JP3800876B2 - Manufacturing method of liquid crystal display device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a liquid crystal display device, and more particularly to a method for manufacturing a reflective liquid crystal display device in which a reflective layer is provided on one of a pair of substrates sandwiching a liquid crystal layer.
[0002]
[Prior art]
In a conventional reflective liquid crystal display device, a reflection plate for reflecting external light such as sunlight or illumination light is used as an outer surface (display) of a pair of substrates sandwiching a liquid crystal layer, a polarizing plate, and the like. It was externally attached to the surface opposite to the surface). However, in the case of this structure, there is a problem in visibility such as a large parallax and a double image. Therefore, a reflective layer built-in panel is proposed in which a reflective layer made of a highly reflective metal such as aluminum or a reflective layer that also serves as a pixel electrode (hereinafter referred to as a reflective electrode) is formed on one substrate of a liquid crystal panel. Already put into practical use. However, even in this reflective layer built-in panel, if a mirror-like reflective layer is simply provided, a so-called reflection phenomenon occurs in which the user's face or illumination is reflected on the display screen, and the visibility is poor. turn into. For this reason, measures are taken to prevent reflection by scattering light by forming irregularities on the surface of the reflective layer.
[0003]
FIG. 7 is a process cross-sectional view showing a manufacturing process of a substrate provided with a reflective layer having a conventional light scattering function.
[0004]
First, as shown in FIG. 7A, the organic insulating film 101 is formed on the substrate 100. Next, as shown in FIG. 7B, a photoresist 102 is applied on the organic insulating film 101. Next, as shown in FIG. 7C, exposure is performed with ultraviolet light using a photomask 103 having a fine pattern of about several tens of μm to expose the photoresist 102, and development is performed. A resist pattern 104 as shown in FIG. Next, as shown in FIG. 7E, the organic insulating film 101 is wet-etched using the resist pattern 104 as a mask. After the etching, the resist pattern 104 is peeled off, as shown in FIG. A convex portion 105 made of the patterned organic insulating film 101 is formed. Next, as shown in FIG. 7G, curved irregularities are formed by covering the entire surface with an overcoat film 106 made of a similar organic insulating film. Here, the convex portions 105 are covered with the overcoat film 106 to form curved irregularities. However, instead of this method, if the organic insulating film 101 has thermoplasticity, convex portions are formed. By applying heat treatment later, the corners of the convex portion 105 can be bent and rounded to form curved irregularities. Although illustration is omitted, finally, a reflective layer is formed by forming an aluminum film along the curved irregularities.
[0005]
When the substrate having the above configuration is used as the lower substrate of the liquid crystal panel, the light transmitted through the upper substrate and the liquid crystal layer is reflected by the surface of the reflective layer, but at this time, the surface of the reflective layer is uneven and reflected. Light is scattered and reflection on the display screen can be prevented.
[0006]
[Problems to be solved by the invention]
As described above, in the manufacturing process of the substrate provided with the reflective layer having the light scattering function, the convex portion of the organic insulating film is formed in order to provide the reflective layer surface with irregularities. At this time, a normal photolithography process such as resist coating, exposure, and development is required. Due to the presence of this photolithography process, problems such as an increase in the number of steps in the entire manufacturing process, an increase in the delivery time of the product, and an increase in manufacturing cost due to the use of a photomask have occurred.
[0007]
The present invention has been made in order to solve the above-described problem, and further simplifies the manufacturing process in a manufacturing method of a liquid crystal display device in which a substrate having a reflective layer having a light scattering function is used as one substrate. An object of the present invention is to provide a method of manufacturing a liquid crystal display device that can contribute to shortening the construction period and reducing manufacturing costs.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, a method of manufacturing a liquid crystal display device according to the present invention includes at least a pair of substrates arranged opposite to each other and a liquid crystal layer sandwiched between the substrates, and one of the pair of substrates. A method of manufacturing a liquid crystal display device in which a reflective layer is provided on a substrate, the step of forming a film for forming a convex portion on one substrate, and a number of resins from an inkjet head on the film for forming the convex portion The step of discharging the droplets, the step of solidifying the resin droplets, the step of etching the film for forming the convex portion using the solidified resin pieces as a mask, and removing the many resin pieces remaining after the etching And a step of leaving a convex portion made of a film for forming a convex portion, and a step of forming curved irregularities for scattering light on the upper surface of the substrate based on the convex portion. It is.
[0009]
In a manufacturing method of a liquid crystal display device, particularly a manufacturing method of a substrate on the side where a reflective layer is to be formed, a resist pattern is conventionally formed by using a photolithography technique that is very common in a semiconductor manufacturing process including resist coating, exposure, and development processes. Then, a convex portion for light scattering was formed based on this resist pattern. On the other hand, when the inventor ejects fine resin droplets onto the substrate using a head for an ink jet printer, a fine pattern (resin piece) having a size suitable for the light scattering convex portion is formed. I found what I could do. In other words, by discharging a fine resin droplet from the head for an ink jet printer and solidifying it, the development process in the conventional photolithography process is completed. Thereafter, in the same manner as in the conventional method, the convex portion forming film may be etched using the fine pattern as a mask. In other words, according to the method of the present invention, a photolithographic process is not required when forming the light scattering convex portion, so that problems such as a prolonged delivery date of the product and an increase in manufacturing cost associated with the photolithographic process are solved. Can do.
[0010]
The film thickness of the convex forming film is preferably in the range of 0.5 μm to 3 μm.
[0011]
The reason is that when the film thickness of the film for forming convex portions is less than 0.5 μm, the height of the convex portions to be formed is too low, the light scattering effect is lowered, and reflection cannot be prevented. On the other hand, if the film thickness exceeds 3 μm, the surface irregularities become too large and the cell gap varies, so that the optical characteristics (contrast, etc.) of the liquid crystal panel are lowered. The orientation of the twist domain, stripe domain, etc. This is because problems such as disturbance occur.
[0012]
An organic insulating film can be used as the material for the convex forming film. This organic insulating film is desirably thermoplastic. Specifically, an acrylic resin film can be used as the organic insulating film.
[0013]
The following two methods can be considered as a method of forming a convex / concave portion for light scattering based on the convex portion after forming the convex portion made of the convex portion forming film on the substrate. For example, when a film having thermoplasticity such as an acrylic resin is used as a material for a film for forming a convex part, the substrate on which the convex part made of the film for forming a convex part is formed is heat-treated. The convex portions can be bent and rounded to form curved irregularities.
[0014]
The other is to form curved irregularities by covering the entire surface of the substrate including the upper portion of the convex portion formed of the convex portion forming film with an overcoat film. In the case of the latter method, the material of the convex portion forming film is not limited to one having thermoplasticity. In this case, the thickness of the overcoat film needs to be in the range of 0.5 μm to 6 μm, and more preferably in the range of 1 to 1.5 times the film thickness of the film for forming the convex portion.
[0015]
The reason for this is that when the overcoat film thickness is less than 1 times the film thickness of the convex portion forming film, the corners of the convex portions are not sufficiently rounded, so that the light scattering effect is reduced. If it exceeds five times, the unevenness is excessively flattened, so that the light scattering effect is lowered and reflection cannot be prevented.
[0016]
Specifically, a photoresist can be used as the resin discharged from the inkjet head. In that case, it is desirable that the discharge amount of one droplet of the photoresist be in the range of 1 nano cc to 100 nano cc.
[0017]
This is because it is difficult to control the discharge amount of less than 1 nano cc with the current inkjet technology. Moreover, when the discharge amount exceeds 100 nano cc, the diameter of the unevenness becomes too large and the pattern is visually recognized. In terms of the diameter of the resist after ejection, it is preferably 30 μm or less.
[0018]
In addition, it is desirable to vary the discharge amount of each droplet of resin discharged from the inkjet head as close to random as possible. Similarly, it is desirable that the intervals between the resin droplets be varied as close to random as possible.
[0019]
The reason is that if the discharge amount of each droplet of resin, that is, the diameter of the discharged resin is constant or the interval between the droplets is constant, a moire pattern will occur when looking at the screen. This is because the visibility is lowered.
[0020]
With respect to the reflective layer, a metal film forming the reflective layer may be formed above the curved irregularities, or curved irregularities may be formed above the metal film forming the reflective layer.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
[First Embodiment]
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
[0022]
FIG. 1 is a cross-sectional view showing a configuration of a liquid crystal display device 1 manufactured by the method of the present embodiment. This embodiment is an example of a passive matrix STN (Super Twisted Nematic) type liquid crystal display device, and a liquid crystal panel. It has a well-known configuration including the portion 2, the optical compensation film 3, the polarizing plate 4, and the like.
[0023]
In the liquid crystal panel unit 2, for example, a first substrate 5 made of a glass substrate or the like and a second substrate 6 (a pair of substrates) are disposed to face each other, and a liquid crystal layer 7 is sandwiched therebetween. A plurality of reflective electrodes 8 (reflective layers) made of a highly reflective metal film such as an aluminum film are formed in parallel on a surface of the first substrate 5 facing the second substrate 6. . Curved irregularities are formed on the surface of the reflective electrode 8, and details of this portion will be described later in the description of the manufacturing method.
[0024]
On the other hand, on the surface of the second substrate 6 facing the first substrate 5, a light shielding film 9 made of, for example, a resin black resist is formed in a lattice shape, and R (red), between the light shielding films 9. A color filter layer 12 corresponding to the three primary colors G (green) and B (blue) is formed. An overcoat film 13 is formed so as to cover the color filter layer 12, and a plurality of counter electrodes 14 made of a transparent conductive film such as ITO (Indium Tin Oxide) are formed in parallel on the overcoat film 13. ing. The reflective electrode 8 on the first substrate 5 and the counter electrode 14 on the second substrate 6 are arranged so as to cross each other in a lattice shape. Therefore, the light is scattered at the same time as the external light is reflected on the surface of the reflective electrode 8.
[0025]
A range corresponding to the liquid crystal display region of the first substrate 5 and the second substrate 6 is covered with an alignment film (not shown) including portions on the reflective electrode 8 and the counter electrode 14. Further, a plurality of gap materials (not shown) having a predetermined diameter are dispersed and arranged between the first substrate 5 and the second substrate 6, so that the cell gap of the liquid crystal panel is, for example, 5 It is kept constant at 2 μm. In addition, a sealing material 16 is disposed at the edge of the opposing surface of the first substrate 5 and the second substrate 6, and between the first substrate 5 and the second substrate 6 sealed by the sealing material 16. The STN type liquid crystal having a twist angle of 240 ° is enclosed in the liquid crystal layer 7 to form the liquid crystal panel portion 2.
[0026]
Next, the manufacturing method of the 1st board | substrate provided with the reflective electrode which has a light-scattering function is demonstrated. FIG. 2 is a process sectional view showing the manufacturing process.
[0027]
First, as shown in FIG. 2A, a glass substrate to be the first substrate 5 is prepared, and an acrylic organic insulating film 17 (projection forming film) is formed on the substrate. At this time, the film thickness of the acrylic organic insulating film 17 is preferably about 0.5 μm to 3 μm. Next, as shown in FIG. 2B, a large number of droplets of photoresist 18 (resin) are ejected onto the acrylic organic insulating film 17 using the inkjet head 10.
[0028]
An example of the structure of the inkjet head 10 used here is shown in FIGS. As shown in FIG. 3, the inkjet head 10 includes a nozzle plate 11 made of, for example, stainless steel and a diaphragm 13, and both are joined via a partition member (reservoir plate) 15. A plurality of spaces 19 and a liquid reservoir 21 are formed by the partition member 15 between the nozzle plate 11 and the diaphragm 13. The interior of each space 19 and the liquid reservoir 21 is filled with a photoresist, and each space 19 and the liquid reservoir 21 communicate with each other via a supply port 23. Further, the nozzle plate 11 is provided with a nozzle hole 25 for injecting a photoresist from the space 19. On the other hand, a hole 27 for supplying a photoresist to the liquid reservoir 21 is formed in the vibration plate 13.
[0029]
As shown in FIG. 4, a piezoelectric element 29 is bonded to the surface of the diaphragm 13 opposite to the surface facing the space 19. The piezoelectric element 29 is located between the pair of electrodes 31 and bends so that when energized, the piezoelectric element 29 protrudes outward. At the same time, the diaphragm 13 to which the piezoelectric element 29 is bonded is also integrally formed outward. Bend. This increases the volume of the space 19. Therefore, the photoresist corresponding to the increased volume in the space 19 flows from the liquid reservoir 21 through the supply port 23. Next, when energization to the piezoelectric element 29 is released, both the piezoelectric element 29 and the diaphragm 13 return to their original shapes. As a result, the space 19 also returns to its original volume, so that the pressure of the photoresist inside the space 19 rises and the photoresist is ejected from the nozzle hole 25 toward the substrate.
[0030]
In the step of discharging the photoresist 18, by appropriately controlling the operation of the inkjet head 10, the discharge amount of one droplet of the photoresist 18 is set within the range of 1 nanocc to 100 nanocc. It is desirable. Further, it is desirable to vary the discharge amount of the droplets of the photoresist 18 in a state as close to random as possible. Similarly, it is desirable that the distance between the droplets of the photoresist 18 be varied as close to random as possible.
[0031]
FIG. 5 shows the relationship between the discharge amount of one droplet of photoresist and the diameter of the droplet. The photoresist used here is NN550 manufactured by JSR Corporation. When the discharge amount is 1 nano cc, the resist diameter is about 6 μm, and then the resist diameter increases as the discharge amount is increased. When the discharge amount is 100 nano cc, the resist diameter is about 28 μm. A substrate having a reflective layer formed by changing the resist diameter was actually produced and the light scattering effect was evaluated. If the resist diameter was 30 μm or less, the uneven pattern was not visually recognized, and a sufficient scattering effect was obtained. It turns out that it is obtained. Moreover, it is difficult to control the discharge amount to be 1 nano cc or less with the current inkjet technology. From this, it is understood that the discharge amount of one droplet of the photoresist is preferably in the range of 1 nanocc to 100 nanocc.
[0032]
Next, the photoresist 18 is baked under conditions of a temperature of 120 ° C. and a time of 10 minutes. By this baking, the solvent in the photoresist 18 is volatilized, and the photoresist 18 is cured to increase resistance to the next etching. The firing temperature may be in the range of about 60 ° C to 140 ° C. Next, as shown in FIG. 2C, wet etching of the acrylic organic insulating film 17 is performed using the photoresist 18 as a mask.
[0033]
Next, as shown in FIG. 2D, when the photoresist 18 is peeled off, only the convex portion 20 made of the acrylic organic insulating film 17 remains on the first substrate 5. Next, the 1st board | substrate 5 with which the convex part 20 was formed is baked for 2 hours at the temperature of 200 degreeC. The convex part 20 before firing has an angular shape as shown in FIG. 2 (d). However, since the acrylic organic insulating film 17 has thermoplasticity, the corner is bent and rounded by this firing. Thus, the convex portion 20 has a shape as shown in FIG. The firing temperature may be in the range of about 150 ° C. to 200 ° C., and the firing time may be 30 minutes or longer. Next, as shown in FIG. 2 (f), an aluminum film 22 serving as a reflective electrode forming film is formed on the entire surface of the substrate so as to cover the convex portion 20 ', and the reflective electrode 8 is formed by patterning this film. To do. Finally, one substrate is completed by forming an alignment film (not shown).
[0034]
Note that the manufacturing method of the second substrate 6, that is, steps such as color filter formation, counter electrode formation, alignment film formation, and the like are not different from the conventional methods, and thus description thereof is omitted.
[0035]
According to the manufacturing method of the liquid crystal display device 1 of the present embodiment, a resist pattern for forming convex portions can be formed by discharging droplets of the photoresist 18 using the head 10 for an inkjet printer. Since the used photolithography process is not necessary, problems such as a prolonged delivery date of the product and an increase in manufacturing cost associated with the photolithography process can be solved. Further, by optimizing the manufacturing conditions such as the film thickness of the acrylic organic insulating film 17, the discharge amount of the photoresist 18 from the inkjet head 10, and the discharge interval, a sufficient light scattering effect is obtained and the reflection is ensured. In addition, it is possible to realize a reflection type liquid crystal display device that does not cause a problem of visibility such as a decrease in contrast, disorder of alignment, and moire pattern.
[0036]
[Second Embodiment]
The second embodiment of the present invention will be described below with reference to FIG.
[0037]
The configuration of the liquid crystal display device of this embodiment is the same as that of the first embodiment, and this embodiment is different from the first embodiment only in the method for manufacturing the first substrate. Therefore, the description of the configuration of the liquid crystal display device is omitted below, and only the method for manufacturing the first substrate will be described. FIG. 6 is a process cross-sectional view showing the manufacturing process of the first substrate, and the same components as those in FIG.
[0038]
First, as shown in FIG. 6A, a first acrylic organic insulating film 17 (projection forming film) having a film thickness of about 0.5 μm to 3 μm is formed on the first substrate 5. Next, as shown in FIG. 6B, droplets of photoresist 18 (resin) are ejected onto the first acrylic organic insulating film 17 using the inkjet head 10. At this time, the discharge amount of one droplet of the photoresist 18 is set within the range of 1 nano cc to 100 nano cc, the discharge amount of the photoresist 18 is varied, and the droplet interval is also varied. Is desirable. Next, after baking the photoresist 18, as shown in FIG. 6C, the first acrylic organic insulating film 17 is wet-etched using the photoresist 18 as a mask. Next, as shown in FIG. 6D, when the photoresist 18 is peeled off, only the convex portion 20 made of the first acrylic organic insulating film 17 remains on the first substrate 5. The above steps are the same as those in the first embodiment.
[0039]
Next, as shown in FIG. 6E, a second acrylic organic insulating film 24 (overcoat) is formed on the entire surface of the first substrate 5 so as to cover the convex portion 20 made of the first acrylic organic insulating film 17. Film). The film thickness of the second acrylic organic insulating film 24 needs to be in the range of 0.5 μm to 6 μm in order to obtain a sufficient light scattering effect, and further the film thickness of the first acrylic organic insulating film 17. It is desirable to set it in the range of 1 to 1.5 times. Since the second acrylic organic insulating film 24 is formed on the convex portion 20 made of the first acrylic organic insulating film 17, curved irregularities are formed on the surface of the second acrylic organic insulating film 24. It becomes a state. Next, as shown in FIG. 6 (f), an aluminum film 22 serving as a reflective electrode forming film is formed on the second acrylic organic insulating film 24, and the reflective electrode 8 is formed by patterning this film. To do. Finally, the first substrate 5 is completed by forming an alignment film (not shown).
[0040]
That is, the method of rounding the corners of the convex portions 20 is different between the present embodiment and the first embodiment, and the first embodiment employs a method of tilting the corners of the convex portions 20 using heat treatment. On the other hand, in the present embodiment, a method of covering the convex portion 20 with another layer of film is adopted. Also in the present embodiment, reflection is ensured by optimizing the film thickness of the first acrylic organic insulating film 17 and the film thickness of the second acrylic organic insulating film 24 in addition to the ink jet conditions. The same effect as that of the first embodiment can be obtained that a reflective liquid crystal display device that is prevented and has excellent visibility can be obtained.
[0041]
The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in the above-described embodiment, an acrylic organic insulating film is used as the film for forming the protrusions. However, the present invention is not limited to this, and a polyimide organic insulating film can also be used. In addition, an example was given in which a reflective electrode was formed on an acrylic organic insulating film and irregularities were formed on the surface of the reflective electrode. Conversely, an acrylic organic insulating film was formed on a flat reflective electrode. The structure which forms an unevenness | corrugation may be sufficient. Even in this case, light is scattered by unevenness on the surface of the acrylic organic insulating film, and the same effect can be obtained. Further, in the second embodiment, since the structure in which the convex portion made of the acrylic organic insulating film is overcoated with the acrylic organic insulating film of the same material is adopted, naturally the conformity between the films is good and preferable. The film for forming the portion and the film for overcoat do not necessarily need to be the same material.
[0042]
In addition, the specific conditions and the like in the manufacturing process described in the above embodiment are merely examples, and it is needless to say that changes can be made as appropriate. Furthermore, the manufacturing method of the present invention can be applied not only to STN type liquid crystal display devices but also to TFD (Thin Film Diode) type liquid crystal display devices, TFT (Thin Film Transistor) type liquid crystal display devices, and the like.
[0043]
【The invention's effect】
As described above in detail, according to the present invention, it is possible to obtain a reflective liquid crystal display device with excellent visibility that does not cause reflection, and a photolithography process is not required when forming a light scattering convex portion. Therefore, the manufacturing process can be simplified, and the delivery time of the product can be shortened and the manufacturing cost can be reduced.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a configuration of a liquid crystal display device obtained by a manufacturing method according to an embodiment of the present invention.
FIG. 2 is a process cross-sectional view illustrating the manufacturing method according to the first embodiment of the present invention.
FIG. 3 is a perspective view illustrating a configuration example of an inkjet head used in the present method.
4 is a cross-sectional view of a nozzle portion of the inkjet head shown in FIG.
FIG. 5 is a graph showing the relationship between the amount of photoresist discharged and the resist diameter when an inkjet head is used.
FIG. 6 is a process cross-sectional view illustrating the manufacturing method according to the second embodiment of the present invention.
FIG. 7 is a process cross-sectional view illustrating an example of a method for manufacturing a liquid crystal display device of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Liquid crystal display device 5 1st board | substrate 6 2nd board | substrate 7 Liquid crystal layer 8 Reflective electrode (reflective layer)
10 Ink-jet head 17 (first) acrylic organic insulating film (projection forming film)
18 Photoresist (resin)
20, 20 ′ convex portion 22 aluminum film (metal film)
24 Second acrylic organic insulating film (overcoat film)

Claims (11)

A method of manufacturing a liquid crystal display device comprising at least a pair of substrates disposed opposite to each other and a liquid crystal layer sandwiched between the substrates, wherein a reflective layer is provided on one of the pair of substrates,
Forming a film for forming convex portions on the one substrate;
Discharging a large number of resin droplets from the inkjet head onto the convex-forming film;
Baking and solidifying the resin droplets; and
Etching the projection forming film using a number of resin pieces after solidification as a mask;
Removing a large number of resin pieces remaining after etching to leave the convex portions made of the convex portion forming film; and
Forming curved irregularities for scattering light on the upper surface of the substrate based on the projections;
Forming a metal film that forms the reflective layer above the curved irregularities,
The discharge amount of one droplet is in the range of 1 nano cc to 100 nano cc so that the discharge amount of each droplet can be varied and the interval between the droplets discharged on the substrate can be varied. A method for manufacturing a liquid crystal display device. A method of manufacturing a liquid crystal display device comprising at least a pair of substrates disposed opposite to each other and a liquid crystal layer sandwiched between the substrates, wherein a reflective layer is provided on one of the pair of substrates,
Forming a metal film forming the reflective layer on the one substrate;
Forming a film for forming convex portions on the metal film;
Discharging a large number of resin droplets from the inkjet head onto the convex-forming film;
Baking and solidifying the resin droplets; and
Etching the projection forming film using a number of resin pieces after solidification as a mask;
Removing a large number of resin pieces remaining after etching to leave the convex portions made of the convex portion forming film; and
Forming curved irregularities for scattering light on the upper surface of the substrate based on the projections, and
The discharge amount of one droplet is in the range of 1 nano cc to 100 nano cc so that the discharge amount of each droplet can be varied and the interval between the droplets discharged on the substrate can be varied. A method for manufacturing a liquid crystal display device.   3. The method of manufacturing a liquid crystal display device according to claim 1, wherein a film thickness of the convex portion forming film is in a range of 0.5 μm to 3 μm.   The method for manufacturing a liquid crystal display device according to claim 1, wherein an organic insulating film is used as the projection forming film.   The method of manufacturing a liquid crystal display device according to claim 4, wherein the organic insulating film has thermoplasticity.   6. The method for manufacturing a liquid crystal display device according to claim 5, wherein an acrylic resin film is used as the organic insulating film.   The curved surface unevenness is formed by deflecting a corner of the convex portion by heat-treating a substrate on which the convex portion formed of the convex portion forming film is formed. A method for manufacturing a liquid crystal display device.   8. The curved irregularities are formed by covering an entire surface of the substrate including an upper portion of the convex portion formed of the convex portion forming film with an overcoat film. The manufacturing method of the liquid crystal display device of description.   9. The method of manufacturing a liquid crystal display device according to claim 8, wherein the overcoat film has a thickness in a range of 0.5 to 6 [mu] m.   10. The method for manufacturing a liquid crystal display device according to claim 9, wherein the film thickness of the overcoat film is in the range of 1 to 1.5 times the film thickness of the projection forming film.   The method for manufacturing a liquid crystal display device according to claim 1, wherein a photoresist is used as the resin discharged from the inkjet head.

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