TWI571189B - Part assembly device - Google Patents

Description

Part assembly device

The present invention relates to a technical field of a component mounting device having a plurality of soldering tips and configured to heat and press the electronic components by respective soldering tips.

There is a component mounting device having a soldering tip, and the electronic component is joined and assembled to a predetermined position of a substrate or a semiconductor wafer or the like by soldering or the like.

In the component mounting device, there is a device that adsorbs a tool formed into a size and shape corresponding to the type and size of the electronic component by the adsorption portion of the soldering tip, and the electronic component is passed through the tool and through the adsorption portion. Heating and pressurization are performed (for example, refer to Patent Document 1).

In the component mounting device described in Patent Document 1, a heater is provided on the lower surface side of the adsorption portion, and the tool is held by the adsorption portion, and the electronic component is adsorbed by the adsorption portion. . The electronic component to be adsorbed is heated by a heater, and pressurization by the adsorption section is performed via a tool.

In the case of the electronic component, the bonding terminal is melted by heating by the heater, and the bonding terminal is pressed by pressing to the bonding terminal of the other electronic component mounted on the soldering stage and the semiconductor wafer or the like. Thereby, the joint is configured on the structure.

Further, in the component mounting device, there is also a device having a plurality of welding heads arranged in an array, and each electronic component is simultaneously bonded to the package by heating the electronic components provided in the heaters of the respective soldering heads. (For example, refer to Patent Document 2).

In the component mounting device described in Patent Document 2, a plurality of welding heads are arranged in series, and a plurality of welding heads can be integrally moved in the arrangement direction. A plurality of electronic components are placed in advance on the structure held on the soldering stage at predetermined intervals, and if the structure is located below the plurality of soldering tips by the movement of the soldering stage, a plurality of The welding head is lowered and the welding heads are pressed against the electronic components, so that the electronic components are respectively adsorbed by the respective adsorption portions. Then, the solder joints respectively adsorbing the electronic components are slightly moved up and down to adjust the height positions of the electronic components, and the electronic components are heated by the heaters respectively disposed on the soldering tips, and the electronic components are joined by soldering. It is mounted on the connection terminal of the structure.

In the component mounting device described in Patent Document 2, since a plurality of electronic components are attached to the assembly body at a time by a plurality of bonding heads, the manufacturing time of the product can be shortened, and the manufacturing cost can be reduced.

(previous technical literature) (Patent Literature)

Patent Document 1: Japanese Laid-Open Patent Publication No. 2008-251589

Patent Document 2: Japanese Laid-Open Patent Publication No. 2012-114382

However, in the manufacturing process of the electronic component as described above, the positional accuracy of each component of the electronic component to the component and the tool relative to the soldering are due to the positional accuracy of each part of the component mounting device and the positional accuracy of each part of the electronic component. The holding position (adsorption position) of the head or the like may deviate from each of the predetermined reference positions.

If the deviation from the reference position occurs, the engagement position of the electronic component with respect to the assembly is offset with respect to the appropriate engagement position depending on the magnitude of the deviation, or the pressing position of the adsorption portion and the tool to the electronic component is relative to the reference position. Deviation does not ensure a good bonding state of the electronic component to the package, and there is a possibility that a defect such as a joint failure may occur.

In particular, in a so-called laminated chip in which a plurality of electronic components are stacked on an electronic component to form a plurality of electronic components, the number of segments of the electronic component is likely to be tilted, and the possibility of joint failure between the electronic components increases. .

Further, in the component mounting device configured to simultaneously bond a plurality of electronic components to the mounting body by a plurality of bonding heads, each of the bonding heads and the tool are simultaneously pressed against the plurality of electronic components, and thus the relative reference is also likely to occur. The positional deviation causes an increase in the possibility of poor bonding of the electronic component to the package and poor bonding between the electronic components.

Therefore, the component mounting device of the present invention overcomes the above problems, and its purpose is to ensure a good bonding state of the electronic component to the package body and other electronic components.

First, the component mounting device of the present invention includes: a plurality of soldering heads each having a heater for heating a plurality of electronic components previously placed on the mounting body via a molten material to melt the molten material And the adsorption unit that adsorbs the tool pressed against the electronic component when the electronic component is heated, and the soldering tip heats and presses the electronic component via the tool; the tool recognizes the camera and adsorbs the respective components Performing image recognition on each position and direction of the plurality of tools in the plurality of adsorption portions in the horizontal direction; and a component recognition camera for the plurality of electronic components previously placed on the structure in the horizontal direction Image recognition at each position and each direction, and the plurality of adsorption portions It is possible to separately move in the up-down direction, the left-right direction, and the front-rear direction, and to rotate the shaft extending upward and downward as a fulcrum, according to the position and orientation of the aforementioned tools recognized by the tool recognition camera and the recognition of the camera by the aforementioned parts. The position and orientation of each of the electronic components are such that the positions and directions of the respective electronic components that are heated and pressurized are aligned with each other, and the positions and rotation directions of the respective adsorption portions are before, after, and after The upper direction is controlled.

Thereby, according to the position and orientation of each tool recognized by the tool recognition camera and the position and orientation of each electronic component recognized by the component recognition camera, respectively, the orientation of each electronic component in the horizontal direction and the direction of rotation are respectively To correct the position of each tool in the horizontal direction and the direction of rotation, and press each tool on each electronic part.

Secondly, in the component mounting device of the present invention, the plurality of electronic components are placed on the structure in advance in a state of being stacked in the vertical direction, and the electronic component of the uppermost stage is recognized by the component recognition camera. It is preferred that the parts are identified in each position and orientation in the horizontal direction.

Thereby, the position and orientation of the uppermost electronic component in the horizontal direction are recognized by the component recognition camera, whereby even when the inclination of the stacked electronic components is increased, the tools can be used. The position and orientation of the respective adsorption portions are controlled in the front, rear, left, and right positions and in the rotational direction so as to coincide with the positions and orientations of the respective electronic components to be heated and pressurized.

Thirdly, in the above-described component mounting device of the present invention, it is preferable that the component identification imaging mechanism is mounted on one of the soldering tips.

Thereby, a dedicated mechanism for moving the part recognition camera is not required.

Fourthly, in the component mounting device according to the above aspect of the invention, it is preferable that the moving stage is provided, and the movable stage is placed on the mounting body and moved in the horizontal direction in the downward direction of the welding head.

Thereby, the joining operation of the plurality of electronic components based on the plurality of adsorption sections can be continuously performed.

Fifthly, in the component mounting device of the present invention, it is preferable that the tool recognition imaging mechanism is mounted on the moving stage.

Thereby, a dedicated mechanism for the tool to recognize the movement of the camera is not required.

Sixthly, in the component mounting device of the present invention, a tool holder for holding a plurality of the tools is provided, and the tool holder is preferably attached to the moving stage.

Thereby, a dedicated mechanism for moving the tool holder is not required.

According to the present invention, according to the position and orientation of each tool recognized by the tool recognition camera and the position and orientation of each electronic component recognized by the component recognition camera, respectively, according to the position and rotation direction of each electronic component in the horizontal direction. The orientation of each tool in the horizontal direction and the direction of rotation are corrected, and each tool is pressed against each electronic component. Therefore, it is possible to ensure a good bonding state of the electronic component to the component and other electronic components.

1‧‧‧Parts assembly device

9‧‧‧welding head

11a‧‧‧Adsorption Department

11b‧‧‧heater

13‧‧‧Part identification camera

17‧‧‧Mobile stage

18‧‧‧Tool fixture

21‧‧‧ Tools

23a‧‧‧Into the recess

24‧‧‧Tool recognition camera

100‧‧‧Semiconductor wafer (construction body)

300‧‧‧Electronic parts

301‧‧‧Bumps

302‧‧‧Solder (melted material)

Fig. 1 is a view showing an embodiment of a component assembly device of the present invention together with Figs. 2 to 20, and Fig. 1 is a schematic perspective view of a component assembly device.

Fig. 2 is a view showing the component mounting device in a state viewed from a direction different from Fig. 1 A schematic perspective view.

Fig. 3 is a schematic front view showing a part of the component mounting device omitted.

Fig. 4 is a schematic side view showing a part of the component mounting device omitted.

Fig. 5 is a schematic plan view of a component mounting device.

Fig. 6 is an enlarged perspective view showing a state in which the tool is held by the adsorption unit.

Figure 7 is an exploded perspective view of a portion of the weld head and a portion of the tool and tool holder.

Fig. 8 is a schematic view showing the component mounting device and the devices in the vicinity thereof.

Fig. 9 is a schematic front view showing a state in which a laminate is placed on a semiconductor wafer in a tentative state.

Fig. 10 is a schematic perspective view showing a state in which a laminate is placed on a semiconductor wafer in a tentative state.

Fig. 11 is a view showing the operation of the component mounting apparatus together with Figs. 12 to 20, and Fig. 11 is a schematic side view showing a schematic side view of the initial state of each part.

Fig. 12 is a schematic enlarged side view showing a state in which the moving portion is moved rearward and the predetermined tool is positioned directly below the welding head.

Fig. 13 is a schematic enlarged side view showing the state of the suction tool by the adsorption portion in the subsequent Fig. 12;

Fig. 14 is a schematic enlarged side view showing a state in which the moving portion is moved forward and the tool recognition camera is positioned directly below the tool held by the suction portion.

Fig. 15 is a schematic enlarged front view showing the state of the tool sequentially photographed by the tool recognition tool.

Figure 16 is a view subsequent to Figure 15 showing that the moving portion of the semiconductor wafer is moved rearward. A schematic enlarged side view of the state in which the laminate on the last side is located directly below the part identification camera and the electronic component is captured by the part recognition camera.

Fig. 17 is a schematic enlarged front view showing the state in which the laminated body is directly under the tool, in the subsequent Fig. 16.

18 is a partial cross-sectional view showing the adjustment of the welding head in the left-right direction and the front-rear direction and the adjustment of the adsorption portion in the rotation direction so that the tool held in the adsorption portion is located directly above the electronic component. A rough view of the front view.

Fig. 19 is a schematic enlarged front view showing a state in which the suction portion is moved downward and the tool is pressed from above to the laminate in a partial cross section.

Figure 20 is a front elevational view showing a state in which the solder and the functional material are melted by heating the solder and the functional material by means of a heater and a partial cross-section.

Hereinafter, a mode for carrying out the component mounting device of the present invention will be described with reference to the drawings.

A plurality of welding heads are arranged on the component mounting device. Hereinafter, the arrangement direction of the soldering tips will be described as a left-right direction. In addition, the upper and lower left and right directions shown below are shown for convenience of explanation, and the implementation of the present technology is not limited to these directions.

<Configuration of part assembly device>

First, the configuration of the component mounting device 1 will be described.

The component mounting device 1 has a base 2 that is placed on the ground or the like, and a support frame 3 that is disposed on the upper side of the base 2 (see FIGS. 1 to 5).

Various control units (not shown) are disposed inside the base 2 .

The support frame 3 is configured to be separated from the left and right at a position offset from the rear end in the upper surface of the base 2.

A web 4 is formed between the support frames 3. On the upper surface side of the connecting plate 4, a guiding protrusion 4a that extends left and right and protrudes upward is provided in a manner to separate the front and rear sides. The first drive motor 5 is mounted on the connecting plate 4 so as to be separated from each other. The first drive motor 5 is disposed, for example, three on each of the right and left sides.

On the web 4, for example, six moving bases 6 arranged in the left-right direction are movably supported in the left-right direction. On the lower surface side of the moving base 6, the guided protrusions 6a which extend left and right and protrude downward are provided in the manner of separating the front and rear sides, respectively. The movable base 6 is guided by the guide protrusions 4a and can be individually moved in the left-right direction by the first drive motor 5, respectively.

Guide projections 6b extending forward and backward and protruding upward are provided on the upper surface side of the movable base 6, respectively. A second drive motor 7 is mounted on the moving base 6, respectively.

The moving member 8 is movably supported in the front-rear direction on the moving base 6, respectively. On the lower surface side of the moving member 8, a guided protrusion 8a that protrudes downward is provided in a manner to separate the front and rear sides, respectively. The moving member 8 is guided so that the guided protrusion 8a is guided by the guiding protrusion 6b and can be separately moved by the second driving motor 7 in the front-rear direction.

Welding heads 9 are respectively formed on the front surface of the moving member 8. As shown in Fig. 6, the welding head 9 has a structure-mounted base 10 that extends in the up-down direction and a drive that is rotatable relative to the frame-mounted base 10 so as to be movable in the up-down direction and capable of extending in the up-down direction. The body 11, the lower end portion of the driving body 11 is provided as the adsorption portion 11a, and is downward from the mounted base 10. protruding. The driver 11 is provided with a heater 11b disposed inside the adsorption unit 11a (see FIG. 7), and as the heater 11b, for example, a pulse heater is used. The lower surface of the heater 11b and the lower surface of the adsorption portion 11a substantially coincide with each other in the vertical direction.

As described above, since the pulse heater is used as the heater 11b in the component mounting apparatus 1, the temperature rise and fall speed is high, and the temperature uniformity is excellent, so that the operation time during heating and cooling can be shortened, and the manufacturing process can be suppressed. Deviation in quality.

A third drive motor (not shown) is disposed inside the framed base 10, respectively. The driving body 11 can be individually moved in the vertical direction with respect to the mounted chassis 10 by the third driving motor.

Rotating motors 12 are respectively disposed on the front surface of the assembled base 10 (see FIGS. 1 to 5). The driving body 11 can be individually rotated by the rotation motor 12 with respect to the framed base 10 with the axis S as a fulcrum.

The welding head 9 can be moved separately in the left-right direction. The moving base 6 and the moving member 8 are moved in the left-right direction by the first driving motor 5 with respect to the connecting plate 4, and the movement of the welding head 9 in the left-right direction proceeds with the movement of the moving base 6 and the moving member 8.

Further, the welding head 9 can also be moved separately in the front-rear direction. The moving member 8 is moved in the front-rear direction with respect to the moving base 6 by the second driving motor 7, and the movement of the welding head 9 in the front-rear direction is performed in accordance with the movement of the moving member 8.

A part identification camera 13 is mounted on the front surface of the mounted base 10 defined in the package base 10. Since the component recognition camera 13 is attached to the chassis 10 to be mounted, it moves in the left-right direction and the front-rear direction as the frame 10 is moved in the left-right direction and the front-rear direction. The part identification camera 13 has a pair that exists below the part recognition camera 13 The function of image recognition by the object recognizes the orientation of the electronic component described later in the horizontal direction and the direction of rotation in the horizontal direction.

In this manner, since the component recognition camera 13 is mounted on the mounted base 10 of the welding head 9 that can move in the left-right direction and the front-rear direction, a dedicated mechanism for moving the component recognition camera 13 is not required, and the component construction can be realized. Simplification of the structure of the mounting device 1 and reduction in manufacturing cost.

A guide portion 14 is provided on the upper surface of the base 2. The guide portion 14 has a base table 14a that faces in the vertical direction and a pair of guide rails 14b that protrude upward from the base table 14a. The guide rail 14b extends in the front-rear direction and is disposed to be separated left and right.

The moving portion 15 is movably supported in the front-rear direction on the guide portion 14. The moving unit 15 has a base body 16, a moving stage 17, and a tool holder 18. The moving portion 15 moves between the front moving end, that is, the ready position and the rear moving end.

The base body 16 has a base plate portion 16a formed in a plate shape in the vertical direction, and a guided portion 16b configured to be vertically separated from the lower surface of the base plate portion 16a. The guided portion 16b of the base body 16 is slidably supported by the guide rail 14b of the guide portion 14 in the front-rear direction.

The moving stage 17 has a flat-shaped stage portion 17a that faces in the up-and-down direction, and a framed projection 17b that protrudes downward from the lower surface of the stage portion 17a, and the framed projection 17b is attached to the base. The upper surface of the base plate portion 16a of the body 16.

A plurality of suction holes (not shown) that open upward are formed in the stage portion 17a of the moving stage 17, and the stage portion 17a has a function of attracting and holding a semiconductor wafer, which will be described later, as a structure. A heater (not shown) is incorporated in the stage portion 17a, and is configured to be heated by heating. The semiconductor wafer placed on the stage portion 17a is heated to maintain a constant temperature.

The tool holder 18 has a flat-shaped holding surface portion 19 that faces in the vertical direction, and a connecting protrusion 20 that protrudes downward from the rear end portion of the holding surface portion 19. The connecting protrusion 20 is coupled to the front end portion of the stage portion 17a. In the holding surface portion 19, an arrangement recess portion 19a that opens upward is formed so as to be spaced apart from the left and right. The upper surface of the holding surface portion 19 is located at substantially the same height as the upper surface of the stage portion 17a.

Further, although the example in which the tool holder 18 is coupled to the front end portion of the stage portion 17a has been described above, the tool holder 18 may be coupled to the rear end portion of the stage portion 17a.

A tool 21 is held on the tool holder 18 (refer to Fig. 7). The tool 21 is formed of, for example, a highly thermally conductive material, and is formed integrally with a pressed surface portion 22 that is formed in a rectangular flat shape and that faces in the vertical direction and a pressing portion 23 that is coupled to the lower surface of the adsorbed surface portion 22, and the pressing portion 23 is formed as Cuboid.

The outer shape of the pressing portion 23 is smaller than the outer shape of the surface to be adsorbed 22, and is connected to a portion other than the outer peripheral portion of the surface to be adsorbed 22.

The tool 21 is held by the tool holder 18 by the pressing portion 23 being inserted into the arrangement recess 19a.

A tool recognition camera 24 is mounted on the rear end portion of the stage portion 17a in the moving stage 17. Since the tool recognition camera 24 is mounted on the moving stage 17, it can be moved in the front-rear direction as the moving stage 17 moves in the front-rear direction. The tool recognition camera 24 has a function of recognizing an object existing above the tool recognition camera 24, and recognizes the orientation of the tool 21 in the horizontal direction and the direction of rotation in the horizontal direction.

In this manner, the tool recognition camera 24 is mounted on the moving stage 17 that can move in the forward and backward directions, so that a dedicated mechanism for moving the tool recognition camera 24 is not required, so that the configuration of the component mounting device 1 can be simplified. Reduction in manufacturing costs.

Further, although the example in which the tool recognition camera 24 is attached to the rear end portion of the stage portion 17a has been described above, the tool recognition camera 24 may be attached to the front end portion of the stage portion 17a.

A drive mechanism 25 is disposed on the base 14a of the guide portion 14. The drive mechanism 25 is provided with a drive motor 25a and a lead screw 25b that is rotated by the drive force of the drive motor 25a. The drive motor 25a is disposed at the rear end portion of the base table 14a. When the lead screw 25b is rotated by the driving force of the drive motor 25a, the guided portion 16b is guided by the guide rail 14b to move the moving portion 15 in the forward and backward directions in accordance with the rotational direction of the screw shaft 25b.

<Configuration of Peripheral Devices>

The component mounting device 500, the component carrying device 600, and the component carrying device 700 are disposed around the component mounting device 1 (see Fig. 8). In addition, the configuration body loading device 600 and the component body unloading device 700 can be provided as a part of the structure of the component mounting device 1 in the form of the component carrying portion and the component carrying device, respectively.

As shown in FIG. 9, the component mounting apparatus 500 is a device in which the laminated body 400 is placed in a tentative state, and the laminated body stacks the electronic component 300 via the functional material 200 on the semiconductor wafer 100 used as the package. And constitute. In addition, the functional material 200 is attached to the lower surface of the electronic component 300, and the bump 301 is exaggerated in FIG. 9, so that the functional material 200 is in a large undulating state, but the bump 301 is actually a small protrusion, so the function The material 200 is attached to the lower surface of the electronic component 300 in a substantially planar state. On the semiconductor wafer 100, by zero The component mounting apparatus 500 is placed in a state of being separated at an equal interval, and a plurality of stacked bodies 400 are placed in a temporarily placed state (see FIG. 10).

Further, as the functional material 200, for example, a slurry-like or film-like material having a function as a bonding material, a sealing material, or a reinforcing material is used, and specifically, an underfill material, a non-contact film, or a non-use is used. Various materials such as contact paste.

The component loading device 600 is located between the component mounting device 500 and the component mounting device 1, and has a loading conveyor 601 and a heat insulating heater 602 (see Fig. 8). The carry-in conveyor 601 has a feed roller 601a placed to be separated from each other and a conveyor belt 601b fed by the feed roller 601a. The heat retention heater 602 is disposed between the feed rollers 601a.

The component carrying device 700 is provided on the opposite side of the component carrying device 600 with the component mounting device 1 interposed therebetween, and has a carry-out conveyor 701. The carry-out conveyor 701 has a feed roller 701a placed to be separated from each other and a conveyor belt 701b fed by the feed roller 701a.

Further, in the package carrying-out device 700, in order to prevent warpage of the semiconductor wafer 100 due to rapid cooling, etc., it is also possible to provide a heat insulating heater (not shown) that performs heat retention.

The package loading device 600 has a function of moving the semiconductor wafer 100 from the component mounting device 500 to the movable portion 15 to move the stage portion 17a of the stage 17, and the package carrying device 700 has the semiconductor wafer 100 from the load. The function of the table portion 17a being carried out and transported to a predetermined position.

A predetermined circuit pattern is formed on the semiconductor wafer 100, and a connection terminal 101 is formed at each end portion of the circuit pattern (see FIG. 9). In the semiconductor wafer 100, the laminated body 400 is placed in a temporarily placed state by the component mounting apparatus 500, and the laminated body 400 is previously composed of the functional material 200 and the electronic component 300 so as to cover the connection terminal 101 (refer to the ninth aspect). Figure and Figure 10). On the upper and lower surfaces of the electronic component 300, bumps 301 are respectively provided in the form of vertical and horizontal separation. Solder 302 used as a molten material is applied to the front end portion of the bump 301, respectively. Further, the molten material is not limited to the solder 302, and may be another metal material that can be melted.

In the laminate 400, at the lowermost portion, the solder 302 is located directly above the connection terminal 101 via the functional material 200, and at the upper portion than the lowermost portion, the solder 302 on the upper surface side of the lower electronic component 300 is via The functional material 200 is located directly under the solder 302 on the lower surface side of the electronic component 300 on the upper side.

As described above, in the state in which the laminated body 400 is placed on the semiconductor wafer 100 by the component mounting apparatus 500, the functional material 200 and the solder 302 are heated to a predetermined temperature state which is not melted.

As described above, the heat insulating heater 602 is provided in the structure carrying device 600, and when the semiconductor wafer 100 in which the functional material 200 and the electronic component 300 are placed in the temporary state by the loading conveyor 601, The functional material 200 and the solder 302 are insulated by the heat retention heater 602.

Further, when the heat retaining heater is provided in the component carrying device 700, when the semiconductor wafer 100 to which the laminate 400 is bonded is carried out by the carry-out conveyor 701, the functional material 200 and the heat insulating heater are used. Solder 302 is insulated.

<Operation of part assembly device>

Next, a configuration of the component mounting device 1 when the electronic components 300 are bonded to each other and the lowermost electronic component 300 is bonded to the semiconductor wafer 100 will be described.

First, an initial state of each unit before the semiconductor wafer 100 is carried into the component mounting apparatus 1 by the package loading device 600 will be described.

The moving portion 15 is a ready position at the moving end in the initial state, and the tool holder 18 is located at the moving end in the front (see FIG. 11).

In the initial state, the driving body 11 is located at the upper moving end, and the welding head 9 is in the left-right direction, that is, the state in which the pitch becomes the narrowest (refer to FIGS. 1 to 3).

When the mounting operation is performed, first, before the semiconductor wafer 100 is carried into the component mounting device 1 by the component loading device 600, the preceding operation is performed.

As a prior operation, first, the moving unit 15 is moved rearward by the drive mechanism 25 (refer to Fig. 12). The moving tool 15 is moved rearward, and the predetermined tool 21 is located directly below the welding head 9. The predetermined tool 21 is of a size corresponding to the laminated body 400 temporarily placed on the semiconductor wafer 100 carried in thereafter.

Next, the driving body 11 moves downward in the bonding head 9. At this time, the negative pressure is applied to the adsorption unit 11a, and the tool 21 is sucked and taken out from the tool holder 18 by the adsorption unit 11a, and the driving body 11 is moved upward and the tool 21 is held by the adsorption unit 11a (see Fig. 13).

Next, as the preceding operation, the moving unit 15 moves forward, and the tool recognition camera 24 is positioned directly below the tool 21 held by the adsorption unit 11a (see FIG. 14). When the tool recognition camera 24 is located directly below the tool 21, the welding head 9 is moved in the left-right direction, the tool 21 sequentially passes the tool recognition camera 24 directly above, and the tool recognition camera 24 sequentially photographs the tool 21 (refer to Fig. 15). When the imaging of the tool 21 that has been attached to the adsorption unit 11a by the tool recognition camera 24 is completed, the welding head 9 moves in the left-right direction and returns to the initial state in which the pitch becomes the narrowest, and the moving portion 15 moves to the front mobile end. The position returned to the initial state is also the preparation position.

If the tool 21 is photographed by the tool recognition camera 24, it is based on the captured image. The image data identifies the position and orientation of the photographed tool 21 in the horizontal direction. The position in the horizontal direction is the position (coordinate) in the front-rear direction and the position (coordinate) in the left-right direction, and the orientation in the horizontal direction is the direction in the rotation direction with respect to the reference position with the axis extending in the up-down direction as a fulcrum ( Rotation angle).

When the above-described prior operation is completed, the semiconductor wafer 100 on which the stacked body 400 is placed in the temporary state is carried into the stage portion 17a of the moving stage 15 to move the stage 17 by the package carrying device 600. The semiconductor wafer 100 carried into the stage portion 17a is sucked and held on the stage portion 17a.

At this time, the semiconductor wafer 100 is kept warm by the heat retention heater 602, and the functional material 200 is kept in a state of being easily melted while maintaining a high temperature state close to the melting temperature. Further, in a state where the semiconductor wafer 100 is carried into the stage portion 17a, the semiconductor wafer 100 and the laminated body 400 are also insulated by the heater assembled to the stage portion 17a, thereby holding the functional material 200 and the solder 302. Insulation status.

When the semiconductor wafer 100 is held by the stage portion 17a of the moving stage 17, the moving portion 15 moves rearward, and the laminated body 400 on the rearmost side or the laminated body 400 on the foremost side is located directly below the part identification camera 13. (Refer to Figure 16).

When the laminated body 400 is located directly below the part identification camera 13, the welding head 9 is moved in the left-right direction, or the moving portion 15 is moved in the front-rear direction, and the laminated body 400 sequentially passes through the part identification camera 13 directly, and the part recognition camera is 13 The uppermost electronic component 300 in the laminated body 400 is sequentially photographed. When the imaging of all the electronic components 300 in the uppermost stage by the part identification camera 13 is completed, the welding head 9 moves in the left-right direction and returns to the initial state in which the pitch becomes the narrowest, and the moving portion 15 moves to the front moving end and returns. The position to the initial state That is, the location is prepared.

When the electronic component 300 of the uppermost stage is captured by the part identification camera 13, the position and orientation of the captured electronic component 300 in the horizontal direction are identified based on the captured image data. The position in the horizontal direction is the position (coordinate) in the front-rear direction and the position (coordinate) in the left-right direction, and the orientation in the horizontal direction is the direction in the rotation direction with respect to the reference position with the axis extending in the up-down direction as a fulcrum ( Rotation angle).

Next, the joining operation of the laminated body 400 based on the bonding head 9 is started. When the joining operation is started, the moving portion 15 moves rearward, and the laminated body 400 is positioned directly below the tool 21 (see FIG. 17). At this time, for example, the laminated body 400 is located directly under the tool 21 every plurality.

If the laminated body 400 is located directly under the tool 21, the recognition result of the tool recognition camera 23 based on the identification result of the tool recognition camera 24 and the uppermost electronic component 300 located directly below is determined based on the recognition result of the component recognition camera 13 by the tool. The position and orientation of each of the tools 21 coincide with the position and orientation of each of the electronic components 300 located immediately below. In other words, the welding head 9 is slightly moved in the left-right direction by the first drive motor 5 so that the position and orientation of each tool 21 coincide with the position and orientation of each of the electronic components 300 located immediately below. The adjustment is performed, and the second drive motor 7 is slightly moved in the forward and backward directions to be adjusted, and the adsorption portion 11a is adjusted by the rotation motor 12 being slightly rotated slightly.

By adjusting the welding head 9 in the left-right direction and the front-rear direction and adjusting the direction of rotation of the adsorption portion 11a in the rotation direction, the center portion of the tool 21 of the adsorption portion 11a and the central portion of the electronic component 300 located directly below are held. The orientation in the vertical direction is the same, and the orientation of the tool 21 in the horizontal direction coincides with the orientation of the electronic component 300 in the horizontal direction (refer to the 18th). Figure).

Then, the adsorption unit 11a moves downward, and the tool 21 is pressed against the laminate 400 from above (see FIG. 19).

Further, in the case where the bump 301 is provided on the upper surface of the uppermost electronic component 300, it is preferable that the lower surface side of the pressing portion 23 of the tool 21 is formed with an insertion recess that opens downward. The insertion recess formed in the tool 21 may be formed to be separated from the front and rear sides, or may be formed in a straight line extending in the front-rear direction or the left-right direction. In the case where the insertion recess is formed in the tool 21, when the tool 21 is pressed against the laminated body 400 from above, each of the projections is inserted into the insertion recess.

As described above, since the respective bumps formed on the upper surface of the electronic component 300 located at the uppermost stage are respectively inserted into the insertion recesses, the tool 21 does not come into contact with the solder 302 applied to the front end portion of the bumps 301, thereby preventing the solder 302 from being prevented. It is detached from the bump 301 or the unintended melting of the solder 302.

Further, the electronic component 300 and other structures joined by the bumps 301 are mounted on the upper side of the uppermost electronic component 300. However, as described above, the solder 302 is prevented from falling off from the bumps 301 or the solder 302 is not. In order to melt, the other electronic components 300 and other structures can be appropriately mounted on the upper side of the electronic component 300.

When the tool 21 is pressed against the laminated body 400 from above, the electronic component 300 is heated via the tool 21 by the heater 11b provided in the driving body 11. Therefore, the solder 302 and the functional material 200 are heated by the heater 11b. The heated solder 302 and the functional material 200 are melted, the solder 302 crushes the functional material 200, and the connection terminal 101 or the solder 302 are in contact with each other (refer to Fig. 20).

At this time, since the pulse heater is used as the heater 11b, the laminate 400 is quickly pressed by the heating and cooling of the solder 302 and the functional material 200 in a state of being pressed against the adsorption portion 11a. Therefore, the rapid rise and fall of the temperature of the solder 302 and the functional material 200 can be ensured, and the floating portion of the joint portion can be prevented and the highly reliable joint state can be ensured, so that the quality deviation of the manufactured product can be suppressed.

Since the functional material 200 is cured after melting, the electronic component 300 is bonded to the electronic component 300 from the periphery and filled between the lower surface of the lowermost electronic component 300 and the upper surface of the semiconductor wafer 100, and the electronic component 300 is bonded by the functional material 200. The semiconductor wafer 100 is filled and filled between the electronic components 300 such that the electronic components 300 are bonded to each other by the functional material 200.

Next, in a state where the tool 21 is sucked by the adsorption unit 11a, the driving body 11 is moved upward. When the driving body 11 is moved upward, the pressing state of the laminated body 400 by the adsorption portion 11a can be released.

The driving body 11 moves to the upper moving end, and the adsorption portion 11a moves to the upper moving end, thereby completing the joining operation for the six stacked bodies 400 at one time.

When the driving body 11 is moved to the upper moving end, the welding head 9 is moved only in the left-right direction by an amount corresponding to one pitch of the laminated body 400, and then the joining of the other laminated body 400 by the bonding head 9 is performed in the same manner as described above. action. The movement of the welding head 9 at each pitch and the joining operation of the laminated body 400 are repeated.

The moving portion 15 is moved in the left-right direction or the front-rear direction so that the laminated bodies 400 that are not joined are sequentially positioned directly below the tool 21, and the joining operation of all the laminated bodies 400 by the bonding heads 9 is performed.

Engagement of all of the laminates 400 placed on the semiconductor wafer 100 When the operation is completed, the moving unit 15 moves forward to the front mobile end, that is, the preparation position. When the moving portion 15 is moved to the preparation position, the moving stage 17 stops sucking the semiconductor wafer 100, and the holding state of the semiconductor wafer 100 is released.

Further, when the bonding operation of the stacked body 400 placed on the new semiconductor wafer 100 is not performed, the operation of inserting the tool 21 held by the adsorption portion 11a into the arrangement concave portion 19a of the tool holder 18 is performed.

When the holding state of the semiconductor wafer 100 based on the moving stage 17 is released, the semiconductor wafer 100 is held by the package carrying-out device 700, and is carried out to a predetermined position by the structure carrying-out device 700.

In the above, an example in which the tool 21 is captured by the tool recognition camera 24 before the semiconductor wafer 100 is carried into the moving stage 17 is described. However, the state in which the semiconductor wafer 100 is carried into the moving stage 17 may be performed. Next, the moving stage 17 is moved rearward, the tool 21 is sucked by the suction portion 11a, and the tool 21 is photographed based on the tool recognition camera 24.

<summary>

As described above, in the component mounting apparatus 1, each tool 21 is used in accordance with the position and orientation of each tool 21 recognized by the tool recognition camera 24 and the position and orientation of each electronic component 300 recognized by the component recognition camera 13. The position and orientation of the respective electronic components 300 are controlled so as to match the positions and directions of the respective electronic components 300 in the front, rear, left, and right positions and in the rotational direction.

Therefore, according to the position and orientation of each tool 21 recognized by the tool recognition camera 24 and the position and orientation of each electronic component 300 recognized by the component recognition camera 13, The orientation of each of the electronic components 300 in the horizontal direction and the direction of the rotational direction are corrected in the horizontal direction and the orientation in the rotational direction, respectively, and the tools 21 are pressed against the respective electronic components 300. The component 300 has a good bonding state to the semiconductor wafer 100 and other electronic components 300.

Further, in the component mounting apparatus 1, a plurality of electronic components 300 are placed on the semiconductor wafer 100 in advance in a state of being stacked in the vertical direction, and the uppermost electronic component 300 is horizontally positioned by the component recognition camera 13. The position and orientation are identified.

As described above, in the so-called laminated chip in which a plurality of electronic components 300 are stacked in the vertical direction, as the number of segments of the electronic component 300 increases, the possibility that the laminated body 400 is tilted and tilted increases, but as described above, By the component recognition camera 13 recognizing the position and orientation of the uppermost electronic component 300 in the horizontal direction, it is possible to secure the electronic component 300 to the semiconductor wafer 100 even when the inclination of the laminated body 400 is increased. Good bonding with other electronic components 300.

In addition, since the movable stage 17 on which the semiconductor wafer 100 is placed and moved in the horizontal direction in the downward direction of the adsorption unit 11a is provided, the bonding operation of the plurality of stacked bodies 400 by the plurality of adsorption units 11a can be continuously performed. Thereby, the manufacturing efficiency can be improved.

Further, since the tool holder 18 holding the plurality of tools 21 is provided on the component mounting device 1, and the tool holder 18 is mounted on the moving stage 17, a dedicated mechanism for moving the tool holder 18 is not required. Thereby, simplification of the structure and reduction in manufacturing cost can be further achieved.

Further, in another component mounting device (a conventional component mounting device), there is a device in which an electronic component 300 is sucked and taken out from a component storage portion by a plurality of adsorption portions, and sucked The electronic component 300 is moved and placed on the semiconductor wafer 100 carried in by the component loading device 600, and the bonding operation of the electronic component 300 is continued in this state. Therefore, in such a component mounting apparatus, the mounting operation (mounting process) of the electronic component 300 on the semiconductor wafer 100 and the bonding operation (joining process) of the electronic component 300 are alternately repeated.

On the other hand, in the component mounting apparatus 1, the semiconductor wafer 100 is carried by the package loading device 600, and the electronic component 300 in a state of being temporarily placed on the loaded semiconductor wafer 100 is joined (joined) Process). Therefore, it is not necessary to alternately repeat the placing operation and the joining operation, and the joining operation to the electronic component 300 can be continuously performed, and the productivity per unit time (UPH: Utility Per Hour) relating to the joining operation of the electronic component 300 is high. Can increase productivity.

<Other>

In the above, the laminated body 400 of the so-called laminated chip in which a plurality of electronic components 300 are stacked in the vertical direction is shown. However, the object to be bonded by the component mounting device 1 is not limited to the laminated chip. The laminate 400 can also be a single electronic component 300.

Also, for example, when one electronic component is bonded to the semiconductor wafer 100, it is not necessary to provide bumps on the upper and lower surfaces, and the bumps may be provided only on the lower surface side.

In the above description, the semiconductor wafer 100 is illustrated as an example of the arrangement of the laminated body 400. However, the package is not limited to the semiconductor wafer 100, and may be a circuit board or an electronic component. When the package is an electronic component, a so-called laminated chip in which the electronic component 300 is bonded to the electronic component is used.

Further, although the above example has been described in which the laminated body 400 is pressed downward by the tool 21, the pressing portion 11a may be pressed downward by, for example, the tool 21 is not provided. Stack 400.

11‧‧‧Driver

11a‧‧‧Adsorption Department

11b‧‧‧heater

21‧‧‧ Tools

22‧‧‧Adsorbed face

23‧‧‧ Pressing Department

100‧‧‧Semiconductor wafer (construction body)

101‧‧‧Connecting terminal

200‧‧‧ functional materials

300‧‧‧Electronic parts

301‧‧‧Bumps

302‧‧‧Solder (melted material)

400‧‧‧Laminated body

Claims (6)

A component mounting apparatus comprising: a plurality of soldering heads each having a heater for heating a plurality of electronic components previously placed on the mounting body via a molten material to melt the molten material; The adsorption unit sucks the tool pressed against the electronic component when the electronic component is heated, and the soldering tip heats and presses the electronic component via the tool; the tool recognition camera is respectively attached to the electronic component a plurality of the plurality of tools of the plurality of adsorption portions perform image recognition at respective positions and orientations in the horizontal direction; and a component recognition camera for horizontally arranging the plurality of electronic components previously placed on the structure Image recognition is performed at each position and each direction, and the component mounting device is provided with a moving stage on which the movable body is placed and moved horizontally in the downward direction of the welding head, and the plurality of adsorptions The part can be moved separately in the up-down direction, the left-right direction, and the front-rear direction, and can be extended upward and downward. The fulcrum is rotated independently, and the position and orientation of each of the aforementioned electronic components recognized by the camera and the position and orientation of the electronic components identified by the component recognition camera are respectively determined by the position and orientation of the respective tools. The orientation of each of the adsorbing portions in the front, rear, left, and right positions and the direction of rotation is controlled so that the positions and orientations of the pressed electronic components are the same. The component mounting device according to the first aspect of the invention, wherein the plurality of electronic components are placed on the structure in advance in a state of being stacked in the up-and-down direction, and the upper part is identified by the component recognition camera. The aforementioned electronic parts are in the horizontal direction Each position and each orientation is identified. The component mounting device according to claim 1, wherein the component identification imaging mechanism is mounted on one of the soldering tips. The component mounting device according to claim 1, wherein the tool recognition imaging mechanism is mounted on the moving stage. The component mounting device according to claim 1, wherein the component mounting device is provided with a tool holder for holding a plurality of the tools, and the tool holder is mounted on the moving stage. The component mounting device according to claim 4, wherein the component mounting device is provided with a tool holder for holding a plurality of the tools, and the tool holder is mounted on the moving stage.