JP3885993B2 - Polishing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a polishing method.
[0002]
[Prior art]
Conventionally, as a polishing method of a workpiece such as a mold for molding an optical element, a method of reciprocating the polishing tool while pressing a small-diameter polishing tool against a processing surface of the workpiece with a constant force is used. ing. According to such a polishing method, the polishing depth can be adjusted by changing the moving speed of the polishing tool, the processing accuracy of the processing surface can be improved, and the waviness on the processing surface can be removed. it can.
[0003]
FIG. 12 shows a general working mode when the processing surface 102 of the mold 101 for molding a lens as an optical element is polished with a small-diameter polishing tool 103, and FIG. 3 is a plan view showing a tool trajectory of a polishing tool 103 on a processing surface 102. FIG. The rectangular broken line in FIG. 13 indicates that the inner part is an optically effective area and the outer part is an optically unnecessary area.
[0004]
The polishing tool 103 is driven to rotate about an axis and moves on a predetermined tool path while being pressed against the processing surface 102 with a predetermined polishing load F. This tool trajectory is a tool trajectory heading in the Y direction, which is the short direction (sub-scanning direction) of the mold 101, or the opposite direction thereof, and the mold 101 orthogonal to the Y direction at the end of the Y direction or the opposite direction. Are formed by a small amount of tool trajectory in the X direction which is the longitudinal direction (main scanning direction).
[0005]
Here, when polishing is performed by driving a general-purpose NC machine tool, when the polishing tool 103 moves in the Y direction, the moving speed gradually decreases at the end thereof, and the moving direction of the polishing tool 103 changes from the Y direction to the X direction. It becomes “0” instantaneously at a portion turned back approximately 90 ° in the direction.
[0006]
FIG. 14 shows the processing surface 102 of the mold 101 in the sub-scanning direction (Y direction) and the movement range of the polishing tool 103 that moves on the processing surface 102. The width dimension in the sub-scanning direction (Y direction) of the mold 101 is 2.4 mm, the contact width dimension with the machining surface 102 of the polishing tool 103 formed of an elastic member is about 0.8 mm, and NC machining The moving width dimension of the polishing tool 103 controlled by the NC data of the machine is 1.6 mm.
[0007]
FIG. 15 shows the polishing depth (polishing) in the sub-scanning direction when the polishing tool 103 is moved in the sub-scanning direction (Y direction) of the mold 101 and the work surface 102 of the mold 101 is polished as shown in FIG. Amount). At both ends in the sub-scanning direction, an excessively polished portion A in which the polishing depth is remarkably increased due to a decrease in the moving speed of the polishing tool 103 occurs. And the stable processing area in which appropriate grinding | polishing is performed will be about 0.6 mm. That is, the stable processing area is reduced to about 1/4 with respect to the width dimension of 2.4 mm of the processing surface 102 of the mold 101.
[0008]
[Problems to be solved by the invention]
For these reasons, various polishing methods have been proposed in which the proportion of the stable processing region is increased, and examples thereof include those described in JP-A Nos. 62-246467 and 2001-79742. As described above, a pseudo-shape (Yato) having a guide surface continuous with the work surface is provided on the outer periphery of the work surface of a workpiece (for example, a mold), and the polishing tool is moved on the pseudo-guide surface. There is a known method of turning the direction.
[0009]
However, this method increases the number of new work steps for forming a pseudo-shape (Yatoi) having a guide surface having no step with respect to the processed surface of the workpiece. Furthermore, when finishing workpieces and pseudo-shapes with ultra-precise cutting, the machining area of ultra-precise cutting increases by that amount, increasing the time required for ultra-precise cutting and the amount of wear of the tool for performing ultra-precise cutting. Problems such as a reduction in the precision of ultra-precise cutting due to the above-mentioned will occur in the pre-process of polishing.
[0010]
Further, as a polishing method that does not use a pseudo-shape (Yatoi), as described in Japanese Patent Laid-Open No. 2001-138196, a defect area caused by turning back in the moving direction of the polishing tool is changed to an optically unnecessary area in the workpiece. The method of storing is known.
[0011]
However, according to this polishing method, the workpiece must be formed in an unnecessarily large size, and there is a problem similar to the case where the pseudo shape is used.
[0012]
Further, as described in Japanese Patent Laid-Open No. 2001-170852, the amount of polishing in the turning region in the moving direction of the polishing tool is reduced by synchronously controlling the turning in the moving direction of the polishing tool and the peripheral speed of the polishing tool. A polishing method is also known.
[0013]
However, in this polishing method, the number of rotations of the polishing tool must be controlled within an extremely short time of 1 second or less, which is difficult to control.
[0014]
An object of the present invention is to provide a polishing method capable of easily and accurately polishing a processed surface of a workpiece.
[0015]
An object of the present invention is to increase the ratio of the stable processing area in the polishing process.
[0016]
[Means for Solving the Problems]
  According to the first aspect of the present invention, a rotating small-diameter polishing tool is pressed against a work surface of a workpiece with a predetermined load and relatively moved in the first direction or the opposite direction, and the predetermined direction in the first direction or the opposite direction is moved. After moving to a position, a turn that moves a relatively small amount in a second direction substantially orthogonal to the moving direction,With the polishing tool pressed against the workpiece with the predetermined loadPolishing method for polishing the processed surface by repeatingBecauseThe polishing tool in a region where the relative movement direction of the polishing tool is turned back from the first direction or the opposite direction to the second direction, and a region where the relative movement direction of the polishing tool is turned back from the second direction to the first direction or the opposite direction. It is characterized in that the tool trajectory is moved on the tool trajectory heading simultaneously in the first direction or the two opposite directions and the second direction.
[0017]
Therefore, in a region where the moving direction of the polishing tool is turned back from the first direction or its reverse direction to the second direction, or from the second direction to the first direction or its reverse direction, the polishing tool moves in the first direction or its reverse direction. And the second direction are simultaneously moved on the tool trajectory heading in the two directions, it is possible to suppress a decrease in the moving speed of the polishing tool, and further, it is possible to reduce the density of the tool trajectory. It is possible to prevent excessive polishing in the region where the moving direction is turned back.
[0018]
  The invention according to claim 2 is the polishing method according to claim 1, wherein the tool locus is formed by coordinate command points of NC data of an NC machine tool,AboveIn the first direction or vice versaAboveThe tool trajectory of the section moving simultaneously in two directions with the second direction is formed by a straight line or an arc.
[0019]
Therefore, such setting of the tool path can be easily performed by a normal G code command of the NC machine tool.
[0020]
  According to a third aspect of the present invention, in the polishing method according to the first aspect, the tool path is formed by adjusting a response speed of the NC machine tool,AboveIn the first direction or vice versaAboveThe tool trajectory of the section moving simultaneously in two directions with the second direction is formed so as to make a short turn around the inside of the first direction or the opposite direction and the second direction.
[0021]
Therefore, such setting of the tool trajectory can be easily performed only by tuning the positioning servo of the NC machine tool or setting parameters without correcting the NC data.
[0022]
  The rotating small-diameter polishing tool is pressed against the work surface of the workpiece with a predetermined load, and the polishing is performed so that the tool trajectory is cut back in a zigzag manner by planar projection while pressing the polishing tool against the workpiece with the predetermined load. A polishing method for polishing the processed surface by moving a tool, wherein a tip portion of the tool trajectory cut back in a zigzag shape is rounded into an arc shape or a trapezoidal shape.
[0023]
  Therefore, in the region where the tool trajectory of the polishing tool is turned back in a zigzag shape, it is possible to suppress a decrease in the moving speed of the polishing tool, and further to reduce the density of the tool trajectory, thereby returning the moving direction of the polishing tool. It is possible to prevent over-polishing in the region to be used.
[0024]
  The invention according to claim 55. The polishing method according to claim 1, wherein a part of the polishing tool is separated from the processing surface of the workpiece except the maximum movement position of the polishing tool in the first direction or the opposite direction. This is characterized in that a part of is in a position in contact with the processed surface.
[0025]
Therefore, it is possible to increase the movement width of the polishing tool when the polishing tool is moved in the first direction or in the opposite direction, whereby the remaining polishing regions on both ends in the first direction on the processing surface of the work piece can be increased. The number of stable processing areas increases.
[0026]
  The invention described in claim 66. The polishing method according to claim 5, wherein a chamfering process is performed on an edge of the workpiece in a moving direction of the polishing tool in the first direction or the opposite direction thereof.
[0027]
  Therefore, when polishing is performed using a polishing tool formed of an elastic member, the edge of the workpiece is chamfered so that a part of the polishing tool is processed on the workpiece surface. Even if the part of the polishing tool is separated from the workpiece surface and the part is in contact with the machining surface, the deformation state of the polishing tool at the contact portion between the polishing tool and the edge of the workpiece becomes gentle, and the polishing tool is caused by sharp deformation. Is prevented from being damaged. Further, since the chamfering process eliminates burrs at the edge of the workpiece, the burrs remaining on the edge of the workpiece are caught in the polishing tool and come into contact with the processing surface of the workpiece. Generation of scratches is prevented.
[0028]
DETAILED DESCRIPTION OF THE INVENTION
A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows an operation mode when a processing surface 2 of a mold 1 which is a workpiece for molding a lens which is an optical element is polished with a small-diameter polishing tool 3. FIG. It is a top view which shows the tool locus | trajectory of the grinding | polishing tool 3 on the process surface 2 at that time. The rectangular broken line in FIG. 2 indicates that the inner part is an optically effective area and the outer part is an optically unnecessary area.
[0029]
The polishing tool 3 is formed by shaping a compression member in which urethane resin and wood are kneaded, and a diamond paste having a diameter of ¼ μm is used as an abrasive on the outer peripheral portion.
[0030]
Further, the polishing tool 3 is connected to an NC machine tool (not shown) and is driven to rotate around an axis, and is pressed against the processing surface 2 with a predetermined polishing load F. Further, the polishing tool 3 is connected to the NC machine tool so that the inclination adjustment in which the normal direction of the processing surface 2 and the direction of the polishing load always coincide is performed.
[0031]
The tool trajectory of the polishing tool 3 when the processing surface 2 is polished by the polishing tool 3 is in the short direction (sub-scanning direction) of the mold 1 as shown in FIG. 2 and FIG. A tool trajectory heading in a certain first direction (Y direction) or its reverse direction (Y direction), and a longitudinal direction (main scanning direction) of the mold 1 orthogonal to the Y direction at the end of the first direction or its reverse direction A small amount of tool trajectory toward the second direction (X direction), a region where the moving direction of the polishing tool 3 is turned back from the first direction or the opposite direction to the second direction, and the second direction (X direction) Is formed by a tool trajectory that simultaneously travels in two directions, the Y direction and the X direction, in a region turned back in the first direction (Y direction) or the opposite direction (Y direction).
[0032]
3A is an enlarged view of a part of the tool path of the present embodiment, and FIG. 3B is an enlarged view of a part of the tool path in the conventional example shown in FIG. Is. Both the tool trajectory of the present embodiment shown in FIG. 3A and the tool trajectory of the conventional example shown in FIG. 3B are formed by coordinate command points (white circle points) of NC data. In the present embodiment, “P0” and “P1” in FIG. 3B are moved to “P0S” and “P1S” in FIG. 3A to move in the X direction and the Y direction. A linear tool trajectory heading simultaneously is formed. In FIGS. 3A and 3B, “W1” is 0.1 mm, “C1” is 0.2 mm, and “C1S” is 0.1 mm.
[0033]
By such a change of the tool trajectory, in the conventional example shown in FIG. 3B, the time until the polishing tool 103 reaches the “B” point from the “A” point is 1.0 second. In the present embodiment shown in FIG. 3A, the time required for the polishing tool 3 to reach the “B” point from the “A” point can be shortened to 0.4 seconds. This means that it is possible to suppress a decrease in the moving speed of the polishing tool 3 at both ends in the Y direction, and it is possible to prevent excessive polishing accompanying a decrease in the moving speed.
[0034]
Furthermore, the length of the tool trajectory included in the rectangular area “S” of the same area shown in FIG. 3A and FIG. 3B is the same as that in FIG. It is shorter than the conventional example shown in (b). This means that the density of tool trajectories within the same area at both ends in the Y direction is lower than that of the conventional example in this embodiment, and this also prevents excessive polishing at both ends in the Y direction. It will contribute.
[0035]
FIG. 4 shows the machining surface 2 of the mold 1 in the sub-scanning direction (Y direction) and the movement range of the polishing tool 3 that moves on the machining surface 2. The width dimension of the mold 1 in the sub-scanning direction (Y direction) is 2.4 mm, the contact width dimension with the machining surface 2 of the polishing tool 3 having elasticity is about 0.8 mm, and is controlled by NC data of the NC machine tool. The moving width dimension of the polishing tool 3 is 1.6 mm.
[0036]
4 is the same as FIG. 14 described as the conventional example, but the polishing depth in the sub-scanning direction (Y direction) when the processing surface 2 of the mold 1 is polished according to the present embodiment is as follows. As shown in FIG. That is, although incompletely processed areas are generated by 0.6 mm at both ends of the mold 1 in the sub-scanning direction (Y direction), the occurrence of excessively polished portions at both ends in the Y direction is prevented. The stable processing area where smooth polishing is performed is as wide as about 1.2 mm, and the ratio of the stable processing area is increased.
[0037]
In the present embodiment, the case where the tool trajectory toward the Y direction and the X direction of the polishing tool 3 at both ends in the sub-scanning direction (Y direction) is formed linearly has been described as an example. Alternatively, the number of coordinate command points may be increased and arranged in an arc shape to form an arc shape.
[0038]
In the present embodiment, the case where the polishing tool 3 is moved with the mold 1 fixed as a position has been described as an example. However, the mold 1 may be moved with the polishing tool 3 fixed as a position.
[0039]
Next, a second embodiment of the present invention will be described with reference to FIG. In addition, the same part as the part demonstrated in 1st Embodiment (FIGS. 1 thru | or FIG. 5) is shown with the same code | symbol, and description is abbreviate | omitted (the same also in the following embodiment).
[0040]
As in the first embodiment, this embodiment also suppresses a decrease in the moving speed of the polishing tool (not shown) at both ends in the sub-scanning direction (Y direction), and the sub-scanning direction (Y By reducing the density of the tool trajectory of the polishing tool at both ends in the direction), excessive polishing at both ends in the sub-scanning direction (region where the moving direction of the polishing tool is turned back) is prevented.
[0041]
Therefore, in this embodiment, the coordinate command point of NC data is set to be the same as that of the conventional example shown in FIG. 3B, and the response speed of the NC machine tool is adjusted by tuning the positioning servo or changing the parameters. The tool trajectory is made to make short turns inside the Y direction and the X direction.
[0042]
Next, a third embodiment of the present invention will be described with reference to FIGS. In the present embodiment, the maximum movement position of the polishing tool 3 in the sub-scanning direction (Y direction) is such that a part of the polishing tool 3 is detached from the processing surface 2 of the mold 1 as shown in FIG. Is a position where a part of the polishing tool 3 is in contact with the processing surface 2, and the movement width dimension of the polishing tool 3 in the sub-scanning direction is 2.4 mm.
[0043]
Further, a chamfered portion 4 is formed at the edge of the mold 1 in the sub-scanning direction. The chamfered portion 4 has a radius of curvature of 0.1 mm or more.
[0044]
In such a configuration, when the polishing tool 3 is moved in the sub-scanning direction (Y direction), the movement width of the polishing tool 3 can be made substantially the same as the width of the mold 1 in the sub-scanning direction. As a result, the unpolished areas on both ends in the sub-scanning direction on the processing surface 2 of the mold 1 are reduced, and as shown in FIG. 9, the stable processing area is widened to about 2.0 mm, and the ratio of the stable processing area is growing.
[0045]
Further, in the present embodiment, since the chamfered portions 4 are formed at the edge portions at both ends in the sub-scanning direction of the mold 1, as shown in FIG. The deformation state of the polishing tool 3 at the contact portion between the polishing tool 3 and the edge of the mold 1 is moderate even when the processing surface 2 is separated from the processing surface 2 and another part is in contact with the processing surface 2. Thus, the polishing tool 3 is prevented from being damaged. Moreover, since the burr is reliably removed from the edge of the mold 1 by the formation of the chamfered portion 4, the burr remaining on the edge of the mold 1 is polished along with the polishing process. It is possible to prevent the burrs that have been wound into contact with the processed surface 2 of the mold 1 and cause scratches on the processed surface 2.
[0046]
On the other hand, FIG. 8B shows a case where the edge of the mold 1 is not chamfered. When chamfering is not performed on the edge of the mold 1, when a part of the polishing tool 3 is detached from the processing surface 2 of the mold 1 and the other part is in contact with the processing surface 2. Then, a sharp deformation occurs in the contact portion of the polishing tool 3 with the edge of the mold 1, and the polishing tool 3 is easily damaged by the deformation. Furthermore, a situation in which burrs remain on the edge of the mold 1 is likely to occur, and after the burrs are wound on the polishing tool 3, the burrs may come into contact with the processing surface 2 to generate scratches on the processing surface 2. .
[0047]
In the present embodiment, the case where the chamfered portion 4 is formed in an arc shape has been described as an example. However, the chamfered portion 4 may be chamfered in a right isosceles triangle shape. In that case, by setting one side of the chamfered portion to 0.1 mm or more, it is possible to prevent abrupt deformation from occurring when the polishing tool 3 comes into contact with the chamfered portion. 3 can be prevented from being damaged.
[0048]
Further, in the present embodiment, the chamfered portion 4 is formed at the edge of the mold 1, and a part of the polishing tool 3 having elasticity is detached from the processing surface 2 of the mold 1 and the other part is processed. The case where the sharp deformation of the polishing tool 3 at the contact portion between the polishing tool 3 and the edge of the mold 1 is prevented when the surface 2 is brought into contact is described. However, even when the hardness of the polishing tool is increased and a part of the polishing tool is detached from the processing surface 2 of the mold 1 and the other part is in contact with the processing surface 2, the deformation amount of the polishing tool is reduced. Therefore, chamfering at the edge of the mold 1 is not always necessary.
[0049]
Next, a fourth embodiment of the present invention will be described with reference to FIG. In the present embodiment, as shown in FIG. 10 (b), when the tool locus is turned back so as to be zigzag (N-shaped) by planar projection and polishing is performed, the tip portion of the tool locus is As shown to Fig.10 (a), it is rounded to trapezoid shape.
[0050]
As a method of rounding the tip portion of the tool locus into a trapezoidal shape, as described in the first embodiment (FIG. 5), a method of changing the coordinate command point of NC data is adopted.
[0051]
In this way, by rounding the tip of the zigzag tool path into a trapezoidal shape, it is possible to suppress a decrease in the moving speed of the polishing tool in the area where the tool path is turned back, and further reduce the density of the tool path. Accordingly, excessive polishing in a region where the moving direction of the polishing tool is turned back can be prevented, and the ratio of the stable processing region on the processing surface of the mold can be increased.
[0052]
Next, a fifth embodiment of the present invention will be described with reference to FIG. In the present embodiment, as shown in FIG. 11 (b), when the tool locus is turned back so as to have a zigzag shape (triangular wave shape) by planar projection and polishing is performed, the tip portion of the tool locus is illustrated. As shown in 11 (a), it is rounded into an arc.
[0053]
As described in the second embodiment (FIG. 6), the tip of the tool locus is rounded into an arc shape. As described in the second embodiment (FIG. 6), the NC data coordinate command point is not changed. A method is adopted in which the response speed of the machine tool is adjusted, and the inner side of the tool path is turned around on the tip side.
[0054]
In this way, by rounding the tip portion of the zigzag tool path in an arc shape, it is possible to suppress a decrease in the moving speed of the polishing tool in the area where the tool path is turned back, and to further reduce the density of the tool path. Thus, excessive polishing in the region where the moving direction of the polishing tool is turned back can be prevented, and the ratio of the stable processing region on the processing surface of the mold can be increased.
[0055]
【The invention's effect】
According to the polishing method of the first aspect of the present invention, the region in which the relative movement direction of the polishing tool is turned back from the first direction or the opposite direction to the second direction, and the second direction to the first direction or the direction thereof. Since the polishing tool is moved on the tool trajectory heading simultaneously in the first direction or the two directions of the opposite direction and the second direction in the region turned back in the reverse direction, the movement direction of the polishing tool is the first direction or In the region that is turned back from the opposite direction to the second direction and from the second direction to the first direction or the opposite direction, it is possible to suppress a decrease in the moving speed of the polishing tool, and further reduce the density of the tool trajectory. Accordingly, excessive polishing in a region where the moving direction of the polishing tool is turned back can be prevented, and high-precision polishing can be performed.
[0056]
According to a second aspect of the present invention, in the polishing method according to the first aspect, the tool locus is formed by coordinate command points of NC data of the NC machine tool, and the first direction or the opposite direction and the second direction Since the tool trajectory in the section moving simultaneously in the two directions is formed by a straight line or an arc, such a tool trajectory can be easily set by a normal G code command of the NC machine tool.
[0057]
According to a third aspect of the present invention, in the polishing method according to the first aspect, the tool trajectory is formed by adjusting a response speed of the NC machine tool, and the first direction or its reverse direction and the second direction The tool trajectory of the section that moves simultaneously in the two directions is formed so as to make a short turn around the inside of the first direction or the opposite direction and the second direction. Can be easily performed only by tuning the positioning servo of the NC machine tool or setting parameters.
[0058]
  According to the polishing method of the invention according to claim 4,When polishing the work surface of the workpiece by moving the polishing tool so that the tool trajectory is cut back in a zigzag pattern by planar projection, the tip portion of the tool trajectory cut back in a zigzag shape is rounded into an arc shape or a trapezoidal shape. By doing so, it is possible to suppress a decrease in the moving speed of the polishing tool at the tip portion, and further to reduce the density of the tool trajectory, whereby an excessive amount in an area where the moving direction of the polishing tool is turned over. Polishing can be prevented, and accurate polishing can be performed.
[0059]
  According to the polishing method of the invention of claim 5,5. The polishing method according to claim 1, wherein a part of the polishing tool moves away from the processing surface of the workpiece and the other part of the maximum movement position of the polishing tool in the first direction or the opposite direction. Is in a position in contact with the processing surface, the movement width of the polishing tool when the polishing tool is moved in the first direction or in the opposite direction can be increased. The unpolished area on both ends in one direction is reduced, and the ratio of the stable processing area can be increased.
[0060]
  According to the invention described in claim 6,6. The polishing method according to claim 5, wherein chamfering is performed on an edge of the workpiece in a moving direction of the polishing tool in the first direction or in the opposite direction, so that the workpiece is formed of an elastic member. When the polishing process is performed using a polishing tool, the edge of the workpiece is chamfered so that a part of the polishing tool is detached from the processing surface of the workpiece and the other part is removed. Even when it is in contact with the machining surface, the deformation state of the polishing tool at the contact portion between the polishing tool and the edge of the workpiece becomes gentle, and damage to the polishing tool due to sharp deformation can be prevented. In addition, the chamfering process eliminates burrs at the edge of the workpiece, and scratches on the workpiece surface that cause the burrs remaining on the edge of the workpiece to be caught in the polishing tool. Can be prevented.
[Brief description of the drawings]
BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a perspective view showing a working mode of polishing processing in a first embodiment of the present invention.
FIG. 2 is a plan view showing a tool trajectory of a polishing tool on a processing surface.
FIG. 3A is a plan view showing an enlarged part of the tool path of the polishing tool, and FIG. 3B is a plan view showing an enlarged part of the tool path of the polishing tool in the conventional example. .
FIG. 4 is a cross-sectional view showing a moving range of a polishing tool that moves on a processing surface in a sub-scanning direction (Y direction) of a mold.
FIG. 5 is a graph showing the polishing depth in the sub-scanning direction (Y direction) when the processed surface of the mold is polished.
FIG. 6 is an enlarged plan view showing a part of a tool path of a polishing tool according to a second embodiment of the present invention.
FIG. 7 is a cross-sectional view showing a moving range of a polishing tool that moves on a processing surface in a sub-scanning direction (Y direction) of a mold in a third embodiment of the present invention.
FIG. 8 is a cross-sectional view showing a deformed state of the polishing tool when a chamfered portion is formed at the edge in the sub-scanning direction of the mold (a) and when a chamfered portion is not formed (b).
FIG. 9 is a graph showing the polishing depth in the sub-scanning direction (Y direction) when the processed surface of the mold is polished.
FIG. 10 is a plan view showing a tool path (a) of a polishing tool in a fourth embodiment of the present invention in comparison with a tool path (b) of a conventional example.
FIG. 11 is a plan view showing a tool locus (a) of a polishing tool in a fifth embodiment of the present invention in comparison with a tool locus (b) of a conventional example.
FIG. 12 is a perspective view showing an operation mode of polishing in a conventional example.
FIG. 13 is a plan view showing a tool trajectory of a polishing tool on a processing surface.
FIG. 14 is a cross-sectional view showing a moving range of a polishing tool that moves on a processing surface in a sub-scanning direction (Y direction) of a mold.
FIG. 15 is a graph showing the polishing depth in the sub-scanning direction (Y direction) when the processed surface of the mold is polished.
[Explanation of symbols]
1 Workpiece
2 Machining surface
3 Abrasive tools

Claims (6)

A rotating small-diameter polishing tool is pressed against the work surface of the workpiece with a predetermined load, moved relatively in the first direction or the opposite direction, moved to a predetermined position in the first direction or the opposite direction, and then moved. the crosscut to relatively small amount of movement in the second direction to a direction substantially orthogonal, meet the polishing method for polishing the work surface by repeating remain pressed against the polishing tool to the workpiece at the predetermined load And
In the region where the relative movement direction of the polishing tool is turned back from the first direction or its reverse direction to the second direction, and the region where the relative direction of the polishing tool is turned back from the second direction to the first direction or its reverse direction, A polishing method characterized by moving on a tool trajectory heading simultaneously in one direction or two directions of the opposite direction and the second direction. The tool path is formed by the coordinate command point of the NC data for NC machine tools, the tool path sections simultaneously moved in two directions between the first direction or the second direction and the opposite direction is formed by a straight line or arc The polishing method according to claim 1, wherein the polishing process is performed. The tool path is formed by adjusting the response speed of the NC machine tool, the tool path of the section to be moved simultaneously in two directions between the first direction or the second direction and its opposite direction or a first direction The polishing method according to claim 1, wherein the polishing method is formed so as to make a short turn around the inside of the opposite direction and the second direction. The rotating small-diameter polishing tool is pressed against the work surface of the workpiece with a predetermined load, and the polishing is performed so that the tool trajectory is cut back in a zigzag manner by planar projection while pressing the polishing tool against the workpiece with the predetermined load. a polishing method of polishing the work surface by moving the tool,
A polishing method characterized in that a tip portion of the tool trajectory cut back in a zigzag shape is rounded into an arc shape or a trapezoidal shape. The maximum movement position of the polishing tool in the first direction or the opposite direction is a position where a part of the polishing tool is detached from the processing surface of the workpiece and the other part is in contact with the processing surface. The polishing method according to claim 1 or 4, wherein the polishing method is characterized. 6. The polishing method according to claim 5, wherein a chamfering process is performed on an edge of the workpiece in a moving direction of the polishing tool in the first direction or in the opposite direction.

Images