JP2016167643A - Mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting device such that radiant heat from a feeder line to heating means provided to a bonding head exerts no thermal influence on a thermosetting resin before mounting.SOLUTION: A mounting device is configured to sequentially mount chips on a substrate having a plurality of mounting plates, and comprises: a substrate stage which can suck and hold the substrate and move in a horizontal direction; and a bonding head which has a tool for sucking and holding the chips and heating means heated by power feeding to a resistance wire so as to heat the chips via the tool, and presses the chips against the substrate and heats them. A lead wire lead-out part for connecting the feeder line to the resistance wire is protrusively provided to the side of the bonding head, and movement of the substrate stage is so controlled that when the chips sucked and held by the tool are sequentially mounted on the substrate, the direction of the lead wire lead-out part becomes a direction where no mounting place is present or a direction of a mounting place where mounting has been completed.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a mounting apparatus for thermocompression bonding a flip chip to a substrate.

  When a flip chip (hereinafter referred to as a chip) is thermocompression bonded to a substrate, the image recognition means recognizes the alignment mark provided on the substrate and the alignment mark provided on the chip, and holds the substrate stage or chip that holds the substrate. The tool is aligned in the XY direction (horizontal direction) and the θ direction (rotation direction), and the chip is pressed and heated to a predetermined position on the substrate.

  The substrate is pre-filled with a thermosetting resin, and the chip and the substrate are joined by thermosetting the resin by thermocompression bonding. The substrate has a plurality of mounting locations, and mounting operations are sequentially performed while moving the substrate stage or the tool. Note that, instead of filling the thermosetting resin, a sheet-like thermosetting resin film may be placed on the substrate.

  A plurality of types of tools for holding the chip are prepared for each chip size and type, and a tool suitable for the chip to be mounted is adsorbed and held by a bonding head having a lifting mechanism so as to be detachable. The bonding head is provided with heating means such as a heater for heating the chip and the substrate. The tool is heated by the heating means, and the thermosetting resin is heated when pressing the chip and the substrate.

  Since the chip is mounted one by one sequentially from the state where all the mounting locations of the substrate are filled with thermosetting resin, when pressing and heating the chip to the target mounting location, There is a problem in that the radiant heat of the heated tool affects the thermosetting resin in the mounting area where the chip is not yet mounted. On the other hand, in patent document 1, the position of the part which adsorb | sucks the chip | tip of a tool is shifted from the center of a tool to an end so that the radiant heat of a tool may not reach the thermosetting resin before mounting.

  Moreover, the influence of a radiant heat can be prevented by making the size of a heating means and a tool into the magnitude | size which does not affect the thermosetting resin of an adjacent mounting location. For example, the size of the heating means and the tool is made approximately the same as the size of the chip to be mounted.

Japanese Patent No. 4539454

  However, even if mounting is performed so that the radiant heat of the tool does not reach the thermosetting resin before mounting, the radiant heat from the power supply line to the heating means provided in the bonding head affects the thermosetting resin before mounting. There is a problem that gives.

  Accordingly, an object of the present invention is to provide a mounting apparatus in which radiant heat from a power supply line to a heating unit provided with a bonding head does not affect the thermosetting resin before mounting.

In order to solve the above-mentioned problem, the invention described in claim 1
A mounting device for sequentially mounting chips on a substrate having a plurality of mounting locations,
A substrate stage that sucks and holds the substrate and is movable in the horizontal direction, a tool that sucks and holds the chip, and a heating unit that is heated by feeding power to a resistance wire and heats the chip via the tool. A bonding head that pressurizes and heats the chip to the substrate; and a controller that controls the substrate stage and the bonding head.
A lead wire lead portion for connecting a power supply line to the resistance wire is provided on the side of the bonding head so as to project the lead wire when the chips sucked and held by the tool are sequentially mounted on the substrate. In the mounting apparatus, the control unit controls the movement of the substrate stage so that the direction of the portion is a direction where there is no mounting portion or a direction where the mounting is completed.

  According to the present invention, when the chips sucked and held by the tool are sequentially pressed and heated on the substrate, the direction of the power supply line of the bonding head becomes the direction of the mounting portion where the chips are mounted. Therefore, the radiant heat from the feeder does not affect the thermosetting resin in the unmounted portion. Also, when mounting at the mounting location on the outer edge of the board, there is no mounting location on the outside of the board, so even if the feed line is directed in that direction, it does not affect the thermosetting resin in the unmounted location .

It is a schematic side view of the mounting apparatus of this invention. It is a schematic plan view of the board | substrate used by this invention. It is a schematic plan view of the heating means of this invention. It is an operation | movement flowchart of this invention. It is a schematic plan view explaining the chip mounting order on the substrate.

  Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic side view of a mounting apparatus 1 according to the present invention. In FIG. 1, the left and right direction toward the mounting apparatus 1 is the X axis, the front and rear direction is the Y axis, the axis orthogonal to the XY plane composed of the X axis and the Y axis is the Z axis (up and down direction), Axis.

  The mounting apparatus 1 includes a substrate stage 10 that holds the substrate 6 by suction, a bonding head 8 that sucks and holds the chip 2, a two-field camera 13 that recognizes alignment marks provided on the chip 2 and the substrate 6, and a mounting apparatus. It is comprised from the control part 20 which controls 1 whole.

  The substrate stage 10 is connected to a suction means such as a suction pump (not shown) and a pipe, and can hold the substrate 6 on the substrate stage 10 by suction. Further, the substrate stage 10 is movable in the horizontal direction (XY direction).

  A plurality of mounting locations are provided on the substrate 6. As an example, FIG. 2 shows a schematic plan view of a substrate. The example of FIG. 2 is an example in which there are 12 mounting locations, and each mounting location is a portion indicated by 101, 102, and 112. The mounting portions 101 to 112 are filled with a predetermined portion of the thermosetting resin 4 in advance. At each mounting location, an electrode 5 connected to the bump 3 of the chip 2 is provided.

  The bonding head 8 is movable in the vertical direction (Z direction) and the rotation direction (θ direction), and the chip 2 sucked and held by the tool 9 at the tip of the bonding head 8 can be pressed and heated on the substrate 6. It can be done. A heating means 12 is attached to the lower part of the bonding head 8. FIG. 3 shows a schematic plan view of the heating means 12. The heating means 12 is composed of two parts, a heating part 15 and a lead lead part 16. A resistance wire 17 introduced from the lead lead-out portion 16 is embedded in the heating portion 15 in a folded state. The portion in the zigzag folded state is a heating effective area 18 surrounded by a dotted line in FIG. The heating unit 15 coincides with the attachment surface of the bonding head 8 and the tool 9. The lead lead portion 16 is a portion protruding laterally from the bonding head 8, and a power supply line 19 to the resistance wire 17 is connected from above. A tool 9 is attached to the lower side of the heating means 12.

  The heat of the heating means 12 is transmitted to the tool 9 and heats the chip 2 sucked and held by the tool 9. Since the lead lead portion 16 protrudes laterally from the bonding head 8, there is a problem that the radiant heat from the lead lead portion 16 affects the mounting location of the adjacent substrate 6. Therefore, in the present invention, the mounting method described below is performed.

  FIG. 4 shows an operation flowchart of the mounting method of the present invention, and FIG. 5 shows a plan view of the substrate 6.

  First, the substrate 6 filled with the thermosetting resin 4 is sucked and held on the substrate stage 10 (SP01).

  Next, the bonding head 8 receives the chip 2 from the chip conveying means and sucks and holds it on the tool 9 (SP02).

  Next, the bonding head 8 is lowered to a predetermined height, and the two-field camera 13 is inserted between the substrate 6 and the chip 2 (SP03).

  Next, based on the alignment mark of the mounting target portion of the substrate 6 recognized by the two-field camera 13 and the alignment mark of the chip 2, the substrate stage 10 is set in the horizontal direction (XY direction) and the bonding head 8 is rotated in the rotation direction (θ The direction is adjusted (SP04). When the alignment is completed, the two-field camera 13 is retracted from between the substrate 6 and the chip 2.

  Next, energization of the heating means 12 of the bonding head 8 is started, and the tool 9 is heated to a predetermined temperature (SP05).

  Next, the bonding head 8 is lowered and pressurized to the electrode 5 at the mounting location 101 shown in FIG. 5A with a predetermined load for a predetermined time (SP06). With the pressurization and heating, the thermosetting resin 4 at the mounting location 101 is cured by heating. In the mounting location 101 of FIG. 5, the shape of the heating means 12 is indicated by a dotted line so that the orientation of the heating means 12 can be understood. The heating unit 15 of the heating unit 12 is an upper portion of the mounting portion 101, and the lead drawing unit 16 is oriented toward the outer edge side of the substrate 6.

  Next, the bonding head 8 is raised, the heating means 12 is turned off, and it is confirmed whether or not there is a next mounting location on the substrate 6 (SP07).

  If the mounting location remains (in the case of “Yes” in SP07), the substrate stage 10 is moved and positioned so that the bonding head 8 comes on the adjacent mounting location 102 (SP08). FIG. 5B shows the positional relationship between the bonding head 8 and the mounting portion 102 of the substrate 6. The lead drawing portion 16 of the heating means 12 is directed toward the mounting location 101 where the mounting has already been completed. For this reason, the radiant heat from the lead lead-out portion 16 affects the mounting location 101, but does not affect the non-chip mounting location filled with the thermosetting resin 4.

  Next, returning to ST02, the mounting of the chip 2 is continued. Each time mounting is completed, the substrate stage 10 is aligned so that the bonding head 8 is in the order of the mounting locations 103, 104,. Be directed to. When the chip mounting location is the outer edge portion of the substrate 6 (for example, the mounting locations 105 and 109), the drawing portion 16 is aligned so as to face the outside of the substrate 6. The movement order of the bonding head 8 is indicated by arrows in FIG.

  By performing the mounting method as described above, the mounting can be completed without affecting the thermosetting resin 4 filled in the unmounted portion of the substrate 6 without the influence of the radiant heat from the lead drawing portion 16 of the heating means 12. I can do it.

DESCRIPTION OF SYMBOLS 1 Mounting apparatus 2 Chip 3 Bump 4 Thermosetting resin 5 Electrode 6 Substrate 8 Bonding head 9 Tool 10 Substrate stage 12 Heating means 13 2 Field of view camera 15 Heating part 16 Lead extraction part 17 Resistance wire 18 Heating effective area 19 Feeding line 20 Control Part 101-112 mounting location

Claims (1)

A mounting device for sequentially mounting chips on a substrate having a plurality of mounting locations,
A substrate stage that holds the substrate by suction and is movable in a horizontal direction;
A bonding head that pressurizes and heats the chip to the substrate, and includes a tool that holds the chip by suction, and a heating unit that is heated by power supply to a resistance wire and heats the chip via the tool.
A controller for controlling the substrate stage and the bonding head;
On the side of the bonding head, a lead wire lead-out portion for connecting a power supply line to the resistance wire is projected and provided,
When the chips sucked and held by the tool are sequentially mounted on the substrate, the control means is configured so that the lead wire lead-out portion is oriented in a direction where there is no mounting location or a mounting location where mounting is completed. A mounting apparatus for controlling movement of the substrate stage.

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