JP2000332061A - Chip thermocompression-bonding tool and chip mounting equipment provided with the tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent parallelism of a ceramic indenter from changing out of the regulation, due to the influence of thermal expansion and thermal conduction, in a chip thermocompression-bonding tool sintering a ceramic holder, a ceramic heater and the ceramic indenter. SOLUTION: A ceramic holder 2 is installed at the lower end of a connecting block 30 formed of metal which is installed at the lower end of a tool main body 1 formed of metal, and the ceramic holder 2, a ceramic heater 4 and a ceramic indenter 5 are sintered. The coefficient of linear expansion of the ceramic holder 2 is nearly equal to those of the ceramic heater 4 and the ceramic indenter 5. Thermal conductivities of the ceramic holder 2 and the ceramic indenter 5 are increased proceeding toward a pressing surface side of the ceramic indenter 5 as viewed from the ceramic heater 4, and are decreased proceeding toward an attaching surface side of the ceramic holder 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip thermocompression bonding tool and a chip mounting apparatus provided with the same.

[0002]

2. Description of the Related Art Conventionally, various types of chip thermocompression tools used for thermocompression bonding of a chip to various substrates such as a liquid crystal substrate, that is, mounting are known. For example, as disclosed in Japanese Patent Application Laid-Open No. 7-86341, a chip thermocompression bonding method in which a ceramic holder is mounted on a lower end of a tool body and a ceramic heater and a ceramic indenter are mounted on a lower end of the ceramic holder. Tools.

[0003]

However, in this type of chip thermocompression bonding tool, the ceramic holder, the ceramic heater and the ceramic indenter are integrated (adhesion between the three members) using an appropriate adhesive. Due to the difference in thermal expansion caused by the non-uniformity of the applied thickness of the adhesive or the deterioration of the adhesive over time, or because the adhesive generally has a small thermal conductivity, The parallelism of the ceramic indenter (the parallelism between the processing surface and the substrate or the substrate holding stage) or the flatness (the flatness of the processing surface) due to the thermal deformation distortion caused by the temperature difference generated between the two members. Hereinafter, such parallelism or flatness is simply referred to as parallelism, but has a drawback that it tends to change over time and is not constant.

In addition, since the tool body is made of metal, the tool body and the ceramic holder are fixed by bolting. However, the bolt is loosened due to repeated heating and cooling at this location. In addition, heat was transferred to the parallelism adjusting mechanism mounted on the upper end of the tool body, and the parallelism of the ceramic indenter was liable to change due to these effects.

The parallelism of the ceramic indenter is, in particular,
It is considered a problem in mounting that requires micron-level accuracy, and if it is not kept within the specified range, chip displacement may occur at the time of mounting. It becomes difficult.

Accordingly, the present inventors have filed a prior application (Japanese Patent Application No. 9-2980).
82618), a thermocompression bonding tool in which a ceramic holder, a ceramic heater, and a ceramic indenter are sintered is proposed. However, in this case, since the effects of thermal expansion and heat conduction are not taken into account, mounting is performed one after another. As the process proceeds, the ceramic holders and the like thermally expand in different states, causing distortion, and the tool body is also heated by the heat transferred from the ceramic heater, causing the same distortion. It tends to be difficult to keep the parallelism of the crimping tool within the specified range, and therefore, it is difficult to perform high-precision mounting constantly. The present invention has been made in view of such a drawback and as a result of intensive studies to solve it.

[0007]

That is, one of the chip thermocompression bonding tools according to the present invention is, as described in claim 1, a connection mounted directly on the lower end of the tool main body or on the lower end of the tool main body. In a chip thermocompression bonding tool in which a ceramic holder is attached to a lower end of a block and a ceramic heater and a ceramic indenter are sintered at a lower end of the ceramic holder, a linear expansion coefficient of the ceramic holder is equal to a linear expansion coefficient of the ceramic heater and indenter. And the thermal conductivity of the ceramic holder is smaller toward the mounting surface side of the ceramic holder as viewed from the ceramic heater / indenter.

According to another aspect of the present invention, there is provided a chip thermocompression bonding tool, wherein a ceramic holder is provided directly on a lower end of a tool main body or on a lower end of a connection block mounted on a lower end of the tool main body. In a chip thermocompression bonding tool obtained by sintering a ceramic heater / indenter at the lower end of the ceramic holder and mounting the ceramic holder, the linear expansion coefficient of the ceramic holder is substantially equal to the linear expansion coefficient of the ceramic heater / indenter, and the The thermal conductivity of the ceramic holder is so small that it goes to the mounting surface side of the ceramic holder as viewed from the ceramic heater / indenter.

According to a tenth aspect of the present invention, there is provided a chip mounting apparatus including any one of the chip thermocompression tools according to the first to ninth aspects. It is.

Note that a chip mounting apparatus includes, in addition to a mounting apparatus for mounting a chip and a bonding apparatus for bonding the chips, for example, a substrate and a chip, and a substrate and an adhesive (AC).
F, NCF, etc.), which is a device of a broad concept including a device for fixing or transferring by heating and pressing an object in which objects are in contact with each other (such as mounting or temporary bonding). Further, the substrate holding stage side may be of a heating type or a non-heating type.

[0011]

FIG. 1 is a front view, and FIG. 2 is a left side view of FIG. 1, showing a lower end portion of a chip thermocompression bonding tool. Ceramic holder 2 directly on the lower end of tool body 1
A ceramic holder is fixed with a plurality of bolts 3 and a ceramic heater 4 and a ceramic indenter 5 (ceramic indenter) are provided at the lower end of the holder 2.
Have been sintered.

The ceramic indenter 5 has a temperature detecting means 3
1 (for example, a thermocouple, a radiation thermometer, etc.) is provided in a form that can be controlled to a set temperature.

That is, as shown in FIG. 3, the ceramic heater 4 connects the heat generating portion 6 and the terminal portion 7 with T.
The heater 4 is formed in a panel body having a predetermined thickness (for example, about 1 mm) arranged in a character shape, and the heat generating portion 6 of the heater 4 fits into a mounting recess 8 formed on the lower end surface of the ceramic holder 2. The ceramic indenter 5 is inserted and sintered with the ceramic holder 2, and the upper end of the ceramic indenter 5 is fitted into the mounting recess 8 and sintered with the ceramic holder 2 and the ceramic heater 4. A temperature detecting means 31 (for example, a thermocouple, a radiation thermometer, etc.) is attached to the ceramic indenter 5 so as to be controllable at a set temperature.

Further, the sintering is performed under the condition of applying a binder mixed with silicon nitride powder, aluminum nitride powder, boron nitride powder, or the like to the contact surface of each part under a pressure of several thousand atmospheres.
The heating can be performed at 700 ° C. to 1800 ° C., and the ceramic holder 2, the ceramic heater 4, and the ceramic indenter 5 can be integrated with each other. In addition, since the upper end of the ceramic indenter 5 is fitted into the mounting recess 8, it is possible to firmly join without causing displacement.

Further, as shown in FIGS. 3 and 4 (longitudinal sectional views of the heat generating portion 6), the ceramic heater 4 is constituted by covering the heat generating element 9 with a ceramic material 10 which is an electric insulating material. From the terminal portion 7 to the terminal 11 of the heating element 9
The connection hole 12 is made to penetrate the heat generating portion 6 and the connection hole 12 is formed into the chip suction hole 13 which is made to penetrate the ceramic indenter 5 as shown in FIG. And a connection hole 14 penetrated through the ceramic holder 2.

The ceramic holder 2, the ceramic material 10 of the ceramic heater 4 and the ceramic indenter 5 are
The ceramic holder 2 is made of a material in which a predetermined amount of glass or the like is added to silicon nitride, and the coefficient of linear expansion of the ceramic holder 2 is equal to or substantially equal to the coefficient of linear expansion of the ceramic heater 4 and the ceramic indenter 5. The thermal conductivity is
With the ceramic heater 4 as a base point, the ceramic holder 2 is larger toward the pressing surface side of the ceramic indenter 5 (the surface side where the chip suction holes 13 are opened), and the ceramic holder 2 on the opposite side.
It is provided so that it becomes smaller as it goes toward the mounting surface side.

More specifically, the ceramic holder 2,
The coefficient of linear expansion of the ceramic heater 4 and the ceramic indenter 5 is 2.5 to 3.0 (× 10 ⁻⁶ ) / ° C., the thermal conductivity of the ceramic indenter 5 is 84 W / m · K, and the ceramic holder 2 is It is 17 to 84 W / mK.

In the case where the ceramic heater and the ceramic indenter are not separated from each other as described above, but the ceramic heater and indenter in which the ceramic heater and the indenter are integrated is mounted, the linear expansion coefficients of the two are the same or substantially the same. And the thermal conductivity is provided so as to decrease toward the ceramic holder mounting portion.

As is well known, the ceramic material is composed of silicon nitride or the like (main component) and glass or the like (additive) as components, but the thermal conductivity varies depending on the amount of glass mixed. One having a predetermined thermal conductivity can be selected.

Although the upper end of the connection hole 14 is not shown in FIG. 1, the connection hole 14 is connected to a connection hole 15 penetrated through the tool body 1. Thus, the chip suction holes 13 are formed by the connection holes 12, 14 and 15.
To form an intake passage 16 communicating with the intake passage. Therefore, suction can be performed through the chip suction hole 13 by suctioning through the pressure-resistant hose 17 mounted on the tool body 1, and therefore, the chip (not shown) can be suction-held by the ceramic indenter 5. it can.

A plurality of elongate cooling slits 18, a first air outlet passage 19, and a connection hole 20 (see FIG. 5) are passed through the ceramic holder 2.
The first air blowing passage 19 is formed on the upper end surface of the heat generating portion 6 of the ceramic heater 4, and has left and right ends opened in FIG.

The connection hole 20 is formed in the first air outlet passage 19 and the connection hole 2 penetrating through the tool body 1.
1 (see FIG. 5). Thus, the connection holes 20 and 21 form the first air supply passage 22 that communicates with the first air blow passage 19.

The first air supply passages 22 are provided as a pair as shown in FIG. Therefore, by supplying air through the pressure-resistant hose 23 (see FIG. 5) mounted on the tool body 1, air can be blown out from the left and right openings of the first air blowing passage 19 in FIG. .

Therefore, the heat generated from the heat generating portion 6 of the ceramic heater 4 is removed by the air, so that the ceramic heater 4 and the ceramic indenter 5 can be rapidly cooled and the heat is excessively transferred to the ceramic holder 2. And the cooling slit 18 cools the heated ceramic holder 2 to prevent the joint between the ceramic holder 2 and the metal tool body 1 from being excessively heated. can do.

Further, as shown in FIG.
A pair of second air blowing passages 24 are provided on the upper end surface of the ceramic holder 2, and the second air blowing 24 is opened at both front and rear ends in FIG. The second penetrated
Since the air supply passage 25 is communicated, the air is supplied through a pressure-resistant hose 26 attached to the tool main body 1 so that the air is supplied from the front and rear openings of the second air blowing passage 24 in FIG. It can be blown out and the joint between the ceramic holder 2 and the metal tool body 1 can be forcibly cooled.

As described above, one of the chip thermocompression bonding tools according to the present invention comprises a ceramic holder 2, a ceramic heater 4 and a ceramic indenter 5 directly mounted on the lower end of a metal tool body 1 having a low linear expansion coefficient. And sinter
The coefficient of linear expansion of the ceramic holder 2 is equal to or substantially equal to the coefficient of linear expansion of the ceramic heater 4 and the ceramic indenter 5. It is provided such that it becomes larger as it goes toward the surface on which the suction holes 13 are opened) and becomes smaller as it goes toward the mounting surface side of the ceramic holder 2 on the opposite side.

When the ceramic heater and the ceramic indenter are combined with a ceramic heater / indenter, the linear expansion coefficients of both (the upper heater portion and the lower indenter portion) are the same or different. They are provided substantially identically, and are provided so that the thermal conductivity becomes smaller toward the ceramic holder mounting portion.

Therefore, even if the thermocompression bonding (mounting) is performed one after another by the bonding apparatus equipped with the chip thermocompression bonding tool, the parallelism of the ceramic indenter 5 can be maintained within the specified range for a long period of time. , High-precision mounting can be performed constantly.

Although not shown, the chip mounting apparatus comprises:
A substrate such as a liquid crystal substrate is supported by a substrate holding stage mounted so as to be movable in a horizontal plane, and a mounting position of the substrate is mounted above the substrate by moving or rotating the stage. The chip thermocompression bonding tool precisely aligns the chip with the chip held by suction, and then lowers the chip thermocompression tool holding the chip through the chip suction hole 13 to move the chip on the substrate holding stage. It is configured so that it can be thermocompression-bonded (mounted) to a substrate.

The substrate holding stage is mounted on a movable table that can be controlled to move in the XY direction or the XYθ direction. The chip thermocompression tool cannot move in the horizontal direction, but moves vertically. It is attached to be able to do. However, it may be provided in other forms. For example, the chip thermocompression bonding tool may be mounted so as to be rotatable or may be mounted so as to be movable in a horizontal direction.

The chip thermocompression bonding tool may not be provided with the intake passage 16 and the chip suction hole 13, but it is preferable to provide them because a high-speed response of temperature control can be achieved. Also, ceramic holder 2,
The ceramic heater 4 and the ceramic indenter 5 may be made of any of oxide ceramics such as alumina and zirconia, and non-oxide ceramics such as aluminum nitride, boron nitride and silicon nitride. Preferably, as the ceramic indenter 5, the latter capable of adjusting the thermal conductivity as compared with the former is used.

The ceramic holder 2 may be fixed to the tool body 1 using an appropriate adhesive.
It is preferable that the ceramic heater 4 is mounted by bolting so that the ceramic heater 4 can be replaced when the ceramic heater 4 is damaged. Further, another clamp mechanism may be used.

Although the cooling slits 18 are preferably penetrated, they may be provided at a predetermined depth without being penetrated, and a predetermined number is selected as necessary and the shape thereof is also changed. It is provided in a predetermined shape as needed.

The embodiment in which the ceramic holder 2 is directly mounted on the lower end of the metal tool body 1 has been described above. In the present invention, as shown in FIGS. A metal connection block 30 is mounted on the lower end of the tool body 1, and the ceramic holder 2 is mounted on the lower end of the connection block 30, and the ceramic holder 2, the ceramic heater 4, and the ceramic indenter 5 are sintered. Good.

FIG. 7 is a front view, and FIGS. 8 and 9 are left side views of FIG. 7. As shown in these figures, the connection block 30 is formed with an intake passage 16a. The connection hole 15a of FIG.
A connection hole 21a for forming the air supply passage 25a and the first air supply passage 22a is penetrated, and
As in the case of the above-described first air supply passage 22 shown in FIG. 6, a pair of first air supply passages 22a are provided at predetermined intervals in the front-rear direction in FIG. 9, and furthermore, pressure-resistant hoses 17a, 23a, and 26a are provided. It is installed.

Accordingly, the chip thermocompression bonding tool in which the connection block 30 is mounted on the lower end of the metal tool body 1 is also similar to the chip thermocompression tool in which the ceramic holder 2 is mounted directly on the lower end of the metal tool body 1. In addition, heat conduction from the heating portion 6 of the ceramic heater 4 to the ceramic holder 2 can be suppressed.

Accordingly, since the magnitude of the temperature rise and fall of the ceramic holder 2 can be reduced, no distortion is generated, so that the bolt is not loosened, and the tool body having the parallel adjusting function can be extended by the thermal expansion and parallelized. The degree of distortion (distortion) can be eliminated.

Although not shown, the connection block 30 is mounted on the lower end of the metal tool body 1 by bolting. A thermocouple 31 for temperature measurement is attached to the ceramic indenter 5 (see FIGS. 2 and 8), and the tool body 1 is connected to a movable table (not shown) via a movable table that can be controlled in XYZ directions. It is mounted so that it can move in the axial direction.

However, it may be mounted so as to be able to move only in the Z-axis direction, or to rotate at a predetermined angle θ in addition thereto, and further to the first and second air supply passages 22 (or 22a), 25 (or 25a) to the first
2 The air supplied to the air blowing passages 19 and 24 may be either room temperature air or cooling air.

Further, the ceramic holder 2 may be provided in a laminated type instead of the above-described integrated type (the type shown in FIGS. 1 to 9). 10 and 11, a two-layer type is shown, but this holder 2 is formed by sintering a lower ceramic block 2a and an upper ceramic block 2b.

Although the two blocks 2a and 2b have substantially the same thermal expansion coefficient, the thermal conductivity of the upper ceramic block 2b is larger than that of the lower ceramic block 2a. Less than. In this manner, two or more ceramic blocks are stacked in the order from the ceramic heater side to the ceramic holder mounting portion in the order of larger thermal conductivity (the ceramic block having the larger thermal conductivity is formed on the ceramic block). May be formed by sequentially laminating ceramic blocks each having a lower thermal conductivity.

As described above, by providing the ceramic holder 2 in a laminated type, it is possible to more effectively prevent the holder itself and the tool body 1 having the parallel adjustment function from being distorted due to a rise in temperature. Therefore, it is possible to prevent the degree of parallelism of the chip thermocompression bonding tool from changing outside the specified range in a short period of time.

Although the ceramic blocks 2a and 2b shown in FIGS. 10 and 11 are stacked in a plane, they may be combined in an uneven shape. The same is true even if the number of layers increases.

That is, regardless of whether the ceramic holder 2 is of the integral type (non-laminated type) or the laminated type, the temperature of the ceramic heater 4 is high (for example, 250 ° C.).
° C) and the lower end of the tool body 1 is at a low temperature (for example, 30 ° C to 50 ° C). However, in the integrated type, since the temperature is rapidly lowered at the intermediate portion of the ceramic holder 2, thermal deformation distortion due to the temperature difference is likely to occur. Since there is no obstructing part and the temperature drops slowly rather than rapidly, distortion is less likely to occur, and this is more advantageous.

In the ceramic indenter, ceramic plates are laminated in ascending order of thermal conductivity from the ceramic heater side to the tool tip side (the pressing surface side of the ceramic indenter) and have the same or substantially the same linear expansion coefficient. By doing so, the effects of distortion and elongation due to heat can be eliminated.

As is clear from the above, the configuration of the chip thermocompression bonding tool according to the present invention includes (1) a combination of a ceramic holder and a ceramic heater and an indenter, and (2) a ceramic block having two or more layers. A combination of a laminated holder and a ceramic heater combined indenter,
(3) a combination of a ceramic holder, a ceramic heater and a ceramic indenter, (4) a combination of a ceramic block laminated type holder having two or more layers, a ceramic heater and a ceramic indenter, and (5) a ceramic holder and a ceramic heater and two layers. The combination with the above-described ceramic plate laminated type indenter, (6) the combination of the ceramic block laminated type indenter with two or more layers, the ceramic block laminated type holder, the ceramic heater, and the two or more layers.

The ideal balance of the thermal conductivity of the entire combination of the ceramic holder, the ceramic heater and the ceramic indenter is set such that the thermal conductivity decreases from the pressing surface of the ceramic indenter toward the ceramic holder mounting portion. Although it is more preferable, since the ceramic heater is a heat source, even when the thermal conductivity deviates from the balance of the thermal conductivity, the present effect is obtained, and the present effect is achieved by stacking the ceramic holder and the ceramic indenter respectively. The same applies to the case where a ceramic heater and an indenter are provided instead of separately providing the ceramic holder and the ceramic heater.

The ceramic heater and the ceramic indenter are mounted not only in the case of being fixed by sintering but also in a detachable form as required, for example, by mounting by a suction method, an electrostatic method, a mechanical clamping method or the like. Is also good. In addition, the temperature detecting means 31 is the ceramic heater 4.
Alternatively, it may be mounted on the ceramic holder 2, but is preferably mounted on a portion closest to the chip suction position.

The ceramic holder, the ceramic heater, and the ceramic indenter may be provided on the substrate holding stage side. In this case, the ceramic holder, the ceramic heater, and the ceramic indenter are sintered on the upper end of the ceramic holder mounted on the substrate holding stage.
Alternatively, it may be mounted in a removable form, for example, by a suction method, an electrostatic method, a mechanical clamping method, or the like, or may be held only by gravity.

The chip in the present invention includes, for example, a semiconductor chip, an IC chip, an optical element, a wafer, etc.
Regardless of its type and size, it refers to a mounting object to be mounted or bonded to a substrate.

The substrate refers to a mounting object on which the chip is mounted or bonded, such as a resin substrate, a glass substrate, a film substrate, a chip, and a wafer.

[0052]

As described above, according to the present invention, heat is hardly transmitted to the mounting portion of the tool body and the ceramic holder in a space-saving manner of the ceramic holder, the ceramic heater, the ceramic indenter and the like. Elongation due to thermal expansion of the tool body having the parallel adjustment function and deviation (parallelism) of the parallelism can be eliminated.

The ceramic holder is formed by sintering so as to gradually reduce heat conduction from the ceramic heater side to the ceramic holder mounting portion, and has a laminated structure having the same or substantially the same linear expansion coefficient. By adopting a structure, the temperature difference between adjacent laminations can be reduced (the heat can be gradually decreased instead of sharply decreased), so that the heat of the ceramic indenter, the ceramic heater, the ceramic holder, and the tool body can be reduced. Deformation can be suppressed.

Therefore, heat can be easily transmitted to the chip pressing side and hard to be transmitted to the tool main body having the parallel adjustment function by this laminated structure, and the linear expansion coefficient is the same or substantially the same. The problem which causes a factor can be eliminated, and highly accurate mounting can be realized.

[Brief description of the drawings]

FIG. 1 is a front view of a lower end portion of a chip thermocompression bonding tool.

FIG. 2 is a left side view of FIG.

FIG. 3 is a perspective view of a ceramic heater.

FIG. 4 is a longitudinal sectional view of a heat generating portion of the ceramic heater.

FIG. 5 is a left side view of FIG.

FIG. 6 is a front view of a lower end portion of the chip thermocompression bonding tool.

FIG. 7 is a front view of a lower end portion of the chip thermocompression bonding tool.

FIG. 8 is a left side view of FIG. 7;

FIG. 9 is a left side view of FIG. 7;

FIG. 10 is a front view of a chip thermocompression bonding tool according to another example.

FIG. 11 is a left side view of FIG.

[Explanation of symbols]

 1: Tool body 2: Ceramic holder 4: Ceramic heater 5: Ceramic indenter 6: Heating part 8: Mounting recess 13: Chip suction hole 30: Connection block

Claims (10)

[Claims] 1. A chip heat source in which a ceramic holder is mounted directly on a lower end of a tool main body or on a lower end of a connection block mounted on a lower end of the tool main body, and a ceramic heater and a ceramic indenter are sintered on a lower end of the ceramic holder. In the crimping tool, the coefficient of linear expansion of the ceramic holder is substantially equal to the coefficient of linear expansion of the ceramic heater and the ceramic indenter, and the thermal conductivity of the ceramic holder and the ceramic indenter is the same as viewed from the ceramic heater. A chip thermocompression bonding tool characterized by being larger toward a pressing surface side of a ceramic indenter and smaller toward a mounting surface side of the ceramic holder on the opposite side. 2. The chip thermocompression bonding tool according to claim 1, wherein the ceramic holder is formed of a laminate of ceramic blocks, and each of the ceramic blocks is sintered. 3. The chip thermocompression bonding tool according to claim 2, wherein the ceramic blocks are stacked in order of decreasing thermal conductivity from the ceramic heater side to the tool body or the connection block side. 4. The chip thermocompression bonding tool according to claim 1, wherein the ceramic indenter is formed of a laminate of ceramic plates, and each of the ceramic plates is sintered. 5. The chip heater according to claim 4, wherein the ceramic plates are stacked in order of decreasing thermal conductivity from the ceramic heater side to the tool tip side (the pressing surface side of the ceramic indenter). Crimping tool. 6. The ceramic heater according to claim 1, wherein the heat generating portion of the ceramic heater and the upper end portion of the ceramic indenter are inserted into a mounting recess formed on the lower end surface of the ceramic holder and sintered. The chip thermocompression bonding tool according to any one of claims 1, 2, 3, 4 and 5. 7. A chip thermocompression bonding method wherein a ceramic holder is mounted directly on a lower end of a tool body or on a lower end of a connection block mounted on a lower end of the tool body, and a ceramic heater indenter is sintered on a lower end of the ceramic holder. In the tool, the coefficient of linear expansion of the ceramic holder is substantially equal to the coefficient of linear expansion of the ceramic heater / indenter, and the thermal conductivity of the ceramic holder is the mounting surface of the ceramic holder as viewed from the ceramic heater / indenter. A chip thermocompression bonding tool characterized by being smaller toward the side. 8. The chip thermocompression bonding tool according to claim 7, wherein the ceramic holder is formed of a laminate of ceramic blocks, and each of the ceramic blocks is sintered. 9. The chip thermocompression bonding tool according to claim 8, wherein the ceramic blocks are stacked in order of increasing thermal conductivity from the ceramic heater / indenter side to the tool body or the connection block side. 10. A chip mounting apparatus comprising any one of the chip thermocompression bonding tools according to claim 1.