JP2001313779A - Mount structure for solid-state imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mount structure for a solid-state imaging device with which the solid-state imaging device can be mounted highly precisely after adjustment of the 5-axes of the solid-state imaging device and the yield is improved without causing reduction in a fixing strength after reduction (after an adhesive is cured) by enabling easy adjustment of the 5-axes of the solid-state imaging device before adhesion and fixing of the solid-state imaging device. SOLUTION: Intermediate support members 23 are placed so that a 1st adhesive face A between an image forming lens support member 21 and the intermediate support members 23 is made in parallel with a pixel line and an optical axis 28 of the solid-state imaging device 22 and a 2nd adhesive B between a front side (or rear side) of the solid-state imaging device 22 and the intermediate support members 23 is orthogonal to the optical axis 28.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a solid-state imaging device, and more particularly, to a mounting of a solid-state imaging device used in a copier, a facsimile machine, a scanner device, etc. for reading an optical image using the solid-state imaging device. Regarding the structure.

[0002]

2. Description of the Related Art Generally, an image apparatus that reads an image as an optical image using a solid-state image sensor such as a CCD or the like, forms an object 1 on a solid-state image sensor 3 via an image-forming lens 2 as shown in FIG. Let me read. The solid-state imaging device 3 includes a plurality of minute photoelectric conversion elements (hereinafter, simply referred to as pixels,
This pixel usually has a very large size of several μm × several μm).

In such an image reading apparatus, the line image formed by the imaging lens 2 is positioned on the solid-state image pickup device 1 and the optical characteristics (focus, magnification, etc.) are read with a predetermined required accuracy. The image forming lens 2 and the pixel line 4 of one line of the solid-state imaging device 3 are connected to the X-axis and Y-axis as shown in FIG.
Axis, the Z axis, the β rotation direction around the Y axis, and the γ rotation direction around the Z axis, and three rotation directions (hereinafter, the two rotation directions are also the axial directions, and the X axis, Y axis, Z axis, β axis, It is necessary to finely move the γ axis to simply 5 axes) to adjust the position. 4 and 5, reference numeral 5 denotes an optical axis.

Here, the reason why the adjustment about the axis about the X axis is not performed is that the β axis and the γ axis are in the direction orthogonal to the pixel line, and if the β and γ axes are not adjusted, the imaging lens 2 is not adjusted. The distance between the solid-state image sensor 3 and the solid-state image sensor 3 is different for each pixel, and the accuracy of the optical characteristics is reduced. On the other hand, the X axis is coaxial (parallel) with the pixel line. This is because the distance from the element 3 does not differ for each pixel and is not affected by optical characteristics.

On the other hand, recently, in order to read a color image, Red (hereinafter simply referred to as R) and Gr as shown in FIG.
een (hereinafter simply referred to as G) and Blue (hereinafter referred to as G).
A pixel R (6) having a spectral sensitivity peak at
a), B (6b), and G (6c) may use three solid-state imaging devices 6 arranged on a straight line.

Normally, the position adjustment accuracy of such a solid-state image sensor 6 is required to be high in all directions along the five axes. Particularly, in order to achieve this requirement, the solid-state image sensor 6 is indispensable. When the solid-state imaging device 6 is fixed to the frame after the position adjustment as described above, this is a technique for preventing the solid-state imaging device 6 from being displaced.

[0007] Such a technique is necessary even if the position is adjusted with high precision, if the position is displaced during fixing, the position must be adjusted again, or if a separable fixing method is adopted, it is required. This is because there is no other way but to dispose of the portion, and the position adjustment time becomes longer and the cost becomes higher.

Conventionally, screw fixing has been widely used for this fixing. However, when such fixing is used, there is a problem that the amount of displacement becomes as large as several hundred μm to several tens μm.

In order to solve such a problem, it is conceivable to use a complicated structural component such as a screw, a ball and a spring as a means instead of the screw. However, such a configuration is more expensive because the component is expensive. The cost will be high.

[0010] Therefore, at present, many attempts have been made to fix with an adhesive, which is considered to have a smaller amount of displacement than that of fixing with screws, and to reduce the problem of the number of parts. The method of fixing with the adhesive is roughly classified into two methods. One is a method in a case where the parts to be bonded are in contact with each other, and the other is a method in which there is a gap between the parts to be bonded. The former is called close adhesion, and the latter is called filling adhesion.

The filling bonding is a method in which there is a gap between the objects to be bonded that is larger than an adjustment allowance for position adjustment, and the gap is filled with an adhesive and fixed. As a conventional filling and bonding method of this kind, there is, for example, a method described in Japanese Patent Application Laid-Open No. 7-299799. This product sets the amount of gap between the adherends so that the adherends do not come into contact with each other even if the shape accuracy of the adherend is affected. Is what you do.

FIG. 7 shows a method of attaching the head holding member to the head holding member via an ultraviolet-curable adhesive.

In the method shown in FIG. 7, an adhesive 12 is applied to one surface of a work 11 as shown in FIG.
When the work 1 is positioned with respect to the work holding member 13 and the work 11 is fixed to the work holding member 13 via the adhesive 12, as shown in FIG. By irradiating the adhesive 12 with ultraviolet light from the gap by the light guide L, the adhesive 12
Is hardened to fix the work 11 to the work holding member 13. If one of the work 11 and the work holding member 13 is made of a material that transmits ultraviolet light, the ultraviolet light is applied to the adhesive 12 through one of them.

[0014]

However, in such a conventional mounting structure, a gap between the objects is set so that the objects do not come into contact with each other. Since the agent was filled and fixed, the following problems occurred.

Hereinafter, this method of filling and bonding will be described with reference to a model diagram shown in FIG. 8, and its problems will be specifically described.

In FIG. 8, reference numeral 14 denotes a work to be adhered, 15 denotes a work holding member, and 16 denotes an adhesive. In this method, a gap between the work 14 and the work holding member 15 is filled with the adhesive 16. By hardening, the work 14
Is fixed to the work holding member 15.

For this reason, the work 14 and the work holding member 1
In order to adhere and fix the workpiece 5 without making contact, the positional variation A between the workpiece 14 and the bonding surface 14a (position adjustment allowance for the workpiece 4) and the variation C between the bonding surface 15a on the workpiece holding member 15 side are generated. In addition, a gap B is necessary to ensure that the bonding surface 14a of the work 14 does not abut on the bonding surface 15a of the work holding member 15 and that a gap for filling the adhesive 16 is provided. Therefore, the thickness of the adhesive 16 is B at the minimum and A + B + C at the maximum, and the thickness of the adhesive 16 is A
It will vary by the length of + C.

Further, the influence of the surface accuracy of the adhesive surface 14a on the workpiece 14 side and the adhesive surface 15a on the workpiece holding member 15 causes
The film thickness of the adhesive 16 may vary by + J.

In general, the adhesive shrinks when it is hardened. Therefore, it is important to minimize the amount of the adhesive applied so as not to displace the adherend after the hardening of the adhesive. However, in the above-described filling and bonding method, the film thickness of the adhesive cannot be reduced to B or less.
Even if the misalignment due to the curing shrinkage of the adhesive occurs more than the allowable value when the adhesive film thickness is B, it cannot be handled by changing the adhesive film thickness, and the amount of misalignment after fixing is improved. There was a case that could not be done.

When the thickness of the adhesive is A + C, the curing shrinkage of the adhesive also changes according to the variation. Thereby, the fixed work 14
In some cases, the required position accuracy cannot be ensured. Usually, the volume shrinkage of the ultraviolet curable adhesive during curing is about 5 to 10%. Considering the case where the volume shrinkage rate is 7%, when the cured shape of the adhesive is a square, it shrinks by about 2% in each of the three-dimensional directions.

Therefore, when a difference of about 0.5 mm occurs in the film thickness of the adhesive, a difference of about 10 μm occurs in the curing shrinkage amount in each direction. When the object to be bonded is manufactured by injection molding of a resin, the above-mentioned variation A + C of the film thickness of the adhesive may be 0.5 mm or more.
There is a good possibility that displacement after fixing will be a problem.

As described above, in the conventional filling and bonding method, the required accuracy of the work fixing position may not be maintained, so that the yield at the time of production may be reduced or the fixing accuracy may be poor. The material must be disposed of, which raises the problem of increased manufacturing costs.

To solve such a problem, there is, for example, one disclosed in Japanese Patent Application Laid-Open No. 10-309801.

In this apparatus, an intermediate holding member is interposed between the work and the work holding member, and the intermediate holding member is fixed to the work with an adhesive and fixed to the work holding member via the adhesive. The amount of the intermediate holding member interposed between the work and the work holding member is equal to the amount of the adhesive bonded to the bonding surface of the work and the bonding surface of the intermediate holding member, and the bonding surface of the work holding member and the intermediate holding member. Even if the thickness of the adhesive bonded to the bonding surface of the member is controlled to the minimum necessary and constant, it is not necessary to strictly control the positional accuracy between the bonding position of the work and the bonding position of the work holding member. This is a technique capable of mounting a work with high accuracy, increasing the yield, and preventing a decrease in work fixing force after production.

However, when the work is a solid-state imaging device, the work holding member is a solid-state imaging device holding member, and the intermediate holding member is interposed between the solid-state imaging device and the work holding member via an adhesive, the solid-state imaging device When the line image formed by the imaging lens is adjusted on the solid-state imaging device in the position adjustment before the adhesive fixation, and the optical characteristics are read with a predetermined required accuracy, the solid-state imaging device can easily be moved along five axes. After the position is adjusted, the solid-state imaging device can be mounted with high accuracy, the yield can be increased, and a specific fixing method for preventing a decrease in the fixing force of the solid-state imaging device after production occurs. There is still room for improvement because there is no structure.

Therefore, the present invention enables the five-axis adjustment of the solid-state imaging device to be easily performed before the solid-state imaging device is bonded and fixed, and the solid-state imaging device to be mounted with high accuracy after the five-axis adjustment. It is an object of the present invention to provide a mounting structure of a solid-state imaging device that can increase the yield and does not cause a decrease in fixing force of the solid-state imaging device after production (after curing of an adhesive).

[0027]

According to the first aspect of the present invention,
In order to solve the above problem, an imaging lens holding member to which an imaging lens is fixed, a pixel line including a photoelectric conversion element is arranged on a straight line, and a cover glass that covers the photoelectric conversion element on a surface and A solid-state imaging device having a terminal connectable to a circuit board formed on the back surface, and an intermediate holding member that supports the solid-state imaging device so as to face the imaging lens; An attachment structure for a solid-state imaging device in which the intermediate holding member is fixed with an adhesive and the solid-state imaging device and the intermediate holding member are fixed with an adhesive. 1 The bonding surface is a surface parallel to the pixel line and the optical axis of the solid-state imaging device,
The intermediate holding member is provided such that a second adhesive surface between the front or back surface of the solid-state imaging device and the intermediate holding member is a surface orthogonal to an optical axis.

According to a second aspect of the present invention, in order to solve the above-mentioned problem, in the first aspect of the present invention, it is preferable that the second bonding surface of the solid-state imaging device is a cover glass of the solid-state imaging device. It is characterized in that the adhesive is made of an ultraviolet-curable adhesive.

According to a third aspect of the present invention, in order to solve the above-mentioned problem, in the first or second aspect of the present invention, a terminal provided on a back surface of the solid-state imaging device is connected to a circuit board, and The surface is the circuit board.

According to the first to third aspects of the present invention, the line image formed by the imaging lens is positioned on the solid-state imaging device before the solid-state imaging device is bonded and fixed, and the optical characteristics (focus, magnification) are obtained. When reading is performed with a predetermined required accuracy, FIG.
As shown in (b), by sliding the intermediate holding member 23 in parallel with the adhesion surface of the imaging lens holding member 21, adjustment in the three axes of X, Z, and β can be performed. By sliding the image sensor 22 in parallel to the adhesive surface of the intermediate holding member 23, adjustment in the three axes of X, Y, and γ can be performed. As a result, it is possible to easily adjust the position of the fine movement only in the five axis directions of X, Y, Z, β, and γ excluding the axis around the X axis.

That is, the first bonding surface A between the imaging lens holding member 21 and the intermediate holding member 23 is a surface parallel to the pixel lines and the optical axis 28 of the solid-state image sensor 22 and the surface ( Or back surface) and intermediate holding member 2
By arranging the intermediate holding member 23 so that the second adhesive surface B with the optical axis 3 is orthogonal to the optical axis 28, the position adjustment in the direction of the axis around the X axis is prevented from being positively performed. Only the five axis directions of X, Y, Z, β, and γ can be easily adjusted.

Here, the reason why the adjustment about the rotation axis about the X axis is not performed is that the Y and Z axes are the directions orthogonal to the pixel lines, and the adjustment of the γ and β axes around the Y and Z axes is performed. Otherwise, the distance between the imaging lens and the solid-state imaging device differs for each pixel, and the accuracy of the optical characteristics is reduced.
Since the X-axis is coaxial (parallel) with the pixel line, the distance between the imaging lens and the solid-state imaging device does not differ for each pixel without adjustment around the X-axis, and is affected by optical characteristics. Because there is no.

After the five-axis adjustment, the intermediate holding member is interposed between the solid-state image pickup device and the imaging lens holding member, and the adhesive surface of the solid-state image pickup device and the adhesion surface of the intermediate holding member are adhered. The thickness of the adhesive to be adhered to the adhesive surface of the imaging lens holding member and the adhesive surface of the intermediate holding member is minimized, and is only required to be kept constant. The solid-state imaging device can be mounted with high accuracy without strictly controlling the positional accuracy of the bonding portion of the solid-state imaging device holding member, and the yield can be increased, and after production (after curing of the adhesive). 2) It is possible to prevent the fixing force of the solid-state imaging device from decreasing.

According to the first aspect of the present invention, the bonding surface of the solid-state imaging device is limited to the front surface or the back surface of the solid-state imaging device.
According to a second aspect of the present invention, the bonding surface of the solid-state imaging device is limited to a cover glass, and the bonding surface of the solid-state imaging device is limited to a circuit board to which terminals of the solid-state imaging device are attached.

[0035]

Embodiments of the present invention will be described below with reference to the drawings.

As shown in the reference example of FIG. 1, the first member 10
When adjusting the position of the first member 102 and the second member 102, the intermediate holding member 103 is slid in parallel to the bonding surface of the first member 101 to adjust the three axes of X, Y, and γ. And the second member 102 is connected to the intermediate holding member 10.
X, Z, by sliding parallel to the adhesive surface of No. 3
β can be adjusted in three axial directions. As a result, X
It is possible to easily adjust the position of the fine movement only in the five axis directions of X, Y, Z, β, and γ excluding the axis around the axis.

That is, the first bonding surface A between the first member 101 and the intermediate holding member 103 and the second bonding surface B between the second member 102 and the intermediate holding member 103 are arranged by a plurality of working members of the second member 102. It becomes a plane parallel to the setting direction and the first
By arranging the intermediate holding member 103 so that the bonding surface A and the second bonding surface B are at right angles to each other, X, Y, and X are not positively adjusted in the direction of the axis around the X axis.
Only the five axis directions of Z, β, and γ can be easily adjusted.

Here, the reason why the adjustment about the rotation axis around the X axis is not performed is that the Y and Z axes are in the direction orthogonal to the working member, and the adjustment of the γ and β axes around the Y and Z axes is performed. Otherwise, the distance between the first member and the second member is different for each work member, and the work accuracy of the work member is reduced.
Since the X axis is coaxial (parallel) with the working member,
This is because the distance between the first member and the second member does not differ from one working member to another even if adjustment around the axis is not performed, and the workability of the working member is not affected.

Further, after the five-axis adjustment, the adhesive is adhered to the bonding surface of the second member and the bonding surface of the intermediate holding member by the amount of the intermediate holding member interposed between the second member and the first member. The thickness of the adhesive bonded to the bonding surface of the first member and the bonding surface of the first member and the bonding surface of the intermediate holding member is kept to a minimum and required to be constant. The second member can be mounted with high accuracy without strictly controlling the positional accuracy of the bonding portion, the yield can be increased, and the production of the second member (after curing of the adhesive) can be performed. A decrease in the fixing force can be prevented.

[First Embodiment] FIGS. 2 to 4 show a first embodiment of a member mounting structure and a member mounting apparatus.
The mounting structure of this member is applied to an image forming apparatus such as an image reading apparatus such as a copying machine, a facsimile apparatus, and a scanner apparatus, and a printing apparatus.

First, the configuration will be described. 2 and 3, reference numeral 21 denotes a frame, which is formed in an L-shape, includes a horizontal portion 21a and a vertical portion 21b, and the frame 21 constitutes a first member according to the present invention.

A V-groove 24 is formed in the horizontal portion 21a, and an imaging lens 25 is positioned in the V-groove 24. The image forming lens 25 converts the image of the original into each pixel line 2 provided for each RGB of the photoelectric conversion element 22 such as a CCD.
Images are formed on 2a, 22b, and 22c, and are fixed to the horizontal portion 21a by a lens retainer 26.

An opening 27 is formed in the vertical portion 21b. The opening 27 is used to convert a line image converged by the imaging lens 25 into each pixel line 22 of the solid-state image sensor 22.
a, 22b and 22c.

The solid-state imaging device 22 has pixel lines 22 a, 22 b, and 22 c formed of photoelectric conversion elements arranged in a straight line.
22b and 22c are supported by the vertical portion 21b so as to face the imaging lens 25. The solid-state imaging device 22 and the pixel lines 22a, 22b, and 22c constitute a second member and an operation member according to the present invention.

2 and 3, reference numeral 28 denotes an optical axis, which corresponds to the Z direction on the coordinates. The X-axis direction is a main scanning direction in the image reading device, and the Y-axis direction is a sub-scanning direction.

The solid-state imaging device 22 has a circuit board 29.
The circuit board 29 drives the solid-state imaging device 22 while electrically processing an electric output signal of the solid-state imaging device 22 associated with the formed optical image, and then transmits the processed signal to the image reading device. It has become.

On the other hand, the intermediate holding member 23 is formed in an L-shape, and is made of a material through which ultraviolet rays pass.
The intermediate holding member 23 is made of an ultraviolet-curable adhesive 30, 31.
The vertical portion 21b and the solid-state imaging device 22
And a bonding surface (hereinafter, referred to as a first bonding surface) A between the vertical portion 21b and the intermediate holding member 23 and a bonding surface (hereinafter, referred to as a second bonding surface) between the solid-state imaging device 22 and the intermediate holding member 23. B) the pixel line 22a of the solid-state imaging device 22
The intermediate holding member 23 is disposed between the vertical portion 21b and the solid-state image sensor 22 such that the first bonding surface A and the second bonding surface B are at right angles to each other while being parallel to the planes 22c to 22c.

Next, a method for adjusting the position of the solid-state imaging device 22 will be described.

First, adhesives 30 and 31 are applied to two orthogonal surfaces A and B of the intermediate holding member 23 by a solid image pickup device mounting device (not shown). At this time, the thickness of the adhesives 30 and 31 is adjusted to be constant while monitoring the thicknesses of the adhesives 30 and 31 with a camera (not shown), and then the solid-state imaging device 22 is attached to the intermediate holding member 23 by the mounting device. At the same time, the intermediate holding member 23 is attached to the vertical portion 21b.

Next, the line image formed by the image forming lens 25 is positioned on the solid-state image pickup device 22, and the optical characteristics (focus, magnification, etc.) are read with a predetermined required accuracy. At this time, the position of the solid-state imaging device 22 is adjusted while outputting the data photoelectrically converted by the solid-state imaging device 22 on a monitor.

First, when adjusting the position in the X-axis direction, the solid-state imaging device 22 is gripped by a chuck or the like so that the solid-state imaging device 22 slides on the adhesive 31. In this case, as shown in FIG. 3A, since the adhesive area of the adhesive 31 with respect to the adhesive 30 is small, a slip portion at the time of adjustment is adjusted due to a difference in surface tension between the adhesives 30 and 31. There is one place.

However, at the time of adjustment in the X-axis direction, the intermediate holding member 23 and the solid-state
Both may slide.

When adjusting the position of the β-axis around the Y-axis, the solid-state image sensor 22 is gripped by a chuck or the like, and the solid-state image sensor 22 is slid on the adhesive 31.

When adjusting the position in the Y-axis direction, the intermediate holding member 23 is gripped by a chuck or the like so that the solid-state imaging device 22 and the intermediate holding member 23 slide on the adhesive 30 at the same time. .

When the position is adjusted in the Z-axis direction, the solid-state imaging device 22 is gripped by a chuck or the like so that the solid-state imaging device 22 slides on the adhesive 31 at the same time.

Further, when adjusting the position of the γ axis around the Z axis, the intermediate holding member 23 is gripped by a chuck or the like so that the solid-state imaging device 22 and the intermediate holding member 23 slide on the adhesive 30 at the same time. Adjust.

In this embodiment, the intermediate holding member 23 is mounted on the frame 21 so that the first bonding surface A and the second bonding surface B are perpendicular to each other.
And between the solid-state image sensor 22 and X,
The individual movements of Y, Z, β, and γ can be performed independently for each axis, and the movement for sliding and adjusting the intermediate holding member 23 and the solid-state imaging device 22 can be made to match the rectangular coordinates.

Here, the reason why the adjustment about the rotation axis around the X axis is not performed is that the Y and Z axes are the pixel lines 22a to 22a.
Γ, β around the Y and Z axes.
If the axis is not adjusted, the distance between the imaging lens 25 and the solid-state imaging device 22 differs for each pixel, and the accuracy of the optical characteristics is reduced. On the other hand, the X axis is the pixel lines 22a to 22a.
Since it is coaxial (parallel) with c, the distance between the imaging lens 25 and the solid-state imaging device 22 does not differ for each pixel without adjustment about the X axis, and is not affected by optical characteristics. That's why.

When the position of the solid-state image pickup device 22 is adjusted in this way, and it is determined from the output of the monitor that the optical characteristics satisfy the required accuracy, the adhesive is irradiated with an ultraviolet light (not shown). The adhesives 30 and 31 are cured by irradiating ultraviolet rays simultaneously through the intermediate holding member 23 over the entire area where the adhesives 30 and 31 are attached and from the direction perpendicular to the adhesive surface.

As described above, in the present embodiment, the first bonding surface A and the second bonding surface are the pixel lines 22a of the solid-state imaging device 22.
Since the intermediate holding member 23 is disposed between the vertical portion 21b and the solid-state imaging device 22 so that the first bonding surface A and the second bonding surface B are perpendicular to each other while being parallel to the surfaces 22c to 22c.
Before the solid-state imaging device 22 is fixed by bonding, the intermediate holding member 2
3 can be adjusted in three axial directions of X, Y, and γ by sliding in parallel to the bonding surface of the frame 21.
In addition, by sliding the solid-state imaging device 22 in parallel with the bonding surface of the intermediate holding member 23, adjustment in the X, Z, and β directions can be performed. As a result, it is possible to easily adjust the position of the fine movement only in the five axis directions of X, Y, Z, β, and γ excluding the axis around the X axis.

That is, the frame 21 and the intermediate holding member 2
3 and a second bonding surface B between the solid-state imaging device 22 and the intermediate holding member 23 are parallel to the pixel lines 22a to 22c of the solid-state imaging device 22, and the first bonding surface A By arranging the intermediate holding member 23 so that the second bonding surface B is at a right angle, X, Y, Z, and X are not positively adjusted in the direction of the axis around the X axis.
Only the five axis directions of β and γ can be easily adjusted.

After the five-axis adjustment, the solid-state image sensor 22
The thickness of the adhesives 30 and 31 bonded to the first bonding surface A and the second bonding surface B is minimized and fixed by the amount that the intermediate holding member 23 is interposed between the first bonding surface A and the second bonding surface B. Only the position of the solid-state image sensor 22 and the frame 21
The solid-state imaging device 22 can be mounted with high accuracy without strictly controlling the positional accuracy of the bonding portion of the solid-state imaging device, the yield can be increased, and the solid-state imaging after production (after curing of the adhesive) can be performed. It is possible to prevent a decrease in the fixing force of the element 22 from occurring.

The adhesives 30 and 31 are made of an ultraviolet-curable adhesive, and the intermediate holding member 23 is made of a material that transmits ultraviolet light. Since the irradiation can be performed, ultraviolet rays can be simultaneously irradiated on the entire area of the bonding portion and from the direction perpendicular to the bonding surface, so that the time until the adhesives 30 and 31 are hardened is further reduced, and the productivity is reduced. Can be improved.

The thickness of the adhesives 30, 31 is preferably as thin as possible in order to reduce the influence of curing shrinkage.
However, actually, the solid-state imaging device 22, the frame 21
In addition, it is necessary to set a thickness sufficient to fill the difference between the unevenness of the plane according to the flatness of the solid-state imaging device 22.

In the present embodiment, the intermediate holding member 23 is disposed above the solid-state image sensor 22. However, the present invention is not limited to this, and as shown in FIG. On the other hand, the same effect can be obtained even if the intermediate holding member 23 is disposed on the lower side.

Further, the intermediate holding member 23 is not limited to the L-shape, but may be formed in a triangular shape as indicated by reference numeral 41 in FIG. In this case, the intermediate holding member 41
The rigidity of itself can be increased.

[Second Reference Example] FIG. 5 is a view showing a second reference example of the mounting structure of the member. The mounting structure of this member is the same as that of the first reference example, such as a copying machine, a facsimile apparatus, and a scanner. The present invention is applied to an image reading apparatus such as an apparatus and an image forming apparatus such as a printing apparatus.

In the first reference example, the solid-state imaging device is fixed to the intermediate holding member on the second bonding surface B.
In the present embodiment, the solid-state imaging device is fixed to the intermediate holding member via the attaching / detaching holding member, and the other configuration is the same as that of the first embodiment. And the description is omitted.

In the present embodiment, the solid-state image sensor constitutes an arrangement member, and the solid-state image sensor, the substrate and the support member for attachment and detachment constitute a second member.

Further, in this embodiment, two intermediate holding members 23 are prepared as 23a and 23b, and the first bonding surface A and the second bonding surface B are each two, that is, the first bonding surfaces A, A ′ And second bonding surfaces B and B ′.

In FIG. 5, the holding member 50 for attachment and detachment is a rectangular parallelepiped having a hollow inside, and two parallel planes are penetrated (hereinafter referred to as penetrating surfaces). The circuit board 29 on which the solid-state imaging device 22 is mounted is inserted through one surface of the penetrating surface.
9 is a screw hole 51a provided in the attaching / detaching holding member 50,
51b is screwed. The screwing may be performed with the accuracy that can be achieved by ordinary screwing, and there is no need to mount the screw with particularly high accuracy.

The attachment / detachment holding member 50 can be attached to the fixed image element 22 attached to the attachment / detachment holding member 50 in the same manner as in the method of joining the solid-state image sensor 22 and the intermediate holding member 23 of the first reference example. The detachable holding member 50 is bonded to the intermediate holding members 23a and 23b such that the first bonding surfaces A and A 'and the second bonding surfaces B and B' are perpendicular to the pixel lines 22a to 22c. Fixed.

As a result, the line image converged by the imaging lens 25 is transferred from the other one of the penetrating surfaces of the detachable holding member 50 to each of the pixel lines 22a, 22b, and 22c of the solid-state image sensor 22.
Is to lead to.

As for the method of adjusting the position of the solid-state image pickup device 22, the solid-state image pickup device 22 is mounted on the circuit board 29 in advance, and the circuit board 29 is mounted on the detachable holding member 50. Similarly to the attachment method, the intermediate holding member 23 to which the solid-state imaging device 22 is attached is moved in the X-axis direction while viewing the monitor (not shown) obtained by photoelectrically converting the intermediate holding member 23 by the solid-state imaging device 22.
Adjustment is performed in the Z-axis direction and the β-axis direction, and positioning is performed.

As described above, in this embodiment, the effect of the first embodiment, that is, it is possible to easily adjust only the directions of five axes, it is possible to mount the solid-state imaging device 22 with high accuracy, and the yield is reduced. In addition to the same effect of being able to increase the fixing force of the solid-state imaging device 22 after production (after curing of the adhesive), it is possible to prevent the solid-state imaging device 22 from being lowered. Since the circuit board 29 on which the solid-state imaging device 22 is mounted is screwed, even if the position adjustment of the solid-state imaging device 22 with the imaging lens 25 fails, the detachable holding member 5
From 0, the circuit board 29 including the solid-state imaging device 22 can be removed.

When the circuit board 29 is screwed to the attachment / detachment holding member 50, the position of the solid-state imaging device 22 can be adjusted after the screwing. Therefore, high accuracy is not required for the screwing. The solid-state imaging device 22 can be easily attached to the detachable holding member 50.

In this embodiment, the solid-state imaging device member 2
2 is attached to the circuit board 29, and this circuit board is screwed to the detachable holding member 50 using two screws. As shown in FIG.
0, the solid-state imaging device 22 is attached to the detachable holding member 50 from outside.
May be directly fixed with three screws 53a, 53b, 53c so as to contact the two inner wall surfaces 52a, 52b.

In this embodiment, when the circuit board 29 is attached to the attachment / detachment holding member 50 and when the solid-state imaging device 22 is directly fixed to the attachment / detachment member as described above, it is fixed by screws. However, it may be fixed by a snap fit.

The circuit board 29 and the solid-state imaging device 2
When fixing 2 to the detachable holding member 50 by screwing and snap-fit as described above, the fixing points of screwing and snap-fit are not limited as described above.

[Third Reference Example] FIGS. 7 to 9 are views showing a third reference example of a member mounting structure and a member mounting device according to the present invention. The mounting structure of this member is the same as that of the first reference example. In addition, the present invention is applied to an image reading apparatus such as a copying machine, a facsimile apparatus, and a scanner, and an image forming apparatus such as a printing apparatus.

In the first reference example, the solid-state image pickup device and the frame are fixed to one intermediate holding member on the first bonding surface A and the second bonding surface B. Similarly to the above, two intermediate holding members are fixed to the solid-state imaging device and the frame, and these intermediate holding members have a configuration that penetrates a circuit board on which the solid-state imaging device is mounted. I have.

Normally, in a contraction optical system, the variation in the position of the image plane with respect to the imaging lens is several tens μm, while the variation in the position of the object plane with respect to the imaging lens is several mm (hereinafter referred to as the conjugate length). Variation). Therefore, when this conjugate length variation occurs, it is necessary to adjust the positions of the imaging lens and the solid-state imaging device within a range of several mm in the optical axis direction.

When sliding the imaging lens on the frame,
If the imaging lens has a surface on which the imaging lens slides, the position of the imaging lens in the optical axis direction can be adjusted. However, when the position adjustment of the solid-state imaging device is performed in a range of several mm, on the imaging lens side, the width until the intermediate holding member contacts the circuit board, and on the opposite side of the imaging lens, the intermediate holding member However, the adjustment can be made only in the width until the adhesive margin for fixing the solid-state imaging device can be secured.

As shown in FIG. 7, this width is t + Δh which is the sum of the thickness t of the solid-state image sensor 22 and the distance Δh between the solid-state image sensor 22 and the circuit board 29 at the longest. Usually, t is about 2 to 3 mm, and Δh is about 1 mm. Anything longer than that cannot be made long due to the problem of noise.

For this reason, as described above, the adjustable width is about ± 2 mm, but usually requires an adhesive margin of about 1 to 2 mm, which is practically about ± 1 mm.

The variation in the conjugate length varies depending on the imaging lens, but is generally about ± 2 to 5 mm.
In the case of adjusting the variation of the conjugate length of not less than mm, the adjustment width is narrow in the structure as in the first reference example, and
However, there is a possibility that the position adjustment and fixing may not be possible due to contact with the circuit board 29 or an inability to secure a margin for bonding.

The present embodiment is characterized in that the position adjustment in the Z-axis direction is taken into consideration, and the other configuration is the same as that of the first embodiment. Description is omitted.

As shown in FIGS. 8 and 9, the intermediate holding member 23
a, 23b and the second adhesive surfaces B, B between the solid-state imaging device 22
'Has a length L penetrating the circuit board 29.

The circuit board 29 includes the solid-state imaging device 22.
Penetrate through the intermediate holding members 23a, 23b around the height at which they are fixed to the intermediate holding member 23.
b.

With this configuration, the solid-state imaging device 22 mounted on the circuit board 29 slides the second bonding surfaces B and B 'of the intermediate holding members 23a and 23b in the Z-axis direction when performing position adjustment. Is available.

At this time, the moving distance of the solid-state imaging device 22 is, as shown in FIG. 8, 11 + 12 + 2 × t− (adhesion margin). Therefore, this movable width (11 + 12 +
If 2 × t− (adhesion margin) is set wider than the variation width of the conjugate length of the imaging lens 25, the solid-state imaging device 22 can be accurately fixed even if the conjugate length varies. Has become.

As described above, in the present embodiment, the effect of the first embodiment, that is, it is possible to easily adjust only the directions of five axes, it is possible to mount the solid-state imaging device 22 with high accuracy, and the yield is reduced. In addition to the same effect of being able to increase the fixing force of the solid-state imaging device 22 after production (after curing of the adhesive), the conjugate length of the imaging lens 25 can be reduced. Can be provided in the Z-axis direction just enough to correct the error width, so that the position can be accurately adjusted.

The through holes 60a, 60b of this embodiment
May be a curved shape such as a hole or a cutout, a linear shape, or a circle as shown in FIG. However, the one that most effectively penetrates the intermediate holding members 23a and 23b is wider than the projected shape of the intermediate holding members 23a and 23b by the shape error and the installation error of the circuit board 29 and the intermediate holding members 23a and 23b. Shape.

In the present embodiment, when adjusting the position of the second adhesive surface, when moving the solid-state imaging device 22 in the optical axis direction, through holes 60a and 60b are provided in the circuit board 29, and the through holes 60a and 60b are provided. The intermediate holding member 23 is provided at 60a and 60b.
a and 23b are penetrated so as not to contact the circuit board 29. At this time, the intermediate holding members 23a and 23b
3b so that the solid-state imaging device 22 is not in contact with the circuit board 29.
It may be arranged in.

For example, when the intermediate holding members 23a and 23b are fixed on the upper surface of the solid-state imaging device 22, even if the solid-state imaging device 22 is moved in the optical axis direction, the circuit board 29 remains on the intermediate holding members 23a and 23b. The solid-state imaging device 22 may be mounted on the upper end of the circuit board 29 so as not to come into contact with the solid-state imaging device 22. With such a configuration, the same effect as that of the present embodiment can be obtained.

[Fourth Embodiment] FIG. 10 is a view showing a fourth embodiment of a member mounting structure and a member mounting apparatus according to the present invention. The member mounting structure is a copying machine, a facsimile apparatus, and a scanner apparatus. And the like, and image forming apparatuses such as printing apparatuses.

In this embodiment, a through hole is provided in the circuit board in the third embodiment, and the position of the solid-state imaging device in the Z-axis direction is adjusted so that the intermediate holding member can be penetrated. Instead, in the frame, the first adhesive surface A with the intermediate holding member is moved in the Z-axis direction to adjust the distance between the imaging lens and the solid-state imaging device. 3 Since this is the same as the reference example, the same members are denoted by the same reference numerals and description thereof will be omitted. However,
As the intermediate holding member, four members 23a, 23b, 23c, and 23d are used, two each at the top and bottom of the solid-state imaging device 22.

As shown in FIG. 10, in the frame 21, the imaging lens fixing surface 70 fixing the imaging lens, the conjugate adjustment bracket 71 for performing the conjugate adjustment, and the conjugate adjustment bracket 71 slide. The conjugate adjustment bracket 71, which is composed of the sliding surface 72, constitutes an adjustment member according to the present invention.

The imaging lens fixing surface 70 corresponds to the horizontal portion 21a of the first reference example, and the sliding surface 72 is lower than the imaging lens fixing surface 70. Further, the solid-state imaging device 22
When the position of the imaging lens 25 is adjusted, the conjugate adjustment bracket 71 is slid on the sliding surface 72, and after the positions of the solid-state imaging device 22 and the imaging lens 25 are determined. The conjugate adjustment bracket 71 is fixed.

As a result, as in the third embodiment, if the movable width of the conjugate adjustment bracket 71 is set to be wider than the variation width of the conjugate length of the imaging lens 25, even if the conjugate length varies. The solid-state imaging device 22 can be accurately fixed.

As described above, in this embodiment, similarly to the third embodiment, in addition to the same effects as those of the first embodiment, the imaging lens 25
In this case, even if a variation width of the conjugate length occurs, a width sufficient to correct this error width can be provided in the Z-axis direction, so that the position can be accurately adjusted.

[First Embodiment] FIGS. 11 to 13 show a first embodiment of a member mounting structure and a member mounting device according to the present invention. The present mounting device is applied to a solid image pickup device mounting device. Applied.

This embodiment is an embodiment of a device for adjusting the position of the solid-state imaging device in the Z-axis direction in a third embodiment described later. Since the configuration is the same as that of the embodiment, the same members are denoted by the same reference numerals and description thereof will be omitted. First, the configuration will be described.

The solid-state image pickup device mounting device 80 shown in FIG.
Is a light source 81, a chart 82 illuminated by the light source 81, a fixed base 84 for holding a solid-state imaging device member 83 including the frame 21, the solid-state imaging device 22, and the intermediate holding member 23 of the third embodiment. , A chart holding member 85 for holding the light source 81 and the chart 82, a base 86 for fixing the chart holding member 85 and the fixing base 84, and a control unit 87 for controlling the mounting device.

The light source 81 is disposed above the chart holding member 85 so as to irradiate the chart. The center of the chart 82 is aligned with the optical axes of the solid-state imaging device 22 and the imaging lens 25. It is arranged to match.

The fixing base 84 includes a first fixing part (not shown) for fixing the frame 21 with a chuck or the like, and a solid-state image sensor 22.
And a second fixing portion 100 for fixing the fixing member with a chuck or the like. The second fixed portion is moved by the control portion 87 in the Z-axis direction, that is, in the chart direction.

Further, the height of the fixed base 84 can be changed up and down.
4 can be adjusted so that the optical axes of the imaging lens 25 fixed to each other coincide.

The distance between the fixed base 84 and the chart holding member 85 is changed according to the focal length of the imaging lens 25, and the fixed base 84 can be moved in parallel to the chart holding member back and forth. I can do it.

A control unit 87 shown in FIG. 12 receives an output image data from a circuit board (hereinafter, referred to as a CCD circuit board) 29 on which the solid-state image sensor 22 is mounted, and calculates the position of the solid-state image sensor 22. A central processing unit (hereinafter referred to as a CPU) 89 for controlling the second fixed unit 100 based on the calculation result, and FIG. 20 of the third embodiment.
, A display unit 90 for displaying the length of the first adhesive surface A of the intermediate holding member 23, a light source drive control unit 91 for controlling the power supply of the light source 81, the solid-state imaging device 22, and the CCD circuit board 2.
And a CCD circuit drive control section 92 for driving the drive circuit 9.

The arithmetic section 88 receives image data from the solid-state imaging device 22 for forming an image of the chart 82 via the imaging lens 25, and converts the image data into the solid-state imaging device 2.
2 is calculated.

The CPU 89 moves the second fixed unit 100 in the Z-axis direction, that is, in the optical axis direction, based on the calculation result calculated in the calculation unit 88. Further, the CPU 89 controls the light source drive control section 91 and the CCD circuit drive control section 92.

The display section 90 calculates and displays the length L of the first bonding surface A after the CPU 89 adjusts the second fixing section.

Next, the operation of the mounting device 80 will be described with reference to FIG.

First, the solid-state imaging device member 83 is fixed to the fixed base 84.
Is fixed to the first fixed portion and the second fixed portion 100, the height of the fixed base 84 is made to coincide with the center of the chart 82 and the optical axis 28, and the distance from the chart 82 is determined based on the focal length of the imaging lens. The power supply and the solid-state imaging device 22
Is driven (step 1).

Next, the chart 82 is displayed on the solid-state image sensor 22.
Then, image data is output, and the image data is input to the arithmetic unit 88 (step 2).

Next, the operation section 88 calculates the position of the solid-state imaging device 22 based on the image data (step 3).

Next, the CPU 89 determines whether there is a variation in the conjugate length based on the calculation result (step 4). If there is no variation in the conjugate length, the length of the first bonding surface A of the intermediate holding member 23 is calculated, this length is displayed (step 5), and this operation is terminated. If there is a variation in the conjugate length, the second fixed unit 100 is moved in parallel to adjust the position (step 6), and the solid-state imaging device 22 inputs the chart 82 again (step 2).

As described above, in the present embodiment, the chart 82 illuminated by the light source 81 is
Since the image is formed on the solid-state imaging device 22 and the position of the second fixed portion 100 can be calculated from the image data, the relative position between the frame 21 and the solid-state imaging device 22 depends on the variation of the conjugate length generated in the imaging lens 25. Even if the position is shifted, the solid state imaging device 2 is
2 can be adjusted in the Z-axis direction, and the solid-state imaging device 22 can be fixed with high accuracy while being fixed to the intermediate holding member 23.

In this embodiment, after the solid-state image pickup device is held on the second adhesive surface by a chuck or the like, the position is adjusted and then fixed.
And the intermediate holding member 23 may be replaced every time the position is adjusted, and the intermediate holding member 23 having the length L may be fixed.

Further, in this embodiment, a solid-state imaging device member having the structure of the fourth embodiment may be used as a solid-state imaging member to be used. In this case, the second fixing part 100
Hold the conjugate adjustment bracket.

[Fifth Reference Example] FIGS. 14 to 16 are views showing a fifth reference example of a member mounting structure and a member mounting device. The present mounting device is applied to a device for mounting a solid-state imaging device. is there.

In the fifth reference example, it is a further object to provide a mounting structure of a solid-state image pickup device in which all components are accommodated in a minimum necessary space, and there is no restriction on layout. .

In FIGS. 14 and 15, a frame 221 includes an image of a document as RGB pixel lines 1a, 1b, 1
c (see FIG. 48)
Are pressed and supported by the lens pressing plate 26 on the V-groove 24 in the horizontal portion 221a. At this time, the optical axis 28 of the imaging lens 25 corresponds to the Z direction on the coordinates. In addition, the X direction is the main scanning direction in the image reading apparatus, that is, the line direction of the pixel line, and the Y direction is the sub scanning direction.

The circuit board 29 has the solid-state image sensor 22 mounted thereon. Here, the circuit board 29 has a function of driving the solid-state imaging device 22 and transmitting an electric output signal of the solid-state imaging device 22 accompanying the formed optical image to the image reading device after performing electrical processing. Have. The solid-state imaging device 22 is attached to the vertical portion 221b of the frame 221 via an L-shaped intermediate holding member 223.

In FIG. 16, the intermediate holding member 223 and the solid-state imaging device 22 are adhered and fixed by providing a second adhesive surface B on the side surface of the solid-state imaging device 22. Then, the intermediate holding member 223 and the frame 221 are connected to the first portion of the vertical portion 221b.
It is bonded and fixed on the bonding surface A.

Here, when viewed from the X direction as shown in FIG. 16, the first bonding surface A which is the frame side bonding surface has the optical axis 28.
It is arranged at the position where it intersects. Therefore, the height of the horizontal portion 223e of the intermediate holding member 223 and the height of the vertical portion 221b of the frame 221 are substantially the same as the height of the lens pressing plate 26 as shown in FIG.

In this height direction (Y direction), at least the dimension of the imaging lens 25 must be secured at least. Therefore, as shown in FIG. 15, by expanding the vertical portion 223f of the intermediate holding member 223 to the same size as the lens size, the layout of the entire structure can be maintained as it is while the bonding area (that is, bonding force) is increased. . That is, since all the components are accommodated in the minimum necessary space, there is no restriction on the layout.

The means for bonding the solid-state image sensor 22 to the intermediate holding member 223 and the imaging lens 25 and the intermediate holding member 223
In particular, it is advantageous in terms of productivity to use an ultraviolet curable adhesive whose curing speed is as fast as about 10 seconds. In this case, a transparent member such as glass or plastic is used as the intermediate holding member 223, and ultraviolet rays (not shown) are transmitted through the intermediate holding member 223 to irradiate the first bonding surface A and the second bonding surface B. , Curing becomes possible.

Before and after the curing of the adhesive during manufacturing, the frame 221 and the solid-state image sensor 22 are gripped by a manufacturing apparatus (not shown), and the intermediate holding member 223 is not gripped.

For this reason, when ultraviolet rays are irradiated, the adhesive contracts from the initial state. The contraction of the adhesive causes the intermediate holding member 223 to move the frame 221 and the solid-state imaging device 22.
The adhesive is cured while moving so as to be attracted to the adhesive.

[0131] The adhesive thickness between the second adhesive surface B and the first adhesive surface A in this adhesive fixing is preferably as thin as possible in order to reduce the influence of curing shrinkage. However, actually, the solid-state imaging device 22, the frame 221, the intermediate holding member 223
It is necessary to set a thickness sufficient to fill the difference between the irregularities of the plane according to the flatness of the plane.

By the way, at the time of manufacturing, the solid-state imaging device 22 must first be adjusted to a predetermined position before the adhesive fixing. That is, in this position adjustment, the optical characteristics (focus and magnification) are read with predetermined required accuracy, and the position is adjusted by finely moving the solid-state imaging device 22 in the five axes of x, y, z, β, and γ. Is required. On the other hand, in the case of the X direction, first, the solid-state imaging device 22
Is adjusted by sliding in the X direction.

In the case of the Y direction, the adjustment is performed by sliding the intermediate holding member 223 and the solid-state imaging device 22 on the first adhesive surface A in conjunction with each other. In the case of the Z direction, the second bonding surface B
Above, the solid-state imaging device 22 is adjusted by sliding in the Z direction.

In the rotation adjustment, the β direction is adjusted by the solid-state imaging device 22 rotating in the β direction in conjunction with the second adhesive surface B. The γ adjustment of the rotation adjustment is performed on the first bonding surface A.
Above, the intermediate holding member 223 and the solid-state imaging device 22 are rotated and adjusted in the γ direction in conjunction with each other to be adjusted. These x, y, z,
The individual movements of β and γ can be performed completely independently of each other. This is because the second bonding surface B and the first bonding surface A are formed at right angles. Since the two bonding surfaces are at a right angle, the movement to be adjusted by sliding can be made to match the rectangular coordinates.

As described above, according to the fifth reference example, the first bonding surface A is orthogonal to the optical axis 28 and the height of the optical axis is the first.
Since it is arranged within the vertical width of the bonding surface A, the intermediate holding member 223 moves with the solid-state imaging device 2 with the shrinkage of the adhesive, due to the shrinkage of the adhesive caused during the bonding and hardening.
By converting the movement into a movement (deviation) approaching the frame 2 and the frame 221, the deviation of the solid-state imaging device itself can be suppressed, and the solid-state imaging device 22 can be positioned with respect to the frame 221 with high accuracy.

Further, two perpendicular surfaces (the second adhesive surface B, the first
By performing the slide adjustment on the bonding surface A), the position of the entire structure can be adjusted by fine movement in the five axes of x, y, z, β, and γ.

Further, when viewed from the X direction, the first
By arranging the bonding surface A and the optical axis at the same height, the second bonding surface B and the first bonding surface can be set within the upper and lower (Y direction) widths of the imaging lens 25, which is a basic restriction range on the layout. Since the surface Ab can be accommodated, all components can be accommodated in a minimum necessary space, and it is possible to prevent a layout restriction from occurring.

[Sixth Embodiment] FIGS. 17 and 18 are views showing a sixth embodiment of a member mounting structure and a member mounting apparatus. The present mounting apparatus is applied to a solid image pickup device mounting apparatus. is there.

In the sixth embodiment, as shown in FIG. 17, the number of the intermediate holding members 23 for fixing the solid-state imaging device 22 is two or more, and the solid-state imaging device of at least one or more intermediate holding members 23 is provided. The adhesive surface 23e on the 22 side is the adhesive surface 23f on the solid-state image sensor 22 side of the remaining intermediate holding member 23.
And are arranged to face each other. In the figure, 23
g is a rib.

At this time, as shown in FIG. 18A, the bonding surface 23e and the bonding surface 23f are arranged in parallel, or as shown in FIG. 18B, the bonding surface 23e and the bonding surface 23f Can also be arranged so as to face each other.

As in the sixth reference example, the intermediate holding member 23
The natural frequency and the vibration shape of the mounting structure of the solid-state imaging device 22 in which is disposed and the mounting structure of the solid-state imaging device shown in the reference examples of FIGS. According to this comparison, the natural frequency of the mounting structure of the solid-state imaging device according to the sixth embodiment is 30 to 5 more.
It can be seen that the structure is about 0% higher and is strong against vibration.

As described above, according to the sixth reference example, two or more intermediate holding members are used, and at least one of the intermediate holding members has the solid-state imaging element side adhesive surface of another intermediate holding member. By arranging them in the direction facing the solid-state image sensor-side adhesive surface, it is possible to make the structure stronger against external force and vibration than arranging the same number of intermediate holding members on the same surface.

In the embodiments of the present specification, as the shape of the intermediate holding member, a rib may be provided as shown as an example in the sixth reference example, or a rectangular triangular prism may be used.

[Second Embodiment] FIG. 19 is a view showing an intermediate holding member used in a member mounting structure and a member mounting apparatus according to a second embodiment of the present invention. This mounting device is the same as that of the sixth embodiment shown in FIG. 1, and is applied to a mounting device for a solid-state imaging device.

As shown in FIG. 19, in the second embodiment, the intermediate holding member 23 has two adhesive surfaces so as to be perpendicular to both the solid image pickup device-side adhesive surface and the holding member-side adhesive surface. Ribs 23h are provided at both ends. Then, as shown in FIG. 17, it is arranged to fix the frame 21 and the solid-state imaging device 22, and ultraviolet rays are irradiated from the direction of the arrow U in FIG. 19 to cure the ultraviolet curing adhesive. At this time, the amount of ultraviolet light per unit area that passes through the flat portions 23e and 23f of the intermediate holding member 23 is the same as that of the L-shaped intermediate holding member without the rib 23h (for example, see FIGS. 2 and 3). For this reason, uneven curing of the ultraviolet-curable adhesive hardly occurs. Moreover, from the viewpoint of strength, the provision of the ribs 23h makes the shape more resistant to external force and vibration than the L-shaped intermediate holding member without the ribs 23h.

As described above, according to the second embodiment, the ribs 23h, which are perpendicular to both the bonding surfaces of the intermediate holding member (the second bonding surface B and the first bonding surface A), are provided at both ends of the bonding surface. ,
The same strength as that of forming the intermediate holding member 23 into a triangular prism shape can be obtained, and further, the bonding surface can be formed in a flat plate shape, whereby the amount of transmitted ultraviolet light when the adhesive is fixed can be made constant. External force,
A structure for mounting a solid-state imaging device that is resistant to vibration can be provided.

[Third Embodiment] FIGS. 20, 22 to 25 show a third embodiment of a member mounting structure and a member mounting device according to the present invention. Applied to the device.

FIG. 20 shows an example of the third embodiment, and FIG.
Reference numeral 1 is a reference example. As shown in FIGS. 20 and 21, after all the adjustments are completed and the adhesive is cured, the frame 21 is attached to the housing 270 by using fixing means 271 such as screws. The fixing means 271 usually has two or more fixing positions 272 for stably fixing the frame 21.
At this time, the frame 21 is restrained by the fixing means 271 at the plane 278 where the frame 21 and the fixing means 271 are in contact.

As shown in FIG. 24 which is an enlarged view of a main part of FIG. 20, two arbitrary fixed positions 272 are provided on the frame 21.
Between any point in each of the two planes 278 that constrain
79 can be formed.

As shown in FIG. 20, the first bonding surface A for bonding the intermediate holding member 23 and the frame 21 has a straight line 279.
Are extended in a direction parallel to the case fixing direction 275 and are arranged in a plane 276 obtained.

Further, as shown in FIG. 25 which is an enlarged view of a main part of FIG. 21, arbitrary points in a plane 278 for restricting three or more fixed positions 272 are connected by a straight line 281 to form a plane 282. Will be formed.

As shown in FIG. 21, the first bonding surface A for bonding the intermediate holding member 23 and the frame 21 has a flat surface 282.
Are extended in a direction parallel to the case fixing direction 275 and are arranged in a space 277 obtained.

Here, when the first bonding surface A for bonding the intermediate holding member 23 and the frame 21 is located outside the space 277, as shown in FIG. When approximating a model having a typical beam shape, the fixed position 272 is changed to the fixed position 272 ′ of the beam model and the frame 21−.
The system consisting of the intermediate holding member 23 and the solid-state imaging device 22 is
It approximates to 79 and appears as a cantilever model.

When the structure shown in FIG. 20, which is an example of the mounting structure of the solid-state imaging device according to the third embodiment, is similarly approximated to a beam-shaped model, it is represented as a fixed-end beam model as shown in FIG. Here, if the strength and the weight of the beam portion of both models are equal, the fixed-both-end model is stronger in strength and has a higher natural frequency than the cantilever beam model.

According to the third embodiment, the frame 2
As shown in FIG. 25, the first bonding surface A for bonding the first holding member 23 and the intermediate holding member 23 has a fixing member 271 mounted on any two fixing points 272 for mounting the frame 21 to the housing 270. A straight line 279 formed by connecting any two points in each of the constraining planes 278 is
Position at which it intersects with a plane 276 obtained by extending in a direction parallel to the mounting direction
A straight line 281 is formed between arbitrary points in each plane 278 in which the frame 21 is constrained by fixing members 271 attached to three or more fixing points 272 for attaching the frame 21 to the housing 270.
Inside the space 2 obtained by extending the plane 282 formed by joining in the direction parallel to the mounting direction 275 to the housing 270.
By forming the solid-state imaging device at 77, the system including the frame, the intermediate holding member, and the solid-state imaging device can be regarded as a beam whose both ends are fixed when viewed as a vibration model. The strength of the part is increased, and the vibration resistance is improved.

[Fourth Embodiment] FIGS. 26 to 28 are views showing a fourth embodiment of the mounting structure of the solid-state image pickup device mounting structure according to the present invention. The mounting structure is a copying machine, a facsimile apparatus, and a scanner apparatus. And the like.

First, the configuration will be described. 26 to 28, reference numeral 21 denotes a frame (imaging lens holding member);
This frame 21 is formed in a planar shape.

A V-groove 24 is formed in the frame 21, and an imaging lens 25 is positioned in the V-groove 24. The image forming lens 25 converts the image of the original into each pixel line 2 provided for each RGB of the photoelectric conversion element 22 such as a CCD.
Images are formed on the frames 2a, 22b, and 22c, and are fixed to the frame 21 by a lens holder 26. A screw hole 27 is formed in the frame 21, and a bolt (not shown) is inserted into an insertion hole 26 a formed in the lens presser 26, and the bolt 27 is screwed into the screw 27. 21.

The solid-state imaging device 22 is a pixel line 2 having a photoelectric conversion element built in the surface of a main body 32 made of ceramics.
2a, 22b, and 22c are arranged in a straight line, and a cover glass (a portion shown by oblique lines in FIG. 27C) that covers the pixel lines 22a to 22c is attached to the surface of the main body 32. A pair of intermediate holding members 23 are attached to both ends of the main body 32 excluding the cover glass 33, and the main body 32 is arranged such that the pixel lines 22 a, 22 b, and 22 face the imaging lens 25 by the intermediate holding members 23. Are supported by the protruding portion 21a of the frame 21.

In FIG. 27, reference numeral 28 denotes an optical axis, which corresponds to the Z direction on the coordinates. The X-axis direction is a main scanning direction in the image reading device, and the Y-axis direction is a sub-scanning direction.

A terminal 34 is provided on the back surface of the main body 32. A circuit board 29 is attached to the terminal 34. The circuit board 29 drives the solid-state image pickup device 22 while forming an optical image. The electric output signal of the solid-state imaging device 22 accompanying the above is electrically processed and then transmitted to the image reading device.

On the other hand, the intermediate holding member 23 is formed in an L-shape, and is made of a material through which ultraviolet rays pass.
The intermediate holding member 23 is made of an ultraviolet-curable adhesive 30, 31.
The projection 21a and the cover glass 33, respectively.
Is fixed to the ceramic surface of the main body 32 excluding
A bonding surface (hereinafter, referred to as a first bonding surface) A between the protrusion 21a and the intermediate holding member 23 is a pixel line 2 of the solid-state imaging device 22.
2a to 22c and a plane parallel to the optical axis 28, and an intermediate surface such that an adhesive surface (hereinafter, referred to as a second adhesive surface) B between the solid-state imaging device 22, the main body 32, and the intermediate holding member 23 is orthogonal to the optical axis 28. The holding member 23 is disposed between the protrusion 21 a and the ceramic surface on the surface of the main body 32.

Next, a method for adjusting the position of the solid-state imaging device 22 will be described. First, adhesives 30 and 31 are applied to two orthogonal surfaces A and B of the intermediate holding member 23 by a solid-state imaging device mounting device (not shown). At this time, while monitoring the film thickness of the adhesives 30 and 31 with a camera (not shown), the film thickness of the adhesives 30 and 31 is adjusted to be constant, and then the ceramic surface of the main body 32 is attached to the intermediate holding member by the mounting device. 23, and the intermediate holding member 23 is attached to the protrusion 21a.

Next, the line image formed by the image forming lens 25 is positioned on the solid-state image pickup device 22, and the optical characteristics (focus, magnification, etc.) are read with a predetermined required accuracy. At this time, the position of the solid-state imaging device 22 is adjusted while outputting the data photoelectrically converted by the solid-state imaging device 22 on a monitor.

First, after the frame 21 is fixed to the mount of the mounting device, when adjusting the position in the X-axis direction, the intermediate holding member 23 is gripped by a chuck or the like to hold the intermediate holding member 2.
3 is adjusted so as to slide on the adhesive 30.

When adjusting the position of the β axis around the Y axis, the intermediate holding member 23 is gripped by a chuck or the like, and the intermediate holding member 23 is slid on the adhesive 30.

When adjusting the position in the Y-axis direction, the circuit board 29 and the intermediate holding member 23 are gripped by a chuck or the like so that the solid-state image sensor 22 and the intermediate holding member 23 slide on the adhesive 31 at the same time. And adjust.

When adjusting the position in the Z-axis direction, the intermediate holding member 23 is gripped by a chuck or the like so that the solid-state imaging device 22 slides on the adhesive 30 at the same time.

Further, when adjusting the position of the γ-axis around the Z-axis, the circuit board 29 and the intermediate holding member 23 are gripped by a chuck or the like, and the solid-state image pickup device 22 and the intermediate holding member 2 are held.
3 is adjusted so as to slide on the adhesive 31 at the same time.

In the present embodiment, the intermediate holding member 23 is mounted on the frame 2 so that the first bonding surface A and the second bonding surface B are perpendicular to each other.
1 and the solid-state imaging device 22, X,
The individual movements of Y, Z, β, and γ can be performed independently for each axis, and the movement for sliding and adjusting the intermediate holding member 23 and the solid-state imaging device 22 can be made to coincide with the rectangular coordinates.

Here, the reason why the adjustment about the rotation axis about the X axis is not performed is that the Y and Z axes are the pixel lines 22a to 22a.
Γ, β around the Y and Z axes.
If the axis is not adjusted, the distance between the imaging lens 25 and the solid-state imaging device 22 differs for each pixel, and the accuracy of the optical characteristics is reduced. On the other hand, the X axis is the pixel lines 22a to 22a.
Since it is coaxial (parallel) with c, the distance between the imaging lens 25 and the solid-state imaging device 22 does not differ for each pixel without adjustment about the X axis, and is not affected by optical characteristics. That's why.

When the position of the solid-state imaging device 22 is adjusted as described above and it is determined from the output of the monitor that the optical characteristics satisfy the required accuracy, the adhesive is irradiated with an ultraviolet light (not shown). The adhesives 30 and 31 are cured by irradiating ultraviolet rays simultaneously through the intermediate holding member 23 over the entire area where the adhesives 30 and 31 are attached and from the direction perpendicular to the adhesive surface.

As described above, in the present embodiment, the frame 21
The first bonding surface A between the solid-state imaging device 2 and the intermediate holding member 23 is
2 and the intermediate holding member 23 so that the second adhesive surface B between the surface of the solid-state image sensor 22 and the intermediate holding member 23 is orthogonal to the optical axis 28. Is arranged so that the position adjustment in the direction of the axis around the X axis is not positively performed, so that X, Y,
Only the five axis directions of Z, β, and γ can be easily adjusted.

After the five-axis adjustment, the solid-state image sensor 22
The thickness of the adhesives 30 and 31 bonded to the first bonding surface A and the second bonding surface B is minimized and fixed by the amount that the intermediate holding member 23 is interposed between the first bonding surface A and the second bonding surface B. Only the position of the solid-state image sensor 22 and the frame 21
The solid-state imaging device 22 can be mounted with high precision without strictly controlling the positional accuracy of the bonding portion of the solid-state imaging device, the yield can be increased, and the solid-state imaging after production (after curing of the adhesive) can be performed. It is possible to prevent a decrease in the fixing force of the element 22 from occurring.

The adhesives 30 and 31 are made of an ultraviolet-curing adhesive, and the intermediate holding member 23 is made of a material that transmits ultraviolet light. Since the irradiation can be performed, ultraviolet rays can be simultaneously irradiated on the entire area of the bonding portion and from the direction perpendicular to the bonding surface, so that the time until the adhesives 30 and 31 are hardened is further reduced, and the productivity is reduced. Can be improved.

The thickness of the adhesives 30, 31 is preferably as thin as possible in order to reduce the influence of curing shrinkage.
However, actually, the solid-state imaging device 22, the frame 21
In addition, it is necessary to set a thickness sufficient to fill the difference between the unevenness of the plane according to the flatness of the solid-state imaging device 22.

In this embodiment, the cover glass 33 is used.
Although the intermediate holding members 23 are attached to both ends of the main body 32 except for the above, the present invention is not limited to this, and the intermediate holding members 23 may be attached to the back surface of the main body 32. In this case, FIG.
The holding surface 23e of the intermediate holding member 23 shown in (a) may be interposed between the circuit board 29 and the main body 32.

In addition, as shown in FIG. 28A, the intermediate holding members 23 may be attached to both ends of the cover glass 33, and as shown in FIG.
The intermediate holding member 23 may be attached to the surface of the device. Even in this case, it goes without saying that the same effects as those described above can be obtained.

[Fifth Embodiment] FIGS. 29 to 30 show a fifth embodiment of a member mounting structure and a member mounting apparatus according to the present invention. Applied.

FIG. 29 shows a fifth embodiment according to the present invention.
FIG. 30 is an exploded perspective view illustrating an example of a mounting structure of a solid-state imaging device. FIG. 30 is a perspective view illustrating an example of a mounting structure of a solid-state imaging device according to a fifth embodiment of the present invention. This mounting structure is applied to an image reading device such as a copying machine, a facsimile device, a scanner device, and the like.

First, the component configuration of the mounting device to which the mounting structure is applied will be described. As shown in FIGS. 29 and 30, in the mounting device for the solid-state imaging device 22, the imaging lens 22, the first bonding surface A and the second bonding surface B are perpendicular to each other, and both surfaces are parallel to the pixel line. , A circuit board 29 on which the solid-state imaging device 22 is held, a groove 24 for mounting the imaging lens 25, and a screw hole 27 for fixing the lens holder 26. And the bonding surface 21a parallel to the pixel line and the optical axis of the photoelectric conversion element of the solid-state imaging device 22
5. A frame 21 which is an imaging lens holding member provided two on the side opposite to the installation side, and a lens holder 26 which is a band for fixing the imaging lens 25 to the groove 24 of the frame 21.
And a spacer 307 fixed to the circuit board 29 by a detachable means. As shown in FIGS. 29 and 30, the shape of the spacer 307 is an integrated shape that is continuous at a plurality of bonding locations. The frame 21 and the spacer 307 are made of a material having the same linear expansion coefficient, and the circuit board 29 has a lower rigidity than the spacer 307.

According to the embodiment shown in FIGS. 29 and 30, when an environmental temperature change occurs, the frame 21 and the spacer 307 are changed.
Since the linear expansion coefficients of
No stress is generated between the adhesive layers of the two intermediate holding members 23,
No delamination occurs. The linear expansion coefficient of the circuit board 29 is
Since the extension is not the same as the spacer 307, a difference in the extension amount occurs. However, since the rigidity of the circuit board 29 is weaker than the rigidity of the spacer 307, it follows the extension amount of the spacer 307. , Frame 21
The reliability of the adhesive force between the spacer 6 and the spacer 307 is maintained.

FIG. 31 is a perspective view showing another example of the fifth embodiment of the present invention. In the example of FIG. 31, the same parts as those of the example of FIG. 30 are denoted by the same reference numerals, and description thereof will be omitted. As shown in FIG. 31, the spacer 307 has a separate structure at a plurality of bonding locations. Further, the frame 21 and the spacer 307 have the same coefficient of linear expansion using the same material.

According to this configuration, when an environmental temperature change occurs, since the linear expansion coefficient of the frame 21 and the circuit board 29 is the same, the extension amount is equal and the distance between the adhesive layers of the two intermediate holding members 23 is equal. Is not generated, the reliability of the adhesive force between the frame 21 and the circuit board 29 is maintained.

Also, as shown in FIG.
7. The shape of 7 is a separate structure at a plurality of bonding points, and
It is also possible to use a material having a different coefficient of linear expansion between the frame 21 and the circuit board 29, and to make the rigidity of the circuit board weaker than that of the frame.

According to this configuration, when an environmental temperature change occurs, the linear expansion coefficient of the frame 21 differs from that of the circuit board 29, so that a difference occurs in the extension amount. However, since the rigidity of the circuit board 29 is weaker than the rigidity of the frame 21, the circuit board 29 follows the extension of the frame 21. For this reason,
The position of the solid-state imaging device 22 does not change, and the reliability of the adhesive force between the frame 21 and the circuit board 529 is maintained.

FIGS. 32 to 34 are cross-sectional views showing a structure for mounting the circuit board 29 and the spacer 307 in the fifth embodiment. As shown in FIG. 32, in this mounting structure,
The circuit board 29 and the spacer 307 are attached via screws 308.

According to this mounting structure, even if a defective product is produced in the mounting process of the solid-state imaging device, the spacer 30
The circuit board 29 having the solid-state imaging device 22 can be removed from the spacer 307 by reusing the screws 308 fixing the circuit board 7 to the circuit board 29 and reused.

As shown in FIG. 33, in this mounting structure, the circuit board 29 and the spacer 307 are mounted via a patch stop 309. According to this mounting structure, even if a defective product is produced in the mounting process of the solid-state image sensor, the patch buckling portion 309 fixing the spacer 307 to the circuit board 29 is removed.
7, the circuit board 29 having the solid-state image sensor 22 can be removed and reused. As shown in FIG.
In this mounting structure, the circuit board 29 and the spacer 307 are mounted via the heat welding part 310.

According to this mounting structure, even if a defective product is produced in the mounting process of the solid-state imaging device, the spacer 30
7 is fixed to the circuit board 29 by cutting the heat-welded portion 310 so that the solid-state image sensor 22
Can be removed and reused.

[Sixth Embodiment] FIGS. 35 to 37 are views showing a sixth embodiment of a member mounting structure and a member mounting device according to the present invention. Applied.

The sixth embodiment is different from the sixth embodiment shown in FIGS.
The spacer part is different from that of the embodiment 0, and the other configurations are the same. As shown in FIGS. 35 and 36, the spacer 307 is disposed so as to surround the solid-state imaging device 22 at the opening thereof, and is attached to the solid-state imaging device 22 by a fixing screw 308 which is a detachable fixing means. Spacer 307
The intermediate holding member 2 is bonded to the intermediate holding member 2 in the same manner as the structure shown in FIGS. In the structure of this embodiment, the frame 21, the spacer 307, and the intermediate holding member 23 are formed of members having the same linear expansion coefficient. FIG. 37 is FIG.
30 shows an intermediate holding member similar to that used in FIG.

According to the above configuration, even if a defective product is produced in the process of mounting the circuit board 29 having the solid-state image sensor 22, the fixing screw 308 for the circuit board 29 having the solid-state image sensor 22 is loosened from the defective product. Thus, the circuit board 29 having the solid-state imaging device 22 can be reused.

Further, since the members having the same linear expansion coefficient are formed, even when the environmental temperature changes, no stress is generated on the bonding surface and no peeling occurs, so that the reliability of the bonding force is maintained. It also has the advantage of being

As shown in FIG. 36, after the intermediate holding member 23 and the frame 21 and the intermediate holding member 23 and the spacer 307 are positioned in the mounting process of the solid-state imaging device,
If the characteristics of the standard cannot be obtained after the bonding and fixing, the circuit board 29 having the solid-state image sensor 22 can be removed from the spacer 307 by loosening the screw 308 fixed to the solid-state image sensor 22 and reused. it can.

[Seventh Embodiment] FIGS. 38 to 41 are views showing a seventh embodiment of a member mounting structure and a member mounting apparatus according to the present invention. Applied.

FIGS. 38 and 39 are structural views showing the seventh embodiment. FIG. 38 is an exploded perspective view and FIG. 39 is a perspective view. FIG. 40 is an enlarged perspective view around the solid-state imaging device, and FIG. 41 is a front view of the solid-state imaging device. The seventh embodiment is different from the above-described embodiments of FIGS. 29 and 30 in the portion related to the adhesion of the intermediate holding member, and the other configuration is the same.

As shown in FIGS.
Is characterized in that the bonding position is on an extension of the pixel line of the solid-state imaging device 22 and is located at a distance of the adjustment margin 320 of the solid-state imaging device 22 from the end of the solid-state imaging device.

As shown in FIGS. 40 and 41, the intermediate holding member 23 used for bonding the circuit board 29 is located on an extension of the pixel line 22a of the solid-state image sensor 22 and in the main scanning direction. Is arranged at a position where the adjustment margin 320 can be secured. The bonding surface of the circuit board 29 is a solder coat surface 321, and the solder coat surface 321 is located at a position where the intermediate holding member 23 is disposed, and its area is for adjusting the solid-state imaging device 22 in the main scanning direction and the sub-scanning direction. It is configured to be able to secure. Reference numeral 22d indicates the bonding position.

When adjusting the solid-state image sensor 22, it is necessary to hold the solid-state image sensor 22. FIG. 42 is a configuration diagram for holding the solid-state imaging device. When adjusting the positions of the imaging lens 25 and the solid-state imaging device 22 attached to the frame 21 so as to secure desired optical characteristics, the position of the solid-state imaging device 22 is moved while holding the solid-state imaging device 22. Make adjustments by: At this time, a chuck unit 401 provided in a CCD position adjuster (not shown)
402 holds the solid-state imaging device 22.

When the bonding position of the circuit board 29 is
2 and is located at a position close to the end of the solid-state image sensor, even if the circuit board 29 is deformed by heat or vibration, as shown in FIG. Since the amount of displacement does not occur with respect to the position, a target optical characteristic value can be guaranteed.

On the other hand, in FIG. 44, since the bonding position of the circuit board 29 is far from the end of the solid-state image sensor,
As shown in FIG. 44, when the circuit board 29 is deformed due to heat, vibration, or the like, an amount of variation with respect to the pixel position of the solid-state imaging device 22 occurs, so that a target optical characteristic value cannot be guaranteed.

FIG. 45 is a front view of another example of the solid-state imaging device. In the drawing, reference numeral 22f indicates an area having a mounting height of 1 mm or less. Note that the present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the gist of the present invention.

[0204]

According to the first to third aspects of the present invention, the first bonding surface between the imaging lens holding member and the intermediate holding member is a surface parallel to the pixel lines and the optical axis of the solid-state imaging device. By arranging the intermediate holding member so that the second adhesive surface between the front or back surface of the solid-state imaging device and the intermediate holding member is a surface orthogonal to the optical axis, position adjustment in the direction of the axis around the X axis is actively performed. X, Y, Z, β, γ
Can be easily adjusted only in the five axis directions.

After the five-axis adjustment, only the intermediate holding member interposed between the solid-state imaging device and the imaging lens holding member is bonded to the bonding surface of the solid-state imaging device and the bonding surface of the intermediate holding member. The thickness of the adhesive to be adhered to the adhesive surface of the imaging lens holding member and the adhesive surface of the intermediate holding member is minimized, and is only required to be kept constant. The solid-state imaging device can be mounted with high accuracy without strictly controlling the positional accuracy of the bonding portion of the solid-state imaging device holding member, and the yield can be increased, and after production (after curing of the adhesive). 2) It is possible to prevent the fixing force of the solid-state imaging device from decreasing.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining a reference example.

FIGS. 2A and 2B are diagrams showing a first reference example of a mounting structure of a member of a solid-state imaging device, where FIG. 2A is a perspective view and FIG. 2B is a side view.

FIG. 3A is a diagram illustrating a connection relationship between a frame, an intermediate holding member, and a solid-state imaging device according to a first reference example, and FIG. 3B is a schematic front view of the solid-state imaging device.

4A is a diagram illustrating another connection relationship between the frame, the intermediate holding member, and the solid-state imaging device according to the first reference example, and FIG. 4B is a diagram illustrating another shape of the intermediate holding member.

5A is a diagram illustrating another connection relationship between the frame, the intermediate holding member, and the solid-state imaging device according to the second reference example, and FIG. 5B is a cross-sectional view taken along line OO ′ of FIG.

6A is a diagram illustrating another connection relationship between a frame in which the solid-state imaging device of the second reference example is directly attached to a detachable holding member, an intermediate holding member, and a solid-state imaging device; FIG. It is sectional drawing of PP 'of FIG.

FIG. 7 is a diagram for explaining an adjustment width when the solid-state imaging device according to the third reference example is attached to an intermediate holding member.

FIG. 8 is a diagram illustrating another connection relationship between the frame, the intermediate holding member, and the solid-state imaging device according to the third reference example;

FIG. 9 is a cross-sectional view illustrating a connection relationship between an intermediate holding member and a solid-state imaging device according to a third reference example.

10A and 10B are diagrams illustrating another connection relationship between the frame, the intermediate holding member, and the solid-state imaging device according to the fourth reference example, where FIG. 10A is a top view and FIG. 10B is a side view.

FIG. 11 is a side view of the solid-state imaging device mounting device according to the first embodiment of the present invention.

FIG. 12 is a block diagram of a control unit according to the first embodiment of the present invention.

FIG. 13 is a flowchart showing the operation of the first embodiment according to the present invention.

FIG. 14 is a perspective view showing a fifth reference example of the mounting structure of the members of the solid-state imaging device.

FIG. 15 is a side view showing a fifth reference example of the mounting structure of the members of the solid-state imaging device.

FIG. 16 is an enlarged view of a main part of FIG.

17A and 17B are diagrams illustrating a connection relationship between a frame, an intermediate holding member, and a solid-state imaging device according to a sixth reference example, where FIG. 17A is a top view, FIG. 17B is a side view, and FIG. FIG. 6 is a view showing a state where the sheet is adhered to a sheet.

FIG. 18 is a view showing the arrangement of an intermediate holding member, and FIG.
Indicates a case where the components are arranged in parallel, and FIG.

FIG. 19 is a view showing an intermediate holding member used in a member mounting structure and a member mounting device according to a second embodiment of the present invention.

FIG. 20 is an exploded perspective view showing an example of a third embodiment of a member mounting structure and a member mounting device according to the present invention.

FIG. 21 is an exploded perspective view showing another example of the seventh embodiment of the member attachment structure and the member attachment device.

FIG. 22 is a model diagram of a beam shape when a first bonding surface for bonding an intermediate holding member and a holding member is located outside a space;

FIG. 23 is a beam shape model diagram when the structure of FIG. 20 which is an example of the mounting structure of the solid-state imaging device according to the third embodiment or FIG. 21 which is another example is similarly approximated to a beam shape model. is there.

FIG. 24 is an enlarged view of a main part of FIG. 20;

FIG. 25 is an enlarged view of a main part of FIG. 21.

26A and 26B are diagrams showing a fourth embodiment of the mounting structure of the solid-state imaging device according to the present invention, wherein FIG. 26A is an exploded perspective view of the mounting structure, and FIG. 26B is a perspective view of the mounting structure.

FIG. 27A is a side view of a mounting structure according to a fourth embodiment, FIG. 27B is a diagram showing a connection relationship between a frame, an intermediate holding member, and a solid-state imaging device, and FIG. 27C is a schematic diagram of the solid-state imaging device; It is a front view.

28A is a perspective view of another mounting structure, and FIG. 28B is a perspective view of another mounting structure different from FIG.

FIG. 29 is an exploded perspective view showing an example of a solid-state imaging device mounting structure according to a fifth embodiment of the present invention.

FIG. 30 is a perspective view showing an example of a mounting structure of a solid-state imaging device according to a fifth embodiment of the present invention.

FIG. 31 is a perspective view showing another example of the fifth embodiment of the present invention.

FIG. 32 is a cross-sectional view illustrating a first example of a mounting structure of a circuit board and a spacer according to a fifth embodiment.

FIG. 33 is a cross-sectional view illustrating a second example of the mounting structure of the circuit board and the spacer according to the fifth embodiment.

FIG. 34 is a cross-sectional view showing a third example of the mounting structure of the circuit board and the spacer in the fifth embodiment.

FIG. 35 is a perspective view illustrating an example of a mounting structure of a solid-state imaging device according to a sixth embodiment of the present invention.

FIG. 36 is an enlarged view showing a main part of FIG. 35;

FIG. 37 is a perspective view of an intermediate holding member used in the embodiment shown in FIGS.

FIG. 38 is an exploded perspective view illustrating an example of a mounting structure of a solid-state imaging device according to a seventh embodiment of the present invention.

FIG. 39 is a perspective view of the same.

FIG. 40 is an enlarged perspective view around the solid-state imaging device of FIGS. 38 and 39;

FIG. 41 is a front view showing an example of a solid-state imaging device attached to a substrate.

FIG. 42 is a configuration diagram for holding a solid-state imaging device.

FIGS. 43 (a) and 43 (b) are diagrams showing an operation of the solid-state imaging device mounting structure according to the seventh embodiment, wherein FIG. 43 (a) is before deformation and FIG. 43 (b) is after deformation.

44A and 44B are diagrams illustrating an operation of a reference example of a mounting structure of a solid-state imaging device, wherein FIG. 44A illustrates a state before deformation and FIG.

FIG. 45 is a front view showing another example of the solid-state imaging device attached to the substrate.

FIG. 46 is a diagram showing an optical positional relationship between a conventional object, an imaging lens, and a solid-state imaging device.

FIG. 47 is a diagram illustrating five-axis coordinates of a conventional solid-state imaging device and an imaging lens.

FIG. 48 is a schematic front view of a conventional solid-state imaging device.

FIGS. 49 (a) and (b) are views showing a conventional procedure for mounting a work.

FIG. 50 is a model diagram of a conventional filling and bonding method;
(A) is a top view thereof, and (b) is a cross-sectional view taken along line HH of FIG.

[Description of Signs] 21 Frame (first member, imaging lens holding member) 22 Solid-state image sensor (second member, disposing member) 22a to 22c Pixel line (operating member) 23 Intermediate holding member 25 Imaging lens 28 Light Shaft 29 Circuit board / CCD circuit board (substrate) 30, 31 UV-curable adhesive 50 Detachable support member 60a, 60b Through hole 81 Light source 82 Chart (position adjustment image) 84 Fixed base (fixing work section)

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Shio Kanaya 1-3-6 Nakamagome, Ota-ku, Tokyo Inside Ricoh Co., Ltd. (72) Inventor Hiroshi Takemoto 1-3-6 Nakamagome, Ota-ku, Tokyo F-term (reference) in Ricoh Company, Ltd. EA05 FA05 XA01

Claims (3)

[Claims] 1. An imaging lens holding member to which an imaging lens is fixed, and a pixel line composed of a photoelectric conversion element are arranged in a straight line, and a cover glass covering the photoelectric conversion element on a front surface and a cover glass formed on a rear surface. A solid-state imaging device having a terminal connectable to the circuit board, and an intermediate holding member that supports the solid-state imaging device so as to face the imaging lens, wherein the imaging lens holding member and the intermediate holding member And a solid-state imaging device, wherein the solid-state imaging device and the intermediate holding member are fixed with an adhesive, and a first bonding surface between the imaging lens holding member and the intermediate holding member. Is a plane parallel to the pixel line and the optical axis of the solid-state imaging device, and the second bonding surface between the front or back surface of the solid-state imaging device and the intermediate holding member is a surface orthogonal to the optical axis. A mounting structure for a solid-state imaging device, wherein the intermediate holding member is disposed so as to be as follows. 2. The mounting structure for a solid-state imaging device according to claim 1, wherein the second adhesive surface of the solid-state imaging device is a cover glass of the solid-state imaging device. 3. A mounting structure for a solid-state imaging device according to claim 1, wherein a terminal provided on a back surface of said solid-state imaging device is connected to a circuit board, and said two bonding surfaces are formed on said circuit board.