JP3825844B2 - 精密研磨用組成物、Ａｌ合金基板上に成膜された無電解ＮｉＰメッキ膜の研磨方法、無電解ＮｉＰメッキ膜を有するＡｌ合金基板の製造方法 - Google Patents

精密研磨用組成物、Ａｌ合金基板上に成膜された無電解ＮｉＰメッキ膜の研磨方法、無電解ＮｉＰメッキ膜を有するＡｌ合金基板の製造方法 Download PDF

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Publication number
JP3825844B2
JP3825844B2 JP25053996A JP25053996A JP3825844B2 JP 3825844 B2 JP3825844 B2 JP 3825844B2 JP 25053996 A JP25053996 A JP 25053996A JP 25053996 A JP25053996 A JP 25053996A JP 3825844 B2 JP3825844 B2 JP 3825844B2
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JP
Japan
Prior art keywords
polishing
plating film
alloy substrate
alumina particles
nip plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP25053996A
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English (en)
Japanese (ja)
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JPH09286975A5 (enExample
JPH09286975A (ja
Inventor
健 石飛
文男 今井
高徳 貴堂
博 阪本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaguchi Seiken Kogyo Co Ltd
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Yamaguchi Seiken Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK, Yamaguchi Seiken Kogyo Co Ltd filed Critical Showa Denko KK
Priority to JP25053996A priority Critical patent/JP3825844B2/ja
Publication of JPH09286975A publication Critical patent/JPH09286975A/ja
Publication of JPH09286975A5 publication Critical patent/JPH09286975A5/ja
Application granted granted Critical
Publication of JP3825844B2 publication Critical patent/JP3825844B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
JP25053996A 1996-02-19 1996-09-20 精密研磨用組成物、Ａｌ合金基板上に成膜された無電解ＮｉＰメッキ膜の研磨方法、無電解ＮｉＰメッキ膜を有するＡｌ合金基板の製造方法 Expired - Fee Related JP3825844B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25053996A JP3825844B2 (ja) 1996-02-19 1996-09-20 精密研磨用組成物、Ａｌ合金基板上に成膜された無電解ＮｉＰメッキ膜の研磨方法、無電解ＮｉＰメッキ膜を有するＡｌ合金基板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8-53687 1996-02-19
JP5368796 1996-02-19
JP25053996A JP3825844B2 (ja) 1996-02-19 1996-09-20 精密研磨用組成物、Ａｌ合金基板上に成膜された無電解ＮｉＰメッキ膜の研磨方法、無電解ＮｉＰメッキ膜を有するＡｌ合金基板の製造方法

Publications (3)

Publication Number Publication Date
JPH09286975A JPH09286975A (ja) 1997-11-04
JPH09286975A5 JPH09286975A5 (enExample) 2004-10-07
JP3825844B2 true JP3825844B2 (ja) 2006-09-27

Family

ID=26394402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25053996A Expired - Fee Related JP3825844B2 (ja) 1996-02-19 1996-09-20 精密研磨用組成物、Ａｌ合金基板上に成膜された無電解ＮｉＰメッキ膜の研磨方法、無電解ＮｉＰメッキ膜を有するＡｌ合金基板の製造方法

Country Status (1)

Country Link
JP (1) JP3825844B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4114018B2 (ja) * 1996-11-14 2008-07-09 日産化学工業株式会社 アルミニウムディスクの研磨用組成物及びその研磨用組成物を用いる研磨方法
JPH11181403A (ja) * 1997-12-18 1999-07-06 Hitachi Chem Co Ltd 酸化セリウム研磨剤及び基板の研磨法
TWI268286B (en) 2000-04-28 2006-12-11 Kao Corp Roll-off reducing agent
JP2002151448A (ja) * 2000-11-13 2002-05-24 Hitachi Chem Co Ltd 酸化セリウム研磨剤用ｃｍｐパッド及び基板の研磨方法
JP5570685B2 (ja) * 2007-03-16 2014-08-13 花王株式会社 ハードディスク基板用研磨液組成物
JP5031446B2 (ja) * 2007-05-30 2012-09-19 花王株式会社 ハードディスク基板用研磨液組成物

Also Published As

Publication number Publication date
JPH09286975A (ja) 1997-11-04

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