JP3916366B2 - Chip thermocompression bonding tool and chip mounting apparatus including the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a chip thermocompression bonding tool and a chip mounting apparatus including the tool.
[0002]
[Prior art]
Conventionally, various types of chip thermocompression bonding tools used for thermocompression bonding, that is, mounting a chip on various substrates such as a liquid crystal substrate are known. As one of them, for example, as disclosed in JP-A-7-86341, a chip thermocompression bonding in which a ceramic holder is attached to the lower end of the tool body and a ceramic heater and a ceramic indenter are attached to the lower end of the ceramic holder. Tools.
[0003]
[Problems to be solved by the invention]
However, in this type of chip thermocompression bonding tool, the ceramic holder, ceramic heater and ceramic indenter are integrated (adherence between the three) using a suitable adhesive. Due to differences in thermal expansion due to thickness non-uniformity, deterioration of the adhesive over time, etc., or because the adhesive generally has a low thermal conductivity, the temperature difference generated between the two sandwiching it Due to thermal deformation strain caused by the above, the parallelism of the ceramic indenter (the parallelism between the processed surface and the substrate or the substrate holding stage) or the flatness (the flatness of the processed surface). Is simply referred to as parallelism, but it has a drawback that it is easy to change over time and is not constant.
[0004]
In addition, since the tool main body is made of metal, the tool main body and the ceramic holder are fixed by bolting, but the bolting is loosened due to repeated heating and cooling of this part, or The parallelism of the ceramic indenter easily changed due to the heat conduction to the parallelism adjusting mechanism mounted on the upper end of the tool body.
[0005]
In addition, the parallelism of the ceramic indenter is regarded as a problem particularly in mounting where accuracy in units of microns is required, and if it is not kept constant within the specification, chip deviation or the like occurs during mounting, for example, It becomes difficult to mount with high accuracy of several μm or less.
[0006]
In view of this, the present inventors have proposed a thermocompression bonding tool in which a ceramic holder, a ceramic heater, and a ceramic indenter are sintered in a prior application (Japanese Patent Application No. 9-282618). Since the effect of heat conduction is not taken into consideration, the ceramic holders etc. will thermally expand to different states and become distorted as they are mounted one after the other, and the tool body will also be affected by heat transfer from the ceramic heater. Similarly, distortion occurs when heated, so it is difficult to keep the parallelism of the chip thermocompression bonding tool constant within the specified range. Therefore, it is difficult to perform high-precision mounting constantly. Had. The present invention has been obtained as a result of intensive studies in order to eliminate such drawbacks.
[0007]
[Means for Solving the Problems]
That is, according to one of the thermocompression bonding tools according to the present invention, as described in claim 1, the ceramic holder is mounted on the lower end of the connection block mounted directly on the lower end of the tool body or on the lower end of the tool body. In a chip thermocompression bonding tool in which a ceramic holder and a T-shaped ceramic heater having a connection hole at the lower end of the ceramic holder are sintered, the linear expansion coefficient of the ceramic holder is T-shaped with the connection hole. The linear expansion coefficient of the ceramic heater and the ceramic indenter is approximately equal to each other, and the thermal conductivity of the ceramic indenter increases from the T-shaped ceramic heater having the connection hole toward the pressing surface on the tip side of the ceramic indenter. Grow,
The thermal conductivity of the ceramic holder decreases from the T-shaped ceramic heater having a connection hole toward the mounting surface on the base end side of the ceramic holder .
[0008]
As another aspect of the thermocompression bonding tool according to the present invention, as described in claim 7, the ceramic holder is mounted directly on the lower end of the tool body or on the lower end of the connection block mounted on the lower end of the tool body. In a chip thermocompression bonding tool in which a T-shaped ceramic heater and indenter having a connection hole at the lower end of the ceramic holder is sintered, the linear expansion coefficient of the ceramic holder has a T-shaped ceramic having the connection hole. substantially equal to the linear expansion coefficient of the heater also serves indenter, and the thermal conductivity of the ceramic holder, the mounting surface of the base end side of the T-shaped ceramic heater also serves indenter or found before Symbol ceramic holder having the connection hole it is characterized in that the small Kunar as directed.
[0009]
In addition, a chip mounting apparatus according to the present invention includes any one of the chip thermocompression bonding tools according to claims 1 to 9 as described in claim 10.
[0010]
In addition to the mounting device for mounting the chip and the bonding device for bonding the chip, the chip mounting device is such that, for example, the substrate and the chip, the substrate and the adhesive (ACF, NCF, etc.) contact each other in advance (mounting). Or a device having a broad concept including a device for fixing or transferring by heat-pressing what has been temporarily bonded or the like. Further, the substrate holding stage side may be either a heating type or a non-heating type.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
In FIG. 1 which is a front view and FIG. 2 which is a left side view of FIG. 1, the lower end portion of the chip thermocompression bonding tool is shown. The lower end portion of this tool is directly connected to the lower end of the metal tool body 1. A ceramic holder 2 (ceramic holder) is fixed with a plurality of bolts 3, and a ceramic heater 4 and a ceramic indenter 5 (ceramic indenter) are sintered at the lower end of the holder 2.
[0012]
The ceramic indenter 5 is provided with a temperature detecting means 31 (for example, a thermocouple, a radiation thermometer, etc.) so as to be controlled to a set temperature.
[0013]
That is, as shown in FIG. 3, the ceramic heater 4 is formed in a panel body having a predetermined thickness (for example, about 1 mm) in which the heat generating portion 6 and the terminal portion 7 are arranged in a T shape. The heating portion 6 of the heater 4 is inserted into a mounting recess 8 formed on the lower end surface of the ceramic holder 2 and sintered with the ceramic holder 2, and the upper end portion of the ceramic indenter 5 is also mounted. The ceramic holder 2 and the ceramic heater 4 are sintered by being inserted into the recess 8. The ceramic indenter 5 is provided with a temperature detecting means 31 (for example, a thermocouple, a radiation thermometer, etc.) so as to be controlled to a set temperature.
[0014]
The sintering is performed by heating at 1700 ° C. to 1800 ° C. under several thousand atmospheres with a binder mixed with silicon nitride powder, aluminum nitride powder, boron nitride powder or the like applied to the contact surface of each part. In this case, the ceramic holder 2, the ceramic heater 4, and the ceramic indenter 5 can be integrated. At this time, the heat generating portion 6 of the ceramic heater 4 and the upper end portion of the ceramic indenter 5 are Since it is inserted into the mounting recess 8, it can be firmly joined without causing a positional shift.
[0015]
Further, as shown in FIGS. 3 and 4 (longitudinal sectional view of the heat generating portion 6), the ceramic heater 4 is configured by covering a heating element 9 with a ceramic material 10 which is an electrical insulating material, and its terminals. The terminal 11 of the heating element 9 is projected from the portion 7 and the connection hole 12 is passed through the heat generation portion 6, and the connection hole 12 is connected to the ceramic indenter 5 as shown in FIG. The chip suction hole 13 penetrated through and the connection hole 14 penetrated through the ceramic holder 2 are connected.
[0016]
The ceramic holder 2, the ceramic material 10 of the ceramic heater 4 and the ceramic indenter 5 are made of a material obtained by adding a predetermined amount of glass or the like to silicon nitride, and the linear expansion coefficient of the ceramic holder 2 is determined by the ceramic heater. 4 and the ceramic indenter 5 have the same or substantially the same linear expansion coefficient, and their thermal conductivity is based on the pressing surface side of the ceramic indenter 5 with respect to the ceramic heater 4 (the surface side on which the chip suction holes 13 are opened). It is provided so that it is so large that it goes to the side, and it becomes so small that it goes to the attachment surface side of the ceramic holder 2 on the opposite side.
[0017]
More specifically, the linear expansion coefficient of the ceramic holder 2, the ceramic heater 4, and the ceramic indenter 5 is 2.5 to 3.0 (× 10 ⁻⁶ ) / ° C., and the thermal conductivity of the ceramic indenter 5 is 84 W / m · K, that of the ceramic holder 2 is 17 to 84 W / m · K.
[0018]
In the case where the ceramic heater combined with the ceramic heater and the ceramic indenter are mounted separately as described above, the linear expansion coefficient of the both is set to be the same or substantially the same. At the same time, the thermal conductivity is provided so as to decrease toward the ceramic holder mounting portion.
[0019]
In addition, as is well known, ceramic materials have silicon nitride or the like (main component) and glass or the like (additives) as components, but the thermal conductivity differs depending on the amount of glass mixed in. One having conductivity can be selected.
[0020]
Although the upper end of the connection hole 14 is not shown in FIG. 1, the connection hole 14 is connected to the connection hole 15 that is penetrated through the tool body 1. In this manner, the connection holes 12, 14, and 15 form the intake passage 16 that communicates with the chip suction hole 13. Therefore, air can be sucked from the chip suction hole 13 by sucking through the pressure hose 17 attached to the tool body 1, and therefore the chip (not shown) can be sucked and held by the ceramic indenter 5. it can.
[0021]
The ceramic holder 2 has a plurality of elongate cooling slits 18, a first air outlet passage 19, and a connection hole 20 (see FIG. 5) that pass through the ceramic holder 2. It is formed on the upper end surface of the heat generating part 6 of the heater 4, and its left and right ends are opened in FIG.
[0022]
Further, the connection hole 20 is connected to the first air blowing passage 19 and a connection hole 21 (see FIG. 5) penetrated through the tool body 1. Thus, the connection holes 20 and 21 form a first air supply passage 22 that communicates with the first air blowing passage 19.
[0023]
A pair of the first air supply passages 22 is provided as shown in FIG. Therefore, by supplying air through the pressure hose 23 (see FIG. 5) attached to the tool body 1, the air can be blown out from the openings at the left and right ends of the first air blowing passage 19 in FIG. .
[0024]
Therefore, the heat generated from the heat generating portion 6 of the ceramic heater 4 is taken away by the air, so that the ceramic heater 4 and the ceramic indenter 5 can be rapidly cooled and excessively conducted to the ceramic holder 2. In addition, the heated ceramic holder 2 can be cooled by the cooling slit 18 to prevent the joint between the ceramic holder 2 and the metal tool body 1 from being heated excessively. it can.
[0025]
Further, as shown in FIG. 2, a pair of second air outlet passages 24 are provided on the upper end surface of the ceramic holder 2. Since the second air supply passage 25, which is fastened and penetrated through the tool main body 1, is communicated with this, by supplying air via the pressure hose 26 attached to the tool main body 1 In FIG. 2, air can be blown from the openings at the front and rear ends of the second air blowing passage 24, and the joint between the ceramic holder 2 and the metal tool body 1 can be forcibly cooled.
[0026]
As described above, one of the chip thermocompression bonding tools according to the present invention bakes the ceramic holder 2, the ceramic heater 4, and the ceramic indenter 5 that are directly attached to the lower end of the metal tool body 1 having a low linear expansion coefficient. In addition, the coefficient of linear expansion of the ceramic holder 2 is equal to or substantially equal to the coefficient of linear expansion of the ceramic heater 4 and the ceramic indenter 5, and their thermal conductivity is determined by adding the ceramic indenter 5 with the ceramic heater 4 as a starting point. It is provided so as to increase toward the pressure surface side (surface side where the chip suction hole 13 is opened) and to decrease toward the attachment surface side of the ceramic holder 2 on the opposite side.
[0027]
When a ceramic heater / indenter in which the ceramic heater and the ceramic indenter are integrated is mounted, the linear expansion coefficients of both (the upper heater portion and the lower indenter portion) are the same or substantially the same. In addition to being provided, the thermal conductivity is provided so as to decrease toward the ceramic holder mounting portion.
[0028]
For this reason, the parallelism of the ceramic indenter 5 can be kept within a specified range for a long period of time even if the thermocompression bonding (mounting) is performed one after another by the bonding apparatus equipped with this chip thermocompression bonding tool. Can be implemented consistently.
[0029]
Although not shown, the chip mounting apparatus supports a substrate such as a liquid crystal substrate on a substrate holding stage mounted so as to be movable in a horizontal plane, and mounts the substrate by controlling the movement or rotation of the stage. The chip is precisely positioned with respect to the chip held by the chip thermocompression bonding tool mounted above it, and then the chip thermocompression bonding that holds the chip through the chip suction hole 13 The tool is lowered so that it can be thermocompression bonded (mounted) to the substrate on the substrate holding stage.
[0030]
The substrate holding stage is mounted on a movable table whose movement can be controlled in the XY direction or XYθ direction, and the chip thermocompression bonding tool cannot move in the horizontal direction, but can move up and down vertically. It is attached to. However, it may be provided in other forms. For example, the chip thermocompression bonding tool may be mounted so as to be rotated or mounted so as to be moved in the horizontal direction.
[0031]
In addition, the chip thermocompression bonding tool may not be provided with the intake passage 16 and the chip suction hole 13, but it is preferable to provide them because a high-speed response of temperature control can be achieved. The ceramic holder 2, the ceramic heater 4 and the ceramic indenter 5 are made of any of oxide ceramics such as alumina and zirconia, and non-oxide ceramics such as aluminum nitride, boron nitride and silicon nitride. The ceramic indenter 5 is preferably made of the latter that can adjust the thermal conductivity as compared with the former.
[0032]
Further, the ceramic holder 2 may be fixed to the tool body 1 using an appropriate adhesive, but it is attached by bolting so that it can be replaced when the ceramic heater 4 is damaged. Further, other clamping mechanisms may be used.
[0033]
The cooling slit 18 is preferably penetrated, but may be provided at a predetermined depth without penetrating, and the predetermined number is selected as necessary, and the shape thereof is also required. Are provided in a predetermined shape.
[0034]
As mentioned above, although the form at the time of attaching the ceramic holder 2 directly to the lower end of the metal tool main body 1 was described in this invention, as shown in FIGS. A metal connection block 30 may be attached to the lower end of the contact block 30, and the ceramic holder 2 may be attached to the lower end of the connection block 30 and the ceramic holder 2, the ceramic heater 4, and the ceramic indenter 5 may be sintered.
[0035]
7 is a front view, and FIGS. 8 and 9 are left side views of FIG. 7. As shown in these drawings, the connection block 30 has a connection hole for forming the intake passage 16a. 15a is penetrated, and a connection hole 21a for forming the second air supply passage 25a and the first air supply passage 22a is penetrated, and the first air supply passage 22a is shown in FIG. In the same manner as the first air supply passage 22 described above, a pair of pressure hoses 17a, 23a, and 26a are provided in the front-rear direction in FIG.
[0036]
Therefore, in the chip thermocompression bonding tool in which the connection block 30 is attached to the lower end of the metal tool main body 1, as in the chip thermocompression bonding tool in which the ceramic holder 2 is directly attached to the lower end of the metal tool main body 1, Heat conduction from the heat generating portion 6 of the heater 4 to the ceramic holder 2 can be suppressed.
[0037]
Accordingly, since the magnitude of the temperature rise and fall of the ceramic holder 2 can be reduced, no distortion occurs, so that the bolts are not loosened, and the tool body having a parallel adjustment function is elongated due to thermal expansion and the parallelism is not correct. (Distortion) can be eliminated.
[0038]
Although not shown, the connection block 30 is attached to the lower end of the metal tool body 1 by bolting. A thermocouple 31 for temperature measurement (see FIGS. 2 and 8) is attached to the ceramic indenter 5, and the tool body 1 is moved through a movable table that can be moved and controlled in the XYZ directions (not shown). It is mounted so that it can move in the axial direction.
[0039]
However, other than this, for example, it may be mounted so that it can move only in the Z-axis direction, or can be rotated to a predetermined angle θ in addition thereto, and further, the first and second air supply passages 22 (or 22a), The air supplied from 25 (or 25a) to the first and second air blowing passages 19 and 24 may be either room temperature air or cooling air.
[0040]
Moreover, regarding the ceramic holder 2, it may replace with the above integral type (type | mold as shown in FIGS. 1-9), and may provide in a lamination | stacking type | mold. 10 and 11, a two-layer type is shown. This holder 2 is formed by sintering a lower ceramic block 2a and an upper ceramic block 2b.
[0041]
Both the blocks 2a and 2b have substantially the same thermal expansion coefficient, but the thermal conductivity of the upper ceramic block 2b is smaller than that of the lower ceramic block 2a. . In this way, two or more ceramic blocks, that is, a plurality of ceramic blocks are laminated from the ceramic heater side to the ceramic holder mounting portion in order of increasing thermal conductivity (on the ceramic block having high thermal conductivity, Alternatively, ceramic blocks having lower thermal conductivity may be stacked in order.
[0042]
In this way, by providing the ceramic holder 2 in a laminated type, it is possible to more effectively prevent the holder itself and the tool body 1 having the parallel adjustment function from being distorted due to a temperature rise. It is possible to prevent the parallelism of the chip thermocompression bonding tool from changing outside the specification in a short period of time.
[0043]
Further, although the ceramic blocks 2a and 2b shown in FIGS. 10 and 11 are laminated in a plane, they may be combined in an uneven shape. The same applies even if the number of layers increases.
[0044]
That is, regardless of whether the ceramic holder 2 is the integral type (non-laminate type) or the laminated type, the ceramic heater 4 portion is at a high temperature (for example, 250 ° C.) and the lower end portion of the tool body 1 is at a low temperature ( For example, 30 ° C. to 50 ° C.). However, in the integrated type, since the temperature suddenly drops in the middle part of the ceramic holder 2, thermal deformation distortion due to the temperature difference is likely to occur, whereas in the laminated type, heat conduction is performed in this way. Since there is no hindering part and the temperature does not drop suddenly and falls slowly, distortion hardly occurs, and this is advantageous.
[0045]
The ceramic indenter is also formed by laminating ceramic plates in ascending order of thermal conductivity from the ceramic heater side to the tool tip side (pressure surface side of the ceramic indenter), and by making the linear expansion coefficient the same or substantially the same. The effect of strain and elongation due to heat can be eliminated.
[0046]
As can be seen from the above, the configuration of the chip thermocompression bonding tool according to the present invention includes (1) a combination of a ceramic holder and a ceramic heater combined indenter, and (2) a ceramic block multi-layer holder having two or more layers. And (3) a combination of a ceramic holder, a ceramic heater and a ceramic indenter, and (4) a combination of a ceramic block laminate type holder of two or more layers, a ceramic heater and a ceramic indenter ( 5) Combination of ceramic holder, ceramic heater and two or more layers of ceramic plate stacking indenter; (6) Combination of two or more layers of ceramic block stacking type holder, ceramic heater and two or more layers of ceramic plate stacking indenter Etc.
[0047]
In addition, as an ideal balance of the thermal conductivity of the entire combination of the ceramic holder, the ceramic heater, and the ceramic indenter, it is preferable to provide the thermal conductivity to decrease from the pressing surface of the ceramic indenter toward the ceramic holder mounting portion. However, since the ceramic heater is a heat generation source, this effect can be obtained even when the thermal conductivity is out of balance, and this effect can be obtained when the ceramic holder and the ceramic indenter are provided in a laminated type. In addition, the ceramic holder and the ceramic heater are not separately provided, and a ceramic heater combined indenter is provided instead.
[0048]
Further, the ceramic heater and the ceramic indenter may be mounted not only in the case of being fixed by sintering but also in a removable form, for example, by an adsorption method, an electrostatic method, a mechanical clamp method, or the like, if necessary. The temperature detecting means 31 may be attached to the ceramic heater 4 or the ceramic holder 2, but is preferably attached to a location closest to the chip suction position.
[0049]
The ceramic holder, ceramic heater and ceramic indenter may be provided on the substrate holding stage side. In this case, they can be sintered or removed from the upper end of the ceramic holder mounted on the substrate holding stage. It may be attached to the form, for example, attached by an adsorption method, an electrostatic method, a mechanical clamp method, or may be held only by gravity.
[0050]
In addition, the chip in the present invention refers to an object to be mounted or bonded to a substrate, for example, a semiconductor chip, an IC chip, an optical element, a wafer or the like regardless of the type or size.
[0051]
Furthermore, the substrate refers to a mounting object on which the chip is mounted or bonded, such as a resin substrate, a glass substrate, a film substrate, a chip, or a wafer.
[0052]
【The invention's effect】
As described above, according to the present invention, a parallel adjustment function is provided by configuring the ceramic holder, ceramic heater, ceramic indenter, and the like so that heat is not easily transmitted to the mounting portion of the tool body and the ceramic holder. Elongation due to thermal expansion of the tool body and parallelism deviation (distortion) can be eliminated.
[0053]
The ceramic holder is constructed by sintering so that the heat conduction gradually decreases from the ceramic heater side toward the ceramic holder mounting portion, and has a laminated structure in which the linear expansion coefficients are the same or substantially the same. As a result, the temperature difference between adjacent stacks can be reduced (it can be gradually reduced rather than suddenly dropping heat), so that the thermal deformation of the ceramic indenter, ceramic heater, ceramic holder and tool body is suppressed. be able to.
[0054]
Thus, this laminated structure, heat is easily transmitted in the chip pressure side, rather flame reportedly on the tool body side having a parallel adjustment function, since the coefficient of linear expansion the same or substantially the same, the heat is a factor Problems can be eliminated and high-precision mounting can be realized.
[Brief description of the drawings]
FIG. 1 is a front view of a lower end portion of a chip thermocompression bonding tool.
FIG. 2 is a left side view of FIG.
FIG. 3 is a perspective view of a ceramic heater.
FIG. 4 is a longitudinal sectional view of a heat generating part of a ceramic heater.
FIG. 5 is a left side view of FIG. 1;
FIG. 6 is a front view of a lower end portion of a chip thermocompression bonding tool.
FIG. 7 is a front view of a lower end portion of a chip thermocompression bonding tool.
8 is a left side view of FIG.
9 is a left side view of FIG.
FIG. 10 is a front view of a chip thermocompression bonding tool according to another example.
11 is a left side view of FIG.
[Explanation of symbols]
1: Tool body 2: Ceramic holder 4: Ceramic heater 5: Ceramic indenter 6: Heat generating part 8: Recess for mounting 13: Chip suction hole 30: Connection block

Claims (10)

A ceramic holder is attached directly to the lower end of the tool body or to the lower end of a connection block attached to the lower end of the tool body, and a T-shaped ceramic heater and ceramic indenter having a connection hole at the lower end of the ceramic holder are sintered. In the crimped chip thermocompression bonding tool, the linear expansion coefficient of the ceramic holder is substantially equal to the linear expansion coefficient of the T-shaped ceramic heater having the connection hole and the ceramic indenter, and the thermal conductivity of the ceramic indenter Increases from the T-shaped ceramic heater having the connection hole toward the pressure surface on the tip side of the ceramic indenter,
The chip thermocompression bonding tool, wherein the thermal conductivity of the ceramic holder decreases from a T-shaped ceramic heater having a connection hole toward a mounting surface on the base end side of the ceramic holder .   2. The chip thermocompression bonding tool according to claim 1, wherein the ceramic holder is composed of a laminated body of ceramic blocks and each ceramic block is sintered.   3. The chip thermocompression bonding according to claim 2, wherein the ceramic blocks are laminated in order of increasing thermal conductivity from the side of the T-shaped ceramic heater having connection holes toward the tool body or connection block side. tool.   4. The chip thermocompression bonding tool according to claim 1, wherein the ceramic indenter is composed of a laminate of ceramic plates and the ceramic plates are sintered together.   The ceramic plate is laminated in the order of decreasing thermal conductivity from the side of the T-shaped ceramic heater having connection holes toward the tip of the tool (the pressing surface side of the ceramic indenter). The chip thermocompression bonding tool described.   The heat generating portion of the T-shaped ceramic heater having a connection hole and the upper end portion of the ceramic indenter are inserted into a mounting recess formed on the lower end surface of the ceramic holder and sintered. The chip thermocompression bonding tool according to claim 1, 2, 3, 4, or 5. A ceramic holder is mounted directly on the lower end of the tool body or on the lower end of the connection block mounted on the lower end of the tool body, and a T-shaped ceramic heater combined indenter having a connection hole on the lower end of the ceramic holder is sintered. In the chip thermocompression bonding tool, the linear expansion coefficient of the ceramic holder is substantially equal to the linear expansion coefficient of the T-shaped ceramic heater and indenter having the connection hole, and the thermal conductivity of the ceramic holder is chip thermal compression tool, characterized in that small Kunar as toward the mounting surface of the base end side of the T-shaped ceramic heater also serves indenter or found before Symbol ceramic holder having a connection hole.   8. The chip thermocompression bonding tool according to claim 7, wherein the ceramic holder is composed of a laminated body of ceramic blocks and each ceramic block is sintered.   9. The chip according to claim 8, wherein the ceramic blocks are stacked in descending order of thermal conductivity from the T-shaped ceramic heater / indenter side having a connection hole toward the tool body or the connection block side. Thermocompression tool.   A chip mounting apparatus comprising any one of the chip thermocompression bonding tools according to claim 1.

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