JP3860826B2 - 圧電装置および圧電装置の製造方法 - Google Patents
圧電装置および圧電装置の製造方法 Download PDFInfo
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- JP3860826B2 JP3860826B2 JP2004324442A JP2004324442A JP3860826B2 JP 3860826 B2 JP3860826 B2 JP 3860826B2 JP 2004324442 A JP2004324442 A JP 2004324442A JP 2004324442 A JP2004324442 A JP 2004324442A JP 3860826 B2 JP3860826 B2 JP 3860826B2
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- sealing material
- oxide
- lid
- wiring layer
- piezoelectric element
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- 238000000034 method Methods 0.000 title description 6
- 238000004519 manufacturing process Methods 0.000 title description 4
- 239000003566 sealing material Substances 0.000 claims description 42
- 239000013078 crystal Substances 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 22
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000011521 glass Substances 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 229910000416 bismuth oxide Inorganic materials 0.000 claims description 8
- 229910052810 boron oxide Inorganic materials 0.000 claims description 8
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims description 8
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 8
- YAFKGUAJYKXPDI-UHFFFAOYSA-J lead tetrafluoride Chemical compound F[Pb](F)(F)F YAFKGUAJYKXPDI-UHFFFAOYSA-J 0.000 claims description 8
- 239000011787 zinc oxide Substances 0.000 claims description 8
- 229910000464 lead oxide Inorganic materials 0.000 claims description 7
- -1 lead titanate compound Chemical class 0.000 claims description 7
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000005304 joining Methods 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 claims 1
- 238000002844 melting Methods 0.000 description 10
- 230000008018 melting Effects 0.000 description 10
- 238000005219 brazing Methods 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 239000012777 electrically insulating material Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052863 mullite Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000010897 surface acoustic wave method Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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Description
1a・・・・・凹部
2・・・・・・蓋体
3・・・・・・容器
4・・・・・・水晶振動子
5・・・・・・接着剤
6・・・・・・メタライズ配線層
7・・・・・・封止材
Claims (4)
- 外部電気回路に電気的に接続されるメタライズ配線層が形成された絶縁基体と、
導電性樹脂から成る接着剤を介して前記メタライズ配線層に電気的に接続された電極を有し、前記絶縁基体に収容された圧電素子と、
前記絶縁基体に、酸化鉛30重量%乃至50重量%、フッ化鉛10重量%乃至20重量%、酸化ビスマス3重量%乃至13重量%、酸化ホウ素1重量%乃至5重量%および酸化亜鉛1重量%乃至5重量%を含むガラス成分にフィラーとしてのチタン酸鉛系化合物が25重量%乃至45重量%添加された封止材を介して接合された蓋体と、を備えた圧電装置。 - 前記絶縁基体がセラミックスからなることを特徴とする請求項1記載の圧電装置。
- 前記圧電素子が水晶振動子であることを特徴とする請求項1または請求項2記載の圧電装置。
- 外部電気回路に電気的に接続されるメタライズ配線層が形成された絶縁基体を準備する工程と、
前記メタライズ配線層上に導電性樹脂から成る接着剤を介して圧電素子を搭載し、前記接着剤に熱処理を施すことにより、前記圧電素子の電極を前記メタライズ配線層に電気的に接続する工程と、
前記絶縁基体に、酸化鉛30重量%乃至50重量%、フッ化鉛10重量%乃至20重量%、酸化ビスマス3重量%乃至13重量%、酸化ホウ素1重量%乃至5重量%および酸化亜鉛1重量%乃至5重量%を含むガラス成分にフィラーとしてのチタン酸鉛系化合物が25重量%乃至45重量%添加された封止材を介して蓋体を載置して、前記封止材を加熱させて前記絶縁基体と前記蓋体とを接合する工程と、を有する圧電装置の製造方法。
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JP2004324442A JP3860826B2 (ja) | 2004-11-08 | 2004-11-08 | 圧電装置および圧電装置の製造方法 |
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JP2004324442A JP3860826B2 (ja) | 2004-11-08 | 2004-11-08 | 圧電装置および圧電装置の製造方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP23651595A Division JP3631536B2 (ja) | 1995-09-14 | 1995-09-14 | 圧電素子収納用容器 |
Publications (2)
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JP2005072620A JP2005072620A (ja) | 2005-03-17 |
JP3860826B2 true JP3860826B2 (ja) | 2006-12-20 |
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JP2004324442A Expired - Fee Related JP3860826B2 (ja) | 2004-11-08 | 2004-11-08 | 圧電装置および圧電装置の製造方法 |
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Families Citing this family (1)
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KR101667934B1 (ko) * | 2015-07-08 | 2016-10-21 | 주식회사 베이스 | 레이저 감응용 유리 프릿을 이용한 수정 진동자 패키지 및 그 제조방법 |
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