JP3856634B2 - 基板保持装置及び該基板保持装置を備えたポリッシング装置 - Google Patents

基板保持装置及び該基板保持装置を備えたポリッシング装置 Download PDF

Info

Publication number
JP3856634B2
JP3856634B2 JP2000280216A JP2000280216A JP3856634B2 JP 3856634 B2 JP3856634 B2 JP 3856634B2 JP 2000280216 A JP2000280216 A JP 2000280216A JP 2000280216 A JP2000280216 A JP 2000280216A JP 3856634 B2 JP3856634 B2 JP 3856634B2
Authority
JP
Japan
Prior art keywords
polishing
substrate
top ring
elastic membrane
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000280216A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002096261A (ja
JP2002096261A5 (enrdf_load_stackoverflow
Inventor
芳宏 軍司
穂積 安田
計介 並木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2000280216A priority Critical patent/JP3856634B2/ja
Priority to EP01117745A priority patent/EP1177859B1/en
Priority to EP09005308A priority patent/EP2085181A1/en
Priority to DE60138343T priority patent/DE60138343D1/de
Priority to SG200804145-1A priority patent/SG157258A1/en
Priority to KR1020010046378A priority patent/KR100876381B1/ko
Priority to TW090118572A priority patent/TW516991B/zh
Priority to US09/917,732 priority patent/US6890402B2/en
Priority to SG200501205A priority patent/SG125152A1/en
Priority to SG200104611-9A priority patent/SG129989A1/en
Publication of JP2002096261A publication Critical patent/JP2002096261A/ja
Priority to US10/972,579 priority patent/US20050072527A1/en
Publication of JP2002096261A5 publication Critical patent/JP2002096261A5/ja
Application granted granted Critical
Publication of JP3856634B2 publication Critical patent/JP3856634B2/ja
Priority to US11/907,590 priority patent/US20080047667A1/en
Priority to US11/979,019 priority patent/US20080066862A1/en
Priority to US12/136,424 priority patent/US7897007B2/en
Priority to SG10201706765QA priority patent/SG10201706765QA/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2000280216A 2000-07-31 2000-09-14 基板保持装置及び該基板保持装置を備えたポリッシング装置 Expired - Lifetime JP3856634B2 (ja)

Priority Applications (15)

Application Number Priority Date Filing Date Title
JP2000280216A JP3856634B2 (ja) 2000-09-14 2000-09-14 基板保持装置及び該基板保持装置を備えたポリッシング装置
EP09005308A EP2085181A1 (en) 2000-07-31 2001-07-30 Substrate holding apparatus and substrate polishing apparatus
DE60138343T DE60138343D1 (de) 2000-07-31 2001-07-30 Substrathalter und Poliervorrichtung
EP01117745A EP1177859B1 (en) 2000-07-31 2001-07-30 Substrate holding apparatus and substrate polishing apparatus
SG200501205A SG125152A1 (en) 2000-07-31 2001-07-31 Substrate holding apparatus and substrate polishing apparatus
KR1020010046378A KR100876381B1 (ko) 2000-07-31 2001-07-31 기판 고정 장치 및 기판 폴리싱 장치
TW090118572A TW516991B (en) 2000-07-31 2001-07-31 Substrate holding apparatus and substrate polishing apparatus
US09/917,732 US6890402B2 (en) 2000-07-31 2001-07-31 Substrate holding apparatus and substrate polishing apparatus
SG200804145-1A SG157258A1 (en) 2000-07-31 2001-07-31 Substrate holding apparatus and substrate polishing apparatus
SG200104611-9A SG129989A1 (en) 2000-07-31 2001-07-31 Substrate holding apparatus and substrate polishing apparatus
US10/972,579 US20050072527A1 (en) 2000-07-31 2004-10-26 Substrate holding apparatus and substrate polishing apparatus
US11/907,590 US20080047667A1 (en) 2000-07-31 2007-10-15 Substrate holding apparatus and substrate polishing apparatus
US11/979,019 US20080066862A1 (en) 2000-07-31 2007-10-30 Substrate holding apparatus and substrate polishing apparatus
US12/136,424 US7897007B2 (en) 2000-07-31 2008-06-10 Substrate holding apparatus and substrate polishing apparatus
SG10201706765QA SG10201706765QA (en) 2000-07-31 2014-07-31 Substrate holding apparatus and substrate polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000280216A JP3856634B2 (ja) 2000-09-14 2000-09-14 基板保持装置及び該基板保持装置を備えたポリッシング装置

Publications (3)

Publication Number Publication Date
JP2002096261A JP2002096261A (ja) 2002-04-02
JP2002096261A5 JP2002096261A5 (enrdf_load_stackoverflow) 2004-12-24
JP3856634B2 true JP3856634B2 (ja) 2006-12-13

Family

ID=18765099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000280216A Expired - Lifetime JP3856634B2 (ja) 2000-07-31 2000-09-14 基板保持装置及び該基板保持装置を備えたポリッシング装置

Country Status (1)

Country Link
JP (1) JP3856634B2 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7357699B2 (en) 2003-02-10 2008-04-15 Ebara Corporation Substrate holding apparatus and polishing apparatus
JP5464820B2 (ja) 2007-10-29 2014-04-09 株式会社荏原製作所 研磨装置
US10702972B2 (en) 2012-05-31 2020-07-07 Ebara Corporation Polishing apparatus
JP5976522B2 (ja) 2012-05-31 2016-08-23 株式会社荏原製作所 研磨装置および研磨方法
KR102160111B1 (ko) * 2013-12-11 2020-09-25 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드용 멤브레인 및 이를 구비한 캐리어 헤드
JP7372107B2 (ja) * 2019-10-15 2023-10-31 株式会社岡本工作機械製作所 ウェーハ研磨用ヘッド
KR102783310B1 (ko) * 2019-11-19 2025-03-19 가부시키가이샤 에바라 세이사꾸쇼 기판을 보유 지지하기 위한 톱링 및 기판 처리 장치

Also Published As

Publication number Publication date
JP2002096261A (ja) 2002-04-02

Similar Documents

Publication Publication Date Title
KR100876381B1 (ko) 기판 고정 장치 및 기판 폴리싱 장치
KR101000420B1 (ko) 가압 시트
US7108592B2 (en) Substrate holding apparatus and polishing apparatus
US6143127A (en) Carrier head with a retaining ring for a chemical mechanical polishing system
JP4107835B2 (ja) 基板保持装置及びポリッシング装置
JP2002113653A (ja) 基板保持装置及び該基板保持装置を備えたポリッシング装置
TW520319B (en) Polishing head of chemical mechanical polishing apparatus and polishing method using the same
JP4353673B2 (ja) ポリッシング方法
JP3856634B2 (ja) 基板保持装置及び該基板保持装置を備えたポリッシング装置
JP2004193289A (ja) ポリッシング方法
JP4049579B2 (ja) 基板保持装置及びポリッシング装置
JP2008066761A (ja) 基板保持装置
JP2008188767A (ja) 基板保持装置
JP4620072B2 (ja) ポリッシング装置
JP3902715B2 (ja) ポリッシング装置
JP2003266301A (ja) ポリッシング装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040122

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040122

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060118

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060124

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060324

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060627

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060823

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20060912

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20060912

R150 Certificate of patent or registration of utility model

Ref document number: 3856634

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090922

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100922

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110922

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120922

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130922

Year of fee payment: 7

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term