JP3743287B2

JP3743287B2 - Manufacturing method of micro parts

Info

Publication number: JP3743287B2
Application number: JP2000400458A
Authority: JP
Inventors: 昌博 ▲高▼木; 弘行竹下; 弘志和田; 康介山内; 由美子大島; 明藤森; 始山本
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 2000-12-28
Filing date: 2000-12-28
Publication date: 2006-02-08
Anticipated expiration: 2020-12-28
Also published as: JP2002203710A

Description

【０００１】
【発明の属する技術分野】
本発明は、チップ型の抵抗、コンデンサ、インダクタあるいはフィルターなどの微小部品における外部電極形成や外装形成などの微小部品の製造方法に関するものである。
【０００２】
【従来の技術】
従来の、微小部品における外部電極形成や外装形成などの製造方法は、例えば、図５の要部斜視図に示すようなものであった。４はワークとも呼ばれる複数個のチップ型の電子部品となる、抵抗、コンデンサ、インダクタあるいはフィルター機能などを形成した電子部品素子（構成素子）である。この電子部品素子４を、弾性体の金属板でなる保持パレット３の一端に形成された櫛歯部５に整列して保持し、軸２を回転軸とし回転自在、かつ移動自在な弾性体でなり、外周表面に電極材や外装材を塗布したローラ１の外周表面に、電子部品素子４の所定の各面をそれぞれ当接させ電極材や外装材を転写することにより、電子部品素子４に対し所定の外部電極形成や外装形成を行っていた。
【０００３】
【発明が解決しようとする課題】
しかしながら、前記従来の転写による塗布方法では電子部品素子４の外形形状に対して、電極材や外装材を薄く均一にかつ平面的に塗布できないという課題を有していた。
【０００４】
本発明は、前記課題を解決しようとするものであり、電着工法を使用し、確実に電極材あるいは外装材を電子部品素子（構成素子）の表面に対応して、容易に薄く、均一にかつ平面的に塗布できる微小部品の製造方法を提供することを目的とするものである。
【０００５】
【課題を解決するための手段】
前記課題を解決するために本発明の微小部品の製造方法は、一端に第１の電極平面と他端に第２の電極平面とを有する電子部品素子を、前記第１の電極平面には第１の保持手段を、前記第２の電極平面には第２の保持手段をそれぞれ当接させて挟持し、前記電子部品素子の外周面に電着用絶縁樹脂を電着により析出させて外装部を形成し、前記第１の電極平面に当接させていた前記第１の保持手段を前記第１の電極平面から離し、前記電子部品素子の外周面に析出させた電着用絶縁樹脂により前記電子部品素子を前記第２の保持手段に保持したまま、前記第１の電極平面に前記第１の外部電極を形成し、前記第１の外部電極を形成した前記電子部品素子を第３の保持手段で保持させ、前記第２の電極平面に当接させていた前記第２の保持手段を前記第２の電極平面から離して前記第２の電極平面に第２の外部電極を形成するものであり、電着用絶縁樹脂で電子部品素子を保持したまま第１の外部電極を形成することにより、容易で確実に第１の外部電極を形成することが可能となる。
【０００６】
【発明の実施の形態】
本発明の請求項１に記載の発明は、一端に第１の電極平面と他端に第２の電極平面とを有する電子部品素子を、前記第１の電極平面には第１の保持手段を、前記第２の電極平面には第２の保持手段をそれぞれ当接させて挟持し、前記電子部品素子の外周面に電着用絶縁樹脂を電着により析出させて外装部を形成し、前記第１の電極平面に当接させていた前記第１の保持手段を前記第１の電極平面から離し、前記電子部品素子の外周面に析出させた電着用絶縁樹脂により前記電子部品素子を前記第２の保持手段に保持したまま、前記第１の電極平面に第１の外部電極を形成し、前記第１の外部電極を形成した前記電子部品素子を第３の保持手段で保持させ、前記第２の電極平面に当接させていた前記第２の保持手段を前記第２の電極平面から離して前記第２の電極平面に第２の外部電極を形成する微小部品の製造方法としたものであり、電着用絶縁樹脂で電子部品素子を保持したまま第１の外部電極を形成することにより、電子部品素子を別途、保持しなおす必要もなく、外装形成工程から第１の外部電極の形成工程への移行を円滑に、かつ容易にするという作用を有する。
【０００７】
請求項２に記載の発明は、電子部品素子の第１の電極平面を、絶縁材料により構成される第１の保持手段の絶縁部に当接させて前記電子部品素子を挟持し、前記電子部品素子の外周面に外装部を形成することを特徴とする請求項１に記載の微小部品の製造方法としたものであり、第１の保持手段側の電子部品素子の外周面に不要な析出が抑制できるという作用を有する。
【０００８】
請求項３に記載の発明は、電子部品素子の外周面に析出させる電着用絶縁樹脂に対して離型性を有する樹脂部材により構成した第１の保持手段の前記樹脂部材に、前記電子部品素子の第１の電極平面を当接させて挟持し、前記電子部品素子の外周面に外装部を形成することを特徴とする請求項２に記載の微小部品の製造方法としたものであり、電子部品素子の端面から第１の保持手段の離脱が容易かつ確実になるという作用を有する。
【０００９】
請求項４に記載の発明は、第１の保持手段に設けたシリコーン樹脂またはフッ素樹脂に電子部品素子の第１の電極平面を当接させ、前記電子部品素子の外周面に外装部を形成することを特徴とする請求項３に記載の微小部品の製造方法としたものであり請求項３に記載の作用に加えて、少ない樹脂使用量の保持手段を単純に構成できるという作用を有する。
【００１０】
請求項５に記載の発明は、第１の保持手段に設けたゴム弾性体に電子部品素子の第１の電極平面を当接させ、前記電子部品素子の外周面に外装部を形成することを特徴とする請求項２に記載の微小部品の製造方法としたものであり、電子部品素子を損傷することなく確実に挟持できるという作用を有する。
【００１１】
請求項６に記載の発明は、第１の保持手段に設けたシリコーンゴムに電子部品素子の第１の電極平面を当接させ、前記電子部品素子の外周面に外装部を形成することを特徴とする請求項５に記載の微小部品の製造方法としたものであり、請求項５に記載の作用に加えて、少ない使用量の保持手段を単純に構成できるという作用を有する。
【００１２】
請求項７に記載の発明は、電着用絶縁樹脂に浸漬する電子部品素子を、前記電着用絶縁樹脂に浸漬する第１の保持手段と第２の保持手段の浸漬部をそれぞれ絶縁材料により構成した前記第１の保持手段と前記第２の保持手段とで挟持し、電気エネルギーの印加により前記電子部品素子の外周部に前記電着用絶縁樹脂を析出させ、外装部を形成することを特徴とする請求項１に記載の微小部品の製造方法としたものであり、第１の保持手段と第２の保持手段における不要な析出が抑制できるという作用を有する。
【００１３】
請求項８に記載の発明は、電子部品素子の第２の電極平面を導電材料よりなるサブプレートを介して第２の保持手段に当接させ、前記電子部品素子の第１の電極平面は第１の保持手段に当接させて前記電子部品素子を挟持し、前記サブプレートを介して電気エネルギーを印加することにより前記電子部品素子の外周部に電着用絶縁樹脂を析出させ、外周部を形成することを特徴とする請求項７に記載の微小部品の製造方法としたものであり、電子部品素子への給電と、サブプレートに当接させた第２の電極平面側の電着用絶縁樹脂による保持が確実にできるという作用を有する。
【００１４】
請求項９に記載の発明は、電子部品素子の第２の電極平面に当接するサブプレートに対し、外周に絶縁層を設けた第２の保持手段となる導電部材の一端を接続し、前記サブプレートを介して電気エネルギーを印加することにより、前記電子部品素子の外周部に電着用絶縁樹脂を析出させ、外装部を形成することを特徴とする請求項８に記載の微小部品の製造方法としたものであり、絶縁層を設けた第２の保持手段でサブプレートに給電することにより、請求項８に記載の作用に加えて単純な構成で確実に給電することができるという作用を有する。
【００１５】
請求項１０に記載の発明は、一端に第１の電極平面と他端に第２の電極平面とを有する電子部品素子を、前記第１の電極平面には第１の保持手段を、前記第２の電極平面には、導電材料よりなり第２の保持手段に固定されたサブプレートを当接させ、前記第１の保持手段と前記第２の保持手段とにより挟持し、前記電子部品素子の外周面に電着用絶縁樹脂を電着により析出させて形成し、前記電子部品素子の外周面に析出させた電着用絶縁樹脂により前記電子部品素子を前記サブプレートに保持したまま前記サブプレートを前記第１の保持手段と前記第２の保持手段とから分離し、前記第１の電極平面に第１の外部電極を形成し、前記第１の外部電極を形成した前記電子部品素子の前記第１の外部電極を前記サブプレートと同形状の第３の保持手段に当接させ、前記第２の電極平面を当接させていた前記サブプレートから離して前記第３の保持手段に保持させ、前記第２の電極平面に第２の外部電極を形成する微小部品の製造方法としたものであり、電子部品素子を保持するサブプレートを第１の保持手段と第２の保持手段とから分離することにより、電着用絶縁樹脂を析出させた後の工程で電子部品素子を処理する際の荷姿を単純で小型の構造とすることができ、後工程での作業を簡便にし、また後工程の装置の小型化を図ることができ、さらには分離したサブプレートを大量に複数個処理することを可能にする。そしてまた、サブプレートを導電材料で構成したことにより、電着用絶縁樹脂を熱硬化させる際に対し充分な耐熱性を有することができ、したがって、電着用絶縁樹脂を形成した後の工程に対し、取扱いを容易とし作業性を向上させるという作用を有する。
【００１６】
請求項１１に記載の発明は、サブプレートに設けた位置出し手段により前記サブプレートを第２の保持手段の所定位置に固定し、前記位置出し手段を基準にして前記サブプレートに電子部品素子を当接させて第１の保持手段との間で挟持し、電着により電子部品素子の外周面に外装部を形成し、前記位置出し手段を基準にして前記サブプレートを外部電極形成手段に固定し、前記電子部品素子の第１の電極平面に第１の外部電極を形成し、前記第１の外部電極を形成した前記電子部品素子の前記第１の外部電極を前記サブプレートと同形状の位置出し手段を基準にして第３の保持手段に当接させ、前記第３の保持手段に有した前記位置出し手段を基準にして前記第３の保持手段を外部電極形成手段に固定し、前記電子部品素子の第２の電極平面に第２の外部電極を形成することを特徴とする請求項１０に記載の微小部品の製造方法としたものであり、サブプレートに設けた位置出し手段で各工程の位置決めをすることにより、均一で安定した外装形成および外部電極形成ができる、かつ作業性を向上させるという作用を有する。
【００１７】
請求項１２に記載の発明は、サブプレートおよび前記サブプレートと同形状の第３の保持手段に設けた２つの貫通穴を位置出し手段とし、前記貫通穴を基準として所定位置に固定することを特徴とする請求項１１記載の微小部品の製造方法としたものであり、請求項１１に記載の作用に加えて、簡単かつ確実に位置出し基準が構成できるという作用を有する。
【００１８】
請求項１３に記載の発明は、耐腐食性を有する鉄系材料の薄板によりサブプレートと第３の保持手段を構成し、電子部品素子を前記サブプレートと前記第３の保持手段に当接させて保持することを特徴とする請求項１０に記載の微小部品の製造方法としたものであり、請求項１０に記載の作用に加えて、堅牢で長寿命なサブプレートを容易にかつ安価に構成することができるという作用を有する。
【００１９】
請求項１４に記載の発明は、電子部品の外周部に電着用絶縁樹脂を析出させて外装部を形成し、前記電子部品素子の第２の電極平面から第２の保持手段を離した後、前記電子部品素子の外周部に析出させた不要な電着用絶縁樹脂を除去することを特徴とする請求項１記載の微小部品の製造方法としたものであり、電子部品の第２の電極平面側の外形精度を向上させ、第２の外部電極の形成を容易に、かつ確実にするという作用を有する。
【００２０】
請求項１５に記載の発明は、電子部品の外周部に電着用絶縁樹脂を析出させて外装部を形成し、前記電子部品素子の第１の電極平面から第１の保持手段を離した後、前記電子部品素子の外周部に析出させた電着用絶縁樹脂よりなる外装部の端部を、所定形状に成形することを特徴とする請求項１４記載の微小部品の製造方法としたものであり、請求項１４に記載の作用に加えて、電子部品素子の両端の外形精度を向上させるという作用を有する。
【００２１】
請求項１６に記載の発明は、電子部品素子の外周部に析出させた不要な電着用絶縁樹脂をレーザ加工により除去することを特徴とする請求項１４に記載の微小部品の製造方法としたものであり、不要な電着用樹脂を容易に除去できるという作用を有する。
【００２２】
請求項１７に記載の発明は、電子部品の外周部に電着用絶縁樹脂を析出させて外装部を形成し、前記電子部品素子の第２の電極平面から第２の保持手段を離した後、前記第２の電極平面に付着した付着物をブラスト加工により除去することを特徴とする請求項１４に記載の微小部品の製造方法としたものであり、第２の電極平面に付着した微細な付着物を確実に除去できるという作用を有する。
【００２３】
請求項１８に記載の発明は、一端に第１の電極平面と他端に第２の電極平面とを有する複数の電子部品素子を所定間隔毎に直線状に配置し、前記第１の電極平面には第１の保持手段を、前記第２の電極平面には第２の保持手段をそれぞれ当接させて挟持し、前記電子部品素子の外周面に電着用絶縁樹脂を電着により析出させて外装部を形成し、前記第１の電極平面に当接させていた前記第１の保持手段を前記第１の電極平面から離し、前記電子部品素子の外周面に析出させた電着用絶縁樹脂により前記電子部品素子を前記第２の保持手段に保持したまま、前記第１の電極平面に第１の外部電極を形成し、前記第１の外部電極を形成した前記電子部品素子を、粘着部材を有した第３の保持手段に対向させ、前記粘着部材に前記第１の外部電極を当接させて所定位置に前記電子部品素子を同時に保持し、前記第２の電極平面に当接させていた前記第２の保持手段を前記第２の電極平面から離して前記第２の電極平面に第２の外部電極を形成する微小部品の製造方法としたものであり、多数個の電子部品素子に対して荷姿をくずすことなく、サブプレートと同形状の第３の保持部材に同時に電子部品素子の移替えが容易にでき、かつ外装部や外部電極をも同様に簡単に形成でき、一連の生産性および作業性を向上させるという作用を有する。
【００２４】
請求項１９に記載の発明は、直線状に配置した複数の電子部品素子における第１の電極平面を、上層に設けた前記電子部品素子の外周面に析出させる電着用絶縁樹脂に対し離型性を有する樹脂部材と下層に設けたゴム弾性体より構成された２層構造をなし、第１の保持部材に設けられた当接部材に当接させて前記電子部品素子を挟持し、前記電子部品素子の外周面に外装部を形成することを特徴とする請求項１８に記載の微小部品の製造方法としたものであり、電子部品素子の当接によってゴム弾性体が変形することにより、複数の電子部品素子に対する保持性を向上させるとともに、一方で、上層に設けた樹脂部材により、複数の電子部品素子間においては、下層のゴム弾性体の変形量を抑制し、電子部品素子を当接させている上層のくぼみ変形を小さくし、電子部品素子の第１の電極平面近傍の端部においても均一な電着用絶縁樹脂を析出させ、外周部全体に対して均一な外装部を形成することができるという作用を有する。
【００２５】
請求項２０に記載の発明は、上層がシリコーン樹脂またはフッ素樹脂よりなる第１の保持手段に設けた２層構造の当接部材に、電子部品素子の第１の電極平面を当接させ、前記電子部品素子の外周面に外装部を形成することを特徴とする請求項１９に記載の微小部品の製造方法としたものであり、請求項１９に記載の作用に加えて、少ない樹脂使用量の保持手段を単純に構成できるという作用を有する。
【００２６】
請求項２１に記載の発明は、下層の表面に電子部品素子の外周面に析出させる電着用絶縁樹脂に対し離型性を有する樹脂部材を下層に対して薄く形成した２層構造の当接部材に、前記電子部品素子の第１の電極平面を当接させ、前記電子部品素子の外周面に外装部を形成することを特徴とする請求項２０記載の微小部品の製造方法としたものであり、請求項２０に記載の作用に加えて、複数の電子部品素子に対する保持の安定性を向上させるという作用を有する。
【００２７】
以下、本発明の実施の形態における方法について図面を用いて説明する。図１は、本発明の実施の形態における外部電極や外装部の形成概要工程図、図２は他の実施の形態における外部電極や外装部の形成概要工程図、図３は同電着パレットの要部斜視図そして図４は同外部電極塗布用の構成要部斜視図である。
【００２８】
なお、従来の技術で説明した構成部材については同一の符号を付与し、詳細な説明は省略する。
【００２９】
図１において、６は外周部が導電材よりなる電子部品素子４の一端側の第２の電極平面、７は他端側の第１の電極平面、８は前記第２の電極平面６と当接する硬質で弾性体の金属材よりなる第２の保持手段であり、その第２の保持手段は移動、揺動あるいは回動自在に設けてある。９は絶縁材料のゴム弾性体であるシリコーンゴムにより構成されている第１の保持手段であり、移動、揺動あるいは回動自在で前記第１の電極平面７と当接する。
【００３０】
１０は熱あるいは紫外線硬化型の電着用の絶縁樹脂１１により形成された外装部、１２は銀ペーストなどの導電材を塗布して形成され、電子部品素子４における機能部、たとえば抵抗部、インダクタ部、コンデンサ部などと機械的、かつ電気的に接続した第１の外部電極である。１３は高剛性体の金属材でなり第３の保持手段であるプレート、１４は銀ペーストなどの導電材を塗布して形成され、電子部品素子４における前記機能部の他端と機械的、電気的に接続した第２の外部電極であり、そして２４は外装および外部電極の形成を完成したチップ型の電子部品である。
【００３１】
なお、電着用絶縁樹脂１１に対して離型性を有する樹脂部材としてシリコーン樹脂あるいはフッ素樹脂により構成した第１の保持手段９としてもよく、第１の保持手段９から電子部品素子４の離脱が容易になり、電着用絶縁樹脂１１より形成した外装部を損傷させることなく確実に第１の保持手段９に当接させた面での離脱ができる。
【００３２】
また、第２の保持手段８としては、外周に絶縁層を設けた導電部材でなる構成としてもよく、電着する際に第２の保持手段８に不要な電着用絶縁樹脂を析出させることなく電子部品素子に通電でき、また、第２の保持手段から電子部品素子４の離脱を容易にすることができる。
【００３３】
前記構成における電着による外装形成や塗布による外部電極形成の工程について説明する。まず、図１（ａ）に示すように、電子部品素子４の第１の電極平面７には第１の保持手段９を、そして同第２の電極平面６には第２の保持手段８をそれぞれ当接させて電子部品素子４を挟持する。
【００３４】
次に、電着用絶縁樹脂１１の充填された槽に前記状態の電子部品素子４を浸漬し、第２の保持手段に電圧すなわち電気エネルギーを印加して（以上図示せず）、図１（ｂ）に示すように、電子部品素子４の外周面に電着用絶縁樹脂１１を電着により析出させて外装部１０を形成する。
【００３５】
その後、図１（ｃ）に示すように、第１の電極平面７に当接させていた前記第１の保持手段９を第１の電極平面７から離脱させ、電子部品素子４の外周面に析出させた電着用絶縁樹脂１１により電子部品素子４を第２の保持手段８の表面に保持したまま、図１（ｄ）に示すように第１の電極平面７に第１の外部電極１２を塗布などにより形成する。
【００３６】
次に、図１（ｅ）に示すように、第１の外部電極１２が形成された電子部品素子４を、第３の保持手段であるプレート１３に第１の外部電極１２の面部分で保持させ、第２の電極平面６に当接させていた第２の保持手段８を移動させて第２の電極平面６から離脱させた後、図１（ｆ）に示すように、前記第１の外部電極１２と同じ手段により、第２の電極平面６に第２の外部電極１４を形成する。
【００３７】
そして、図１（ｇ）に示すように、プレート１３を第１の外部電極１２から離脱させて、チップ型の電子部品２４を完成させるのである。
【００３８】
次に、他の構成による実施の形態について図２、図３および図４を用いて説明する。図２において、３３，３５は第２の保持手段８の内面に配設した鋼材でなる位置決めピンである。
【００３９】
２８は当接部材であり、第１の保持手段９の内面に配設されており、第１の電極平面７と当接する電着用絶縁樹脂１１に対し離型性を有する比較的硬質で変形しにくい樹脂部材、例えばシリコーン樹脂またはフッ素樹脂でなる上層２６と、外力による十分な変形と確実に変形前の復元が可能なゴム弾性体でなる下層２７の２層構造となっている。なお、上層２６は下層２７に対して十分に薄い構成となっており、外力に対して十分な変形が可能な柔軟性を有している。
【００４０】
１５はサブプレートであり、ステンレスなどの耐腐食性を有する鉄系材料の薄板でなり、前記位置決めピン３３，３５に対応する電子部品素子４の位置出し手段である貫通穴２３，２５を設けており、位置決めピン３３，３５と貫通穴２３，２５により各工程における所定位置の設定と固定を行うのである。なお、貫通穴２３，２５の片方を楕円形状とし、より位置決めの操作や設定を容易としてもよい。
【００４１】
１６はサブプレート１５と同じ構成をなす第３の保持手段となるサブプレートであり、粘着部材となる両面の粘着テープ２９により電子部品素子４における第１の外部電極１２の平面を粘着テープ２９を介してサブプレート１６に固着する。
【００４２】
３０は電子部品素子４における不要な電着用絶縁樹脂をレーザ照射により除去するためのレーザである。
【００４３】
図３、図４において、２１は電着パレットであり、軸２０により揺動自在で当接部材２８を配設した第１の保持手段９と、電子部品素子４を載置するサブプレート１５を内面に装着する第２の保持手段８で構成されている。そして、２２は硬質弾性体でなるスキージであり、電子部品素子４の外装部１０を塗布して形成するために、ローラ１に供給される銀ペーストなどの導電材料よりなる外部電極材を均一な厚みとしている。
【００４４】
前記構成における電着や塗布の工程について説明する。まず、図２（ａ）（ｂ）に示すように、サブプレート１５を貫通穴２３，２５に位置決めピン３３，３５を挿通することで位置決めして、電着パレット２１における第２の保持手段８の内面側に装着する。
【００４５】
次にワークである電子部品素子４を、１個または整列させて複数個を同時あるいは順次に供給し、第１の保持手段９を図３に示すように揺動して、サブプレート１５の内面側と当接部材２８の上層２６により直線状に配置した電子部品素子４を図２（ｃ）に示すように挟持して保持する。
【００４６】
そして、前記で説明したと同じ方法にて、図２（ｄ）に示すように電着用絶縁樹脂１１を電着して外装部１０を形成する。
【００４７】
次に図２（ｅ）に示すように、第１の保持手段９を分離し離脱させて電子部品素子４を挟持する前の元の位置とした後、サブプレート１５を第２の保持手段８から取外す。そして、前記で説明したと同じ方法にて図４および図２（ｆ）に示すように、第１の外部電極１２を塗布して形成する。
【００４８】
次に図２（ｇ）に示すように、電子部品素子４における第１の外部電極１２の平面を粘着テープ２９によりサブプレート１５と同形状の第３の保持手段であるサブプレート１６の側面に複数個は位置出し手段となる貫通穴を基準としてサブプレート１５で当接させた位置と同じ所定の位置に同時に装着させ、その後サブプレート１５を電子部品素子４より離脱させる。
【００４９】
続いて図２（ｈ）に示すように、レーザ３０よりレーザ照射して電子部品素子４の第２の電極平面６側における不要な電着用絶縁樹脂１１を除去する。
【００５０】
その後、前記で説明したと同じ方法にて、図２（ｉ）に示すように第２の外部電極１４を塗布して形成する。そして、図２（ｊ）に示すように、サブプレート１６の粘着テープ２９から第１の外部電極１２を離脱させて、チップ型の電子部品２４を完成させるのである。
【００５１】
なお、図２（ｅ）に示す状態において、不要な電着用絶縁樹脂１１をレーザ３０により除去して、第１の電極平面７部分を所定形状とすれば、第１および第２の電極平面側の形状が高精度に左右均一となり、また後工程にて第１の電極平面と第１の外部電極との接続が向上し確実な導通性を得ることになる。また、レーザ３０に代えてサンドブラストによるブラスト加工とすれば、第１および第２の電極平面６，７などに付着した微細な電着用絶縁樹脂１１をも容易に除去することができ、さらに第１および第２の電極平面と第１および第２の外部電極との接続の信頼性を向上できるのである。
【００５２】
【発明の効果】
以上のように本発明による微小部品の製造方法によれば、微小形状でも確実に電極材あるいは外装材を電子部品素子（構成素子）の表面に対応して、容易に薄く、均一にかつ平面的に塗布および形成できるという効果を有する。
【図面の簡単な説明】
【図１】本発明の実施の形態における外部電極や外装部の形成概要工程図
【図２】他の実施の形態における外部電極や外装部の形成概要工程図
【図３】同電着パレットの要部斜視図
【図４】同外部電極塗布用の構成要部斜視図
【図５】従来における塗布用の構成要部斜視図
【符号の説明】
１ローラ
２軸
３パレット
４電子部品素子（構成素子）
５櫛歯部
６第２の電極平面
７第１の電極平面
８第２の保持手段
９第１の保持手段
１０外装部
１１電着用絶縁樹脂
１２第１の外部電極
１３プレート（第３の保持手段）
１４第２の外部電極
１５サブプレート
１６サブプレート
２０軸
２１電着パレット
２２スキージ
２３，２５貫通穴（位置出し手段）
２４電子部品
２６上層
２７下層
２８当接部材
２９粘着テープ（粘着部材）
３０レーザ
３３，３５位置決めピン[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a micro component such as external electrode formation or exterior formation in a micro component such as a chip-type resistor, capacitor, inductor, or filter.
[0002]
[Prior art]
Conventional manufacturing methods such as external electrode formation and exterior formation in microparts are as shown in the perspective view of the main part in FIG. 5, for example. Reference numeral 4 denotes an electronic component element (component) having a resistor, a capacitor, an inductor, a filter function, or the like, which is a plurality of chip-type electronic components called workpieces. The electronic component element 4 is held in alignment with a comb tooth portion 5 formed at one end of a holding pallet 3 made of an elastic metal plate, and is an elastic body that is rotatable and movable with the shaft 2 as a rotation axis. The predetermined surface of the electronic component element 4 is brought into contact with the outer peripheral surface of the roller 1 coated with the electrode material or the exterior material on the outer peripheral surface to transfer the electrode material or the exterior material to the electronic component element 4. On the other hand, predetermined external electrode formation and exterior formation were performed.
[0003]
[Problems to be solved by the invention]
However, the conventional transfer coating method has a problem that the electrode material and the exterior material cannot be applied thinly, uniformly and planarly with respect to the outer shape of the electronic component element 4.
[0004]
The present invention is intended to solve the above-described problems, and uses an electrodeposition method to ensure that an electrode material or an exterior material is easily thinned and uniformly applied to the surface of an electronic component element (component). An object of the present invention is to provide a method for manufacturing a micropart that can be applied in a planar manner.
[0005]
[Means for Solving the Problems]
In order to solve the above-described problems, a method of manufacturing a microcomponent according to the present invention includes an electronic component element having a first electrode plane at one end and a second electrode plane at the other end, and a first electrode plane having a first electrode plane at the other end. 1 holding means, the second holding means is held in contact with the second electrode plane, electrodeposition insulating resin is deposited on the outer peripheral surface of the electronic component element by electrodeposition, and the exterior portion is The electronic component is formed by an electrodeposition insulating resin formed and separated from the first electrode plane and deposited on the outer peripheral surface of the electronic component element. While holding the element in the second holding means, the first external electrode is formed on the first electrode plane, and the electronic component element in which the first external electrode is formed is formed by the third holding means. The second holding means held and in contact with the second electrode plane The second external electrode is formed on the second electrode plane away from the second electrode plane, and the first external electrode is formed while holding the electronic component element with the electrodeposition insulating resin. Thus, the first external electrode can be formed easily and reliably.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
According to a first aspect of the present invention, there is provided an electronic component element having a first electrode plane at one end and a second electrode plane at the other end, and a first holding means on the first electrode plane. The second electrode plane is brought into contact with and held between the second holding means, and an electrodeposition insulating resin is deposited on the outer peripheral surface of the electronic component element by electrodeposition to form an exterior portion; The first holding means that is in contact with one electrode plane is separated from the first electrode plane, and the electronic component element is moved to the second by an electrodeposition insulating resin deposited on the outer peripheral surface of the electronic component element. The first external electrode is formed on the first electrode plane while being held by the holding means, and the electronic component element on which the first external electrode is formed is held by the third holding means, and the second The second holding means that is in contact with the electrode plane of the second electrode is separated from the second electrode plane. And forming a second external electrode on the second electrode plane, and forming the first external electrode while holding the electronic component element with the electrodeposition insulating resin, There is no need to separately hold the electronic component element again, and the transition from the exterior forming process to the first external electrode forming process can be performed smoothly and easily.
[0007]
According to a second aspect of the present invention, the electronic component element is clamped by bringing the first electrode plane of the electronic component element into contact with the insulating portion of the first holding means made of an insulating material. The exterior part is formed in the outer peripheral surface of an element, It is a manufacturing method of the micro components of Claim 1, The unnecessary precipitation is carried out on the outer peripheral surface of the electronic component element by the side of a 1st holding means. It has the effect that it can be suppressed.
[0008]
According to a third aspect of the present invention, there is provided the electronic component element in the resin member of the first holding means constituted by a resin member having releasability from the electrodeposition insulating resin deposited on the outer peripheral surface of the electronic component element. 3. The method of manufacturing a microcomponent according to claim 2, wherein the first electrode plane is abutted and sandwiched to form an exterior portion on the outer peripheral surface of the electronic component element. The first holding means can be easily and reliably detached from the end face of the component element.
[0009]
According to a fourth aspect of the present invention, the first electrode plane of the electronic component element is brought into contact with the silicone resin or fluororesin provided in the first holding means, and an exterior portion is formed on the outer peripheral surface of the electronic component element. According to the third aspect of the present invention, there is provided a method of manufacturing a micropart according to the third aspect of the invention. In addition to the action of the third aspect, the means for holding a small amount of resin can be simply configured.
[0010]
According to a fifth aspect of the present invention, the first electrode plane of the electronic component element is brought into contact with a rubber elastic body provided in the first holding means, and an exterior portion is formed on the outer peripheral surface of the electronic component element. The method of manufacturing a microcomponent according to claim 2, which is characterized in that the electronic component element can be securely clamped without being damaged.
[0011]
The invention according to claim 6 is characterized in that the first electrode plane of the electronic component element is brought into contact with the silicone rubber provided in the first holding means, and an exterior portion is formed on the outer peripheral surface of the electronic component element. The method for manufacturing a micropart according to claim 5 has the effect that in addition to the function described in claim 5, the holding means with a small amount of use can be simply configured.
[0012]
According to the seventh aspect of the present invention, the electronic component element immersed in the electrodeposition insulating resin is composed of an insulating material in each of the first holding means and the second holding means immersed in the electrodeposition insulating resin. It is sandwiched between the first holding means and the second holding means, and the electrodeposition insulating resin is deposited on the outer peripheral portion of the electronic component element by applying electric energy to form an exterior part. The method for manufacturing a micro component according to claim 1 has an effect of suppressing unnecessary precipitation in the first holding means and the second holding means.
[0013]
According to an eighth aspect of the present invention, the second electrode plane of the electronic component element is brought into contact with the second holding means via a sub plate made of a conductive material, and the first electrode plane of the electronic component element is The electronic component element is clamped by being brought into contact with one holding means, and an electric energy is applied through the sub-plate to deposit electrodeposition insulating resin on the outer peripheral portion of the electronic component element, thereby forming the outer peripheral portion. The method of manufacturing a microcomponent according to claim 7, wherein power is supplied to the electronic component element and the electrodeposition insulating resin on the second electrode plane side abutted on the sub plate is used. It has the effect that it can be held securely.
[0014]
According to a ninth aspect of the present invention, one end of a conductive member serving as a second holding means having an insulating layer provided on the outer periphery is connected to a subplate that is in contact with the second electrode plane of the electronic component element. 9. The method of manufacturing a microcomponent according to claim 8, wherein by applying electrical energy through a plate, an insulating resin for electrodeposition is deposited on an outer peripheral portion of the electronic component element to form an exterior portion. Thus, by supplying power to the sub-plate with the second holding means provided with the insulating layer, in addition to the operation of the eighth aspect, it is possible to reliably supply power with a simple configuration.
[0015]
According to a tenth aspect of the present invention, an electronic component element having a first electrode plane at one end and a second electrode plane at the other end, a first holding means on the first electrode plane, and the first holding means A sub plate made of a conductive material and fixed to the second holding means is brought into contact with the two electrode planes, and is sandwiched between the first holding means and the second holding means. An electrodepositing insulating resin is deposited on the outer peripheral surface by electrodeposition, and the subplate is retained while the electronic component element is held on the subplate by the electrodepositing insulating resin deposited on the outer peripheral surface of the electronic component element. The first part of the electronic component element, which is separated from the first holding unit and the second holding unit, and a first external electrode is formed on the first electrode plane, and the first external electrode is formed. Of the third electrode having the same shape as the sub-plate. And a second external electrode formed on the second electrode plane by contacting the second electrode plane and separating the second electrode plane from the sub-plate, which is held by the third holding means. In the method for manufacturing a component, the subplate that holds the electronic component element is separated from the first holding means and the second holding means, so that an electron can be produced in a process after the electrodeposition insulating resin is deposited. The packaging form when processing component elements can be made simple and compact structure, the work in the post-process can be simplified, the equipment in the post-process can be downsized, and the separated subplate It is possible to process a plurality of large numbers. Also, by configuring the subplate with a conductive material, it can have sufficient heat resistance for thermosetting the electrodeposition insulating resin, and therefore, for the step after forming the electrodeposition insulating resin, It has the effect of facilitating handling and improving workability.
[0016]
According to an eleventh aspect of the present invention, the sub plate is fixed at a predetermined position of the second holding means by the positioning means provided on the sub plate, and the electronic component element is placed on the sub plate based on the positioning means. Abutting and holding between the first holding means, forming an exterior portion on the outer peripheral surface of the electronic component element by electrodeposition, and fixing the sub-plate to the external electrode forming means with respect to the positioning means The first external electrode is formed on the first electrode plane of the electronic component element, and the first external electrode of the electronic component element on which the first external electrode is formed has the same shape as the sub-plate. The third holding means is brought into contact with the third holding means with reference to the positioning means, and the third holding means is fixed to the external electrode forming means with reference to the positioning means included in the third holding means, Second electrode plane of electronic component element The method according to claim 10, wherein a second external electrode is formed on the substrate, wherein each step is positioned uniformly by positioning means provided on the sub-plate. Thus, it is possible to form a stable exterior and external electrodes, and to improve workability.
[0017]
According to a twelfth aspect of the present invention, the two through holes provided in the sub-plate and the third holding means having the same shape as the sub-plate are used as positioning means, and fixed at a predetermined position with reference to the through-hole. The method of manufacturing a micropart according to claim 11 is characterized in that, in addition to the action described in claim 11, it has an action that a positioning reference can be configured easily and reliably.
[0018]
According to a thirteenth aspect of the present invention, the sub-plate and the third holding means are constituted by a thin plate of an iron-based material having corrosion resistance, and the electronic component element is brought into contact with the sub-plate and the third holding means. The method of manufacturing a micro component according to claim 10, wherein in addition to the operation of claim 10, a robust and long-life subplate is easily and inexpensively configured. It has the effect of being able to.
[0019]
In the invention according to claim 14, after the electrodeposition insulating resin is deposited on the outer peripheral portion of the electronic component to form an exterior portion, and the second holding means is separated from the second electrode plane of the electronic component element, The unnecessary electrodeposition insulating resin deposited on the outer peripheral portion of the electronic component element is removed, and the method of manufacturing a microcomponent according to claim 1, wherein the second electrode plane side of the electronic component is used. The outer shape accuracy is improved, and the second external electrode is easily and reliably formed.
[0020]
The invention according to claim 15 is formed by depositing an insulating resin for electrodeposition on the outer peripheral portion of the electronic component to form an exterior portion, and after separating the first holding means from the first electrode plane of the electronic component element, The method of manufacturing a microcomponent according to claim 14, characterized in that an end portion of an exterior portion made of an electrodeposition insulating resin deposited on an outer peripheral portion of the electronic component element is molded into a predetermined shape. In addition to the effect of the fourteenth aspect, it has an effect of improving the external accuracy of both ends of the electronic component element.
[0021]
The invention according to claim 16 is the method of manufacturing a microcomponent according to claim 14, wherein unnecessary insulating resin for electrodeposition deposited on the outer peripheral portion of the electronic component element is removed by laser processing. It has the effect | action that an unnecessary electrodeposition resin can be removed easily.
[0022]
In the invention according to claim 17, after the electrodeposition insulating resin is deposited on the outer peripheral portion of the electronic component to form an exterior portion, the second holding means is separated from the second electrode plane of the electronic component element, 15. The method of manufacturing a micro component according to claim 14, wherein the deposit attached to the second electrode plane is removed by blasting, and the minute attachment attached to the second electrode plane. The kimono can be removed reliably.
[0023]
According to an eighteenth aspect of the present invention, a plurality of electronic component elements each having a first electrode plane at one end and a second electrode plane at the other end are linearly arranged at predetermined intervals, and the first electrode plane The first holding means and the second electrode plane are held in contact with the second holding means, and an insulating resin for electrodeposition is deposited on the outer peripheral surface of the electronic component element by electrodeposition. An electrodeposition insulating resin that forms an exterior part and separates the first holding means that has been in contact with the first electrode plane from the first electrode plane and is deposited on the outer peripheral surface of the electronic component element. While holding the electronic component element on the second holding means, the first external electrode is formed on the first electrode plane, and the electronic component element on which the first external electrode is formed is attached to the adhesive member. The first external electrode is placed on the adhesive member so as to face the third holding means. The electronic component elements are simultaneously held in contact with each other, and the second holding means that is in contact with the second electrode plane is separated from the second electrode plane on the second electrode plane. This is a method of manufacturing a micro component for forming the second external electrode, and the electronic component is simultaneously applied to the third holding member having the same shape as the sub-plate without losing the packing state for a large number of electronic component elements. The element can be easily transferred, and the exterior portion and the external electrode can be easily formed in the same manner, thereby improving the series of productivity and workability.
[0024]
According to the nineteenth aspect of the present invention, the first electrode plane of the plurality of linearly arranged electronic component elements is releasable from the electrodeposition insulating resin that deposits on the outer peripheral surface of the electronic component element provided in the upper layer. A two-layer structure composed of a resin member having an elastic layer and a rubber elastic body provided in a lower layer, wherein the electronic component element is clamped by contacting the contact member provided on the first holding member. 19. The micropart manufacturing method according to claim 18, wherein an exterior portion is formed on an outer peripheral surface of the element, and the rubber elastic body is deformed by contact of the electronic part element, so that a plurality of parts are formed. On the other hand, the resin member provided in the upper layer suppresses the deformation amount of the rubber elastic body in the lower layer and makes the electronic component element contact between the plurality of electronic component elements. Upper layer The deformation can be reduced, and a uniform electrodeposition insulating resin can be deposited even at the end near the first electrode plane of the electronic component element, and a uniform exterior portion can be formed over the entire outer peripheral portion. .
[0025]
According to a twentieth aspect of the present invention, the first electrode plane of the electronic component element is brought into contact with a contact member having a two-layer structure provided in the first holding means whose upper layer is made of silicone resin or fluororesin, An exterior part is formed on the outer peripheral surface of the electronic component element. The method of manufacturing a microcomponent according to claim 19, wherein the resin usage amount is small in addition to the function according to claim 19. The holding means can be configured simply.
[0026]
The invention according to claim 21 is a contact member having a two-layer structure in which a resin member having releasability with respect to an insulating resin for electrodeposition deposited on the outer peripheral surface of an electronic component element is formed thinly on the lower layer surface. 21. The method of manufacturing a microcomponent according to claim 20, wherein a first electrode plane of the electronic component element is brought into contact with the outer peripheral surface of the electronic component element to form an exterior portion. In addition to the operation described in claim 20, it has an operation of improving the holding stability of the plurality of electronic component elements.
[0027]
Hereinafter, a method according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic process diagram of formation of external electrodes and exterior parts in the embodiment of the present invention, FIG. 2 is a schematic process diagram of formation of external electrodes and exterior parts in other embodiments, and FIG. FIG. 4 is a perspective view of the main part of the structure for applying the external electrode.
[0028]
In addition, about the structural member demonstrated by the prior art, the same code | symbol is provided and detailed description is abbreviate | omitted.
[0029]
In FIG. 1, reference numeral 6 denotes a second electrode plane on one end side of the electronic component element 4 whose outer peripheral portion is made of a conductive material, 7 denotes a first electrode plane on the other end side, and 8 denotes a contact with the second electrode plane 6. The second holding means is made of a hard and elastic metal material in contact with the second holding means, and the second holding means is provided so as to be movable, swingable or rotatable. Reference numeral 9 denotes a first holding means made of silicone rubber, which is a rubber elastic body of an insulating material, and is in contact with the first electrode plane 7 so as to be movable, swingable or rotatable.
[0030]
10 is an exterior part formed of an insulating resin 11 of heat or ultraviolet curable electrodeposition, 12 is formed by applying a conductive material such as silver paste, and a functional part in the electronic component element 4, such as a resistance part or an inductor part. The first external electrode is mechanically and electrically connected to the capacitor portion and the like. 13 is a plate made of a highly rigid metal material, which is a third holding means, and 14 is formed by applying a conductive material such as silver paste. The other end of the functional part in the electronic component element 4 is mechanically and electrically connected. Are externally connected second external electrodes, and 24 is a chip-type electronic component that completes the formation of the exterior and external electrodes.
[0031]
The resin member having releasability from the electrodeposition insulating resin 11 may be the first holding means 9 made of silicone resin or fluororesin, and the electronic component element 4 may be detached from the first holding means 9. It becomes easy, and it can detach | desorb in the surface contact | abutted to the 1st holding means 9 reliably, without damaging the exterior part formed from the insulating resin 11 for electrodeposition.
[0032]
Further, the second holding means 8 may be composed of a conductive member provided with an insulating layer on the outer periphery, without causing unnecessary electrodeposition insulating resin to be deposited on the second holding means 8 during electrodeposition. The electronic component element can be energized, and the electronic component element 4 can be easily detached from the second holding means.
[0033]
A process of forming an exterior by electrodeposition and forming an external electrode by coating in the above configuration will be described. First, as shown in FIG. 1A, a first holding means 9 is provided on the first electrode plane 7 of the electronic component element 4, and a second holding means 8 is provided on the second electrode plane 6. The electronic component elements 4 are held in contact with each other.
[0034]
Next, the electronic component element 4 in the above-described state is immersed in a tank filled with the electrodeposition insulating resin 11, and a voltage, that is, electric energy is applied to the second holding means (not shown above), and FIG. As shown in FIG. 4, the exterior part 10 is formed by depositing the electrodeposition insulating resin 11 on the outer peripheral surface of the electronic component element 4 by electrodeposition.
[0035]
Thereafter, as shown in FIG. 1 (c), the first holding means 9, which has been in contact with the first electrode plane 7, is separated from the first electrode plane 7, and is placed on the outer peripheral surface of the electronic component element 4. While the electronic component element 4 is held on the surface of the second holding means 8 by the deposited electrodeposition insulating resin 11, the first external electrode 12 is placed on the first electrode plane 7 as shown in FIG. It is formed by coating.
[0036]
Next, as shown in FIG. 1 (e), the electronic component element 4 on which the first external electrode 12 is formed is held by the surface portion of the first external electrode 12 on the plate 13 which is the third holding means. After the second holding means 8 that has been in contact with the second electrode plane 6 is moved away from the second electrode plane 6, as shown in FIG. The second external electrode 14 is formed on the second electrode plane 6 by the same means as the external electrode 12.
[0037]
Then, as shown in FIG. 1G, the plate 13 is detached from the first external electrode 12 to complete the chip-type electronic component 24.
[0038]
Next, an embodiment according to another configuration will be described with reference to FIGS. In FIG. 2, 33 and 35 are positioning pins made of steel disposed on the inner surface of the second holding means 8.
[0039]
Reference numeral 28 denotes an abutting member which is disposed on the inner surface of the first holding means 9 and is relatively hard and deformable having releasability with respect to the electrodeposition insulating resin 11 which abuts on the first electrode plane 7. It has a two-layer structure of an upper layer 26 made of a difficult resin member, for example, a silicone resin or a fluororesin, and a lower layer 27 made of a rubber elastic body that can be sufficiently deformed by an external force and reliably restored before deformation. The upper layer 26 has a sufficiently thin structure with respect to the lower layer 27, and has a flexibility that allows sufficient deformation with respect to an external force.
[0040]
Reference numeral 15 denotes a sub-plate, which is a thin plate of an iron-based material having corrosion resistance such as stainless steel, and is provided with through holes 23 and 25 as positioning means for the electronic component element 4 corresponding to the positioning pins 33 and 35. The predetermined positions in each process are set and fixed by the positioning pins 33 and 35 and the through holes 23 and 25. It should be noted that one of the through holes 23 and 25 may be oval to facilitate positioning operation and setting.
[0041]
Reference numeral 16 denotes a sub-plate serving as a third holding means having the same configuration as that of the sub-plate 15, and the adhesive tape 29 is attached to the plane of the first external electrode 12 in the electronic component element 4 by the double-sided adhesive tape 29 serving as an adhesive member. To the sub-plate 16.
[0042]
Reference numeral 30 denotes a laser for removing unnecessary electrodeposition insulating resin in the electronic component element 4 by laser irradiation.
[0043]
3 and 4, reference numeral 21 denotes an electrodeposition pallet, which includes a first holding means 9 that is swingable by a shaft 20 and provided with a contact member 28, and a subplate 15 on which the electronic component element 4 is placed. The second holding means 8 is mounted on the inner surface. Reference numeral 22 denotes a squeegee made of a hard elastic body, and in order to apply and form the exterior part 10 of the electronic component element 4, an external electrode material made of a conductive material such as a silver paste supplied to the roller 1 is made uniform. The thickness.
[0044]
The electrodeposition and coating process in the above configuration will be described. First, as shown in FIGS. 2 (a) and 2 (b), the sub-plate 15 is positioned by inserting positioning pins 33 and 35 into the through holes 23 and 25, and the second holding means 8 in the electrodeposition pallet 21. Attach to the inner side of the.
[0045]
Next, one or a plurality of electronic component elements 4 that are workpieces are aligned and supplied simultaneously or sequentially, and the first holding means 9 is swung as shown in FIG. The electronic component element 4 arranged in a straight line by the side and the upper layer 26 of the contact member 28 is sandwiched and held as shown in FIG.
[0046]
Then, by the same method as described above, the exterior resin 10 is formed by electrodepositing the electrodeposition insulating resin 11 as shown in FIG.
[0047]
Next, as shown in FIG. 2 (e), the first holding means 9 is separated and separated to the original position before the electronic component element 4 is clamped, and then the sub-plate 15 is moved to the second holding means 8. Remove from. Then, as shown in FIGS. 4 and 2F, the first external electrode 12 is applied and formed by the same method as described above.
[0048]
Next, as shown in FIG. 2G, the plane of the first external electrode 12 in the electronic component element 4 is placed on the side surface of the sub-plate 16 that is the third holding means having the same shape as the sub-plate 15 by the adhesive tape 29. A plurality of them are simultaneously mounted at the same predetermined position as the position contacted by the sub-plate 15 with the through hole serving as a positioning means as a reference, and then the sub-plate 15 is detached from the electronic component element 4.
[0049]
Subsequently, as shown in FIG. 2H, laser irradiation is performed by the laser 30 to remove unnecessary electrodeposition insulating resin 11 on the second electrode plane 6 side of the electronic component element 4.
[0050]
Thereafter, by the same method as described above, the second external electrode 14 is applied and formed as shown in FIG. Then, as shown in FIG. 2 (j), the first external electrode 12 is detached from the adhesive tape 29 of the sub-plate 16 to complete the chip-type electronic component 24.
[0051]
In the state shown in FIG. 2E, if the unnecessary electrodeposition insulating resin 11 is removed by the laser 30 and the first electrode plane 7 portion has a predetermined shape, the first and second electrode plane sides The shape of the first and second electrodes becomes uniform with high accuracy, and the connection between the first electrode plane and the first external electrode is improved in a subsequent process, and reliable conductivity is obtained. If the blasting process is performed by sandblasting instead of the laser 30, the fine electrodeposition insulating resin 11 attached to the first and second electrode planes 6, 7 and the like can be easily removed. And the reliability of the connection between the second electrode plane and the first and second external electrodes can be improved.
[0052]
【The invention's effect】
As described above, according to the method for manufacturing a microcomponent according to the present invention, the electrode material or the exterior material can be easily made thin, uniform, and planar even in a micro shape, corresponding to the surface of the electronic component element (component). It has the effect that it can apply | coat and form.
[Brief description of the drawings]
FIG. 1 is a schematic process diagram of formation of external electrodes and exterior parts in an embodiment of the present invention.
FIG. 2 is a schematic process diagram of formation of external electrodes and exterior parts in another embodiment.
FIG. 3 is a perspective view of the main part of the electrodeposition pallet.
FIG. 4 is a perspective view of a main part of the configuration for applying the external electrode.
FIG. 5 is a perspective view of a main part of a conventional configuration for coating.
[Explanation of symbols]
1 Roller
2 axis
3 Palette
4 Electronic component elements (components)
5 comb teeth
6 Second electrode plane
7 First electrode plane
8 Second holding means
9 First holding means
10 Exterior
11 Insulating resin for electrodeposition
12 First external electrode
13 Plate (third holding means)
14 Second external electrode
15 Sub-plate
16 Sub-plate
20 axes
21 Electrodeposition palette
22 Squeegee
23, 25 Through hole (positioning means)
24 Electronic components
26 Upper layer
27 Lower layer
28 Contact member
29 Adhesive tape (adhesive material)
30 laser
33, 35 Locating pin

Claims

An electronic component element having a first electrode plane at one end and a second electrode plane at the other end, a first holding means on the first electrode plane, and a second holder on the second electrode plane The holding means are brought into contact with each other, electrodepositing insulating resin is deposited on the outer peripheral surface of the electronic component element by electrodeposition to form an exterior portion, and the first electrode plane is in contact with the first electrode plane. The first holding means is separated from the first electrode plane, and the electronic component element is held on the second holding means by the electrodeposition insulating resin deposited on the outer peripheral surface of the electronic component element. A first external electrode is formed on an electrode plane, the electronic component element on which the first external electrode is formed is held by a third holding means, and the second electrode is in contact with the second electrode plane. The holding means is spaced apart from the second electrode plane and placed on the second electrode plane. Method for producing microcomponents forming the electrode.

The first electrode plane of the electronic component element is brought into contact with the insulating portion of the first holding means made of an insulating material to sandwich the electronic component element, and an exterior portion is formed on the outer peripheral surface of the electronic component element The method of manufacturing a microcomponent according to claim 1, wherein:

The first electrode plane of the electronic component element is brought into contact with the resin member of the first holding means constituted by a resin member having releasability with respect to the electrodeposition insulating resin deposited on the outer peripheral surface of the electronic component element 3. The method of manufacturing a micro component according to claim 2, wherein an exterior part is formed on the outer peripheral surface of the electronic component element.

4. The exterior part is formed on the outer peripheral surface of the electronic component element by bringing the first electrode plane of the electronic component element into contact with a silicone resin or fluororesin provided on the first holding means. Manufacturing method of micro parts.

3. The minute structure according to claim 2, wherein the first electrode plane of the electronic component element is brought into contact with a rubber elastic body provided in the first holding means, and an exterior portion is formed on the outer peripheral surface of the electronic component element. A manufacturing method for parts.

6. The microcomponent according to claim 5, wherein the first electrode plane of the electronic component element is brought into contact with silicone rubber provided in the first holding means, and an exterior portion is formed on the outer peripheral surface of the electronic component element. Manufacturing method.

The first holding means and the first holding means in which the immersion parts of the first holding means and the second holding means for immersing the electronic component element immersed in the electrodeposition insulating resin in the electrodeposition insulating resin are respectively made of an insulating material. 2. The micropart manufacturing method according to claim 1, wherein the electrodeposition insulating resin is deposited on an outer peripheral portion of the electronic component element by applying electric energy to form an exterior portion. Method.

The second electrode plane of the electronic component element is brought into contact with the second holding means via a sub plate made of a conductive material, and the first electrode plane of the electronic component element is brought into contact with the first holding means. 8. The insulating part is deposited on the outer peripheral part of the electronic component element by sandwiching the electronic component element and applying electric energy through the sub-plate to form the outer peripheral part. The manufacturing method of the micro component of description.

One end of a conductive member serving as a second holding means provided with an insulating layer on the outer periphery is connected to the subplate that is in contact with the second electrode plane of the electronic component element, and electrical energy is applied through the subplate. 9. The method of manufacturing a microcomponent according to claim 8, wherein an electrodepositing insulating resin is deposited on an outer peripheral portion of the electronic component element to form an exterior portion.

An electronic component element having a first electrode plane on one end and a second electrode plane on the other end, a first holding means on the first electrode plane, and a conductive material on the second electrode plane The sub-plate fixed to the second holding means is brought into contact with and sandwiched between the first holding means and the second holding means, and the electrodeposition insulating resin is applied to the outer peripheral surface of the electronic component element. The sub-plate is formed on the outer peripheral surface of the electronic component element, and the sub-plate is held on the sub-plate while the electronic component element is held on the sub-plate by the electrodeposition insulating resin. A first external electrode is formed on the first electrode plane, and the first external electrode of the electronic component element on which the first external electrode is formed is the same as the sub-plate. The second holding means is in contact with the second holding means, Away from the sub-plate that had an electrode plane is in contact is held by the third holding means, said method for producing microcomponents forming the second external electrode to a second electrode plane.

The sub-plate is fixed to a predetermined position of the second holding means by positioning means provided on the sub-plate, and the electronic component element is brought into contact with the sub-plate with respect to the positioning means as the first holding means. The outer plate is formed on the outer peripheral surface of the electronic component element by electrodeposition, the sub-plate is fixed to the external electrode forming means with reference to the positioning means, and the first of the electronic component elements is A first external electrode is formed on the electrode plane, and the first external electrode of the electronic component element on which the first external electrode is formed is defined on the basis of positioning means having the same shape as the sub-plate. The third holding means is fixed to the external electrode forming means with reference to the positioning means included in the third holding means, and the second electrode plane of the electronic component element is fixed. A second external electrode is formed on Manufacturing method for a micro component according to claim 10, wherein a.

12. The micro plate according to claim 11, wherein two through holes provided in the sub plate and the third holding means having the same shape as the sub plate are used as positioning means, and fixed at a predetermined position with the through hole as a reference. A manufacturing method for parts.

The thin plate of iron-based material having corrosion resistance constitutes the sub plate and the third holding means, and the electronic component element is held in contact with the sub plate and the third holding means. Item 11. A method for manufacturing a micropart according to Item 10.

Electrodepositing insulating resin is deposited on the outer peripheral part of the electronic component to form an exterior part, and after the second holding means is separated from the second electrode plane of the electronic component element, it is deposited on the outer peripheral part of the electronic component element 2. The method of manufacturing a micro component according to claim 1, wherein the unnecessary insulating resin for electrodeposition is removed.

Electrodepositing insulating resin is deposited on the outer peripheral part of the electronic component to form an exterior part, and after the first holding means is separated from the first electrode plane of the electronic component element, it is deposited on the outer peripheral part of the electronic component element The method of manufacturing a micropart according to claim 14, wherein an end portion of the exterior portion made of the electrodeposition insulating resin is formed into a predetermined shape.

15. The method for manufacturing a micro component according to claim 14, wherein unnecessary insulating resin for electrodeposition deposited on the outer peripheral portion of the electronic component element is removed by laser processing.

Electrodepositing insulating resin is deposited on the outer periphery of the electronic component to form an exterior portion, and after the second holding means is separated from the second electrode plane of the electronic component element, it adheres to the second electrode plane. 15. The method for manufacturing a micro component according to claim 14, wherein the deposit is removed by blasting.

A plurality of electronic component elements having a first electrode plane at one end and a second electrode plane at the other end are linearly arranged at predetermined intervals, and a first holding means is provided on the first electrode plane. A second holding means is brought into contact with and sandwiched between the second electrode planes, and an electrodepositing insulating resin is deposited on the outer peripheral surface of the electronic component element by electrodeposition to form an exterior portion. The first holding means that is in contact with the electrode plane is separated from the first electrode plane, and the electronic component element is attached to the second electrode by the electrodeposition insulating resin deposited on the outer peripheral surface of the electronic component element. The first external electrode is formed on the first electrode plane while being held by the holding means, and the electronic component element having the first external electrode is opposed to the third holding means having an adhesive member. The first external electrode in contact with the adhesive member, and A second external electrode is formed on the second electrode plane by holding the component element at the same time and separating the second holding means that has been in contact with the second electrode plane away from the second electrode plane. Manufacturing method of micro parts.

A first electrode plane in a plurality of linearly arranged electronic component elements is provided in a lower layer and a resin member having releasability with respect to an electrodeposition insulating resin that is deposited on the outer peripheral surface of the electronic component element provided in an upper layer. A two-layer structure composed of a rubber elastic body is used to hold the electronic component element in contact with an abutting member provided on the first holding member and form an exterior portion on the outer peripheral surface of the electronic component element The method of manufacturing a microcomponent according to claim 18, wherein:

The first electrode plane of the electronic component element is brought into contact with a contact member having a two-layer structure provided on the first holding means whose upper layer is made of silicone resin or fluororesin, and an exterior portion is provided on the outer peripheral surface of the electronic component element. The method of manufacturing a micro component according to claim 19, wherein:

The contact member having a two-layer structure in which a resin member having releasability with respect to the electrodeposition insulating resin deposited on the outer peripheral surface of the electronic component element is formed on the lower layer surface is formed on the first layer of the electronic component element. 21. The method of manufacturing a microcomponent according to claim 20, wherein an outer surface is formed on an outer peripheral surface of the electronic component element by contacting the electrode plane.