JP3916366B2 - チップ熱圧着ツール及びそれを備えたチップ実装装置 - Google Patents
チップ熱圧着ツール及びそれを備えたチップ実装装置 Download PDFInfo
- Publication number
- JP3916366B2 JP3916366B2 JP2000074710A JP2000074710A JP3916366B2 JP 3916366 B2 JP3916366 B2 JP 3916366B2 JP 2000074710 A JP2000074710 A JP 2000074710A JP 2000074710 A JP2000074710 A JP 2000074710A JP 3916366 B2 JP3916366 B2 JP 3916366B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- indenter
- chip
- holder
- thermocompression bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 claims description 225
- 230000007423 decrease Effects 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 230000003247 decreasing effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000007664 blowing Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052575 non-oxide ceramic Inorganic materials 0.000 description 1
- 239000011225 non-oxide ceramic Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000074710A JP3916366B2 (ja) | 1999-03-16 | 2000-03-16 | チップ熱圧着ツール及びそれを備えたチップ実装装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-70229 | 1999-03-16 | ||
| JP7022999 | 1999-03-16 | ||
| JP2000074710A JP3916366B2 (ja) | 1999-03-16 | 2000-03-16 | チップ熱圧着ツール及びそれを備えたチップ実装装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000332061A JP2000332061A (ja) | 2000-11-30 |
| JP2000332061A5 JP2000332061A5 (enrdf_load_stackoverflow) | 2005-07-07 |
| JP3916366B2 true JP3916366B2 (ja) | 2007-05-16 |
Family
ID=26411400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000074710A Expired - Fee Related JP3916366B2 (ja) | 1999-03-16 | 2000-03-16 | チップ熱圧着ツール及びそれを備えたチップ実装装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3916366B2 (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6821381B1 (en) | 1999-03-16 | 2004-11-23 | Toray Engineering Co., Ltd. | Tool for thermo-compression-bonding chips, and chip packaging device having the same |
| WO2002041385A1 (fr) * | 1999-03-16 | 2002-05-23 | Toray Engineering Co., Ltd. | Outil pour lier les puces par compression thermique et dispositif d'encapsulation de puces muni de cet outil |
| AT414079B (de) * | 2002-12-20 | 2006-08-15 | Datacon Semiconductor Equip | Einrichtung zum positionieren |
| AT412603B (de) * | 2003-03-12 | 2005-04-25 | Datacon Semiconductor Equip | Einrichtung zum verbinden von elektronischen schaltungen |
| JP4941305B2 (ja) | 2005-10-12 | 2012-05-30 | 株式会社村田製作所 | 接合装置 |
| JP6106320B2 (ja) * | 2016-06-24 | 2017-03-29 | 東レエンジニアリング株式会社 | 実装装置 |
| CN115394689B (zh) * | 2022-09-05 | 2023-09-01 | 江苏富乐华功率半导体研究院有限公司 | 一种功率半导体器件热压烧结装置 |
-
2000
- 2000-03-16 JP JP2000074710A patent/JP3916366B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000332061A (ja) | 2000-11-30 |
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