portion 23 formed in the solid-state image sensor fixing member 7 is inserted into the hole portion 22. The shape of the gap between the adhered portions formed by the both is tubular with a non-uniform width, the width on the side where the adhesive 24 is injected and applied is wide, and the width on the side where the adhesive 24 flows down is narrow. Has become. That is, as shown in FIG. 6, it is formed of a hole 22 having a tapered portion 22a and a straight portion 22b, and a rod-shaped protrusion 23 having a tapered portion 23a and a straight portion 23b, and is fixed at a position facing each other. Portion 22 having a diameter of
b and 23b are provided.

Here, the solid-state image pickup device holding member 6 has the hole 22 and the solid-state image pickup device fixing member 7 has the projection 23 to form a gap for adhesion. On the contrary, the solid-state image pickup is performed. The element holding member 6 may be provided with a projection and the solid-state image sensor fixing member 7 may be provided with a hole to form the above-mentioned gap.

In addition to the structure described above, the structure of the connecting portion is, as shown in FIG. 7, a hole portion 22 having a straight portion.
And a rod-shaped projection 23 having a taper portion 23a and a straight portion 23b, and as shown in FIG. 8, a hole 22 having a taper portion 22a and a straight portion 22b, and a rod-shaped projection having a straight portion. You may form with the part 23. Further, as shown in FIG. 9, it may be formed by a hole portion 22 having a taper portion and a rod-shaped projection portion 23 having a taper portion, and as shown in FIG. 10, it has a taper portion 22a and a straight portion 22b. A rod-shaped protrusion 23 having a hole 22, a taper portion 23a, a straight portion 23b ₁ and a straight portion 23b _{2 having} a different diameter (a straight portion having a smaller diameter is formed in a lower portion which does not come into contact with an adhesive). You can also use it.

Next, the behavior of the adhesive 24 when the adhesive 24 is applied to the above-mentioned gap will be described. As shown in FIG. 11, the applied adhesive 24 has a frictional drag force D with respect to the surface tension T peculiar to the adhesive agent and a weight P of the adhesive agent, a drag force with respect to the pressure inside the adhesive agent (not shown),
The adhesive 24 does not flow downward due to a mechanical balance due to the widths A and A ′ at the lowermost part of the gap and the density of the adhesive 24. In addition, by changing the inclination of the tapered portion of the gap,
By making the B'section wider, the force of the adhesive 24 flowing downward is further reduced. This is because the frictional drag force D due to the weight of the adhesive agent 24 increases, and the surface tension T generated in the wider gap portion increases. This allows
The range of restrictions on the adhesive 24 such as viscosity and weight is widened.

Next, a method of applying the adhesive 24 will be described. As shown in FIG. 12, the nozzle 33 mounted on the adhesive application jig from above the gap formed by the hole 22 of the solid-state image sensor holding member 6 and the protrusion 23 of the solid-state image sensor fixing member 7. Apply close to each other. At this time, in order to apply the adhesive evenly as quickly as possible in the circumferential direction of the gap, it is ideal to arrange many nozzle tip portions 33a in the circumferential direction of the gap. FIG. 13 shows a sectional view of the nozzle tip portion 33a. Further, since B and B ′ in FIG. 11 can be widened in accordance with the diameter of the nozzle tip portion 33a, it is very easy to apply, and it is advantageous that there are few coating mistakes even when performing automatic application.

Next, a method of curing the adhesive will be described.
Since the adhesive 24 used here is an ultraviolet curable adhesive, ultraviolet rays 39 are irradiated from above the adhesive application part by the UV light irradiation part 35 shown in FIG. 4 to cure the adhesive 24. The curing of the adhesive 24 proceeds from the surface on the side where the ultraviolet ray 39 is irradiated. In this case, since irradiation is performed from the central axis direction of the adhesive-applying tubular gap, the curing of the adhesive 24 proceeds in this direction. When the adhesive 24 hardens, a force is generated by contracting, and in this case, this force acts in the direction normal to the central axis of the tubular gap portion and yet in the circumferential direction of the tubular gap portion. Since the force acts almost uniformly, this force is canceled out, and the displacement of the solid-state image sensor holding member 6 in the x and y directions hardly occurs.
In FIG. 14, the irradiation is performed from the upper side in the central axis direction of the tubular gap portion, but even if the irradiation is performed from the lower side, the same effect is obtained with respect to the above-mentioned positional deviation.

Further, since there is a taper portion in the adhesive-applying tubular gap portion, when the adhesive is hardened, a force also acts in the z-direction to move the solid-state image sensor holding member 6 in the z-direction. However, at that time, if the tubular gap portion has a structure having a straight portion as shown in FIGS. 6, 7, 8, and 9, by irradiating ultraviolet rays from below and curing from the straight portion, The solid-state image sensor holding member 6 can be fixed in a state in which the force generated by the contraction of the adhesive in the z, x, and y directions hardly acts, and if irradiation is performed again from above and main curing is performed, there is almost no displacement in position. Curing can be completed. Further, when irradiation is performed from above, the wider B and B ′ shown in FIG. 11, the easier the ultraviolet rays reach the bottom of the gap, and the shorter the time required for the applied adhesive 24 to be completely cured. Further, the curing speed of the adhesive can be shortened by using a transparent material for the protrusions 23 forming the gap and forming a reflective film (for example, Al, Ni, etc.) on the surface forming the gap. It is possible to do so.

Next, the materials of the adhesive 24 and the adhered member used here will be described. Normally, in such filling bonding, the adhesive and the adherend member are completely in close contact, so if thermal expansion due to heat change occurs, peeling of the joint,
Since problems such as cracking of the member occur, it is possible to improve reliability against heat by making the linear expansion coefficient of the adhesive and that of the member to be adhered similar to each other.

In the above embodiment, the solid-state image sensor holding member 6 and the solid-state image sensor fixing member 7 are bonded to each other by bonding.
Although it was performed by applying an adhesive,
May be melted and adhered to the hole 22.

[0041]

The effects of the present invention will be described below for each claim. According to the first aspect, after the position of the solid-state image sensor is adjusted with respect to the imaging lens, the adhesive is applied from the larger gap between the solid-state image sensor fixing member and the solid-state image sensor holding member. Since it is fixed, the adhesive can be applied at high speed and evenly, and the assembling workability can be improved.

According to the second aspect, it is possible to reduce the amount of positional deviation at the time of fixing by first curing the adhesive having a constant diameter.

According to the third aspect, the irradiated light is reflected on these surfaces, and the curing of the adhesive can be accelerated.

According to the fourth aspect, since the radiated light is transmitted to the back side of the protrusion and circulates, the light radiating effect can be enhanced.

According to the fifth aspect, it is difficult for the solid-state image sensor holding member and the solid-state image sensor fixing member to be displaced due to heat change.

According to the sixth aspect of the invention, the position adjustment between the solid-state image sensor holding member and the solid-state image sensor fixing member is performed by a jig, and the joint portion is fixed after the adjustment. Therefore, the CCD is attached to the image reading apparatus itself. Since it is not necessary to provide a member for adjusting the mounting position of the, the cost can be reduced and the adjustment work can be facilitated. Moreover, the same effect as that of the first aspect is obtained.

According to the seventh aspect, the light reaches every corner of the gap and the uncured portion of the adhesive can be eliminated.

According to claim 8, the cost required for the adhesive can be reduced.

According to the ninth aspect, since the adhesive does not adhere to the substrate even when the connecting portion is provided so as to penetrate the substrate, the substrate is removed from the solid-state image sensor holding member. It does not interfere with the removal. Therefore, even if adhesion failure occurs, it is not necessary to dispose of the expensive solid-state imaging device, so that the cost can be reduced.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an embodiment of the present invention.

FIG. 2 is a perspective view of an embodiment of the present invention.

3 is a cross-sectional view taken along the line AA of FIG.

FIG. 4 is an explanatory diagram of position adjustment by an image forming jig.

FIG. 5 is a perspective view of a coupling portion.

FIG. 6 is a cross-sectional view of a joint portion.

FIG. 7 is a cross-sectional view of another configuration of the coupling portion.

FIG. 8 is a cross-sectional view of another configuration of the coupling portion, similarly.

FIG. 9 is a cross-sectional view of another configuration of the coupling portion, similarly.

FIG. 10 is a cross-sectional view of another configuration of the coupling portion, similarly.

FIG. 11 is a diagram for explaining the behavior of the adhesive when the adhesive is applied to the gap portion of the joint portion.

FIG. 12 is a diagram showing a state in which an adhesive is applied.

FIG. 13 is a cross-sectional view of a nozzle tip portion.

FIG. 14 is a diagram of irradiating ultraviolet rays to cure the adhesive.

FIG. 15 is a schematic diagram of an apparatus for reading an image using a solid-state image sensor.

16 is an explanatory diagram showing a position adjustment direction of the solid-state image sensor in FIG.

FIG. 17 is a diagram showing a relationship between a solid-state image sensor and pixel lines.

FIG. 18 is a diagram illustrating a problem caused by a gap.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 CCD (solid-state image sensor) 2 Imaging lens 5 Solid-state image sensor substrate 6 Solid-state image sensor holding member 7 Solid-state image sensor fixing member 10 Body mounting member 22 Hole 23 Protrusion 24 Adhesive 33 Nozzle 34 Adhesive applicator 35 UV light irradiation unit

Claims (9)

[Claims] 1. A solid-state image sensor fixing member to which an imaging lens is fixed, a substrate to which the solid-state image sensor is attached, and a solid-state image sensor holding member to which the substrate is detachably attached, and An image reading device having a coupling portion between a solid-state image sensor fixing member and a solid-state image sensor holding member, and adhering the coupling portion to the solid-state image sensor fixing member after adjusting the position of the solid-state image sensor holding member. In the mounting structure for a solid-state image sensor according to the above, the coupling portion is provided with a protrusion / a solid-state image sensor fixing member.
It is composed of a hole and a hole / projection provided in the solid-state image sensor holding member, and the gap formed by the projection and the hole is formed so that the adhesive injection side or the tip end side of the projection is wide. A mounting structure for a solid-state image pickup device in an image reading device. 2. The solid in the image reading apparatus according to claim 1, wherein portions having a constant diameter are provided at positions where the protrusion and the hole forming the gap of the joint portion face each other. Image sensor mounting structure. 3. The mounting of a solid-state image pickup device in an image reading apparatus according to claim 1, wherein an optical reflection film is provided on the surfaces of the projection and the hole which form the gap of the coupling portion. Construction. 4. The mounting structure for a solid-state image sensor in an image reading apparatus according to claim 1, wherein the protrusion forming the gap between the coupling portions is formed of a member that allows light to pass therethrough. 5. The image reading apparatus according to claim 1, wherein the protrusion, the hole, and the adhesive forming the gap of the joint are made of a material having the same or nearly the same linear expansion coefficient. Mounting structure of solid-state image sensor in. 6. A solid-state image sensor fixing member to which an imaging lens is fixed, a substrate to which the solid-state image sensor is attached, and a solid-state image sensor holding member to which the substrate is detachably attached, An image reading device having a coupling portion between a solid-state image sensor fixing member and a solid-state image sensor holding member, and adhering the coupling portion to the solid-state image sensor fixing member after adjusting the position of the solid-state image sensor holding member. In the method for mounting a solid-state image sensor according to the above item, the connecting portion is provided with a protrusion / a solid-state image sensor fixing member.
The hole and the hole / protrusion provided on the solid-state image sensor holding member are formed, and the gap formed by the protrusion and the hole is formed such that the adhesive injection side or the tip end side of the protrusion is wide. A method for mounting a solid-state image sensor in an image reading apparatus, comprising: adjusting the position with a jig and then applying an adhesive to the gap to bond the joint. 7. The image reading apparatus according to claim 6, wherein a photo-curing adhesive is used as the adhesive, and light is applied from the wide side of the gap when the adhesive is cured. Method of mounting solid-state image sensor in. 8. The method for mounting a solid-state image sensor in an image reading apparatus according to claim 6, wherein the bonding portion is bonded by melting the protrusion instead of the adhesive. 9. The amount of the adhesive or the melting amount of the protrusion is
9. The mounting method for a solid-state image sensor in an image reading apparatus according to claim 6, wherein the amount is set so as not to protrude from the surface of the coupling portion.