JP5535395B1 - Component mounting equipment - Google Patents

Abstract

[PROBLEMS] To improve versatility.
SOLUTION: A suction part 48 for sucking a plurality of electronic components 300 previously placed at equal intervals on a substrate 100 via solder 301 and a heater 51 for heating at least the solder are provided, and each suction part is sucked by the suction part. A plurality of suction heads 42 that join the plurality of electronic components to predetermined positions of the substrate by solder, a plurality of drive bodies 41 that respectively move the plurality of suction heads in the vertical direction, and a plurality of drive bodies connected to the plurality of drive bodies. A drive link mechanism 53 that varies the drive body and the plurality of suction heads at an equal interval pitch and moves the plurality of drive bodies and the plurality of suction heads integrally in a variable direction of the pitch at an equal interval pitch is provided.
[Selection] Figure 17

Description

  The present invention relates to a component mounting apparatus having a plurality of suction heads each provided with a suction portion and movable in the vertical direction, each of which sucks an electronic component by each suction portion and joins and mounts the electronic components at a predetermined position by soldering In the technical field.

JP-A-8-222608 JP 2012-114382 A

  There is a component mounting apparatus that has a suction head for sucking an electronic component and mounts the sucked electronic component by bonding to a predetermined position of a mounting body such as a substrate by soldering (for example, see Patent Document 1 and Patent Document 2). .

  In the component mounting apparatus described in Patent Document 1, the suction head is movable by the first drive mechanism in a direction orthogonal to the substrate transport direction, and the suction head is moved up and down by the second drive mechanism. Has been made movable. When the substrate is transported to a predetermined work position, the suction head that sucks the electronic components is moved to a position directly above the substrate by the first drive mechanism, and then the suction head is lowered by the second drive mechanism. Then, each joining electrode of the electronic component is aligned with each electrode of the substrate, and the electronic component is placed on the substrate. Subsequently, the bonding electrode of the electronic component is pressed by the suction head, and the bonding electrode is heated by a heater provided in the suction head, and each bonding electrode is bonded to each electrode by soldering and mounted.

  In the component mounting apparatus described in Patent Document 2, a plurality of suction heads are arranged side by side, and the plurality of suction heads are integrally movable in the arrangement direction. A plurality of electronic components are placed on the substrate in advance at predetermined intervals, and when the substrate is transported below the plurality of suction heads, the plurality of suction heads are lowered to attract the electronic components to the respective suction heads. Is done. Subsequently, each suction head that sucks each electronic component is slightly moved up and down to adjust the height position of each electronic component, and each electronic component is heated by a heater provided in each suction head, so that the electronic component becomes a substrate. It is joined and soldered to the connection terminal of the connector.

  In the component mounting apparatus described in Patent Document 2, since a plurality of electronic components are joined to a substrate at a time by a plurality of suction heads, the manufacturing time of the product can be shortened and the manufacturing cost can be reduced. It is possible to reduce this.

  However, the arrangement position of a plurality of electronic components with respect to a mounting body such as a board may differ depending on the type of product to be manufactured. It is desirable that the joining work can be performed by the apparatus.

  In this way, by allowing a single component mounting apparatus to mount even when the arrangement positions of a plurality of electronic components on the substrate are different, it is possible to reduce costs by improving versatility.

  Therefore, an object of the component mounting apparatus of the present invention is to overcome the above-described problems and improve versatility.

1stly, the component mounting apparatus which concerns on this invention has the adsorption | suction part which each adsorb | sucks several electronic components previously mounted in the mounting body through the solder at equal intervals pitch, and the heater which heats at least the said solder And a plurality of suction heads for joining the plurality of electronic components respectively sucked by the suction portion to the predetermined positions of the mounting body by the solder, and a plurality of driving bodies for moving the plurality of suction heads in the vertical direction, respectively. , wherein the plurality of pitch at equal intervals state the said plurality of driver plurality of suction heads with coupled to the drive member to vary the pitch of the plurality of driver plurality of suction head at equal intervals in the state of a drive linkage for moving together to the variable direction, the the drive linkage first axis and a second axis parallel are provided extending in the variable direction, the first The shaft is rotated to move the plurality of driving bodies and the plurality of suction heads integrally in the variable direction, and the second shaft is rotated to vary the pitches of the plurality of driving bodies and the plurality of suction heads. It is what is done.

As a result, the pitch of the plurality of suction heads can be varied according to the pitch of the plurality of electronic components previously placed on the mounting body by the drive link mechanism, and the plurality of suction heads can move in the direction in which the plurality of electronic components are arranged. To be. Further, any one of the shafts is rotated to change or move the pitch between the driving body and the suction head.

Second , in the component mounting apparatus according to the present invention described above, the drive link mechanism is provided with a link body connected to the plurality of drive bodies, and a ball screw shaft having a thread groove as the first shaft. Preferably, a spline shaft that guides the link body in the variable direction is provided as the second shaft.

  As a result, the ball screw shaft is rotated to move the plurality of drive bodies and the plurality of suction heads integrally in the variable direction, and the spline shaft is rotated to vary the pitches of the plurality of drive bodies and the plurality of suction heads.

Third, in the component mounting apparatus according to the present invention described above, the substrate is used as the mounting member, the functional material between said plurality of electronic component substrate are filled respectively, with the plurality of suction heads It is preferable that a protective tape that extends in the variable direction and separates the functional material and the suction head is positioned between the electronic components.

  Thereby, the protective tape is positioned between the melted functional material and the suction head.

Fourth, in the component mounting apparatus according to the present invention described above, a plurality of air flow holes at the same interval as the pitch of the plurality of electronic components on the protective tape that is formed preferably.

  Thereby, the electronic component can be adsorbed by the adsorbing portion in a state where the protective tape is positioned between the electronic component and the adsorbing head.

Fifth , in the above-described component mounting apparatus according to the present invention, it is preferable that a tape feeding mechanism for feeding the protective tape in the variable direction is provided.

  This makes it possible to use a new portion of the protective tape for each repeated suction operation.

Sixth, in the component mounting apparatus according to the present invention described above, the when increasing the suction head, sticking prevention portion which is to be contactable from above the protective tape at the lower of the suction head that is provided desirable.

  As a result, when the suction head is moved upward, the sticking prevention portion is brought into contact with the protective tape from above, and the protective tape can be detached from the suction portion.

Seventh , in the above-described component mounting apparatus according to the present invention, it is desirable that the protective tape can be sucked to the suction portion.

  Thereby, the position shift of a protective tape does not arise with respect to an adsorption | suction part.

Eighth , in the above-described component mounting apparatus according to the present invention, the plurality of heaters are set to a first heater that is set to a first heating temperature and a second heating temperature that is higher than the first heating temperature. The plurality of suction heads are provided with the first heater or the second heater, and the same electronic component is heated by the first heater and the second heater. It is desirable that heating by the heater No. 2 is performed in order.

  Thereby, heating with respect to an electronic component is performed in order by the 1st heater of constant temperature heating and the 2nd heater of constant temperature heating.

According to the present invention, the pitch of the plurality of suction heads is varied according to the pitch of the plurality of electronic components arranged in advance on the mounting body by the drive link mechanism, and the plurality of suction heads move in the arrangement direction of the plurality of electronic components. Since it can be moved, a plurality of electronic components having different arrangement positions with respect to the mounting body can be sucked by the suction head, and the cost can be reduced by improving versatility. Further, any one of the shafts is rotated to change or move the pitch between the driving body and the suction head.

2 to 45 show an embodiment of the component mounting apparatus of the present invention, and this figure is a schematic perspective view of the component mounting apparatus. It is a schematic perspective view of the component mounting apparatus shown in the state seen from the direction different from FIG. It is a schematic front view of a component mounting apparatus. It is a schematic side view of a component mounting apparatus. It is an expansion perspective view which shows an arrangement | positioning stand, a tool holder, a drilling block, and a tool. It is a perspective view which shows a tape feeding mechanism. It is a perspective view of a head structure. It is an expansion perspective view which shows an adsorption | suction part and a tool. It is an enlarged front view which shows a peeling member etc. It is a perspective view of a drive link mechanism. It is a rear view of a drive link mechanism. It is a top view of a drive link mechanism. FIG. 4 is an enlarged perspective view showing a first nut body and a ball screw shaft with a part thereof in cross section. It is an expansion perspective view which shows a nut member and a ball screw shaft. It is an expansion perspective view which shows a 2nd nut body and a spline shaft by making a part into a cross section. It is a rear view of the drive link mechanism which shows the state to which the link body was moved. It is a perspective view of the drive link mechanism shown in a state where the pitch is widened. It is a rear view of the drive link mechanism shown in a state where the pitch is widened. It is the schematic which shows a component mounting apparatus and each peripheral device. It is a schematic front view which shows the state by which the functional material and the electronic component were mounted in the board | substrate. It is a perspective view which shows the board | substrate with which the electronic component was mounted. FIG. 23 to FIG. 34 show the operation of the component mounting apparatus, and this figure is a schematic side view showing the initial state of each part. It is a schematic side view which shows the state by which the tape feeding mechanism was moved ahead. It is a schematic front view which shows the state in which the pitch of the head structure was converted. It is a schematic side view which shows the state by which the board | substrate moving part was moved back. It is a schematic side view which shows the state by which the tool was adsorbed and hold | maintained by the adsorption | suction part. It is a schematic side view which shows the state which the tape feed mechanism was moved back and was located just above the punching block. It is a schematic side view which shows the state in which the drilling operation | work with respect to a protective tape is performed. It is a schematic side view which shows the state by which the protective tape was adsorbed and hold | maintained by the adsorption | suction part. It is a schematic front view which shows the state in which the board | substrate was carried in to the board | substrate moving part. It is a schematic side view which shows the state by which the board | substrate moving part was moved back and the electronic component was located just under the protective tape. It is a general | schematic expanded sectional view which shows the state to which the adsorption | suction part was moved below and the protective tape contacted the electronic component. It is a general | schematic expanded sectional view which shows the state by which the functional material and the solder were fuse | melted by heating. It is a schematic front view which shows the state which the protection tape contacted the peeling member when the adsorption | suction part was moved upwards. FIG. 36 and FIG. 37 show the joining work when different types of electronic components are placed, and this figure is a schematic plan view showing a substrate on which different types of electronic components are placed. It is a schematic front view which shows the state by which the tool used with respect to one kind of electronic component was adsorbed by the adsorption | suction part. It is a schematic front view which shows the state by which the tool used with respect to the other kind of electronic component was adsorbed | sucked to the adsorption | suction part. FIG. 39 to FIG. 41 show an example in which different types of heaters are provided in the adsorption part, and this figure is a schematic diagram showing an example in which the first heater and the second heater are alternately provided in the adsorption part. It is a front view. It is a graph which shows the relationship between time and temperature in the operation | work when a 1st heater and a 2nd heater are provided. It is a schematic front view which shows the state by which the odd-numbered adsorption | suction part is pressed by the electronic component in the joining operation, and is heated with the 1st heater. It is a schematic front view which shows the state in which the even-numbered adsorption | suction part is pressed by the electronic component in the joining operation, and is heated with the 2nd heater. 43 shows an example in which the tool is made elastically deformable together with FIG. 43, and this figure is a schematic front view showing the electronic component together with the tool in a tilted state. It is a schematic front view which shows the state by which the electronic component was hold | suppressed with the tool and the tool was elastically deformed. FIG. 45 is a diagram for explaining the height detection regarding the electronic component, and FIG. 45 is a schematic front view showing a state in which the electronic component placed on the substrate in a temporarily placed state is positioned directly below the suction head. It is a schematic front view which shows the state which the tool contact | connected the electronic component.

  EMBODIMENT OF THE INVENTION Below, the form for implementing this invention component mounting apparatus is demonstrated with reference to an accompanying drawing.

  In the component mounting apparatus, a plurality of suction heads are arranged side by side. Hereinafter, the direction in which the suction heads are arranged will be described as the left-right direction. Note that the following directions in the up / down / front / back / left / right directions are for convenience of explanation, and the implementation of the present technology is not limited to these directions.

<Configuration of component mounting device>
First, the configuration of the component mounting apparatus 1 will be described.

  The component mounting apparatus 1 has a base 2 installed on a floor surface and the like, and a support frame 3 arranged on the upper side of the base 2 (see FIGS. 1 to 4).

  The base 2 includes a top plate portion 4 that faces in the up-down direction, a bottom plate portion 5 that is positioned below the top plate portion 4 and faces in the up-down direction, and a plurality of support portions 6 that connect the top plate portion 4 and the bottom plate portion 5. , 6,... Various control units 7, 7,... Are arranged between the top plate unit 4 and the bottom plate unit 5.

  The support frame 3 is attached to the rear end portion on the upper surface of the top plate portion 4. The support frame 3 extends vertically and is connected to support columns 8 and 8 that are spaced apart from each other and the support columns 8 and 8, and connection plates 9 and 9 that are connected to the front surfaces of the support columns 8 and 8. have.

  The support columns 8 and 8 are attached to both left and right end portions of the rear end portion of the top plate portion 4. Arrangement notches 8a and 8a are formed at the front ends of the support columns 8 and 8 so as to open to the left and right and forward.

  The connecting plates 9 and 9 are spaced apart from each other in the vertical direction, and are attached to the upper ends of the support columns 8 and 8 and the substantially central portion in the vertical direction.

  The mounting plate 10 is attached to the upper half of the support pillars 8 and 8 in the front-rear direction. The mounting plate 10 is formed with a horizontally long insertion hole 10a at the center in the vertical direction. Guide rails 11 and 11 are attached to the front surface of the mounting plate 10 so as to extend left and right above and below the insertion hole 10a.

  A guide portion 12 is provided on the top surface of the top plate portion 4. The guide unit 12 includes a base table 13 and a pair of guide rails 14 and 14 attached on the base table 13. An arrangement recess 13 a that opens upward is formed at the center of the base 13 in the left-right direction. The guide rails 14, 14 extend in the front-rear direction and are spaced apart from each other on the left and right.

  A substrate moving unit 15 is supported on the guide unit 12 so as to be movable in the front-rear direction. The substrate moving unit 15 includes a base body 16, a bonding stage 17, and a mounting base 18. The substrate moving unit 15 is moved between a preparation position which is a front moving end and a rear moving end.

  The base body 16 includes a base plate portion 16a formed in a plate shape facing in the vertical direction and guided portions 16b and 16b attached to the lower surface of the base plate portion 16a so as to be separated from each other in the left-right direction. The base body 16 is supported such that the guided portions 16b and 16b are slidable in the front-rear direction on the guide rails 14 and 14 of the guide portion 12, respectively.

  The bonding stage 17 is attached on the base body 16. The bonding stage 17 functions as a substrate holding portion that sucks and holds a substrate, which will be described later, which is a mounting body, and has a plurality of suction holes (not shown) opened on the upper surface.

  The mounting base 18 has conveyors 18a and 18a positioned before and after the bonding stage 17 and connecting bars 18b and 18b for connecting the left and right ends of the conveyors 18a and 18a, respectively. It is a little bigger. The mounting base 18 is supported by the base body 16 so as to be movable in the vertical direction. A board | substrate is carried in to the conveyors 18a and 18a, and the conveyors 18a and 18a can send a board | substrate to the left-right direction.

  The mounting base 18 includes an upper moving end where the upper surfaces of the conveyors 18a, 18a are located above the upper surface of the bonding stage 17, and a lower moving end where the upper surfaces of the conveyors 18a, 18a are located below the upper surface of the bonding stage 17. It is possible to move up and down by an elevating mechanism (not shown).

  A drive mechanism 19 is arranged in the arrangement recess 13 a formed in the base 13 of the guide unit 12. The drive mechanism 19 is provided with a drive motor 19a and a lead screw 19b that is rotated by the drive force of the drive motor 19a. When the lead screw 19b is rotated by the driving force of the drive motor 19a, the guided portions 16b and 16b are guided by the guide rails 14 and 14, and the substrate moving portion 15 moves in the front-rear direction according to the rotation direction of the lead screw 19b. Is done.

  An arrangement table 20 is attached to the base body 16 (see FIG. 4). As shown in FIG. 5, the arrangement table 20 is an L-shaped attachment leg portion 20 a, 20 a, a connection leg portion 20 b that connects the attachment leg portions 20 a, 20 a, and an arrangement formed in a horizontally long plate shape that faces in the vertical direction. And a plate portion 20c. The left and right end portions of the arrangement plate portion 20c are attached to the upper end portions of the attachment leg portions 20a and 20a, respectively. The arrangement table 20 has front end portions of the mounting leg portions 20 a and 20 a attached to the lower surface of the base portion 16 a in the base body 16.

  On the arrangement plate portion 20c of the arrangement table 20, tool holders 21, 21,...

  The tool holders 21, 21,... Are formed in a horizontally long shape, and for example, four are provided side by side in the front-rear and left-right directions. The tool holders 21, 21,... Are detachable (replaceable) with respect to the arrangement plate portion 20c of the arrangement table 20.

  The tool holder 21 is formed with disposition recesses 21a, 21a,... Opened upward at equal intervals on the left and right. In the tool holders 21, 21,..., The arrangement recesses 21a, 21a,... Of the tool holder 21 positioned on the left front side and the arrangement recesses 21a, 21a of the tool holder 21 positioned on the right front side,. .. And the placement recesses 21a, 21a,... Of the tool holder 21 located on the left rear side and the placement recesses 21a, 21a,. Has been.

  .. Are inserted and held in the arrangement recesses 21a, 21a,... Of the tool holder 21, respectively. The tool 23 is made of, for example, a highly heat-conductive material, and is formed by integrally forming a suction surface portion 24 that is formed in a rectangular flat plate shape and that faces the vertical direction and a pressing portion 25 that is continuous with the lower surface of the suction surface portion 24. The pressing part 25 is formed in a rectangular parallelepiped shape. The pressing portion 25 has an outer shape that is slightly smaller than the outer shape of the suction surface portion 24, and is continuous with a portion excluding the outer peripheral portion of the suction surface portion 24.

  In the tool 23, a component suction hole 23a penetrating vertically is formed at the center, and tape suction holes 23b, 23b,... Penetrating vertically are formed around the component suction hole 23a.

  The pressing portions 25, 25,... Are inserted into the placement recesses 21a, 21a,... And held by the tool holders 21, 21,. Therefore, the pressing portions 25, 25,... Are sized according to the size of the placement recesses 21a, 21a,. .. Different types are used depending on the size.

  The drilling block 22 is arranged on the rear side of the tool holders 21, 21,... And is detachable (replaceable) with respect to the arrangement plate portion 20c of the arrangement table 20.

  The perforating block 22 has a base portion 22a formed in a horizontally long shape and perforating pins 22b, 22b,... Projecting upward from the base portion 22a. The perforating pins 22b, 22b,... Are provided at equal intervals on the left and right sides, and are formed in a tapered shape. The number of the perforating pins 22b, 22b,... Is, for example, the same as the number in the left-right direction of a plurality of electronic components to be described later placed on the substrate, and the spacing is the pitch in the left-right direction of the plurality of electronic components Have been the same. Further, the number of hole punching pins 22b, 22b,... Is an integral multiple of the suction heads described later.

  Different types of hole punching blocks 22 are used depending on the number of electronic components arranged on the substrate in the left-right direction and the pitch in the left-right direction.

  As described above, since the arrangement table 20 is attached to the base body 16 of the substrate moving unit 15, the arrangement table 20, the tool holders 21, 21,. Is moved in the front-rear direction together with the substrate moving unit 15 by the driving force of the driving mechanism 19.

  Support plates 26 and 26 are respectively attached to the front surfaces of the support columns 8 and 8 in the support frame 3 (see FIGS. 1 and 4). The support plates 26 and 26 are located below the mounting plate 10.

  A tape feeding mechanism 27 is supported on the support plates 26 and 26 so as to be movable in the front-rear direction. The tape feeding mechanism 27 has reel plates 28 and 29, tape reels 30 and 31, and support shafts 32, 32,... (See FIG. 6).

  The reel plates 28 and 29 are formed in a plate shape facing in the front-rear direction, and are supported by the support plates 26, 26 via the support shafts 32, 32,. The support shafts 32, 32,... Are extendable in the front-rear direction.

  The reel plate 28 is supported on the left support plate 26 via support shafts 32, 32,..., And a mechanism case 33 containing a rotation mechanism and a torque limiter (not shown) is attached to the rear surface of the reel plate 28. Yes. Pinch rollers 34, 34, 34 are rotatably supported on the front side of the lower end portion of the reel plate 28.

  The tape reel 30 is rotatably supported on the upper end portion of the reel plate 28, and is rotatable by a rotation mechanism and a torque limiter built in the mechanism case 33. The tape reel 30 is, for example, a winding reel.

  The reel plate 28 supports a tape feed motor and a manual winding dial 35.

  The reel plate 29 is supported on the right support plate 26 via support shafts 32, 32,..., And a mechanism case 36 incorporating a rotation mechanism and a torque limiter (not shown) is attached to the rear surface of the reel plate 29. Yes. Pinch rollers 37 and 37 are rotatably supported on the front side of the lower end portion of the reel plate 29.

  The tape reel 31 is rotatably supported on the upper end portion of the reel plate 29, and is rotatable by a rotation mechanism and a torque limiter built in the mechanism case 36. The tape reel 31 is, for example, a supply reel.

  A protective tape 38 is stretched between the tape reel 30 and the tape reel 31 and wound. The width of the protective tape 38 is larger than the width in the front-rear direction of an electronic component described later. When the protective tape 38 is wound around the pinch rollers 34, 34, 34, 37, 37, slack is prevented from being generated by the rotation mechanism and the torque limiter built in the mechanism case 36. The protective tape 38 has an intermediate portion 38 a extending between the reel plates 28 and 29 in the left-right direction and facing in the vertical direction.

  In the tape feeding mechanism 27, the manual winding dial 35 is manually operated to correct the slack of the protective tape 38 and to manually feed the protective tape 38.

  The tape feeding mechanism 27 is moved in the front-rear direction by an operating mechanism (not shown) between an operating position where the protective tape 38 is positioned directly below the suction head and a retracted position where the protective tape 38 is retracted forward of the suction head.

  Head structures 39, 39,... Are supported on the mounting plate 10 of the support frame 3 via guide rails 11, 11 so as to be movable in the left-right direction (see FIGS. 1 and 3). In the component mounting apparatus 1, for example, six head structures 39, 39,... Are provided, and the head structures 39, 39,. .

  The head structure 39 has a mounting base 40, a driving body 41, and a suction head 42 (see FIG. 7).

  The mounting base 40 is formed in a plate shape facing in the front-rear direction, and is formed in a vertically long shape. The mounting base 40 is provided as an upper mounting portion 40a having an upper end protruding forward from the other portion, and a lower end is provided as a lower mounting portion 40b.

  Guided members 43 and 43 are mounted on the rear surface of the mounting base 40 so as to be spaced apart from each other in the vertical direction. The guided members 43 and 43 are respectively supported by the guide rails 11 and 11 so as to be slidable in the left-right direction.

  The drive body 41 is attached to the front surface of the upper attachment portion 40a of the attachment base 40. The drive body 41 has a bracket 44 attached to the upper attachment portion 40 a, an elevating motor 45 attached to the bracket 44, and a feed screw 46 that is rotated by the driving force of the elevating motor 45.

  The bracket 44 includes a mounting surface portion 44a and support protrusions 44b and 44b that protrude forward from both upper and lower ends of the mounting surface portion 44a. The mounting surface portion 44a of the bracket 44 is attached to the front surface of the upper mounting portion 40a.

  The elevating motor 45 is attached to the upper surface of the upper support protrusion 44 b in the bracket 44.

  The feed screw 46 protrudes downward from the elevating motor 45 and is supported in a state where a portion near the upper end is inserted into the support protrusions 44 b and 44 b of the bracket 44.

  The suction head 42 includes a base body 47 formed in a vertically long shape and a suction portion 48 positioned below the base body 47. A nut member 49 is fixed to the upper end portion of the base body 47, and the feed screw 46 is threadedly engaged with the nut member 49. When the feed screw 46 is rotated by the driving force of the elevating motor 45, the nut member 49 is sent in the vertical direction according to the rotation direction of the feed screw 46, and the suction head 42 is integrated with the nut member 49 in the vertical direction. Moved.

  A sensor 50 is disposed inside the base body 47. The sensor 50 functions as a detection unit that detects the height position of the electronic component placed on the substrate and the pressing force of the suction head 42 against the electronic component.

  The adsorption part 48 has a heater 51 at its lower end (see FIG. 8). As the heater 51, for example, a pulse heater is used. In the heater 51, a component suction hole 51a is formed at the center, and tool suction holes 51b, 51b,... Are formed around the component suction hole 51a in the circumferential direction, and the tool suction holes 51b, 51b,. Are formed with tape suction holes 51c, 51c,... Spaced apart in the circumferential direction.

  A suction device (not shown) is connected to the suction portion 48 via a connection pipe (not shown). A plurality of spaces for suction with negative pressure air are formed inside the suction portion 48, and in each of these spaces, the component suction holes 51a, tool suction holes 51b, 51b,. , 51c,... Communicate with each other. Therefore, as will be described later, the electronic component, the tool 23, and the protective tape 38 placed on the substrate are respectively component suction holes 51a, tool suction holes 51b, 51b,. It is adsorbed by the adsorbing part 48 via

  In a state where the tool 23 is sucked by the suction portion 48, the component suction hole 51a is aligned with the component suction hole 23a of the tool 23, and the tape suction holes 51c, 51c,. 23b, 23b,...

  A peeling member 52 is attached to the lower attachment portion 40b of the attachment base 40 (see FIGS. 7 and 9). The peeling member 52 includes a base surface portion 52a facing in the front-rear direction and sticking prevention portions 52b and 52c protruding forward from left and right end portions of the base surface portion 52a. In the peeling member 52, the upper end portion of the base surface portion 52a is attached to the lower attachment portion 40b, and the sticking prevention portions 52b and 52c are positioned laterally from the moving space of the suction head 42 in the left-right direction. Accordingly, the suction head 42 is movable in the vertical direction between the sticking preventing portions 52b and 52c.

  In the peeling member 52, the left sticking prevention part 52b protrudes from the lower end part of the base face part 52a, and the positions of the sticking prevention parts 52b and 52c are different in the vertical direction (see FIG. 9). The peeling members 52, 52,... Are attached to the mounting bases 40, 40,... Arranged side by side, and the peeling members 52 attached to the adjacent mounting bases 40, 40,. , 52,... Are located on the upper side of the anti-sticking parts 52b, 52b,.

  In this way, the sticking prevention parts 52c, 52c,... Of the peeling members 52, 52,... Attached to the adjacent mounting bases 40, 40,. Therefore, even when the head structures 39, 39,... Are located close to each other in the left-right direction, the adjacent sticking prevention part 52b and the sticking prevention part 52c do not interfere with each other. Therefore, it is possible to reduce the space in the left-right direction of the peeling members 52, 52,... And reduce the space in the left-right direction of the head structures 39, 39,. Miniaturization can be achieved.

  The guided members 43, 43,... Are slidably supported on the guide rails 11, 11, respectively, and the head structures 39, 39,. And can be moved in the left-right direction at equal intervals.

  The drive link mechanism 53 is rotated by the moving motor 54 for moving the head structures 39, 39,... In the left-right direction and the driving force of the moving motor 54, as shown in FIGS. The pitch switching motor 56 for changing the pitch of the ball screw shaft 55 and the head structures 39, 39,..., The spline shaft 57 rotated by the driving force of the pitch changing motor 56, and the driving bodies 41, 41,. And a link body 58 connected to each other.

  The moving motor 54 and the pitch variable motor 56 are positioned up and down and are attached to motor attachment members 59 and 59, respectively. The moving motor 54, the pitch variable motor 56, and the motor mounting members 59 and 59 are inserted into the disposition notches 8 a formed on one support pillar 8 of the support frame 3, and the motor mounting members 59 and 59 are attached to the mounting plate 10. It is attached to one end in the left-right direction.

  The ball screw shaft 55 extends in the left-right direction, is formed integrally with the motor shaft of the moving motor 54, and has a screw groove 55a. The end of the ball screw shaft 55 on the moving motor 54 side is inserted and supported by a motor mounting member 59.

  The spline shaft 57 extends in the left-right direction, is positioned directly below the ball screw shaft 55, and has guide grooves 57a, 57a,. The spline shaft 57 is formed integrally with the motor shaft of the pitch varying motor 56, and the end portion on the pitch varying motor 56 side is inserted into and supported by the motor mounting member 59. A rotary handle 61 is attached to the end of the spline shaft 57 opposite to the pitch variable motor 56 in the axial direction. The spline shaft 57 can be manually rotated by operating the rotary handle 61.

  The end of the ball screw shaft 55 opposite to the moving motor 54 side and the end of the spline shaft 57 opposite to the pitch varying motor 56 are rotatably supported by the bearing member 60. The end of the ball screw shaft 55 opposite to the moving motor 54 side, the end of the spline shaft 57 opposite to the pitch variable motor 56 side, and the bearing member 60 are formed on the other support column 8 of the support frame 3. The bearing member 60 is attached to the other end of the mounting plate 10 in the left-right direction.

  By attaching the motor attachment members 59, 59 and the bearing member 60 to the attachment plate 10, respectively, the ball screw shaft 55 is positioned immediately behind the insertion hole 10a formed in the attachment plate 10 (see FIG. 3).

  The link body 58 is linked to the first nut body 62, the nut member 63, the second nut body 64, the first outer coupling member 65, the second outer coupling member 66, the inner coupling members 67, 67,. It has an arm 68 and a connecting bar 69 (see FIGS. 10 to 12).

  The first nut body 62 has a case 70 and a substantially cylindrical screw nut 71 disposed inside the case 70 except for a part (see FIG. 13). The case 70 includes a cylindrical coupling portion 70a, a flange portion 70b projecting outward from one end portion in the axial direction of the coupling portion 70a, and a cylindrical portion 70c continuous to the other end surface of the coupling portion 70a. The diameter of the part 70a is made larger than the diameter of the cylindrical part 70c. The screw nut 71 is rotatable with respect to the case 70 and is screwed into the screw groove 55 a of the ball screw shaft 55. One end portion of the screw nut 71 in the axial direction protrudes from the case 70, and one end portion protruding from the case 70 is provided as a belt winding portion 71a.

  Between the case 70 and the screw nut 71, the 1st linear bodies 72 and 72 are spaced apart and arrange | positioned in the axial direction. The first linear body 72 is formed by connecting balls 72a, 72a,. By arranging the first linear bodies 72, 72 between the case 70 and the screw nut 71, smooth rotation of the screw nut 71 with respect to the case 70 is ensured.

  Between the case 70 and the ball screw shaft 55, a second linear body 73 engaged with the screw groove 55a is disposed so as to be separated in the axial direction. The second linear body 73 is formed by connecting balls 73a, 73a,. By engaging the second linear body 73 with the screw groove 55a, smooth rotation of the ball screw shaft 55 relative to the screw nut 71 is ensured.

  The nut member 63 has a cylindrical threaded portion 63a and a projecting portion 63b projecting outward from one end portion in the axial direction of the threaded portion 63a (see FIG. 14). The nut member 63 has a screwing portion 63a screwed into the screw groove 55a.

  The second nut body 64 has an arrangement case 74 and a substantially cylindrical spline nut 75 arranged inside the arrangement case 74 except for a part (see FIG. 15). The arrangement case 74 includes a cylindrical coupling portion 74a, a flange portion 74b projecting outward from one end portion in the axial direction of the coupling portion 74a, and a cylindrical portion 74c continuous to the other end surface of the coupling portion 74a. The diameter of the coupling portion 74a is larger than the diameter of the cylindrical portion 74c. The spline nut 75 is rotatable with respect to the arrangement case 74. One end portion of the spline nut 75 in the axial direction protrudes from the arrangement case 74, and one end portion protruding from the arrangement case 74 is provided as a belt winding portion 75a.

  Guided ridges 75b, 75b,... Projecting inward and extending in the axial direction are provided on the inner circumferential surface of the spline nut 75 so as to be spaced apart in the circumferential direction. The guided ridges 75b, 75b,... Are slidably engaged with the guide grooves 57a, 57a,... Of the spline shaft 57, and the guided ridges 75b, 75b,. The spline nut 75 is slidably engaged with 57a, 57a,... So that the spline nut 75 cannot rotate with respect to the spline shaft 57 but can move in the axial direction with respect to the spline shaft 57.

  Between the arrangement case 74 and the spline nut 75, linear bodies 76, 76 are arranged apart from each other in the axial direction. The linear body 76 is formed by connecting balls 76a, 76a,. By arranging the linear bodies 76, 76 between the arrangement case 74 and the spline nut 75, a smooth rotation operation of the spline nut 75 with respect to the arrangement case 74 is ensured.

  A timing belt 77 is wound around the winding portion 71 a of the screw nut 71 in the first nut body 62 and the winding portion 75 a of the spline nut 75 in the second nut body 64, and the screw nut 71 and the spline nut 75 are wound by the timing belt 77. Are connected (see FIGS. 10 to 12). Therefore, the screw nut 71 and the spline nut 75 are rotated synchronously.

  The first outer coupling member 65, the second outer coupling member 66, and the inner coupling members 67, 67,... The first outer coupling member 65 and the second outer coupling member 66 are inserted into the insertion hole 10a of the mounting plate 10, and the mounting base 40 and the head positioned on the leftmost side in the head structure 39 positioned on the rightmost side, respectively. It is attached to the mounting base 40 in the structure 39 from the rear. The inner coupling members 67, 67,... Are inserted into the insertion holes 10 a of the mounting plate 10, and the mounting bases in the head structures 39, 39,. 40, 40, ... are attached from the rear.

  A first coupling protrusion 65a and a second coupling protrusion 65b are provided vertically at the rear end of the first outer coupling member 65. The first coupling protrusion 65 a is coupled to the coupling portion 70 a in the case 70 of the first nut body 62 in an outer fitting manner, and the second coupling projection 65 b is coupled to the arrangement case 74 of the second nut body 64. A flange portion 70b of the case 70 and a flange portion 74b of the arrangement case 74 are respectively screwed to the first coupling protrusion 65a and the second coupling protrusion 65b by screwing or the like. It is attached. Accordingly, the first nut body 62, the second nut body 64, and the first outer coupling member 65 are integrally moved in the left-right direction.

  A coupling protrusion 66 a is provided at the rear end of the second outer coupling member 66. The coupling protrusion 66a is externally coupled to a part of the threaded portion 63a of the nut member 63, and an overhang 63b is attached to the coupling protrusion 66a by screwing or the like. Therefore, the nut member 63 and the second outer coupling member 66 are moved together in the left-right direction.

  The link arms 68, 68,... Are linearly formed, for example, five. The link arms 68, 68,... Are spaced apart in parallel in the left-right direction.

  The connection bar 69 is formed in a straight line shape, and one end in the longitudinal direction is rotatably connected to the rear end of the second outer coupling member 66. One end of each of the link arms 68, 68,... Is connected to the connection bar 69 so as to be rotatable at equal intervals. The other ends of the link arms 68, 68,... Are pivotably connected to the rear end of the first outer coupling member 65 and the rear ends of the inner coupling members 67, 67,. Has been.

  In the drive link mechanism 53 configured as described above, when the movement motor 54 is driven when the pitch variable motor 56 is not driven, the ball screw shaft 55 is rotated. At this time, since the spline shaft 57 is not rotated, the spline nut 75 of the second nut body 64 is not rotated, and the screw nut 71 of the first nut body 62 connected by the timing belt 77 is not rotated. Accordingly, the screw nut 71 is not rotated with respect to the ball screw shaft 55, and the first nut body 62 is sent to the ball screw shaft 55 and moved in the left-right direction.

  When the first nut body 62 is moved in the left-right direction, the nut member 63 is also sent to the ball screw shaft 55 and moved in the left-right direction in synchronization with the first nut body 62. The first outer coupling member 65, the second outer coupling member 66, and the inner coupling members 67, 67,... Are connected by the link body 58, and the first outer coupling member 65 is connected to the first nut body 62 and the second. Since the second outer coupling member 66 coupled to the nut body 64 is coupled to the nut member 63, the first outer coupling member 65, the second outer coupling member 66, and the inner coupling members 67, 67,. Are integrally moved in the left-right direction (see FIGS. 11 and 16). Therefore, the head structures 39, 39,... To which the first outer coupling member 65, the second outer coupling member 66, and the inner coupling members 67, 67,. Moves left and right together.

  On the other hand, in the drive link mechanism 53, when the pitch varying motor 56 is driven when the moving motor 54 is not driven, the spline shaft 57 is rotated. Since the spline nut 75 of the second nut body 64 is made non-rotatable with respect to the spline shaft 57, it is rotated together with the spline shaft 57. When the spline nut 75 is rotated, the screw nut 71 of the first nut body 62 connected by the timing belt 77 is rotated in synchronization. At this time, since the ball screw shaft 55 is not rotated, the screw nut 71 of the first nut body 62 is sent to the ball screw shaft 55 and the first nut body 62 is moved in the left-right direction.

  Since the first outer coupling member 65 is coupled to the first nut body 62 and the second nut body 64, the second nut body 64 is moved when the first nut body 62 is moved in the left-right direction. Are also moved in the left-right direction together with the first nut body 62. At this time, since the nut member 63 is not rotated with respect to the ball screw shaft 55, it is not moved in the left-right direction. Since the first outer coupling member 65, the second outer coupling member 66, and the inner coupling members 67, 67,... Are coupled by the link body 58, the link arms 68, 68,. And the first outer coupling member 65 and the inner coupling members 67, 67,... And the coupling bar 69 is rotated with respect to the second outer coupling member 66, and the first outer coupling member is rotated. The member 65 and the inner coupling members 67, 67,... , 67,... Are changed at equal intervals (see FIGS. 10, 11, 17, and 18). Therefore, the head structures 39, 39,... To which the first outer coupling member 65, the second outer coupling member 66, and the inner coupling members 67, 67,. The pitch is changed.

<Configuration of peripheral devices>
A component mounting device 500, a substrate carry-in device 600, and a substrate carry-out device 700 are disposed around the component mounting device 1 (see FIG. 19). In addition, the board | substrate carrying-in apparatus 600 and the board | substrate carrying-out apparatus 700 may be provided as each one part of the structure of the component mounting apparatus 1, for example as a board | substrate carrying-in part and a board | substrate carrying-out part, respectively.

  As shown in FIG. 20, the component mounting device 500 is a device that places electronic components 300, 300,... In a temporarily placed state on a substrate 100 via functional materials 200, 200,. For example, the electronic components 300, 300,... Are sucked and held, placed on the substrate 100, placed, and released to be temporarily placed.

  In addition, as the functional material 200, for example, a paste-like or film-like material having a function as an adhesive material, a sealing material, or a reinforcing material is used. Specifically, an underfill material, a non-contact film, Various materials called non-contact paste or the like are used.

  The board carry-in device 600 is positioned between the component mounting device 500 and the component mounting device 1 and includes a carry-in conveyor 601 and a heat retaining heater 602 (see FIG. 19). The carry-in conveyor 601 includes feed rollers 601a and 601a that are spaced apart from each other on the left and right sides and a transport belt 601b that is fed by the feed rollers 601a and 601a. The heat retaining heater 602 is disposed between the feed rollers 601a and 601a.

  The board carry-out device 700 is located on the opposite side of the component mounting device 500 with the component mounting device 1 interposed therebetween, and has a carry-out conveyor 701. The carry-out conveyor 701 includes feed rollers 701a and 701a that are spaced apart from each other on the left and right sides, and a transport belt 701b that is fed by the feed rollers 701a and 701a.

  The substrate carry-out device 700 may also be provided with a heat retention heater (not shown) that retains heat in order to prevent warping of the substrate 100 due to rapid cooling.

  The substrate carry-in device 600 has a function of carrying the substrate 100 from the component mounting device 500 into the substrate moving unit 15, and the substrate carry-out device 700 has a function of carrying the substrate 100 out of the substrate moving unit 15 and carrying it to a predetermined position. doing. A predetermined circuit pattern is formed on the substrate 100, and connection terminals 101, 101,... Are formed at each end of the circuit pattern (see FIG. 20). The functional materials 200, 200,... And the electronic components 300, 300,... Are preliminarily placed by the component mounting device 500 in a state of covering the connection terminals 101, 101,. It is placed. Solder (solder balls) 301, 301,... Are arranged on the lower surfaces of the electronic components 300, 300,. In the electronic components 300, 300,..., The solders 301, 301,... Are positioned directly above the connection terminals 101, 101,. .

  As described above, in the state where the electronic components 300, 300,... Are placed on the substrate 100 via the functional materials 200, 200,. 300,... Are heated to a predetermined temperature so that the solders 301, 301,... Are not melted.

  In each drawing referred to below, two solders 301, 301 are arranged on one electronic component 300 so as to be separated from each other in the left and right directions, and two connection terminals 101, 101 are arranged in a region where one electronic component 300 is arranged. Is simplified and shown as being formed separately from each other on the left and right.

  The electronic components 300, 300,... Are placed in the respective regions on the substrate 100 with an equal interval left and right (see FIG. 21). In addition, the same number of electronic components 300, 300,... Spaced apart from each other are placed on the front and rear sides.

  The functional material 200 is formed of, for example, a film-like resin material, has a function of protecting the connection terminals 101 and 101 and the solders 301 and 301, and functions as an adhesive that bonds the electronic component 300 and the substrate 100. The melting temperature of the functional material 200 is about 180 ° C., for example. Further, the melting temperature of the solder 301 is set to about 230 ° C., for example.

  In some cases, a paste-like type is used as the functional material 200, but the melting temperature of the paste-like functional material 200 is set lower than the melting temperature of the film-like functional material 200.

  As described above, the substrate carry-in device 600 is provided with the heat retaining heater 602, and the functional materials 200, 200,... And the electronic components 300, 300,. When the substrate 100 is carried in by the carry-in conveyor 601, the functional materials 200, 200,... And the solders 301, 301,.

  In addition, when the substrate carrying-out device 700 is provided with a heat retaining heater, when the substrate 100 to which the electronic components 300, 300,. The materials 200, 200,... And the solders 301, 301,.

<Operation of component mounting device>
Next, the operation of the component mounting apparatus 1 when the electronic components 300, 300,... Are bonded to the substrate 100 will be described (see FIGS. 20 to 34).

  First, an initial state of each part before the board 100 is carried into the component mounting apparatus 1 by the board carrying-in apparatus 600 will be described.

  In each region of the substrate 100, as described above, the functional materials 200, 200,... And the electronic components 300, 300,. It is mounted in a state (see FIG. 20). For example, the same kind of electronic components 300, 300,... Are placed at equal intervals from the first column to the n-th column in the front-rear direction, and for example, left and right at equal intervals in each column. 30 are placed side by side (see FIG. 21).

  In the initial state, the substrate moving unit 15 is in a preparation position which is a front moving end, and the mounting base 18 is positioned at the upper moving end (see FIG. 22). Therefore, the upper ends of the conveyors 18 a and 18 a in the mounting base 18 are positioned above the upper surface of the bonding stage 17.

  When the substrate moving unit 15 is in the preparation position, which is the front moving end, the arrangement table 20 attached to the substrate moving unit 15 is also located at the front moving end, and the punching block 22 arranged on the arrangement table 20. Are positioned directly below the head structures 39, 39,.

  In the initial state, the tape feeding mechanism 27 is in the operating position, which is the rear moving end, and the intermediate portion 38a of the protective tape 38 is located directly under the head structures 39, 39,. Has been. In the head structures 39, 39,..., The suction heads 42, 42,... Are positioned at the upper moving end, and the pitch that is the interval in the left-right direction is the narrowest.

  Next, a pre-operation before the board 100 is carried into the component mounting apparatus 1 by the board carrying-in apparatus 600 is performed (see FIGS. 23 to 28).

  As a preliminary operation, first, the tape feeding mechanism 27 is moved to the retracted position, which is the front moving end, by the operating mechanism (see FIG. 23). Moreover, the board | substrate moving part 15 and the arrangement | positioning stand 20 attached to the board | substrate moving part 15 are united, and are moved back by the drive mechanism 19 (refer FIG. 24). By moving the substrate moving part 15 and the arrangement table 20 rearward, the tools 23, 23,... Held by the predetermined tool holder 21 are positioned below the head structures 39, 39,. The The tools 23, 23,... Held by the predetermined tool holder 21 are sized according to the electronic components 300, 300,. Are held by the tool holder 21 at the same pitch as the pitch of these electronic components 300, 300,.

  Next, as a pre-operation, the head structure 39, 39,... Is changed to a predetermined equal interval pitch by the drive link mechanism 53 and moved to a predetermined position in the left-right direction in the state of the changed equal interval pitch. (See FIG. 24). The pitch of the head structures 39, 39,... Is varied to, for example, 5 times the pitch of the electronic components 300, 300,. It should be noted that the head structures 39, 39,... May be changed to a predetermined equal interval pitch after being moved to a predetermined position in the left-right direction.

  At this time, the six head structures 39, 39,..., Which are varied at equal intervals, for example, have a pitch that is five times the pitch of the 30 punch pins 22b, 22b,. The component suction holes 51a, 51a,... Formed in the suction portions 48, 48,... Are true of the six drilling pins 22b, 22b,. Located on the top.

  Subsequently, as a pre-operation, the substrate moving unit 15 and the arrangement table 20 are moved rearward, and predetermined tools 23, 23,... Arranged in the tool holder 21 are moved to the suction heads 42, 42,. It is located directly below (see FIG. 25). At this time, the component suction holes 51a, 51a, ... formed in the suction parts 48, 48, ... and the component suction holes 23a, 23a, ... formed in the tools 23, 23, ... Are aligned in the vertical direction, and the tape suction holes 51c, 51c,... Formed in the suction portions 48, 48,... And the tape suction holes 23b formed in the tools 23, 23,. , 23b,... Are matched in the vertical direction.

  Next, as a pre-operation, the feed screws 46, 46,... Are rotated in the head structures 39, 39,. At this time, negative pressure is applied to the suction portions 48, 48,... Via the tool suction holes 51b, 51b,..., And the tools 23, 23,. .. are sucked and taken out from the tool holder 21, and the suction heads 42, 42,... Are moved upward, and the tools 23, 23,. (See FIG. 26).

  Subsequently, as a pre-operation, the substrate moving unit 15 and the placement table 20 are moved forward, the drilling block 22 is positioned directly below the suction heads 42, 42,... (See FIG. 27), and the component suction hole 51a. , 51a,... And the six punching pins 22b, 22b,. At this time, the tape feeding mechanism 27 is moved backward from the retracted position to the operating position, and the intermediate portion 38a of the protective tape 38 is positioned directly below the suction heads 42, 42,.

  Next, as a preliminary operation, the suction heads 42, 42,... Sucking the tools 23, 23,... Are moved downward, and the protective tape 38 is pushed down by the tools 23, 23,. (See FIG. 28). When the protective tape 38 is pushed down, the six punching pins 22b, 22b,... Are pierced into the protective tape 38 from below and the component suction holes 23a, 23a,. .. are inserted from below and other than the six piercing pins 22b, 22b,... Are pierced from below into the protective tape 38, and are attached to the protective tape 38 by the piercing pins 22b, 22b,. The same number of air flow holes 38b, 38b,... As the perforated pins 22b, 22b,.

  Subsequently, as a preliminary operation, the suction heads 42, 42,... Are moved upward (see FIG. 29). At this time, negative pressure is applied to the tools 23, 23,... Via the tape suction holes 51c, 51c,... And the tape suction holes 23b, 23b,. , The protective tape 38 is sucked through the tools 23, 23,..., And the protective tape 38 is also moved upward together with the suction heads 42, 42,. The suction heads 42, 42,... Are not moved to the upper moving end, and are stopped at the intermediate point of the moving range in the vertical direction. Therefore, at this time, the intermediate portion 38a of the protective tape 38 is not in contact with the sticking prevention portions 52b, 52b,... Of the peeling members 52, 52,.

  When the above-described preliminary operation is completed, the substrate moving unit 15 and the arrangement table 20 are moved forward to the preparation position, and the functional material 200, 200,... And the electronic components 300, 300,. Are loaded onto the mounting base 18 of the substrate moving unit 15 (see FIG. 30). At this time, the substrate 100 is kept warm by the heat-retaining heater 602, and the functional materials 200, 200,... Are kept in a high temperature state near the melting temperature and are easily melted.

  When the substrate 100 is loaded onto the mounting base 18, the mounting base 18 is moved below the upper surface of the bonding stage 17 by the lifting mechanism, and the substrate 100 is mounted on the bonding stage 17 and sucked and held. The bonding stage 17 is heated to a predetermined temperature by a heating heater (not shown), and the functional material 200, 200,... Placed on the substrate 100 and the solder 301, 301,.・ The heat insulation state is maintained.

  When the substrate 100 is held by the bonding stage 17, the substrate moving unit 15 and the placement table 20 are moved together and moved backward, for example, six electronic components 300, 300,. .. Are respectively located directly under the suction heads 42, 42,... (See FIG. 31). At this time, for example, the electronic components 300, 300,... Placed on the first, sixth, eleventh, sixteenth, twenty-first, and twenty-sixth from the left are the suction heads 42, 42,. Located directly below.

  Subsequently, the bonding operation to the electronic components 300, 300,... By the head structures 39, 39,... Is started, the suction heads 42, 42,. ,... Are in contact with the electronic components 300, 300,. At this time, the height positions of the electronic components 300, 300,... And the suction heads 42, 42,... By the sensors 50, 50,. ... Are pressed against the respective electronic components 300, 300,.

  The height positions of the electronic components 300, 300,... Are sent to the control unit 7, and the detected height positions are stored as the initial positions of the electronic components 300, 300,.

  The suction heads 42, 42,... Are stopped from moving downward when the intermediate portion 38a is in contact with the electronic components 300, 300,. At this time, negative pressure is applied to the tools 23, 23,... Via the tape suction holes 51c, 51c,... And the tape suction holes 23b, 23b,. Are attached to the electronic components 300, 300,... Via the air circulation holes 38a, 38a,... Protected by the suction portions 48, 48,. The electronic components 300, 300,... Are sucked through the tape 38 (see FIG. 32).

  Subsequently, the electronic components 300, 300,... Via the tools 23, 23,... And the protective tape 38 by the heaters 51, 51,. And the functional materials 200, 200,... Are heated. The heated solder 301, 301, ... and the functional material 200, 200, ... are melted so that the solder 301, 301, ... breaks through the functional material 200, 200, .... Are brought into contact with the connection terminals 101, 101,.

  When heating is performed by the heaters 51, 51,..., The initial positions detected by the sensors 50, 50 are read from the control unit 7, and the suction heads 42, 42,. Further, it is slightly moved up and down based on each initial position (see FIG. 33). At this time, the soldering heads 42, 42,... Are pressed against the connection terminals 101, 101,. , And slightly up and down based on each initial position so that a good bonding state is ensured in which a sufficient bonding area of the solders 301, 301,... To the connection terminals 101, 101,. Moved to. Are in good connection with the connection terminals 101, 101,... Of the solders 301, 301,... At the positions detected by the sensors 50, 50,. Is maintained, the state stopped without moving up and down is maintained.

  Subsequently, the heating by the heaters 51, 51,... Is finished, and the suction heads 42, 42,... Are moved upward with the tools 23, 23,. When the heating by the heaters 51, 51,... Is finished and the suction heads 42, 42,... Are moved upward, the solders 301, 301,. Are cooled and solidified, and the solders 301, 301,... Are joined to the connection terminals 101, 101,. Since the functional materials 200, 200,... Are melted and solidified, the electronic components 300, 300,... Are covered from the surroundings, and the lower surfaces of the electronic components 300, 300,. The electronic components 300, 300,... Are bonded to the substrate 100 by the functional materials 200, 200,.

  As described above, when the functional material 200 is melted, the melted functional material 200 flows around the upper surface side of the electronic component 300, but is adsorbed by the electronic component 300 and the adsorption portion 48. A protective tape 38 is positioned between the tool 23.

  Therefore, the suction part 48 and the tool 23 and the electronic component 300 are separated by the protective tape 38, and adhesion of the functional material 200 to the suction part 48 and the tool 23 can be prevented.

  Further, since the intermediate portion 38a of the protective tape 38 is positioned in a state extending in the moving direction of the suction heads 42, 42,..., A plurality of suction portions 48, 48,. Can be prevented from adhering to the tools 23, 23,...

  Further, since the plurality of air circulation holes 38b, 38b,... Are formed in the protective tape 38 at the same interval as the pitch of the electronic components 300, 300, ..., the electronic component 300 and the suction heads 42, 42,. The electronic parts 300, 300,... Can be adsorbed by the adsorbing portions 48, 48,.

  Therefore, the suction operation of the electronic parts 300, 300,... By the suction parts 48, 48,... Is not hindered by the protective tape 38, and the suction parts 48 of the functional materials 200, 200,. , And the adhesion of the electronic parts 300, 300,... By the suction parts 48, 48,. Improvements can be made.

  In the component mounting apparatus 1, the suction parts 48, 48,... Are moved downward and the electronic components 300, 300,. The air circulation holes 38b, 38b,... Are formed at the same interval as the pitch.

  Therefore, since it is not necessary to use the protective tape 38 in which the air circulation holes 38b, 38b,... Are formed in advance, the object to be joined by the component mounting apparatus 1 is the pitch of the electronic components 300, 300,. Even when the substrate 100 is changed to a different type of substrate 100, there is no need to replace the protective tape 38.

  As described above, in the component mounting apparatus 1, since it is not necessary to replace the protective tape 38 and discard the protective tape 38, it is possible to reduce the working time by improving workability and to manufacture the component mounting apparatus 1. Cost can be reduced.

  Further, since the perforated block 22 can be replaced with a different type depending on the size of the electronic components 300, 300,..., The air circulation holes 38b, 38b formed in the protective tape 38,. .. Can be changed according to the size of the electronic components 300, 300,.

  Further, in a state where the air circulation holes 38b, 38b,... Are formed in the protective tape 38, the protective tape 38 can be adsorbed by the adsorbing portions 48, 48,. Therefore, the protective tape 38 is securely positioned between the suction portions 48, 48,... And the electronic components 300, 300,..., And the suction portions 48, 48,. It is possible to ensure a good adhesion preventing function of the functional materials 200, 200,.

  Furthermore, since the protective tape 38 is adsorbed by the adsorbing portions 48, 48,..., The tape adsorbing holes 51c, 51c,. .. Does not occur, and the electronic parts 300, 300,... Can be reliably sucked by the suction portions 48, 48,.

  When the suction heads 42, 42,... Are moved upward, the suction to the protective tape 38 by the suction heads 42, 42,. Are separated from the lower surface of. At this time, the protective tape 38 comes into contact with the sticking preventing portions 52b, 52b,... From below, and the upward movement is restricted (see FIG. 34).

As described above, in the component mounting apparatus 1, when the suction heads 42, 42,... Are moved upward, the protective tape 38 is prevented from being attached from below the suction heads 42, 42,. Since the portions 52b, 52b,... Are provided, it is possible to prevent the protective tape 38 from sticking to the suction portions 48, 48,. When the suction heads 42, 42,... Are moved to the upper moving end, the joining operation to the six electronic components 300, 300 is completed.

  When the suction heads 42, 42,... Are moved to the upper moving end, the head structures 39, 39,. Is just moved to the right. When the head structures 39, 39,... Are moved to the right by one pitch of the electronic components 300, 300,. For example, the electronic components 300, 300,... Placed on the second, seventh, twelfth, seventeenth, twenty-second and twenty-seventh positions from the left are respectively positioned, and the above-described joining operation is started again. The suction heads 42, 42,... Are moved downward.

  When the suction heads 42, 42,... Are moved downward, a portion other than the portion that has been sucked at the tip of the protective tape 38 is again sucked by the suction portions 48, 48,. Through the joining operation, the solders 301, 301,... Of the other six electronic components 300, 300,... In the first row are joined to the connection terminals 101, 101,.

  Thereafter, the joining operation for each of the six electronic components 300, 300,... In the first row is repeatedly performed. When the joining operation for all the electronic components 300, 300,... In the first row is completed, the head structures 39, 39,. 20 is moved in the front-rear direction, and the joining operation to the electronic components 300, 300,.

  In the joining operation to the electronic components 300, 300,... In the second row, as a preliminary operation, the tape reel 30 and the tape reel 31 are rotated in the tape feeding mechanism 27 and the protective tape 38 is fed in the left-right direction. Are newly formed in the intermediate portion 38a by the above-described drilling operation.

  As described above, the component mounting apparatus 1 is provided with the tape feeding mechanism 37 for feeding the protective tape 38 in the variable direction of the pitch of the head structures 39, 39,. Can be used to perform the adsorption operation, and to the adsorption portions 48, 48,... Of the functional materials 200, 200,... And the tools 23, 23,. Can be prevented.

  When the joining operation for all the electronic components 300, 300,... Placed on the substrate 100 is completed, the substrate moving unit 15 and the arrangement table 20 are moved forward to the preparation position which is the front moving end. The When the substrate moving unit 15 and the arrangement table 20 are moved to the preparation position, the suction of the bonding stage 17 to the substrate 100 is stopped, the holding state of the substrate 100 is released, and the mounting base 18 moves upward to the upper moving end. Then, the substrate 100 is lifted and placed again on the placement base 18.

  The substrate 100 is moved to the right by the conveyors 18a and 18a, is held by the substrate carry-out device 700, and is carried out to a predetermined position by the substrate carry-out device 700.

<Relationship between electronic component pitch and head structure pitch>
Next, the relationship between the pitch of the electronic components 300, 300,... And the pitch of the head structures 39, 39,.

  In the component mounting apparatus 1, as described above, the pitch of the head structures 39, 39,... Can be changed at equal intervals. Therefore, when the equally spaced pitches of the electronic components 300, 300,... Relative to the substrate 100 are different, the pitch of the head structures 39, 39,. Is changed by the drive link mechanism 53.

  As described above, in the component mounting apparatus 1, the equidistant pitch of the head structures 39, 39,... Is changed by the drive link mechanism 53 in accordance with the equidistant pitch of the electronic components 300, 300,. Therefore, it is possible to perform the joining operation of the electronic components 300, 300,... On different types of substrates 100, 100,.

  In this case, the tool holder 21 in which the pitch of the placement recesses 21a, 21a,... Is formed according to the equally spaced pitch of the electronic components 300, 300,. , And the punching block 22 formed so that the pitch of the punching pins 22b, 22b,... Matches the equally spaced pitch of the electronic components 300, 300,. To be used.

<Bonding work when different types of electronic components are placed>
Hereinafter, a joining operation by the component mounting apparatus 1 when different types of electronic components 300, 300,... Having different sizes, shapes, functions, and the like are placed on the substrate 100 will be described (FIGS. 35 to 37). reference).

  Hereinafter, as an example, a case where two types of electronic components 300, 300,... Are placed on the substrate 100 in a temporarily placed state will be described. , 300,... Are placed on the substrate 100 only in one row.

  In the component mounting apparatus 1, the variable range of the pitch of the suction heads 42, 42,... Is, for example, 50 mm to 75 mm. Therefore, the minimum pitch is 50 mm and the maximum pitch is 75 mm.

  As the electronic components 300, 300,..., Different types of electronic components 300A, 300A,... And electronic components 300B, 300B,. Each of the electronic components 300A, 300A,... And the electronic components 300B, 300B,.

  In the component mounting apparatus 1, first, as shown in FIG. 36, the tools 23A, 23A,... For the electronic component 300A are sucked by the suction heads 42, 42,. And the tools 23A, 23A,... Are moved up and down to join the electronic components 300A, 300A,. Next, the suction of the tools 23A, 23A,... For the electronic component 300A by the suction heads 42, 42,. Subsequently, as shown in FIG. 37, the tools 23B, 23B,... For the electronic component 300B are sucked by the suction heads 42, 42,. The tools 23B, 23B, ... are moved up and down to join the electronic components 300B, 300B, ... to the connection terminals 101, 101, ....

  As described above, in the component mounting apparatus 1, even when different types of electronic components 300 </ b> A, 300 </ b> A,..., 300 </ b> B, 300 </ b> B,. ..., 300B, 300B, ... can be joined to the connection terminals 101, 101, ..., and the versatility of the component mounting apparatus 1 can be improved.

  When the substrate 100 on which the electronic components 300A, 300A,... And the electronic components 300B, 300B,... Are alternately mounted is handled, the tools 23A, 23A,. .. Are alternately arranged on the arrangement surface portion 20 c of the arrangement table 20.

  At this time, as described above, the tools 23A, 23A,... Are first sucked by the suction heads 42, 42,... (See FIG. 36), and then the suction heads 42, 42,. The suction of the tools 23A, 23A,... Is released, and the tools 23B, 23B,... Are attracted to the suction heads 42, 42,. Therefore, the arrangement pitch of the tools 23A, 23A,... Relative to the tool holder 21 may be equal to or greater than the minimum pitch of the suction heads 42, 42,. It is sufficient that the arrangement pitch with respect to is not less than the minimum pitch of the suction heads 42, 42,.

  For example, when each suction operation is performed on the tools 23A, 23A,... And the tools 23B, 23B,... With the suction heads 42, 42,. The pitch Pa of 23A, 23A,... And the pitch Pb of the tools 23B, 23B,. Therefore, the pitch Pab of the tools 23A, 23A,... And the tools 23B, 23B,... Arranged alternately is set to 25 mm, which is a half of the minimum pitch. Therefore, the total pitch Pt of 12 tools when the tools 23A, 23A,... And the tools 23B, 23B,.

  When the electronic components 300A, 300A,... And the electronic components 300B, 300B,... Are alternately placed in this way, the tools 23, 23,. ) Can be made smaller than the pitch of the suction heads 42, 42,.

  On the other hand, six tools 23A, 23A,... Similar to the above are arranged in the tool holder 21 when joining different types of electronic components 300A, 300A,. It is also possible to make an arrangement in which six tools 23B, 23B,.

  However, in such an arrangement, it is necessary that the arrangement pitches of the adjacent tools 23, 23,... Be all equal to or greater than the minimum pitch of the suction heads 24, 24,. Therefore, the total pitch Pt of the twelve tools when the tools 23A, 23A,... And the tools 23B, 23B,.

  As described above, the tool holder 21 has the tool 23A when joining the electronic components 300A, 300A,... And the electronic components 300B, 300B,. , 23A,... And tools 23B, 23B,... Can be arranged alternately to reduce the pitch of the tools 23, 23,.

  Therefore, the arrangement space of the tools 23, 23,... Can be reduced by reducing the pitch of the tools 23, 23,.

  In the above, two types of tools 23A, 23A,... And tools 23B, 23B,... Are alternately arranged corresponding to two types of electronic components 300, 300,. However, the component mounting apparatus 1 can also be applied to a case where three or more different types of tools are sequentially arranged. In this case, the pitch between the tools decreases as the types of tools increase, and the component mounting apparatus 1 can be further downsized. For example, when three different types of tools are sequentially arranged, the pitch of the tools 23, 23,... May be set to one third of the pitch of the suction heads 24, 24,. Is possible.

<Examples with different types of heaters>
Next, an example in which different types of heaters are provided in the suction portions 48, 48, ... of the suction heads 42, 42, ... will be described (see Figs. 38 to 41).

  In the above, an example in which pulse heaters are provided as the heaters 51, 51,... In the adsorption units 48, 48,..., But as shown below, the adsorption units 48, 48,. ··· providing the first heater 78 set to the first heating temperature or the second heater 79 set to the second heating temperature to perform the joining operation to the electronic components 300, 300,. Is possible.

  For example, in the suction portions 48, 48,... Of the six suction heads 42, 42,..., The first heaters 78, 78, 78 are provided in the odd-numbered suction portions 48, 48, 48, respectively. Second heaters 79, 79, 79 are provided in the even-numbered adsorption portions 48, 48, 48, respectively (see FIG. 38).

  The first heater 78 is set to a first heating temperature, for example, 180 ° C., and the second heater 79 is set to a second heating temperature, for example, 230 ° C.

  For example, three electronic components 300, 300, 300 are placed on the substrate 100 in a temporarily placed state as a target of the joining work, and the solders 301, 301,... And the functional materials 200, 200, 200 are The pre-heating temperature is t0 (see FIG. 39). The pre-heating temperature t0 is an arbitrary temperature lower than 180 ° C. such as room temperature.

  In the joining operation, first, as shown in FIG. 40, odd-numbered suction portions 48, 48, 48 are pressed against the electronic components 300, 300, 300, respectively, and are soldered 301 by the first heaters 78, 78, 78. , 301,... And the functional materials 200, 200, 200 are heated during the first heating time s1 (see FIG. 39). Since the first heaters 78, 78, 78 are set to 180 ° C., the solders 301, 301,... And the functional materials 200, 200, 200 are heated to the first temperature t1 (180 ° C.). Is done. In the state heated to the first temperature t1, the solders 301, 301,... Are not melted and the functional materials 200, 200, 200 are melted.

  Next, the odd-numbered adsorption parts 48, 48, 48 are moved upward to complete the heating by the first heaters 78, 78, 78, and all the adsorption parts 48, 48,. Then, as shown in FIG. 41, the even-numbered suction portions 48, 48, 48 are pressed against the electronic components 300, 300, 300, respectively. The working time from when the odd-numbered suction parts 48, 48, 48 are moved upward to when the even-numbered suction parts 48, 48, 48 are pressed against the electronic components 300, 300, 300 is sm (FIG. 39). reference).

  The even-numbered adsorption portions 48, 48, 48 are pressed against the electronic components 300, 300, 300, so that the solder 301, 301,. , 200 is heated during the second heating time s2. Since the second heaters 79, 79, 79 are set to 230 ° C., the solders 301, 301,... And the functional materials 200, 200, 200 are heated to the second temperature t3 (230 ° C.). Is done. In the state heated to the second temperature t2, the solders 301, 301,... Are also melted.

  Subsequently, the even-numbered adsorption portions 48, 48, 48 are moved upward to complete the heating by the second heaters 79, 79, 79, and the solders 301, 301,. 200 is solidified and solders 301, 301,... Are joined to connection terminals 101, 101,. The joining time from the end of heating by the second heaters 79, 79, 79 to the joining of the solders 301, 301,... To the connection terminals 101, 101,.

  The functional material 200, 200, 200 may be temporarily solidified by the working time sm and the temperature falls below the first temperature t 1, but by the next heating by the second heater 79, 79, 79 Since the functional material 200, 200, 200 is reliably melted, the temperature drop due to the working time sm does not interfere with the joining of the solders 301, 301,... To the connection terminals 101, 101,. Absent.

  Further, the first temperature t1 is set to a temperature higher than the melting temperature of the functional material 200 and lower than the melting temperature of the solder 301. Even if the temperature decreases due to the working time sm, heating by the second heaters 79, 79, 79 is performed. It is possible to maintain the molten state of the functional material 200 by the time.

  As described above, the first heater 78 set to the first heating temperature or the second heater 79 set to the second heating temperature is provided in the adsorption portions 48, 48,. The heating by the first heaters 78, 78, 78 and the heating by the second heaters 79, 79, 79 are sequentially performed on the components 300, 300, 300.

  Accordingly, the electronic components 300, 300, and 300 are sequentially heated by the first heaters 78, 78, 78 of constant temperature heating and the second heaters 79, 79, 79 of constant temperature heating, so that it is not necessary to use a pulse heater. Thus, it is possible to use a heater that is inexpensive and has a long service life, so that the manufacturing cost of the component mounting apparatus 1 can be reduced and the life of the heater can be increased.

  In pulse heat, it is necessary to attach a thermocouple to the tip of an electrode formed of a highly exothermic material such as molybdenum or tungsten to perform thermal management of the heater, and the heater itself is expensive and expensive. Often requires a control system. However, as described above, by using the first heaters 78, 78, 78 for constant temperature heating and the second heaters 79, 79, 79, the manufacturing cost can be reduced by simplifying the control system or the like. become.

  In the above, an example in which the six heaters 48, 48,... Are each provided with the first heater 78 or the second heater 79 for constant temperature heating is shown. The number of... Is not limited to six, and may be any number as long as it is plural. For example, two suction portions 48 and 48 are provided, and each of the two suction portions 48 and 48 has a first one. A heater 78 and a second heater 79 may be provided.

<Modified example of protective tape>
Next, a modified example of the protective tape will be described.

  In the above example, the air circulation holes 38b, 38b,... Are formed in the protective tape 38. For example, without forming the air circulation holes 38b, 38b,. It is also possible to use a protective tape formed in a mesh shape.

  In this case, it is desirable that the size of the mesh material be such that air passes but functional material 200 does not. By making the size of the mesh so that air can pass but the functional material 200 does not pass, the suction part 48 can suck the electronic component 300 through the mesh-shaped protective tape, and the suction part 48 and the tool. It is possible to prevent the functional material 200 from adhering to 23.

  Further, by using a mesh-like protective tape, it is not necessary to provide the drilling block 22, and it is not necessary to perform a drilling operation on the protective tape 38, thereby reducing the manufacturing cost of the component mounting apparatus 1 and the component mounting apparatus 1. Miniaturization can be achieved.

<First Modification of Tool>
Next, a first modification of the tool will be described.

  Although the example in which the tool 23 is formed of a metal material has been described above, the tool 23 may be subjected to surface processing using a fluorocarbon resin (polytetrafluoroethylene). Further, when the tool 23 is formed of a resin material, surface processing with a fluorocarbon resin or addition of a fluorocarbon resin may be performed.

  Thus, by processing or adding a fluorocarbon resin to the tool 23, it is possible to make it difficult to attach the electronic component 200 to the tool 23.

  In addition, surface treatment with fluorocarbon resin and addition of fluorocarbon resin can be performed on the adsorption portion 48, and by performing treatment and addition of fluorocarbon resin on the adsorption portion 48, adsorption is possible. It is possible to make it difficult to attach the electronic component 200 to the portion 48.

<Second Modification of Tool>
Next, a second modification of the tool will be described (see FIGS. 42 and 43).

  Although the example in which the tool 23 is formed of a metal material has been described above, the tool 23C that can be elastically deformed may be formed of a resin material, a rubber material, or the like.

  At the time of the bonding operation, for example, as shown in FIG. 42, when the flatness of the substrate 100 carried on the bonding stage 17 is low, the electronic component 300 is inclined with respect to the lower surface of the bonding stage 17 and the tool 23C. May be placed.

  In this way, when the electronic component 300 is placed inclined with respect to the lower surface of the tool 23, when the suction portion 48 and the tool 23C are moved downward and pressed against the electronic component 300, the tool 23C is moved to the electronic component 300. It is elastically deformed following the inclined state of the upper surface (see FIG. 43).

  Therefore, the pressure of the tool 23 </ b> C against the electronic component 300 is substantially uniform in each part on the upper surface of the electronic component 300, and a stable joint state of the solder 301 and 301 to the connection terminals 101 and 101 can be ensured.

<Height detection for electronic components>
In the above, the suction heads 42, 42,... Are moved downward, and the lower surfaces of the protective tape 38 sucked by the suction portions 48, 48,. In this example, the height positions of the electronic components 300, 300,... Are detected by the sensors 50, 50,. It is also possible to perform a method of detecting the height related to... (See FIGS. 44 and 45).

  The detection of the heights related to the electronic components 300, 300,... Is performed by, for example, the electronic components 300, 300,. This is performed in a state of being directly below (see FIG. 44). In order to simplify the description, height detection relating to the two electronic components 300 and 300 will be described below, and the flatness of the substrate 100 carried on the bonding stage 17 is low, and the electronic components 300 and 300 are described below. Are in different states.

  When the electronic components 300 and 300 are positioned immediately below the suction heads 42 and 42, the suction heads 42 and 42 that respectively hold the tools 23 and 23 are moved downward before the joining operation is performed, and the tools 23 and 23 are moved downward. Each contact with the upper surface of the electronic component 300, 300 (see FIG. 45). At this time, the height positions of the electronic components 300 and 300 are detected by the sensors 50 and 50 disposed inside the suction heads 42 and 42, and the distance H1 from the upper surface of the bonding stage 17 to the upper surface of the electronic components 300 and 300 is detected. , H2 is calculated by the control unit 7.

  When the height positions of the electronic components 300 and 300 are detected by the sensors 50 and 50, the suction heads 42 and 42 are moved upward to a predetermined position. The predetermined position P is, for example, a moving end above the suction heads 42 and 42 and is stored in advance by the control unit 7. Further, the control unit 7 attracts the electronic components 300 and 300 when a good bonding state of the solder 301 and 301 to the connection terminals 101 and 101 is ensured in a state where the electronic components 300 and 300 are in a predetermined vertical position. A necessary moving amount M of the heads 42, 42 from a predetermined position P downward is stored.

  This moving amount M is based on, for example, the size (thickness) of the electronic components 300, 300,... Placed on the substrate 100 to be joined by the component mounting apparatus 1, the position of the bonding stage 17, and the like. Is calculated.

  In the control unit 7, when the distances H1 and H2 are calculated, based on the distances H1 and H2 and the movement amount M, each of the solders 301 and 301 when a good bonding state to the connection terminals 101 and 101 is ensured. The actual movement amounts M1 and M2 required for the suction heads 42 and 42 are calculated and stored.

  When the bonding operation is started and the suction heads 42 and 42 are moved downward again, the stored movement amounts M1 and M2 are read, and the suction heads 42 and 42 are moved downward by the movement amounts M1 and M2, respectively. . Therefore, in the electronic components 300 and 300, a good bonding state of the solders 301 and 301 to the connection terminals 101 and 101 is ensured regardless of the position in the vertical direction with respect to the bonding stage 17.

  According to such a method, the bonding heads 42, 42,... Are moved downward by the required actual movement amounts M1, M2,. Therefore, in order to ensure a good bonding state, the suction heads 42, 42,... Are made minute with the electronic parts 300, 300,. It is not necessary to adjust the position of the electronic components 300, 300,.

  Therefore, before the joining operation is started, the height positions H1, H2,... Of the electronic components 300, 300,. By using a method for calculating the actual movement amounts M1, M2,..., It is possible to simplify the operation control and shorten the operation time.

<Summary>
As described above, in the component mounting apparatus 1, the drive bodies 41, 41,... And the suction heads 42, 42,. A drive link mechanism 53 that moves integrally in a variable direction is provided.

  Therefore, the pitch of the suction heads 42, 42,... Is varied by the drive link mechanism 53 according to the pitch of the electronic components 300, 300,. Are movable in the arrangement direction of the electronic components 300, 300,..., So that the electronic components 300, 300,. It becomes possible to adsorb, and the cost can be reduced by improving the versatility of the component mounting apparatus 1.

  In addition, two shafts (ball screw shaft 55 and spline shaft 57) parallel to the drive link mechanism 53 are provided, and one of the shafts is rotated to drive bodies 41, 41,... And suction heads 42, 42,. .. Are moved together in the variable direction of the pitch, and the other shaft is rotated to vary the pitch of the drive bodies 41, 41,... And the suction heads 42, 42,.

  Accordingly, since the two shafts are parallel, space can be saved, and one of the shafts is rotated to drive the drive bodies 41, 41,... And the suction heads 42, 42,. Therefore, the structure of the drive link mechanism 53 can be simplified.

  Further, the ball screw shaft 55 having the thread groove 55a is provided as one shaft, and the spline shaft 57 that guides the link body 58 in the variable direction of the pitch is provided as the other shaft. It is simple, and the structure of the drive link mechanism 53 can be further simplified.

  It should be noted that the electronic components 300, 300,... Are sucked and taken out from the component storage unit by a plurality of suction heads to other component mounting devices (conventional component mounting devices), and are loaded by the component loading device 600. .. Are moved and placed on the substrate 100, and in this state, the electronic components 300, 300,... Therefore, in such a component mounting apparatus, the placement operation (placement process) of the electronic components 300, 300,... On the substrate 100 and the joint operation (joint process) of the electronic components 300, 300,. ) And are repeated alternately.

  On the other hand, in the component mounting apparatus 1, the board 100 is carried in by the board carry-in apparatus 600, and is joined to the electronic components 300, 300,. Joining step) is performed. Therefore, it is not necessary to alternately perform the placing operation and the bonding operation, and the bonding operation for the electronic components 300, 300,... Can be performed continuously, and the bonding operation of the electronic components 300, 300,. The production capacity per unit time (UPH: Utility Per Hour) is high, and productivity can be improved.

<Others>
In the above description, the substrate 100 is shown as an example of a mounting body on which the electronic components 300, 300,... Are arranged, but the mounting body is not limited to the substrate 100, and a semiconductor wafer or an electronic component may be used. Good. When the mounting body is an electronic component, it is a so-called chip-on-chip in which the electronic component 300 is joined to the electronic component.

DESCRIPTION OF SYMBOLS 1 ... Component mounting apparatus 27 ... Tape feed mechanism 38 ... Protection tape 38b ... Air circulation hole 41 ... Drive body 42 ... Adsorption head 48 ... Adsorption part 51 ... Heater 52b ... Adhesion prevention part 52c ... Adhesion prevention part 53 ... Drive link mechanism 55 ... Ball screw shaft 57 ... Spline shaft 58 ... Link body 100 ... Substrate 200 ... Functional material 300 ... Electronic component 301 ... Solder

Claims (8)

The plurality of electronic components each having an adsorbing portion that adsorbs a plurality of electronic components previously placed on the mounting body at equal intervals through the solder and a heater that heats at least the solder, and adsorbed by the adsorbing portion. A plurality of suction heads that are joined to the predetermined position of the mounting body by the solder;
A plurality of driving bodies for moving the plurality of suction heads in the vertical direction, and
The pitch at equal intervals state the said plurality of driver plurality of suction heads while variable at equal intervals in a state the pitch of the plurality of connected to the drive member of the plurality of suction head and the plurality of the driver A drive link mechanism that moves integrally in a variable direction ,
The drive link mechanism is provided with a parallel first axis and a second axis extending in the variable direction,
The first shaft is rotated, and the plurality of driving bodies and the plurality of suction heads are integrally moved in the variable direction,
A component mounting apparatus in which a pitch of the plurality of driving bodies and the plurality of suction heads is varied by rotating the second shaft . The drive link mechanism is provided with a link body connected to the plurality of drive bodies,
A ball screw shaft having a thread groove as the first shaft is provided;
A spline shaft for guiding the link body in the variable direction is provided as the second shaft.
The component mounting apparatus according to claim 1 . A substrate is used as the mounting body,
Functional materials are filled between the plurality of electronic components and the substrate,
A protective tape that extends in the variable direction and separates the functional material and the suction head is positioned between the plurality of suction heads and the electronic components.
The component mounting apparatus according to claim 1 or 2 . A plurality of air circulation holes are formed in the protective tape at the same interval as the pitch of the plurality of electronic components.
The component mounting apparatus according to claim 3 . A tape feeding mechanism is provided for feeding the protective tape in the variable direction.
The component mounting apparatus according to claim 3 or 4 . When the suction head is raised, a sticking prevention portion is provided below the suction head so as to be able to contact the protective tape from above.
The component mounting apparatus according to claim 3, 4 or 5 . The protective tape can be adsorbed to the adsorption part.
The component mounting apparatus according to claim 4, claim 5, or claim 6 . The heater is constituted by a first heater set at a first heating temperature and a second heater set at a second heating temperature higher than the first heating temperature;
The plurality of suction heads are provided with the first heater or the second heater,
The component mounting apparatus according to claim 1, wherein heating by the first heater and heating by the second heater are sequentially performed on the same electronic component.

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