JP3294710B2 - Mounting method and mounting structure of solid-state imaging device in image reading device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and a structure for mounting a solid-state imaging device in an image reading apparatus for reading an optical image using the solid-state imaging device.
It is used as an image reading unit such as a scanner.

[0002]

2. Description of the Related Art In an apparatus for reading an optical image using a solid-state image pickup device, as shown in FIG. 15, an object 3 is imaged on a solid-state image pickup device 1 via an image forming lens 2 for reading. The solid-state imaging device 1 includes a one-line solid-state imaging device in which a plurality of minute photoelectric conversion elements (hereinafter, simply referred to as pixels, usually having a size of several μm × several μm) are arranged in a line. Used.

In such an image reading apparatus, the line image formed by the image forming lens 2 is positioned on the solid-state image pickup device 1 and the optical characteristics (focus and magnification) are read with a predetermined required accuracy. The image forming lens 2 and the one pixel line 4 of the solid-state imaging device 1 are connected to x, y,
It is necessary to finely adjust the position in five axes of z, β and γ to adjust the position. In addition, 26 in the figure is an optical axis. More recently, to read a color image, as shown in FIG.
Red (hereinafter simply referred to as R), Green (hereinafter referred to as R).
It is simply G. ), Blue (hereinafter simply referred to as B)
In some cases, a solid-state imaging device 1a having three lines 4a, 4b, and 4c in which pixels having a spectral sensitivity peak are arranged in three rows for R, G, and B, respectively, may be used.

In this case, in addition to the above-described adjustment in the five-axis direction, the three-line solid-state imaging device 1 is also arranged in the α direction shown in FIG.
Since the degree of freedom with respect to the position a is generated, adjustment in a total of six axial directions is required. Usually, such a solid-state imaging device 1
The position adjustment accuracy of a is required to be several μm in each of the six axial directions. Particularly, in order to achieve this requirement, it is indispensable to fix the solid-state imaging device 1a after adjusting the position as described above. In addition, this is a technique for preventing the position of the solid-state imaging device 1a from shifting.

[0005] This is because even if the position is adjusted with high accuracy, if the position shifts during fixing, the position needs to be adjusted again.
This is because if a separable fixing method is used, that part must be discarded, resulting in a longer position adjustment time and a higher cost.

[0006] For this fixing, fixing with a screw has been often used in the past, but the amount of displacement is several hundred μm.
Attempts at fixing with an adhesive, which is considered to have a small amount of displacement compared to fixing with a screw due to being too large, being several tens of μm, have been attempted at present. For fixing with this adhesive,
There are roughly two methods. One is a method in a case where parts to be bonded are in contact with each other, and the other is a method in which there is a gap in the parts to be bonded. The former is referred to as close adhesion, and the latter is referred to as filling adhesion.

Various methods for fixing a solid-state image sensor using this close adhesion have been proposed. One of the methods is disclosed in Japanese Patent Application Laid-Open No. 62-139466. A complicated mechanism is provided on the side of the image reading device so that the members always contact each other. In such a method, the position adjustment of the solid-state imaging device itself becomes complicated, and a position adjustment mechanism that is not necessary for the original function of reading an image in the image reading device must be provided. The cost of parts not required for the function is high, which contributes to the high cost. In addition, there are many movable parts in the adjustment mechanism, so that there are inevitably many adhesion points, and there is a disadvantage that positional displacement due to adhesion also increases.

Further, in the case of the method proposed in Japanese Patent Application Laid-Open No. 62-268263, the contact portion for bonding and fixing the solid-state image pickup device is not formed with a complicated mechanism, so that the cost is high. Although it is not a cause, the solid-state imaging device is abutted and adhered to a part of the image reading apparatus, and it is sufficient that the abutting portions of both are at predetermined positions, but if the positions are misaligned, they abut. Since the solid-state imaging device cannot be positioned only by itself, a washer is arranged between the two to perform adjustment and adhesion. However, with such a means, it is difficult to quickly and accurately adjust the position at a level of several μm, and a washer must be prepared for each adjustment, which makes it difficult to cope with mass production. is there.

A problem common to the above two proposals is that, although the parts to be bonded are in contact with each other, they are not completely adhered but have a gap of about several hundred μm or less. Due to the inherent surface tension and density of the adhesive or the relationship of the gap described above, the adhesive sometimes fills the inside of the fixed member due to the capillary phenomenon. For this reason, depending on the filling state, it may cause a displacement of the fixed member when the adhesive is cured, or when a light-curing adhesive is used, the light is not irradiated to the inside of the fixed member and the uncured member is not cured. A portion remains, and even if the position is at a predetermined position at the time of adjustment and fixing, there occurs a problem that curing proceeds later due to a thermal change or the like and a positional shift occurs.

On the other hand, various methods of fixing a solid-state image sensor using filling and bonding have been proposed, one of which is proposed in Japanese Patent Application Laid-Open No. 61-118707. This method is provided with a complicated mechanism that allows the position of the solid-state imaging device to be adjusted, and the solid-state imaging device has a contact portion with the fixed-side member. Instead, a portion having a gap that is not in contact is filled with an adhesive and bonded and fixed. This method has the same disadvantages as in the above-mentioned Japanese Patent Application Laid-Open No. 62-139466, which contributes to a high cost, and has a contact point between the solid-state imaging device and the fixed side member in addition to the adhesion point.
In particular, since the screw and the elastic body are abutting members, the screw may be loosened due to vibration or thermal change, or the elastic body may apply an external force to the solid-state image sensor due to vibration or plastic deformation, and the position of the solid-state image sensor may be reduced In some cases, this could cause a shift.

Normally, in the case of filling and bonding, when it is desired to set the positional deviation due to bonding strength and bonding to a predetermined value without variation,
It is necessary to fill the adhesive evenly between the parts to be bonded to form an arbitrary shape and to reduce the amount of the adhesive as much as possible. In order to uniformly fill the adhesive with this method, it is better to use a low-viscosity adhesive. However, as shown in FIG. 18, unless the gap E between the mounting plate 38 and the solid-state imaging device 1 is narrowed,
The adhesive flows out into the gap E. However, even when the gap E is narrowed, the adhesive may flow into the gap due to the capillary phenomenon, and when using a photo-curing adhesive,
The uncured portion remains without being irradiated with light to the gap portion. Even if the position is at a predetermined position during adjustment and fixing, curing proceeds later due to thermal change or the like, and as a result, the solid-state imaging device This can lead to misalignment.

In addition, in this method, there is also a problem that the required amount of the adhesive is too large in view of the area where the adhesive comes into contact with the adherend, which increases the displacement of the solid-state imaging device and the cost for the adhesive. Failures have also occurred.

On the other hand, Nikkei Mechanical (1992.6.29 P
age88), the method for fixing the solid-state imaging device does not have a position adjustment mechanism for the solid-state imaging device, so that it does not lead to high costs as in Japanese Patent Application Laid-Open No. 62-139466. Is constituted by a cylindrical hole and a cylindrical pin, a large bonding area is secured with a small amount of adhesive, which leads to an improvement in bonding strength and a reduction in displacement.

[0014]

However, also in this method, there is a problem that the adhesive flows down unless the gap between the cylindrical hole and the cylindrical pin is reduced. However, if the gap is made too narrow, the adhesive will not easily enter the gap, and if a photo-curing adhesive is used, it will be difficult for light to penetrate to the bottom, and the adhesive will be completely cured. It takes a long time to perform the operation, or an uncured portion remains, which leads to a problem that the position of the solid-state imaging device is displaced similarly to the other methods described above.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a mounting method and a mounting structure of a solid-state imaging device in an image reading apparatus which can assemble the solid-state imaging device with high accuracy and is less likely to cause positional displacement thereafter.

[0016]

SUMMARY OF THE INVENTION The present invention provides a solid-state imaging device fixing member to which an imaging lens is fixed, a substrate to which the solid-state imaging device is mounted, and a solid-state imaging device to which the substrate is detachably mounted. Holding member, and further comprising a coupling portion between the solid-state imaging device fixing member and the solid-state imaging device holding member, wherein the coupling portion after adjusting the position of the solid-state imaging device holding member with respect to the solid-state imaging device fixing member. In the attachment structure of the solid-state imaging device in the image reading device in which the solid-state imaging device is adhered, the coupling portion is provided at one of the solid-state imaging device fixing member and the solid-state imaging device holding member and at the other. Setting
In addition to the projections, the gap formed by the projections and the holes is formed so as to be wider on the adhesive injection side or on the tip side of the projections.

In this case, a portion having a constant diameter may be provided at a position opposite to the projection and the hole forming the gap of the joint, and the gap of the joint is formed. An optical reflection film may be provided on the surface of the projection and the hole, and the projection forming the gap between the coupling portions may be formed of a member through which light can be transmitted. It is desirable that the protrusion forming the gap, the hole, and the adhesive be made of a material having the same or nearly the same coefficient of linear expansion.

Further, the present invention provides a solid-state imaging device fixing member to which an imaging lens is fixed, a substrate to which the solid-state imaging device is mounted, and a solid-state imaging device holding member to which the substrate is detachably mounted. And further comprising a coupling portion between the solid-state imaging device fixing member and the solid-state imaging device holding member, and bonding the coupling portion after the position adjustment of the solid-state imaging device holding member to the solid-state imaging device fixing member. In the method of mounting the solid-state imaging device in the image reading device,
The coupling portion is configured with a hole provided on one of the solid-state imaging device fixing member and the solid-state imaging device holding member and a projection provided on the other, and a gap formed by the projection and the hole, The adhesive injection side or the tip end side of the protrusion is formed so as to be wide, and after adjusting the position with a jig, an adhesive is applied to the gap to bond the joint.

In this case, it is preferable to use a light-curing adhesive as the adhesive and to irradiate light from the larger gap when curing. Further, instead of bonding the bonding portion with an adhesive , the bonding portion may be welded by melting the protrusion. In addition, it is desirable that the amount of the adhesive or the amount of melting of the protrusion is an amount that does not protrude from the surface of the joint.

[0020]

Since the present invention is constructed as described above, the solid-state imaging device is mounted by first mounting the substrate on which the solid-state imaging device is mounted to the solid-state imaging device holding member, and then mounting the solid-state imaging device holding member. Is fixed to the solid-state imaging device fixing member to which the imaging lens is fixed by a coupling portion formed by a hole and a projection, and the image of the imaging lens is accurately positioned at the solid-state imaging device. The solid-state image sensor holding member is moved so as to perform the positioning, and when the member reaches a predetermined position, the bonding portion is bonded and positioned.

When an optically reflective film is provided on the surface of the projection and the hole forming the gap of the joint, when the photo-curing adhesive is used, the irradiated light is The light is reflected on these surfaces, and the curing of the adhesive is accelerated. Also,
In the case where the protrusion is formed of a member that can transmit light, the irradiated light is transmitted to the back of the protrusion and turns around, so that the light irradiation effect can be enhanced. Further, when the protrusion forming the gap, the hole, and the adhesive are made of a material having the same or nearly the same linear expansion coefficient, the solid-state image sensor holding member and the solid-state image sensor fixing member due to a thermal change can be used. It is unlikely that displacement will occur.

Further, since the adjustment of the mounting position of the solid-state imaging device holding member and the solid-state imaging device fixing member is performed by a jig, the image reading apparatus itself needs a member for adjusting the mounting position of the solid-state imaging device. do not do.

Further, when irradiating the light, the light is applied from the widest one of the gaps, so that the light reaches all corners of the gaps and the uncured portion of the adhesive can be eliminated. . When so as to dissolve wearing melting of protrusions without using an adhesive will be able to reduce the cost of the adhesive. Also, at this time, the amount of the adhesive or the melting amount of the protrusion is an amount that does not protrude from the surface of the bonding portion, so that even when the bonding portion is provided through the substrate, Since the adhesive or the like does not adhere, there is no problem in removing the substrate from the solid-state imaging device holding member.

[0024]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view of an embodiment of the image reading apparatus according to the present invention, FIG. 2 is a perspective view of the assembled state, and FIG. 3 is a perspective view of the image reading apparatus shown in FIG. It is the figure which showed the cross section by the -A line. As shown in the figure, a solid-state imaging device (hereinafter, referred to as a CCD) 1 includes a solid-state imaging device substrate 5.
The solid-state image sensor substrate 5 is fixed to the solid-state image sensor holding member 6 with screws 19. At this time, a spring washer 18 and a flat washer 17 are fitted to the screw 19.

As the solid-state image sensor holding member 6, a member having higher rigidity than the solid-state image sensor substrate 5 is used, and when positioning adjustment described later, distortion occurs when the image forming jig chucks the solid-state image sensor holding member 6. It is becoming difficult.

The solid-state image sensor holding member 6 is fixed to the solid-state image sensor fixing member 7 with an adhesive. As shown in FIG. 3, an adhesive 24 is applied and fixed therein. In addition, although there are three bonding portions here, the number is not limited as long as it is one or more.

Further, the solid-state image pickup device fixing member 7 is
It has a block 25, and the imaging lens 2
, And a leaf spring 9 for lens pressing is arranged from above, and the imaging lens 2 is fixed by tightening the screw 8. An optical filter holding member 13 is fixed to the solid-state imaging device fixing member 7 with a screw 20. The optical filter holding member 13 adjusts the spectral transmittance of R, G, and B to a predetermined value. The optical filter 12 is fixed by screws 21 using the optical filter holding plate 11. The solid-state image sensor fixing member 7 is fixed to the main body mounting member 10 by screws 16 via flat washers 14 and spring washers 15. Further, the main body mounting member 10 is fixed to an image reading apparatus main body (not shown).

Next, the image reading apparatus of this embodiment is
And a procedure for adjusting the position of the imaging lens 2 and a procedure for fixing the same. First, the imaging lens 2 is fixed to the solid-state image sensor fixing member 7.
Is fixed with screws 8 via a lens holding leaf spring 9. Further, in this state, it is fixed to the body mounting member 10 with the screw 16 via the flat washer 14 and the spring washer 15. Next, in this assembled state, it is mounted on the image forming jig shown in FIG. In this image forming jig, an image reading device support member 27 and a light source chart support member 31 are arranged on a surface plate 32.
The chart glass 3 is placed on the light source chart support member 31.
0, a light source 29 and a light source reflector 28 are provided.

On the surface of the chart glass 30, a chart capable of detecting optical characteristics, specifically, focus, magnification, deviation of the optical axis, and the like is formed.
Is turned on, and the light reflected by the light source reflecting plate 28 can be applied to the chart glass 30 with the present image forming jig. Therefore, the chart image is formed via the imaging lens 2 by mounting the assembly member on the image reading device support member 27.

The solid-state image pickup device substrate 5 to which the CCD 1 is soldered and fixed is fixed to a solid-state image pickup device holding member 6 by screws, and the solid-state image pickup device holding member 6 is connected to a solid-state image pickup device chuck (not shown). Part is gripped. Furthermore, x, y, and
A means (not shown) capable of moving in six axes of z, α, β, and γ is incorporated. Since the solid-state imaging device holding member 6 is formed of a member having higher rigidity than the solid-state imaging device substrate 5, even if it is gripped by the solid-state imaging device chuck portion, distortion does not easily occur, and the solid-state imaging device substrate 5 is directly gripped. The influence on the solid-state imaging device substrate 5 is extremely small as compared with the case where the above-mentioned operation is performed. The solid-state imaging device fixing member 7 fixing the imaging lens 2 is held by a solid-state imaging device fixing member chuck (not shown) having a moving unit in the direction of the optical axis 26. Therefore, the chart image is photoelectrically converted by the CCD 1 and the data is used to calculate the optical characteristics such as focus, magnification, tilt of the optical axis, etc. The position adjustment is performed by moving the above-described solid-state image pickup device chuck and the solid-state image pickup device fixing member chuck.

After the completion of the position adjustment, the fixing is carried out.
3. An adhesive application jig including a UV light irradiation unit 35, an applicator irradiation unit switching unit 37, and an adhesive application unit support base 36 is provided. An ultraviolet curing adhesive is applied to the joint formed by the holding member 6 and the hole 22 and the projection 23 of the solid-state imaging device fixing member 7, and then the applicator irradiation unit switching unit 37 is operated to activate the UV light irradiation unit. The UV light irradiating unit 35 is moved so that the light irradiated from the unit 35 is incident on the coupling unit, and the adhesive is cured. The adhesive may be applied before the position is adjusted, and then the position may be adjusted and the adhesive may be cured.

Next, the structure of the connecting portion, which is also the bonding portion, will be described. FIG. 5 is an enlarged view of the joint, and FIG. 6 is a cross-sectional view of the joint. Solid-state image sensor holding member 6
Is formed with a hole 22 as a portion to be bonded, and a projection 23 formed on the solid-state imaging device fixing member 7 is inserted into the hole 22. The shape of the gap between the bonded portions formed by the two is a tubular shape having an uneven width, the width on the side where the adhesive 24 is injected and applied is wide, and the width on the side where the adhesive 24 flows down is narrow. Has become. That is, as shown in FIG. 6, a hole 22 having a tapered portion 22a and a straight portion 22b, and a rod-shaped projection 23 having a tapered portion 23a and a straight portion 23b are formed at predetermined positions opposite to each other. Part 22 having a diameter of
b and 23b are provided.

In this case, the solid-state image sensor holding member 6 has a hole 22 and the solid-state image sensor fixing member 7 has a projection 23 to form a gap for bonding. A projection may be formed on the element holding member 6 and a hole may be formed on the solid-state imaging device fixing member 7 to form the above-described gap.

The structure of the connecting portion is, in addition to the above, a hole 22 having a straight portion as shown in FIG.
And a bar-shaped projection 23 having a tapered portion 23a and a straight portion 23b. As shown in FIG. 8, a rod-shaped projection having a tapered portion 22a and a straight portion 22b and a hole 22 having a straight portion. It may be formed with the portion 23. Further, as shown in FIG. 9, a hole 22 having a tapered portion and a rod-shaped projection 23 having a tapered portion may be formed. As shown in FIG. 10, a tapered portion 22a and a straight portion 22b are provided. formed between the rod-like protrusion 23 and a hole 22 and a tapered portion 23a and the straight portion 23b ₁ and a straight portion 23b ₂ with different diameters (small straight portion diameters are formed in the lower portion is not in contact with the adhesive) May be done.

Next, the behavior of the adhesive 24 when the adhesive 24 is applied to the gap will be described. As shown in FIG. 11, the applied adhesive 24 has a frictional drag D against the surface tension T inherent to the adhesive and the weight P of the adhesive, a drag against the pressure inside the adhesive (not shown),
The adhesive 24 does not flow downward due to a mechanical balance based on the widths A and A ′ at the lowermost portion of the gap and the density of the adhesive 24. By changing the inclination of the tapered portion of the gap, B,
By making the portion B 'wider, the force of the adhesive 24 flowing downward is further reduced. This is because the frictional drag D due to the weight of the adhesive 24 increases, and the surface tension T generated in the wider gap portion increases. This allows
The range of restriction on the viscosity and weight of the adhesive 24 is widened.

Next, a method of applying the adhesive 24 will be described. As shown in FIG. 12, the nozzle 33 attached to the adhesive application jig from above the gap formed by the hole 22 of the solid-state imaging device holding member 6 and the projection 23 of the solid-state imaging device fixing member 7. Is applied close. At this time, in order to apply the adhesive uniformly in the circumferential direction of the gap as soon as possible, it is ideal to arrange a large number of nozzle tips 33a in the circumferential direction of the gap. FIG. 13 shows a cross-sectional view of the nozzle tip 33a. In addition, since B and B 'in FIG. 11 can be widened in accordance with the diameter of the nozzle tip 33a, it is very easy to apply, and there are few coating errors when performing automatic coating, which is advantageous.

Next, a method of curing the adhesive will be described.
Since the adhesive 24 used here is an ultraviolet-curable adhesive, the adhesive 24 is cured by irradiating ultraviolet rays 39 from above the adhesive-applied portion by a UV light irradiator 35 shown in FIG. The curing of the adhesive 24 proceeds from the surface to which the ultraviolet rays 39 are irradiated. In this case, since the irradiation is performed from the center axis direction of the adhesive-applied tubular gap, the curing of the adhesive 24 proceeds in this direction. When the adhesive 24 cures, a force is generated by shrinking. In this case, the force acts in a direction normal to the central axis of the tubular gap and also acts in a circumferential direction of the tubular gap. Therefore, since the force acts almost uniformly, this force is canceled, and the displacement of the solid-state imaging device holding member 6 in the x and y directions hardly occurs.
In FIG. 14, the irradiation is performed from the upper part of the tubular gap in the direction of the central axis.

In addition, since the adhesive-curing tubular gap has a tapered portion, when the adhesive is cured, a force also acts in the z-direction, and the solid-state imaging device holding member 6 may be moved in the z-direction. However, in such a case, if the tubular gap has a straight portion as shown in FIGS. 6, 7, 8, and 9, ultraviolet rays are irradiated from below and cured from the straight portion. The solid-state imaging device holding member 6 can be fixed in a state where force generated by contraction of the adhesive in the z, x, and y directions hardly acts on the solid-state imaging device holding member. Curing can be completed. When irradiating further from above, the wider the B and B 'shown in FIG. 11, the more easily the ultraviolet rays reach the lowermost portion of the gap, and the shorter the time required for all the applied adhesive 24 to cure. The curing speed of the adhesive can also be shortened by using a transparent material for the projections 23 forming the gaps or by forming a reflective film (for example, Al, Ni, etc.) on the surface forming the gaps. It is possible to do this.

Next, the material of the adhesive 24 and the material to be bonded used here will be described. Usually, in such filling bonding, the adhesive and the member to be bonded are completely adhered, so that when the heat swelling due to the heat change occurs, the joint is peeled off,
Since defects such as cracking of the member may occur, the reliability with respect to heat is improved when the linear expansion coefficients of the adhesive and the member to be bonded are made equal.

In the above embodiment, the bonding of the joint between the solid-state image sensor holding member 6 and the solid-state image sensor fixing member 7 is performed in the following manner.
Although this was performed by applying an adhesive, the protrusion 23
May be melted and adhered to the hole 22.

[0041]

The effects of the present invention will be described below for each claim. According to the first aspect, after the position of the solid-state imaging device is adjusted with respect to the imaging lens, an adhesive is applied from a wider gap of a joint between the solid-state imaging device fixing member and the solid-state imaging device holding member. Since the fixing is performed, the application of the adhesive can be performed at high speed and evenly, and the assembling workability can be improved.

According to the second aspect, by first curing the adhesive having a constant diameter, the amount of displacement during fixing can be reduced.

According to the third aspect, the irradiated light is reflected on these surfaces, and the curing of the adhesive can be promoted.

According to the fourth aspect, the radiated light is transmitted to the back of the protruding portion and turned around, so that the light irradiation effect can be enhanced.

According to the fifth aspect, displacement of the solid-state image sensor holding member and the solid-state image sensor fixing member due to a thermal change is less likely to occur.

According to the sixth aspect, the position of the solid-state image pickup device holding member and the solid-state image pickup device fixing member is adjusted by a jig, and the connecting portion is fixed after the adjustment. Since there is no need to provide a member for adjusting the mounting position of the device, the cost can be reduced and the adjustment operation is also facilitated. Further, the same effects as those of the first aspect can be obtained.

According to the seventh aspect, the light reaches all corners of the gap and the uncured portion of the adhesive can be eliminated.

According to the eighth aspect, the cost required for the adhesive can be reduced.

According to the ninth aspect, even when the connecting portion is provided through the substrate, no adhesive is attached to the substrate. Does not hinder removal. For this reason, even when an adhesion failure occurs, it is not necessary to dispose of the expensive solid-state imaging device, so that the cost can be reduced.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an embodiment of the present invention.

FIG. 2 is a perspective view of an embodiment of the present invention.

FIG. 3 is a sectional view taken along line AA of FIG. 2;

FIG. 4 is an explanatory diagram of position adjustment by an image forming jig.

FIG. 5 is a perspective view of a connecting portion.

FIG. 6 is a cross-sectional view of a coupling portion.

FIG. 7 is a cross-sectional view of another configuration of the coupling portion.

FIG. 8 is a cross-sectional view of another configuration of the coupling portion.

FIG. 9 is a cross-sectional view of another configuration of the coupling portion.

FIG. 10 is a cross-sectional view of another configuration of the coupling portion.

FIG. 11 is a diagram illustrating the behavior of the adhesive when the adhesive is applied to the gap of the joint.

FIG. 12 is a diagram showing a state in which an adhesive is applied.

FIG. 13 is a cross-sectional view of a nozzle tip.

FIG. 14 is a view showing irradiation of ultraviolet rays to cure an adhesive.

FIG. 15 is a schematic diagram of an apparatus that performs image reading using a solid-state imaging device.

FIG. 16 is an explanatory diagram showing a position adjustment direction of the solid-state imaging device in FIG.

FIG. 17 is a diagram illustrating a relationship between a solid-state imaging device and a pixel line.

FIG. 18 is a diagram illustrating a defect due to a gap.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 CCD (solid-state image sensor) 2 imaging lens 5 solid-state image sensor substrate 6 solid-state image sensor holding member 7 solid-state image sensor fixing member 10 body mounting member 22 hole 23 projecting portion 24 adhesive 33 nozzle 34 adhesive applicator 35 UV light irradiator

Claims (8)

(57) [Claims] And 1. A solid-state image sensor fixing member imaging lens is fixed, and the substrate solid-state imaging element is mounted, et al., The substrate together with and a solid-state image pickup element holding member removably attached to, An image reading apparatus having a coupling portion between the solid-state imaging device fixing member and the solid-state imaging device holding member, wherein the coupling portion is adhered to the solid-state imaging device fixing member after the position of the solid-state imaging device holding member is adjusted. In the mounting structure of the solid-state imaging device in the device, the coupling portion includes a hole provided on one of the solid-state imaging device fixing member and the solid-state imaging device holding member and a projection provided on the other, and the projections And a gap formed by the hole and the hole is formed so that an adhesive injection side or a protrusion tip side is widened. 2. A solid-state image reading apparatus according to claim 1, wherein a portion having a constant diameter is provided at a position where the projection and the hole forming the gap of the coupling portion face each other. Mounting structure of the image sensor. 3. The mounting of the solid-state image pickup device in the image reading device according to claim 1, wherein an optical reflection film is provided on the surface of the projection and the hole forming the gap of the connecting portion. Construction. 4. The mounting structure of a solid-state image pickup device in an image reading device according to claim 1, wherein the projection forming the gap of the coupling portion is formed of a member that can transmit light. 5. The image reading apparatus according to claim 1, wherein the projection, the hole, and the adhesive forming the gap of the coupling portion are made of a material having the same or nearly the same linear expansion coefficient. Mounting structure of the solid-state imaging device in the above. 6. A solid-state image sensor fixing member imaging lens is fixed, and the substrate solid-state imaging element is mounted, et al., The substrate together with and a solid-state image pickup element holding member removably attached to, An image reading apparatus having a coupling portion between the solid-state imaging device fixing member and the solid-state imaging device holding member, wherein the coupling portion is adhered to the solid-state imaging device fixing member after the position of the solid-state imaging device holding member is adjusted. In the method for mounting a solid-state imaging device in an apparatus, the coupling portion includes a hole provided in one of a solid-state imaging device fixing member and a solid-state imaging device holding member and a projection provided in the other, and the projections The gap formed by the hole and the hole is formed so that the adhesive injection side or the tip end side of the protrusion is widened, and after adjusting the position with a jig, an adhesive is applied to the gap to form a joint. Mounting method for a solid-state imaging device in the image reading apparatus is characterized in that so as to wear. 7. The image reading apparatus according to claim 6, wherein a light-curable adhesive is used as the adhesive, and light is irradiated from a wider side of the gap when the adhesive is cured. Mounting method of the solid-state imaging device in the above. 8. The method according to claim 6, wherein the amount of the adhesive is set so as not to protrude from the surface of the connecting portion.