JP3874152B2 - Heating apparatus and heating method - Google Patents

Heating apparatus and heating method Download PDF

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JP3874152B2
JP3874152B2 JP13235499A JP13235499A JP3874152B2 JP 3874152 B2 JP3874152 B2 JP 3874152B2 JP 13235499 A JP13235499 A JP 13235499A JP 13235499 A JP13235499 A JP 13235499A JP 3874152 B2 JP3874152 B2 JP 3874152B2
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container
gap
vessel
reaction vessel
water
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JP2000323419A (en
JP2000323419A5 (en
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淳 芳之内
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石川島播磨重工業株式会社
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【0001】
【発明が属する技術分野】
本発明は、半導体等の熱処理に用いられる加熱装置に係り、特に液晶ディスプレイやイメージセンサ等を製作するために、ガラス基板上に形成される薄膜トランジスタの熱処理に用いられる加熱装置に関する。
【0002】
【従来の技術】
シリコンウエハや基板上に形成された半導体膜を処理するためのアニール炉、拡散炉、酸化炉や膜を形成するための減圧CVD(Chemical Vapor Deposition)等の加熱炉が従来から多く用いられている。近年、これらの加熱炉は、装置の省スペース化を図るため反応管を横置きするタイプに代わり縦置きするタイプ(例えば、特開平8−8194の図3に開示されている。)が主流となっている。また、酸化炉においては反応管内ガス雰囲気を高圧にすることによって、圧力に依存した高い反応レートを得ることができる(例えば、特開昭53−112064、特開昭56−24938に開示されている。)ことも知られている。また、近年、液晶ディスプレイ等に大面積角型ガラス基板が用いられるため、従来の丸型シリコンウエハに代わって大面積角型ガラス基板を処理する装置が求められている。
【0003】
また、ガラス基板を処理する場合、ガラス基板に影響を及ぼさないような温度で処理する必要がある。通常、半導体デバイスへの不純物の影響を考慮して、無アルカリガラスが用いられる。無アルカリガラスにはバリウムホウケイ酸ガラス、ホウケイ酸ガラス、アルミノホウケイ酸ガラス、アルミノケイ酸ガラス等が用いられる。しかし、このようなガラス基板の歪点は593〜700℃程度であり、実際に使用できる温度は600℃以下であるので、600℃以下で処理することが求められている。なお、反応容器の炉体は、内部の汚染防止のため石英などで製作されており、反応容器内の圧力を高圧にするために反応容器を高圧に耐える鋼製の密閉容器内に収容し、反応容器内外の圧力を等しくするようにしている。
【0004】
図2は従来の加熱装置の断面図である。図において、1は被加熱物を収容する密閉竪型円筒状で底部が開放可能な反応容器である。反応容器1は先に述べたように石英などでできており、上部構造1aと底部構造1bからなり、上部構造1aと底部構造1bとの間にシール1cが挟持されており、被加熱物の収納時と取出し時に底部構造1bを開放する。上部構造1aは天井部は皿形をしており、下端が開放された円筒状で外側に張り出した締結用のフランジを有している。底部構造1bは上方が皿形をしており、下端が開放された円筒状で外側に張り出した締結用のフランジを有し、高さが上部構造1aより低く、底部構造1bを上部構造1aに挿入して反応容器1を構成する。反応容器1の底部構造1b上に多段のホルダ4が取付けられており、このホルダ4に多数のガラス基板などの被加熱物5を載置する。2はヒータ容器である。ヒータ容器2は反応容器1に上から被せるように囲繞しており、下方が開放された竪型円筒状をしている。ヒータ容器2は断熱材でできており、内面にはヒータ2aが、周壁および天井に取り付けられている。ヒータ2aはヒータ容器2の他に、反応容器1の底部構造1bの内部にも設けられており、反応容器1を上下面および周面から加熱する。
【0005】
3は密閉容器である。密閉容器3は鋼製の耐圧容器であり、上部構造3aと底部構造3bとからなり、締結を解除することにより開放可能である。上部構造3aは天井部が皿形をしており、下端が開放されていて、外側に張り出した締結用のフランジを有している。底部構造3bは下方が皿形をしており、上端が開放されていて外側に張り出した締結用フランジを有している。6は蒸気発生器であり、内部に熱水を貯留し、下方に設けたヒータ2aにより加熱されて水蒸気を発生する。7は上記発生器6に水を補給する水導入管である。8aは昇圧用空気導入管であり、8bは降圧用空気排出管である。9aは酸素などの反応ガスを反応容器1内に導入するガス導入管であり、9bはガス排出管である。10は冷却水が循環するウォータジャケットである。
【0006】
【発明が解決しようとする課題】
反応容器1の上部構造1aのフランジと下部構造1bのフランジとの間に挟まれたシール1cはOリングでゴム製であるため、せいぜい200℃程度の耐熱性があるにすぎない。そのため図に示すように上下1対のフランジを挟んでシール冷却ジャケット12を設けてシール1cを冷却し、その温度が200℃以上にならないようにしている。なお、12aは冷却水導入管であり、12bは冷却水排出管である。
【0007】
しかし、冷却ジャケット12による冷却は、ジャケット12からフランジおよびシール1cとの伝熱を良くしなければならず、そのためジャケット12とフランジとの密着性を高めなければならないが、現実には困難で、部分的に過熱状態になり、シール1cが劣化してしまう。また、密閉容器内を高圧にするので、ジャケット12や配管12aに耐圧性を持たせるため高価になってしまう。さらに、反応容器1内に水蒸気を含むガスを導入する場合には、底部構造1bの外周と上部構造1aとの間に形成される隙間であって、シール1cの内側の部分が冷却されているために反応容器1内の水蒸気が凝縮してドレンが溜るが、一旦ドレンが溜ると上記隙間は200℃以下の低温に保たれ、ジャケット12に冷水を導入する必要がなくなることがわかった。
【0008】
本発明は従来技術のかかる問題点に鑑み、かつ、上記知見に基づいて案出されたもので、シール冷却ジャケット12が不要で、かつ、シール1cの冷却性に優れた加熱装置を提供することを目的とする。
【0009】
【課題を解決するための手段】
上記目的を達成するため本発明の加熱装置は、内部に被加熱物を収容する密閉竪型円筒状で底部が開放可能で水蒸気を含む気体が導入される反応容器と、該反応容器に上から被せるように囲繞する下方が開放された竪型円筒状のヒータ容器と、これらの容器を収容する竪型円筒状で底部が開放可能な耐圧密閉容器とを有してなる加熱装置であって、上記反応容器は上部が密閉され下部が開放された円筒状で下端に外側に張り出したフランジを有する上部構造と、上部が密閉され下部が開放された円筒状で下端に外側に張り出したフランジを有し、高さが上記上部構造より低く、上部構造内に下から挿入される下部構造と、上記上部構造のフランジと上記下部構造のフランジとに挟まれたシールとからなり、上記底部構造の外周と上記上部構造の内周との間に形成されるシール内側の隙間に注、排水配管を接続したものである。
【0010】
上記反応容器および密閉容器内には、1〜50気圧の気体が封入されているのが好ましい。
【0011】
次に、本発明の作用を説明する。
被加熱物を反応容器内に収容し、ヒータにより加熱を始める前に底部構造の外周と上部構造の内周との間に形成されるシール内側の隙間に注水しておく。ヒータによる加熱で反応容器内部は加熱温度まで昇温するが、この隙間の部分はヒータにより加熱されておらず、反応容器壁面からの伝熱のみなので注水された部分への入熱量は小さい。反応容器が加熱温度に保たれている間にこの隙間に溜った水は蒸発するので水を補給する。反応容器内には酸化ガスとして水蒸気が導入されており、水蒸気分圧が高いので、上記隙間に溜った水の蒸発量は少い。蒸発により潜熱が奪われるので水の温度は、反応容器内の水蒸気分圧に相当する飽和温度よりも高くなることはなく、シールの耐熱温度以下におさまる。また、この隙間に水を溜めてあるので、反応容器内に導入した水蒸気が低温部で結露する量を低減することができる。
【0012】
【発明の実施の形態】
以下本発明の1実施形態について、図面を参照しつつ説明する。
図1は本発明の加熱装置の断面図である。なお、本図において図2と共通の部分については同一の符号を付してあり、重複した説明は省略する。本発明の加熱装置は内部に被加熱物5を収容する密閉竪型円筒状で底部が開放可能で水蒸気を含む気体が導入される反応容器1と、該反応容器1に上から被せるように囲繞する下方が開放された竪型円筒状のヒータ容器2と、これらの容器を収容する竪型円筒状で底部が開放可能な耐圧密閉容器3とを有してなる。上記反応容器1は、上部が皿形で密閉され下部が開放された円筒状で下端に外側に張り出したフランジを有する上部構造1aと、上部が皿形で密閉され下部が開放された円筒状で下端に外側に張り出したフランジを有し、高さが上記上部構造1aより低く、上部構造内に下から挿入される底部構造1bと、上記上部構造1aのフランジと上記底部構造1bのフランジとに挟まれたシール1cとからなり、上記底部構造1bの外周と上記上部構造1aの内周との間に形成されるシール1c内側の隙間15に、注水配管13aと排水配管13bとを接続したものである。なお、14は隙間15に溜った水であり、16は熱放散蓋である。熱放散蓋16は、ヒータ容器16の天井部に設けられた孔2bを塞ぐようになっていて、加熱が完了して被加熱物5を自然冷却するときに開放して密閉容器3内の対流循環を活発に行わせて、被加熱物の冷却を促進するために設けられている。
【0013】
次に本実施形態の作用を説明する。
被加熱物5を反応容器1内に収容し、ヒータ2aにより加熱を始める前に底部構造1bの外周と上部構造1aの内周との間に形成されるシール1c内側の隙間15に注水して水14を溜めておく。ヒータ2aによる加熱で反応容器1内部は600℃程度の加熱温度まで昇温するが、この隙間15の部分は、ヒータ2aにより加熱されておらず、反応容器1壁面からの伝熱のみなので注水された部分14への入熱量は小さい。反応容器1が加熱温度に保たれている間に、この隙間に溜った水14は蒸発するので注水配管13aを通じて水を補給する。反応容器1内には酸化ガスとして水蒸気が導入されており、水蒸気分圧が高いので、上記隙間15に溜った水14の蒸発量は少い。蒸発により潜熱が奪われるので水の温度は、反応容器内の水蒸気分圧に相当する飽和温度よりも高くなることはなく、シール1cの耐熱温度以下におさまる。また、この隙間15に水を溜めてあるので、反応容器1内に導入した水蒸気が低温部で結露する量を低減することができる。
【0014】
本発明は以上述べた実施形態に限定されるものではなく、発明の要旨を逸脱しない範囲で種々の変更が可能である。
【0015】
【発明の効果】
以上説明したように、本発明の加熱装置は反応容器の底部構造の外周と上部構造の内周との間に形成される隙間に注、排水配管を接続し、反応容器の加熱中には上記隙間に水を溜めるようにしたので、反応容器の上部構造と底部構造との間のシールが過熱されて劣化することがなく信頼性が向上するとともに、反応容器内部に導入された水蒸気が低温部で結露する量を低減することができるなどの優れた効果を有する。
【図面の簡単な説明】
【図1】本発明の加熱装置の断面図である。
【図2】従来の加熱装置の断面図である。
【符号の説明】
1 反応容器
1a 上部構造
1b 底部構造
1c シール
2 ヒータ容器
3 密閉容器
5 被加熱物
13a 注水配管
13b 排水配管
15 隙間
[0001]
[Technical field to which the invention belongs]
The present invention relates to a heating device used for heat treatment of a semiconductor or the like, and more particularly to a heating device used for heat treatment of a thin film transistor formed on a glass substrate in order to manufacture a liquid crystal display, an image sensor, or the like.
[0002]
[Prior art]
Conventionally, heating furnaces such as annealing furnaces, diffusion furnaces, oxidation furnaces and low-pressure CVD (Chemical Vapor Deposition) for forming semiconductor films formed on silicon wafers and substrates have been used. . In recent years, these heating furnaces are mainly of a type in which a reaction tube is placed vertically instead of a type in which a reaction tube is placed horizontally (for example, disclosed in FIG. 3 of JP-A-8-8194) in order to save the space of the apparatus. It has become. Further, in an oxidation furnace, a high reaction rate depending on the pressure can be obtained by increasing the gas atmosphere in the reaction tube (for example, disclosed in JP-A-53-112064 and JP-A-56-24938). .) Is also known. In recent years, since a large-area square glass substrate is used for a liquid crystal display or the like, an apparatus for processing a large-area square glass substrate is required instead of the conventional round silicon wafer.
[0003]
Moreover, when processing a glass substrate, it is necessary to process at the temperature which does not affect a glass substrate. Usually, alkali-free glass is used in consideration of the influence of impurities on the semiconductor device. As the alkali-free glass, barium borosilicate glass, borosilicate glass, aluminoborosilicate glass, aluminosilicate glass, or the like is used. However, the strain point of such a glass substrate is about 593 to 700 ° C., and the actually usable temperature is 600 ° C. or less. In addition, the reactor body of the reaction vessel is made of quartz or the like to prevent internal contamination, and in order to increase the pressure in the reaction vessel, the reaction vessel is housed in a steel sealed vessel that can withstand high pressure, The pressure inside and outside the reaction vessel is made equal.
[0004]
FIG. 2 is a cross-sectional view of a conventional heating device. In the figure, reference numeral 1 denotes a reaction vessel having a closed bowl-shaped cylindrical shape that accommodates an object to be heated and whose bottom can be opened. As described above, the reaction vessel 1 is made of quartz or the like, and is composed of an upper structure 1a and a bottom structure 1b. A seal 1c is sandwiched between the upper structure 1a and the bottom structure 1b. The bottom structure 1b is opened during storage and removal. The upper structure 1a has a dish-shaped ceiling and has a fastening flange projecting outward in a cylindrical shape with an open lower end. The bottom structure 1b is dish-shaped at the top, has a cylindrical shape with an open lower end, and has a fastening flange projecting outward. The height is lower than that of the upper structure 1a, and the bottom structure 1b is replaced with the upper structure 1a. The reaction vessel 1 is configured by insertion. A multistage holder 4 is mounted on the bottom structure 1 b of the reaction vessel 1, and an object to be heated 5 such as a glass substrate is placed on the holder 4. 2 is a heater container. The heater container 2 surrounds the reaction container 1 so as to be covered from above, and has a vertical cylindrical shape with the lower part opened. The heater container 2 is made of a heat insulating material, and the heater 2a is attached to the inner wall and the ceiling on the inner surface. In addition to the heater vessel 2, the heater 2a is also provided inside the bottom structure 1b of the reaction vessel 1, and heats the reaction vessel 1 from the upper and lower surfaces and the peripheral surface.
[0005]
3 is an airtight container. The hermetic container 3 is a pressure vessel made of steel and includes an upper structure 3a and a bottom structure 3b, and can be opened by releasing the fastening. The upper structure 3a has a dish-shaped ceiling, has a lower end open, and has a fastening flange projecting outward. The bottom structure 3b is dish-shaped at the bottom, and has a fastening flange that is open at the top and projects outward. A steam generator 6 stores hot water therein and is heated by a heater 2a provided below to generate water vapor. Reference numeral 7 denotes a water introduction pipe for supplying water to the generator 6. 8a is a pressure-increasing air introduction pipe, and 8b is a pressure-lowering air discharge pipe. 9a is a gas introduction pipe for introducing a reaction gas such as oxygen into the reaction vessel 1, and 9b is a gas discharge pipe. Reference numeral 10 denotes a water jacket through which cooling water circulates.
[0006]
[Problems to be solved by the invention]
Since the seal 1c sandwiched between the flange of the upper structure 1a and the flange of the lower structure 1b of the reaction vessel 1 is made of rubber with an O-ring, it has only a heat resistance of about 200 ° C. at most. Therefore, as shown in the figure, a seal cooling jacket 12 is provided between a pair of upper and lower flanges to cool the seal 1c so that the temperature does not exceed 200 ° C. In addition, 12a is a cooling water introduction pipe, 12b is a cooling water discharge pipe.
[0007]
However, the cooling by the cooling jacket 12 has to improve heat transfer from the jacket 12 to the flange and the seal 1c, and thus the adhesion between the jacket 12 and the flange must be improved. Partially overheated and the seal 1c deteriorates. In addition, since the inside of the sealed container is set to a high pressure, the jacket 12 and the pipe 12a are provided with pressure resistance, which is expensive. Further, when a gas containing water vapor is introduced into the reaction vessel 1, a gap formed between the outer periphery of the bottom structure 1 b and the upper structure 1 a, and a portion inside the seal 1 c is cooled. For this reason, the water vapor in the reaction vessel 1 is condensed and drainage is accumulated, but once the drainage is accumulated, the gap is kept at a low temperature of 200 ° C. or less, and it is found that there is no need to introduce cold water into the jacket 12.
[0008]
The present invention has been devised in view of such problems of the prior art and based on the above knowledge, and provides a heating device that does not require the seal cooling jacket 12 and is excellent in the cooling performance of the seal 1c. With the goal.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, the heating device of the present invention includes a sealed bowl-shaped cylindrical shape that accommodates an object to be heated, a bottom that can be opened and a gas containing water vapor introduced thereinto, and the reaction container from above. A heating apparatus comprising a vertical cylindrical heater container that is open at the bottom to be covered and a vertical cylindrical container that accommodates these containers and that can be opened at the bottom, The reaction vessel has a cylindrical structure with the upper part sealed and the lower part open and has a flange projecting outward at the lower end, and a cylindrical structure with the upper part sealed and the lower part opened, and a flange projecting outward at the lower end. A lower structure inserted from below into the upper structure, and a seal sandwiched between the flange of the upper structure and the flange of the lower structure, and the outer periphery of the bottom structure And the superstructure The seal inside the gap formed between the inner periphery which are connected Note, the discharge pipe.
[0010]
It is preferable that a gas of 1 to 50 atm is enclosed in the reaction vessel and the sealed vessel.
[0011]
Next, the operation of the present invention will be described.
An object to be heated is accommodated in a reaction vessel, and water is poured into a gap inside the seal formed between the outer periphery of the bottom structure and the inner periphery of the upper structure before heating by the heater is started. Although the inside of the reaction vessel is heated up to the heating temperature by heating with the heater, the gap portion is not heated by the heater, and only heat transfer from the wall surface of the reaction vessel makes the amount of heat input to the injected portion small. While the reaction vessel is kept at the heating temperature, the water accumulated in this gap evaporates, so water is replenished. Water vapor is introduced as an oxidizing gas into the reaction vessel, and the partial pressure of water vapor is high, so that the amount of water accumulated in the gap is small. Since latent heat is taken away by evaporation, the temperature of water does not become higher than the saturation temperature corresponding to the water vapor partial pressure in the reaction vessel, and is kept below the heat resistant temperature of the seal. Further, since water is accumulated in the gap, it is possible to reduce the amount of water vapor introduced into the reaction vessel at the low temperature portion.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a cross-sectional view of the heating apparatus of the present invention. In this figure, parts common to those in FIG. 2 are denoted by the same reference numerals, and redundant description is omitted. The heating device of the present invention has a sealed bowl-shaped cylindrical shape that accommodates an object to be heated 5 therein, a reaction vessel 1 that can be opened at the bottom and introduced with a gas containing water vapor, and an enclosure that covers the reaction vessel 1 from above. A vertical cylindrical heater container 2 having an open bottom, and a pressure-resistant hermetic container 3 having a vertical cylindrical shape that accommodates these containers and having a bottom that can be opened. The reaction vessel 1 has an upper structure 1a having a cylindrical shape with an upper portion sealed in a dish shape and an open lower portion and a flange projecting outward at a lower end, and a cylindrical shape with an upper portion sealed in a dish shape and an open lower portion. A bottom structure 1b having a flange projecting outward at the lower end and having a height lower than that of the upper structure 1a and inserted into the upper structure from below; a flange of the upper structure 1a and a flange of the bottom structure 1b; A water supply pipe 13a and a drain pipe 13b are connected to a gap 15 inside the seal 1c formed between the outer periphery of the bottom structure 1b and the inner periphery of the upper structure 1a. It is. Reference numeral 14 denotes water accumulated in the gap 15, and reference numeral 16 denotes a heat dissipation lid. The heat dissipating cover 16 closes the hole 2b provided in the ceiling portion of the heater container 16, and is opened when the heating object 5 is naturally cooled to naturally cool the object 5 to be heated. It is provided to actively circulate and promote cooling of the object to be heated.
[0013]
Next, the operation of this embodiment will be described.
The object to be heated 5 is accommodated in the reaction vessel 1, and water is poured into a gap 15 inside the seal 1c formed between the outer periphery of the bottom structure 1b and the inner periphery of the upper structure 1a before heating by the heater 2a. Accumulate water 14. The inside of the reaction vessel 1 is heated up to a heating temperature of about 600 ° C. by heating with the heater 2a, but the gap 15 is not heated by the heater 2a, and only the heat transfer from the wall of the reaction vessel 1 is poured. The amount of heat input to the portion 14 is small. While the reaction vessel 1 is maintained at the heating temperature, the water 14 accumulated in the gap evaporates, so water is replenished through the water injection pipe 13a. Since water vapor is introduced into the reaction vessel 1 as an oxidizing gas and the water vapor partial pressure is high, the evaporation amount of the water 14 accumulated in the gap 15 is small. Since latent heat is removed by evaporation, the temperature of water does not become higher than the saturation temperature corresponding to the water vapor partial pressure in the reaction vessel, and is kept below the heat resistance temperature of the seal 1c. Further, since water is accumulated in the gap 15, the amount of water vapor introduced into the reaction vessel 1 in the low temperature portion can be reduced.
[0014]
The present invention is not limited to the embodiments described above, and various modifications can be made without departing from the scope of the invention.
[0015]
【The invention's effect】
As described above, the heating device of the present invention is poured into the gap formed between the outer periphery of the bottom structure of the reaction vessel and the inner periphery of the upper structure, connected to the drainage pipe, and during the heating of the reaction vessel, Since water is stored in the gap, the seal between the upper structure and the bottom structure of the reaction vessel is not overheated and deteriorated, and the reliability is improved. It has excellent effects such as being able to reduce the amount of condensation.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a heating apparatus according to the present invention.
FIG. 2 is a cross-sectional view of a conventional heating device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Reaction container 1a Top structure 1b Bottom structure 1c Seal 2 Heater container 3 Sealed container 5 Heated object 13a Water injection pipe 13b Drain pipe 15 Crevice

Claims (5)

内部に被加熱物を収容する密閉竪型円筒状で底部が開放可能で、水蒸気を含む気体が導入される反応容器と、該反応容器に所要の隙間を介して上から被せるように囲繞し、下方が解放された竪型円筒状のヒータ容器と、これらの容器を収容する竪型円筒状で底部が解放可能な耐圧密閉容器とを有してなる加熱装置であって、上記反応容器は、上部が上方に膨らんだ皿形の天井によって密閉され下部が解放された円筒状で、下端に外側に張り出したフランジを有する上部容器と、上部が上方に膨らんだ皿形の天井によって密閉され下部が解放された円筒状で下端に外側に張り出したフランジを有し、高さが上記上部容器より低く、上部容器内に下から挿入される底部容器と、上記上部容器のフランジと上記底部容器のフランジとに挟まれたシールとからなり、上記上部容器の下部と上記底部容器の下部との間から上記両フランジ間にかけて隙間を有していて、上記両フランジの外側寄りは上記シールによって密閉されていてそのシール内側の隙間に水を溜めることが可能になっており、その隙間に注水する注水配管と、その隙間の水を排水する排水配管が接続されていることを特徴とする加熱装置。A closed bowl-shaped cylinder that contains an object to be heated inside, the bottom of which can be opened, and a reaction vessel into which a gas containing water vapor is introduced, and surrounding the reaction vessel so as to be covered from above through a required gap , A heating apparatus having a vertical cylindrical heater container opened at the bottom, and a pressure-tight sealed container having a vertical cylindrical shape capable of releasing these bottoms, which accommodates these containers. upper cylindrical lower portion is closed has been released by the swollen ceiling dished upwardly, an upper container having a flange that projects outwardly at the lower end, top the bottom is sealed by a ceiling of swollen dished upward has a lower end at a released cylindrical flanges outwardly flared lower than the above upper container height, and a bottom container to be inserted from below into the upper container, the flange and the bottom vessel of the upper container flange Sea sandwiched between Consists of a, the subjected between both flanges have a gap, outboard gap of the seal inside have been sealed by the sealing of both flanges from between the lower portion of the lower and the bottom vessel of the upper chamber The heating apparatus is characterized in that water can be stored in the water supply pipe, and a water injection pipe for injecting water into the gap and a drain pipe for draining water in the gap are connected . 上記反応容器および密閉容器には、1〜50気圧の気体が封入されている請求項1記載の加熱装置。  The heating apparatus according to claim 1, wherein a gas of 1 to 50 atm is enclosed in the reaction container and the sealed container. 内部に被加熱物を収容し水蒸気を含む気体が導入される反応容器と、該反応容器に所要の隙間を介して上から被せるように囲繞し、下方が解放されたヒータ容器と、これの容器を収容する底部が解放可能な耐圧密閉容器を有してなる加熱装置において、上記反応容器は上部容器と、底部容器とからなり、それぞれ下端にフランジを有していて、底部容器は上部容器内に下から挿入されるようになっていて、上部容器のフランジと底部容器のフランジとの間に隙間を形成するようにシールを挟むとともに、底部容器の外周と上部容器の内周との間に上記両フランジ間の隙間と連通する隙間を形成し、装置をヒータにより加熱する前にその隙間に注水し、装置の加熱中には隙間に溜まった水の蒸発潜熱によってシールを冷却することを特徴とする加熱方法。A reaction vessel in which an object to be heated is accommodated and a gas containing water vapor is introduced, a heater vessel that surrounds the reaction vessel so as to be covered from above through a required gap, and a lower portion is opened, and the vessel In the heating apparatus having a pressure-tight airtight container that can release the bottom, the reaction container is composed of an upper container and a bottom container , each having a flange at the lower end, and the bottom container is in the upper container . It has adapted to be inserted from below into, with sandwiching the seal so as to form a gap between the flange of the flange and the bottom vessel of the upper container, between an inner periphery of the outer peripheral and upper container bottom container forming a gap communicating with the gap between the upper Symbol flanges, the device is water injection into the gap prior to heating by a heater, cooling the seal by the latent heat of evaporation of the water accumulated in the gap during heating apparatus Characterize Heat method. 装置が加熱温度に保たれている間に上記隙間から蒸発した水分を補給する請求項3記載の加熱方法。  The heating method according to claim 3, wherein moisture evaporated from the gap is replenished while the apparatus is maintained at a heating temperature. 上記反応容器および密閉容器の気体圧力を、1〜50気圧とする請求項3または請求項4記載の加熱方法。  The heating method according to claim 3 or 4, wherein a gas pressure in the reaction vessel and the sealed vessel is set to 1 to 50 atmospheres.
JP13235499A 1999-05-13 1999-05-13 Heating apparatus and heating method Expired - Fee Related JP3874152B2 (en)

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