JP3874152B2 - 加熱装置及び加熱方法 - Google Patents
加熱装置及び加熱方法 Download PDFInfo
- Publication number
- JP3874152B2 JP3874152B2 JP13235499A JP13235499A JP3874152B2 JP 3874152 B2 JP3874152 B2 JP 3874152B2 JP 13235499 A JP13235499 A JP 13235499A JP 13235499 A JP13235499 A JP 13235499A JP 3874152 B2 JP3874152 B2 JP 3874152B2
- Authority
- JP
- Japan
- Prior art keywords
- container
- gap
- vessel
- reaction vessel
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 title claims description 36
- 238000000034 method Methods 0.000 title claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 50
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 45
- 238000001816 cooling Methods 0.000 claims description 7
- 230000008020 evaporation Effects 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- 239000000498 cooling water Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000005407 aluminoborosilicate glass Substances 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13235499A JP3874152B2 (ja) | 1999-05-13 | 1999-05-13 | 加熱装置及び加熱方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13235499A JP3874152B2 (ja) | 1999-05-13 | 1999-05-13 | 加熱装置及び加熱方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2000323419A JP2000323419A (ja) | 2000-11-24 |
JP2000323419A5 JP2000323419A5 (enrdf_load_stackoverflow) | 2005-10-27 |
JP3874152B2 true JP3874152B2 (ja) | 2007-01-31 |
Family
ID=15079408
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13235499A Expired - Fee Related JP3874152B2 (ja) | 1999-05-13 | 1999-05-13 | 加熱装置及び加熱方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3874152B2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006165304A (ja) * | 2004-12-08 | 2006-06-22 | Ishikawajima Harima Heavy Ind Co Ltd | 水蒸気アニール装置とこの装置における水蒸気導入方法 |
JP5024645B2 (ja) * | 2005-07-07 | 2012-09-12 | 株式会社Ihi | 水蒸気アニール用治具 |
JP4683332B2 (ja) * | 2005-12-28 | 2011-05-18 | 株式会社Ihi | 熱処理装置 |
JP2010021558A (ja) * | 2009-07-23 | 2010-01-28 | Kyoshin Engineering:Kk | 高精度高圧アニール装置 |
-
1999
- 1999-05-13 JP JP13235499A patent/JP3874152B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2000323419A (ja) | 2000-11-24 |
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