JP2001051269A - Production of liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To further simplify a production process when a substrate with a reflecting layer having light scattering functions is used as one of substrates. SOLUTION: An acrylic organic insulating film 17 is formed on a substrate 5 as the 1st one of a pair of substrates constituting a liquid crystal display device, and drops of a photoresist 18 are discharged from an ink jet head 10 on the acrylic organic insulating film 17 to form a pattern of the photoresist 18. The acrylic organic insulating film 17 is etched using the pattern as a mask, the photoresist 18 is removed, and protrusions 20 comprising the acrylic organic insulating film 17 are left on the substrate 5. Corners of the protrusions 20 are rounded off by heat treatment, and a reflecting electrode is formed on the protrusions 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a liquid crystal display device, and more particularly to a method of manufacturing a reflection type liquid crystal display device in which a reflection layer is provided on one of a pair of substrates sandwiching a liquid crystal layer. It is.

[0002]

2. Description of the Related Art In a conventional reflection type liquid crystal display device,
A reflector for reflecting external light such as sunlight or illumination light is externally attached to the outer surface of the liquid crystal panel (the surface opposite to the display surface) including a pair of substrates sandwiching the liquid crystal layer, a polarizing plate, and the like. Was. However, in the case of this structure, there is a problem in visibility such that a parallax becomes large and an image is reflected twice. Therefore, a reflective layer built-in panel in which a reflective layer made of a metal having high reflectivity such as aluminum or a reflective layer also serving as a pixel electrode (hereinafter, referred to as a reflective electrode) is formed on one substrate of a liquid crystal panel has been proposed. It has already been put to practical use. However, even in this reflective layer built-in panel, simply providing a mirror-like reflective layer causes a phenomenon called so-called glare, in which a user's face or illumination is reflected on a display screen, resulting in poor visibility. turn into. For this reason, measures have been taken to prevent uneven reflection by scattering light by forming irregularities on the surface of the reflective layer.

FIG. 7 is a process sectional view showing a conventional manufacturing process of a substrate provided with a reflective layer having a light scattering function.

[0004] First, as shown in FIG.
An organic insulating film 101 is formed thereon. Next, FIG.
As shown in (1), a photoresist 102 is applied on the organic insulating film 101. Next, as shown in FIG. 7C, a photomask 10 having a fine pattern of about several tens μm is formed.
Exposure to ultraviolet light is carried out using
02 is exposed and developed to form a resist pattern 104 as shown in FIG. 7D. Next, as shown in FIG. 7E, the organic insulating film 101 is wet-etched using the resist pattern 104 as a mask, and after the etching, the resist pattern 104 is peeled off. As shown in FIG. The projection 105 made of the patterned organic insulating film 101 is formed. Next, as shown in FIG. 7 (g), the entire surface is covered with an overcoat film 106 made of a similar organic insulating film, so that curved unevenness is formed. Here, the convex portions 105 are covered with the overcoat film 106 to form curved unevenness. However, instead of this method, the organic insulating film 101 is used.
Is a thermoplastic, if subjected to a heat treatment after the formation of the convex portion, the corner of the convex portion 105 is rounded,
Curved unevenness can also be formed. Although not shown, a reflective layer is formed by finally forming an aluminum film along the curved unevenness.

When the substrate having the above structure is used as a lower substrate of a liquid crystal panel, light transmitted through the upper substrate and the liquid crystal layer is reflected on the surface of the reflective layer. At this time, the surface of the reflective layer has irregularities. Therefore, reflected light is scattered, and reflection on the display screen can be prevented.

[0006]

As described above, in the manufacturing process of the substrate provided with the reflection layer having the light scattering function, the projections of the organic insulating film are formed in order to provide the surface of the reflection layer with irregularities. In order to form the projections, ordinary photolithography steps such as resist application, exposure, and development were required. Due to the presence of this photolithography step, the number of steps in the entire manufacturing process increases,
Problems such as a long delivery time of the product and an increase in manufacturing cost due to the use of a photomask have occurred.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and is directed to a method of manufacturing a liquid crystal display device in which a substrate having a reflective layer having a light scattering function is used as one substrate. An object of the present invention is to provide a method for manufacturing a liquid crystal display device, which can be further simplified and contributes to shortening of a construction period, reduction of a manufacturing cost, and the like.

[0008]

In order to achieve the above-mentioned object, a method of manufacturing a liquid crystal display device according to the present invention comprises at least a pair of substrates opposed to each other and a liquid crystal layer sandwiched between these substrates. A method for manufacturing a liquid crystal display device in which a reflective layer is provided on one of a pair of substrates, comprising: forming a film for forming a convex portion on one of the substrates; A step of ejecting a large number of resin droplets from an ink-jet head, a step of solidifying the resin droplets, a step of etching the projection-forming film using a large number of solidified resin pieces as a mask, and an etching step. A step of removing a large number of resin pieces left behind to leave a convex portion made of a film for forming a convex portion, and a step of forming curved unevenness for scattering light on the upper surface of the substrate based on the convex portion. And characterized by having .

In a method of manufacturing a liquid crystal display device, in particular, a method of manufacturing a substrate on which a reflective layer is to be formed, a photolithography technique generally used in a semiconductor manufacturing process including a resist coating, exposure, developing step and the like is conventionally used. A resist pattern was formed, and a light scattering projection was formed based on the resist pattern. In contrast, the present inventor
It has been found that when a fine resin droplet is ejected onto a substrate using an ink jet printer head, a fine pattern (resin piece) having a size suitable for the light scattering projection can be formed. That is, a state in which the developing process in the conventional photolithography process is completed only by discharging fine resin droplets from the ink jet printer head and solidifying the droplets. Thereafter, in the same manner as in the conventional method, the film for forming a convex portion may be etched using the fine pattern as a mask. In other words, according to the method of the present invention, a photolithography step is not required when forming the light scattering projections, so that problems such as a prolonged delivery time of a product and a rise in manufacturing costs accompanying the photolithography step can be solved. Can be.

The thickness of the film for forming the convex portion is 0.5 μm.
It is desirable that the thickness be in the range of m to 3 μm.

The reason is that the film thickness of the projection-forming film is 0.5
If it is less than μm, the height of the formed convex portion is too low, and the light scattering effect is reduced, and reflection cannot be prevented. Conversely, if the film thickness exceeds 3 μm, the unevenness of the surface becomes too large and the cell gap varies, so that the optical characteristics (contrast and the like) of the liquid crystal panel are reduced, and the orientation of the rotwist domain, stripe domain, etc. This is because there is a problem that disturbance occurs.

An organic insulating film can be used as a material of the film for forming the projections. This organic insulating film desirably has thermoplasticity. Specifically, an acrylic resin film can be used as the organic insulating film.

After forming a projection made of a projection-forming film on a substrate, the following two methods are conceivable as a method for forming curved unevenness for light scattering based on the projection. One is that, when a film having thermoplasticity such as an acrylic resin is used as a material of a film for forming a convex portion, a substrate having a convex portion formed of the film for forming a convex portion is subjected to a heat treatment. In addition, the corners of the convex portion may be rounded to form curved surface irregularities.

In the other, curved surfaces can be formed by covering the entire surface of the substrate including the upper part of the projections formed of the projection forming film with an overcoat film. In the latter method, the material of the projection-forming film is not limited to a thermoplastic material. In this case, the thickness of the overcoat film needs to be in the range of 0.5 μm to 6 μm.
Further, it is desirable that the thickness be in the range of 1 to 1.5 times the film thickness of the projection forming film.

The reason is that, when the thickness of the overcoat film is less than one time the thickness of the film for forming the convex portions, the corners of the convex portions are not sufficiently rounded, so that the light scattering effect is reduced. If the ratio is more than 1.5 times, the unevenness is excessively flattened, and the light scattering effect is reduced.

As the resin discharged from the inkjet head, specifically, a photoresist can be used. In that case, it is desirable that the discharge amount of one droplet of the photoresist be in the range of 1 nanocc to 100 nanocc.

The reason is that it is difficult to control the discharge amount of less than 1 nano cc with the current inkjet technology.
On the other hand, if the ejection amount exceeds 100 nanocc, the diameter of the unevenness becomes too large, and the pattern is visually recognized. In terms of the diameter of the resist after ejection, it is desirable that the diameter be 30 μm or less.

Further, it is desirable that the ejection amount of each droplet of resin ejected from the ink jet head be varied in a state as nearly random as possible. Similarly, it is desirable that the distance between the resin droplets is also varied in a state that is as random as possible.

The reason is that when the discharge amount of each resin droplet, that is, the diameter of the discharged resin is constant or the interval between the droplets is constant, a moire pattern is generated when the screen is viewed. This is because the visibility is reduced.

Regarding the reflective layer, a metal film forming a reflective layer may be formed above the curved unevenness, or a curved unevenness may be formed above the metal film forming the reflective layer.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] A first embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is a sectional view showing the structure of a liquid crystal display device 1 manufactured by the method of the present embodiment. In this embodiment, a passive matrix STN (Super Twisted Nematic) is used.
matic) type liquid crystal display device.
It has a known configuration including an optical compensation film 3, a polarizing plate 4, and the like.

In the liquid crystal panel section 2, a first substrate 5 and a second substrate 6 (a pair of substrates) made of, for example, a glass substrate are arranged to face each other, and a liquid crystal layer 7 is sandwiched therebetween. On a facing surface of the first substrate 5 facing the second substrate 6, a reflective electrode 8 made of a metal film having a high reflectivity such as an aluminum film.
A plurality of (reflection layers) are formed in parallel in a straight line. Curved unevenness is formed on the surface of the reflective electrode 8, and details of this portion will be described later in the description of the manufacturing method.

On the other hand, a light-shielding film 9 made of, for example, a resin black resist or the like is formed in a grid pattern on a surface of the second substrate 6 facing the first substrate 5.
Color filter layers 12 corresponding to the three primary colors (red), G (green), and B (blue) are formed. An overcoat film 13 is formed so as to cover the color filter layer 12,
On the overcoat film 13, ITO (Indium Tin Oxi
A plurality of opposing electrodes 14 made of a transparent conductive film such as de) are formed in parallel in a straight line. The reflective electrode 8 on the first substrate 5 and the opposing electrode 14 on the second substrate 6 are arranged so as to intersect each other and form a grid. Therefore, light is scattered at the same time as external light is reflected on the surface of the reflective electrode 8.

The area corresponding to the liquid crystal display area of the first substrate 5 and the second substrate 6 is covered with an alignment film (not shown) including the portions on the reflective electrode 8 and the counter electrode 14. . Further, between the first substrate 5 and the second substrate 6,
A plurality of gap members (not shown) having a predetermined diameter are dispersedly arranged, so that the cell gap of the liquid crystal panel is kept constant at, for example, 5.2 μm. In addition, a sealing material 16 is disposed at an edge of the opposing surface of the first substrate 5 and the second substrate 6, and the space between the first substrate 5 and the second substrate 6 sealed by the sealing material 16 is provided. S with 240 ° twist angle
The liquid crystal layer 7 is formed by enclosing the TN type liquid crystal, and the liquid crystal panel unit 2 is configured.

Next, a method for manufacturing the first substrate provided with the reflective electrode having a light scattering function will be described. FIG. 2 is a process sectional view showing the manufacturing process.

First, as shown in FIG. 2A, a glass substrate serving as the first substrate 5 is prepared, and an acrylic organic insulating film 17 (a film for forming a convex portion) is formed on the glass substrate. At this time,
The thickness of the acrylic organic insulating film 17 is 0.5 μm to 3 μm.
It is preferable to set the degree. Next, as shown in FIG. 2B, a large number of droplets of a photoresist 18 (resin) are discharged onto the acrylic organic insulating film 17 using the inkjet head 10.

The ink jet head 10 used here
3 and 4 show an example of the structure of FIG. As shown in FIG. 3, the inkjet head 10 includes a nozzle plate 11 made of, for example, stainless steel and a vibration plate 13, and both are joined via a partition member (reservoir plate) 15. Between the nozzle plate 11 and the vibration plate 13, a plurality of spaces 19 and the liquid pool 2 are separated by a partition member 15.
1 are formed. Each space 19 and the inside of the liquid pool 21 are filled with a photoresist, and each space 19 and the liquid pool 21 communicate with each other through a supply port 23. Further, the nozzle plate 11 is provided with a nozzle hole 25 for jetting a photoresist from the space 19.
On the other hand, a hole 27 for supplying a photoresist to the liquid reservoir 21 is formed in the vibration plate 13.

As shown in FIG. 4, a piezoelectric element 29 is joined to the surface of the diaphragm 13 opposite to the surface facing the space 19. The piezoelectric element 29 is located between the pair of electrodes 31, and when energized, the piezoelectric element 29 bends so as to protrude outward, and at the same time, the diaphragm 13 to which the piezoelectric element 29 is joined is also integrated and outward. Bend. This increases the volume of the space 19. Therefore, the photoresist corresponding to the increased volume in the space 19 is accumulated in the liquid pool 2.
1 flows through the supply port 23. Next, the piezoelectric element 2
When the energization to 9 is released, both the piezoelectric element 29 and the diaphragm 13 return to their original shapes. As a result, the space 19 also returns to the original volume, so that the pressure of the photoresist inside the space 19 increases, and the photoresist is ejected from the nozzle holes 25 toward the substrate.

In the step of discharging the photoresist 18, by appropriately controlling the operation of the ink jet head 10, the discharge amount of one droplet of the photoresist 18 is set within a range of 1 nano cc to 100 nano cc. It is desirable to set to. Further, it is desirable that the ejection amount of the droplets of the photoresist 18 be varied in a state as random as possible. Similarly, it is desirable that the intervals between the droplets of the photoresist 18 be varied in a state that is as random as possible.

FIG. 5 shows the relationship between the discharge amount of one droplet of photoresist and the diameter of the droplet. The photoresist used here is NN550 manufactured by JSR Corporation.
When the discharge amount is 1 nano cc, the resist diameter becomes about 6 μm. Thereafter, as the discharge amount is increased, the resist diameter increases, and when the discharge amount is 100 nano cc, the resist diameter becomes about 28 μm. When a substrate on which a reflective layer was formed by changing the resist diameter was actually manufactured and the light scattering effect was evaluated, if the resist diameter was 30 μm or less, the pattern of irregularities was not visually recognized, and a sufficient scattering effect was obtained. It turned out to be obtained. In addition, it is difficult to control the discharge amount to 1 nano cc or less with the current inkjet technology. From this, the ejection amount of one photoresist droplet is 1 nano c
It can be seen that it is preferable to be in the range of c to 100 nanocc.

Next, the photoresist 18 is baked under the conditions of a temperature of 120 ° C. and a time of 10 minutes. The solvent in the photoresist 18 volatilizes by this baking, and the photoresist 1
8 hardens, and the resistance to the next etching increases.
The firing temperature may be in the range of about 60C to 140C. next,
As shown in FIG. 2C, the acrylic organic insulating film 17 is wet-etched using the photoresist 18 as a mask.

Next, as shown in FIG. 2D, when the photoresist 18 is peeled off, only the projections 20 made of the acrylic organic insulating film 17 remain on the first substrate 5. Next, the first substrate 5 on which the convex portions 20 are formed is heated to a temperature of 200 ° C.
For 2 hours. The protrusions 20 before firing have an angular shape as shown in FIG. 2D, but since the acrylic organic insulating film 17 has thermoplasticity, the firing causes the corners to be rounded and rounded. Thus, the convex portion 20 has a shape as shown in FIG. Firing temperature is 1
The temperature may be in the range of about 50 ° C to 200 ° C, and the firing time may be 30 minutes or more. Next, as shown in FIG. 2F, an aluminum film 22 serving as a reflective electrode forming film is formed on the entire surface of the substrate so as to cover the protrusions 20 ′, and the reflective electrode 8 is formed by patterning the aluminum film 22. I do. Finally, an alignment film (not shown) is formed to complete one of the substrates.

The method of manufacturing the second substrate 6, that is, the steps of forming a color filter, forming a counter electrode, forming an alignment film, and the like are not different from those of the conventional method, and a description thereof will be omitted.

According to the manufacturing method of the liquid crystal display device 1 of the present embodiment, the resist pattern for forming the convex portion can be formed by discharging the droplets of the photoresist 18 using the ink jet printer head 10. This eliminates the need for the conventional photolithography process, so that problems such as a longer product delivery time and a higher production cost due to the photolithography process can be solved. In addition, by optimizing the manufacturing conditions such as the thickness of the acrylic organic insulating film 17, the discharge amount of the photoresist 18 from the inkjet head 10, the discharge interval, and the like,
It is possible to realize a reflective liquid crystal display device in which a sufficient light scattering effect is obtained to reliably prevent glare, and which does not cause a problem in visibility such as a decrease in contrast, alignment disorder, and moire pattern. .

[Second Embodiment] Hereinafter, a second embodiment of the present invention will be described.
The embodiment will be described with reference to FIG.

The structure of the liquid crystal display of this embodiment is the first
This embodiment is the same as the first embodiment, and the present embodiment is different from the first embodiment only in the method of manufacturing the first substrate. Therefore, the description of the configuration of the liquid crystal display device will be omitted below, and only the method of manufacturing the first substrate will be described.
FIG. 6 is a process sectional view showing the manufacturing process of the first substrate, and the same components as those in FIG. 2 are denoted by the same reference numerals.

First, as shown in FIG. 6A, a first acrylic organic insulating film 17 (film for forming convex portions) having a film thickness of about 0.5 μm to 3 μm is formed on the first substrate 5. . Next, as shown in FIG. 6B, droplets of a photoresist 18 (resin) are discharged onto the first acrylic-based organic insulating film 17 using the inkjet head 10. At this time, the discharge amount of one droplet of the photoresist 18 is set in the range of 1 nano cc to 100 nano cc, and the discharge amount of the photoresist 18 is further varied, and the droplet interval is also varied. Is desirable. Next, after baking the photoresist 18, as shown in FIG.
Is used as a mask to perform wet etching of the first acrylic organic insulating film 17. Next, as shown in FIG. 6D, when the photoresist 18 is peeled off, only the protrusions 20 made of the first acrylic organic insulating film 17 remain on the first substrate 5. The above steps are the same as in the first embodiment.

Next, as shown in FIG. 6E, a second acrylic organic insulating film 24 is formed on the entire surface of the first substrate 5 so as to cover the projections 20 made of the first acrylic organic insulating film 17.
(Overcoat film) is formed. The thickness of the second acrylic organic insulating film 24 needs to be in the range of 0.5 μm to 6 μm in order to obtain a sufficient light scattering effect, and further, the thickness of the first acrylic organic insulating film 17 1 time to 1.5
It is desirable to make the range twice as large. Since the second acrylic organic insulating film 24 is formed on the projections 20 made of the first acrylic organic insulating film 17, the surface of the second acrylic organic insulating film 24 has curved irregularities. State. Next, as shown in FIG. 6F, an aluminum film 22 serving as a reflective electrode forming film is formed on the second acrylic organic insulating film 24, and the reflective electrode 8 is formed by patterning the aluminum film 22. I do. Finally, the first substrate 5 is completed by forming an alignment film (not shown).

That is, the method of rounding the corners of the projections 20 is different between the present embodiment and the first embodiment. The first embodiment employs a method of shaping the corners of the projections 20 using heat treatment. On the other hand, in the present embodiment, a method is employed in which the convex portion 20 is further covered with another film. Also in the present embodiment, the thickness of the first acrylic organic insulating film 17
By optimizing the film thickness of the second acrylic-based organic insulating film 24 in addition to the inkjet conditions, a reflection-type liquid crystal display device that reliably prevents reflection and has excellent visibility can be obtained. The same effect as the embodiment can be obtained.

The technical scope of the present invention is not limited to the above embodiment, and various changes can be made without departing from the spirit of the present invention. For example, in the above-described embodiment, an acrylic organic insulating film is used as the film for forming the projections. However, the present invention is not limited to this, and a polyimide organic insulating film or the like can be used. In addition, an example was given in which a reflective electrode was formed on an acrylic organic insulating film to form irregularities on the surface of the reflective electrode.
A configuration in which unevenness is formed by an acrylic organic insulating film on a flat reflective electrode may be employed. Even in this case, light is scattered by the unevenness on the surface of the acrylic organic insulating film, and the same effect can be obtained. Further, in the second embodiment, a configuration in which the convex portion formed of the acrylic organic insulating film is overcoated with the acrylic organic insulating film of the same material is employed. The film for forming the part and the film for the overcoat need not necessarily be the same material.

In addition, the specific conditions in the manufacturing process described in the above embodiment are merely examples, and it is needless to say that the conditions can be appropriately changed. Furthermore, the manufacturing method of the present invention is not limited to the STN-type liquid crystal display device, but can be applied to a TFD (Thin Fil
m Diode) liquid crystal display, TFT (Thin Film Transis)
It is also applicable to tor) type liquid crystal display devices and the like.

[0043]

As described in detail above, according to the present invention, a reflection type liquid crystal display device having excellent visibility without reflection is obtained. Since the lithography step is not required, the manufacturing process can be simplified, which contributes to shortening the delivery time of the product and reducing the manufacturing cost.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a configuration of a liquid crystal display device obtained by a manufacturing method according to an embodiment of the present invention.

FIG. 2 is a process sectional view illustrating the manufacturing method according to the first embodiment of the present invention.

FIG. 3 is a perspective view illustrating a configuration example of an inkjet head used in the present method.

4 is a cross-sectional view of a nozzle portion of the inkjet head shown in FIG.

FIG. 5 is a graph showing a relationship between a photoresist discharge amount and a resist diameter when an inkjet head is used.

FIG. 6 is a process sectional view illustrating the manufacturing method in the second embodiment of the present invention.

FIG. 7 is a process sectional view illustrating an example of the method for manufacturing a liquid crystal display device of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Liquid crystal display device 5 1st board | substrate 6 2nd board | substrate 7 Liquid crystal layer 8 Reflection electrode (reflection layer) 10 Inkjet head 17 (1st) acrylic organic insulating film (film for convex part formation) 18 Photoresist ( Resin) 20, 20 'convex portion 22 Aluminum film (metal film) 24 Second acrylic organic insulating film (overcoat film)

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H090 HA05 HB07X HC01 HC12 HD06 KA08 LA05 2H091 FA02Y FA14Y FA31Y FC22 FC26 GA02 GA07 GA16 HA10 LA12 LA21 5G435 AA00 AA17 BB12 BB16 CC12 EE33 FF00 FF03 FF05 GG12 H05

Claims (15)

[Claims] 1. Production of a liquid crystal display device comprising at least a pair of substrates arranged opposite to each other and a liquid crystal layer sandwiched between these substrates, wherein a reflective layer is provided on one of the pair of substrates. A method of forming a film for forming a convex portion on the one substrate, a step of discharging a large number of resin droplets from an inkjet head on the film for forming a convex portion, A step of solidifying the droplets, a step of etching the film for forming a convex portion using a large number of resin pieces after solidification as a mask, and a film for forming a convex portion by removing a large number of resin pieces remaining after the etching. A method for manufacturing a liquid crystal display device, comprising: a step of leaving a convex portion; and a step of forming curved unevenness for scattering light on the upper surface of a substrate based on the convex portion. 2. The method for manufacturing a liquid crystal display device according to claim 1, wherein the film thickness of the projection forming film is in a range of 0.5 μm to 3 μm. 3. The method for manufacturing a liquid crystal display device according to claim 1, wherein an organic insulating film is used as the projection forming film. 4. The method according to claim 3, wherein the organic insulating film has thermoplasticity. 5. The method according to claim 4, wherein an acrylic resin film is used as the organic insulating film. 6. The curved surface irregularities are formed by heat-treating the substrate on which the convex portions formed of the convex portion forming film are formed, so that the corners of the convex portions are distorted. 6. The method for manufacturing a liquid crystal display device according to item 5. 7. The curved surface irregularities are formed by covering an entire surface of a substrate including an upper part of the convex portion formed of the film for forming a convex portion with an overcoat film.
6. The method for manufacturing a liquid crystal display device according to any one of items 5 to 5. 8. The overcoat film having a thickness of 0.5 μm
8. The range of m to 6 μm.
3. The method for manufacturing a liquid crystal display device according to item 1. 9. The liquid crystal display device according to claim 8, wherein the thickness of the overcoat film is in a range of 1 to 1.5 times the thickness of the projection forming film. Method. 10. The method for manufacturing a liquid crystal display device according to claim 1, wherein a photoresist is used as a resin discharged from the inkjet head. 11. The method according to claim 10, wherein a discharge amount of one droplet of the photoresist is in a range of 1 nano cc to 100 nano cc. 12. The method for manufacturing a liquid crystal display device according to claim 1, wherein the ejection amount of each droplet of the resin ejected from the inkjet head is varied. 13. The method for manufacturing a liquid crystal display device according to claim 1, wherein an interval between resin droplets ejected from said inkjet head is varied. 14. The method of manufacturing a liquid crystal display device according to claim 1, wherein a metal film serving as the reflection layer is formed above the curved unevenness. 15. The method of manufacturing a liquid crystal display device according to claim 1, wherein the curved unevenness is formed above a metal film forming the reflection layer.